Freescale Semiconductor Technical Data MPXV5050VC6T1 Rev 1, 05/2005 High Temperature Accuracy Integrated Silicon Pressure Sensor On-Chip Signal Conditioned, Temperature Compensated and Calibrated MPXV5050VC6T1 INTEGRATED PRESSURE SENSOR –50 to 0 kPa (–7.25 to 0 psi) 0.1 to 4.6 Volts Output The MPXV5050VC6T1 sensor integrates on-chip, bipolar op amp circuitry and thin film resistor networks to provide a high output signal and temperature compensation. The small form factor and high reliability of on-chip integration make the Freescale Semiconductor, Inc. pressure sensor a logical and economical choice for the system designer. The MPXV5050VC6T1 piezoresistive transducer is a state-of-the-art, monolithic, signal conditioned, silicon pressure sensor. This sensor combines advanced micromachining techniques, thin film metallization, and bipolar semiconductor processing to provide an accurate, high level analog output signal that is proportional to applied pressure. Figure 1 shows a block diagram of the internal circuitry integrated on a pressure sensor chip. SMALL OUTLINE PACKAGE MPXV5050VC6T1 CASE 482A-01 Features • • • • • • • 2.5% Maximum Error over 0° to 85°C Ideally suited for Microprocessor or Microcontroller-Based Systems Temperature Compensated from Over –40° to +125°C Patented Silicon Shear Stress Strain Gauge Durable Thermoplastic (PPS) Surface Mount Package Easy-to-Use Chip Carrier Option Ideal for Automotive and Non-Automotive Applications PIN NUMBER(1) Typical Applications • Vacuum Pump Monitoring ORDERING INFORMATION Device Type Options Ported Vacuum, Element Axial Port Case No. MPX Series Order No. 482A MPXV5050VC6T1 Packing Options Device Marking 1 N/C 5 N/C 2 VS 6 N/C 3 GND 7 N/C 4 VOUT 8 N/C 1. Pins 1, 5, 6, 7, and 8 are internal device connections. Do not connect to external circuitry or ground. Pin 1 is noted by the notch in the lead. Tape & Reel MPXV5050VC6T1 VS Thin Film Temperature Compensation and Gain Stage #1 Sensing Element GND Gain Stage #2 and Ground Reference Shift Circuitry Vout Pins 1, 5, 6, 7, and 8 are NO CONNECTS Figure 1. Fully Integrated Pressure Sensor Schematic MPXV5050VC6T1 Sensors Freescale Semiconductor 1 Table 1. Maximum Ratings(1) Rating Symbol Value Units Maximum Pressure (P1 > P2) Pmax 200 kPa Storage Temperature Tstg –40° to +125° °C Operating Temperature TA –40° to +125° °C 1. Exposure beyond the specified limits may cause permanent damage or degradation to the device. Table 2. Operating Characteristics (VS = 5.0 Vdc, TA = 25°C unless otherwise noted, P1 > P2.) Characteristic Symbol Min Typ Max Unit Pressure Range POP –50 — 0 kPa Supply Voltage(1) VS 4.75 5.0 5.25 Vdc Supply Current Io — 7.0 10 mAdc (0 to 85°C) (Pdiff = 0 kPa) VFSO 4.488 4.6 4.713 Vdc Full Scale Span(3) @ VS = 5.0 Volts (0 to 85°C) VFSS — 4.5 — Vdc Accuracy(4) (0 to 85°C) — — — ±2.5 %VFSS V/P — 90 —- mV/kPa Response Time(5) tR — 1.0 —- ms Warm-Up Time(6) — — 20 —- ms Offset Stability(7) — — ±0.5 —- %VFSS Voff 0 0.1 0.213 Vdc Full Scale Output(2) @ VS = 5.0 Volts Sensitivity Pressure Offset(8) (0 to 85°C) 1. Device is ratiometric within this specified excitation range. 2. Full Scale Output (VFSO) is defined as the output voltage at the maximum or full rated pressure. 3. Full Scale Span (VFSS) is defined as the algebraic difference between the output voltage at full rated pressure and the output voltage at the minimum rated pressure. 4. Accuracy is the deviation in actual output from nominal output over the entire pressure range and temperature range as a percent of span at 25°C due to all sources of errors, including the following: • Linearity: Output deviation from a straight line relationship with pressure over the specified pressure range. • Temperature Hysteresis: Output deviation at any temperature within the operating temperature range, after the temperature is cycled to and from the minimum or maximum operating temperature points, with zero differential pressure applied. • Pressure Hysteresis: Output deviation at any pressure within the specified range, when this pressure is cycled to and from minimum or maximum rated pressure at 25°C. • TcSpan: Output deviation over the temperature range of 0° to 85°C, relative to 25°C. • TcOffset: Output deviation with minimum pressure applied, over the temperature range of 0° to 85°C, relative to 25°C. 5. Response Time is defined as the time for the incremental change in the output to go from 10% to 90% of its final value when subjected to a specified step change in pressure. 6. Warm-up Time is defined as the time required for the product to meet the specified output voltage after the pressure has been stabilized. 7. Offset Stability is the product's output deviation when subjected to 1000 hours of Pulsed Pressure, Temperature Cycling with Bias Test. 8. Offset (Voff) is defined as the output voltage at the minimum rated pressure. MPXV5050VC6T1 2 Sensors Freescale Semiconductor FLUOROSILICONE GEL DIE COAT +5 V STAINLESS STEEL CAP DIE P1 WIRE BOND OUTPUT Vout THERMOPLASTIC CASE Vs LEAD FRAME IPS 1.0 µF P2 0.01 µF GND 470 pF DIE BOND DIFFERENTIAL SENSING ELEMENT Figure 3. Typical Application Circuit (Output Source Current Operation) Figure 2. Cross-Sectional Diagram (not to scale) TRANSFER FUNCTION MPXV5050VC6T1 Transfer Function MPXV5050VC Series 5 3 Span Range (Typ) Output Voltage (V) 4 TYPICAL MAX 2 Output Range (Typ) Transfer Function: Vout = VS x (0.018 x P + 0.92) ± (PE x TM x 0.018 x Vs) Vs = 5.0 ± 0.25 vdc PE = 1.25 TM = 1 Temperature = 0 to 85°C MIN 1 0 –50 –40 –30 –20 –10 0 Offset (Typ) Pressure (kPa) Figure 4. Output versus Absolute Pressure Figure 4 shows the sensor output signal relative to pressure input. Typical minimum and maximum output curves are shown for operation over 0 to 85°C temperature range. The output will saturate outside of the rated pressure range. A fluorosilicone gel isolates the die surface and wire bonds from the environment, while allowing the pressure signal to be transmitted to the silicon diaphragm. The MPXV5050VC6T1 pressure sensor operating characteristics, internal reliability and qualification tests are based on use of dry air as the pressure media. Media other than dry air may have adverse effects on sensor performance and long-term reliability. Contact the factory for information regarding media compatibility in your application. MPXV5050VC6T1 Sensors Freescale Semiconductor 3 Transfer Function (MPXV5050VC6T1 Nominal Transfer Value: Vout = VS x (0.018 x P + 0.92) ± (Pressure Error x Temp Multi x 0.018 x VS) VS = 5.0 ± 0.25 V Temperature Error Band MPXV5050V 4.0 Break Points Temp 3.0 Temperature Error Factor Multiplier –40 0 to 85 +125 2.0 3 1 3 1.0 0.0 –40 –20 0 20 40 60 80 100 120 140 Temperature in °C NOTE: The Temperature Multiplier is a linear response from 0°C to –40°C and from 85°C to 125°C. Pressure Error Band MPXV5050V Error Limits for Pressure Pressure Error (kPa) 1.25 1.00 0.75 0 –50 –40 –30 –20 –10 0 Pressure (in kPa) –0.75 –1.00 –1.25 Pressure Error (Max) –50 to 0 kPa ±1.25 kPa MPXV5050VC6T1 4 Sensors Freescale Semiconductor MINIMUM RECOMMENDED FOOTPRINT FOR SMALL OUTLINE PACKAGE Surface mount board layout is a critical portion of the total design. The footprint for the semiconductor package must be the correct size to ensure proper solder connection interface between the board and the package. With the correct pad geometry, the packages will self-align when subjected to a solder reflow process. It is always recommended to fabricate boards with a solder mask layer to avoid bridging and/or shorting between solder pads, especially on tight tolerances and/or tight layouts. 0.100 TYP 2.54 0.660 16.76 0.060 TYP 8X 1.52 0.300 7.62 0.100 TYP 8X 2.54 inch mm Figure 5. SOP Footprint (Case 482A) MPXV5050VC6T1 Sensors Freescale Semiconductor 5 PACKAGE DIMENSIONS -A- D 4 0.25 (0.010) 5 N 8 PL M T B S A S NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. DIMENSION A AND B DO NOT INCLUDE MOLD PROTRUSION. 4. MAXIMUM MOLD PROTRUSION 0.15 (0.006). 5. ALL VERTICAL SURFACES 5˚ TYPICAL DRAFT. -BG 8 1 S W V C H J -TK M PIN 1 IDENTIFIER DIM A B C D G H J K M N S V W INCHES MIN MAX 0.415 0.425 0.415 0.425 0.500 0.520 0.038 0.042 0.100 BSC 0.002 0.010 0.009 0.011 0.061 0.071 0˚ 7˚ 0.444 0.448 0.709 0.725 0.245 0.255 0.115 0.125 MILLIMETERS MIN MAX 10.54 10.79 10.54 10.79 12.70 13.21 0.96 1.07 2.54 BSC 0.05 0.25 0.23 0.28 1.55 1.80 0˚ 7˚ 11.28 11.38 18.01 18.41 6.22 6.48 2.92 3.17 SEATING PLANE CASE 482A-01 ISSUE A SMALL OUTLINE PACKAGE MPXV5050VC6T1 6 Sensors Freescale Semiconductor NOTES MPXV5050VC6T1 Sensors Freescale Semiconductor 7 How to Reach Us: Home Page: www.freescale.com E-mail: [email protected] USA/Europe or Locations Not Listed: Freescale Semiconductor Technical Information Center, CH370 1300 N. Alma School Road Chandler, Arizona 85224 +1-800-521-6274 or +1-480-768-2130 [email protected] Europe, Middle East, and Africa: Freescale Halbleiter Deutschland GmbH Technical Information Center Schatzbogen 7 81829 Muenchen, Germany +44 1296 380 456 (English) +46 8 52200080 (English) +49 89 92103 559 (German) +33 1 69 35 48 48 (French) [email protected] Japan: Freescale Semiconductor Japan Ltd. Headquarters ARCO Tower 15F 1-8-1, Shimo-Meguro, Meguro-ku, Tokyo 153-0064 Japan 0120 191014 or +81 3 5437 9125 su[email protected] Asia/Pacific: Freescale Semiconductor Hong Kong Ltd. Technical Information Center 2 Dai King Street Tai Po Industrial Estate Tai Po, N.T., Hong Kong +800 2666 8080 [email protected] For Literature Requests Only: Freescale Semiconductor Literature Distribution Center P.O. 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