MICROCHIP RE46C162E16F

RE46C162/163
CMOS Ionization Smoke Detector ASIC with Interconnect,
Timer Mode and Alarm Memory
Features
Description
• Pin Selectable Horn Patterns
• Alarm Memory
• Sensitivity Control Timer:
- 8 minute Timer for RE46C162
- 1 minute Timer for RE46C163
• >1500V ESD Protection (HBM) on All Pins
• Guard Outputs for Ion Detector Input
• ±0.75 pA Detect Input Current
• Internal Reverse Battery Protection
• Low Quiescent Current Consumption (<6.5 µA)
• I/O Filter and Charge Dump
• Internal Low Battery Detection
• Power-up Low Battery Test
• Interconnect up to 66 Detectors
• RoHS Compliant, Lead Free Packaging
The RE46C162/163 devices are low-power, CMOS
ionization type, smoke detector ICs. With few external
components, these circuits will provide all the required
features for an ionization type smoke detector.
An internal oscillator strobes power to the smoke
detection circuitry for 10.5 ms every 1.67 seconds to
keep standby current to a minimum. A check for a low
battery condition is performed every 40 seconds when
in standby. The temporal horn pattern supports the
NFPA 72 emergency evacuation signal.
An interconnect pin allows multiple detectors to be
connected so when one unit alarms, all units will sound.
A charge dump feature will quickly discharge the interconnect line when exiting a local alarm. The interconnect input is also digitally filtered.
An internal timer allows for a single button, push-to-test
to be used for a reduced sensitivity mode.
An alarm memory feature allows the user to determine
if the unit has previously entered a local alarm
condition.
Utilizing
low-power
CMOS
technology,
the
RE46C162/163 devices are designed for use in smoke
detectors that comply with Underwriters Laboratory
Specification UL217 and UL268.
Package Types
RE46C162/163
PDIP
 2010 Microchip Technology Inc.
TSTART
1
16
GUARD2
IO
2
15
DETECT
TONE
3
14
GUARD1
TSTROBE
4
13
VSEN
LED
5
12
OSCAP
VDD
6
11
HS
RBIAS
7
10
HB
FEED
8
9
VSS
DS22245A-page 1
RE46C162/163
Functional Block Diagram
IO (2)
TONE (3)
VDD(6)
TSTART (1)
Reference
R2
760K
+
-
Low Battery
Comparator
R3
340K
+
-
R4
1100K
VSS(9)
DS22245A-page 2
HB (10)
LED (5)
Smoke
Comparator
TSTROBE (4)
Bias and
Power
Reset
GUARD1 (14)
GUARD2 (16)
HS (11)
Logic and
Timing
VSEN (13)
DETECT (15)
FEED (8)
RBIAS (7)
+
Oscillator
OSCAP (12)
Guard Amp
 2010 Microchip Technology Inc.
RE46C162/163
Typical Applications
RE46C162 Typical Application – Temporal Horn Pattern
TEST and HUSH
R6
68K
R5
100K
To Other
R7
Units
100
Dled
R8
1.5K
R2
390
9V
Battery
+
1 µF
C2
-
1 TSTART
GUARD2 16
2 IO
DETECT 15
3 TONE
GUARD1 14
4 TSTROBE
R1
8.2M
R9
VSEN 13
5 LED
OSCAP 12
6 VDD
HS 11
7 RBIAS
HB 10
8 FEED
VSS
C3
.1 µF
9
R3
1.5M
Note 1:
R4
220K
C1
.001 µF
Select R5 and R6 for the correct level to test the ion chamber. The voltage level on pin 1 (TSTART) must
be greater than the VIH level to initiate the timer. Pin 1 has an internal 180K nominal pull down which must
be considered.
2:
Select R9 to reduce sensitivity during the timer mode.
3:
R3, R4 and C1 are typical values and may be adjusted to maximize sound pressure.
4:
C2 should be located as close as possible to the device power pins.
5:
Route the pin 8 PC board trace away from pin 7 to avoid coupling.
6:
R8 should be at least 1.5K.
 2010 Microchip Technology Inc.
DS22245A-page 3
RE46C162/163
RE46C162 Typical Application – 2/3 Duty Cycle Continuous Tone Horn Pattern
TEST and HUSH
R6
68K
R5
100K
To Other
R7
Units
100
Dled
R2
390
9V
Battery
+
1 µF
C2
-
1 TSTART
GUARD2 16
2 IO
DETECT 15
3 TONE
GUARD1 14
4 TSTROBE
R1
8.2M
R9
VSEN 13
5 LED
OSCAP 12
6 VDD
HS 11
7 RBIAS
HB 10
8 FEED
VSS
C3
.1 µF
9
R3
1.5M
Note 1:
R4
220K
C1
.001 µF
Select R5 and R6 for the correct level to test the ion chamber. The voltage level on pin 1 (TSTART) must be
greater than the VIH level to initiate the timer. Pin 1 has an internal 180K nominal pull down which must be
considered.
2:
Select R9 to reduce sensitivity during the timer mode.
3:
R3, R4 and C1 are typical values and may be adjusted to maximize sound pressure.
4:
C2 should be located as close as possible to the device power pins.
5:
Route the pin 8 PC board trace away from pin 7 to avoid coupling.
DS22245A-page 4
 2010 Microchip Technology Inc.
RE46C162/163
1.0
† Notice: Stresses above those listed under “Maximum ratings” may cause permanent damage to the device. This is a
stress rating only and functional operation of the device at
these or any other conditions above those indicated in the
operation listings of this specification is not implied. Exposure
to maximum rating conditions for extended periods may affect
device reliability.
ELECTRICAL
CHARACTERISTICS
Absolute Maximum Ratings†
VDD....................................................................................15V
Input Voltage Range Except FEED, I/O ........... VIN=-.3V to VDD +.3V
FEED Input Voltage Range .................... VINFD = -10 to +22V
I/O Input Voltage Range................................VIO1 = -.3 to 15V
Reverse Battery Time ...............................................TRB = 5S
Input Current except FEED ................................... IIN = 10 mA
Operating Temperature ............................... TA = -10 to +60°C
Storage Temperature ............................TSTG = -55 to +125°C
Maximum Junction Temperature ......................... TJ = +150°C
DC ELECTRICAL CHARACTERISTICS
DC Electrical Characteristics: Unless otherwise indicated, all parameters apply at TA = +25°C, VDD = 9V,
OSCAP = .1 µF, RBIAS = 8.2 M, VSS = 0V
Symbol
Test
Pin
Min
Typ
Max
Units
Supply Voltage
VDD
6
6
—
12
V
Operating
Supply Current
IDD1
6
—
5
6.5
µA
RBIAS = 8.2 MW, OSCAP = .1 µF
IDD2
6
—
—
9
µA
RBIAS = 8.2 MW, OSCAP = .1 µF;
VDD = 12V
VIH1
3,8
6.2
4.5
—
V
Note 2
VIH2
2
3
—
—
V
No local alarm, I/O as an input
VIH3
1
4.5
—
—
V
VIL1
3,8
—
4.5
2.7
V
Note 2
VIL2
2
—
—
1
V
No local alarm, I/O as an input
VIL3
1
—
—
2.5
V
ILDET1
15
—
—
-0.75
pA
VDD = 9V, DETECT = VSS,
0-40% RH
ILDET2
15
—
—
-1.50
pA
VDD = 9V, DETECT = VSS, 85%
RH Note 1
ILFD
8
—
—
-50
µA
FEED = -10V
Parameter
Input Voltage High
Input Voltage Low
Input Leakage Low
Input Leakage High
Conditions
ILTONE
3
—
—
-100
nA
TONE = VSS
IHDET1
15
—
—
0.75
pA
VDD = 9V, DETECT = VDD,
0-40% RH
IHDET2
15
—
—
1.50
pA
VDD = 9V, DETECT = VDD,
85% RH Note 1
IHFD
8
—
—
50
µA
FEED = 22V
IIOL2
2
—
—
150
µA
No alarm, VIO = 15V
IHTONE
3
—
—
100
nA
TONE = VDD
Output Off Leakage High
IIOHZ
4,5
—
—
1
µA
Outputs off
Input Pull Down Current
IPD1
1
20
50
80
µA
TSTART = 9V
Output High Voltage
VOH1
10,11
6.3
—
—
V
Note 1: Sample test only.
2: Not 100% production tested.
3: Production test at room with temperature guard banded limits.
 2010 Microchip Technology Inc.
IOH = -16 mA, VDD = 7.2V
DS22245A-page 5
RE46C162/163
DC ELECTRICAL CHARACTERISTICS (CONTINUED)
DC Electrical Characteristics: Unless otherwise indicated, all parameters apply at TA = +25°C, VDD = 9V,
OSCAP = .1 µF, RBIAS = 8.2 M, VSS = 0V
Parameter
Output Low Voltage
Output Current
Symbol
Test
Pin
Min
Typ
Max
Units
VOL1
10,11
—
—
.9
V
IOL = 16 mA, VDD = 7.2V
VOL2
4
—
—
.5
V
IOL = 500 µA
VOL3
5
—
—
1
V
IOL = 10 mA, VDD = 7.2V
IIOL1
2
25
—
60
µA
No alarm, VIO = VDD -2V
Conditions
IIOH1
2
-4
—
-16
mA
Alarm, VIO = VDD -2V or VIO = 0V
IIODMP
2
5
—
—
mA
At conclusion of local alarm or test,
VIO = 1V
VLB
6
7.2
7.5
7.8
V
Internal Sensitivity Set
Voltage
VSET1
13
48.5
50
51.5
%VDD
Offset Voltage
VGOS1
14,15
-50
—
50
mV
Guard amplifier
VGOS2
15,16
-50
—
50
mV
Guard amplifier
VGOS3
13,15
-50
—
50
mV
Smoke comparator
VCM1
14,15
2
—
VDD.5
V
VCM2
13,15
.5
—
VDD-2
V
Output Impedance
ZOUT
14,16
—
10
—
kW
Hysteresis
VHYS
Low Battery Voltage
Common Mode Voltage
Note 1:
2:
3:
13
90
130
170
mV
Sample test only.
Not 100% production tested.
Production test at room with temperature guard banded limits.
TA = -10 to +60ºC, Note 3
Guard amplifier, Note 2
Smoke comparator, Note 2
Guard amplifier outputs, Note 2
No alarm to alarm condition
AC ELECTRICAL CHARACTERISTICS
AC Electrical Characteristics: Unless otherwise indicated, all parameters apply at TA = +25°C, VDD = 9V,
OSCAP = .1 µF, RBIAS = 8.2 M, VSS = 0V.
Parameter
Oscillator Period
Symbol
Test
Pin
Min
Typ
Max
Units
TPER1
12
1.34
1.67
2
s
Conditions
No alarm condition
TPER2
12
37.5
41.7
45.8
ms
Alarm condition
Oscillator Pulse Width
TPW
5
9.4
10.5
12.9
ms
Operating
LED On Time
TLON
5
9.4
10.5
12.9
ms
Operating
LED Off Time
TLOF1
5
32
40
48
s
TLOF2
5
.9
1
1.1
s
Alarm condition
TLOF3
5
8
10
12
s
Timer mode, no alarm
TLOF4
5
2.66
3.33
4
s
Alarm memory LED pulse spacing
TLOF5
5
26
33.3
40
s
Alarm memory LED off time between
pulse train
Note 1:
2:
Standby, no alarm
See timing diagram for horn temporal and non-temporal patterns.
TPER1,TPER2 and TPW are 100% production tested. All other timing is verified by functional testing.
DS22245A-page 6
 2010 Microchip Technology Inc.
RE46C162/163
AC ELECTRICAL CHARACTERISTICS (CONTINUED)
AC Electrical Characteristics: Unless otherwise indicated, all parameters apply at TA = +25°C, VDD = 9V,
OSCAP = .1 µF, RBIAS = 8.2 M, VSS = 0V.
Parameter
Symbol
Test
Pin
Min
Typ
Max
Units
THON1
10,11
450
500
550
ms
Operating, alarm condition, Note 1,
TONE = High
THON2
10,11
9.4
10.5
12.9
ms
Low battery, no alarm or PTT in
alarm memory
THON3
10,11
150
167
183
ms
Operating, alarm condition, Note 1,
TONE = Low
THOF1
10,11
450
500
550
ms
Operating, alarm condition, Note 1,
TONE = High
THOF2
10,11
1.35
1.5
1.65
s
Operating, alarm condition, Note 1,
TONE = High
THOF3
10,11
75
83
92
ms
Operating, alarm condition, Note 1,
TONE = Low
THOF4
10,11
32
40
48
s
Low battery, no alarm
PTT in alarm memory
Horn On Time
Horn Off Time
Conditions
THOF5
10,11
216
240
264
ms
I/O Charge
Dump Duration
TIODMP
2
1.34
1.67
2.0
s
At conclusion of local alarm or test
I/O Delay
TIODLY1
2
—
3
—
s
From start of local alarm to I/O active
I/O Filter
TIOFILT
2
—
—
450
ms
Remote Alarm Delay
TIODLY2
2
.450
—
2.75
s
Timer
Period
RE46C162
Alarm Memory
Visual Indicator Period
Note 1:
2:
TTPER
RE46C163
TAMTPER
I/O as input, no local alarm
No local alarm, I/O as input,
from I/O active to horn active
4
6
8
10
Min
No alarm
4
40
50
60
s
No alarm
5
19.2
24
28.8
Hour
No alarm, alarm memory
See timing diagram for horn temporal and non-temporal patterns.
TPER1,TPER2 and TPW are 100% production tested. All other timing is verified by functional testing.
TEMPERATURE CHARACTERISTICS
Electrical Specifications: Unless otherwise indicated,
Parameters
Sym
Min
Typ
Max
Units
Conditions
Temperature Ranges
Operating Temperature Range
Storage Temperature Range
TA
-10
—
+60
°C
TSTG
-55
—
+125
°C
θJA
—
70
—
°C/W
Thermal Package Resistances
Thermal Resistance, 16L-PDIP
 2010 Microchip Technology Inc.
DS22245A-page 7
RE46C162/163
NOTES:
DS22245A-page 8
 2010 Microchip Technology Inc.
RE46C162/163
2.0
PIN DESCRIPTIONS
The descriptions of the pins are listed in Table 2-1.
TABLE 2-1:
PIN FUNCTION TABLE
RE46C162/163
Name
Description
PDIP, SOIC
1
TSTART
This input is used to invoke the push-to-test alarm, alarm memory indication,
and the timer mode. This input has an internal pull-down.
2
I/O
This bidirectional pin provides the capability to interconnect many detectors in a
single system. This pin has an internal pull-down.
3
TONE
This pin selects the NFPA72 horn tone (high) or the 2/3 duty cycle continuous
tone (low).
4
TSTROBE
5
LED
Open drain NMOS output used to drive a visible LED.
6
VDD
Connect to the positive supply voltage.
7
RBIAS
A resistor connected between this pin and VDD sets the internal bias current.
8
FEED
Usually connected to the feedback electrode through a current limiting resistor.
If not used, this pin must be connected to VDD or VSS.
9
VSS
Connect to the negative supply voltage.
10
HB
This pin is connected to the metal electrode of a piezoelectric transducer.
11
HS
HS is a complementary output to HB and connects to the ceramic electrode of
the piezoelectric transducer.
12
OSCAP
13
VSEN
14
GUARD1
This pin is strobed on with the internal clock in timer mode. A resistor
connected to this pin is used to modify the detector sensitivity for the timer
period.
A capacitor connected between this pin and VSS sets the oscillator timing.
This pin can be used to modify the set point for the smoke comparator by use of
external resistors to VDD or VSS.
Output of the guard amplifier.
15
DETECT
Connect to the collector electrode (CEV) of the ion smoke chamber.
16
GUARD2
Output of the guard amplifier.
 2010 Microchip Technology Inc.
DS22245A-page 9
RE46C162/163
NOTES:
DS22245A-page 10
 2010 Microchip Technology Inc.
RE46C162/163
3.0
DEVICE DESCRIPTION
3.1
Internal Timing
With external components as indicated on the
application drawing, the period of the oscillator is
nominally
1.67 seconds
in
standby.
Every
1.67 seconds, the detection circuitry is powered up for
10.5 ms and the status of the smoke comparator is
latched. In addition, every 40 seconds the LED driver is
turned on for 10.5 ms and the status of the low battery
comparator is latched. The smoke comparator status is
not checked during the low battery test, during the low
battery horn warning chirp, or when the horn is on due
to an alarm condition.
If an alarm condition is detected, the oscillator period
increases to 41.7 ms.
Due to the low current used in the oscillator, the
capacitor on the OSCAP pin should be a low leakage
type.
3.2
Smoke Detection Circuit
The smoke comparator compares the ionization
chamber voltage to a voltage derived from a resistor
divider across VDD. This divider voltage is available
externally on the VSEN pin. When smoke is detected,
this voltage is internally increased by 130 mV nominal
to provide hysteresis and make the detector less
sensitive to false triggering.
The VSEN pin can be used to modify the internal set
point for the smoke comparator by use of external
resistors to VDD or VSS. Nominal values for the internal
resistor divider are indicated on the block diagram.
These internal resistor values can vary by up to ±20%,
but the resistor matching should be <2% on any one
device. The transmission switch on VSEN prevents any
interaction from the external adjustment resistors.
The guard amplifier and outputs are always active and
will be within 50 mV of the DETECT input to reduce
surface leakage. The guard outputs also allow for
measurement of the DETECT input without loading the
ionization chamber.
3.3
Low Battery Detection
An internal reference is compared to the voltagedivided VDD supply. The battery can be checked under
load via the LED low side driver output since low
battery status is latched at the end of the 10.5 ms LED
pulse.
3.4
3.5
Interconnect
The I/O pin provides a capability common to many
detectors in a single system. If a single unit goes into
alarm, the I/O pin is driven high. This high signal
causes the interconnected units to alarm. The LED
flashes every 1s for 10.5 ms on the signaling unit and
is inhibited on the units that are in alarm due to the I/O
signal. An internal sink device on the I/O pin helps to
discharge the interconnect line. This charge dump
device is active for 1 clock cycle after the unit exits the
alarm condition (1.67s).
The interconnect input has a 500 ms nominal digital
filter. This allows for interconnection to other types of
alarms (carbon monoxide for example) that may have
a pulsed interconnect signal.
3.6
Testing
At power-up all internal registers are reset. The low
battery set point can be tested at power-up by holding
FEED and OSCAP low at power-up. HB will change
state as VDD passes through the low battery set point.
By holding the OSCAP pin low, the internal power
strobe is active. Functional testing can be accelerated
by driving OSCAP with a 4 kHz square wave; however,
the 10.5 ms strobe period must be maintained for
proper operation of the analog circuitry. Refer to
Figure 3-1 timing diagram.
3.7
Timer Mode
The transition of the TSTART pin from a high to low
level initiates a timer period (10 minutes maximum for
RE46C162, and 1 minute maximum for RE46C163).
During this timer period, the open drain NMOS on the
TSTROBE pin is strobed simultaneously with the internal clock. A resistor connected to this pin and the
VSEN pin is used to modify the detector sensitivity for
the timer period.
During the timer period, the LED flashes for 10.5 ms
every 10 seconds.
If the smoke level exceeds the reduced sensitivity set
point during the timer period, the unit will go into a local
alarm condition, the horn will sound and the timer mode
is cancelled. If an external only alarm occurs during the
timer mode, the timer mode is cancelled.
If the test button is pushed in a standby, reduced
sensitivity mode, the unit is tested normally. Upon
release of the test button, the timer mode counter is
reset and restarted.
LED Pulse
The LED is pulsed on for 10.5 ms every 40s in standby.
In alarm, the LED is pulsed on for 10.5 ms every
1 second.
 2010 Microchip Technology Inc.
DS22245A-page 11
RE46C162/163
3.8
Alarm Memory
If a detector has entered a local alarm, once it exits the
local alarm, the alarm memory latch is set. Initially the
LED can be used to visually identify any unit that had
previously been in a local alarm condition. The LED will
flash 3 times spaced 3.3 seconds apart. This pattern
will repeat every 40 seconds. The duration of the flash
is 10.5 ms. In order to conserve battery power, this
visual indication will stop after a period of 24 hours. The
user will still be able to identify a unit with an active
alarm memory by pressing the push-to-test button.
When the push-to-test button is active, the horn will
chirp for 10.5 ms every 250 ms.
If the alarm memory condition is set, any time the pushto-test button is pressed and then released, the alarm
memory latch is reset.
Standby Mode; No Low Bat tery; No Alarm
The initial 24 hour visual indication is not displayed if a
low battery condition exits.
3.9
Tone Select
The TONE pin selects the NFPA72 temporal horn tone
(high), or the 2/3 duty cycle continuous tone (low). If
this pin is externally connected high, use a current
limiting resistor of at least 1.5K from TONE pin to VDD.
3.10
Reverse Battery Protection
The RE46C162/163 internally limits the current from
VSS to VDD in the event of accidental polarity reversal.
If an input is connected to VDD it should be done
through a resistance of at least 1.5K to limit the reverse
current through this path.
Alarm; No Low Battery
Alarm; Low Battery
No Alarm; Low Battery
Oscillator
P in 15 > Pin 13
T PER1
Pin 13 > Pin 15; 130mV Level Shift on P in 13
TPW
Pin 15 > Pin 13
TPER2
Inte rnal Clock
24 Cloc k Cyc les (40 S)
24 Cloc k Cy cles (1S)
LED
Sample Smoke
Low Battery Warning Chirp
Horn
See F igure Below for C omplete Horn Cycle
TIODLY1
IO (Pin 2) as Output
Timing not same scale as above
IO Charge Dump
TIODMP
TIOFILT
IO ( Pin 2) a s Input
LED supress ed in remote alarm mode
TIODLY2
Horn
Start of horn tem poral pattern is not sy nc hroniz ed to an ex ternal alarm
Horn pattern not self completing for external alarm,s ee timing below for complete horn c ycle
Inte rnal Clock
Note s:
1. Smoke is not sampled when the ho rn is active. Horn cycle is self completing in local alarm.
2. L ow battery warnin g chirp is suppressed in local or re mote alarm
3. IO Dump active on ly in loca l alarm, inactive if external alarm
T HOF2
THON1 THOF1
Complete Temporal Horn Pattern
THON3
THOF3
Non -Temporal Horn Pattern
FIGURE 3-1:
DS22245A-page 12
Timing Diagram – Standby, Local Alarm, Low Battery.
 2010 Microchip Technology Inc.
RE46C162/163
Oscillator
TPER1
TPW
Internal Clock
TSTART
TLOF3
LED
Outputs High Z
TSTROBE
TTPER
FIGURE 3-2:
Timing Diagram –Timer Mode.
AlarmMemory
Alarm, No Low Battery
Alarm Memory; No Alarm; No Low Battery
AlarmMemory After 24 Hour Timer
Indication
Standby
LED
TLON
TLOF2
TLOF4
TLOF1
TLOF1
TLOF5
THON2
TAMTPER
HB
THOF5
TSTART
FIGURE 3-3:
Timing Diagram – Alarm Memory Mode.
 2010 Microchip Technology Inc.
DS22245A-page 13
RE46C162/163
NOTES:
DS22245A-page 14
 2010 Microchip Technology Inc.
RE46C162/163
4.0
PACKAGING INFORMATION
4.1
Package Marking Information
16-Lead PDIP
Example
XXXXXXXXXXXXXX
XXXXXXXXXXXXXX
YYWWNNN
Legend: XX...X
Y
YY
WW
NNN
e3
*
Note:
RE46C162-V/P
1003256
Customer-specific information
Year code (last digit of calendar year)
Year code (last 2 digits of calendar year)
Week code (week of January 1 is week ‘01’)
Alphanumeric traceability code
Pb-free JEDEC designator for Matte Tin (Sn)
This package is Pb-free. The Pb-free JEDEC designator ( e3 )
can be found on the outer packaging for this package.
In the event the full Microchip part number cannot be marked on one line, it will
be carried over to the next line, thus limiting the number of available
characters for customer-specific information.
 2010 Microchip Technology Inc.
DS22245A-page 15
RE46C162/163
3
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NOTE 1
E1
1
2
3
D
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DS22245A-page 16
 2010 Microchip Technology Inc.
RE46C162/163
APPENDIX A:
REVISION HISTORY
Revision A (March 2010)
• Original Release of this Document.
 2010 Microchip Technology Inc.
DS22245A-page 17
RE46C162/163
NOTES:
DS22245A-page 18
 2010 Microchip Technology Inc.
RE46C162/163
PRODUCT IDENTIFICATION SYSTEM
To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office.
PART NO.
XX
/X
Examples:
Device Package Number
of Pins
Device
RE46C162:
RE46C163:
Package
E
=
a)
b)
RE46C162E16F:
RE46C163E16F:
16LD PDIP Package.
16LD PDIP Package.
CMOS Ionization Smoke Detector
CMOS Ionization Smoke Detector
Plastic Dual In-Line, 300 mil. Body, 16-Lead (PDIP)
 2010 Microchip Technology Inc.
DS22245A-page 19
RE46C162/163
NOTES:
DS22245A-page 20
 2010 Microchip Technology Inc.
Note the following details of the code protection feature on Microchip devices:
•
Microchip products meet the specification contained in their particular Microchip Data Sheet.
•
Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the
intended manner and under normal conditions.
•
There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our
knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data
Sheets. Most likely, the person doing so is engaged in theft of intellectual property.
•
Microchip is willing to work with the customer who is concerned about the integrity of their code.
•
Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not
mean that we are guaranteeing the product as “unbreakable.”
Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our
products. Attempts to break Microchip’s code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts
allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act.
Information contained in this publication regarding device
applications and the like is provided only for your convenience
and may be superseded by updates. It is your responsibility to
ensure that your application meets with your specifications.
MICROCHIP MAKES NO REPRESENTATIONS OR
WARRANTIES OF ANY KIND WHETHER EXPRESS OR
IMPLIED, WRITTEN OR ORAL, STATUTORY OR
OTHERWISE, RELATED TO THE INFORMATION,
INCLUDING BUT NOT LIMITED TO ITS CONDITION,
QUALITY, PERFORMANCE, MERCHANTABILITY OR
FITNESS FOR PURPOSE. Microchip disclaims all liability
arising from this information and its use. Use of Microchip
devices in life support and/or safety applications is entirely at
the buyer’s risk, and the buyer agrees to defend, indemnify and
hold harmless Microchip from any and all damages, claims,
suits, or expenses resulting from such use. No licenses are
conveyed, implicitly or otherwise, under any Microchip
intellectual property rights.
Trademarks
The Microchip name and logo, the Microchip logo, dsPIC,
KEELOQ, KEELOQ logo, MPLAB, PIC, PICmicro, PICSTART,
PIC32 logo, rfPIC and UNI/O are registered trademarks of
Microchip Technology Incorporated in the U.S.A. and other
countries.
FilterLab, Hampshire, HI-TECH C, Linear Active Thermistor,
MXDEV, MXLAB, SEEVAL and The Embedded Control
Solutions Company are registered trademarks of Microchip
Technology Incorporated in the U.S.A.
Analog-for-the-Digital Age, Application Maestro, CodeGuard,
dsPICDEM, dsPICDEM.net, dsPICworks, dsSPEAK, ECAN,
ECONOMONITOR, FanSense, HI-TIDE, In-Circuit Serial
Programming, ICSP, Mindi, MiWi, MPASM, MPLAB Certified
logo, MPLIB, MPLINK, mTouch, Octopus, Omniscient Code
Generation, PICC, PICC-18, PICDEM, PICDEM.net, PICkit,
PICtail, REAL ICE, rfLAB, Select Mode, Total Endurance,
TSHARC, UniWinDriver, WiperLock and ZENA are
trademarks of Microchip Technology Incorporated in the
U.S.A. and other countries.
SQTP is a service mark of Microchip Technology Incorporated
in the U.S.A.
All other trademarks mentioned herein are property of their
respective companies.
© 2010, Microchip Technology Incorporated, Printed in the
U.S.A., All Rights Reserved.
Printed on recycled paper.
ISBN: 978-1-60932-126-0
Microchip received ISO/TS-16949:2002 certification for its worldwide
headquarters, design and wafer fabrication facilities in Chandler and
Tempe, Arizona; Gresham, Oregon and design centers in California
and India. The Company’s quality system processes and procedures
are for its PIC® MCUs and dsPIC® DSCs, KEELOQ® code hopping
devices, Serial EEPROMs, microperipherals, nonvolatile memory and
analog products. In addition, Microchip’s quality system for the design
and manufacture of development systems is ISO 9001:2000 certified.
 2010 Microchip Technology Inc.
DS22245A-page 21
WORLDWIDE SALES AND SERVICE
AMERICAS
ASIA/PACIFIC
ASIA/PACIFIC
EUROPE
Corporate Office
2355 West Chandler Blvd.
Chandler, AZ 85224-6199
Tel: 480-792-7200
Fax: 480-792-7277
Technical Support:
http://support.microchip.com
Web Address:
www.microchip.com
Asia Pacific Office
Suites 3707-14, 37th Floor
Tower 6, The Gateway
Harbour City, Kowloon
Hong Kong
Tel: 852-2401-1200
Fax: 852-2401-3431
India - Bangalore
Tel: 91-80-3090-4444
Fax: 91-80-3090-4123
India - New Delhi
Tel: 91-11-4160-8631
Fax: 91-11-4160-8632
Austria - Wels
Tel: 43-7242-2244-39
Fax: 43-7242-2244-393
Denmark - Copenhagen
Tel: 45-4450-2828
Fax: 45-4485-2829
India - Pune
Tel: 91-20-2566-1512
Fax: 91-20-2566-1513
France - Paris
Tel: 33-1-69-53-63-20
Fax: 33-1-69-30-90-79
Japan - Yokohama
Tel: 81-45-471- 6166
Fax: 81-45-471-6122
Germany - Munich
Tel: 49-89-627-144-0
Fax: 49-89-627-144-44
Atlanta
Duluth, GA
Tel: 678-957-9614
Fax: 678-957-1455
Boston
Westborough, MA
Tel: 774-760-0087
Fax: 774-760-0088
Chicago
Itasca, IL
Tel: 630-285-0071
Fax: 630-285-0075
Cleveland
Independence, OH
Tel: 216-447-0464
Fax: 216-447-0643
Dallas
Addison, TX
Tel: 972-818-7423
Fax: 972-818-2924
Detroit
Farmington Hills, MI
Tel: 248-538-2250
Fax: 248-538-2260
Kokomo
Kokomo, IN
Tel: 765-864-8360
Fax: 765-864-8387
Los Angeles
Mission Viejo, CA
Tel: 949-462-9523
Fax: 949-462-9608
Santa Clara
Santa Clara, CA
Tel: 408-961-6444
Fax: 408-961-6445
Toronto
Mississauga, Ontario,
Canada
Tel: 905-673-0699
Fax: 905-673-6509
Australia - Sydney
Tel: 61-2-9868-6733
Fax: 61-2-9868-6755
China - Beijing
Tel: 86-10-8528-2100
Fax: 86-10-8528-2104
China - Chengdu
Tel: 86-28-8665-5511
Fax: 86-28-8665-7889
Korea - Daegu
Tel: 82-53-744-4301
Fax: 82-53-744-4302
China - Chongqing
Tel: 86-23-8980-9588
Fax: 86-23-8980-9500
Korea - Seoul
Tel: 82-2-554-7200
Fax: 82-2-558-5932 or
82-2-558-5934
China - Hong Kong SAR
Tel: 852-2401-1200
Fax: 852-2401-3431
Malaysia - Kuala Lumpur
Tel: 60-3-6201-9857
Fax: 60-3-6201-9859
China - Nanjing
Tel: 86-25-8473-2460
Fax: 86-25-8473-2470
Malaysia - Penang
Tel: 60-4-227-8870
Fax: 60-4-227-4068
China - Qingdao
Tel: 86-532-8502-7355
Fax: 86-532-8502-7205
Philippines - Manila
Tel: 63-2-634-9065
Fax: 63-2-634-9069
China - Shanghai
Tel: 86-21-5407-5533
Fax: 86-21-5407-5066
Singapore
Tel: 65-6334-8870
Fax: 65-6334-8850
China - Shenyang
Tel: 86-24-2334-2829
Fax: 86-24-2334-2393
Taiwan - Hsin Chu
Tel: 886-3-6578-300
Fax: 886-3-6578-370
China - Shenzhen
Tel: 86-755-8203-2660
Fax: 86-755-8203-1760
Taiwan - Kaohsiung
Tel: 886-7-536-4818
Fax: 886-7-536-4803
China - Wuhan
Tel: 86-27-5980-5300
Fax: 86-27-5980-5118
Taiwan - Taipei
Tel: 886-2-2500-6610
Fax: 886-2-2508-0102
China - Xian
Tel: 86-29-8833-7252
Fax: 86-29-8833-7256
Thailand - Bangkok
Tel: 66-2-694-1351
Fax: 66-2-694-1350
Italy - Milan
Tel: 39-0331-742611
Fax: 39-0331-466781
Netherlands - Drunen
Tel: 31-416-690399
Fax: 31-416-690340
Spain - Madrid
Tel: 34-91-708-08-90
Fax: 34-91-708-08-91
UK - Wokingham
Tel: 44-118-921-5869
Fax: 44-118-921-5820
China - Xiamen
Tel: 86-592-2388138
Fax: 86-592-2388130
China - Zhuhai
Tel: 86-756-3210040
Fax: 86-756-3210049
01/05/10
DS22245A-page 22
 2010 Microchip Technology Inc.