1.27mm (.050”) Pitch SEARAY*Slim 4-Row Connectors FEATURES AND SPECIFICATIONS SEARAY Slim offers a deceivingly narrow profile while providing a robust solution capable of speeds in excess of 12.5Gbps. SEARAY Slim is a solution armed with the benefits of the standard SEARAY family but with a width similar to 2-row mezzanine products. The design meets system needs as a highly compact solution but with speed capabilities of 12.5 Gbps, a level of performance most other 2-row products cannot achieve today. As systemlevel speeds approach 5Gbps and beyond, SEARAY stands as an enticing mezzanine architecture that provides headroom for future-generation iterations as protocol speeds continue to increase. SEARAY Slim pushes the envelope of the SEARAY product family, offering a 4-row solution that is a narrower version of the existing SEARAY housings. Because Slim features Molex’s patented solder-charge technology and can pack tighter signal density into a 1.27mm (.050”) pitch, the connector width is equivalent to that of standard 2-row SMT products. With a flexible tooling strategy, SEARAY Slim can offer circuit sizes ranging from 40 to 200 circuits and stacking heights of 7 to 15mm (.236 to .591”). SEARAY Slim’s slender profile provides design engineers with a solution complementary to system airflow and with a long body that provides ease in routing signals through minimal signal layers, as few as 2 layers if signals are routed to both sides of the connector or 4 layers if all signals route to one side of the mezzanine solution. In addition, unlike competitors products available today, SEARAY Slim offers guide posts for blind-mating capabilities. For additional information about SEARAY Slim visit: www.molex.com/link/SEARAYSlim.html. Features and Benefits ■ Narrow body width comparable to 2-row SMT products provides minimal PCB footprint for high-density board designs and effective design for airflow considerations ■ Data rates of up to 12.5 Gbps provide excellent signal clarity and large bandwidth for customer requirements in high-speed designs ■ Robust contact design prevents stubbing and damage in mating interface ■ Molex’s unique and patented, solder-charge technology are more cost effective and more reliable than Ball Grid Array (BGA) attach methods with less assembly processing required and a more reliable PCB adhesion ■ Flexible tooling design with multiple stack heights and circuit sizes provides ease in tooling a new circuit size or stack-height version SPECIFICATIONS Reference Information Product Specification: PS-45970-001 Packaging: Tray UL File No: TBD CSA File No: TBD Designed in: Inches Electrical Voltage: 250V AC per Current: 1.0A per contact Contact Resistance: 25 milliohms nominal Dielectric Withstanding Voltage: 500V DC Insulation Resistance: 5000 Ohms min. Impedance: 100 ohm differential signal pairs *SEARAY is a trademark of Samtec, Inc. Mechanical Mating Force: 50g max. per contact Un-mating Force: 30g max. per contact Normal Force: 82g max. per contact Durability: 100 cycles Physical Housing: Glass-filled LCP, UL 94V-0 Contact: Copper (Cu) Alloy Plating: Contact Area – 0.75µm Gold (Au) min. Solder Tail Area – 3.80µm Tin (Sn) min. Underplating – 1.25µm Nickel (Ni) min. overall Operating Temperature: -55 to +125°C 46556 Plug 46557 Receptacle 1.27mm (.050”) Pitch SEARAY*Slim 4-Row Connectors APPLICATIONS 46556 Plug 46557 Receptacle ■ Mezzanine add-on cards - Memory expansion - I/O expansion ■ Real estate proliferation ■ Controller cards - Motherboard personality cards - Industrial controllers - ASIC port enablers ORDERING INFORMATION Order No. Component Circuits Unmated Height Plating Plant No. for Samples 46556-2345 Plug 80 7.11mm (.280”) 30µ Gold 3109 46557-2345 Receptacle 80 6.55mm (.258”) 30µ Gold 3109 46556-4145 Plug 160 5.61mm (.221”) 30µ Gold 3109 46557-4545 Receptacle 160 8.05mm (.317”) 30µ Gold 3109 *SEARAY is a trademark of Samtec, Inc. www.molex.com/link/SEARAYSlim.html Americas Headquarters Lisle, Illinois 60532 U.S.A. 1-800-78MOLEX [email protected] Order No. 987650-2061 Asia Pacific North Headquarters Yamato, Kanagawa, Japan 81-46-265-2325 [email protected] Asia Pacific South Headquarters Jurong, Singapore 65-6268-6868 [email protected] USA/KP/2008.07 European Headquarters Munich, Germany 49-89-413092-0 [email protected] Corporate Headquarters 2222 Wellington Ct. Lisle, IL 60532 U.S.A. P: 630-969-4550 F: 630-969-1352 © 2008, Molex