SCLS128D − DECEMBER 1982 − REVISED AUGUST 2003
LSTTL Loads
D Low Power Consumption, 80-µA Max ICC
D Typical tpd = 9 ns
D ±6-mA Output Drive at 5 V
D Low Input Current of 1 µA Max
D 3-State Outputs Drive Bus Lines or Buffer
Memory Address Registers
SN54HC240 . . . J OR W PACKAGE
SN74HC240 . . . DB, DW, N, NS, OR PW PACKAGE
(TOP VIEW)
20
2
19
3
18
4
17
5
16
6
15
7
14
8
13
9
12
10
11
2Y4
1A1
1OE
VCC
1
VCC
2OE
1Y1
2A4
1Y2
2A3
1Y3
2A2
1Y4
2A1
1A2
2Y3
1A3
2Y2
1A4
4
3 2 1 20 19
18
5
17
6
16
7
15
8
14
9 10 11 12 13
1Y1
2A4
1Y2
2A3
1Y3
2Y1
GND
2A1
1Y4
2A2
1OE
1A1
2Y4
1A2
2Y3
1A3
2Y2
1A4
2Y1
GND
SN54HC240 . . . FK PACKAGE
(TOP VIEW)
2OE
D Wide Operating Voltage Range of 2 V to 6 V
D High-Current Outputs Drive Up To 15
description/ordering information
These octal buffers and line drivers are designed specifically to improve both the performance and density of
3-state memory address drivers, clock drivers, and bus-oriented receivers and transmitters. The ’HC240
devices are organized as two 4-bit buffers/drivers with separate output-enable (OE) inputs. When OE is low,
the device passes inverted data from the A inputs to the Y outputs. When OE is high, the outputs are in the
high-impedance state.
ORDERING INFORMATION
PACKAGE†
TA
PDIP − N
SN74HC240N
Tube of 25
SN74HC240DW
Reel of 2000
SN74HC240DWR
SOP − NS
Reel of 2000
SN74HC240NSR
HC240
SSOP − DB
Reel of 2000
SN74HC240DBR
HC240
Tube of 70
SN74HC240PW
Reel of 2000
SN74HC240PWR
Reel of 250
SN74HC240PWT
CDIP − J
Tube of 20
SNJ54HC240J
SNJ54HC240J
CFP − W
Tube of 85
SNJ54HC240W
SNJ54HC240W
LCCC − FK
Tube of 55
SNJ54HC240FK
TSSOP − PW
−55°C
−55
C to 125
125°C
C
TOP-SIDE
MARKING
Tube of 20
SOIC − DW
−40°C to 85°C
ORDERABLE
PART NUMBER
SN74HC240N
HC240
HC240
SNJ54HC240FK
† Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are
available at www.ti.com/sc/package.
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
Copyright 2003, Texas Instruments Incorporated
!"# $ %&'# "$ (&)*%"# +"#',
+&%#$ %! # $('%%"#$ (' #-' #'!$ '."$ $#&!'#$
$#"+"+ /""#0, +&%# (%'$$1 +'$ # '%'$$"*0 %*&+'
#'$#1 "** (""!'#'$,
(+&%#$ %!(*"# # 23 "** (""!'#'$ "' #'$#'+
&*'$$ #-'/$' #'+, "** #-' (+&%#$ (+&%#
(%'$$1 +'$ # '%'$$"*0 %*&+' #'$#1 "** (""!'#'$,
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
1
SCLS128D − DECEMBER 1982 − REVISED AUGUST 2003
FUNCTION TABLE
(each buffer/driver)
INPUTS
OE
A
OUTPUT
Y
L
H
L
L
L
H
H
X
Z
logic diagram (positive logic)
1OE
1A1
1A2
1A3
1A4
1
2OE
2
4
18
16
6
14
8
12
1Y1
2A1
1Y2
2A2
1Y3
2A3
1Y4
2A4
19
11
9
13
7
15
5
17
3
2Y1
2Y2
2Y3
2Y4
absolute maximum ratings over operating free-air temperature range (unless otherwise noted)†
Supply voltage range, VCC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.5 V to 7 V
Input clamp current, IIK (VI < 0 or VI > VCC) (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±20 mA
Output clamp current, IOK (VO < 0 or VO > VCC) (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±20 mA
Continuous output current, IO (VO = 0 to VCC) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±35 mA
Continuous current through VCC or GND . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±70 mA
Package thermal impedance, θJA (see Note 2): DB package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 70°C/W
DW package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 58°C/W
N package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 69°C/W
NS package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 60°C/W
PW package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 83°C/W
Storage temperature range, Tstg . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −65°C to 150°C
† Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
NOTES: 1. The input and output voltage ratings may be exceeded if the input and output current ratings are observed.
2. The package thermal impedance is calculated in accordance with JESD 51-7.
2
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
SCLS128D − DECEMBER 1982 − REVISED AUGUST 2003
recommended operating conditions (see Note 3)
SN54HC240
VCC
VIH
Supply voltage
VCC = 2 V
VCC = 4.5 V
High-level input voltage
VCC = 6 V
VCC = 2 V
VIL
VI
VO
∆t/∆v
MIN
NOM
MAX
2
5
6
Input voltage
MAX
2
5
6
3.15
3.15
4.2
4.2
0
VCC = 6 V
UNIT
V
V
0.5
0.5
1.35
1.35
1.8
1.8
VCC
VCC
VCC = 2 V
VCC = 4.5 V
Input transition rise/fall time
NOM
1.5
0
Output voltage
MIN
1.5
VCC = 4.5 V
VCC = 6 V
Low-level input voltage
SN74HC240
0
VCC
VCC
0
1000
1000
500
500
400
400
V
V
V
ns
TA
Operating free-air temperature
−55
125
−40
85
°C
NOTE 3: All unused inputs of the device must be held at VCC or GND to ensure proper device operation. Refer to the TI application report,
Implications of Slow or Floating CMOS Inputs, literature number SCBA004.
electrical characteristics over recommended operating free-air temperature range (unless
otherwise noted)
PARAMETER
VOH
VOL
TEST CONDITIONS
VI = VCC or 0,
MIN
MAX
SN74HC240
MIN
MAX
UNIT
1.9
1.998
1.9
1.9
IOH = −20 µA
4.4
4.499
4.4
4.4
6V
5.9
5.999
5.9
5.9
IOH = −6 mA
IOH = −7.8 mA
4.5 V
3.98
4.3
3.7
3.84
6V
5.48
5.8
5.2
5.34
2V
0.002
0.1
0.1
0.1
IOL = 20 µA
4.5 V
0.001
0.1
0.1
0.1
6V
0.001
0.1
0.1
0.1
4.5 V
0.17
0.26
0.4
0.33
6V
0.15
0.26
0.4
0.33
6V
±0.1
±100
±1000
±1000
nA
6V
±0.01
±0.5
±10
±5
µA
8
160
80
µA
10
10
10
pF
IOL = 6 mA
IOL = 7.8 mA
ICC
Ci
SN54HC240
2V
VI = VIH or VIL
VI = VCC or 0
VO = VCC or 0
TA = 25°C
MIN
TYP
MAX
4.5 V
VI = VIH or VIL
II
IOZ
VCC
IO = 0
6V
2 V to 6 V
POST OFFICE BOX 655303
3
• DALLAS, TEXAS 75265
V
V
3
SCLS128D − DECEMBER 1982 − REVISED AUGUST 2003
switching characteristics over recommended operating free-air temperature range, CL = 50 pF
(unless otherwise noted) (see Figure 1)
TA = 25°C
TYP
MAX
SN54HC240
SN74HC240
PARAMETER
FROM
(INPUT)
TO
(OUTPUT)
VCC
2V
50
100
150
125
tpd
A
Y
4.5 V
10
20
30
25
6V
9
17
25
21
ten
OE
tdis
OE
tt
Y
Y
Y
MIN
MIN
MAX
MIN
MAX
2V
75
150
225
190
4.5 V
15
30
45
38
6V
13
26
38
32
2V
44
150
225
190
4.5 V
22
30
45
38
6V
21
26
38
32
2V
28
60
90
75
4.5 V
8
12
18
15
6V
6
10
15
13
UNIT
ns
ns
ns
ns
switching characteristics over recommended operating free-air temperature range, CL = 150 pF
(unless otherwise noted) (see Figure 1)
PARAMETER
tpd
ten
tt
FROM
(INPUT)
A
OE
TA = 25°C
MIN
TYP
MAX
SN54HC240
SN74HC240
TO
(OUTPUT)
VCC
2V
75
150
225
190
Y
4.5 V
15
30
45
38
6V
13
26
38
32
2V
100
200
300
250
4.5 V
20
40
60
50
6V
17
34
51
43
2V
45
210
315
265
4.5 V
17
42
63
53
6V
13
36
53
45
Y
Y
MIN
MAX
MIN
MAX
UNIT
ns
ns
ns
operating characteristics, TA = 25°C
PARAMETER
Cpd
4
TEST CONDITIONS
Power dissipation capacitance per buffer/driver
POST OFFICE BOX 655303
No load
• DALLAS, TEXAS 75265
TYP
35
UNIT
pF
SCLS128D − DECEMBER 1982 − REVISED AUGUST 2003
PARAMETER MEASUREMENT INFORMATION
VCC
PARAMETER
Test
Point
From Output
Under Test
S1
ten
RL
CL
(see Note A)
RL
tPZH
tPZL
tPHZ
tdis
S2
tPLZ
1 kΩ
1 kΩ
−−
tpd or tt
LOAD CIRCUIT
CL
S1
S2
50 pF
or
150 pF
Open
Closed
Closed
Open
Open
Closed
Closed
Open
Open
Open
50 pF
50 pF
or
150 pF
VCC
Input
50%
50%
0V
tPLH
In-Phase
Output
50%
10%
tPHL
90%
VOH
50%
10% V
OL
tf
90%
tr
tPHL
Out-of-Phase
Output
90%
tPLH
50%
10%
50%
10%
90%
VOH
VOL
tf
tr
VOLTAGE WAVEFORMS
PROPAGATION DELAY AND OUTPUT TRANSITION TIMES
Output
Control
(Low-Level
Enabling)
VCC
50%
50%
0V
tPZL
Output
Waveform 1
(See Note B)
tPLZ
10%
tPZH
Input
50%
10%
90%
VCC
90%
50%
10% 0 V
tr
Output
Waveform 2
(See Note B)
≈VCC
≈VCC
50%
VOL
tPHZ
50%
90%
VOH
≈0 V
tf
VOLTAGE WAVEFORM
INPUT RISE AND FALL TIMES
VOLTAGE WAVEFORMS
ENABLE AND DISABLE TIMES FOR 3-STATE OUTPUTS
NOTES: A. CL includes probe and test-fixture capacitance.
B. Waveform 1 is for an output with internal conditions such that the output is low except when disabled by the output control.
Waveform 2 is for an output with internal conditions such that the output is high except when disabled by the output control.
C. Phase relationships between waveforms were chosen arbitrarily. All input pulses are supplied by generators having the following
characteristics: PRR ≤ 1 MHz, ZO = 50 Ω, tr = 6 ns, tf = 6 ns.
D. The outputs are measured one at a time with one input transition per measurement.
E. tPLZ and tPHZ are the same as tdis.
F. tPZL and tPZH are the same as ten.
G. tPLH and tPHL are the same as tpd.
Figure 1. Load Circuit and Voltage Waveforms
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
5
PACKAGE OPTION ADDENDUM
www.ti.com
9-Oct-2007
PACKAGING INFORMATION
Orderable Device
Status (1)
Package
Type
Package
Drawing
Pins Package Eco Plan (2)
Qty
84074012A
ACTIVE
LCCC
FK
20
1
TBD
8407401RA
ACTIVE
CDIP
J
20
1
TBD
8407401SA
ACTIVE
CFP
W
20
1
TBD
JM38510/65703B2A
ACTIVE
LCCC
FK
20
1
TBD
JM38510/65703BRA
ACTIVE
CDIP
J
20
1
TBD
1
TBD
Lead/Ball Finish
MSL Peak Temp (3)
POST-PLATE N / A for Pkg Type
A42 SNPB
N / A for Pkg Type
A42
N / A for Pkg Type
POST-PLATE N / A for Pkg Type
A42 SNPB
N / A for Pkg Type
A42 SNPB
N / A for Pkg Type
SN54HC240J
ACTIVE
CDIP
J
20
SN74HC240DBR
ACTIVE
SSOP
DB
20
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74HC240DBRE4
ACTIVE
SSOP
DB
20
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74HC240DBRG4
ACTIVE
SSOP
DB
20
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74HC240DW
ACTIVE
SOIC
DW
20
25
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74HC240DWE4
ACTIVE
SOIC
DW
20
25
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74HC240DWG4
ACTIVE
SOIC
DW
20
25
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74HC240DWR
ACTIVE
SOIC
DW
20
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74HC240DWRE4
ACTIVE
SOIC
DW
20
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74HC240DWRG4
ACTIVE
SOIC
DW
20
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74HC240N
ACTIVE
PDIP
N
20
CU NIPDAU
N / A for Pkg Type
20
Pb-Free
(RoHS)
TBD
Call TI
20
Pb-Free
(RoHS)
CU NIPDAU
N / A for Pkg Type
SN74HC240N3
OBSOLETE
PDIP
N
20
SN74HC240NE4
ACTIVE
PDIP
N
20
SN74HC240NSR
ACTIVE
SO
NS
20
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74HC240NSRE4
ACTIVE
SO
NS
20
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74HC240NSRG4
ACTIVE
SO
NS
20
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74HC240PW
ACTIVE
TSSOP
PW
20
70
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74HC240PWE4
ACTIVE
TSSOP
PW
20
70
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74HC240PWG4
ACTIVE
TSSOP
PW
20
70
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74HC240PWR
ACTIVE
TSSOP
PW
20
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74HC240PWRE4
ACTIVE
TSSOP
PW
20
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74HC240PWRG4
ACTIVE
TSSOP
PW
20
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74HC240PWT
ACTIVE
TSSOP
PW
20
250
CU NIPDAU
Level-1-260C-UNLIM
Addendum-Page 1
Green (RoHS &
Call TI
PACKAGE OPTION ADDENDUM
www.ti.com
9-Oct-2007
Orderable Device
Status (1)
Package
Type
Package
Drawing
Pins Package Eco Plan (2)
Qty
SN74HC240PWTE4
ACTIVE
TSSOP
PW
20
250
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74HC240PWTG4
ACTIVE
TSSOP
PW
20
250
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SNJ54HC240FK
ACTIVE
LCCC
FK
20
1
TBD
SNJ54HC240J
ACTIVE
CDIP
J
20
1
TBD
A42 SNPB
N / A for Pkg Type
SNJ54HC240W
ACTIVE
CFP
W
20
1
TBD
A42
N / A for Pkg Type
Lead/Ball Finish
MSL Peak Temp (3)
no Sb/Br)
POST-PLATE N / A for Pkg Type
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
Addendum-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com
4-Oct-2007
TAPE AND REEL BOX INFORMATION
Device
Package Pins
Site
Reel
Diameter
(mm)
Reel
Width
(mm)
A0 (mm)
B0 (mm)
K0 (mm)
P1
(mm)
W
Pin1
(mm) Quadrant
SN74HC240DBR
DB
20
SITE 41
330
16
8.2
7.5
2.5
12
16
Q1
SN74HC240DWR
DW
20
SITE 41
330
24
10.8
13.0
2.7
12
24
Q1
SN74HC240NSR
NS
20
SITE 41
330
24
8.2
13.0
2.5
12
24
Q1
SN74HC240PWR
PW
20
SITE 41
330
16
6.95
7.1
1.6
8
16
Q1
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
Device
4-Oct-2007
Package
Pins
Site
Length (mm)
Width (mm)
Height (mm)
SN74HC240DBR
DB
20
SITE 41
346.0
346.0
33.0
SN74HC240DWR
DW
20
SITE 41
346.0
346.0
41.0
SN74HC240NSR
NS
20
SITE 41
346.0
346.0
41.0
SN74HC240PWR
PW
20
SITE 41
346.0
346.0
33.0
Pack Materials-Page 2
MECHANICAL DATA
MLCC006B – OCTOBER 1996
FK (S-CQCC-N**)
LEADLESS CERAMIC CHIP CARRIER
28 TERMINAL SHOWN
18
17
16
15
14
13
NO. OF
TERMINALS
**
12
19
11
20
10
A
B
MIN
MAX
MIN
MAX
20
0.342
(8,69)
0.358
(9,09)
0.307
(7,80)
0.358
(9,09)
28
0.442
(11,23)
0.458
(11,63)
0.406
(10,31)
0.458
(11,63)
21
9
22
8
44
0.640
(16,26)
0.660
(16,76)
0.495
(12,58)
0.560
(14,22)
23
7
52
0.739
(18,78)
0.761
(19,32)
0.495
(12,58)
0.560
(14,22)
24
6
68
0.938
(23,83)
0.962
(24,43)
0.850
(21,6)
0.858
(21,8)
84
1.141
(28,99)
1.165
(29,59)
1.047
(26,6)
1.063
(27,0)
B SQ
A SQ
25
5
26
27
28
1
2
3
4
0.080 (2,03)
0.064 (1,63)
0.020 (0,51)
0.010 (0,25)
0.020 (0,51)
0.010 (0,25)
0.055 (1,40)
0.045 (1,14)
0.045 (1,14)
0.035 (0,89)
0.045 (1,14)
0.035 (0,89)
0.028 (0,71)
0.022 (0,54)
0.050 (1,27)
4040140 / D 10/96
NOTES: A.
B.
C.
D.
E.
All linear dimensions are in inches (millimeters).
This drawing is subject to change without notice.
This package can be hermetically sealed with a metal lid.
The terminals are gold plated.
Falls within JEDEC MS-004
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
MECHANICAL DATA
MSSO002E – JANUARY 1995 – REVISED DECEMBER 2001
DB (R-PDSO-G**)
PLASTIC SMALL-OUTLINE
28 PINS SHOWN
0,38
0,22
0,65
28
0,15 M
15
0,25
0,09
8,20
7,40
5,60
5,00
Gage Plane
1
14
0,25
A
0°–ā8°
0,95
0,55
Seating Plane
2,00 MAX
0,10
0,05 MIN
PINS **
14
16
20
24
28
30
38
A MAX
6,50
6,50
7,50
8,50
10,50
10,50
12,90
A MIN
5,90
5,90
6,90
7,90
9,90
9,90
12,30
DIM
4040065 /E 12/01
NOTES: A.
B.
C.
D.
All linear dimensions are in millimeters.
This drawing is subject to change without notice.
Body dimensions do not include mold flash or protrusion not to exceed 0,15.
Falls within JEDEC MO-150
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
MECHANICAL DATA
MTSS001C – JANUARY 1995 – REVISED FEBRUARY 1999
PW (R-PDSO-G**)
PLASTIC SMALL-OUTLINE PACKAGE
14 PINS SHOWN
0,30
0,19
0,65
14
0,10 M
8
0,15 NOM
4,50
4,30
6,60
6,20
Gage Plane
0,25
1
7
0°– 8°
A
0,75
0,50
Seating Plane
0,15
0,05
1,20 MAX
PINS **
0,10
8
14
16
20
24
28
A MAX
3,10
5,10
5,10
6,60
7,90
9,80
A MIN
2,90
4,90
4,90
6,40
7,70
9,60
DIM
4040064/F 01/97
NOTES: A.
B.
C.
D.
All linear dimensions are in millimeters.
This drawing is subject to change without notice.
Body dimensions do not include mold flash or protrusion not to exceed 0,15.
Falls within JEDEC MO-153
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
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