Pressure Freescale Semiconductor MPX2300DT1 Rev 8, 04/2010 High Volume Pressure Sensor for Disposable Applications Freescale Semiconductor has developed a low cost, high volume, miniature pressure sensor package which is ideal as a sub-module component or a disposable unit. The unique concept of the Chip Pak allows great flexibility in system design while allowing an economic solution for the designer. This new chip carrier package uses Freescale Semiconductor's unique sensor die with its piezoresistive technology, along with the added feature of on-chip, thin-film temperature compensation and calibration. NOTE:Freescale Semiconductor is also offering the Chip Pak package in application-specific configurations, which will have an “SPX” prefix, followed by a four-digit number, unique to the specific customer Features • • • • • Low Cost Integrated Temperature Compensation and Calibration Ratiometric to Supply Voltage Polysulfone Case Material (ISO 10993) Provided in Easy-to-Use Tape and Reel MPX2300DT1 MPX2301DT1 Pressure Sensors 0 to 300 mmHg (0 to 40 kPa) Application Examples • • • • • Medical Diagnostics Infusion Pumps Blood Pressure Monitors Pressure Catheter Applications Patient Monitoring ORDERING INFORMATION Device Name MPX2300DT1 MPX2301DT1 Package Options Tape and Reel Tape and Reel Case No. 423A 423A Gauge Pressure Type Differential • • Absolute Device Marking Date Code, Lot ID Date Code, Lot ID CHIP PAK PACKAGE MPX2300DT1/MPX2301DT1 CASE 423A-03 NOTE: The die and wire bonds are exposed on the front side of the Chip Pak (pressure is applied to the backside of the device). Front side die and wire protection must be provided in the customer's housing. Use caution when handling the devices during all processes. © Freescale Semiconductor, Inc., 2005, 2008, 2010. All rights reserved. Pressure The MPX2300DT1/MPX2301DT1 Pressure Sensors have been designed for medical usage by combining the performance of Freescale's shear stress pressure sensor design and the use of biomedically approved materials. Materials with a proven history in medical situations have been chosen to provide a sensor that can be used with confidence in applications, such as invasive blood pressure monitoring. It can be sterilized using ethylene oxide. The portions of the pressure sensor that are required to be biomedically approved are the rigid housing and the gel coating. The rigid housing is molded from a white, medical grade polysulfone that has passed extensive biological testing including: 10993-5:1999, 10993-10:2002, and 1099311:1993. A silicone dielectric gel covers the silicon piezoresistive sensing element. The gel is a nontoxic, nonallergenic elastomer system which meets all USP XX Biological Testing Class V requirements. The properties of the gel allow it to transmit pressure uniformly to the diaphragm surface, while isolating the internal electrical connections from the corrosive effects of fluids, such as saline solution. The gel provides electrical isolation sufficient to withstand defibrillation testing, as specified in the proposed Association for the Advancement of Medical Instrumentation (AAMI) Standard for blood pressure transducers. A biomedically approved opaque filler in the gel prevents bright operating room lights from affecting the performance of the sensor. The MPX2301DT1 is a reduced gel option. MPX2300DT1 2 Sensors Freescale Semiconductor Pressure Maximum Ratings Table 1. Maximum Ratings(1) Rating Symbol Value Unit Maximum Pressure (Backside) Pmax 125 PSI Storage Temperature Tstg -25 to +85 °C Operating Temperature TA +15 to +40 °C 1. Exposure beyond the specified limits may cause permanent damage or degradation to the device. Operating Characteristics Table 2. Operating Characteristics (VS = 6 Vdc, TA = 25°C unless otherwise noted) Characteristics Symbol Min Typ Max Unit Pressure Range POP 0 — 300 mmHg Supply Voltage(1) VS — 6.0 10 Vdc Supply Current Io — 1.0 — mAdc Voff -0.75 — 0.75 mV Zero Pressure Offset Sensitivity Full Scale Span(2) Linearity + Hysteresis (3) Accuracy(9) VS = 6 V, P = 101 to 200 mmHg (9) VS = 6 V, P = 201 to 300 mmHg — 4.95 5.0 5.05 μV/V/mmHg VFSS 2.976 3.006 3.036 mV — -1.5 — 1.5 %VFSS — -1.5 — 1.5 % — -3.0 — 3.0 % TCS -0.1 — +0.1 %/°C TCVFSS -0.1 — +0.1 %/°C TCVoff -9.0 — +9.0 μV/°C Input Impedance Zin 1800 — 4500 Ω Output Impedance Zout 270 — 330 Ω RCAL (150 kΩ)(6) RCAL 97 100 103 mmHg Response Time (10% to 90%) tR — 1.0 — ms Temperature Error Band — 0 — 85 °C — — ±0.5 — %VFSS Accuracy Temperature Effect on Sensitivity Temperature Effect on Full Scale Span(4) (5) Temperature Effect on Offset (7) (8) Stability 1. Recommended voltage supply: 6 V ± 0.2 V, regulated. Sensor output is ratiometric to the voltage supply. Supply voltages above +10 V may induce additional error due to device self-heating. 2. Measured at 6.0 Vdc excitation for 100 mmHg pressure differential. VFSS and FSS are like terms representing the algebraic difference between full scale output and zero pressure offset. 3. Maximum deviation from end-point straight line fit at 0 and 200 mmHg. 4. Slope of end-point straight line fit to full scale span at 15°C and +40°C relative to +25°C. 5. Slope of end-point straight line fit to zero pressure offset at 15°C and +40°C relative to +25°C. 6. Offset measurement with respect to the measured sensitivity when a 150 k resistor is connected to VS and S+ output. 7. For a 0 to 300 mmHg pressure step change. 8. Stability is defined as the maximum difference in output at any pressure within POP and temperature within +10°C to +85°C after: • 1000 temperature cycles, -40°C to +125°C. • 1.5 million pressure cycles, 0 to 300 mmHg. MPX2300DT1 Sensors Freescale Semiconductor 3 Pressure PACKAGE DIMENSIONS A M C L F N B 1 2 3 4 V K DETAIL A -T- D1 G J H FRONT VIEW E END VIEW AC F NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. AA AB AD D2 DETAIL A BACK VIEW DIM A B C D1 D2 E F G H J K L M N V AA AB AC AD INCHES MILLIMETERS MIN MAX MIN MAX 0.240 0.260 6.10 6.60 0.350 0.370 8.89 9.40 0.140 0.150 3.56 3.81 0.012 0.020 0.30 0.51 0.014 0.022 0.36 0.56 0.088 0.102 2.24 2.59 0.123 0.128 3.12 3.25 0.045 0.055 1.14 1.40 0.037 0.047 0.94 1.19 0.007 0.011 0.18 0.28 0.120 0.140 3.05 3.56 0.095 0.105 2.41 2.67 0.165 0.175 4.19 4.45 0.223 0.239 5.66 6.07 0.105 0.115 2.67 2.92 0.095 0.107 2.41 2.72 0.015 0.035 0.38 0.89 0.120 0.175 3.05 4.45 0.100 0.115 2.54 2.92 STYLE 1: PIN 1. 2. 3. 4. VCC +OUT -OUT GROUND CASE 423A-03 ISSUE C CHIP PAK PACKAGE MPX2300DT1 4 Sensors Freescale Semiconductor How to Reach Us: Home Page: www.freescale.com Web Support: http://www.freescale.com/support USA/Europe or Locations Not Listed: Freescale Semiconductor, Inc. Technical Information Center, EL516 2100 East Elliot Road Tempe, Arizona 85284 1-800-521-6274 or +1-480-768-2130 www.freescale.com/support Europe, Middle East, and Africa: Freescale Halbleiter Deutschland GmbH Technical Information Center Schatzbogen 7 81829 Muenchen, Germany +44 1296 380 456 (English) +46 8 52200080 (English) +49 89 92103 559 (German) +33 1 69 35 48 48 (French) www.freescale.com/support Japan: Freescale Semiconductor Japan Ltd. Headquarters ARCO Tower 15F 1-8-1, Shimo-Meguro, Meguro-ku, Tokyo 153-0064 Japan 0120 191014 or +81 3 5437 9125 [email protected] Asia/Pacific: Freescale Semiconductor China Ltd. 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