Obsolete Device 27C64 64K (8K x 8) CMOS EPROM 28 27 26 25 24 23 22 21 20 19 18 17 16 15 VCC PGM NC A8 A9 A11 OE A10 CE O7 O6 O5 O4 O3 30 31 1 32 2 5 29 6 28 7 8 9 10 27 26 25 24 A8 A9 A11 NC OE A10 CE O7 O6 20 19 21 18 22 13 17 23 12 16 11 15 A6 A5 A4 A3 A2 A1 A0 NC O0 3 4 A7 A12 VPP NU Vcc PGM NC PLCC 14 The Microchip Technology Inc. 27C64 is a CMOS 64K bit (electrically) Programmable Read Only Memory. The device is organized as 8K words by 8 bits (8K bytes). Accessing individual bytes from an address transition or from power-up (chip enable pin going low) is accomplished in less than 120 ns. CMOS design and processing enables this part to be used in systems where reduced power consumption and high reliability are requirements. •1 2 3 4 5 6 7 8 9 10 11 12 13 14 VPP A12 A7 A6 A5 A4 A3 A2 A1 A0 O0 O1 O2 VSS 27C64 DESCRIPTION DIP/SOIC 27C64 • High speed performance - 120 ns access time available • CMOS Technology for low power consumption - 20 mA Active current - 100 µA Standby current • Factory programming available • Auto-insertion-compatible plastic packages • Auto ID aids automated programming • Separate chip enable and output enable controls • High speed “express” programming algorithm • Organized 8K x 8: JEDEC standard pinouts - 28-pin Dual-in-line package - 32-pin PLCC Package - 28-pin SOIC package - Tape and reel • Available for the following temperature ranges - Commercial: 0°C to +70°C - Industrial: -40°C to +85°C PACKAGE TYPES O1 O2 VSS NU O3 O4 O5 FEATURES A complete family of packages is offered to provide the most flexibility in applications. For surface mount applications, PLCC or SOIC packaging is available. Tape and reel packaging is also available for PLCC or SOIC packages. 2004 Microchip Technology Inc. DS11107M-page 1 27C64 1.0 ELECTRICAL CHARACTERISTICS 1.1 Maximum Ratings* TABLE 1-1: Name PIN FUNCTION TABLE Function VCC and input voltages w.r.t. VSS ....... -0.6V to + 7.25V A0-A12 VPP voltage w.r.t. VSS during programming .......................................... -0.6V to +14V CE Chip Enable OE Output Enable Voltage on A9 w.r.t. VSS ...................... -0.6V to +13.5V Address Inputs Output voltage w.r.t. VSS ................-0.6V to VCC +1.0V PGM Program Enable Storage temperature ..........................-65°C to +150°C VPP Programming Voltage Ambient temp. with power applied .....-65°C to +125°C O0 - O7 *Notice: Stresses above those listed under “Maximum Ratings” may cause permanent damage to the device. This is a stress rating only and functional operation of the device at those or any other conditions above those indicated in the operation listings of this specification is not implied. Exposure to maximum rating conditions for extended periods may affect device reliability. VCC +5V Power Supply VSS Ground NC No Connection; No Internal Connections NU Not Used; No External Connection Is Allowed TABLE 1-2: Data Output READ OPERATION DC CHARACTERISTICS VCC = +5V (±10%) Commercial: Tamb = 0°C to +70°C Industrial: Tamb = -40°C to +85°C Parameter Part* Status Symbol Min Max Units Conditions Input Voltages all Logic "1" Logic "0" VIH VIL 2.0 -0.5 VCC+1 0.8 V V Input Leakage all — ILI -10 10 µA VIN = 0 to VCC Output Voltages all Logic "1" Logic "0" VOH VOL 2.4 0.45 V V IOH = -400 µA IOL = 2.1 mA Output Leakage all — ILO -10 10 µA VOUT = 0V to VCC Input Capacitance all — CIN — 6 pF VIN = 0V; Tamb = 25°C; f = 1 MHz Output Capacitance all — COUT — 12 pF VOUT = 0V; Tamb = 25°C; f = 1 MHz Power Supply Current, Active C I TTL input TTL input ICC1 ICC2 — — 20 25 mA mA VCC = 5.5V; VPP = VCC; f = 1 MHz; OE = CE = VIL; IOUT = 0 mA; VIL = -0.1 to 0.8V; VIH = 2.0 to VCC; Note 1 Power Supply Current, Standby C I all TTL input TTL input CMOS input ICC(S) — — — — — 2 3 100 mA mA µA all all Read Mode Read Mode IPP VPP VCC-0.7 100 VCC µA V IPP Read Current VPP Read Voltage CE = VCC ± 0.2V VPP = 5.5V * Parts: C=Commercial Temperature Range; I =Industrial Temperature Range. Note 1: Typical active current increases .5 mA per MHz up to operating frequency for all temperature ranges. DS11107M-page 2 2004 Microchip Technology Inc. 27C64 TABLE 1-3: READ OPERATION AC CHARACTERISTICS AC Testing Waveform: Output Load: Input Rise and Fall Times: Ambient Temperature: 27C64-12 Parameter VIH = 2.4V and VIL = 0.45V; VOH = 2.0V VOL = 0.8V 1 TTL Load + 100 pF 10 ns Commercial: Tamb = 0°C to +70°C Industrial: Tamb = -40°C to +85°C 27C64-15 27C64-17 27C64-20 27C64-25 Sym Units Conditions Min Max Min Max Min Max Min Max Min Max Address to Output Delay tACC — 120 — 150 — 170 — 200 — 250 ns CE = OE = VIL CE to Output Delay tCE — 120 — 150 — 170 — 200 — 250 ns OE = VIL OE to Output Delay tOE — 65 — 70 — 70 — 75 — 100 ns CE = VIL CE or OE to O/P High Impedance tOFF 0 50 0 50 0 50 0 55 0 60 ns Output Hold from Address CE or OE, whichever occurs first tOH 0 — 0 — 0 — 0 — 0 — ns FIGURE 1-1: READ WAVEFORMS Note 1: tOFF is specified for OE or CE, whichever occurs first. 2: OE may be delayed up to tCE - tOE after the falling edge of CE without impact on tCE. 3: This parameter is sampled and is not 100% tested. 2004 Microchip Technology Inc. DS11107M-page 3 27C64 TABLE 1-4: PROGRAMMING DC CHARACTERISTICS Ambient Temperature: Tamb = 25°C ± 5°C VCC = 6.5V ± 0.25V, VPP = VH = 13.0V ± 0.25V Parameter Status Symbol Min Max. Units Input Voltages Logic”1” Logic”0” VIH VIL 2.0 -0.1 VCC+1 0.8 V V Input Leakage — ILI -10 10 µA VIN = 0V to VCC Logic”1” Logic”0” VOH VOL 2.4 — — 0.45 V V IOH = -400 µA IOL = 2.1 mA VCC Current, program & verify — ICC2 — 20 mA Note 1 VPP Current, program — IPP2 — 25 mA Note 1 A9 Product Identification — VH 11.5 12.5 V Output Voltages Conditions Note 1: VCC must be applied simultaneously or before VPP and removed simultaneously or after VPP. TABLE 1-5: PROGRAMMING AC CHARACTERISTICS for Program, Program Verify and Program Inhibit Modes Parameter AC Testing Waveform: VIH=2.4V and VIL=0.45V; VOH=2.0V; VOL=0.8V Ambient Temperature: Tamb=25°C ±5°C VCC= 6.5V ± 0.25V, VPP = VH = 13.0V ± 0.25V Symbol Min Max Units Address Set-Up Time tAS 2 — µs Data Set-Up Time tDS 2 — µs Data Hold Time tDH 2 — µs Address Hold Time tAH 0 — µs Float Delay (2) tDF 0 130 ns VCC Set-Up Time tVCS 2 — µs Program Pulse Width (1) tPW 95 105 µs CE Set-Up Time tCES 2 — µs OE Set-Up Time tOES 2 — µs VPP Set-Up Time tVPS 2 — µs Data Valid from OE tOE — 100 ns Remarks 100 µs typical Note 1: For express algorithm, initial programming width tolerance is 100 µs ±5%. 2: This parameter is only sampled and not 100% tested. Output float is defined as the point where data is no longer driven (see timing diagram). DS11107M-page 4 2004 Microchip Technology Inc. 27C64 FIGURE 1-2: PROGRAMMING WAVEFORMS (1) TABLE 1-6: MODES Operation Mode CE OE PGM VPP A9 O0 - O7 Read VIL VIL VIH VCC X DOUT Program VIL VIH VIL VH X DIN Program Verify VIL VIL VIH VH X DOUT Program Inhibit VIH X X VH X High Z Standby VIH X X VCC X High Z Output Disable VIL VIH VIH VCC X High Z Identity VIL VIL VIH VCC VH Identity Code X = Don’t Care 1.2 Read Mode (See Timing Diagrams and AC Characteristics) Read Mode is accessed when a) b) For Read operations, if the addresses are stable, the address access time (tACC) is equal to the delay from CE to output (tCE). Data is transferred to the output after a delay from the falling edge of OE (tOE). the CE pin is low to power up (enable) the chip the OE pin is low to gate the data to the output pins 2004 Microchip Technology Inc. DS11107M-page 5 27C64 1.3 Standby Mode The standby mode is defined when the CE pin is high (VIH) and a program mode is not defined. When these conditions are met, the supply current will drop from 20 mA to 100 µA. 1.4 Output Enable This feature eliminates bus contention in microprocessor-based systems in which multiple devices may drive the bus. The outputs go into a high impedance state when the following condition is true: • The OE and PGM pins are both high. 1.5 Erase Mode (U.V. Windowed Versions) Windowed products offer the capability to erase the memory array. The memory matrix is erased to the all 1’s state when exposed to ultraviolet light. To ensure complete erasure, a dose of 15 watt-second/cm2 is required. This means that the device window must be placed within one inch and directly underneath an ultraviolet lamp with a wavelength of 2537 Angstroms, intensity of 12,000µW/cm2 for approximately 20 minutes. 1.6 Programming Mode The Express Algorithm has been developed to improve the programming throughput times in a production environment. Up to ten 100-microsecond pulses are applied until the byte is verified. No overprogramming is required. A flowchart of the express algorithm is shown in Figure 1-3. Programming takes place when: a) b) c) d) e) VCC is brought to the proper voltage, VPP is brought to the proper VH level, the CE pin is low, the OE pin is high, and the PGM pin is low. Since the erased state is “1” in the array, programming of “0” is required. The address to be programmed is set via pins A0-A12 and the data to be programmed is presented to pins O0-O7. When data and address are stable, OE is high, CE is low and a low-going pulse on the PGM line programs that location. DS11107M-page 6 1.7 Verify After the array has been programmed it must be verified to ensure all the bits have been correctly programmed. This mode is entered when all the following conditions are met: VCC is at the proper level, VPP is at the proper VH level, the CE line is low, the PGM line is high, and the OE line is low. a) b) c) d) e) 1.8 Inhibit When programming multiple devices in parallel with different data, only CE or PGM need be under separate control to each device. By pulsing the CE or PGM line low on a particular device in conjunction with the PGM or CE line low, that device will be programmed; all other devices with CE or PGM held high will not be programmed with the data, although address and data will be available on their input pins (i.e., when a high level is present on CE or PGM); and the device is inhibited from programming. 1.9 Identity Mode In this mode, specific data is output which identifies the manufacturer as Microchip Technology Inc. and device type. This mode is entered when Pin A9 is taken to VH (11.5V to 12.5V). The CE and OE lines must be at VIL. A0 is used to access any of the two non-erasable bytes whose data appears on O0 through O7. Pin Identity Manufacturer Device Type* Input Output H e x A0 0 O O O O O O O 7 6 5 4 3 2 1 0 VIL VIH 0 0 1 0 1 0 0 1 29 0 0 0 0 0 0 1 0 02 * Code subject to change 2004 Microchip Technology Inc. 27C64 FIGURE 1-3: PROGRAMMING EXPRESS ALGORITHM 2004 Microchip Technology Inc. DS11107M-page 7 27C64 27C64 Product Identification System To order or to obtain information, e.g., on pricing or delivery, please use the listed part numbers, and refer to the factory or the listed sales offices. 27C64 – 25 I /P Package: Temperature Range: DS11107M-page 8 L = Plastic Leaded Chip Carrier P = Plastic DIP (600 Mil) SO = Plastic SOIC (300 Mil) Blank = 0°C to +70°C I = –40°C to +85°C Access Time: 12 15 17 20 25 Device: 27C64 = = = = = 120 ns 150 ns 170 ns 200 ns 250 ns 64K (8K x 8) CMOS EPROM 2004 Microchip Technology Inc. Note the following details of the code protection feature on Microchip devices: • Microchip products meet the specification contained in their particular Microchip Data Sheet. • Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the intended manner and under normal conditions. • There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data Sheets. Most likely, the person doing so is engaged in theft of intellectual property. • Microchip is willing to work with the customer who is concerned about the integrity of their code. • Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not mean that we are guaranteeing the product as “unbreakable.” Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our products. Attempts to break Microchip’s code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act. Information contained in this publication regarding device applications and the like is intended through suggestion only and may be superseded by updates. It is your responsibility to ensure that your application meets with your specifications. No representation or warranty is given and no liability is assumed by Microchip Technology Incorporated with respect to the accuracy or use of such information, or infringement of patents or other intellectual property rights arising from such use or otherwise. Use of Microchip’s products as critical components in life support systems is not authorized except with express written approval by Microchip. No licenses are conveyed, implicitly or otherwise, under any intellectual property rights. Trademarks The Microchip name and logo, the Microchip logo, Accuron, dsPIC, KEELOQ, microID, MPLAB, PIC, PICmicro, PICSTART, PRO MATE, PowerSmart, rfPIC, and SmartShunt are registered trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. AmpLab, FilterLab, MXDEV, MXLAB, PICMASTER, SEEVAL, SmartSensor and The Embedded Control Solutions Company are registered trademarks of Microchip Technology Incorporated in the U.S.A. Analog-for-the-Digital Age, Application Maestro, dsPICDEM, dsPICDEM.net, dsPICworks, ECAN, ECONOMONITOR, FanSense, FlexROM, fuzzyLAB, In-Circuit Serial Programming, ICSP, ICEPIC, Migratable Memory, MPASM, MPLIB, MPLINK, MPSIM, PICkit, PICDEM, PICDEM.net, PICLAB, PICtail, PowerCal, PowerInfo, PowerMate, PowerTool, rfLAB, rfPICDEM, Select Mode, Smart Serial, SmartTel and Total Endurance are trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. SQTP is a service mark of Microchip Technology Incorporated in the U.S.A. All other trademarks mentioned herein are property of their respective companies. © 2004, Microchip Technology Incorporated, Printed in the U.S.A., All Rights Reserved. Printed on recycled paper. Microchip received ISO/TS-16949:2002 quality system certification for its worldwide headquarters, design and wafer fabrication facilities in Chandler and Tempe, Arizona and Mountain View, California in October 2003. The Company’s quality system processes and procedures are for its PICmicro® 8-bit MCUs, KEELOQ® code hopping devices, Serial EEPROMs, microperipherals, nonvolatile memory and analog products. In addition, Microchip’s quality system for the design and manufacture of development systems is ISO 9001:2000 certified. 2004 Microchip Technology Inc. DS11107M-page 9 WORLDWIDE SALES AND SERVICE AMERICAS China - Beijing Singapore Corporate Office Unit 706B Wan Tai Bei Hai Bldg. No. 6 Chaoyangmen Bei Str. Beijing, 100027, China Tel: 86-10-85282100 Fax: 86-10-85282104 200 Middle Road #07-02 Prime Centre Singapore, 188980 Tel: 65-6334-8870 Fax: 65-6334-8850 2355 West Chandler Blvd. Chandler, AZ 85224-6199 Tel: 480-792-7200 Fax: 480-792-7277 Technical Support: 480-792-7627 Web Address: www.microchip.com China - Chengdu 3780 Mansell Road, Suite 130 Alpharetta, GA 30022 Tel: 770-640-0034 Fax: 770-640-0307 Rm. 2401-2402, 24th Floor, Ming Xing Financial Tower No. 88 TIDU Street Chengdu 610016, China Tel: 86-28-86766200 Fax: 86-28-86766599 Boston China - Fuzhou 2 Lan Drive, Suite 120 Westford, MA 01886 Tel: 978-692-3848 Fax: 978-692-3821 Unit 28F, World Trade Plaza No. 71 Wusi Road Fuzhou 350001, China Tel: 86-591-7503506 Fax: 86-591-7503521 Atlanta Chicago 333 Pierce Road, Suite 180 Itasca, IL 60143 Tel: 630-285-0071 Fax: 630-285-0075 Dallas 16200 Addison Road, Suite 255 Addison Plaza Addison, TX 75001 Tel: 972-818-7423 Fax: 972-818-2924 Detroit Tri-Atria Office Building 32255 Northwestern Highway, Suite 190 Farmington Hills, MI 48334 Tel: 248-538-2250 Fax: 248-538-2260 Kokomo 2767 S. Albright Road Kokomo, IN 46902 Tel: 765-864-8360 Fax: 765-864-8387 Los Angeles 25950 Acero St., Suite 200 Mission Viejo, CA 92691 Tel: 949-462-9523 Fax: 949-462-9608 San Jose 1300 Terra Bella Avenue Mountain View, CA 94043 Tel: 650-215-1444 Fax: 650-961-0286 Toronto 6285 Northam Drive, Suite 108 Mississauga, Ontario L4V 1X5, Canada Tel: 905-673-0699 Fax: 905-673-6509 China - Hong Kong SAR Unit 901-6, Tower 2, Metroplaza 223 Hing Fong Road Kwai Fong, N.T., Hong Kong Tel: 852-2401-1200 Fax: 852-2401-3431 Taiwan Kaohsiung Branch 30F - 1 No. 8 Min Chuan 2nd Road Kaohsiung 806, Taiwan Tel: 886-7-536-4816 Fax: 886-7-536-4817 Taiwan Taiwan Branch 11F-3, No. 207 Tung Hua North Road Taipei, 105, Taiwan Tel: 886-2-2717-7175 Fax: 886-2-2545-0139 Taiwan Taiwan Branch 13F-3, No. 295, Sec. 2, Kung Fu Road Hsinchu City 300, Taiwan Tel: 886-3-572-9526 Fax: 886-3-572-6459 EUROPE China - Shanghai Austria Room 701, Bldg. B Far East International Plaza No. 317 Xian Xia Road Shanghai, 200051 Tel: 86-21-6275-5700 Fax: 86-21-6275-5060 Durisolstrasse 2 A-4600 Wels Austria Tel: 43-7242-2244-399 Fax: 43-7242-2244-393 China - Shenzhen Regus Business Centre Lautrup hoj 1-3 Ballerup DK-2750 Denmark Tel: 45-4420-9895 Fax: 45-4420-9910 Rm. 1812, 18/F, Building A, United Plaza No. 5022 Binhe Road, Futian District Shenzhen 518033, China Tel: 86-755-82901380 Fax: 86-755-8295-1393 China - Shunde Room 401, Hongjian Building, No. 2 Fengxiangnan Road, Ronggui Town, Shunde District, Foshan City, Guangdong 528303, China Tel: 86-757-28395507 Fax: 86-757-28395571 China - Qingdao Rm. B505A, Fullhope Plaza, No. 12 Hong Kong Central Rd. Qingdao 266071, China Tel: 86-532-5027355 Fax: 86-532-5027205 India Divyasree Chambers 1 Floor, Wing A (A3/A4) No. 11, O’Shaugnessey Road Bangalore, 560 025, India Tel: 91-80-22290061 Fax: 91-80-22290062 Japan ASIA/PACIFIC Yusen Shin Yokohama Building 10F 3-17-2, Shin Yokohama, Kohoku-ku, Yokohama, Kanagawa, 222-0033, Japan Tel: 81-45-471- 6166 Fax: 81-45-471-6122 Australia Korea Microchip Technology Australia Pty Ltd Unit 32 41 Rawson Street Epping 2121, NSW Sydney, Australia Tel: 61-2-9868-6733 Fax: 61-2-9868-6755 168-1, Youngbo Bldg. 3 Floor Samsung-Dong, Kangnam-Ku Seoul, Korea 135-882 Tel: 82-2-554-7200 Fax: 82-2-558-5932 or 82-2-558-5934 Denmark France Parc d’Activite du Moulin de Massy 43 Rue du Saule Trapu Batiment A - ler Etage 91300 Massy, France Tel: 33-1-69-53-63-20 Fax: 33-1-69-30-90-79 Germany Steinheilstrasse 10 D-85737 Ismaning, Germany Tel: 49-89-627-144-0 Fax: 49-89-627-144-44 Italy Via Salvatore Quasimodo, 12 20025 Legnano (MI) Milan, Italy Tel: 39-0331-742611 Fax: 39-0331-466781 Netherlands Waegenburghtplein 4 NL-5152 JR, Drunen, Netherlands Tel: 31-416-690399 Fax: 31-416-690340 United Kingdom 505 Eskdale Road Winnersh Triangle Wokingham Berkshire, England RG41 5TU Tel: 44-118-921-5869 Fax: 44-118-921-5820 07/12/04 2004 Microchip Technology Inc.