VITESSE SEMICONDUCTOR CORPORATION Preliminary Datasheet VSC7217 Multi-Gigabit Interconnect Chip Features • 4 ANSI X3T11 Fibre Channel and IEEE 802.3z Gigabit Ethernet Compliant Transceivers • Compatible with VSC7211/7212/7214 • Fast-Locking CRU: 100-Bit Clock Periods • Over 8 Gb/s Duplex Raw Data Rate • Received Data Aligned to Local REFCLK or to Recovered Clock • Redundant PECL Tx Outputs and Rx Inputs • PECL Rx Signal Detect and Cable Equalization • 8B/10B Encoder/Decoder per Channel, Optional Encoder/Decoder Bypass Operation • Per-Channel Serial Tx-to-Rx and Parallel Rx-toTx Internal Loopback Modes • “ASIC-FriendlyTM” Timing Options for Transmitter Parallel Input Data • Clock Multiplier Generates Baud Rate Clock • Elastic Buffers for Intra/Inter-Chip Cable Deskewing and Channel-to-Channel Alignment • Tx/Rx Rate Matching via IDLE Insertion/ Deletion • Automatic Lock-to-Reference • JTAG Boundary Scan Support for TTL I/O • Built-In Self Test • 3.3V Supply, 3.0W Typ, 3.5W Max. • 256-pin, 27mm BGA Package VSC7217 Block Diagram TRANSMITTER PTXEND TD(7:0) C/DD WSEND 8 8 8B/10B 10 Encode D Q RECEIVER LBEND(1:0) RXP/RD LBTXD PTXD+ PTXDRTXD+ RTXD- RTXEND PTXENC TC(7:0) C/DC WSENC 8 8 8B/10B 10 Encode D Q LBENC(1:0) RXP/RC LBTXC PTXC+ PTXCRTXC+ RTXC- RTXENC PTXENB TB(7:0) C/DB WSENB 8 8 8B/10B 10 Encode D Q TA(7:0) C/DA WSENA 8 8 8B/10B 10 Encode D Q KCHAR 4 TBCA TBCB TBCC TBCD DUAL PTXB+ PTXBRTXB+ RTXB- PRXB+ PRXBRRXB+ RRXB- Clk/Data Recovery 8B/10B Decode 10 8B/10B Decode 8 3 8 Elastic Buffer PSDETD RSDETD Clk/Data Recovery 8 3 8 Elastic Buffer Clk/Data Recovery LBENA(1:0) RXP/RA PTXA+ PTXARTXA+ RTXA- PRXA+ PRXARRXA+ RRXA- Clk/Data Recovery PSDETA RSDETA RTXENA RC7:0) IDLEC KCHC ERRC RCLKC RCLKCN PSDETC RSDETC 10 8B/10B Decode 8 3 8 Elastic Buffer RB(7:0) IDLEB KCHB ERRB RCLKB RCLKBN PSDETB RSDETB LBTXA RD(7:0) IDLED KCHD ERRD RCLKD RCLKDN 10 8B/10B Decode 8 3 8 Elastic Buffer RA(7:0) IDLEA KCHA ERRD RCLKA RCLKAN WSI FLOCK Channel Align WSO Tx Clock x20/x10 Clock Gen REFCLKP REFCLKN G52325-0, Rev. 3.0 6/14/00 PRXC+ PRXCRRXC+ RRXCLBENB(1:0) RXP/RB LBTXB RTXENB PTXENA PRXD+ PRXDRRXD+ RRXD- 10 CAP0 CAP1 REFCLK TBERRA TBERRB TBERRC TBERRD TMODE(2:0) RMODE(1:0) RESETN ENDEC BIST TRSTN TMS TDI TCK JTAG Boundary Scan VITESSE SEMICONDUCTOR CORPORATION 741 Calle Plano, Camarillo, CA 93012 • 805/388-3700 • FAX: 805/987-5896 TDO Page 1 VITESSE SEMICONDUCTOR CORPORATION Preliminary Datasheet VSC7217 Mutli-Gigabit Interconnect Chip General Description The VSC7217 is a quad 8-bit parallel-to-serial and serial-to-parallel transceiver chip used for high bandwidth interconnection between busses, backplanes, or other subsystems. Four Fibre Channel and Gigabit Ethernet compliant transceivers provide up to 8.32Gb/s of duplex raw data transfer. Each channel can be operated at a maximum data transfer rate of 1088Mb/s (8 bits at 136MHz) or a minimum rate of 784Mb/s (8 bits at 98MHz). For the entire chip in duplex mode, the aggregate transfer rate is between 6.3Gb/s and 8.7Gb/s. The VSC7217 contains four 8B/10B encoders, serializers, de-serializers, 8B/10B decoders and elastic buffers which provide the user with a simple interface for transferring data serially and recovering it on the receive side. The device can also be configured to operate as four non-encoded 10-bit transceivers. Notation In this document, each of the four channels are identified as channel A, B, C or D. When discussing a signal on any specific channel, the signal will have the channel letter embedded in the name: TA(7:0). When referring to the common behavior of a signal which is used on each of the four channels, a lower case “n” is used in the signal name: Tn(7:0). Differential signals, such as PTXA+ and PTXA-, may be referred to as a single signal, PTXA, by dropping reference to the “+” and “-”. REFCLK refers either to the PECL/TTL input pair REFCLKP/REFCLKN, which can be differential PECL (using both REFCLKP and REFCLKN) or single-ended TTL (using REFCLKP and leaving REFCLKN open). Clock Synthesizer Depending on the state of the DUAL input, the VSC7217 clock synthesizer multiplies the reference frequency provided on the REFCLK input by 10 (DUAL is LOW) or 20 (DUAL is HIGH) to achieve a baud rate clock between 0.98GHz and 1.36 GHz. The on-chip Phase Lock Loop (PLL) uses a single external 0.1µF capacitor, connected between CAP0 and CAP1, to control the Loop Filter. This capacitor should be a multilayer ceramic dielectric, or better, with at least a 5V working voltage rating and a good temperature coefficient. NPO is preferred but X7R may be acceptable. These capacitors are used to minimize the impact of common mode noise on the Clock Multiplier Unit, especially power supply noise. Higher value capacitors provide better robustness in systems. NPO is preferred because if an X7R capacitor is used, the power supply noise sensitivity will vary with temperature. For best noise immunity, the designer may use a three capacitor circuit with one differential capacitor between CAP0 and CAP1, C1, a capacitor from CAP0 to ground, C2, and a capacitor from CAP1 to ground, C3 (Figure 1). Larger values are better but 0.1µF is adequate. However, if the designer cannot use a three capacitor circuit, a single differential capacitor, C1, is adequate. These components should be isolated from noisy traces. Figure 1: Loop Filter Capacitors (Best Circuit) CAP0 VSC7217 CAP1 C2 C1 C3 C1=C2=C3= >0.1uF MultiLayer Ceramic Surface Mount NPO (Prefered) or X7R 5V Working Voltage Rating The REFCLK signal can be either single-ended TTL or differential LVPECL. If TTL, connect the TTL input to REFCLKP but leave REFCLKN open. If LVPECL, connect the inputs to REFCLKP and REFCLKN. Internal biasing resistors sets the proper DC Level to VDD/2. Page 2 VITESSE SEMICONDUCTOR CORPORATION 741 Calle Plano, Camarillo, CA 93012 • 805/388-3700 • FAX: 805/987-5896 G52325-0, Rev. 3.0 6/14/00 VITESSE SEMICONDUCTOR CORPORATION Preliminary Datasheet VSC7217 Multi-Gigabit Interconnect Chip Transmitter Functional Description Transmitter Data Bus Each VSC7217 transmit channel has an 8-bit input transmit data character, Tn(7:0), and two control inputs, C/Dn and WSENn. The C/Dn input determines whether a normal data character or a special “K-character” is transmitted, and the WSENn input initiates transmission of a 16-character “Word Sync Sequence” used to align the receive channels. These data and control inputs are clocked either on the rising edge of REFCLK, on the rising edge of TBCn, or within the data eye formed by TBCn. When not using REFCLK, each channel uses either its own TBCn input, or the TBCA input. The transmit interface mode is controlled by TMODE(2:0), as shown in Table 1. When used, the TBCn inputs must be frequency locked to REFCLK. No phase relationship is assumed. A small skew buffer is provided to tolerate phase drift between TBCn and REFCLK. This buffer is recentered by the RESETN input, and the total phase drift after recentering must be limited to ±180° (where 360° is one character time). Each channel has an error output, TBERRn, that is asserted HIGH to indicate that the phase drift between TBCn and REFCLK has accumulated to the point that the elastic limit of the skew buffer has been exceeded and a transmit data character has been either dropped or duplicated. This error can not occur when input timing is referenced to REFCLK. The TBERRn output timing is identical to the low-speed receiver outputs, as selected by RMODE(1:0) in Table 5. Table 1: Transmit Interface Input Timing Mode TMODE(2:0) Input Timing Reference 000 REFCLK Rising Edge 001 010 011 Reserved 100 TBCA Rising Edge 101 TBCn Rising Edge 110 TBCA Data Eye 111 TBCn Data Eye The following figures show the possible relationships between data and control inputs and the selected input timing source. Figure 2 shows how REFCLK is used as an input timing reference. This mode of operation is used in the VSC7211 and VSC7214. Figure 3 and Figure 4 show how TBCn is used as an input timing reference. When TBCn is used to define a data eye (see Figure 4), it functions as an additional data input that simply toggles every cycle. Note that the REFCLK and TBCn inputs are not used directly to clock the input data. Instead, an internal PLL generates edges aligned with the appropriate clock. The arrows on the rising edges of these signals define the reference edge for the internal phase detection logic. An internal clock is generated at 1/10 the serial trans- G52325-0, Rev. 3.0 6/14/00 VITESSE SEMICONDUCTOR CORPORATION 741 Calle Plano, Camarillo, CA 93012 • 805/388-3700 • FAX: 805/987-5896 Page 3 VITESSE SEMICONDUCTOR CORPORATION Preliminary Datasheet VSC7217 Mutli-Gigabit Interconnect Chip mit data rate that is locked to the selected input timing source. This is an especially important when DUAL is HIGH and input timing is referenced to REFCLK, since the falling edge is NOT used. The internal clock active edges are placed coincident with the REFCLK rising edges and halfway between the REFCLK rising edges in this mode. A similar situation exists when TBCn is used to define a data eye. Only the rising edges of TBCn are used to define the external data timing. The internal clock active edges are placed at 90° and 270° points between consecutive TBCn rising edges (which are assumed to be 360° apart). Figure 2: Transmit Timing, TMODE(2:0) = 000 REFCLK (DUAL = 0) REFCLK (DUAL = 1) Tn(7:0) C/Dn WSENn Valid Valid Valid Figure 3: Transmit Timing, TMODE(2:0) = 10X TBCA or TBCn Tn(7:0) C/Dn WSENn Valid Valid Valid Figure 4: Transmit Timing, TMODE(2:0) = 11X (“ASIC-Friendly” Timing 0o 90o 180o 270o 360o TBCA or TBCn Tn(7:0) C/Dn WSENn Page 4 Valid Valid Valid VITESSE SEMICONDUCTOR CORPORATION 741 Calle Plano, Camarillo, CA 93012 • 805/388-3700 • FAX: 805/987-5896 G52325-0, Rev. 3.0 6/14/00 VITESSE SEMICONDUCTOR CORPORATION Preliminary Datasheet VSC7217 Multi-Gigabit Interconnect Chip 8B/10B Encoder Each channel contains an 8B/10B encoder which translates the 8-bit input data on Tn(7:0) into a 10-bit encoded data character. C/Dn inputs are also provided in each channel which, along with KCHAR, allow the transmission of special Fibre Channel Kxx.x characters (see Table 2). Note that KCHAR is a static input, and does NOT have the same input timing as Tn(7:0), C/Dn and WSENn. Normally, C/Dn is LOW in order to transmit data. If C/Dn is HIGH and KCHAR is LOW, a Fibre Channel defined IDLE Character (K28.5 = ‘0011111010’ or ‘1100000101’ depending on disparity) is transmitted and Tn(7:0) is ignored. If C/Dn is HIGH and KCHAR is HIGH, a Kxx.x character is transmitted as determined by the data pattern on Tn(7:0). See Table 3. Data patterns other than those defined in Table 3 produce undefined 10B encodings. Table 2: Transmit Data Controls WSENn C/Dn KCHAR Encoded 10-bit Output 0 0 X Data Character 0 1 0 IDLE Character (K28.5) 0 1 1 Special Kxx.x Character 1 X X 16-Character Word Sync Sequence Table 3: Special Characters (Selected when C/Dn and KCHAR are HIGH) Code Tn(7:0) Comment Code Tn(7:0) Comment K28.0 000 11100 User Defined K28.5- 101 01101 User Defined K28.1 001 11100 User Defined K28.6 110 11100 User Defined K28.2 010 11100 User Defined K28.7 111 11100 Test Only K28.3 011 11100 User Defined K23.7 111 10111 User Defined K28.4 100 11100 User Defined K27.7 111 11011 User Defined K28.5 101 11100 IDLE K29.7 111 11101 User Defined K28.5+ 101 01100 User Defined K30.7 111 11110 User Defined Encoder Bypass Mode When ENDEC is LOW, the 8B/10B encoders are bypassed and a 10-bit input character Tn(7:0) is serialized directly in each channel, with bit Tn0 transmitted first. The C/Dn input becomes Tn8 and WSENn becomes Tn9. The KCHAR input becomes ENCDET which is not used in the transmitter but, when HIGH, enables Comma detection in all four receivers. Refer to the “Decoder Bypass Mode” section for a description of this mode of operation in the receiver. The latency through the transmitter is reduced by one character time when ENDEC is LOW. This mode of operation is similar to a 10-bit interface commonly found in serializer/ deserializers for the Fibre Channel (VSC7125) and Gigabit Ethernet (VSC7135) markets. Word Sync Generation The VSC7217 can perform channel alignment (also referred to as “word alignment” or “word sync”). In other words, the four receive data output streams are aligned such that the same 4-byte word presented to the G52325-0, Rev. 3.0 6/14/00 VITESSE SEMICONDUCTOR CORPORATION 741 Calle Plano, Camarillo, CA 93012 • 805/388-3700 • FAX: 805/987-5896 Page 5 VITESSE SEMICONDUCTOR CORPORATION Preliminary Datasheet VSC7217 Mutli-Gigabit Interconnect Chip four transmit channel inputs for serialization will be transferred on the receive channel parallel outputs. The Word Sync Sequence provides a unique synchronization point in the serial data stream that is used to align the receive channels. This sequence consists of 16 consecutive K28.5 IDLE characters with disparity reversals on the second and fourth characters. The Word Sync Sequence is sent either as “I+ I+ I- I- I+ I- I+ I- I+ I- I+ I- I+ I- I+ I-” or as “I- I- I+ I+ I- I+ I- I+ I- I+ I- I+ I- I+ I- I+”, depending on the transmitter’s running disparity at the time the first IDLE character is serialized. Transmission of the Word Sync Sequence is initiated independently in each channel when the WSENn input is asserted HIGH for one character time (see Figure 5). When WSENn is HIGH, the C/Dn and Tn(7:0) inputs are ignored. The WSENn, C/Dn and Tn(7:0) inputs are also ignored for the subsequent 15 character times. In Figure 5 below, the Word Sync Sequence is initiated in cycle W1 and transmitted through cycle W16. Normal data transmission (or the transmission of another Word Sync Sequence) resumes in cycle D3. Figure 5 is drawn assuming that input timing is referenced to REFCLK (e.g., TMODE(2:0)=000) with the DUAL input LOW. As long as WSENn remains asserted, another Word Sync Sequence will be generated. Figure 5: Word Sync Sequence Generation D1 D2 W1 W2 W3 W4 W5 W6 W7 W8 W9 W10 W11 W12 W13 W14 W15 W16 XX XX XX XX XX XX XX XX XX XX XX XX XX XX XX XX D3 D4 REFCLK WSENn C/Dn Tn(7:0) TXn+/- 0x01 0x02 D1.0+ 0x03 0x04 D2.0+ K28.5+ K28.5+ K28.5- K28.5- K28.5+ K28.5- K28.5+ K28.5- K28.5+ K28.5- K28.5+ K28.5- K28.5+ K28.5- K28.5+ K28.5- D3.0+ D4.0- Serializer The 10-bit output from the encoder (or from the encoder input register if ENDEC is LOW) is fed into a multiplexer which serializes the parallel data using the synthesized transmit clock. The least significant bit of the 10B data is transmitted first. Each channel has both primary and redundant serial output ports, PTXn and RTXn, respectively, which consists of differential PECL output buffers operating at either 10 or 20 times the REFCLK rate. The primary and redundant transmitter outputs are controllable separately on each channel. The primary PECL outputs (PTXn) are enabled when the PTXENn input is HIGH, and the redundant PECL outputs (RTXn) are enabled when the RTXENn input is HIGH. When a PECL output is disabled, the associated output buffers do not consume power and the attached pins are undriven. Receiver Functional Description Serial Data Source Each receive channel has both primary (PTXn) and redundant (RRXn) serial input ports, which consists of differential PECL input buffers. Each channel also has a control input, RXP/Rn, used to select either the pri- Page 6 VITESSE SEMICONDUCTOR CORPORATION 741 Calle Plano, Camarillo, CA 93012 • 805/388-3700 • FAX: 805/987-5896 G52325-0, Rev. 3.0 6/14/00 VITESSE SEMICONDUCTOR CORPORATION Preliminary Datasheet VSC7217 Multi-Gigabit Interconnect Chip mary or redundant serial input as the data source for that channel. When RXP/RC is HIGH, the C channel serial data source is PRXC. When LBENn(1:0)=10, the channel’s transmitter is looped back and becomes the serial data source regardless of the state of RXP/Rn (see Table 4). Table 4: Serial Data Source Selection LBENn(1:0) RXP/Rn Serial Data Source ≠10 0 RRXn ≠10 1 PRXn X LBTXn Loopback fromTransmitters =10 Signal Detection Each channel’s primary and redundant PECL input buffers have an associated signal detect output, PSDETn and RSDETn. All eight outputs are available for continuous monitoring of both the selected and nonselected input. Each signal detect output is asserted HIGH when transitions are detected on the associated PECL input and the signal amplitude exceeds 200 mV. A LOW indicates that either no transitions are detected or the signal amplitude is below 100mV. The signal detect outputs are considered undefined when the signal amplitude is in the 100mV to 200 mV range. The signal detect circuitry behaves like a re-triggerable one shot that is triggered by signal transitions, and whose time-out interval ranges from 40 to 80 bit times. The transition density is not checked to ensure that it corresponds to a valid Fibre Channel data stream. The PSDETn and RSDETn output timing is identical to the low-speed receiver outputs, as selected by RMODE(1:0) in Table 5. Receiver Equalization Incoming data on the PRX/RRX inputs typically contains a substantial amount of Inter Symbol Interference (ISI) or deterministic jitter which reduces the ability of the receiver to recover data without errors. An equalizer has been added to each of the receiver’s input buffers in order to compensate for this deterministic jitter. This circuit has been designed to effectively reduce the ISI commonly found in copper cables or backplane traces due to low frequencies traveling faster than high frequencies as a result of the skin effect. The equalizer boosts high-frequency edge response in order to reduce the adverse effects of ISI. Clock and Data Recovery At the receiver, each channel contains an independent Clock Recovery Unit (CRU) that accepts the selected serial input source, extracts the high-speed clock and retimes the data. Each CRU automatically locks on data and if the data is not present, will automatically lock to the REFCLK. This maintains a very well-behaved recovered clock (RCLKn/RCLKNn) which does not contain any slivers and will operate at a frequency of the REFCLK reference ±200 ppm. The use of an external Lock-to-Reference pin is not needed. The Clock Recovery Unit must perform bit synchronization which occurs when the CRU locks onto and properly samples the incoming serial data as described in the previous paragraph. When the CRU is not locked onto the serial data, the 10-bit data out of the decoder is invalid which results in numerous 8B/10B decoding errors or disparity errors. When the link is disturbed (the cable is disconnected or the serial data source is switched), the CRU will require a certain amount of time to lock onto data which is specified in the AC timing specifications for “Data Acquisition Lock Time.” G52325-0, Rev. 3.0 6/14/00 VITESSE SEMICONDUCTOR CORPORATION 741 Calle Plano, Camarillo, CA 93012 • 805/388-3700 • FAX: 805/987-5896 Page 7 VITESSE SEMICONDUCTOR CORPORATION Preliminary Datasheet Mutli-Gigabit Interconnect Chip VSC7217 Deserializer and Character Alignment The retimed serial data stream is converted into 10-bit characters by the deserializer. A special 7-bit “Comma” pattern (‘0011111xxx’ or ‘1100000xxx’) is recognized by the receiver and allows it to identify the 10-bit character boundary. Note that this pattern is found in three special characters: K28.1, K28.5 and K28.7. However, K28.5 is chosen as the unique IDLE character. Only K28.1 and K28.5 should be used in normal operation. The K28.7 character should be reserved for test and characterization use. Character alignment occurs when the deserializer synchronizes the 10-bit character framing boundary to a “Comma” pattern in the incoming serial data stream. If the receiver identifies a “Comma” pattern in the incoming data stream, which is misaligned to the current framing boundary, the receiver will re-synchronize the recovered data in order to align the data to the new “Comma” pattern. Re-synchronization ensures that the “Comma” character is output on the internal 10-bit bus so that bits 0 through 9 equal ‘0011111xxx’ or ‘1100000xxx’. If the “Comma” pattern is aligned with the current framing boundary, re-synchronization will not change the current alignment. Re-synchronization is always enabled and cannot be turned off when ENDEC is HIGH. After character re-synchronization the VSC7217 ensures that within a link, the 8-bit data sent to the transmitting VSC7217 will be recovered by the receiving VSC7217 in the same bit locations as the transmitter (e.g., Tn(7:0) = Rn(7:0)). When ENDEC is LOW, “Comma” detection and alignment are enabled only if KCHAR is HIGH. 10B/8B Decoder The 10-bit character from the deserializer is decoded in the 10B/8B decoder, which outputs the 8B data byte and three bits of status information. If the 10-bit character does not match any valid value, an Out-of-Band Error is generated which is output on the receiver status bus. Similarly, if the running disparity of the character does not match the expected value, a Disparity Error is generated. The decoder also reports when a K-character is received, and distinguishes the K28.5 (IDLE) character from other K-characters. This status information is combined with LOS State Machine status and FIFO error status, to produce the prioritized per-character link status output information (see Table 7). Elastic Buffer and Channel Deskewing An elastic buffer is included in each of the four receive channels. Decoded data and status information is written into these buffers on each channel’s recovered clock, and is read on the selected output clock. In addition to allowing decoded data to easily cross from a channel’s recovered clock domain to its output clock domain, the elastic buffers facilitate channel alignment (the reconstruction of a multi-byte word as presented to the transmitting devices). In addition, the buffers facilitate rate matching via IDLE character insertion/deletion when the channel’s recovered clock is not frequency locked to its output clock. There are three conditions under which a receive channel’s elastic buffer is recentered: (1) the RESETN input, when asserted, recenters the read/write pointers in each elasticity buffer, (2) whenever a Comma character is received which changes the receive character’s framing boundary, and (3) whenever the receiver detects the synchronization point in the Word Sync Sequence. All three of these events are associated with chip initialization or link initialization and will not occur during normal data transfer. Note: recentering can result in the loss or duplication of decoded character data and status information. When a condition change transmit timing (phase shifts in TBC) or shifts phase/alignment into the receiver, the user should initial a Word Sync Event to recenter all elasticity buffers. Otherwise, data corruption could occur. Page 8 VITESSE SEMICONDUCTOR CORPORATION 741 Calle Plano, Camarillo, CA 93012 • 805/388-3700 • FAX: 805/987-5896 G52325-0, Rev. 3.0 6/14/00 VITESSE SEMICONDUCTOR CORPORATION Preliminary Datasheet VSC7217 Multi-Gigabit Interconnect Chip The VSC7217 presents recovered data on Rn(7:0) and status on IDLEn, KCHn and ERRn. These outputs are timed either to each channel’s own recovered clock (RCLKn/RCLKNn), to Channel A’s recovered clock (RCLKA/RCLKNA), or to REFCLK. The output timing reference is selected by RMODE(1:0) (see Table 5). The transmitter input skew buffer error outputs TBERRn and the analog signal detect outputs PSDETn and RSDETn are also synchronized to the selected output timing reference. There are two choices for REFCLKbased timing, which differ in the positioning of the data valid window associated with the output signals timed to REFCLK. When RMODE(1:0)=00, REFCLK is approximately centered in the output data valid window as in the VSC7214. When RMODE(1:0)=01, REFCLK slightly leads the data valid window so that output data appears to have a more typical “Clock-to-Q” timing relationship to REFCLK. Table 5: Receive Interface Output Timing Mode RMODE(1:0) Output Timing Reference 00 REFCLK (Centered) 01 REFCLK (Leading) 1 0 RCLKA/RCLKNA 1 1 RCLKn/RCLKNn The term “word clock” is used for whichever clock ( REFCLK, RCLKA/RCLKNA or RCLKn/ RCLKNn) is selected as the output timing reference. If RMODE(1) is HIGH, each channels’ RCLKn/ RCLKNn outputs are complementary outputs at 1/10th or 1/20th the baud rate of the incoming data depending upon DUAL. When RCLKA/RCLKNA is selected as the output timing reference, Channel B, C and D RCLKn/RCLKNn outputs are copies of RCLKA/RCLKNA. If RMODE(1) is LOW, each channels’ RCLKn/RCLKNn outputs are held in a LOW/HIGH state, respectively, and the data and status outputs are timed to REFCLK. If DUAL is HIGH, all data at the four output ports are synchronously clocked out on both positive and negative edges of the selected word clock at 1/20th the baud rate. If DUAL is LOW, the data is clocked out of the VSC7217 only on the rising edge of the selected word clock at 1/10th the baud rate. Timing waveforms for the output data and status are shown in Figure 6, Figure 7 and Figure 8. Figure 6: Receive Timing, RMODE(1:0) = 00 REFCLK (DUAL = 0) REFCLK (DUAL = 1) Rn(7:0) IDLEn KCHn ERRn G52325-0, Rev. 3.0 6/14/00 Valid Valid Valid VITESSE SEMICONDUCTOR CORPORATION 741 Calle Plano, Camarillo, CA 93012 • 805/388-3700 • FAX: 805/987-5896 Page 9 VITESSE SEMICONDUCTOR CORPORATION Preliminary Datasheet VSC7217 Mutli-Gigabit Interconnect Chip Figure 7: Receive Timing, RMODE(1:0) = 01 REFCLK (DUAL = 0) REFCLK (DUAL = 1) Rn(7:0) IDLEn KCHn ERRn Valid Valid Valid Figure 8: Receive Timing, RMODE(1:0) = 1X RCLKn (DUAL = 0) RCLKn (DUAL = 1) Rn(7:0) IDLEn KCHn ERRn Valid Valid Valid The data coming from the decoder is clocked into the elastic buffer by the recovered clock from the channel’s CRU. The data is clocked out of the elastic buffers with word clock. If the transmitting device’s REFCLK is not precisely frequency locked to a receive channel’s word clock, then the channel’s elastic buffer will tend to gradually fill or empty as the recovered clock (which is by definition frequency locked to the transmitter’s REFCLK) steadily drifts in phase relative to the word clock. To accommodate frequency differences between a transmitter’s REFCLK and the word clock, the VSC7217 can automatically perform rate matching by either deleting or duplicating IDLE characters. The FLOCK input must be LOW to enable rate matching which, based on how the WSI input is connected, can either be performed in each channel individually or can be performed in parallel across a group of channels that are word-aligned. This is discussed in detail in the following section describing Word Alignment. The user must ensure that the frequency at which IDLEs are simultaneously transmitted on each channel accommodates the frequency differences, if any, in their system architecture. Not meeting the IDLE density requirements could result in Underrun/Overrun Errors. Page 10 VITESSE SEMICONDUCTOR CORPORATION 741 Calle Plano, Camarillo, CA 93012 • 805/388-3700 • FAX: 805/987-5896 G52325-0, Rev. 3.0 6/14/00 VITESSE SEMICONDUCTOR CORPORATION Preliminary Datasheet VSC7217 Multi-Gigabit Interconnect Chip The elastic buffer is designed to allow a maximum phase drift of +2 or -2 serial clock bit times between resynchronizations, which sets a limit on the maximum data “packet” length allowed between IDLEs. This maximum packet length depends on the frequency difference between the transmitting and receiving devices REFCLKs. Let ∆φ represent phase drift in bit times, and let 2π represent one full 10-bit character of phase drift. Limiting phase drift to two bit times means the following inequality must be satisfied: (1) ∆φ ≤ ( 0.2 × 2π ) Let L be the number of 10-bit characters transmitted, and let ∆f be the frequency offset in ppm. The total phase drift in bit times is given by: (2) 6 ∆φ = ( ∆f ⁄ 10 ) × 2π L A simple expression for maximum packet length as a function of frequency offset is derived by substituting Equation (2) in Equation (1) and solving for L: (3) 6 L ≤ ( 0.2 × 10 ) ⁄ ∆f As an example, if the frequency offset is 200 ppm, the maximum packet length should not be more than 1K bytes. To increase the maximum packet length L, decrease the frequency offset ∆f. Please note that if only on K28.5 is transmitted between “packets” of data, it might be dropped during compensation for phase drift. If the user must have at least one K28.5 between these two packets, then two K28.5s must be transmitted. Word Alignment The VSC7217 performs channel-to-channel word alignment. In this mode of operation, if the data from all four channels on the transmitting VSC7217 (the 4 Tn(7:0) busses) is viewed as a 32-bit word, then the receiving VSC7217 will recover an identical word. For example, if a transmit pattern was ‘ABCD’, ‘EFGH’, ‘IJKL’, etc., the receiver should not recover data words as ‘ABGD’, ‘EFKH’, ‘IJOL’, etc. This requires the four transmit channels to obtain input data on a common clock (TMODE(2:0)=000 or 1X0) and the four receive channels to present output data on a common word clock (RMODE(1:0)=0X or 10). There are elastic buffers within the receiver used to deskew the four channels and align them to a common word clock. An elastic buffer allows the channels’ input to be skewed up to ±6 bit times (12 bit times total skew between any two channels) to accommodate circuit imperfections, differences in transmission delay and jitter. Multiple VSC7217 devices can also be used in synchronous operation if the skew between all serial input pairs is maintained less than ±6 serial clock bit times. This allows easy implementation of robust systems and is discussed in greater detail in the Using Multiple VSC7217s in Parallel section. In order to perform word alignment, a synchronization point must be seen across all aligned receive channels within the ±6 bit time window. The VSC7217 receiver recognizes the first four characters of the Word Sync Sequence (either K28.5+ K28.5+ K28.5- K28.5- or K28.5- K28.5- K28.5+ K28.5+) as the synchronization point. As a model for understanding, consider the case where a VSC7217 transmitter sends 32 bits of data to the receiver via copper media, which has small cable length differences, causing a channel-to-channel skew. All transmit channels that are to be word-aligned transmit the Word Sync Sequence in parallel. On detection of the synchronization point, the receivers will reposition the recovered data within their elastic buffers in order to align all four channels and remove any channel-to-channel skew. All normal data characters following the G52325-0, Rev. 3.0 6/14/00 VITESSE SEMICONDUCTOR CORPORATION 741 Calle Plano, Camarillo, CA 93012 • 805/388-3700 • FAX: 805/987-5896 Page 11 VITESSE SEMICONDUCTOR CORPORATION Preliminary Datasheet VSC7217 Mutli-Gigabit Interconnect Chip Word Sync Sequence will be properly word-aligned. In the process of channel alignment, one or two of the final twelve K28.5 characters in the Word Sync Sequence may be deleted or duplicated. This ensures that each transmitted 32-bit word is recovered correctly. The VSC7217 is capable of performing rate matching in word-aligned applications by inserting or deleting IDLEs in parallel across the aligned receive channels. This requires that the word-aligned data streams contain IDLEs inserted in parallel on all transmit channels (e.g., an IDLE “word”) according to the IDLE density requirement previously described. Word alignment is enabled by connecting the WSI input to a WSO output, either from the same device if a single device is used, or from another device if multiple devices are used in parallel to align more than four channels. The FLOCK input state and WSI input source determine whether or not rate matching (IDLE deletion or duplication) will be performed, and whether it is done independently on each channel or in parallel across aligned channels. Word alignment is disabled when WSI is not connected to a WSO output. Rate matching is disabled when either FLOCK is HIGH or WSI is held LOW (see Table 6). Table 6: Word Alignment and Rate Matching Control FLOCK WSI Source Word Alignment Rate Matching 0 0 Off Off 0 1 Off Enabled, Independent Channels 0 WSO Enabled Enabled, Aligned Channels 1 0 Off Off 1 1 Off Off 1 WSO Enabled Off There are four distinct modes of operation defined in Table 6. The first row disables both word alignment and rate matching. (The fourth and fifth row configurations function identically to the first row.) The second row configures the channels to operate independently with rate matching. Word alignment is disabled, and IDLEs will be dropped/duplicated independently in each channel as required. The third row configures the part to perform word alignment and rate matching. The receive channels will be aligned per the device driving WSO, and IDLE words will be dropped/duplicated across the aligned channels as required. The last row configures the part to perform word alignment and disables rate matching. This mode of operation is appropriate for a frequency-locked application where it desired to align the receive channels without altering the received data streams. Using Multiple VSC7217s in Parallel Multiple VSC7217s can be used in parallel to form wider bus widths. In order for word alignment to function correctly across multiple devices, each transmit channel’s input data must be transmitted on a common clock, and each receive channel’s output data must also be aligned to a common word clock. This requires that all transmitting devices use either the same or identical REFCLKs, and that TMODE(2:0)=000 (inputs timed to REFCLK) or TMODE(2:0)=1X0 (inputs timed to TBCA). If inputs are timed to TBCA, then all transmitting devices must use either the same or identical TBCAs. Since all receive channels must use a common word clock, the receiving devices must also use the same or identical REFCLKs and it must be selected as the word clock for all receive channels (RMODE(1:0)=0X). Page 12 VITESSE SEMICONDUCTOR CORPORATION 741 Calle Plano, Camarillo, CA 93012 • 805/388-3700 • FAX: 805/987-5896 G52325-0, Rev. 3.0 6/14/00 VITESSE SEMICONDUCTOR CORPORATION Preliminary Datasheet VSC7217 Multi-Gigabit Interconnect Chip If the transmitting devices’ REFCLKs are not frequency locked to the receiving devices’ REFCLKs, IDLEs will have to be added to or dropped from all the channels at the same time. In order to implement this, one VSC7217 is arbitrarily chosen as the “Master” and its WSO output is driven to the WSI inputs of all the receiving VSC7217s, including itself. WSO is asserted prior to the VSC7217 adding/dropping IDLEs so all the VSC7217s will operate simultaneously. WSO uses a simple 3-bit serial protocol, synchronous to the Master channel’s word clock, for indicating the required synchronization action to other VSC7217s. A steady LOW level indicates no action is required. ‘101’ indicates that Master Channel A has seen a Word Sync Event. The relative timing relationship between receiving a Word Sync Event (on all channels together) and seeing ‘101’ on the WSI input in the other channels allows these channels to word-synchronize with Master Channel A. ‘110’ indicates that the next IDLE encountered in the receive data stream should be deleted. ‘111’ indicates that an IDLE should be inserted after the next IDLE encountered in the receive data stream. Note that the arbitrarily chosen Master Channel A must be an active channel. Decoder Bypass Mode If ENDEC is LOW, the 8B/10B decoder is bypassed and a 10-bit received character Rn(9:0) is output from each receive channel. The KCHn output becomes Rn8, and ERRn becomes Rn9. Character alignment is handled differently in this mode of operation. As mentioned in the “Encoder Bypass Mode” section, the KCHAR input becomes ENCDET which enables Comma detection and re-synchronization when HIGH, and disables resynchronization when LOW. Only the ‘0011111xxx’ version of the Comma pattern is recognized when ENDEC is LOW. The IDLEn output becomes COMDET (Comma Detect) which signals detection of the ‘0011111xxx’ Comma pattern in the current 10-bit output character when high. This mode of operation is equivalent to a 10-bit interface commonly found in serializer/deserializers for the Fibre Channel (VSC7125) and Gigabit Ethernet markets (VSC7135). The logic used to align the four receive channels and/or insert and delete IDLE characters to compensate for REFCLK variations between transmitting and receiving devices is disabled when ENDEC is LOW. In order for this mode of operation to function without errors, the word clock source, as selected by RMODE(1:0), must be frequency-locked to the REFCLK of the remote transmitting device in each channel. This is guaranteed when RMODE(1:0) = 11. For other choices of RMODE(1:0), the frequency locked condition must be guaranteed by system design. When DUAL is HIGH and RMODE(1:0) = 10 or 11, the character containing the ‘0011111xxx’ Comma pattern is aligned to RCLKn/RCLKNn in each channel so that COMDET will be asserted on the falling edge of RCLKn (rising edge of RCLKNn). This is done by adjusting the latency through the elastic buffer; the recovered clock is never stretched or slivered. When the Comma pattern changes the framing boundary, data characters prior to the assertion of COMDET on the falling edge of RCLKn may be corrupted. Receiver State Machine Each channel contains a Loss of Synchronization State Machine (LSSM) which is responsible for detecting and handling loss of bit, channel, word and word clock synchronization in a controlled manner. There are three states in the LSSM: LOSS_OF_SYNC, RESYNC, and SYNC_ACQUIRED as shown in the state diagram of Figure 9. The RESYNC state is entered when a 10-bit word has been received which contains the 7-bit Comma pattern (e.g., a K28.5 IDLE character). After entering the RESYNC state, the VSC7217 will stay in it until a valid, non-Comma transmission is received, then it transitions to the SYNC_ACQUIRED state indicating a normal operating condition. The RESYNC state is re-entered if four consecutive Commas are received or if a single Comma is received that changes the 10B character framing boundary. The LOSS_OF_SYNC state is G52325-0, Rev. 3.0 6/14/00 VITESSE SEMICONDUCTOR CORPORATION 741 Calle Plano, Camarillo, CA 93012 • 805/388-3700 • FAX: 805/987-5896 Page 13 VITESSE SEMICONDUCTOR CORPORATION Preliminary Datasheet VSC7217 Mutli-Gigabit Interconnect Chip entered whenever four consecutive invalid transmissions have been detected or when the occurrences of invalid transmission outnumber those of valid transmission by four. The relative occurrences of invalid vs. valid transmissions are monitored with a simple up/down counter that increments when an invalid transmission is detected and decrements otherwise. The LSSM transitions to the LOSS_OF_SYNC state when the counter reaches four, and the counter is reset. A state diagram for the invalid transmission counter is shown in Figure 10. The VSC7217 receiver will stay in the LOSS_OF_SYNC state until a valid Comma pattern is detected. Note that the RESYNC state is entered whenever the 10B framing boundary is changed, and whenever the Word Sync Sequence is received. When ENDEC is LOW the ERRn, KCHn and IDLEn outputs are re-defined and the decoder and associated LSSM logic in each channel is unused. Figure 9: State Diagram of the Loss of Synchronization State Machine Valid Comma (K28.1, K28.5, K28.7) RESYNC ERRn=1 KCHn=1 IDLEn=1 Valid Comma Valid Non-Comma Four Consecutive Commas or Mis-Aligned Comma Invalid Transmission Four Consecutive Invalid Transmissions or LOSS_OF_SYNC ERRn=1 KCHn=1 IDLEn=0 SYNC_ACQUIRED Invalid minus Valid Transmissions is > 4 ERRn=0 ERRn=1 KCHn=X or KCHn=0 IDLEn=X IDLEn=X Figure 10: State Diagram of the Invalid Transmission Counter (Unconditional) Invalid Valid Invalid Invalid Invalid 0 1 Valid 2 Valid 3 4 Valid Mis-Aligned Comma Page 14 VITESSE SEMICONDUCTOR CORPORATION 741 Calle Plano, Camarillo, CA 93012 • 805/388-3700 • FAX: 805/987-5896 G52325-0, Rev. 3.0 6/14/00 VITESSE SEMICONDUCTOR CORPORATION Preliminary Datasheet VSC7217 Multi-Gigabit Interconnect Chip Link Status Outputs The receiver ERRn, KCHn and IDLEn outputs indicate status for each channel as shown below in Table 7. Since this status is encoded, multiple conditions could occur simultaneously so the states are prioritized as indicated (1 being highest priority). For example, if both Out-of-Band and Disparity Errors occur, only an Out-of-Band Error is reported because it has higher priority. The ERRn, KCHn and IDLEn status signals apply to the data on Rn(7:0) on a per-character basis. The only exception to this is the Underrun/Overrun indication. This indication is asserted coincident with the duplicated character when an underrun occurs, and is asserted following the deleted character (e.g., on the cycle where the deleted character should have appeared) when overrun occurs. Table 7: Receiver Status Signals ERRn KCHn IDLEn Priority Link Status 0 0 0 7 Valid Data Transmission: A valid 10B data character with correct disparity was received. The correctly decoded version of this character is on Rn(7:0). 0 0 1 1 Underrun/Overrun Error: The elastic buffer has not been able to add/drop an IDLE when required. Data on Rn(7:0) is invalid. 0 1 0 6 Kxx.x Special Character Detected (not IDLE): A valid 10B special character with correct disparity was received. The correctly decoded version of this character, per Table 3, is on Rn(7:0). 0 1 1 5 IDLE Detected: A valid IDLE character (K28.5) with correct disparity was received. The correctly decoded version of this character, per Table 3, is on Rn(7:0). 1 0 0 3 Out-of-band Error Detected: A character was received which was not a valid 10B data or control character. Data on Rn(7:0) is invalid. 1 0 1 4 Disparity Error Detected: A valid 10B character was received which did not have the expected disparity. Rn(7:0) is invalid. 1 1 0 2 Loss of Synchronization: The receiver state machine is in the Loss-of-Sync state. Data on Rn(7:0) is invalid. 1 1 1 2 RESYNC: The receiver state machine is in the ReSynchronization state. Data on Rn(7:0) is a decoded version of K28.1, K28.5 or K28.7. G52325-0, Rev. 3.0 6/14/00 VITESSE SEMICONDUCTOR CORPORATION 741 Calle Plano, Camarillo, CA 93012 • 805/388-3700 • FAX: 805/987-5896 Page 15 VITESSE SEMICONDUCTOR CORPORATION Preliminary Datasheet Mutli-Gigabit Interconnect Chip VSC7217 Loopback Operation Loopback control pins, LBENn(1:0), are provided in each channel to internally loopback data paths for onchip diagnosis. Both serial and parallel loopback functions are provided. Table 8: Loopback Mode Selection LBENn(1:0) Loopback Mode 00 Normal Operation 01 Internal Parallel Loopback 10 Internal Serial Loopback 11 Reserved When LBENn(1:0)=10, Serial Loopback mode is selected. The transmitter’s serial transmit data is internally connected to the receiver’s CRU input. The serial loopback paths are labelled LBTXn in the VSC7217 block diagram on the first page. This allows parallel data on Tn(7:0) to be encoded, serialized, looped back, deserialized and decoded. This mode is intended for the system to verify functionality of the local VSC7217 prior to attempting to establish an external link. The PTXn and RTXn outputs are unaffected by the state of LBENn(1:0). When LBENn(1:0)=01, Parallel Loopback mode is selected. The Rn(7:0) outputs are looped back to the Tn(7:0) inputs (see Figure 11). WSENn does not have a loopback source and is internally connected to a logic LOW. KCHAR does not have a loopback source and is internally connected to a logic HIGH. The C/Dn input is obtained by decoding the link status outputs such that either a data character, special character, or IDLE (K28.5) is transmitted. When the link is in the LOS or RESYNC states, C/Dn is asserted and the data path is set to 0xBC so that an IDLE will be transmitted. For other link status conditions C/Dn follows the KCHn status bit. This guarantees that IDLE and special characters will be correctly looped back along with normal data, and also has the effect of looping back the data received as a normal data character when a disparity error, out-ofband character, or underflow/overflow link status condition occurs. In Parallel Loopback mode, the receiver uses an internal copy of REFCLK as the word clock in each receiver. This data is looped back to the transmitter with TMODE(2:0) internally set to 000. This guarantees that the parallel loopback data to be re-transmitted will be frequency-locked to the transmitter’s REFCLK. This also means that the receiver parallel output data timing will not match the normal system timing that is externally selected by RMODE(1:0). The parallel output data should be ignored in this mode of operation. This internal loopback configuration also allows rate matching to be performed in the receivers’ elastic buffers. Rate matching is controlled and operates exactly the same way that it does in normal mode. This is required to avoid receiver Overrun/Underrun errors in the loopback device if the remote transmitting device’s REFCLK is not frequency-locked to the loopback device’s REFCLK. Keep in mind that the LBENn(1:0), RXP/Rn, PTXENn, RTXENn and BIST inputs must all be configured appropriately in order for end-to-end parallel loopback to function correctly in a user environment. Parallel Loopback mode is internally disabled when BIST mode is enabled. Page 16 VITESSE SEMICONDUCTOR CORPORATION 741 Calle Plano, Camarillo, CA 93012 • 805/388-3700 • FAX: 805/987-5896 G52325-0, Rev. 3.0 6/14/00 VITESSE SEMICONDUCTOR CORPORATION Preliminary Datasheet VSC7217 Multi-Gigabit Interconnect Chip Figure 11: Parallel Loopback Mode Operation LBENn(1:0) RXP/Rn LBTXn PRXn+ PRXnRRXn+ RRXn- Clk/Data Recovery 10 8B/10B Decode PSDETn RSDETn 8 3 8 Rn(7:0) IDLEn KCHn ERRn Elastic Buffer ≈REFCLK PTXENn (dec) 0 LBTXn PTXn+ PTXnRTXn+ RTXn- 8 8B/10B 10 Encode D Q 8 Tn(7:0) C/Dn WSENn ≈REFCLK RECEIVER 1 0 RTXENn 1 KCHAR PARLOOP 1 0 TRANSMITTER Figure 12: BIST Mode Operation BIST Gen 1 8 D Q 8 Tn(7:0) C/Dn WSENn ≈REFCLK 0 8B/10B 10 Encode LBENn(1:0) RXP/Rn LBTXn PTXn+ PTXnRTXn+ RTXn- RTXENn 0 KCHAR BIST PTXENn PRXn+ PRXnRRXn+ RRXn- Clk/Data Recovery 10 8B/10B Decode PSDETn RSDETn 8 3 8 BIST Chk WORDCLK 1 0 TRANSMITTER RECEIVER Rn(7:0) IDLEn KCHn ERRn Elastic Buffer From Tx Clock Gen } CGERRn 1 0 TBERRn BIST Built-In Self-Test Operation Built-In Self-Test operation is enabled when the BIST input is HIGH, which causes TMODE(2:0) to be internally set to 000. Upon entering BIST mode, the transmitter will issue a Word Sync Sequence in order to recenter the elasticity buffers in the receive channel. Each transmitter then repeatedly sends a simple 256-byte incrementing data pattern (prior to 8B/10B encoding) followed by three IDLE characters (K28.5). Note that this incrementing pattern plus three IDLEs will cause both disparities of each data character and the IDLE character to be transmitted, and contains a sufficient IDLE density for any application requiring IDLE insertion/deletion. It is up to the user to enable IDLE insertion/deletion if the receiver’s word clock is not frequency-locked to the transmitter’s REFCLK. Each receiver monitors incoming data for this pattern and indicates if any errors are detected. Correct reception of the pattern is reported on each receiver’s TBERRn output. A LOW means the pattern is being received correctly and a HIGH means that errors are detected. When BIST transitions from LOW to HIGH, each TBERRn output is initialized HIGH. It will be cleared LOW whenever one or more IDLE characters, followed by all 256 data characters, are sequentially received without error, and set HIGH whenever a pattern mismatch or receiver error is encountered. Each channel functions independently, no attempt is made to word-align the receive channels. Received data and associated status will be output as in normal operation. Please note that Serial Loopback mode and receiver output timing mode selection via RMODE(1:0) operate independently of BIST mode, but BIST mode disables Parallel Loopback mode. G52325-0, Rev. 3.0 6/14/00 VITESSE SEMICONDUCTOR CORPORATION 741 Calle Plano, Camarillo, CA 93012 • 805/388-3700 • FAX: 805/987-5896 Page 17 VITESSE SEMICONDUCTOR CORPORATION Preliminary Datasheet Mutli-Gigabit Interconnect Chip VSC7217 Compatibility with VSC7214 and VSC7211 Care has been taken in the functional definition of the VSC7217 ensure compatiblity with the VSC7211 and VSC7214 at the serial link level, and that the transmitter and receiver low-speed interfaces have compatible modes of operation. It is strongly recommended that the VSC7217 not be connected in any way through the WSO and/or WSI pins to a VSC7211 or VSC7214. Serial Link Compatibility The VSC7217 uses the same Fibre Channel 8b/10b encoding scheme and the same Word Sync Sequence used in the VSC7211 and VSC7214. The only difference in serial link operation is that the VSC7211 and VSC7214 require four consecutive identically-aligned Comma patterns to set the character framing boundary, while the VSC7217 requires a single Comma. This means that from the LOSS_OF_SYNC state, the VSC7217 will make an earlier transition to the RESYNC state (one Comma instead of four) as shown in Figure 9. Once out of the LOSS_OF_SYNC state, there is no difference in receiver behavior in the absence of data link errors. When transmitting in 32-bit mode from a VSC7217 to a VSC7211 or VSC7214, use TMODE(2:0)=000 or =1X0 (common transmit interface timing source) to minimize transmitter inter-channel skew. Parallel Interface Compatibility In general, the VSC7217 low-speed parallel interfaces can be configured so that there are input and output signals that are compatible with their VSC7211 and VSC7214 counterparts. On the transmit interface, the signals Tn(7:0) and C/Dn behave identically on the VSC7217 as long as the input timing is referenced to REFCLK (e.g., TMODE(2:0)=000). On the receive interface, the signals Rn(7:0), ERRn, KCHn and IDLEn behave identically on the VSC7217 as long as the four receive channels present output data centered around REFCLK (RMODE(1:0)=00) or timed to RCLKA/RCLKNA (RMODE(1:0)=10). When RMODE(1:0)=10 the VSC7217 RCLKn/RCLKNn outputs provide four copies of RCLKA/RCLKNA, which are equivalent to the VSC7211 and VSC7214 RCLK/RCLKN outputs. The VSC7217 KCHAR input is no longer a synchronous input timed to REFCLK as on the VSC7211 and VSC7214. It is a static input used to define the control character encoding mode when C/Dn=1 as shown in Table 2. The VSC7217 also has a separate WSENn input per channel instead of a common WSYNC input as on the VSC7211 and VSC7214. Operational Mode Compatibility The VSC7211 and VSC7214 specifications define eight operating modes based on the binary combinations of the RCLKEN, FLOCK and INDEP inputs. Note that these mode inputs control VSC7211 and VSC7214 receiver operation only, and have no effect on transmitter operation. For each of these modes, the equivalent VSC7217 receiver configuration is presented. VSC7214 MODE 0: RCLKEN=LOW, FLOCK=LOW, INDEP=LOW Receiver Rn(7:0), ERRn, KCHn and IDLEn outputs are synchronous to REFCLK, IDLE insertion/deletion is enabled, and the receive channels are word-aligned. The VSC7217 should be configured with RMODE(1:0)=00, FLOCK=0, and WSI connected to its own WSO or to the WSO of another VSC7217 if multiple devices are to be used in parallel. The WSI connection allows IDLE insertion/deletion to occur in parallel across all word-aligned channels. Page 18 VITESSE SEMICONDUCTOR CORPORATION 741 Calle Plano, Camarillo, CA 93012 • 805/388-3700 • FAX: 805/987-5896 G52325-0, Rev. 3.0 6/14/00 VITESSE SEMICONDUCTOR CORPORATION Preliminary Datasheet VSC7217 Multi-Gigabit Interconnect Chip VSC7214 MODE 1: RCLKEN=LOW, FLOCK=LOW, INDEP=HIGH Receiver Rn(7:0), ERRn, KCHn and IDLEn outputs are synchronous to REFCLK, IDLE insertion/deletion is enabled, and the receive channels are independent. The VSC7217 should be configured with RMODE(1:0)=00, FLOCK=0, and WSI=1. The WSI connection inhibits channel alignment, and allows IDLE insertion/deletion to occur independently in each channel. VSC7214 MODE 2: RCLKEN=LOW, FLOCK=HIGH, INDEP=LOW Receiver Rn(7:0), ERRn, KCHn and IDLEn outputs are synchronous to REFCLK, IDLE insertion/deletion is disabled, and the receive channels are word-aligned. The VSC7217 should be configured with RMODE(1:0)=00, FLOCK=1, and WSI connected to its own WSO or to the WSO of another VSC7217 if multiple devices are to be used in parallel. The WSI connection allows word alignment to occur, and the FLOCK connection inhibits IDLE insertion/deletion. VSC7214 MODE 3: RCLKEN=LOW, FLOCK=HIGH, INDEP=HIGH Receiver Rn(7:0), ERRn, KCHn and IDLEn outputs are synchronous to REFCLK, IDLE insertion/deletion is disabled, and the receive channels are independent. The VSC7217 should be configured with RMODE(1:0)=00, FLOCK=1, and WSI=0. The WSI connection inhibits channel alignment, and the FLOCK connection inhibits IDLE insertion/deletion. VSC7214 MODE 4: RCLKEN=HIGH, FLOCK=LOW, INDEP=LOW This configuration does not require IDLE insertion/deletion, use Mode 6 instead. VSC7214 MODE 5: RCLKEN=HIGH, FLOCK=LOW, INDEP=HIGH Receiver Rn(7:0), ERRn, KCHn and IDLEn outputs are synchronous to RCLKn/RCLKNn, IDLE insertion/deletion is enabled, and the receive channels are independent. The VSC7217 should be configured with RMODE(1:0)=10, FLOCK=0, and WSI=1. The WSI connection inhibits channel alignment, and allows IDLE insertion/deletion to occur independently in each channel. The B, C and D channel RCLKn/ RCLKNn outputs are copies of RCLKA/RCLKNA. VSC7214 MODE 6: RCLKEN=HIGH, FLOCK=HIGH, INDEP=LOW Receiver Rn(7:0), ERRn, KCHn and IDLEn outputs are synchronous to RCLKn/RCLKNn, IDLE insertion/deletion is disabled, and the receive channels are word-aligned. The VSC7217 should be configured with RMODE(1:0)=10, FLOCK=1, and WSI connected to its own WSO. Multiple VSC7217 devices should not be used in parallel when the outputs are synchronous to RCLKn/RCLKNn. The WSI connection allows word alignment to occur, and the FLOCK connection inhibits IDLE insertion/deletion. VSC7214 MODE 7: RCLKEN=HIGH, FLOCK=HIGH, INDEP=HIGH Receiver Rn(7:0), ERRn, KCHn and IDLEn outputs are synchronous to RCLKn/RCLKNn, IDLE insertion/deletion is disabled, and the receive channels are independent. The VSC7217 should be configured with RMODE(1:0)=10, FLOCK=1, and WSI=0. The WSI connection inhibits channel alignment, and the FLOCK connection inhibits IDLE insertion/deletion. G52325-0, Rev. 3.0 6/14/00 VITESSE SEMICONDUCTOR CORPORATION 741 Calle Plano, Camarillo, CA 93012 • 805/388-3700 • FAX: 805/987-5896 Page 19 VITESSE SEMICONDUCTOR CORPORATION Preliminary Datasheet VSC7217 Mutli-Gigabit Interconnect Chip AC Specifications Figure 13: Transmit Input Timing Waveforms with TMODE = 000 REFCLK (DUAL=0) REFCLK (DUAL=1) Internal Clock (from PLL) T2 T1 Tn(7:0) C/Dn WSENn Valid T2 T1 Valid Valid Figure 14: Transmit Input Timing Waveforms with TMODE = 10X TBCn (or TBCA) Internal Clock (from PLL) T2 T1 Tn(7:0) C/Dn WSENn Valid T2 T1 Valid Valid Table 9: Transmit Input AC Characteristics with TMODE = 000 or TMODE = 10X Parameters Page 20 Description Min Max Units Conditions Measured between the valid data level of the input and the 1.4V point of REFCLK or TBCn. T1 Input Setup time to the rising edge of REFCLK or TBCn 1.5 — ns T2 Input Hold time after the rising edge of REFCLK or TBCn 1.0 — ns VITESSE SEMICONDUCTOR CORPORATION 741 Calle Plano, Camarillo, CA 93012 • 805/388-3700 • FAX: 805/987-5896 G52325-0, Rev. 3.0 6/14/00 VITESSE SEMICONDUCTOR CORPORATION Preliminary Datasheet VSC7217 Multi-Gigabit Interconnect Chip Figure 15: Transmit Input Timing Waveforms with TMODE = 11X (“ASIC-Friendly” Timing) TBCn (or TBCA) Internal Clock (from PLL) TS Tn(7:0) C/Dn WSENn TS Valid Valid Valid Table 10: Transmit Input AC Characteristics with TMODE = 11X Parameters Description Min Max Units Conditions TS Input Skew relative to the rising edge of TBCn or TBCA — 2.0 bc Measured between the valid data level of the input and the 1.4V point of TBCn or TBCA, bc = Bit Clock. Figure 16: Transmit Serial Timing Waveforms TSDR, TSDF TXn+, TXn- TX0 TLAT REFCLK (or TBCn) Table 11: Transmit Serial AC Characteristics Parameters Min Max Units Conditions TSDR, TSDF TXn+/- Rise and Fall Times — 330 ps Measured between 20% to 80% of the valid data level. TLAT Latency, REFCLK to TX0 Latency, TBCA to TX0 Latency, TBCB/C/D to TX0 22bc+0.2ns 36bc+0.0ns 32bc+0.1ns 22bc+0.8ns 38bc+0.3ns 42bc+0.6ns bc + ns ENDEC=1 TMODE=000 ENDEC=1 TMODE=10X ENDEC=1 TMODE=101 TJ Serial Data Output Total Jitter (p-p) — 192 ps IEEE 802.3z Clause 38.69, tested on a sample basis. TDJ Serial Data Output Deterministic Jitter (p-p) — 80 ps IEEE 802.3z Clause 38.69, tested on a sample basis. G52325-0, Rev. 3.0 6/14/00 Description VITESSE SEMICONDUCTOR CORPORATION 741 Calle Plano, Camarillo, CA 93012 • 805/388-3700 • FAX: 805/987-5896 Page 21 VITESSE SEMICONDUCTOR CORPORATION Preliminary Datasheet VSC7217 Mutli-Gigabit Interconnect Chip Figure 17: Receive Output Timing Waveforms with RMODE = 00 or 01 REFCLK (DUAL = 0) TPER REFCLK (DUAL = 1) Rn(7:0) TBERRn KCHn IDLEn ERRn PSDETn RSDETn TCQ_max TCQ_min TQC_min Valid Valid Valid Table 12: Receive Output AC Characteristics with RMODE = 00 or 01 Parameters Description Min Max Units Conditions TCQ REFCLK Rising Edge to TTL Output Transition 2.58 ns - 0 bc 5.43 ns - 0 bc ns RMODE = 00 bc = Bit Clock TCQ REFCLK Rising Edge to TTL Output Transition 2.58 ns - 2 bc 5.43 ns - 2 bc ns RMODE = 01 bc = Bit Clock TQC TTL Output Transition to REFCLK Rising Edge TPER - TCQ_max ns Figure 18: Receive Output Timing Waveforms with RMODE = 10 or 11 RCLKn (DUAL = 0) TPER RCLKn/RCLKNn (DUAL = 1) Rn(7:0) TBERRn KCHn IDLEn ERRn PSDETn RSDETn TCQ_max TCQ_min TQC_min Valid Valid Valid Table 13: Receive Output AC Characteristics with RMODE = 10 or 11 Parameters Description Min Max Units TCQ RCLKn/RCLKNn Rising Edge to TTL Output Transition -1.25 ns + 4 bc 1.25 ns + 4 bc ns TCQ TTL Output Transition to RCLKn/ RCLKNn Rising Edge TPER - TCQ_max TPER - TCQ_min ns DC RCLKn/RCLKNn Duty Cycle 50% - 1 ns 50% + 1 ns ns Page 22 Conditions RMODE = 10 or 11 bc = Bit Clock Measured at 1.4. V VITESSE SEMICONDUCTOR CORPORATION 741 Calle Plano, Camarillo, CA 93012 • 805/388-3700 • FAX: 805/987-5896 G52325-0, Rev. 3.0 6/14/00 VITESSE SEMICONDUCTOR CORPORATION Preliminary Datasheet VSC7217 Multi-Gigabit Interconnect Chip Figure 19: RCLKn and RCLKNn Timing Waveforms with DUAL = 1 T4 T3 RCLKn RCLKNn Table 14: General Receive AC Characteristics Parameters Description Min. Max. Units T3 Delay Between Rising Edge of RCLKn to Rising Edge of RCLKNn 10 x TRX -500 10 x TRX +500 ps TRX is the bit period of the incoming data on Rx. RCLKn to RCLKNn Skew ∆T3 T4 ∆T4 -500 500 ps Deviation of RCLKn rising edge to RCLKNn rising edge. Nominal delay is 10 bit times. Period of RCLKn and RCLKNn 0.99 x TREFCLK 1.01 x TREFCLK ps Whether or not locked to serial data, independent of DUAL input. Deviation of RCLK/RCLKN Period from REFCLK Period -1.0 1.0 % Whether or not locked to serial data, independent of DUAL input. — 2.4 ns Between VIL(MAX) and VIH(MIN) into 10pf load. 70.5bc-1.6ns 48.5bc-1.6ns 81.5bc+4.1ns 102.5bc+4.1ns bc+ns ENDEC=1, Recenter only ENDEC=X, Recenter + Drift — 100 bc Using K28.5+/K28.5- pattern. tested on a sample basis. 10 - ± ∆T Delay = ----------3 f baud T RCLK = T REFCLK ± ∆T 4 TR, TF Output Rise and Fall Time RLAT Latency from RX0 to REFCLK or RCLK TLOCK(1) Conditions Data Acquisition Lock Time TJTD Receive Data Total Jitter Tolerance (p-p) 600 ps IEEE 802.3z Clause 38.68, tested on a sample basis. DJTD Receive Data Deterministic Jitter Tolerance (p-p) 370 ps IEEE 802.3z Clause 38.69, tested on a sample basis. NOTE: (1) The probability of correct data acquisition and recovery is 99% per FC-PH 4.3 Section 5.3. G52325-0, Rev. 3.0 6/14/00 VITESSE SEMICONDUCTOR CORPORATION 741 Calle Plano, Camarillo, CA 93012 • 805/388-3700 • FAX: 805/987-5896 Page 23 VITESSE SEMICONDUCTOR CORPORATION Preliminary Datasheet VSC7217 Mutli-Gigabit Interconnect Chip Figure 20: REFCLK Timing Waveforms TH VIH(MIN) REFCLK VIL(MAX) TL Table 15: Reference Clock Requirements Parameters FR Description Frequency Range FO Frequency Offset DC TH,TL TRCR,TRCF Min Max Units Conditions 98 136 MHz 49 68 MHz DUAL = 1 | REFCLK (Tx) - REFCLK (Rx) | = max offset between Tx and Rx device REFCLKs on one serial link. DUAL = 0 -200 200 ppm REFCLK Duty Cycle 35 65 % REFLCK and TBC Pulse Width 3 — ns REFCLK Rise and Fall Times — 1.5 ns Between VIL(MAX) and VIH(MIN). — 100 ps Peak-to-peak jitter at VSC7217 REFCLK input. Measured at 1.4V. REFCLK Jitter Power REFCLK Jitter 3MHz ∫ PhaseNoise 100Hz Page 24 VITESSE SEMICONDUCTOR CORPORATION 741 Calle Plano, Camarillo, CA 93012 • 805/388-3700 • FAX: 805/987-5896 G52325-0, Rev. 3.0 6/14/00 VITESSE SEMICONDUCTOR CORPORATION Preliminary Datasheet VSC7217 Multi-Gigabit Interconnect Chip Figure 21: Parametric Measurement Information Serial Input Rise and Fall Time Tr TTL Input and Output Rise and Fall Time 80% VIH(MIN) 20% VIL(MAX) Tr Tf Tf Receiver Input Eye Diagram Jitter Tolerance Mask Bit Time Amplitude Eye Width% 25% Parametric Test Load Circuit Serial Output Load Z0 = 50Ω TTL AC Output Load 50Ω 10 pF VDD – 2.0V G52325-0, Rev. 3.0 6/14/00 VITESSE SEMICONDUCTOR CORPORATION 741 Calle Plano, Camarillo, CA 93012 • 805/388-3700 • FAX: 805/987-5896 Page 25 VITESSE SEMICONDUCTOR CORPORATION Preliminary Datasheet VSC7217 Mutli-Gigabit Interconnect Chip DC Characteristics Parameters Description Min. Typ Max. Units Conditions TTL Outputs (Rn(7:0), KCHn, IDLEn, ERRn, RCLKn/RCLKNn, TBERRn, PSDETn, RSDETn, WSO) VOH TTL Output HIGH Voltage 2.4 — — V VOL TTL Output LOW Voltage — — 0.5 V IOL = +1.0mA µA When set to high-impedance state through JTAG. IOZ TTL Output Leakage Current — — TBD IOH = -1.0mA TTL Inputs (TBCn, Tn(7:0), C/Dn, WSENn, KCHAR, RATE, BIST, LBENn(1:0), TMODE(2:0), RMODE(1:0), DUAL, PTXENn, RTXENn, RXP/Rn, RESETN, ENDEC, WSI, FLOCK, TRSTN, TDI, TDO, TMS, TCK) VIH TTL Input HIGH Voltage 2.0 — — V VIL TTL Input LOW Voltage 0 — 0.8 V IIH TTL Input HIGH Current — 50 500 µA VIN =2.4V IIL TTL Input LOW Current — — -1000 µA VIN =0.5V PECL Inputs (REFCLKP/REFCLKN) VIH PECL Input HIGH Voltage VDD 1.1 — VDD 0.7 V VIL PECL Input LOW Voltage VDD 2.0 — VDD 1.5 V IIH PECL Input HIGH Current — — 200 µA VIN =VIH(MAX) IIL PECL Input LOW Current - 50 — — µA VIN =VIL(MIN) ∆VIN PECL Input Differential Peakto-Peak Voltage Swing 200 — — mV | VIH(MIN) - VIL(MAX) |a VDD 1.5 — VDD 0.7 V — VDD/2 — 450 — 1100 mV | PTXn+ - PTXn- |a 50Ω to VDD - 2.0V PECL Differential Peak-to-Peak Input Voltage Swing 200 — 1300 mV | PRXn+ - PRXn- |a VCM VBIAS PECL Input Common-Mode Voltage REFCLKP/REFCLKN Internal Input bias voltage PECL Outputs (PTXn+/-, RTXn+/-) ∆VOUT PECL Differential Peak-to-Peak Output Voltage Swing PECL Inputs (PRXn+/-, RRXn+/-) ∆VIN Miscellaneous VDD Power Supply Voltage 3.14 — 3.47 V 3.3V + 5% PD Power Dissipation — 3.0 3.5 W IDD Supply Current — 910 1000 mA Maximum at 3.47V, 130MHz redundant I/O OFF Typical at 3.3V, outputs open a. Single ended measurement results are quoted here. Differential techniques used in Fibre Channel would yield values that are twice the magnitude. See diagram below. Tx+ ∆ Vout Tx- Page 26 VITESSE SEMICONDUCTOR CORPORATION 741 Calle Plano, Camarillo, CA 93012 • 805/388-3700 • FAX: 805/987-5896 G52325-0, Rev. 3.0 6/14/00 VITESSE SEMICONDUCTOR CORPORATION Preliminary Datasheet VSC7217 Multi-Gigabit Interconnect Chip Absolute Maximum Ratings (1) Power Supply Voltage, (any VDDX)................................................................................................. 0.5V to +3.8V PECL Differential Input Voltage............................................................................................ -0.5V to VDD +0.5V TTL Input Voltage...........................................................................................................................-0.5V to +5.5V TTL Output Voltage .............................................................................................................. -0.5V to VDD + 0.5V TTL Output Current ...................................................................................................................................... 50mA PECL Output Current .................................................................................................................................... 50mA Case Temperature Under Bias, (TC)................................................................................................-55o to +125oC Storage Temperature, (TSTG) ....................................................................................................... -65oC to +150oC Note: (1) CAUTION: Stresses listed under “Absolute Maximum Ratings” may be applied to devices one at a time without causing permanent damage. Functionality at or above the values listed is not implied. Exposure to these values for extended periods may affect device reliability. Recommended Operating Conditions Power Supply Voltage, (VDD)................................................................................................................+3.3V+5% Operating Temperature Range, .................................................................................0oC Ambient to +95oC Case G52325-0, Rev. 3.0 6/14/00 VITESSE SEMICONDUCTOR CORPORATION 741 Calle Plano, Camarillo, CA 93012 • 805/388-3700 • FAX: 805/987-5896 Page 27 Page 28 RESETN VITESSE SEMICONDUCTOR CORPORATION 741 Calle Plano, Camarillo, CA 93012 • 805/388-3700 • FAX: 805/987-5896 RRXA- PRXB- RRXA+ PRXB+ VSSD VDDD VSSD RRXB+ RRXB- RXP/RB RMODE1 VSSD LBENB1 LBENA1 TA4 TA0 TA7 TA1 VSSD C/DA TA5 TA3 WSENA VSSD VDDD TB1 TB0 TBCB TB5 TB4 TB2 RB0 VSST KCHAR FLOCK VDDT ENDEC RB3 RB7 VDDD WSENB RSVD1 RSVD2 VDDD TB6 C/DB RB1 VSST RB4 VDDT KCHB TBERRB VDDT RB5 IDLEB VSST RSDETB RA0 VSST RA7 ERRA VSST VDDT RCLKND VSST KCHD RD6 VSST RCLKC PSDETC VSST TBERRC RC4 18 VSST VDDT PSDETB RA2 VDDT RA6 KCHA VDDT RCLKNA VSSD TDO VDDT IDLED VDDT RD4 VDDT RD1 RSDETC VDDT VSST 19 RCLKNB RA1 RA4 RA5 VSST TBERRA PSDETA VSST RCLKA WSI VDDD RSDETD TBERRD VSST ERRD RD7 VSST RD3 RD0 ERRC 20 Y W V U T R P N M L K J H G F E D C B A Mutli-Gigabit Interconnect Chip VDDD RXP/RA TB7 VDDD TB3 PRXA- PRXA+ TBCA RTXA- RTXA+ RCLKB RA3 LBENB0 PTXA- PTXA+ VDDRA VDDT VDDRB VDDPA RTXENA LBENA0 RSDETA WSO RCLKD IDLEA PTXENB VDDA VSSA PTXENC RTXENB PTXENA VDDPB VDDD VSSD VDDPC PSDETD RTXB- RCLKNC VDDT IDLEC VDDT RTXB+ ERRB KCHC RC7 VSST RC3 17 PTXB- RB6 RC5 RC6 RC2 RC0 16 PTXB+ RB2 RC1 VSST VDDT TCK 15 VDDA VSSD VDDD VSSD TMS TDI 14 CAP1 TA6 BIST WSENC C/DC NOT POPULATED TC5 TC6 VDDD TRSTN 13 VSSA TA2 TC1 REFCLKN TC2 TBCD TC3 TC7 12 CAP0 RMODE0 TD7 TD6 TBCC VSSD 11 PTXC- DUAL TD3 VSSD WSEND TC4 10 PTXC+ RTXENC PTXEND VDDRD VSSD TMODE0 TMODE1 TD1 TD5 TC0 9 VDDT PTXD- PTXD+ LBEND1 VDDD VDDD TD2 VSSD REFCLKP 8 RTXC- RTXD- RTXD+ LBENC1 VSSD TD0 C/DD 7 RTXC+ PRXD- PRXD+ VSSD TMODE2 TD4 6 RD5 RXP/RD VDDD RXP/RC RRXC- 5 VDDRC VDDPD RTXEND LBEND0 RRXD- RRXD+ RRXC+ 4 RD2 PRXC- PRXC+ 3 LBENC0 2 1 VITESSE SEMICONDUCTOR CORPORATION Preliminary Datasheet VSC7217 Table 16: Pin Table G52325-0, Rev. 3.0 6/14/00 VITESSE SEMICONDUCTOR CORPORATION Preliminary Datasheet VSC7217 Multi-Gigabit Interconnect Chip Table 17: Pin Description Pin 6Y, 8U, 7W, 5Y, 7V, 7U, 6W, 5W 11U, 11W, 10Y, 10W, 10U, 10V, 9Y, 9W 12A, 11C, 11D, 10A, 10B, 10D, 10C, 9A 8D, 8C, 7B, 5A, 7D, 6B, 6C, 5B TA(7:0) TB(7:0) TC(7:0) TD(7:0) I/O Type Pin Description I TTL Transmit Data for Channel n. Synchronous to REFCLK, TBCA or TBCn. I TTL Transmit Data for Channel n. Synchronous to REFCLK, TBCB or TBCn. I TTL Transmit Data for Channel n. Synchronous to REFCLK, TBCC or TBCn. I TTL Transmit Data for Channel n. Synchronous to REFCLK, TBCD or TBCn. TTL Control/Data for Channel n. If KCHAR=C/Dn=LOW, then Tn(7:0) is used to generate transmit data. If KCHAR=C/Dn=HIGH, then special Kxx.x characters are transmitted based upon the value of Tn(7:0). If KCHAR=LOW and C/Dn=HIGH, IDLE characters are transmitted. When ENDEC=LOW, this is equivalent to data bit Tn8. 7Y 11V 12B 6A C/DA C/DB C/DC C/DD 8Y 12Y 12C 8B WSENA WSENB WSENC WSEND I TTL Word Sync ENable for Channel n. Asserted HIGH for one cycle to initiate transmission of the Word Sync Sequence as defined in Figure 5 and related text. When ENDEC=LOW, this is equivalent to data bit Tn9. 9U 9V 9B 9C TBCA TBCB TBCC TBCD I TTL Transmit Byte Clock for Channel n. Optional input data timing reference for Tn(7:0), WSENn and C/Dn. I 12W KCHAR I TTL Special Kxx.x CHARacter Enable. When C/Dn is HIGH, KCHAR controls data sent to the transmitter. When LOW, IDLE characters are sent. When HIGH, Kxx.x special characters are sent as encoded on Tn(7:0). This is intended to be a static input and cannot be changed on a cycle-by-cycle basis. When ENDEC=LOW, this is equivalent to ENCDET. 5D 6D 4B TMODE0 TMODE1 TMODE2 I TTL Transmit Input Data Timing MODE. Determines the timing reference for Tn(7:0), WSENn and C/Dn on all channels as defined in Table 1. 20R 17V 18B 20H TBERRA TBERRB TBERRC TBERRD TTL Transmit Buffer ERRor for Channel n. When HIGH indicates that the elastic limit of the transmit input skew buffer was exceeded, output timing is same as Rn(7:0). A LOW indicates correct reception of the256-bye incrementing pattern in BIST mode. G52325-0, Rev. 3.0 6/14/00 Name O VITESSE SEMICONDUCTOR CORPORATION 741 Calle Plano, Camarillo, CA 93012 • 805/388-3700 • FAX: 805/987-5896 Page 29 VITESSE SEMICONDUCTOR CORPORATION Preliminary Datasheet VSC7217 Mutli-Gigabit Interconnect Chip Pin Name I/O Type 1R, 2R 1M, 2M 1J, 2J 1F, 2F PTXA+/PTXB+/PTXC+/PTXD+/- O PECL Primary Differential Serial TX Outputs for Channel n. These pins output serialized transmit data when PTXENn is HIGH. AC coupling is recommended. 1T, 2T 1N, 2N 1H, 2H 1E, 2E RTXA+/RTXB+/RTXC+/RTXD+/- O PECL Redundant Differential Serial TX Outputs for Channel n. These pins output serialized transmit data when RTXENn is HIGH. AC coupling is recommended. 4N 4M 4J 4H PTXENA PTXENB PTXENC PTXEND I TTL Primary TX Output ENable for Channel n. PTXn+/- is active when HIGH; when LOW, PTXn+/- is powered down and the outputs are undriven. 3P 3N 3H 3G RTXENA RTXENB RTXENC RTXEND I TTL Redundant TX Output ENable for Channel n. RTXn+/- is active when HIGH; when LOW, RTXn+/- is powered down and the outputs are undriven. O TTL Receive Data for Channel A. Synchronous to RCLKA/RCLKNA or REFCLK as selected by RMODE(1:0). O TTL Receive Data for Channel B. Synchronous to RCLKB/RCLKNB or REFCLK as selected by RMODE(1:0). O TTL Receive Data for Channel C. Synchronous to RCLKC/RCLKNC or REFCLK as selected by RMODE(1:0). O TTL Receive Data for Channel D. Synchronous to RCLKD/RCLKND or REFCLK as selected by RMODE(1:0). 18P, 19R 20U, 20V 17R, 19U 20W, 18T 15V, 15U 18Y, 17Y 15W, 14U 16Y, 13V 16C, 15C 15D, 18A 17A, 15B 14D, 16A 20E, 18G 17G, 19F 20C, 17F 19D, 20B Page 30 RA(7:0) RB(7:0) RC(7:0) RD(7:0) Pin Description 17N 18W 17C 19H IDLEA IDLEB IDLEC IDLED O TTL IDLE Detect for Channel n. When HIGH, an IDLE character has been detected by the decoder and is on Rn(7:0). When ENDEC=LOW, this is equivalent to COMDETn. 19P 16V 16D 18H KCHA KCHB KCHC KCHD O TTL Kxx.x CHaracter Detect for Channel n. When HIGH, a special Kxx.x character has been detected by the decoder and is on Rn(7:0). When ENDEC=LOW, this is equivalent to data bit Rn8. VITESSE SEMICONDUCTOR CORPORATION 741 Calle Plano, Camarillo, CA 93012 • 805/388-3700 • FAX: 805/987-5896 G52325-0, Rev. 3.0 6/14/00 VITESSE SEMICONDUCTOR CORPORATION Preliminary Datasheet VSC7217 Pin Name I/O Type 18N 16U 20A 20F ERRA ERRB ERRC ERRD O TTL ERRor Detect for Channel n. When HIGH, an invalid 10-bit character or disparity error has been detected and the data on Rn(7:0) is invalid. When ENDEC=LOW, this is equivalent to data bit Rn9. 20M 19M 17T 20Y 18E 17E 17K 18K RCLKA RCLKNA RCLKB RCLKNB RCLKC RCLKNC RCLKD RCLKND O TTL Recovered CLocK Outputs for Channel n. These outputs are driven from either the channel A or channel n recovered clock, at 1/10 or 1/20 the baud rate, as selected by RMODE(1:0) and DUAL. When unused, RCLKn is LOW and RCLKNn is HIGH. 6U 4W RMODE0 RMODE1 I TTL Receive Output Data Timing MODE. Determines the timing reference for all receive channels’ Rn(7:0), IDLEn, KCHn and ERRn output data, and also for the PSDETn, RSDETn and TBERRn outputs, as defined in Table 5. 1U, 2U 1Y, 2Y 1A, 2A 1D, 2D PRXA+/PRXB+/PRXC+/PRXD+/- PECL Primary Differential Serial RX Inputs for Channel n. These pins receive the serialized input data when LBENn(1) is LOW and RXP/Rn is HIGH; otherwise they are unused. They are internally biased at VDD/2 through a 3.2kΩ resistor to the bias voltage. AC-coupling is recommended. 1W, 2W 3Y, 4Y 3A, 4A 1B, 2B RRXA+/RRXB+/RRXC+/RRXD+/- I PECL Redundant Differential Serial RX Inputs for Channel n. These pins receive the serialized input data when LBENn(1) is LOW and RXP/Rn is LOW, otherwise they are unused. They are internally biased at VDD/2 through a 3.2kΩ resistor to the bias voltage. AC-coupling is recommended. 4P 3T 4R 3U 4F 3D 4G 3E LBENA0 LBENA1 LBENB0 LBENB1 LBENC0 LBENC1 LBEND0 LBEND1 I TTL LoopBack ENable for Channel n. These inputs control the channel serial or parallel loopback configuration as described in Table 8. 2V 3W 3B 2C RXP/RA RXP/RB RXP/RC RXP/RD I TTL RX Input Primary/Redundant Serial Input Select for Channel n. When LBENn(1) is LOW, this input selects PRXn+/- as the RX serial input source when HIGH and RRXn+/- as the serial input source when LOW. 20P 19V 18D 17J PSDETA PSDETB PSDETC PSDETD TTL Primary Analog Signal DETect, Channel n. This output goes HIGH when the amplitude on PRXn is greater than 200mV and goes LOW when the input is less than 100mV. PSDETn is not defined when the input is between 100mV and 200mV. Output timing is same as Rn(7:0). 17M 18U 19C 20J RSDETA RSDETB RSDETC RSDETD TTL Redundant Analog Signal DETect, Channel n. This output goes HIGH when the amplitude on RRXn is greater than 200 mV and goes LOW when the input is less than 100mV. RSDETn is not defined when the input is between 100mV and 200mV. Output timing is same as Rn(7:0). G52325-0, Rev. 3.0 6/14/00 Multi-Gigabit Interconnect Chip I O O Pin Description VITESSE SEMICONDUCTOR CORPORATION 741 Calle Plano, Camarillo, CA 93012 • 805/388-3700 • FAX: 805/987-5896 Page 31 VITESSE SEMICONDUCTOR CORPORATION Preliminary Datasheet VSC7217 Mutli-Gigabit Interconnect Chip Pin Name 8A 9D REFCLKP REFCLKN 1K 1L CAP0 CAP1 5U DUAL I/O I I Type Pin Description PECL REFCLK Differential Positive and Negative PECL or Single-ended TTL Inputs. This rising edge of this clock latches transmit data and control into the input register. It also provides the reference clock, at 1/10th or 1/20th of the baud rate to the PLL as selected by DUAL. If TTL, connect to REFCLKP but leave REFCLKN open. If PECL, connect both REFCLKP and REFCLKN. Analog Loop Filter CAPacitor for Clock Generation PLL. Nominally 0.1 µF, amplitude is less than 3V. Refer to the Loop Filter Applications section for further details. TTL DUAL Clock Mode. When LOW, REFCLK and RCLKn/RCLKNn are 1/10th the baud rate. When HIGH, they are 1/20th the baud rate. 13W FLOCK I TTL Frequency LOCKed Mode. When HIGH, indicates that each transmit channel’s REFCLK is frequency-locked to the receive channel’s word clock. Controls rate matching (IDLE delete/duplicate) logic along with the WSI input as per Table 6. 12D BIST I TTL Built-In Self-Test Mode. When HIGH, all transmit channels continuously send a 256 byte incrementing data pattern, and all receive channels signal correct reception of the test pattern with a LOW on the TBERRn outputs. 12V ENDEC I TTL ENcoder/DECoder Enable. When HIGH, the VSC7217 is configured for 8 bit operation and internal 8B/10B encoding is enabled. When LOW, a 10-bit interface is used and internal 8B/10B encoding is bypassed. 12U RESETN I TTL RESETN Input. When asserted LOW, the transmitter input skew buffers and receiver elastic buffers are recentered. 20L WSI I TTL Word Sync Input. Used to control channel alignment and IDLE character insertion/deletion as defined in Table 6. 17L WSO O TTL Word Sync Output. Used to set initial channel word alignment, and to maintain alignment by controlling IDLE character insertion/deletion. 15A TCK I TTL JTAG Test Access Port test clock input. 13B TMS I TTL JTAG Test Access Port test mode select input. 14A TDI I TTL JTAG Test Access Port test data input. 19K TDO O TTL JTAG Test Access Port test data output. 13A TRSTN I TTL JTAG Test Access Port test logic reset input. 14Y RSVD I N/A Reserved Inputs for Future Use. Set HIGH for compatibility reasons. 13Y RSVD I N/A Reserved Inputs for Future Use. Set HIGH for compatibility reasons. 2L, 4L VDDA VDD Analog Power Supply to PLL. 2K, 4K VSSA GND Analog Ground to PLL. 11B, 11Y, 13D, 15Y, 1C, 1V, 20K, 3L, 4D, 4U, 5C, 5V, 8V VDDD VDD Digital Power Supply. Page 32 VITESSE SEMICONDUCTOR CORPORATION 741 Calle Plano, Camarillo, CA 93012 • 805/388-3700 • FAX: 805/987-5896 G52325-0, Rev. 3.0 6/14/00 VITESSE SEMICONDUCTOR CORPORATION Preliminary Datasheet VSC7217 Multi-Gigabit Interconnect Chip Pin Name 11A, 13C, 13U, 19L, 3C, 3K, 3V, 4C, 4E, 4T, 4V, 6V, 7A, 7C, 8W VSSD GND Digital Ground. 14B, 14W, 17B, 17D, 17H, 17P, 17U, 17W, 18L, 19B, 19E, 19G, 19J, 19N, 19T, 19W VDDT VDD TTL Output Power Supply. 14C, 14V, 16B, 16W, 18C, 18F, 18J, 18M, 18R, 18V, 19A, 19Y, 20D, 20G, 20N, 20T VSST GND TTL Output Ground. 2P 3R 3M 1P 3J 1G 2G 3F VDDPA VDDRA VDDPB VDDRB VDDPC VDDRC VDDPD VDDRD VDD PECL Output Power Supply for PTXA. PECL Output Power Supply for RTXA. PECL Output Power Supply for PTXB. PECL Output Power Supply for RTXB. PECL Output Power Supply for PTXC. PECL Output Power Supply for RTXC. PECL Output Power Supply for PTXD. PECL Output Power Supply for RTXD. If use of an output is not necessary, leave the power supply pin open. G52325-0, Rev. 3.0 6/14/00 I/O Type Pin Description VITESSE SEMICONDUCTOR CORPORATION 741 Calle Plano, Camarillo, CA 93012 • 805/388-3700 • FAX: 805/987-5896 Page 33 VITESSE SEMICONDUCTOR CORPORATION Preliminary Datasheet VSC7217 Mutli-Gigabit Interconnect Chip Package Thermal Considerations The VSC7217 is packaged in a 256-pin, 27mm, thermally enhanced BGA in a 20x20 array which offers excellent electrical characteristics, good thermal performance and small size. This package uses an industrystandard footprint. The package construction is shown in Figure 22. Figure 22: Package Cross Section Adhesive Copper Heat Spreader Die Attach Epoxy Polyimide Dielectric Encapsulant Die Wirebond Eutectic Solder Balls Table 18: Thermal Resistance Symbol Description Value Units θca Thermal resistance from case-to-ambient in still air including conduction through the leads. 15 oC/W θca-100 Thermal resistance from case-to-ambient with 100 LFM airflow 13 oC/W θca-200 Thermal resistance from case-to-ambient with200 LFM airflow 12 oC/W θca-400 Thermal resistance from case-to-ambient with 400 LFM airflow 10.5 oC/W θca-600 Thermal resistance from case-to-ambient with 600 LFM airflow 10 oC/W The VSC7217 is designed to operate with a case temperature up to 95oC. The user must guarantee that this case temperature specification is not violated. With the Thermal Resistances listed in Table 18, the VSC7217 can operate in still air ambient temperatures of 50oC [ 50oC = 95oC - ( 3.0W * 15oC/W ) ]. If the ambient air temperature exceeds these limits, some form of cooling through a heat sink or an increase in airflow must be provided. Moisture Sensitivity Level This device is rated at with a Moisture Sensitivity Level 3 rating. Refer to Application Note AN-20 for appropriate handling procedures. Page 34 VITESSE SEMICONDUCTOR CORPORATION 741 Calle Plano, Camarillo, CA 93012 • 805/388-3700 • FAX: 805/987-5896 G52325-0, Rev. 3.0 6/14/00 VITESSE SEMICONDUCTOR CORPORATION Preliminary Datasheet VSC7217 Multi-Gigabit Interconnect Chip Package Information 256-pin BGA 1.27 Typ A B C D E F G H J K L M N P R T U V W Y 27.0 20 19 18 17 16 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 Pin A1 Indicator TOP VIEW 27.0 BOTTOM VIEW 1.40 Typ G52325-0, Rev. 3.0 6/14/00 VITESSE SEMICONDUCTOR CORPORATION 741 Calle Plano, Camarillo, CA 93012 • 805/388-3700 • FAX: 805/987-5896 Page 35 VITESSE SEMICONDUCTOR CORPORATION Preliminary Datasheet VSC7217 Mutli-Gigabit Interconnect Chip Ordering Information The part number for this product is formed by a combination of the device number and the package style: VSC7217 xx Device Type Multi-Gigabit Interconnect Chip Package UC: 256-Pin, 27mm BGA Marking Information The package is marked with three lines of text as shown: Pin 1 Identifier { { ####AAAA { Date Code { VSC7217UC Part Number VITESSE Package Suffix Lot Tracking Code Notice This document contains information about a new product during its fabrication or sampling phase of development. The information in this document is based on design targets, simulation results or early prototype test results. Characteristic data and other specifications are subject to change without notice. Therefore the reader is cautioned to confirm that this data sheet is current prior to design or order placement. Warning Vitesse Semiconductor Corporation’s products are not intended for use in life support appliances, devices or systems. Use of a Vitesse product in such applications without the written consent is prohibited. Page 36 VITESSE SEMICONDUCTOR CORPORATION 741 Calle Plano, Camarillo, CA 93012 • 805/388-3700 • FAX: 805/987-5896 G52325-0, Rev. 3.0 6/14/00