SCLS158E − DECEMBER 1982 − REVISED SEPTEMBER 2003 D Wide Operating Voltage Range of 2 V to 6 V D Outputs Can Drive Up To 10 LSTTL Loads D Low Power Consumption, 80-µA Max ICC D Typical tpd = 12 ns D ±4-mA Output Drive at 5 V D Low Input Current of 1 µA Max 1 16 2 15 3 14 4 13 5 12 6 11 7 10 8 9 QM QL VCC QK QJ QH QI CLR CLK QA QN QF NC QE QG 4 3 2 1 20 19 18 5 17 6 16 7 15 8 14 9 10 11 12 13 QJ QH NC QI CLR QD GND NC QA CLK QL QM QN QF QE QG QD GND NC VCC QK SN54HC4020 . . . FK PACKAGE (TOP VIEW) SN54HC4020 . . . J OR W PACKAGE SN74HC4020 . . . D, DB, N, NS, OR PW PACKAGE (TOP VIEW) NC − No internal connection description/ordering information The ’HC4020 devices are 14-stage binary ripple-carry counters that advance on the negative-going edge of the clock pulse. The counters are reset to zero (all outputs low) independently of the clock (CLK) input when the clear (CLR) input goes high. ORDERING INFORMATION PACKAGE† TA PDIP − N SN74HC4020N Tube of 40 SN74HC4020D Reel of 2500 SN74HC4020DR Reel of 250 SN74HC4020DT SOP − NS Reel of 2000 SN74HC4020NSR HC4020 SSOP − DB Reel of 2000 SN74HC4020DBR HC4020 Tube of 90 SN74HC4020PW Reel of 2000 SN74HC4020PWR Reel of 250 SN74HC4020PWT CDIP − J Tube of 25 SNJ54HC4020J SNJ54HC4020J CFP − W Tube of 150 SNJ54HC4020W SNJ54HC4020W LCCC − FK Tube of 55 SNJ54HC4020FK TSSOP − PW −55°C −55 C to 125 125°C C TOP-SIDE MARKING Tube of 25 SOIC − D −40°C −40 C to 85 85°C C ORDERABLE PART NUMBER SN74HC4020N HC4020 HC4020 SNJ54HC4020FK † Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at www.ti.com/sc/package. Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. Copyright 2003, Texas Instruments Incorporated ! "#$ ! %#&'" ($) (#"! " !%$""! %$ *$ $! $+! !#$! !(( ,-) (#" %"$!!. ($! $"$!!'- "'#($ $!. '' %$$!) %(#"! "%' /01232 '' %$$! $ $!$( #'$!! *$,!$ $() '' *$ %(#"! %(#" %"$!!. ($! $"$!!'- "'#($ $!. '' %$$!) POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 1 SCLS158E − DECEMBER 1982 − REVISED SEPTEMBER 2003 FUNCTION TABLE (each buffer) INPUTS FUNCTION CLK CLR ↑ L No change ↓ L Advance to next stage X H All outputs L logic diagram (positive logic) CLR 11 R CLK 10 R T R R T 6 QG T QH T R T R T T 7 5 4 QA QD QE QF R T 13 R 9 R T R R T 12 R T 14 QI QJ R T 15 QK R T T 1 2 3 QL QM QN Pin numbers shown are for the D, DB, J, N, NS, PW, and W packages. absolute maximum ratings over operating free-air temperature range (unless otherwise noted)† Supply voltage range, VCC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.5 V to 7 V Input clamp current, IIK (VI < 0 or VI > VCC) (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±20 mA Output clamp current, IOK (VO < 0 or VO > VCC) (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±20 mA Continuous output current, IO (VO = 0 to VCC) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±25 mA Continuous current through VCC or GND . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±50 mA Package thermal impedance, θJA (see Note 2): D package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 73°C/W DB package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 82°C/W N package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 67°C/W NS package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 64°C/W PW package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 108°C/W Storage temperature range, Tstg . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −65°C to 150°C † Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. NOTES: 1. The input and output voltage ratings may be exceeded if the input and output current ratings are observed. 2. The package thermal impedance is calculated in accordance with JESD 51-7. 2 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 SCLS158E − DECEMBER 1982 − REVISED SEPTEMBER 2003 recommended operating conditions (see Note 3) SN54HC4020 VCC VIH Supply voltage VCC = 2 V VCC = 4.5 V High-level input voltage VCC = 6 V VCC = 2 V VIL VI VO Input voltage NOM MAX 2 5 6 NOM MAX 2 5 6 1.5 3.15 3.15 4.2 4.2 0 VCC = 6 V UNIT V V 0.5 0.5 1.35 1.35 1.8 1.8 VCC VCC VCC = 2 V VCC = 4.5 V Input transition rise/fall time MIN 1.5 0 Output voltage ∆t/∆v MIN VCC = 4.5 V VCC = 6 V Low-level input voltage SN74HC4020 0 VCC VCC 0 1000 1000 500 500 400 400 V V V ns TA Operating free-air temperature −55 125 −40 85 °C NOTE 3: All unused inputs of the device must be held at VCC or GND to ensure proper device operation. Refer to the TI application report, Implications of Slow or Floating CMOS Inputs, literature number SCBA004. electrical characteristics over recommended operating free-air temperature range (unless otherwise noted) PARAMETER VOH VOL TEST CONDITIONS VCC Ci MIN MAX SN74HC4020 MIN MAX UNIT 2V 1.9 1.998 1.9 1.9 IOH = −20 µA 4.4 4.499 4.4 4.4 6V 5.9 5.999 5.9 5.9 IOH = −4 mA IOH = −5.2 mA 4.5 V 3.98 4.3 3.7 3.84 6V 5.48 5.8 5.2 5.34 2V 0.002 0.1 0.1 0.1 IOL = 20 µA 4.5 V 0.001 0.1 0.1 0.1 6V 0.001 0.1 0.1 0.1 4.5 V 0.17 0.26 0.4 0.33 6V 0.15 0.26 0.4 0.33 6V ±0.1 ±100 ±1000 ±1000 nA 8 160 80 µA 10 10 10 pF VI = VIH or VIL VI = VIH or VIL VI = VCC or 0 VI = VCC or 0, SN54HC4020 4.5 V IOL = 4 mA IOL = 5.2 mA II ICC TA = 25°C MIN TYP MAX IO = 0 6V 2 V to 6 V POST OFFICE BOX 655303 3 • DALLAS, TEXAS 75265 V V 3 SCLS158E − DECEMBER 1982 − REVISED SEPTEMBER 2003 timing requirements over recommended operating free-air temperature range (unless otherwise noted) VCC fclock Clock frequency CLK high or low tw Pulse duration CLR high tsu Setup time, CLR inactive before CLK↓ TA = 25°C MIN MAX SN54HC4020 MIN MAX SN74HC4020 MIN MAX 2V 5.5 3.7 4.3 4.5 V 28 19 22 6V 33 22 25 2V 90 135 115 4.5 V 18 27 23 6V 15 23 20 2V 70 105 90 4.5 V 14 21 18 6V 12 18 25 2V 60 90 75 4.5 V 12 18 15 6V 10 15 13 UNIT MHz ns ns switching characteristics over recommended operating free-air temperature range, CL = 50 pF (unless otherwise noted) (see Figure 1) PARAMETER FROM (INPUT) TO (OUTPUT) fmax tpd tPHL CLK CLR tt QA Any Any VCC TA = 25°C MIN TYP MAX SN54HC4020 MIN MAX SN74HC4020 MIN 2V 5.5 10 3.7 4.3 4.5 V 28 45 19 22 6V 33 53 22 25 MAX UNIT MHz 2V 62 150 225 190 4.5 V 16 30 45 38 6V 12 26 38 32 2V 63 140 210 175 4.5 V 17 28 42 35 6V 13 24 36 30 2V 28 75 110 95 4.5 V 8 15 22 19 6V 6 13 19 16 ns ns ns operating characteristics, TA = 25°C PARAMETER Cpd 4 TEST CONDITIONS Power dissipation capacitance No load POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 TYP 88 UNIT pF SCLS158E − DECEMBER 1982 − REVISED SEPTEMBER 2003 PARAMETER MEASUREMENT INFORMATION From Output Under Test Test Point Reference Input 0V CL = 50 pF (see Note A) tsu Data Input LOAD CIRCUIT Input 50% 0V tPLH In-Phase Output 90% 50% 10% 90% tPHL 90% VCC 50% 10% 0 V 90% tr tf VOLTAGE WAVEFORMS SETUP AND INPUT RISE AND FALL TIMES tPHL 90% tr Out-of-Phase Output 50% 10% VCC 50% VCC 50% VOH 50% 10% VOL tf tf 50% 10% 50% 50% 0V tPLH 50% 10% VCC High-Level Pulse VOH 90% VOL tr tw VCC Low-Level Pulse VOLTAGE WAVEFORMS PROPAGATION DELAY AND OUTPUT TRANSITION TIMES 50% 50% 0V VOLTAGE WAVEFORMS PULSE DURATIONS NOTES: A. CL includes probe and test-fixture capacitance. B. Phase relationships between waveforms were chosen arbitrarily. All input pulses are supplied by generators having the following characteristics: PRR ≤ 1 MHz, ZO = 50 Ω, tr = 6 ns, tf = 6 ns. C. For clock inputs, fmax is measured when the input duty cycle is 50%. D. The outputs are measured one at a time with one input transition per measurement. E. tPLH and tPHL are the same as tpd. Figure 1. Load Circuit and Voltage Waveforms POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 5 PACKAGE OPTION ADDENDUM www.ti.com 9-Oct-2007 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Drawing Pins Package Eco Plan (2) Qty 85003012A ACTIVE LCCC FK 20 1 TBD 8500301EA ACTIVE CDIP J 16 1 TBD Lead/Ball Finish MSL Peak Temp (3) POST-PLATE N / A for Pkg Type A42 SNPB N / A for Pkg Type 8500301FA ACTIVE CFP W 16 1 TBD A42 N / A for Pkg Type SN54HC4020J ACTIVE CDIP J 16 1 TBD A42 SNPB N / A for Pkg Type SN74HC4020D ACTIVE SOIC D 16 40 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74HC4020DBR ACTIVE SSOP DB 16 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74HC4020DBRE4 ACTIVE SSOP DB 16 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74HC4020DBRG4 ACTIVE SSOP DB 16 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74HC4020DE4 ACTIVE SOIC D 16 40 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74HC4020DG4 ACTIVE SOIC D 16 40 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74HC4020DR ACTIVE SOIC D 16 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74HC4020DRE4 ACTIVE SOIC D 16 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74HC4020DRG4 ACTIVE SOIC D 16 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74HC4020DT ACTIVE SOIC D 16 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74HC4020DTE4 ACTIVE SOIC D 16 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74HC4020DTG4 ACTIVE SOIC D 16 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74HC4020N ACTIVE PDIP N 16 25 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type TBD Call TI 25 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type SN74HC4020N3 OBSOLETE PDIP N 16 SN74HC4020NE4 ACTIVE PDIP N 16 SN74HC4020NSR ACTIVE SO NS 16 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74HC4020NSRE4 ACTIVE SO NS 16 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74HC4020NSRG4 ACTIVE SO NS 16 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74HC4020PW ACTIVE TSSOP PW 16 90 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74HC4020PWE4 ACTIVE TSSOP PW 16 90 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74HC4020PWG4 ACTIVE TSSOP PW 16 90 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74HC4020PWR ACTIVE TSSOP PW 16 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74HC4020PWRE4 ACTIVE TSSOP PW 16 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM Addendum-Page 1 Call TI PACKAGE OPTION ADDENDUM www.ti.com 9-Oct-2007 Orderable Device Status (1) Package Type Package Drawing Pins Package Eco Plan (2) Qty SN74HC4020PWRG4 ACTIVE TSSOP PW 16 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74HC4020PWT ACTIVE TSSOP PW 16 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74HC4020PWTE4 ACTIVE TSSOP PW 16 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74HC4020PWTG4 ACTIVE TSSOP PW 16 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SNJ54HC4020FK ACTIVE LCCC FK 20 1 TBD SNJ54HC4020J ACTIVE CDIP J 16 1 TBD A42 SNPB N / A for Pkg Type SNJ54HC4020W ACTIVE CFP W 16 1 TBD A42 N / A for Pkg Type Lead/Ball Finish MSL Peak Temp (3) POST-PLATE N / A for Pkg Type (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. Addendum-Page 2 PACKAGE MATERIALS INFORMATION www.ti.com 19-Mar-2008 TAPE AND REEL INFORMATION *All dimensions are nominal Device Package Package Pins Type Drawing SN74HC4020DBR SSOP SPQ Reel Reel Diameter Width (mm) W1 (mm) A0 (mm) B0 (mm) K0 (mm) P1 (mm) W Pin1 (mm) Quadrant 12.0 16.0 Q1 DB 16 2000 330.0 16.4 8.2 6.6 2.5 SN74HC4020DR SOIC D 16 2500 330.0 16.4 6.5 10.3 2.1 8.0 16.0 Q1 SN74HC4020NSR SO NS 16 2000 330.0 16.4 8.2 10.5 2.5 12.0 16.0 Q1 SN74HC4020PWR TSSOP PW 16 2000 330.0 12.4 7.0 5.6 1.6 8.0 12.0 Q1 Pack Materials-Page 1 PACKAGE MATERIALS INFORMATION www.ti.com 19-Mar-2008 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) SN74HC4020DBR SSOP DB 16 2000 346.0 346.0 33.0 SN74HC4020DR SOIC D 16 2500 333.2 345.9 28.6 SN74HC4020NSR SO NS 16 2000 346.0 346.0 33.0 SN74HC4020PWR TSSOP PW 16 2000 346.0 346.0 29.0 Pack Materials-Page 2 MECHANICAL DATA MSSO002E – JANUARY 1995 – REVISED DECEMBER 2001 DB (R-PDSO-G**) PLASTIC SMALL-OUTLINE 28 PINS SHOWN 0,38 0,22 0,65 28 0,15 M 15 0,25 0,09 8,20 7,40 5,60 5,00 Gage Plane 1 14 0,25 A 0°–ā8° 0,95 0,55 Seating Plane 2,00 MAX 0,10 0,05 MIN PINS ** 14 16 20 24 28 30 38 A MAX 6,50 6,50 7,50 8,50 10,50 10,50 12,90 A MIN 5,90 5,90 6,90 7,90 9,90 9,90 12,30 DIM 4040065 /E 12/01 NOTES: A. B. C. D. All linear dimensions are in millimeters. This drawing is subject to change without notice. Body dimensions do not include mold flash or protrusion not to exceed 0,15. Falls within JEDEC MO-150 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 MECHANICAL DATA MTSS001C – JANUARY 1995 – REVISED FEBRUARY 1999 PW (R-PDSO-G**) PLASTIC SMALL-OUTLINE PACKAGE 14 PINS SHOWN 0,30 0,19 0,65 14 0,10 M 8 0,15 NOM 4,50 4,30 6,60 6,20 Gage Plane 0,25 1 7 0°– 8° A 0,75 0,50 Seating Plane 0,15 0,05 1,20 MAX PINS ** 0,10 8 14 16 20 24 28 A MAX 3,10 5,10 5,10 6,60 7,90 9,80 A MIN 2,90 4,90 4,90 6,40 7,70 9,60 DIM 4040064/F 01/97 NOTES: A. B. C. D. All linear dimensions are in millimeters. This drawing is subject to change without notice. Body dimensions do not include mold flash or protrusion not to exceed 0,15. Falls within JEDEC MO-153 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 MECHANICAL DATA MLCC006B – OCTOBER 1996 FK (S-CQCC-N**) LEADLESS CERAMIC CHIP CARRIER 28 TERMINAL SHOWN 18 17 16 15 14 13 NO. OF TERMINALS ** 12 19 11 20 10 A B MIN MAX MIN MAX 20 0.342 (8,69) 0.358 (9,09) 0.307 (7,80) 0.358 (9,09) 28 0.442 (11,23) 0.458 (11,63) 0.406 (10,31) 0.458 (11,63) 21 9 22 8 44 0.640 (16,26) 0.660 (16,76) 0.495 (12,58) 0.560 (14,22) 23 7 52 0.739 (18,78) 0.761 (19,32) 0.495 (12,58) 0.560 (14,22) 24 6 68 0.938 (23,83) 0.962 (24,43) 0.850 (21,6) 0.858 (21,8) 84 1.141 (28,99) 1.165 (29,59) 1.047 (26,6) 1.063 (27,0) B SQ A SQ 25 5 26 27 28 1 2 3 4 0.080 (2,03) 0.064 (1,63) 0.020 (0,51) 0.010 (0,25) 0.020 (0,51) 0.010 (0,25) 0.055 (1,40) 0.045 (1,14) 0.045 (1,14) 0.035 (0,89) 0.045 (1,14) 0.035 (0,89) 0.028 (0,71) 0.022 (0,54) 0.050 (1,27) 4040140 / D 10/96 NOTES: A. B. C. D. E. All linear dimensions are in inches (millimeters). This drawing is subject to change without notice. This package can be hermetically sealed with a metal lid. The terminals are gold plated. Falls within JEDEC MS-004 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements, improvements, and other changes to its products and services at any time and to discontinue any product or service without notice. Customers should obtain the latest relevant information before placing orders and should verify that such information is current and complete. All products are sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment. TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TI’s standard warranty. Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty. Except where mandated by government requirements, testing of all parameters of each product is not necessarily performed. TI assumes no liability for applications assistance or customer product design. Customers are responsible for their products and applications using TI components. To minimize the risks associated with customer products and applications, customers should provide adequate design and operating safeguards. TI does not warrant or represent that any license, either express or implied, is granted under any TI patent right, copyright, mask work right, or other TI intellectual property right relating to any combination, machine, or process in which TI products or services are used. Information published by TI regarding third-party products or services does not constitute a license from TI to use such products or services or a warranty or endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the third party, or a license from TI under the patents or other intellectual property of TI. Reproduction of TI information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompanied by all associated warranties, conditions, limitations, and notices. Reproduction of this information with alteration is an unfair and deceptive business practice. TI is not responsible or liable for such altered documentation. Information of third parties may be subject to additional restrictions. Resale of TI products or services with statements different from or beyond the parameters stated by TI for that product or service voids all express and any implied warranties for the associated TI product or service and is an unfair and deceptive business practice. TI is not responsible or liable for any such statements. TI products are not authorized for use in safety-critical applications (such as life support) where a failure of the TI product would reasonably be expected to cause severe personal injury or death, unless officers of the parties have executed an agreement specifically governing such use. Buyers represent that they have all necessary expertise in the safety and regulatory ramifications of their applications, and acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their products and any use of TI products in such safety-critical applications, notwithstanding any applications-related information or support that may be provided by TI. Further, Buyers must fully indemnify TI and its representatives against any damages arising out of the use of TI products in such safety-critical applications. TI products are neither designed nor intended for use in military/aerospace applications or environments unless the TI products are specifically designated by TI as military-grade or "enhanced plastic." Only products designated by TI as military-grade meet military specifications. Buyers acknowledge and agree that any such use of TI products which TI has not designated as military-grade is solely at the Buyer's risk, and that they are solely responsible for compliance with all legal and regulatory requirements in connection with such use. TI products are neither designed nor intended for use in automotive applications or environments unless the specific TI products are designated by TI as compliant with ISO/TS 16949 requirements. Buyers acknowledge and agree that, if they use any non-designated products in automotive applications, TI will not be responsible for any failure to meet such requirements. Following are URLs where you can obtain information on other Texas Instruments products and application solutions: Products Amplifiers Data Converters DSP Clocks and Timers Interface Logic Power Mgmt Microcontrollers RFID RF/IF and ZigBee® Solutions amplifier.ti.com dataconverter.ti.com dsp.ti.com www.ti.com/clocks interface.ti.com logic.ti.com power.ti.com microcontroller.ti.com www.ti-rfid.com www.ti.com/lprf Applications Audio Automotive Broadband Digital Control Medical Military Optical Networking Security Telephony Video & Imaging Wireless www.ti.com/audio www.ti.com/automotive www.ti.com/broadband www.ti.com/digitalcontrol www.ti.com/medical www.ti.com/military www.ti.com/opticalnetwork www.ti.com/security www.ti.com/telephony www.ti.com/video www.ti.com/wireless Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265 Copyright © 2008, Texas Instruments Incorporated