VITESSE VSC7217

VITESSE
SEMICONDUCTOR CORPORATION
Preliminary Datasheet
VSC7217
Multi-Gigabit Interconnect Chip
Features
• 4 ANSI X3T11 Fibre Channel and IEEE
802.3z Gigabit Ethernet Compliant Transceivers
• Compatible with VSC7211/7212/7214
• Fast-Locking CRU: 100-Bit Clock Periods
• Over 8 Gb/s Duplex Raw Data Rate
• Received Data Aligned to Local REFCLK or to
Recovered Clock
• Redundant PECL Tx Outputs and Rx Inputs
• PECL Rx Signal Detect and Cable Equalization
• 8B/10B Encoder/Decoder per Channel,
Optional Encoder/Decoder Bypass Operation
• Per-Channel Serial Tx-to-Rx and Parallel Rx-toTx Internal Loopback Modes
• “ASIC-FriendlyTM” Timing Options for
Transmitter Parallel Input Data
• Clock Multiplier Generates Baud Rate Clock
• Elastic Buffers for Intra/Inter-Chip Cable
Deskewing and Channel-to-Channel Alignment
• Tx/Rx Rate Matching via IDLE Insertion/
Deletion
• Automatic Lock-to-Reference
• JTAG Boundary Scan Support for TTL I/O
• Built-In Self Test
• 3.3V Supply, 3.0W Typ, 3.5W Max.
• 256-pin, 27mm BGA Package
VSC7217 Block Diagram
TRANSMITTER
PTXEND
TD(7:0)
C/DD
WSEND
8
8
8B/10B 10
Encode
D Q
RECEIVER
LBEND(1:0)
RXP/RD
LBTXD
PTXD+
PTXDRTXD+
RTXD-
RTXEND
PTXENC
TC(7:0)
C/DC
WSENC
8
8
8B/10B 10
Encode
D Q
LBENC(1:0)
RXP/RC
LBTXC
PTXC+
PTXCRTXC+
RTXC-
RTXENC
PTXENB
TB(7:0)
C/DB
WSENB
8
8
8B/10B 10
Encode
D Q
TA(7:0)
C/DA
WSENA
8
8
8B/10B 10
Encode
D Q
KCHAR
4
TBCA
TBCB
TBCC
TBCD
DUAL
PTXB+
PTXBRTXB+
RTXB-
PRXB+
PRXBRRXB+
RRXB-
Clk/Data
Recovery
8B/10B
Decode
10
8B/10B
Decode
8
3
8
Elastic
Buffer
PSDETD
RSDETD
Clk/Data
Recovery
8
3
8
Elastic
Buffer
Clk/Data
Recovery
LBENA(1:0)
RXP/RA
PTXA+
PTXARTXA+
RTXA-
PRXA+
PRXARRXA+
RRXA-
Clk/Data
Recovery
PSDETA
RSDETA
RTXENA
RC7:0)
IDLEC
KCHC
ERRC
RCLKC
RCLKCN
PSDETC
RSDETC
10
8B/10B
Decode
8
3
8
Elastic
Buffer
RB(7:0)
IDLEB
KCHB
ERRB
RCLKB
RCLKBN
PSDETB
RSDETB
LBTXA
RD(7:0)
IDLED
KCHD
ERRD
RCLKD
RCLKDN
10
8B/10B
Decode
8
3
8
Elastic
Buffer
RA(7:0)
IDLEA
KCHA
ERRD
RCLKA
RCLKAN
WSI
FLOCK
Channel
Align
WSO
Tx Clock
x20/x10
Clock Gen
REFCLKP
REFCLKN
G52325-0, Rev. 3.0
6/14/00
PRXC+
PRXCRRXC+
RRXCLBENB(1:0)
RXP/RB
LBTXB
RTXENB
PTXENA
PRXD+
PRXDRRXD+
RRXD-
10
CAP0 CAP1
REFCLK
TBERRA
TBERRB
TBERRC
TBERRD
TMODE(2:0)
RMODE(1:0)
RESETN
ENDEC
BIST
TRSTN
TMS
TDI
TCK
JTAG
Boundary
Scan
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TDO
Page 1
VITESSE
SEMICONDUCTOR CORPORATION
Preliminary Datasheet
VSC7217
Mutli-Gigabit Interconnect Chip
General Description
The VSC7217 is a quad 8-bit parallel-to-serial and serial-to-parallel transceiver chip used for high bandwidth interconnection between busses, backplanes, or other subsystems. Four Fibre Channel and Gigabit Ethernet compliant transceivers provide up to 8.32Gb/s of duplex raw data transfer. Each channel can be operated at
a maximum data transfer rate of 1088Mb/s (8 bits at 136MHz) or a minimum rate of 784Mb/s (8 bits at
98MHz). For the entire chip in duplex mode, the aggregate transfer rate is between 6.3Gb/s and 8.7Gb/s. The
VSC7217 contains four 8B/10B encoders, serializers, de-serializers, 8B/10B decoders and elastic buffers which
provide the user with a simple interface for transferring data serially and recovering it on the receive side. The
device can also be configured to operate as four non-encoded 10-bit transceivers.
Notation
In this document, each of the four channels are identified as channel A, B, C or D. When discussing a signal
on any specific channel, the signal will have the channel letter embedded in the name: TA(7:0). When referring
to the common behavior of a signal which is used on each of the four channels, a lower case “n” is used in the
signal name: Tn(7:0). Differential signals, such as PTXA+ and PTXA-, may be referred to as a single signal,
PTXA, by dropping reference to the “+” and “-”. REFCLK refers either to the PECL/TTL input pair REFCLKP/REFCLKN, which can be differential PECL (using both REFCLKP and REFCLKN) or single-ended
TTL (using REFCLKP and leaving REFCLKN open).
Clock Synthesizer
Depending on the state of the DUAL input, the VSC7217 clock synthesizer multiplies the reference frequency provided on the REFCLK input by 10 (DUAL is LOW) or 20 (DUAL is HIGH) to achieve a baud rate
clock between 0.98GHz and 1.36 GHz. The on-chip Phase Lock Loop (PLL) uses a single external 0.1µF
capacitor, connected between CAP0 and CAP1, to control the Loop Filter. This capacitor should be a multilayer
ceramic dielectric, or better, with at least a 5V working voltage rating and a good temperature coefficient. NPO
is preferred but X7R may be acceptable. These capacitors are used to minimize the impact of common mode
noise on the Clock Multiplier Unit, especially power supply noise. Higher value capacitors provide better
robustness in systems. NPO is preferred because if an X7R capacitor is used, the power supply noise sensitivity
will vary with temperature. For best noise immunity, the designer may use a three capacitor circuit with one differential capacitor between CAP0 and CAP1, C1, a capacitor from CAP0 to ground, C2, and a capacitor from
CAP1 to ground, C3 (Figure 1). Larger values are better but 0.1µF is adequate. However, if the designer cannot
use a three capacitor circuit, a single differential capacitor, C1, is adequate. These components should be isolated from noisy traces.
Figure 1: Loop Filter Capacitors (Best Circuit)
CAP0
VSC7217
CAP1
C2
C1
C3
C1=C2=C3= >0.1uF
MultiLayer Ceramic
Surface Mount
NPO (Prefered) or X7R
5V Working Voltage Rating
The REFCLK signal can be either single-ended TTL or differential LVPECL. If TTL, connect the TTL
input to REFCLKP but leave REFCLKN open. If LVPECL, connect the inputs to REFCLKP and REFCLKN. Internal biasing resistors sets the proper DC Level to VDD/2.
Page 2
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VITESSE
SEMICONDUCTOR CORPORATION
Preliminary Datasheet
VSC7217
Multi-Gigabit Interconnect Chip
Transmitter Functional Description
Transmitter Data Bus
Each VSC7217 transmit channel has an 8-bit input transmit data character, Tn(7:0), and two control inputs,
C/Dn and WSENn. The C/Dn input determines whether a normal data character or a special “K-character” is
transmitted, and the WSENn input initiates transmission of a 16-character “Word Sync Sequence” used to align
the receive channels. These data and control inputs are clocked either on the rising edge of REFCLK, on the
rising edge of TBCn, or within the data eye formed by TBCn. When not using REFCLK, each channel uses
either its own TBCn input, or the TBCA input. The transmit interface mode is controlled by TMODE(2:0), as
shown in Table 1.
When used, the TBCn inputs must be frequency locked to REFCLK. No phase relationship is assumed. A
small skew buffer is provided to tolerate phase drift between TBCn and REFCLK. This buffer is recentered by
the RESETN input, and the total phase drift after recentering must be limited to ±180° (where 360° is one character time). Each channel has an error output, TBERRn, that is asserted HIGH to indicate that the phase drift
between TBCn and REFCLK has accumulated to the point that the elastic limit of the skew buffer has been
exceeded and a transmit data character has been either dropped or duplicated. This error can not occur when
input timing is referenced to REFCLK. The TBERRn output timing is identical to the low-speed receiver outputs, as selected by RMODE(1:0) in Table 5.
Table 1: Transmit Interface Input Timing Mode
TMODE(2:0)
Input Timing Reference
000
REFCLK Rising Edge
001
010
011
Reserved
100
TBCA Rising Edge
101
TBCn Rising Edge
110
TBCA Data Eye
111
TBCn Data Eye
The following figures show the possible relationships between data and control inputs and the selected
input timing source. Figure 2 shows how REFCLK is used as an input timing reference. This mode of operation is used in the VSC7211 and VSC7214. Figure 3 and Figure 4 show how TBCn is used as an input timing
reference. When TBCn is used to define a data eye (see Figure 4), it functions as an additional data input that
simply toggles every cycle.
Note that the REFCLK and TBCn inputs are not used directly to clock the input data. Instead, an internal
PLL generates edges aligned with the appropriate clock. The arrows on the rising edges of these signals define
the reference edge for the internal phase detection logic. An internal clock is generated at 1/10 the serial trans-
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VITESSE
SEMICONDUCTOR CORPORATION
Preliminary Datasheet
VSC7217
Mutli-Gigabit Interconnect Chip
mit data rate that is locked to the selected input timing source. This is an especially important when DUAL is
HIGH and input timing is referenced to REFCLK, since the falling edge is NOT used. The internal clock active
edges are placed coincident with the REFCLK rising edges and halfway between the REFCLK rising edges in
this mode.
A similar situation exists when TBCn is used to define a data eye. Only the rising edges of TBCn are used
to define the external data timing. The internal clock active edges are placed at 90° and 270° points between
consecutive TBCn rising edges (which are assumed to be 360° apart).
Figure 2: Transmit Timing, TMODE(2:0) = 000
REFCLK
(DUAL = 0)
REFCLK
(DUAL = 1)
Tn(7:0)
C/Dn
WSENn
Valid
Valid
Valid
Figure 3: Transmit Timing, TMODE(2:0) = 10X
TBCA
or
TBCn
Tn(7:0)
C/Dn
WSENn
Valid
Valid
Valid
Figure 4: Transmit Timing, TMODE(2:0) = 11X (“ASIC-Friendly” Timing
0o
90o
180o
270o
360o
TBCA or TBCn
Tn(7:0)
C/Dn
WSENn
Page 4
Valid
Valid
Valid
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SEMICONDUCTOR CORPORATION
Preliminary Datasheet
VSC7217
Multi-Gigabit Interconnect Chip
8B/10B Encoder
Each channel contains an 8B/10B encoder which translates the 8-bit input data on Tn(7:0) into a 10-bit
encoded data character. C/Dn inputs are also provided in each channel which, along with KCHAR, allow the
transmission of special Fibre Channel Kxx.x characters (see Table 2). Note that KCHAR is a static input, and
does NOT have the same input timing as Tn(7:0), C/Dn and WSENn. Normally, C/Dn is LOW in order to
transmit data. If C/Dn is HIGH and KCHAR is LOW, a Fibre Channel defined IDLE Character (K28.5 =
‘0011111010’ or ‘1100000101’ depending on disparity) is transmitted and Tn(7:0) is ignored. If C/Dn is HIGH
and KCHAR is HIGH, a Kxx.x character is transmitted as determined by the data pattern on Tn(7:0). See
Table 3. Data patterns other than those defined in Table 3 produce undefined 10B encodings.
Table 2: Transmit Data Controls
WSENn
C/Dn
KCHAR
Encoded 10-bit Output
0
0
X
Data Character
0
1
0
IDLE Character (K28.5)
0
1
1
Special Kxx.x Character
1
X
X
16-Character Word Sync Sequence
Table 3: Special Characters (Selected when C/Dn and KCHAR are HIGH)
Code
Tn(7:0)
Comment
Code
Tn(7:0)
Comment
K28.0
000 11100
User Defined
K28.5-
101 01101
User Defined
K28.1
001 11100
User Defined
K28.6
110 11100
User Defined
K28.2
010 11100
User Defined
K28.7
111 11100
Test Only
K28.3
011 11100
User Defined
K23.7
111 10111
User Defined
K28.4
100 11100
User Defined
K27.7
111 11011
User Defined
K28.5
101 11100
IDLE
K29.7
111 11101
User Defined
K28.5+
101 01100
User Defined
K30.7
111 11110
User Defined
Encoder Bypass Mode
When ENDEC is LOW, the 8B/10B encoders are bypassed and a 10-bit input character Tn(7:0) is serialized directly in each channel, with bit Tn0 transmitted first. The C/Dn input becomes Tn8 and WSENn
becomes Tn9. The KCHAR input becomes ENCDET which is not used in the transmitter but, when HIGH,
enables Comma detection in all four receivers. Refer to the “Decoder Bypass Mode” section for a description of
this mode of operation in the receiver. The latency through the transmitter is reduced by one character time
when ENDEC is LOW. This mode of operation is similar to a 10-bit interface commonly found in serializer/
deserializers for the Fibre Channel (VSC7125) and Gigabit Ethernet (VSC7135) markets.
Word Sync Generation
The VSC7217 can perform channel alignment (also referred to as “word alignment” or “word sync”). In
other words, the four receive data output streams are aligned such that the same 4-byte word presented to the
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VITESSE
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Preliminary Datasheet
VSC7217
Mutli-Gigabit Interconnect Chip
four transmit channel inputs for serialization will be transferred on the receive channel parallel outputs. The
Word Sync Sequence provides a unique synchronization point in the serial data stream that is used to align the
receive channels. This sequence consists of 16 consecutive K28.5 IDLE characters with disparity reversals on
the second and fourth characters. The Word Sync Sequence is sent either as “I+ I+ I- I- I+ I- I+ I- I+ I- I+ I- I+
I- I+ I-” or as “I- I- I+ I+ I- I+ I- I+ I- I+ I- I+ I- I+ I- I+”, depending on the transmitter’s running disparity at the
time the first IDLE character is serialized.
Transmission of the Word Sync Sequence is initiated independently in each channel when the WSENn
input is asserted HIGH for one character time (see Figure 5). When WSENn is HIGH, the C/Dn and Tn(7:0)
inputs are ignored. The WSENn, C/Dn and Tn(7:0) inputs are also ignored for the subsequent 15 character
times. In Figure 5 below, the Word Sync Sequence is initiated in cycle W1 and transmitted through cycle W16.
Normal data transmission (or the transmission of another Word Sync Sequence) resumes in cycle D3. Figure 5
is drawn assuming that input timing is referenced to REFCLK (e.g., TMODE(2:0)=000) with the DUAL input
LOW. As long as WSENn remains asserted, another Word Sync Sequence will be generated.
Figure 5: Word Sync Sequence Generation
D1
D2
W1
W2
W3
W4
W5
W6
W7
W8
W9
W10
W11
W12
W13
W14
W15
W16
XX
XX
XX
XX
XX
XX
XX
XX
XX
XX
XX
XX
XX
XX
XX
XX
D3
D4
REFCLK
WSENn
C/Dn
Tn(7:0)
TXn+/-
0x01 0x02
D1.0+
0x03 0x04
D2.0+ K28.5+ K28.5+ K28.5- K28.5- K28.5+ K28.5- K28.5+ K28.5- K28.5+ K28.5- K28.5+ K28.5- K28.5+ K28.5- K28.5+ K28.5- D3.0+
D4.0-
Serializer
The 10-bit output from the encoder (or from the encoder input register if ENDEC is LOW) is fed into a
multiplexer which serializes the parallel data using the synthesized transmit clock. The least significant bit of
the 10B data is transmitted first. Each channel has both primary and redundant serial output ports, PTXn and
RTXn, respectively, which consists of differential PECL output buffers operating at either 10 or 20 times the
REFCLK rate. The primary and redundant transmitter outputs are controllable separately on each channel. The
primary PECL outputs (PTXn) are enabled when the PTXENn input is HIGH, and the redundant PECL outputs
(RTXn) are enabled when the RTXENn input is HIGH. When a PECL output is disabled, the associated output
buffers do not consume power and the attached pins are undriven.
Receiver Functional Description
Serial Data Source
Each receive channel has both primary (PTXn) and redundant (RRXn) serial input ports, which consists of
differential PECL input buffers. Each channel also has a control input, RXP/Rn, used to select either the pri-
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Preliminary Datasheet
VSC7217
Multi-Gigabit Interconnect Chip
mary or redundant serial input as the data source for that channel. When RXP/RC is HIGH, the C channel serial
data source is PRXC. When LBENn(1:0)=10, the channel’s transmitter is looped back and becomes the serial
data source regardless of the state of RXP/Rn (see Table 4).
Table 4: Serial Data Source Selection
LBENn(1:0)
RXP/Rn
Serial Data Source
≠10
0
RRXn
≠10
1
PRXn
X
LBTXn
Loopback fromTransmitters
=10
Signal Detection
Each channel’s primary and redundant PECL input buffers have an associated signal detect output,
PSDETn and RSDETn. All eight outputs are available for continuous monitoring of both the selected and nonselected input. Each signal detect output is asserted HIGH when transitions are detected on the associated PECL
input and the signal amplitude exceeds 200 mV. A LOW indicates that either no transitions are detected or the
signal amplitude is below 100mV. The signal detect outputs are considered undefined when the signal amplitude is in the 100mV to 200 mV range. The signal detect circuitry behaves like a re-triggerable one shot that is
triggered by signal transitions, and whose time-out interval ranges from 40 to 80 bit times. The transition density is not checked to ensure that it corresponds to a valid Fibre Channel data stream. The PSDETn and
RSDETn output timing is identical to the low-speed receiver outputs, as selected by RMODE(1:0) in Table 5.
Receiver Equalization
Incoming data on the PRX/RRX inputs typically contains a substantial amount of Inter Symbol Interference (ISI) or deterministic jitter which reduces the ability of the receiver to recover data without errors. An
equalizer has been added to each of the receiver’s input buffers in order to compensate for this deterministic jitter. This circuit has been designed to effectively reduce the ISI commonly found in copper cables or backplane
traces due to low frequencies traveling faster than high frequencies as a result of the skin effect. The equalizer
boosts high-frequency edge response in order to reduce the adverse effects of ISI.
Clock and Data Recovery
At the receiver, each channel contains an independent Clock Recovery Unit (CRU) that accepts the selected
serial input source, extracts the high-speed clock and retimes the data. Each CRU automatically locks on data
and if the data is not present, will automatically lock to the REFCLK. This maintains a very well-behaved
recovered clock (RCLKn/RCLKNn) which does not contain any slivers and will operate at a frequency of the
REFCLK reference ±200 ppm. The use of an external Lock-to-Reference pin is not needed.
The Clock Recovery Unit must perform bit synchronization which occurs when the CRU locks onto and
properly samples the incoming serial data as described in the previous paragraph. When the CRU is not locked
onto the serial data, the 10-bit data out of the decoder is invalid which results in numerous 8B/10B decoding
errors or disparity errors. When the link is disturbed (the cable is disconnected or the serial data source is
switched), the CRU will require a certain amount of time to lock onto data which is specified in the AC timing
specifications for “Data Acquisition Lock Time.”
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Preliminary Datasheet
Mutli-Gigabit Interconnect Chip
VSC7217
Deserializer and Character Alignment
The retimed serial data stream is converted into 10-bit characters by the deserializer. A special 7-bit
“Comma” pattern (‘0011111xxx’ or ‘1100000xxx’) is recognized by the receiver and allows it to identify the
10-bit character boundary. Note that this pattern is found in three special characters: K28.1, K28.5 and K28.7.
However, K28.5 is chosen as the unique IDLE character. Only K28.1 and K28.5 should be used in normal operation. The K28.7 character should be reserved for test and characterization use.
Character alignment occurs when the deserializer synchronizes the 10-bit character framing boundary to a
“Comma” pattern in the incoming serial data stream. If the receiver identifies a “Comma” pattern in the incoming data stream, which is misaligned to the current framing boundary, the receiver will re-synchronize the
recovered data in order to align the data to the new “Comma” pattern. Re-synchronization ensures that the
“Comma” character is output on the internal 10-bit bus so that bits 0 through 9 equal ‘0011111xxx’ or
‘1100000xxx’. If the “Comma” pattern is aligned with the current framing boundary, re-synchronization will
not change the current alignment. Re-synchronization is always enabled and cannot be turned off when
ENDEC is HIGH. After character re-synchronization the VSC7217 ensures that within a link, the 8-bit data
sent to the transmitting VSC7217 will be recovered by the receiving VSC7217 in the same bit locations as the
transmitter (e.g., Tn(7:0) = Rn(7:0)). When ENDEC is LOW, “Comma” detection and alignment are enabled
only if KCHAR is HIGH.
10B/8B Decoder
The 10-bit character from the deserializer is decoded in the 10B/8B decoder, which outputs the 8B data
byte and three bits of status information. If the 10-bit character does not match any valid value, an Out-of-Band
Error is generated which is output on the receiver status bus. Similarly, if the running disparity of the character
does not match the expected value, a Disparity Error is generated. The decoder also reports when a K-character
is received, and distinguishes the K28.5 (IDLE) character from other K-characters. This status information is
combined with LOS State Machine status and FIFO error status, to produce the prioritized per-character link
status output information (see Table 7).
Elastic Buffer and Channel Deskewing
An elastic buffer is included in each of the four receive channels. Decoded data and status information is
written into these buffers on each channel’s recovered clock, and is read on the selected output clock. In addition to allowing decoded data to easily cross from a channel’s recovered clock domain to its output clock
domain, the elastic buffers facilitate channel alignment (the reconstruction of a multi-byte word as presented to
the transmitting devices). In addition, the buffers facilitate rate matching via IDLE character insertion/deletion
when the channel’s recovered clock is not frequency locked to its output clock.
There are three conditions under which a receive channel’s elastic buffer is recentered: (1) the RESETN
input, when asserted, recenters the read/write pointers in each elasticity buffer, (2) whenever a Comma character is received which changes the receive character’s framing boundary, and (3) whenever the receiver detects
the synchronization point in the Word Sync Sequence. All three of these events are associated with chip initialization or link initialization and will not occur during normal data transfer. Note: recentering can result in the
loss or duplication of decoded character data and status information.
When a condition change transmit timing (phase shifts in TBC) or shifts phase/alignment into the receiver,
the user should initial a Word Sync Event to recenter all elasticity buffers. Otherwise, data corruption could
occur.
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Preliminary Datasheet
VSC7217
Multi-Gigabit Interconnect Chip
The VSC7217 presents recovered data on Rn(7:0) and status on IDLEn, KCHn and ERRn. These outputs
are timed either to each channel’s own recovered clock (RCLKn/RCLKNn), to Channel A’s recovered clock
(RCLKA/RCLKNA), or to REFCLK. The output timing reference is selected by RMODE(1:0) (see Table 5).
The transmitter input skew buffer error outputs TBERRn and the analog signal detect outputs PSDETn and
RSDETn are also synchronized to the selected output timing reference. There are two choices for REFCLKbased timing, which differ in the positioning of the data valid window associated with the output signals timed
to REFCLK. When RMODE(1:0)=00, REFCLK is approximately centered in the output data valid window
as in the VSC7214. When RMODE(1:0)=01, REFCLK slightly leads the data valid window so that output
data appears to have a more typical “Clock-to-Q” timing relationship to REFCLK.
Table 5: Receive Interface Output Timing Mode
RMODE(1:0)
Output Timing Reference
00
REFCLK (Centered)
01
REFCLK (Leading)
1 0
RCLKA/RCLKNA
1 1
RCLKn/RCLKNn
The term “word clock” is used for whichever clock ( REFCLK, RCLKA/RCLKNA or RCLKn/
RCLKNn) is selected as the output timing reference. If RMODE(1) is HIGH, each channels’ RCLKn/
RCLKNn outputs are complementary outputs at 1/10th or 1/20th the baud rate of the incoming data depending
upon DUAL. When RCLKA/RCLKNA is selected as the output timing reference, Channel B, C and D
RCLKn/RCLKNn outputs are copies of RCLKA/RCLKNA. If RMODE(1) is LOW, each channels’
RCLKn/RCLKNn outputs are held in a LOW/HIGH state, respectively, and the data and status outputs are
timed to REFCLK. If DUAL is HIGH, all data at the four output ports are synchronously clocked out on both
positive and negative edges of the selected word clock at 1/20th the baud rate. If DUAL is LOW, the data is
clocked out of the VSC7217 only on the rising edge of the selected word clock at 1/10th the baud rate. Timing
waveforms for the output data and status are shown in Figure 6, Figure 7 and Figure 8.
Figure 6: Receive Timing, RMODE(1:0) = 00
REFCLK
(DUAL = 0)
REFCLK
(DUAL = 1)
Rn(7:0)
IDLEn
KCHn
ERRn
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Valid
Valid
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Preliminary Datasheet
VSC7217
Mutli-Gigabit Interconnect Chip
Figure 7: Receive Timing, RMODE(1:0) = 01
REFCLK
(DUAL = 0)
REFCLK
(DUAL = 1)
Rn(7:0)
IDLEn
KCHn
ERRn
Valid
Valid
Valid
Figure 8: Receive Timing, RMODE(1:0) = 1X
RCLKn
(DUAL = 0)
RCLKn
(DUAL = 1)
Rn(7:0)
IDLEn
KCHn
ERRn
Valid
Valid
Valid
The data coming from the decoder is clocked into the elastic buffer by the recovered clock from the channel’s CRU. The data is clocked out of the elastic buffers with word clock. If the transmitting device’s REFCLK
is not precisely frequency locked to a receive channel’s word clock, then the channel’s elastic buffer will tend to
gradually fill or empty as the recovered clock (which is by definition frequency locked to the transmitter’s
REFCLK) steadily drifts in phase relative to the word clock.
To accommodate frequency differences between a transmitter’s REFCLK and the word clock, the
VSC7217 can automatically perform rate matching by either deleting or duplicating IDLE characters. The
FLOCK input must be LOW to enable rate matching which, based on how the WSI input is connected, can
either be performed in each channel individually or can be performed in parallel across a group of channels that
are word-aligned. This is discussed in detail in the following section describing Word Alignment. The user
must ensure that the frequency at which IDLEs are simultaneously transmitted on each channel accommodates
the frequency differences, if any, in their system architecture. Not meeting the IDLE density requirements could
result in Underrun/Overrun Errors.
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VSC7217
Multi-Gigabit Interconnect Chip
The elastic buffer is designed to allow a maximum phase drift of +2 or -2 serial clock bit times between resynchronizations, which sets a limit on the maximum data “packet” length allowed between IDLEs. This maximum packet length depends on the frequency difference between the transmitting and receiving devices REFCLKs. Let ∆φ represent phase drift in bit times, and let 2π represent one full 10-bit character of phase drift.
Limiting phase drift to two bit times means the following inequality must be satisfied:
(1)
∆φ ≤ ( 0.2 × 2π )
Let L be the number of 10-bit characters transmitted, and let ∆f be the frequency offset in ppm. The total
phase drift in bit times is given by:
(2)
6
∆φ = ( ∆f ⁄ 10 ) × 2π L
A simple expression for maximum packet length as a function of frequency offset is derived by substituting
Equation (2) in Equation (1) and solving for L:
(3)
6
L ≤ ( 0.2 × 10 ) ⁄ ∆f
As an example, if the frequency offset is 200 ppm, the maximum packet length should not be more than 1K
bytes. To increase the maximum packet length L, decrease the frequency offset ∆f. Please note that if only on
K28.5 is transmitted between “packets” of data, it might be dropped during compensation for phase drift. If the
user must have at least one K28.5 between these two packets, then two K28.5s must be transmitted.
Word Alignment
The VSC7217 performs channel-to-channel word alignment. In this mode of operation, if the data from all
four channels on the transmitting VSC7217 (the 4 Tn(7:0) busses) is viewed as a 32-bit word, then the receiving VSC7217 will recover an identical word. For example, if a transmit pattern was ‘ABCD’, ‘EFGH’, ‘IJKL’,
etc., the receiver should not recover data words as ‘ABGD’, ‘EFKH’, ‘IJOL’, etc. This requires the four transmit channels to obtain input data on a common clock (TMODE(2:0)=000 or 1X0) and the four receive channels
to present output data on a common word clock (RMODE(1:0)=0X or 10).
There are elastic buffers within the receiver used to deskew the four channels and align them to a common
word clock. An elastic buffer allows the channels’ input to be skewed up to ±6 bit times (12 bit times total skew
between any two channels) to accommodate circuit imperfections, differences in transmission delay and jitter.
Multiple VSC7217 devices can also be used in synchronous operation if the skew between all serial input pairs
is maintained less than ±6 serial clock bit times. This allows easy implementation of robust systems and is discussed in greater detail in the Using Multiple VSC7217s in Parallel section.
In order to perform word alignment, a synchronization point must be seen across all aligned receive channels within the ±6 bit time window. The VSC7217 receiver recognizes the first four characters of the Word
Sync Sequence (either K28.5+ K28.5+ K28.5- K28.5- or K28.5- K28.5- K28.5+ K28.5+) as the synchronization
point. As a model for understanding, consider the case where a VSC7217 transmitter sends 32 bits of data to the
receiver via copper media, which has small cable length differences, causing a channel-to-channel skew. All
transmit channels that are to be word-aligned transmit the Word Sync Sequence in parallel. On detection of the
synchronization point, the receivers will reposition the recovered data within their elastic buffers in order to
align all four channels and remove any channel-to-channel skew. All normal data characters following the
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Preliminary Datasheet
VSC7217
Mutli-Gigabit Interconnect Chip
Word Sync Sequence will be properly word-aligned. In the process of channel alignment, one or two of the final
twelve K28.5 characters in the Word Sync Sequence may be deleted or duplicated. This ensures that each transmitted 32-bit word is recovered correctly.
The VSC7217 is capable of performing rate matching in word-aligned applications by inserting or deleting
IDLEs in parallel across the aligned receive channels. This requires that the word-aligned data streams contain
IDLEs inserted in parallel on all transmit channels (e.g., an IDLE “word”) according to the IDLE density
requirement previously described.
Word alignment is enabled by connecting the WSI input to a WSO output, either from the same device if a
single device is used, or from another device if multiple devices are used in parallel to align more than four
channels. The FLOCK input state and WSI input source determine whether or not rate matching (IDLE deletion or duplication) will be performed, and whether it is done independently on each channel or in parallel
across aligned channels. Word alignment is disabled when WSI is not connected to a WSO output. Rate matching is disabled when either FLOCK is HIGH or WSI is held LOW (see Table 6).
Table 6: Word Alignment and Rate Matching Control
FLOCK
WSI Source
Word Alignment
Rate Matching
0
0
Off
Off
0
1
Off
Enabled, Independent Channels
0
WSO
Enabled
Enabled, Aligned Channels
1
0
Off
Off
1
1
Off
Off
1
WSO
Enabled
Off
There are four distinct modes of operation defined in Table 6. The first row disables both word alignment
and rate matching. (The fourth and fifth row configurations function identically to the first row.) The second
row configures the channels to operate independently with rate matching. Word alignment is disabled, and
IDLEs will be dropped/duplicated independently in each channel as required. The third row configures the part
to perform word alignment and rate matching. The receive channels will be aligned per the device driving
WSO, and IDLE words will be dropped/duplicated across the aligned channels as required. The last row configures the part to perform word alignment and disables rate matching. This mode of operation is appropriate for a
frequency-locked application where it desired to align the receive channels without altering the received data
streams.
Using Multiple VSC7217s in Parallel
Multiple VSC7217s can be used in parallel to form wider bus widths. In order for word alignment to function correctly across multiple devices, each transmit channel’s input data must be transmitted on a common
clock, and each receive channel’s output data must also be aligned to a common word clock. This requires that
all transmitting devices use either the same or identical REFCLKs, and that TMODE(2:0)=000 (inputs timed
to REFCLK) or TMODE(2:0)=1X0 (inputs timed to TBCA). If inputs are timed to TBCA, then all transmitting devices must use either the same or identical TBCAs. Since all receive channels must use a common word
clock, the receiving devices must also use the same or identical REFCLKs and it must be selected as the word
clock for all receive channels (RMODE(1:0)=0X).
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Multi-Gigabit Interconnect Chip
If the transmitting devices’ REFCLKs are not frequency locked to the receiving devices’ REFCLKs,
IDLEs will have to be added to or dropped from all the channels at the same time. In order to implement this,
one VSC7217 is arbitrarily chosen as the “Master” and its WSO output is driven to the WSI inputs of all the
receiving VSC7217s, including itself. WSO is asserted prior to the VSC7217 adding/dropping IDLEs so all the
VSC7217s will operate simultaneously. WSO uses a simple 3-bit serial protocol, synchronous to the Master
channel’s word clock, for indicating the required synchronization action to other VSC7217s. A steady LOW
level indicates no action is required. ‘101’ indicates that Master Channel A has seen a Word Sync Event. The
relative timing relationship between receiving a Word Sync Event (on all channels together) and seeing ‘101’
on the WSI input in the other channels allows these channels to word-synchronize with Master Channel A.
‘110’ indicates that the next IDLE encountered in the receive data stream should be deleted. ‘111’ indicates that
an IDLE should be inserted after the next IDLE encountered in the receive data stream. Note that the arbitrarily
chosen Master Channel A must be an active channel.
Decoder Bypass Mode
If ENDEC is LOW, the 8B/10B decoder is bypassed and a 10-bit received character Rn(9:0) is output from
each receive channel. The KCHn output becomes Rn8, and ERRn becomes Rn9. Character alignment is handled differently in this mode of operation. As mentioned in the “Encoder Bypass Mode” section, the KCHAR
input becomes ENCDET which enables Comma detection and re-synchronization when HIGH, and disables resynchronization when LOW. Only the ‘0011111xxx’ version of the Comma pattern is recognized when
ENDEC is LOW. The IDLEn output becomes COMDET (Comma Detect) which signals detection of the
‘0011111xxx’ Comma pattern in the current 10-bit output character when high. This mode of operation is
equivalent to a 10-bit interface commonly found in serializer/deserializers for the Fibre Channel (VSC7125)
and Gigabit Ethernet markets (VSC7135).
The logic used to align the four receive channels and/or insert and delete IDLE characters to compensate
for REFCLK variations between transmitting and receiving devices is disabled when ENDEC is LOW. In order
for this mode of operation to function without errors, the word clock source, as selected by RMODE(1:0), must
be frequency-locked to the REFCLK of the remote transmitting device in each channel. This is guaranteed
when RMODE(1:0) = 11. For other choices of RMODE(1:0), the frequency locked condition must be guaranteed by system design. When DUAL is HIGH and RMODE(1:0) = 10 or 11, the character containing the
‘0011111xxx’ Comma pattern is aligned to RCLKn/RCLKNn in each channel so that COMDET will be
asserted on the falling edge of RCLKn (rising edge of RCLKNn). This is done by adjusting the latency
through the elastic buffer; the recovered clock is never stretched or slivered. When the Comma pattern changes
the framing boundary, data characters prior to the assertion of COMDET on the falling edge of RCLKn may
be corrupted.
Receiver State Machine
Each channel contains a Loss of Synchronization State Machine (LSSM) which is responsible for detecting
and handling loss of bit, channel, word and word clock synchronization in a controlled manner. There are three
states in the LSSM: LOSS_OF_SYNC, RESYNC, and SYNC_ACQUIRED as shown in the state diagram of
Figure 9. The RESYNC state is entered when a 10-bit word has been received which contains the 7-bit Comma
pattern (e.g., a K28.5 IDLE character). After entering the RESYNC state, the VSC7217 will stay in it until a
valid, non-Comma transmission is received, then it transitions to the SYNC_ACQUIRED state indicating a normal operating condition. The RESYNC state is re-entered if four consecutive Commas are received or if a single Comma is received that changes the 10B character framing boundary. The LOSS_OF_SYNC state is
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Preliminary Datasheet
VSC7217
Mutli-Gigabit Interconnect Chip
entered whenever four consecutive invalid transmissions have been detected or when the occurrences of invalid
transmission outnumber those of valid transmission by four. The relative occurrences of invalid vs. valid transmissions are monitored with a simple up/down counter that increments when an invalid transmission is detected
and decrements otherwise. The LSSM transitions to the LOSS_OF_SYNC state when the counter reaches four,
and the counter is reset. A state diagram for the invalid transmission counter is shown in Figure 10. The
VSC7217 receiver will stay in the LOSS_OF_SYNC state until a valid Comma pattern is detected. Note that the
RESYNC state is entered whenever the 10B framing boundary is changed, and whenever the Word Sync
Sequence is received. When ENDEC is LOW the ERRn, KCHn and IDLEn outputs are re-defined and the
decoder and associated LSSM logic in each channel is unused.
Figure 9: State Diagram of the Loss of Synchronization State Machine
Valid Comma
(K28.1, K28.5, K28.7)
RESYNC
ERRn=1
KCHn=1
IDLEn=1
Valid Comma
Valid Non-Comma
Four Consecutive Commas
or
Mis-Aligned Comma
Invalid Transmission
Four Consecutive
Invalid Transmissions
or
LOSS_OF_SYNC
ERRn=1
KCHn=1
IDLEn=0
SYNC_ACQUIRED
Invalid minus Valid
Transmissions is > 4
ERRn=0
ERRn=1
KCHn=X or KCHn=0
IDLEn=X
IDLEn=X
Figure 10: State Diagram of the Invalid Transmission Counter
(Unconditional)
Invalid
Valid
Invalid
Invalid
Invalid
0
1
Valid
2
Valid
3
4
Valid
Mis-Aligned
Comma
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Link Status Outputs
The receiver ERRn, KCHn and IDLEn outputs indicate status for each channel as shown below in
Table 7. Since this status is encoded, multiple conditions could occur simultaneously so the states are prioritized
as indicated (1 being highest priority). For example, if both Out-of-Band and Disparity Errors occur, only an
Out-of-Band Error is reported because it has higher priority.
The ERRn, KCHn and IDLEn status signals apply to the data on Rn(7:0) on a per-character basis. The
only exception to this is the Underrun/Overrun indication. This indication is asserted coincident with the duplicated character when an underrun occurs, and is asserted following the deleted character (e.g., on the cycle
where the deleted character should have appeared) when overrun occurs.
Table 7: Receiver Status Signals
ERRn
KCHn
IDLEn
Priority
Link Status
0
0
0
7
Valid Data Transmission: A valid 10B data character with correct
disparity was received. The correctly decoded version of this
character is on Rn(7:0).
0
0
1
1
Underrun/Overrun Error: The elastic buffer has not been able to
add/drop an IDLE when required. Data on Rn(7:0) is invalid.
0
1
0
6
Kxx.x Special Character Detected (not IDLE): A valid 10B
special character with correct disparity was received. The correctly
decoded version of this character, per Table 3, is on Rn(7:0).
0
1
1
5
IDLE Detected: A valid IDLE character (K28.5) with correct
disparity was received. The correctly decoded version of this
character, per Table 3, is on Rn(7:0).
1
0
0
3
Out-of-band Error Detected: A character was received which
was not a valid 10B data or control character. Data on Rn(7:0) is
invalid.
1
0
1
4
Disparity Error Detected: A valid 10B character was received
which did not have the expected disparity. Rn(7:0) is invalid.
1
1
0
2
Loss of Synchronization: The receiver state machine is in the
Loss-of-Sync state. Data on Rn(7:0) is invalid.
1
1
1
2
RESYNC: The receiver state machine is in the ReSynchronization state. Data on Rn(7:0) is a decoded version of
K28.1, K28.5 or K28.7.
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Preliminary Datasheet
Mutli-Gigabit Interconnect Chip
VSC7217
Loopback Operation
Loopback control pins, LBENn(1:0), are provided in each channel to internally loopback data paths for onchip diagnosis. Both serial and parallel loopback functions are provided.
Table 8: Loopback Mode Selection
LBENn(1:0)
Loopback Mode
00
Normal Operation
01
Internal Parallel Loopback
10
Internal Serial Loopback
11
Reserved
When LBENn(1:0)=10, Serial Loopback mode is selected. The transmitter’s serial transmit data is internally connected to the receiver’s CRU input. The serial loopback paths are labelled LBTXn in the VSC7217
block diagram on the first page. This allows parallel data on Tn(7:0) to be encoded, serialized, looped back,
deserialized and decoded. This mode is intended for the system to verify functionality of the local VSC7217
prior to attempting to establish an external link. The PTXn and RTXn outputs are unaffected by the state of
LBENn(1:0).
When LBENn(1:0)=01, Parallel Loopback mode is selected. The Rn(7:0) outputs are looped back to the
Tn(7:0) inputs (see Figure 11). WSENn does not have a loopback source and is internally connected to a logic
LOW. KCHAR does not have a loopback source and is internally connected to a logic HIGH. The C/Dn input
is obtained by decoding the link status outputs such that either a data character, special character, or IDLE
(K28.5) is transmitted. When the link is in the LOS or RESYNC states, C/Dn is asserted and the data path is set
to 0xBC so that an IDLE will be transmitted. For other link status conditions C/Dn follows the KCHn status
bit. This guarantees that IDLE and special characters will be correctly looped back along with normal data, and
also has the effect of looping back the data received as a normal data character when a disparity error, out-ofband character, or underflow/overflow link status condition occurs.
In Parallel Loopback mode, the receiver uses an internal copy of REFCLK as the word clock in each
receiver. This data is looped back to the transmitter with TMODE(2:0) internally set to 000. This guarantees
that the parallel loopback data to be re-transmitted will be frequency-locked to the transmitter’s REFCLK. This
also means that the receiver parallel output data timing will not match the normal system timing that is externally selected by RMODE(1:0). The parallel output data should be ignored in this mode of operation.
This internal loopback configuration also allows rate matching to be performed in the receivers’ elastic
buffers. Rate matching is controlled and operates exactly the same way that it does in normal mode. This is
required to avoid receiver Overrun/Underrun errors in the loopback device if the remote transmitting device’s
REFCLK is not frequency-locked to the loopback device’s REFCLK. Keep in mind that the LBENn(1:0),
RXP/Rn, PTXENn, RTXENn and BIST inputs must all be configured appropriately in order for end-to-end
parallel loopback to function correctly in a user environment. Parallel Loopback mode is internally disabled
when BIST mode is enabled.
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VSC7217
Multi-Gigabit Interconnect Chip
Figure 11: Parallel Loopback Mode Operation
LBENn(1:0)
RXP/Rn
LBTXn
PRXn+
PRXnRRXn+
RRXn-
Clk/Data
Recovery
10
8B/10B
Decode
PSDETn
RSDETn
8
3
8
Rn(7:0)
IDLEn
KCHn
ERRn
Elastic
Buffer
≈REFCLK
PTXENn
(dec)
0
LBTXn
PTXn+
PTXnRTXn+
RTXn-
8
8B/10B 10
Encode
D Q
8
Tn(7:0)
C/Dn
WSENn
≈REFCLK
RECEIVER
1
0
RTXENn
1
KCHAR
PARLOOP
1
0
TRANSMITTER
Figure 12: BIST Mode Operation
BIST
Gen
1
8
D Q
8
Tn(7:0)
C/Dn
WSENn
≈REFCLK
0
8B/10B 10
Encode
LBENn(1:0)
RXP/Rn
LBTXn
PTXn+
PTXnRTXn+
RTXn-
RTXENn
0
KCHAR
BIST
PTXENn
PRXn+
PRXnRRXn+
RRXn-
Clk/Data
Recovery
10
8B/10B
Decode
PSDETn
RSDETn
8
3
8
BIST
Chk
WORDCLK
1
0
TRANSMITTER
RECEIVER
Rn(7:0)
IDLEn
KCHn
ERRn
Elastic
Buffer
From Tx
Clock Gen
} CGERRn
1
0
TBERRn
BIST
Built-In Self-Test Operation
Built-In Self-Test operation is enabled when the BIST input is HIGH, which causes TMODE(2:0) to be
internally set to 000. Upon entering BIST mode, the transmitter will issue a Word Sync Sequence in order to
recenter the elasticity buffers in the receive channel. Each transmitter then repeatedly sends a simple 256-byte
incrementing data pattern (prior to 8B/10B encoding) followed by three IDLE characters (K28.5). Note that this
incrementing pattern plus three IDLEs will cause both disparities of each data character and the IDLE character
to be transmitted, and contains a sufficient IDLE density for any application requiring IDLE insertion/deletion.
It is up to the user to enable IDLE insertion/deletion if the receiver’s word clock is not frequency-locked to the
transmitter’s REFCLK.
Each receiver monitors incoming data for this pattern and indicates if any errors are detected. Correct
reception of the pattern is reported on each receiver’s TBERRn output. A LOW means the pattern is being
received correctly and a HIGH means that errors are detected. When BIST transitions from LOW to HIGH,
each TBERRn output is initialized HIGH. It will be cleared LOW whenever one or more IDLE characters, followed by all 256 data characters, are sequentially received without error, and set HIGH whenever a pattern mismatch or receiver error is encountered. Each channel functions independently, no attempt is made to word-align
the receive channels. Received data and associated status will be output as in normal operation. Please note that
Serial Loopback mode and receiver output timing mode selection via RMODE(1:0) operate independently of
BIST mode, but BIST mode disables Parallel Loopback mode.
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Preliminary Datasheet
Mutli-Gigabit Interconnect Chip
VSC7217
Compatibility with VSC7214 and VSC7211
Care has been taken in the functional definition of the VSC7217 ensure compatiblity with the VSC7211
and VSC7214 at the serial link level, and that the transmitter and receiver low-speed interfaces have compatible
modes of operation. It is strongly recommended that the VSC7217 not be connected in any way through the
WSO and/or WSI pins to a VSC7211 or VSC7214.
Serial Link Compatibility
The VSC7217 uses the same Fibre Channel 8b/10b encoding scheme and the same Word Sync Sequence
used in the VSC7211 and VSC7214. The only difference in serial link operation is that the VSC7211 and
VSC7214 require four consecutive identically-aligned Comma patterns to set the character framing boundary,
while the VSC7217 requires a single Comma. This means that from the LOSS_OF_SYNC state, the VSC7217
will make an earlier transition to the RESYNC state (one Comma instead of four) as shown in Figure 9. Once
out of the LOSS_OF_SYNC state, there is no difference in receiver behavior in the absence of data link errors.
When transmitting in 32-bit mode from a VSC7217 to a VSC7211 or VSC7214, use TMODE(2:0)=000 or
=1X0 (common transmit interface timing source) to minimize transmitter inter-channel skew.
Parallel Interface Compatibility
In general, the VSC7217 low-speed parallel interfaces can be configured so that there are input and output
signals that are compatible with their VSC7211 and VSC7214 counterparts. On the transmit interface, the signals Tn(7:0) and C/Dn behave identically on the VSC7217 as long as the input timing is referenced to REFCLK (e.g., TMODE(2:0)=000). On the receive interface, the signals Rn(7:0), ERRn, KCHn and IDLEn
behave identically on the VSC7217 as long as the four receive channels present output data centered around
REFCLK (RMODE(1:0)=00) or timed to RCLKA/RCLKNA (RMODE(1:0)=10). When RMODE(1:0)=10
the VSC7217 RCLKn/RCLKNn outputs provide four copies of RCLKA/RCLKNA, which are equivalent to
the VSC7211 and VSC7214 RCLK/RCLKN outputs.
The VSC7217 KCHAR input is no longer a synchronous input timed to REFCLK as on the VSC7211 and
VSC7214. It is a static input used to define the control character encoding mode when C/Dn=1 as shown in
Table 2. The VSC7217 also has a separate WSENn input per channel instead of a common WSYNC input as
on the VSC7211 and VSC7214.
Operational Mode Compatibility
The VSC7211 and VSC7214 specifications define eight operating modes based on the binary combinations
of the RCLKEN, FLOCK and INDEP inputs. Note that these mode inputs control VSC7211 and VSC7214
receiver operation only, and have no effect on transmitter operation. For each of these modes, the equivalent
VSC7217 receiver configuration is presented.
VSC7214 MODE 0: RCLKEN=LOW, FLOCK=LOW, INDEP=LOW
Receiver Rn(7:0), ERRn, KCHn and IDLEn outputs are synchronous to REFCLK, IDLE insertion/deletion is enabled, and the receive channels are word-aligned. The VSC7217 should be configured with
RMODE(1:0)=00, FLOCK=0, and WSI connected to its own WSO or to the WSO of another VSC7217
if multiple devices are to be used in parallel. The WSI connection allows IDLE insertion/deletion to occur
in parallel across all word-aligned channels.
Page 18
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Preliminary Datasheet
VSC7217
Multi-Gigabit Interconnect Chip
VSC7214 MODE 1: RCLKEN=LOW, FLOCK=LOW, INDEP=HIGH
Receiver Rn(7:0), ERRn, KCHn and IDLEn outputs are synchronous to REFCLK, IDLE insertion/deletion is enabled, and the receive channels are independent. The VSC7217 should be configured with
RMODE(1:0)=00, FLOCK=0, and WSI=1. The WSI connection inhibits channel alignment, and allows
IDLE insertion/deletion to occur independently in each channel.
VSC7214 MODE 2: RCLKEN=LOW, FLOCK=HIGH, INDEP=LOW
Receiver Rn(7:0), ERRn, KCHn and IDLEn outputs are synchronous to REFCLK, IDLE insertion/deletion is disabled, and the receive channels are word-aligned. The VSC7217 should be configured with
RMODE(1:0)=00, FLOCK=1, and WSI connected to its own WSO or to the WSO of another VSC7217
if multiple devices are to be used in parallel. The WSI connection allows word alignment to occur, and the
FLOCK connection inhibits IDLE insertion/deletion.
VSC7214 MODE 3: RCLKEN=LOW, FLOCK=HIGH, INDEP=HIGH
Receiver Rn(7:0), ERRn, KCHn and IDLEn outputs are synchronous to REFCLK, IDLE insertion/deletion is disabled, and the receive channels are independent. The VSC7217 should be configured with
RMODE(1:0)=00, FLOCK=1, and WSI=0. The WSI connection inhibits channel alignment, and the
FLOCK connection inhibits IDLE insertion/deletion.
VSC7214 MODE 4: RCLKEN=HIGH, FLOCK=LOW, INDEP=LOW
This configuration does not require IDLE insertion/deletion, use Mode 6 instead.
VSC7214 MODE 5: RCLKEN=HIGH, FLOCK=LOW, INDEP=HIGH
Receiver Rn(7:0), ERRn, KCHn and IDLEn outputs are synchronous to RCLKn/RCLKNn, IDLE insertion/deletion is enabled, and the receive channels are independent. The VSC7217 should be configured with
RMODE(1:0)=10, FLOCK=0, and WSI=1. The WSI connection inhibits channel alignment, and allows
IDLE insertion/deletion to occur independently in each channel. The B, C and D channel RCLKn/
RCLKNn outputs are copies of RCLKA/RCLKNA.
VSC7214 MODE 6: RCLKEN=HIGH, FLOCK=HIGH, INDEP=LOW
Receiver Rn(7:0), ERRn, KCHn and IDLEn outputs are synchronous to RCLKn/RCLKNn, IDLE insertion/deletion is disabled, and the receive channels are word-aligned. The VSC7217 should be configured
with RMODE(1:0)=10, FLOCK=1, and WSI connected to its own WSO. Multiple VSC7217 devices
should not be used in parallel when the outputs are synchronous to RCLKn/RCLKNn. The WSI connection allows word alignment to occur, and the FLOCK connection inhibits IDLE insertion/deletion.
VSC7214 MODE 7: RCLKEN=HIGH, FLOCK=HIGH, INDEP=HIGH
Receiver Rn(7:0), ERRn, KCHn and IDLEn outputs are synchronous to RCLKn/RCLKNn, IDLE insertion/deletion is disabled, and the receive channels are independent. The VSC7217 should be configured
with RMODE(1:0)=10, FLOCK=1, and WSI=0. The WSI connection inhibits channel alignment, and the
FLOCK connection inhibits IDLE insertion/deletion.
G52325-0, Rev. 3.0
6/14/00
 VITESSE SEMICONDUCTOR CORPORATION
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Page 19
VITESSE
SEMICONDUCTOR CORPORATION
Preliminary Datasheet
VSC7217
Mutli-Gigabit Interconnect Chip
AC Specifications
Figure 13: Transmit Input Timing Waveforms with TMODE = 000
REFCLK
(DUAL=0)
REFCLK
(DUAL=1)
Internal Clock
(from PLL)
T2
T1
Tn(7:0)
C/Dn
WSENn
Valid
T2
T1
Valid
Valid
Figure 14: Transmit Input Timing Waveforms with TMODE = 10X
TBCn
(or TBCA)
Internal Clock
(from PLL)
T2
T1
Tn(7:0)
C/Dn
WSENn
Valid
T2
T1
Valid
Valid
Table 9: Transmit Input AC Characteristics with TMODE = 000 or TMODE = 10X
Parameters
Page 20
Description
Min
Max
Units
Conditions
Measured between the valid data
level of the input and the 1.4V point
of REFCLK or TBCn.
T1
Input Setup time to the rising
edge of REFCLK or TBCn
1.5
—
ns
T2
Input Hold time after the rising
edge of REFCLK or TBCn
1.0
—
ns
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SEMICONDUCTOR CORPORATION
Preliminary Datasheet
VSC7217
Multi-Gigabit Interconnect Chip
Figure 15: Transmit Input Timing Waveforms with TMODE = 11X (“ASIC-Friendly” Timing)
TBCn
(or TBCA)
Internal Clock
(from PLL)
TS
Tn(7:0)
C/Dn
WSENn
TS
Valid
Valid
Valid
Table 10: Transmit Input AC Characteristics with TMODE = 11X
Parameters
Description
Min
Max
Units
Conditions
TS
Input Skew relative to the rising
edge of TBCn or TBCA
—
2.0
bc
Measured between the valid data
level of the input and the 1.4V point
of TBCn or TBCA, bc = Bit Clock.
Figure 16: Transmit Serial Timing Waveforms
TSDR, TSDF
TXn+, TXn-
TX0
TLAT
REFCLK
(or TBCn)
Table 11: Transmit Serial AC Characteristics
Parameters
Min
Max
Units
Conditions
TSDR, TSDF
TXn+/- Rise and Fall Times
—
330
ps
Measured between 20% to
80% of the valid data level.
TLAT
Latency, REFCLK to TX0
Latency, TBCA to TX0
Latency, TBCB/C/D to TX0
22bc+0.2ns
36bc+0.0ns
32bc+0.1ns
22bc+0.8ns
38bc+0.3ns
42bc+0.6ns
bc + ns
ENDEC=1 TMODE=000
ENDEC=1 TMODE=10X
ENDEC=1 TMODE=101
TJ
Serial Data Output
Total Jitter (p-p)
—
192
ps
IEEE 802.3z Clause 38.69,
tested on a sample basis.
TDJ
Serial Data Output
Deterministic Jitter (p-p)
—
80
ps
IEEE 802.3z Clause 38.69,
tested on a sample basis.
G52325-0, Rev. 3.0
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Description
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VITESSE
SEMICONDUCTOR CORPORATION
Preliminary Datasheet
VSC7217
Mutli-Gigabit Interconnect Chip
Figure 17: Receive Output Timing Waveforms with RMODE = 00 or 01
REFCLK
(DUAL = 0)
TPER
REFCLK
(DUAL = 1)
Rn(7:0) TBERRn
KCHn IDLEn ERRn
PSDETn RSDETn
TCQ_max
TCQ_min
TQC_min
Valid
Valid
Valid
Table 12: Receive Output AC Characteristics with RMODE = 00 or 01
Parameters
Description
Min
Max
Units
Conditions
TCQ
REFCLK Rising Edge to TTL
Output Transition
2.58 ns - 0 bc
5.43 ns - 0 bc
ns
RMODE = 00
bc = Bit Clock
TCQ
REFCLK Rising Edge to TTL
Output Transition
2.58 ns - 2 bc
5.43 ns - 2 bc
ns
RMODE = 01
bc = Bit Clock
TQC
TTL Output Transition to
REFCLK Rising Edge
TPER - TCQ_max
ns
Figure 18: Receive Output Timing Waveforms with RMODE = 10 or 11
RCLKn
(DUAL = 0)
TPER
RCLKn/RCLKNn
(DUAL = 1)
Rn(7:0) TBERRn
KCHn IDLEn ERRn
PSDETn RSDETn
TCQ_max
TCQ_min
TQC_min
Valid
Valid
Valid
Table 13: Receive Output AC Characteristics with RMODE = 10 or 11
Parameters
Description
Min
Max
Units
TCQ
RCLKn/RCLKNn Rising Edge to
TTL Output Transition
-1.25 ns + 4 bc
1.25 ns + 4 bc
ns
TCQ
TTL Output Transition to RCLKn/
RCLKNn Rising Edge
TPER - TCQ_max
TPER - TCQ_min
ns
DC
RCLKn/RCLKNn Duty Cycle
50% - 1 ns
50% + 1 ns
ns
Page 22
Conditions
RMODE = 10 or 11
bc = Bit Clock
Measured at 1.4. V
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SEMICONDUCTOR CORPORATION
Preliminary Datasheet
VSC7217
Multi-Gigabit Interconnect Chip
Figure 19: RCLKn and RCLKNn Timing Waveforms with DUAL = 1
T4
T3
RCLKn
RCLKNn
Table 14: General Receive AC Characteristics
Parameters
Description
Min.
Max.
Units
T3
Delay Between Rising Edge
of RCLKn to Rising Edge
of RCLKNn
10 x TRX
-500
10 x TRX
+500
ps
TRX is the bit period of the
incoming data on Rx.
RCLKn to RCLKNn Skew
∆T3
T4
∆T4
-500
500
ps
Deviation of RCLKn rising
edge to RCLKNn rising
edge. Nominal delay is 10 bit
times.
Period of RCLKn and
RCLKNn
0.99 x
TREFCLK
1.01 x
TREFCLK
ps
Whether or not locked to
serial data, independent of
DUAL input.
Deviation of
RCLK/RCLKN Period
from REFCLK Period
-1.0
1.0
%
Whether or not locked to
serial data, independent of
DUAL input.
—
2.4
ns
Between VIL(MAX) and
VIH(MIN) into 10pf load.
70.5bc-1.6ns
48.5bc-1.6ns
81.5bc+4.1ns
102.5bc+4.1ns
bc+ns
ENDEC=1, Recenter only
ENDEC=X, Recenter + Drift
—
100
bc
Using K28.5+/K28.5- pattern.
tested on a sample basis.
10 - ± ∆T
Delay = ----------3
f baud
T RCLK = T REFCLK ± ∆T 4
TR, TF
Output Rise and Fall Time
RLAT
Latency from RX0 to
REFCLK or RCLK
TLOCK(1)
Conditions
Data Acquisition Lock Time
TJTD
Receive Data Total
Jitter Tolerance (p-p)
600
ps
IEEE 802.3z Clause 38.68,
tested on a sample basis.
DJTD
Receive Data
Deterministic
Jitter Tolerance (p-p)
370
ps
IEEE 802.3z Clause 38.69,
tested on a sample basis.
NOTE: (1) The probability of correct data acquisition and recovery is 99% per FC-PH 4.3 Section 5.3.
G52325-0, Rev. 3.0
6/14/00
 VITESSE SEMICONDUCTOR CORPORATION
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Page 23
VITESSE
SEMICONDUCTOR CORPORATION
Preliminary Datasheet
VSC7217
Mutli-Gigabit Interconnect Chip
Figure 20: REFCLK Timing Waveforms
TH
VIH(MIN)
REFCLK
VIL(MAX)
TL
Table 15: Reference Clock Requirements
Parameters
FR
Description
Frequency Range
FO
Frequency Offset
DC
TH,TL
TRCR,TRCF
Min
Max
Units
Conditions
98
136
MHz
49
68
MHz
DUAL = 1
| REFCLK (Tx) - REFCLK (Rx) | =
max offset between Tx and Rx device
REFCLKs on one serial link.
DUAL = 0
-200
200
ppm
REFCLK Duty Cycle
35
65
%
REFLCK and TBC Pulse Width
3
—
ns
REFCLK Rise and Fall Times
—
1.5
ns
Between VIL(MAX) and VIH(MIN).
—
100
ps
Peak-to-peak jitter at VSC7217
REFCLK input.
Measured at 1.4V.
REFCLK Jitter Power
REFCLK
Jitter
3MHz
∫
PhaseNoise
100Hz
Page 24
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G52325-0, Rev. 3.0
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VITESSE
SEMICONDUCTOR CORPORATION
Preliminary Datasheet
VSC7217
Multi-Gigabit Interconnect Chip
Figure 21: Parametric Measurement Information
Serial Input Rise and Fall Time
Tr
TTL Input and Output Rise and Fall Time
80%
VIH(MIN)
20%
VIL(MAX)
Tr
Tf
Tf
Receiver Input Eye Diagram Jitter Tolerance Mask
Bit Time
Amplitude
Eye Width%
25%
Parametric Test Load Circuit
Serial Output Load
Z0 = 50Ω
TTL AC Output Load
50Ω
10 pF
VDD – 2.0V
G52325-0, Rev. 3.0
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 VITESSE SEMICONDUCTOR CORPORATION
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Page 25
VITESSE
SEMICONDUCTOR CORPORATION
Preliminary Datasheet
VSC7217
Mutli-Gigabit Interconnect Chip
DC Characteristics
Parameters
Description
Min.
Typ
Max.
Units
Conditions
TTL Outputs (Rn(7:0), KCHn, IDLEn, ERRn, RCLKn/RCLKNn, TBERRn, PSDETn, RSDETn, WSO)
VOH
TTL Output HIGH Voltage
2.4
—
—
V
VOL
TTL Output LOW Voltage
—
—
0.5
V
IOL = +1.0mA
µA
When set to high-impedance
state through JTAG.
IOZ
TTL Output Leakage Current
—
—
TBD
IOH = -1.0mA
TTL Inputs (TBCn, Tn(7:0), C/Dn, WSENn, KCHAR, RATE, BIST, LBENn(1:0), TMODE(2:0), RMODE(1:0),
DUAL, PTXENn, RTXENn, RXP/Rn, RESETN, ENDEC, WSI, FLOCK, TRSTN, TDI, TDO, TMS, TCK)
VIH
TTL Input HIGH Voltage
2.0
—
—
V
VIL
TTL Input LOW Voltage
0
—
0.8
V
IIH
TTL Input HIGH Current
—
50
500
µA
VIN =2.4V
IIL
TTL Input LOW Current
—
—
-1000
µA
VIN =0.5V
PECL Inputs (REFCLKP/REFCLKN)
VIH
PECL Input HIGH Voltage
VDD 1.1
—
VDD 0.7
V
VIL
PECL Input LOW Voltage
VDD 2.0
—
VDD 1.5
V
IIH
PECL Input HIGH Current
—
—
200
µA
VIN =VIH(MAX)
IIL
PECL Input LOW Current
- 50
—
—
µA
VIN =VIL(MIN)
∆VIN
PECL Input Differential Peakto-Peak Voltage Swing
200
—
—
mV
| VIH(MIN) - VIL(MAX) |a
VDD 1.5
—
VDD 0.7
V
—
VDD/2
—
450
—
1100
mV
| PTXn+ - PTXn- |a
50Ω to VDD - 2.0V
PECL Differential Peak-to-Peak
Input Voltage Swing
200
—
1300
mV
| PRXn+ - PRXn- |a
VCM
VBIAS
PECL Input Common-Mode
Voltage
REFCLKP/REFCLKN Internal
Input bias voltage
PECL Outputs (PTXn+/-, RTXn+/-)
∆VOUT
PECL Differential Peak-to-Peak
Output Voltage Swing
PECL Inputs (PRXn+/-, RRXn+/-)
∆VIN
Miscellaneous
VDD
Power Supply Voltage
3.14
—
3.47
V
3.3V + 5%
PD
Power Dissipation
—
3.0
3.5
W
IDD
Supply Current
—
910
1000
mA
Maximum at 3.47V, 130MHz
redundant I/O OFF
Typical at 3.3V, outputs open
a.
Single ended measurement results are quoted here. Differential techniques used in Fibre Channel would yield values that are
twice the magnitude. See diagram below.
Tx+
∆ Vout
Tx-
Page 26
 VITESSE SEMICONDUCTOR CORPORATION
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G52325-0, Rev. 3.0
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VITESSE
SEMICONDUCTOR CORPORATION
Preliminary Datasheet
VSC7217
Multi-Gigabit Interconnect Chip
Absolute Maximum Ratings (1)
Power Supply Voltage, (any VDDX)................................................................................................. 0.5V to +3.8V
PECL Differential Input Voltage............................................................................................ -0.5V to VDD +0.5V
TTL Input Voltage...........................................................................................................................-0.5V to +5.5V
TTL Output Voltage .............................................................................................................. -0.5V to VDD + 0.5V
TTL Output Current ...................................................................................................................................... 50mA
PECL Output Current .................................................................................................................................... 50mA
Case Temperature Under Bias, (TC)................................................................................................-55o to +125oC
Storage Temperature, (TSTG) ....................................................................................................... -65oC to +150oC
Note: (1) CAUTION: Stresses listed under “Absolute Maximum Ratings” may be applied to devices one at a time without causing
permanent damage. Functionality at or above the values listed is not implied. Exposure to these values for extended periods may affect device reliability.
Recommended Operating Conditions
Power Supply Voltage, (VDD)................................................................................................................+3.3V+5%
Operating Temperature Range, .................................................................................0oC Ambient to +95oC Case
G52325-0, Rev. 3.0
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Page 27
Page 28
RESETN
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RRXA-
PRXB-
RRXA+
PRXB+
VSSD
VDDD
VSSD
RRXB+
RRXB-
RXP/RB RMODE1
VSSD
LBENB1
LBENA1
TA4
TA0
TA7
TA1
VSSD
C/DA
TA5
TA3
WSENA
VSSD
VDDD
TB1
TB0
TBCB
TB5
TB4
TB2
RB0
VSST
KCHAR FLOCK VDDT
ENDEC
RB3
RB7
VDDD WSENB RSVD1 RSVD2 VDDD
TB6
C/DB
RB1
VSST
RB4
VDDT
KCHB TBERRB
VDDT
RB5
IDLEB
VSST
RSDETB
RA0
VSST
RA7
ERRA
VSST
VDDT
RCLKND
VSST
KCHD
RD6
VSST
RCLKC
PSDETC
VSST
TBERRC
RC4
18
VSST
VDDT
PSDETB
RA2
VDDT
RA6
KCHA
VDDT
RCLKNA
VSSD
TDO
VDDT
IDLED
VDDT
RD4
VDDT
RD1
RSDETC
VDDT
VSST
19
RCLKNB
RA1
RA4
RA5
VSST
TBERRA
PSDETA
VSST
RCLKA
WSI
VDDD
RSDETD
TBERRD
VSST
ERRD
RD7
VSST
RD3
RD0
ERRC
20
Y
W
V
U
T
R
P
N
M
L
K
J
H
G
F
E
D
C
B
A
Mutli-Gigabit Interconnect Chip
VDDD
RXP/RA
TB7
VDDD
TB3
PRXA-
PRXA+
TBCA
RTXA-
RTXA+
RCLKB
RA3
LBENB0
PTXA-
PTXA+
VDDRA
VDDT
VDDRB VDDPA RTXENA LBENA0
RSDETA
WSO
RCLKD
IDLEA
PTXENB
VDDA
VSSA
PTXENC
RTXENB PTXENA
VDDPB
VDDD
VSSD
VDDPC
PSDETD
RTXB-
RCLKNC
VDDT
IDLEC
VDDT
RTXB+
ERRB
KCHC
RC7
VSST
RC3
17
PTXB-
RB6
RC5
RC6
RC2
RC0
16
PTXB+
RB2
RC1
VSST
VDDT
TCK
15
VDDA
VSSD
VDDD
VSSD
TMS
TDI
14
CAP1
TA6
BIST
WSENC
C/DC
NOT POPULATED
TC5
TC6
VDDD
TRSTN
13
VSSA
TA2
TC1
REFCLKN TC2
TBCD
TC3
TC7
12
CAP0
RMODE0
TD7
TD6
TBCC
VSSD
11
PTXC-
DUAL
TD3
VSSD
WSEND
TC4
10
PTXC+
RTXENC PTXEND
VDDRD
VSSD
TMODE0 TMODE1
TD1
TD5
TC0
9
VDDT
PTXD-
PTXD+
LBEND1
VDDD
VDDD
TD2
VSSD REFCLKP
8
RTXC-
RTXD-
RTXD+
LBENC1
VSSD
TD0
C/DD
7
RTXC+
PRXD-
PRXD+
VSSD
TMODE2
TD4
6
RD5
RXP/RD
VDDD
RXP/RC
RRXC-
5
VDDRC VDDPD RTXEND LBEND0
RRXD-
RRXD+
RRXC+
4
RD2
PRXC-
PRXC+
3
LBENC0
2
1
VITESSE
SEMICONDUCTOR CORPORATION
Preliminary Datasheet
VSC7217
Table 16: Pin Table
G52325-0, Rev. 3.0
6/14/00
VITESSE
SEMICONDUCTOR CORPORATION
Preliminary Datasheet
VSC7217
Multi-Gigabit Interconnect Chip
Table 17: Pin Description
Pin
6Y, 8U,
7W, 5Y,
7V, 7U,
6W, 5W
11U, 11W,
10Y, 10W,
10U, 10V,
9Y, 9W
12A, 11C,
11D, 10A,
10B, 10D,
10C, 9A
8D, 8C,
7B, 5A,
7D, 6B,
6C, 5B
TA(7:0)
TB(7:0)
TC(7:0)
TD(7:0)
I/O
Type
Pin Description
I
TTL
Transmit Data for Channel n. Synchronous to REFCLK, TBCA or TBCn.
I
TTL
Transmit Data for Channel n. Synchronous to REFCLK, TBCB or TBCn.
I
TTL
Transmit Data for Channel n. Synchronous to REFCLK, TBCC or TBCn.
I
TTL
Transmit Data for Channel n. Synchronous to REFCLK, TBCD or TBCn.
TTL
Control/Data for Channel n. If KCHAR=C/Dn=LOW, then Tn(7:0) is used
to generate transmit data. If KCHAR=C/Dn=HIGH, then special Kxx.x
characters are transmitted based upon the value of Tn(7:0). If
KCHAR=LOW and C/Dn=HIGH, IDLE characters are transmitted.
When ENDEC=LOW, this is equivalent to data bit Tn8.
7Y
11V
12B
6A
C/DA
C/DB
C/DC
C/DD
8Y
12Y
12C
8B
WSENA
WSENB
WSENC
WSEND
I
TTL
Word Sync ENable for Channel n. Asserted HIGH for one cycle to initiate
transmission of the Word Sync Sequence as defined in Figure 5 and related
text.
When ENDEC=LOW, this is equivalent to data bit Tn9.
9U
9V
9B
9C
TBCA
TBCB
TBCC
TBCD
I
TTL
Transmit Byte Clock for Channel n. Optional input data timing reference for
Tn(7:0), WSENn and C/Dn.
I
12W
KCHAR
I
TTL
Special Kxx.x CHARacter Enable. When C/Dn is HIGH, KCHAR controls
data sent to the transmitter. When LOW, IDLE characters are sent. When
HIGH, Kxx.x special characters are sent as encoded on Tn(7:0). This is
intended to be a static input and cannot be changed on a cycle-by-cycle
basis.
When ENDEC=LOW, this is equivalent to ENCDET.
5D
6D
4B
TMODE0
TMODE1
TMODE2
I
TTL
Transmit Input Data Timing MODE. Determines the timing reference for
Tn(7:0), WSENn and C/Dn on all channels as defined in Table 1.
20R
17V
18B
20H
TBERRA
TBERRB
TBERRC
TBERRD
TTL
Transmit Buffer ERRor for Channel n. When HIGH indicates that the
elastic limit of the transmit input skew buffer was exceeded, output timing is
same as Rn(7:0). A LOW indicates correct reception of the256-bye
incrementing pattern in BIST mode.
G52325-0, Rev. 3.0
6/14/00
Name
O
 VITESSE SEMICONDUCTOR CORPORATION
741 Calle Plano, Camarillo, CA 93012 • 805/388-3700 • FAX: 805/987-5896
Page 29
VITESSE
SEMICONDUCTOR CORPORATION
Preliminary Datasheet
VSC7217
Mutli-Gigabit Interconnect Chip
Pin
Name
I/O
Type
1R, 2R
1M, 2M
1J, 2J
1F, 2F
PTXA+/PTXB+/PTXC+/PTXD+/-
O
PECL
Primary Differential Serial TX Outputs for Channel n. These pins output
serialized transmit data when PTXENn is HIGH. AC coupling is
recommended.
1T, 2T
1N, 2N
1H, 2H
1E, 2E
RTXA+/RTXB+/RTXC+/RTXD+/-
O
PECL
Redundant Differential Serial TX Outputs for Channel n. These pins output
serialized transmit data when RTXENn is HIGH. AC coupling is
recommended.
4N
4M
4J
4H
PTXENA
PTXENB
PTXENC
PTXEND
I
TTL
Primary TX Output ENable for Channel n. PTXn+/- is active when HIGH;
when LOW, PTXn+/- is powered down and the outputs are undriven.
3P
3N
3H
3G
RTXENA
RTXENB
RTXENC
RTXEND
I
TTL
Redundant TX Output ENable for Channel n. RTXn+/- is active when
HIGH; when LOW, RTXn+/- is powered down and the outputs are
undriven.
O
TTL
Receive Data for Channel A. Synchronous to RCLKA/RCLKNA or
REFCLK as selected by RMODE(1:0).
O
TTL
Receive Data for Channel B. Synchronous to RCLKB/RCLKNB or
REFCLK as selected by RMODE(1:0).
O
TTL
Receive Data for Channel C. Synchronous to RCLKC/RCLKNC or
REFCLK as selected by RMODE(1:0).
O
TTL
Receive Data for Channel D. Synchronous to RCLKD/RCLKND or
REFCLK as selected by RMODE(1:0).
18P, 19R
20U, 20V
17R, 19U
20W, 18T
15V, 15U
18Y, 17Y
15W, 14U
16Y, 13V
16C, 15C
15D, 18A
17A, 15B
14D, 16A
20E, 18G
17G, 19F
20C, 17F
19D, 20B
Page 30
RA(7:0)
RB(7:0)
RC(7:0)
RD(7:0)
Pin Description
17N
18W
17C
19H
IDLEA
IDLEB
IDLEC
IDLED
O
TTL
IDLE Detect for Channel n. When HIGH, an IDLE character has been
detected by the decoder and is on Rn(7:0).
When ENDEC=LOW, this is equivalent to COMDETn.
19P
16V
16D
18H
KCHA
KCHB
KCHC
KCHD
O
TTL
Kxx.x CHaracter Detect for Channel n. When HIGH, a special Kxx.x
character has been detected by the decoder and is on Rn(7:0).
When ENDEC=LOW, this is equivalent to data bit Rn8.
 VITESSE SEMICONDUCTOR CORPORATION
741 Calle Plano, Camarillo, CA 93012 • 805/388-3700 • FAX: 805/987-5896
G52325-0, Rev. 3.0
6/14/00
VITESSE
SEMICONDUCTOR CORPORATION
Preliminary Datasheet
VSC7217
Pin
Name
I/O
Type
18N
16U
20A
20F
ERRA
ERRB
ERRC
ERRD
O
TTL
ERRor Detect for Channel n. When HIGH, an invalid 10-bit character or
disparity error has been detected and the data on Rn(7:0) is invalid.
When ENDEC=LOW, this is equivalent to data bit Rn9.
20M
19M
17T
20Y
18E
17E
17K
18K
RCLKA
RCLKNA
RCLKB
RCLKNB
RCLKC
RCLKNC
RCLKD
RCLKND
O
TTL
Recovered CLocK Outputs for Channel n. These outputs are driven from
either the channel A or channel n recovered clock, at 1/10 or 1/20 the baud
rate, as selected by RMODE(1:0) and DUAL. When unused, RCLKn is
LOW and RCLKNn is HIGH.
6U
4W
RMODE0
RMODE1
I
TTL
Receive Output Data Timing MODE. Determines the timing reference for
all receive channels’ Rn(7:0), IDLEn, KCHn and ERRn output data, and
also for the PSDETn, RSDETn and TBERRn outputs, as defined in Table 5.
1U, 2U
1Y, 2Y
1A, 2A
1D, 2D
PRXA+/PRXB+/PRXC+/PRXD+/-
PECL
Primary Differential Serial RX Inputs for Channel n. These pins receive the
serialized input data when LBENn(1) is LOW and RXP/Rn is HIGH;
otherwise they are unused. They are internally biased at VDD/2 through a
3.2kΩ resistor to the bias voltage. AC-coupling is recommended.
1W, 2W
3Y, 4Y
3A, 4A
1B, 2B
RRXA+/RRXB+/RRXC+/RRXD+/-
I
PECL
Redundant Differential Serial RX Inputs for Channel n. These pins receive
the serialized input data when LBENn(1) is LOW and RXP/Rn is LOW,
otherwise they are unused. They are internally biased at VDD/2 through a
3.2kΩ resistor to the bias voltage. AC-coupling is recommended.
4P
3T
4R
3U
4F
3D
4G
3E
LBENA0
LBENA1
LBENB0
LBENB1
LBENC0
LBENC1
LBEND0
LBEND1
I
TTL
LoopBack ENable for Channel n. These inputs control the channel serial or
parallel loopback configuration as described in Table 8.
2V
3W
3B
2C
RXP/RA
RXP/RB
RXP/RC
RXP/RD
I
TTL
RX Input Primary/Redundant Serial Input Select for Channel n. When
LBENn(1) is LOW, this input selects PRXn+/- as the RX serial input source
when HIGH and RRXn+/- as the serial input source when LOW.
20P
19V
18D
17J
PSDETA
PSDETB
PSDETC
PSDETD
TTL
Primary Analog Signal DETect, Channel n. This output goes HIGH when
the amplitude on PRXn is greater than 200mV and goes LOW when the
input is less than 100mV. PSDETn is not defined when the input is between
100mV and 200mV. Output timing is same as Rn(7:0).
17M
18U
19C
20J
RSDETA
RSDETB
RSDETC
RSDETD
TTL
Redundant Analog Signal DETect, Channel n. This output goes HIGH
when the amplitude on RRXn is greater than 200 mV and goes LOW when
the input is less than 100mV. RSDETn is not defined when the input is
between 100mV and 200mV. Output timing is same as Rn(7:0).
G52325-0, Rev. 3.0
6/14/00
Multi-Gigabit Interconnect Chip
I
O
O
Pin Description
 VITESSE SEMICONDUCTOR CORPORATION
741 Calle Plano, Camarillo, CA 93012 • 805/388-3700 • FAX: 805/987-5896
Page 31
VITESSE
SEMICONDUCTOR CORPORATION
Preliminary Datasheet
VSC7217
Mutli-Gigabit Interconnect Chip
Pin
Name
8A
9D
REFCLKP
REFCLKN
1K
1L
CAP0
CAP1
5U
DUAL
I/O
I
I
Type
Pin Description
PECL
REFCLK Differential Positive and Negative PECL or Single-ended TTL
Inputs. This rising edge of this clock latches transmit data and control into
the input register. It also provides the reference clock, at 1/10th or 1/20th of
the baud rate to the PLL as selected by DUAL. If TTL, connect to
REFCLKP but leave REFCLKN open. If PECL, connect both REFCLKP
and REFCLKN.
Analog
Loop Filter CAPacitor for Clock Generation PLL. Nominally 0.1 µF,
amplitude is less than 3V. Refer to the Loop Filter Applications section for
further details.
TTL
DUAL Clock Mode. When LOW, REFCLK and RCLKn/RCLKNn are
1/10th the baud rate. When HIGH, they are 1/20th the baud rate.
13W
FLOCK
I
TTL
Frequency LOCKed Mode. When HIGH, indicates that each transmit
channel’s REFCLK is frequency-locked to the receive channel’s word
clock. Controls rate matching (IDLE delete/duplicate) logic along with the
WSI input as per Table 6.
12D
BIST
I
TTL
Built-In Self-Test Mode. When HIGH, all transmit channels continuously
send a 256 byte incrementing data pattern, and all receive channels signal
correct reception of the test pattern with a LOW on the TBERRn outputs.
12V
ENDEC
I
TTL
ENcoder/DECoder Enable. When HIGH, the VSC7217 is configured for 8
bit operation and internal 8B/10B encoding is enabled. When LOW, a 10-bit
interface is used and internal 8B/10B encoding is bypassed.
12U
RESETN
I
TTL
RESETN Input. When asserted LOW, the transmitter input skew buffers and
receiver elastic buffers are recentered.
20L
WSI
I
TTL
Word Sync Input. Used to control channel alignment and IDLE character
insertion/deletion as defined in Table 6.
17L
WSO
O
TTL
Word Sync Output. Used to set initial channel word alignment, and to
maintain alignment by controlling IDLE character insertion/deletion.
15A
TCK
I
TTL
JTAG Test Access Port test clock input.
13B
TMS
I
TTL
JTAG Test Access Port test mode select input.
14A
TDI
I
TTL
JTAG Test Access Port test data input.
19K
TDO
O
TTL
JTAG Test Access Port test data output.
13A
TRSTN
I
TTL
JTAG Test Access Port test logic reset input.
14Y
RSVD
I
N/A
Reserved Inputs for Future Use. Set HIGH for compatibility reasons.
13Y
RSVD
I
N/A
Reserved Inputs for Future Use. Set HIGH for compatibility reasons.
2L, 4L
VDDA
VDD
Analog Power Supply to PLL.
2K, 4K
VSSA
GND
Analog Ground to PLL.
11B, 11Y,
13D, 15Y,
1C, 1V,
20K, 3L,
4D, 4U,
5C, 5V, 8V
VDDD
VDD
Digital Power Supply.
Page 32
 VITESSE SEMICONDUCTOR CORPORATION
741 Calle Plano, Camarillo, CA 93012 • 805/388-3700 • FAX: 805/987-5896
G52325-0, Rev. 3.0
6/14/00
VITESSE
SEMICONDUCTOR CORPORATION
Preliminary Datasheet
VSC7217
Multi-Gigabit Interconnect Chip
Pin
Name
11A, 13C,
13U, 19L,
3C, 3K, 3V,
4C, 4E, 4T,
4V, 6V, 7A,
7C, 8W
VSSD
GND
Digital Ground.
14B, 14W,
17B, 17D,
17H, 17P,
17U, 17W,
18L, 19B,
19E, 19G,
19J, 19N,
19T, 19W
VDDT
VDD
TTL Output Power Supply.
14C, 14V,
16B, 16W,
18C, 18F,
18J, 18M,
18R, 18V,
19A, 19Y,
20D, 20G,
20N, 20T
VSST
GND
TTL Output Ground.
2P
3R
3M
1P
3J
1G
2G
3F
VDDPA
VDDRA
VDDPB
VDDRB
VDDPC
VDDRC
VDDPD
VDDRD
VDD
PECL Output Power Supply for PTXA.
PECL Output Power Supply for RTXA.
PECL Output Power Supply for PTXB.
PECL Output Power Supply for RTXB.
PECL Output Power Supply for PTXC.
PECL Output Power Supply for RTXC.
PECL Output Power Supply for PTXD.
PECL Output Power Supply for RTXD.
If use of an output is not necessary, leave the power supply pin open.
G52325-0, Rev. 3.0
6/14/00
I/O
Type
Pin Description
 VITESSE SEMICONDUCTOR CORPORATION
741 Calle Plano, Camarillo, CA 93012 • 805/388-3700 • FAX: 805/987-5896
Page 33
VITESSE
SEMICONDUCTOR CORPORATION
Preliminary Datasheet
VSC7217
Mutli-Gigabit Interconnect Chip
Package Thermal Considerations
The VSC7217 is packaged in a 256-pin, 27mm, thermally enhanced BGA in a 20x20 array which offers
excellent electrical characteristics, good thermal performance and small size. This package uses an industrystandard footprint. The package construction is shown in Figure 22.
Figure 22: Package Cross Section
Adhesive
Copper Heat Spreader
Die Attach Epoxy
Polyimide Dielectric
Encapsulant
Die
Wirebond
Eutectic Solder Balls
Table 18: Thermal Resistance
Symbol
Description
Value
Units
θca
Thermal resistance from case-to-ambient in still air including conduction
through the leads.
15
oC/W
θca-100
Thermal resistance from case-to-ambient with 100 LFM airflow
13
oC/W
θca-200
Thermal resistance from case-to-ambient with200 LFM airflow
12
oC/W
θca-400
Thermal resistance from case-to-ambient with 400 LFM airflow
10.5
oC/W
θca-600
Thermal resistance from case-to-ambient with 600 LFM airflow
10
oC/W
The VSC7217 is designed to operate with a case temperature up to 95oC. The user must guarantee that this
case temperature specification is not violated. With the Thermal Resistances listed in Table 18, the VSC7217
can operate in still air ambient temperatures of 50oC [ 50oC = 95oC - ( 3.0W * 15oC/W ) ]. If the ambient air
temperature exceeds these limits, some form of cooling through a heat sink or an increase in airflow must be
provided.
Moisture Sensitivity Level
This device is rated at with a Moisture Sensitivity Level 3 rating. Refer to Application Note AN-20 for
appropriate handling procedures.
Page 34
 VITESSE SEMICONDUCTOR CORPORATION
741 Calle Plano, Camarillo, CA 93012 • 805/388-3700 • FAX: 805/987-5896
G52325-0, Rev. 3.0
6/14/00
VITESSE
SEMICONDUCTOR CORPORATION
Preliminary Datasheet
VSC7217
Multi-Gigabit Interconnect Chip
Package Information
256-pin BGA
1.27 Typ
A
B
C
D
E
F
G
H
J
K
L
M
N
P
R
T
U
V
W
Y
27.0
20
19
18
17
16
15
14
13
12
11
10
9
8
7
6
5
4
3
2
1
Pin A1 Indicator
TOP VIEW
27.0
BOTTOM VIEW
1.40 Typ
G52325-0, Rev. 3.0
6/14/00
 VITESSE SEMICONDUCTOR CORPORATION
741 Calle Plano, Camarillo, CA 93012 • 805/388-3700 • FAX: 805/987-5896
Page 35
VITESSE
SEMICONDUCTOR CORPORATION
Preliminary Datasheet
VSC7217
Mutli-Gigabit Interconnect Chip
Ordering Information
The part number for this product is formed by a combination of the device number and the package style:
VSC7217
xx
Device Type
Multi-Gigabit Interconnect Chip
Package
UC: 256-Pin, 27mm BGA
Marking Information
The package is marked with three lines of text as shown:
Pin 1 Identifier
{
{
####AAAA
{
Date Code
{
VSC7217UC
Part Number
VITESSE
Package Suffix
Lot Tracking Code
Notice
This document contains information about a new product during its fabrication or sampling phase of development. The information in this document is based on design targets, simulation results or early prototype test
results. Characteristic data and other specifications are subject to change without notice. Therefore the reader is
cautioned to confirm that this data sheet is current prior to design or order placement.
Warning
Vitesse Semiconductor Corporation’s products are not intended for use in life support appliances, devices
or systems. Use of a Vitesse product in such applications without the written consent is prohibited.
Page 36
 VITESSE SEMICONDUCTOR CORPORATION
741 Calle Plano, Camarillo, CA 93012 • 805/388-3700 • FAX: 805/987-5896
G52325-0, Rev. 3.0
6/14/00