25AA010A/25LC010A
1K SPI Bus Serial EEPROM
Device Selection Table
Part Number
VCC Range
Page Size
Temp. Ranges
Packages
25AA010A
1.8-5.5V
16 Bytes
I
P, MS, SN, ST, MN, MC, OT
25LC010A
2.5-5.5V
16 Bytes
I, E
P, MS, SN, ST, MN, MC, OT
Features:
Description:
• 10 MHz max. Clock Frequency
• Low-Power CMOS Technology:
- Max. Write Current: 5 mA at 5.5V, 10 MHz
- Read Current: 5 mA at 5.5V, 10 MHz
- Standby Current: 5 A at 5.5V
• 128 x 8-bit Organization
• Write Page mode (up to 16 bytes)
• Sequential Read
• Self-Timed Erase and Write Cycles (5 ms max.)
• Block Write Protection:
- Protect none, 1/4, 1/2 or all of array
• Built-In Write Protection:
- Power-on/off data protection circuitry
- Write enable latch
- Write-protect pin
• High Reliability:
- Endurance: 1,000,000 Erase/Write cycles
- Data retention: > 200 years
- ESD protection: > 4000V
• Temperature Ranges Supported:
- Industrial (I):
-40C to +85C
- Automotive (E):
-40C to +125C
The Microchip Technology Inc. 25XX010A* is a 1 Kbit
Serial Electrically Erasable Programmable Read-Only
Memory (EEPROM). The memory is accessed via a
simple Serial Peripheral Interface (SPI) compatible
serial bus. The bus signals required are a clock input
(SCK) plus separate data in (SI) and data out (SO)
lines. Access to the device is controlled through a Chip
Select (CS) input.
• Pb-Free and RoHS Compliant
Communication to the device can be paused via the
hold pin (HOLD). While the device is paused,
transitions on its inputs will be ignored, with the
exception of Chip Select, allowing the host to service
higher priority interrupts.
The 25XX010A is available in standard packages
including 8-lead PDIP and SOIC, and advanced
packages including 8-lead MSOP, 8-lead TSSOP and
rotated TSSOP, 8-lead 2x3 DFN and TDFN, and 6-lead
SOT-23.
Package Types (not to scale)
CS
SO
WP
VSS
Chip Select Input
SO
Serial Data Output
Write-Protect
VSS
Ground
SCK
HOLD
VCC
8
7
6
5
VCC
HOLD
SCK
SI
CS
SO
1
2
8
7
VCC
HOLD
WP
3
6
SCK
VSS
4
5
SI
DFN/TDFN
SOT-23
CS
SI
1
2
3
4
Function
WP
(P, SN)
(ST, MS)
Pin Function Table
Name
PDIP/SOIC
TSSOP/MSOP
(MC, MN)
(OT)
SCK
1
6
VDD
2
5
CS
CS 1
SO 2
8 VCC
VSS
SI
3
4
SO
WP 3
6 SCK
VSS 4
5 SI
X-Rotated TSSOP
(X/ST)
Serial Data Input
Serial Clock Input
Hold Input
Supply Voltage
2003-2012 Microchip Technology Inc.
7 HOLD
HOLD
VCC
CS
SO
1
2
3
4
8
7
6
5
SCK
SI
VSS
WP
*25XX010A is used in this document as a generic part number
for the 25AA010A and the 25LC010A.
DS21832H-page 1
25AA010A/25LC010A
1.0
ELECTRICAL CHARACTERISTICS
Absolute Maximum Ratings(†)
VCC .............................................................................................................................................................................6.5V
All inputs and outputs w.r.t. VSS ......................................................................................................... -0.6V to VCC +1.0V
Storage temperature .................................................................................................................................-65°C to 150°C
Ambient temperature under bias ...............................................................................................................-40°C to 125°C
ESD protection on all pins ..........................................................................................................................................4 kV
† NOTICE: Stresses above those listed under “Absolute Maximum Ratings” may cause permanent damage to the
device. This is a stress rating only and functional operation of the device at those or any other conditions above those
indicated in the operational listings of this specification is not implied. Exposure to maximum rating conditions for an
extended period of time may affect device reliability.
TABLE 1-1:
DC CHARACTERISTICS
DC CHARACTERISTICS
Param.
No.
Sym.
Characteristic
TA = -40°C to +85°C
TA = -40°C to +125°C
Industrial (I):
Automotive (E):
Min.
Max.
Units
D001
VIH1
High-level input
voltage
0.7 VCC
VCC+1
V
D002
VIL1
-0.3
0.3 VCC
V
D003
VIL2
Low-level input
voltage
D004
VOL
VCC = 1.8V to 5.5V
VCC = 2.5V to 5.5V
Test Conditions
VCC2.7V (Note)
-0.3
0.2 VCC
V
VCC < 2.7V (Note)
Low-level output
voltage
—
0.4
V
IOL = 2.1 mA
—
0.2
V
IOL = 1.0 mA, VCC < 2.5V
VCC -0.5
—
V
IOH = -400 A
D005
VOL
D006
VOH
High-level output
voltage
D007
ILI
Input leakage
current
—
±1
A
CS = VCC, VIN = VSS or VCC
D008
ILO
Output leakage
current
—
±1
A
CS = VCC, VOUT = VSS or VCC
D009
CINT
Internal capacitance
(all inputs and
outputs)
—
7
pF
TA = 25°C, CLK = 1.0 MHz,
VCC = 5.0V (Note)
D010
ICC Read
—
5
mA
—
2.5
mA
VCC = 5.5V; FCLK = 10.0 MHz;
SO = Open
VCC = 2.5V; FCLK = 5.0 MHz;
SO = Open
—
—
5
3
mA
mA
VCC = 5.5V
VCC = 2.5V
—
5
A
—
1
A
CS = VCC = 5.5V, Inputs tied to VCC or
VSS, TA = +125°C
CS = VCC = 2.5V, Inputs tied to VCC or
VSS, TA = +85°C
Operating current
D011
ICC Write
D012
ICCS
Standby current
Note:
This parameter is periodically sampled and not 100% tested.
DS21832H-page 2
2003-2012 Microchip Technology Inc.
25AA010A/25LC010A
TABLE 1-2:
AC CHARACTERISTICS
AC CHARACTERISTICS
Param.
Sym.
No.
Characteristic
Industrial (I):
Automotive (E):
TA = -40°C to +85°C
TA = -40°C to +125°C
VCC = 1.8V to 5.5V
VCC = 2.5V to 5.5V
Min.
Max.
Units
Test Conditions
—
—
—
10
5
3
MHz
MHz
MHz
4.5V VCC 5.5V
2.5V VCC 4.5V
1.8V VCC 2.5V
1
FCLK
Clock frequency
2
TCSS
CS setup time
50
100
150
—
—
—
ns
ns
ns
4.5V VCC 5.5V
2.5V VCC 4.5V
1.8V VCC 2.5V
3
TCSH
CS hold time
100
200
250
—
—
—
ns
ns
ns
4.5V VCC 5.5V
2.5V VCC 4.5V
1.8V VCC 2.5V
4
TCSD
CS disable time
50
—
ns
—
5
Tsu
Data setup time
10
20
30
—
—
—
ns
ns
ns
4.5V VCC 5.5V
2.5V VCC 4.5V
1.8V VCC 2.5V
6
THD
Data hold time
20
40
50
—
—
—
ns
ns
ns
4.5V VCC 5.5V
2.5V VCC 4.5V
1.8V VCC 2.5V
7
TR
CLK rise time
—
100
ns
(Note 1)
8
TF
CLK fall time
—
100
ns
(Note 1)
9
THI
Clock high time
50
100
150
—
—
—
ns
ns
ns
4.5V VCC 5.5V
2.5V VCC 4.5V
1.8V VCC 2.5V
10
TLO
Clock low time
50
100
150
—
—
—
ns
ns
ns
4.5V VCC 5.5V
2.5V VCC 4.5V
1.8V VCC 2.5V
11
TCLD
Clock delay time
50
—
ns
—
12
TCLE
Clock enable time
50
—
ns
—
13
TV
Output valid from clock
low
—
—
—
50
100
160
ns
ns
ns
4.5V VCC 5.5V
2.5V VCC 4.5V
1.8V VCC 2.5V
14
THO
Output hold time
0
—
ns
(Note 1)
15
TDIS
Output disable time
—
—
—
40
80
160
ns
ns
ns
4.5V VCC 5.5V (Note 1)
2.5V VCC 4.5V (Note 1)
1.8V VCC 2.5V (Note 1)
16
THS
HOLD setup time
20
40
80
—
—
—
ns
ns
ns
4.5V VCC 5.5V
2.5V VCC 4.5V
1.8V VCC 2.5V
Note 1: This parameter is periodically sampled and not 100% tested.
2: This parameter is not tested but ensured by characterization. For endurance estimates in a specific
application, please consult the Total Endurance™ Model which can be obtained from Microchip’s web site:
www.microchip.com.
3: TWC begins on the rising edge of CS after a valid write sequence and ends when the internal write cycle
is complete.
2003-2012 Microchip Technology Inc.
DS21832H-page 3
25AA010A/25LC010A
TABLE 1-2:
AC CHARACTERISTICS (CONTINUED)
Param.
Sym.
No.
TA = -40°C to +85°C
TA = -40°C to +125°C
Industrial (I):
Automotive (E):
AC CHARACTERISTICS
Characteristic
Min.
Max.
Units
VCC = 1.8V to 5.5V
VCC = 2.5V to 5.5V
Test Conditions
17
THH
HOLD hold time
20
40
80
—
—
—
ns
ns
ns
4.5V VCC 5.5V
2.5V VCC 4.5V
1.8V VCC 2.5V
18
THZ
HOLD low to output
high-Z
30
60
160
—
—
—
ns
ns
ns
4.5V VCC 5.5V (Note 1)
2.5V VCC 4.5V (Note 1)
1.8V VCC 2.5V (Note 1)
19
THV
HOLD high to output valid
30
60
160
—
—
—
ns
ns
ns
4.5V VCC 5.5V
2.5V VCC 4.5V
1.8V VCC 2.5V
20
TWC
Internal write cycle time
(byte or page)
—
5
ms
(Note 3)
21
—
Endurance
1M
—
E/W 25°C, VCC = 5.5V (Note 2)
Cycles
Note 1: This parameter is periodically sampled and not 100% tested.
2: This parameter is not tested but ensured by characterization. For endurance estimates in a specific
application, please consult the Total Endurance™ Model which can be obtained from Microchip’s web site:
www.microchip.com.
3: TWC begins on the rising edge of CS after a valid write sequence and ends when the internal write cycle
is complete.
TABLE 1-3:
AC TEST CONDITIONS
AC Waveform:
VLO = 0.2V
VHI
= VCC - 0.2V
VHI = 4.0V
—
(Note 1)
(Note 2)
CL = 100 pF
—
Timing Measurement Reference Level
Input
0.5 VCC
Output
0.5 VCC
Note 1: For VCC 4.0V
2: For VCC 4.0V
DS21832H-page 4
2003-2012 Microchip Technology Inc.
25AA010A/25LC010A
FIGURE 1-1:
HOLD TIMING
CS
17
16
17
16
SCK
18
SO
n+2
SI
n+2
n+1
n
19
High-Impedance
n
5
Don’t Care
n+1
n-1
n
n
n-1
HOLD
FIGURE 1-2:
SERIAL INPUT TIMING
4
CS
2
7
Mode 1,1
8
3
12
11
SCK Mode 0,0
5
SI
6
MSB in
LSB in
High-Impedance
SO
FIGURE 1-3:
SERIAL OUTPUT TIMING
CS
9
3
10
Mode 1,1
SCK
Mode 0,0
13
SO
14
MSB out
SI
2003-2012 Microchip Technology Inc.
15
ISB out
Don’t Care
DS21832H-page 5
25AA010A/25LC010A
2.0
FUNCTIONAL DESCRIPTION
2.1
Principles of Operation
The 25XX010A is a 128 byte Serial EEPROM designed
to interface directly with the Serial Peripheral Interface
(SPI) port of many of today’s popular microcontroller
families, including Microchip’s PIC® microcontrollers. It
may also interface with microcontrollers that do not
have a built-in SPI port by using discrete I/O lines
programmed properly in firmware to match the SPI
protocol.
The 25XX010A contains an 8-bit instruction register.
The device is accessed via the SI pin, with data being
clocked in on the rising edge of SCK. The CS pin must
be low and the HOLD pin must be high for the entire
operation.
Table 2-1 contains a list of the possible instruction
bytes and format for device operation. All instructions,
addresses, and data are transferred MSb first, LSb last.
Data (SI) is sampled on the first rising edge of SCK
after CS goes low. If the clock line is shared with other
peripheral devices on the SPI bus, the user can assert
the HOLD input and place the 25XX010A in ‘HOLD’
mode. After releasing the HOLD pin, operation will
resume from the point when the HOLD was asserted.
2.2
Read Sequence
The device is selected by pulling CS low. The 8-bit
READ instruction is transmitted to the 25XX010A
followed by an 8-bit address. See Figure 2-1 for more
details.
After the correct READ instruction and address are sent,
the data stored in the memory at the selected address
is shifted out on the SO pin. Data stored in the memory
at the next address can be read sequentially by
continuing to provide clock pulses to the slave. The
internal Address Pointer automatically increments to
the next higher address after each byte of data is
shifted out. When the highest address is reached
(7Fh), the address counter rolls over to address 00h
allowing the read cycle to be continued indefinitely. The
read operation is terminated by raising the CS pin
(Figure 2-1).
2.3
After setting the write enable latch, the user may
proceed by driving CS low, issuing a WRITE instruction,
followed by the remainder of the address, and then the
data to be written. Up to 16 bytes of data can be sent to
the device before a write cycle is necessary. The only
restriction is that all of the bytes must reside in the
same page. Additionally, a page address begins with
XXXX 0000 and ends with XXXX 1111. If the internal
address counter reaches XXXX 1111 and clock signals
continue to be applied to the chip, the address counter
will roll back to the first address of the page and overwrite any data that previously existed in those
locations.
Note:
Page write operations are limited to
writing bytes within a single physical page,
regardless of the number of bytes
actually being written. Physical page
boundaries start at addresses that are
integer multiples of the page buffer size
(or ‘page size’) and, end at addresses that
are integer multiples of page size – 1. If a
Page Write command attempts to write
across a physical page boundary, the
result is that the data wraps around to the
beginning of the current page (overwriting
data previously stored there), instead of
being written to the next page as might be
expected. It is therefore necessary for the
application software to prevent page write
operations that would attempt to cross a
page boundary.
For the data to be actually written to the array, the CS
must be brought high after the Least Significant bit (D0)
of the nth data byte has been clocked in. If CS is driven
high at any other time, the write operation will not be
completed. Refer to Figure 2-2 and Figure 2-3 for more
detailed illustrations on the byte write sequence and
the page write sequence, respectively. While the write
is in progress, the STATUS register may be read to
check the status of the WIP, WEL, BP1 and BP0 bits
(Figure 2-6). Attempting to read a memory array
location will not be possible during a write cycle. Polling
the WIP bit in the STATUS register is recommended in
order to determine if a write cycle is in progress. When
the write cycle is completed, the write enable latch is
reset.
Write Sequence
Prior to any attempt to write data to the 25XX010A, the
write enable latch must be set by issuing the WREN
instruction (Figure 2-4). This is done by setting CS low
and then clocking out the proper instruction into the
25XX010A. After all eight bits of the instruction are
transmitted, CS must be driven high to set the write
enable latch. If the write operation is initiated immediately after the WREN instruction without CS driven high,
data will not be written to the array since the write
enable latch was not properly set.
DS21832H-page 6
2003-2012 Microchip Technology Inc.
25AA010A/25LC010A
BLOCK DIAGRAM
STATUS
Register
HV Generator
Memory
Control
Logic
I/O Control
Logic
EEPROM
Array
X
Dec
Page Latches
SI
SO
Y Decoder
CS
SCK
Sense Amp.
R/W Control
HOLD
WP
VCC
VSS
TABLE 2-1:
INSTRUCTION SET
Instruction Name
Instruction Format
Description
READ
0000 x011
Read data from memory array beginning at selected address
WRITE
0000 x010
Write data to memory array beginning at selected address
WRDI
0000 x100
Reset the write enable latch (disable write operations)
WREN
0000 x110
Set the write enable latch (enable write operations)
RDSR
0000 x101
Read STATUS register
WRSR
0000 x001
Write STATUS register
x = don’t care
FIGURE 2-1:
READ SEQUENCE
CS
0
1
2
3
4
5
6
7
8
9 10 11 12 13 14 15 16 17 18 19 20 21 22 23
SCK
Instruction
SI
0
0
0
0
0
Address Byte
0
1
1 X A6 A5 A4 A3 A2 A1 A0
Data Out
High-Impedance
SO
2003-2012 Microchip Technology Inc.
7
6
5
4
3
2
1
0
DS21832H-page 7
25AA010A/25LC010A
FIGURE 2-2:
BYTE WRITE SEQUENCE
CS
0
1
2
3
4
5
6
7
8
9 10 11 12 13 14 15 16 17 18 19 20 21 22 23
SCK
Instruction
SI
0
0
0
0
0
Address Byte
0
Data Byte
0 X A6 A5 A4 A3 A2 A1 A0
1
Twc
7
6
5
4
3
2
1
0
High-Impedance
SO
X = don’t care
FIGURE 2-3:
PAGE WRITE SEQUENCE
CS
0
1
2
3
4
5
6
9 10 11 12 13 14 15 16 17 18 19 20 21 22 23
7
8
0
X A6 A5 A4 A3 A2 A1 A0 7
SCK
Address Byte
Instruction
SI
0
0
0
0
0
0 1
Data Byte 1
6
5
4
3
2
1
0
CS
24 25 26 27 28 29 30 31 32 33 34 35 36 37 38 39
SCK
Data Byte 2
SI
7
6
5
4
3
2
Data Byte 3
1
0
7
6
5
4
3
2
Data Byte n (16 max)
1
0
7
6
5
4
3
2
1
0
X = don’t care
DS21832H-page 8
2003-2012 Microchip Technology Inc.
25AA010A/25LC010A
2.4
Write Enable (WREN) and Write
Disable (WRDI)
The following is a list of conditions under which the
write enable latch will be reset:
•
•
•
•
•
The 25XX010A contains a write enable latch. See
Table 2-4 for the Write-Protect Functionality Matrix.
This latch must be set before any write operation will be
completed internally. The WREN instruction will set the
latch, and the WRDI will reset the latch.
FIGURE 2-4:
Power-up
WRDI instruction successfully executed
WRSR instruction successfully executed
WRITE instruction successfully executed
WP pin is brought low
WRITE ENABLE SEQUENCE (WREN)
CS
0
1
2
3
4
5
6
7
SCK
0
SI
0
0
0
1
1
0
High-Impedance
SO
FIGURE 2-5:
0
WRITE DISABLE SEQUENCE (WRDI)
CS
0
1
2
3
4
5
6
7
SCK
SI
0
0
0
0
0
1
0
0
High-Impedance
SO
2003-2012 Microchip Technology Inc.
DS21832H-page 9
25AA010A/25LC010A
2.5
Read Status Register Instruction
(RDSR)
The Write Enable Latch (WEL) bit indicates the status
of the write enable latch and is read-only. When set to
a ‘1’, the latch allows writes to the array, when set to a
‘0’, the latch prohibits writes to the array. The state of
this bit can always be updated via the WREN or WRDI
commands regardless of the state of write protection
on the STATUS register. These commands are shown
in Figure 2-4 and Figure 2-5.
The Read Status Register instruction (RDSR) provides
access to the STATUS register. See Figure 2-6 for the
RDSR timing sequence. The STATUS register may be
read at any time, even during a write cycle. The
STATUS register is formatted as follows:
TABLE 2-2:
The Block Protection (BP0 and BP1) bits indicate
which blocks are currently write-protected. These bits
are set by the user issuing the WRSR instruction, which
is shown in Figure 2-7. These bits are nonvolatile and
are described in more detail in Table 2-3.
STATUS REGISTER
7
6 5 4
3
2
1
–
– – – W/R W/R
R
X
X X X BP1 BP0 WEL
W/R = writable/readable. R = read-only.
0
R
WIP
The Write-In-Process (WIP) bit indicates whether the
25XX010A is busy with a write operation. When set to
a ‘1’, a write is in progress, when set to a ‘0’, no write
is in progress. This bit is read-only.
FIGURE 2-6:
READ STATUS REGISTER TIMING SEQUENCE (RDSR)
CS
0
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
1
0
SCK
Instruction
SI
0
0
0
0
0
High-Impedance
SO
DS21832H-page 10
1
0
1
Data from STATUS Register
7
6
5
4
3
2
2003-2012 Microchip Technology Inc.
25AA010A/25LC010A
2.6
Write Status Register Instruction
(WRSR)
TABLE 2-3:
The Write Status Register instruction (WRSR) allows the
user to write to the nonvolatile bits in the STATUS
register as shown in Table 2-2. See Figure 2-7 for the
WRSR timing sequence. Four levels of protection for the
array are selectable by writing to the appropriate bits in
the STATUS register. The user has the ability to writeprotect none, one, two or all four of the segments of the
array as shown in Table 2-3.
FIGURE 2-7:
ARRAY PROTECTION
BP1
BP0
Array Addresses
Write-Protected
0
0
none
0
1
upper 1/4
(60h-7Fh)
1
0
upper 1/2
(40h-7Fh)
1
1
all
(00h-7Fh)
WRITE STATUS REGISTER TIMING SEQUENCE (WRSR)
CS
0
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
1
0
SCK
Instruction
SI
0
0
0
0
Data to STATUS Register
0
0
0
1
7
6
5
4
3
2
High-Impedance
SO
Note:
An internal write cycle (TWC) is initiated on the rising edge of CS after a valid write STATUS register
sequence.
2003-2012 Microchip Technology Inc.
DS21832H-page 11
25AA010A/25LC010A
2.7
Data Protection
2.8
The following protection has been implemented to
prevent inadvertent writes to the array:
• The write enable latch is reset on power-up
• A write enable instruction must be issued to set
the write enable latch
• After a byte write, page write or STATUS register
write, the write enable latch is reset
• CS must be set high after the proper number of
clock cycles to start an internal write cycle
• Access to the array during an internal write cycle
is ignored and programming is continued
TABLE 2-4:
Power-On State
The 25XX010A powers on in the following state:
• The device is in low-power Standby mode
(CS = 1)
• The write enable latch is reset
• SO is in high-impedance state
• A high-to-low-level transition on CS is required to
enter active state
WRITE-PROTECT FUNCTIONALITY MATRIX
WP
(pin 3)
WEL
(SR bit 1)
Protected Blocks
Unprotected Blocks
Status Register
0 (low)
x
Protected
Protected
Protected
1 (high)
0
Protected
Protected
Protected
1 (high)
1
Protected
Writable
Writable
x = don’t care
DS21832H-page 12
2003-2012 Microchip Technology Inc.
25AA010A/25LC010A
3.0
PIN DESCRIPTIONS
The descriptions of the pins are listed in Table 3-1.
TABLE 3-1:
PIN FUNCTION TABLE
Name
PDIP
SOIC
MSOP
TSSOP
DFN(1)
TDFN(1)
Rotated
TSSOP
SOT-23
Function
CS
1
1
1
1
1
1
3
5
Chip Select Input
SO
2
2
2
2
2
2
4
4
Serial Data Output
WP
3
3
3
3
3
3
5
—
Write-Protect Pin
VSS
4
4
4
4
4
4
6
2
Ground
SI
5
5
5
5
5
5
7
3
Serial Data Input
SCK
6
6
6
6
6
6
8
1
Serial Clock Input
HOLD
7
7
7
7
7
7
1
—
Hold Input
8
8
8
8
8
8
2
6
Supply Voltage
VCC
Note 1:
3.1
The exposed pad on the DFN/TDFN packages can be connected to VSS or left floating.
Chip Select (CS)
A low level on this pin selects the device. A high level
deselects the device and forces it into Standby mode.
However, a programming cycle which is already
initiated or in progress will be completed, regardless of
the CS input signal. If CS is brought high during a
program cycle, the device will go into Standby mode as
soon as the programming cycle is complete. When the
device is deselected, SO goes to the high-impedance
state, allowing multiple parts to share the same SPI
bus. A low-to-high transition on CS after a valid write
sequence initiates an internal write cycle. After powerup, a low level on CS is required prior to any sequence
being initiated.
3.2
Serial Output (SO)
The SO pin is used to transfer data out of the
25XX010A. During a read cycle, data is shifted out on
this pin after the falling edge of the serial clock.
3.3
Write-Protect (WP)
The WP pin is a hardware write-protect input pin.
When it is low, all writes to the array or STATUS register are disabled, but any other operations function
normally. When WP is high, all functions, including
nonvolatile writes operate normally. At any time, when
WP is low, the write enable Reset latch will be reset
and programming will be inhibited. However, if a write
cycle is already in progress, WP going low will not
change or disable the write cycle. See Table 2-4 for
the Write-Protect Functionality Matrix.
3.4
3.5
Serial Clock (SCK)
The SCK is used to synchronize the communication
between a master and the 25XX010A. Instructions,
addresses or data present on the SI pin are latched on
the rising edge of the clock input, while data on the SO
pin is updated after the falling edge of the clock input.
3.6
Hold (HOLD)
The HOLD pin is used to suspend transmission to the
25XX010A while in the middle of a serial sequence
without having to retransmit the entire sequence again.
It must be held high any time this function is not being
used. Once the device is selected and a serial
sequence is underway, the HOLD pin may be pulled
low to pause further serial communication without
resetting the serial sequence. The HOLD pin must be
brought low while SCK is low, otherwise the HOLD
function will not be invoked until the next SCK high-tolow transition. The 25XX010A must remain selected
during this sequence. The SI, SCK and SO pins are in
a high-impedance state during the time the device is
paused and transitions on these pins will be ignored. To
resume serial communication, HOLD must be brought
high while the SCK pin is low, otherwise serial
communication will not resume. Lowering the HOLD
line at any time will tri-state the SO line.
Serial Input (SI)
The SI pin is used to transfer data into the device. It
receives instructions, addresses and data. Data is
latched on the rising edge of the serial clock.
2003-2012 Microchip Technology Inc.
DS21832H-page 13
25AA010A/25LC010A
4.0
PACKAGING INFORMATION
4.1
Package Marking Information
8-Lead PDIP
Example:
XXXXXXXX
T/XXXNNN
YYWW
25AA010A
I/P e3 1L7
0627
Example:
8-Lead SOIC
XXXXXXXT
XXXXYYWW
NNN
25AA01AI
SN e3 0627
1L7
8-Lead TSSOP
Example:
5A1A
I627
1L7
XXXX
TYWW
NNN
8-Lead MSOP (150 mil)
Example:
5L1AI
6271L7
XXXXXT
YWWNNN
Part Number
1st Line Marking Codes
TSSOP
MSOP
SOT-23
Rotated
25AA010A
5A1A
A1AX
5A1AT
12NN
—
25LC010A
5L1A
L1AX
5L1AT
15NN
16NN
Note:
I Temp.
DFN
Standard
T = Temperature grade (I, E)
Legend: XX...X
Y
YY
WW
NNN
e3
*
Note:
DS21832H-page 14
E Temp.
I Temp
TDFN
E. Temp
I Temp.
E. Temp
401
—
C01
—
404
405
C04
C05
NN = Alphanumeric traceability code
Customer-specific information
Year code (last digit of calendar year)
Year code (last 2 digits of calendar year)
Week code (week of January 1 is week ‘01’)
Alphanumeric traceability code
Pb-free JEDEC designator for Matte Tin (Sn)
This package is Pb-free. The Pb-free JEDEC designator ( e3 )
can be found on the outer packaging for this package.
In the event the full Microchip part number cannot be marked on one line, it will
be carried over to the next line, thus limiting the number of available
characters for customer-specific information.
2003-2012 Microchip Technology Inc.
25AA010A/25LC010A
Package Marking Information (continued)
8-Lead 2X3 DFN
XXX
YWW
NN
8-Lead 2X3 TDFN
XXX
YWW
NN
6-Lead SOT-23
XXNN
2003-2012 Microchip Technology Inc.
Example:
401
627
L7
Example:
C04
627
L7
Example:
12L7
DS21832H-page 15
25AA010A/25LC010A
3
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DS21832H-page 16
2003-2012 Microchip Technology Inc.
25AA010A/25LC010A
Note:
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
2003-2012 Microchip Technology Inc.
DS21832H-page 17
25AA010A/25LC010A
Note:
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
DS21832H-page 18
2003-2012 Microchip Technology Inc.
25AA010A/25LC010A
!
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3
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2003-2012 Microchip Technology Inc.
DS21832H-page 19
25AA010A/25LC010A
() )"* !
(+%+(
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3
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NOTE 1
1
2
b
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c
A
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DS21832H-page 20
2003-2012 Microchip Technology Inc.
25AA010A/25LC010A
Note:
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
2003-2012 Microchip Technology Inc.
DS21832H-page 21
25AA010A/25LC010A
Note:
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
DS21832H-page 22
2003-2012 Microchip Technology Inc.
25AA010A/25LC010A
Note:
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
2003-2012 Microchip Technology Inc.
DS21832H-page 23
25AA010A/25LC010A
Note:
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
DS21832H-page 24
2003-2012 Microchip Technology Inc.
25AA010A/25LC010A
,
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3
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'54
e
D
b
N
N
L
K
E2
E
EXPOSED PAD
NOTE 1
NOTE 1
2
1
2
1
D2
BOTTOM VIEW
TOP VIEW
A
A3
A1
NOTE 2
6&!
'!
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2003-2012 Microchip Technology Inc.
DS21832H-page 25
25AA010A/25LC010A
Note:
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
DS21832H-page 26
2003-2012 Microchip Technology Inc.
25AA010A/25LC010A
Note:
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
2003-2012 Microchip Technology Inc.
DS21832H-page 27
25AA010A/25LC010A
Note:
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
DS21832H-page 28
2003-2012 Microchip Technology Inc.
25AA010A/25LC010A
,
$*-./00%12(,
3
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2003-2012 Microchip Technology Inc.
DS21832H-page 29
25AA010A/25LC010A
3
!
(""!( !(/
3
&'
!&"&4#*!(!!&
4%&
&#&
&&255***'
'54
b
4
N
E
E1
PIN 1 ID BY
LASER MARK
1
2
3
e
e1
D
A
A2
c
φ
L
A1
L1
6&!
'!
9'&!
7"')
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99..
7
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7:
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1,
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DS21832H-page 30
2003-2012 Microchip Technology Inc.
25AA010A/25LC010A
Note:
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
2003-2012 Microchip Technology Inc.
DS21832H-page 31
25AA010A/25LC010A
APPENDIX A:
REVISION HISTORY
Revision A (9/2003)
Initial Release.
Revision B (12/2003)
Corrections to Section 1.0, Electrical Characteristics.
Revision C (2/2006)
Added Packages SOT-23, DFN and X-rotated TSSOP;
Revised AC Char., Params. 9, 10; Revised Package
Legend.
Revision D (10/2007)
Revised Pb-free in Features section; Replaced
Package Drawings; Revised Product ID System.
Revision E (9/2008)
Removed Preliminary status; Revised Table 1-2, AC
Characteristics Params. 7 and 8; Updated Package
Drawings.
Revision F (08/2011
Revised Table 1-2, AC Characteristics Param 9 and 10.
Revision G (11/2011)
Added TDFN Package.
Revision H (12/2012)
Revised Table 1-2, Param. 21.
DS21832H-page 32
2003-2012 Microchip Technology Inc.
25AA010A/25LC010A
THE MICROCHIP WEB SITE
CUSTOMER SUPPORT
Microchip provides online support via our WWW site at
www.microchip.com. This web site is used as a means
to make files and information easily available to
customers. Accessible by using your favorite Internet
browser, the web site contains the following
information:
Users of Microchip products can receive assistance
through several channels:
• Product Support – Data sheets and errata,
application notes and sample programs, design
resources, user’s guides and hardware support
documents, latest software releases and archived
software
• General Technical Support – Frequently Asked
Questions (FAQ), technical support requests,
online discussion groups, Microchip consultant
program member listing
• Business of Microchip – Product selector and
ordering guides, latest Microchip press releases,
listing of seminars and events, listings of
Microchip sales offices, distributors and factory
representatives
•
•
•
•
•
Distributor or Representative
Local Sales Office
Field Application Engineer (FAE)
Technical Support
Development Systems Information Line
Customers
should
contact
their
distributor,
representative or field application engineer (FAE) for
support. Local sales offices are also available to help
customers. A listing of sales offices and locations is
included in the back of this document.
Technical support is available through the web site
at: http://microchip.com/support
CUSTOMER CHANGE NOTIFICATION
SERVICE
Microchip’s customer notification service helps keep
customers current on Microchip products. Subscribers
will receive e-mail notification whenever there are
changes, updates, revisions or errata related to a
specified product family or development tool of interest.
To register, access the Microchip web site at
www.microchip.com. Under “Support”, click on
“Customer Change Notification” and follow the
registration instructions.
2003-2012 Microchip Technology Inc.
DS21832H-page 33
25AA010A/25LC010A
READER RESPONSE
It is our intention to provide you with the best documentation possible to ensure successful use of your Microchip
product. If you wish to provide your comments on organization, clarity, subject matter, and ways in which our
documentation can better serve you, please FAX your comments to the Technical Publications Manager at
(480) 792-4150.
Please list the following information, and use this outline to provide us with your comments about this document.
TO:
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RE:
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Total Pages Sent ________
From: Name
Company
Address
City / State / ZIP / Country
Telephone: (_______) _________ - _________
FAX: (______) _________ - _________
Application (optional):
Would you like a reply?
Y
N
Device: 25AA010A/25LC010A
Literature Number: DS21832H
Questions:
1. What are the best features of this document?
2. How does this document meet your hardware and software development needs?
3. Do you find the organization of this document easy to follow? If not, why?
4. What additions to the document do you think would enhance the structure and subject?
5. What deletions from the document could be made without affecting the overall usefulness?
6. Is there any incorrect or misleading information (what and where)?
7. How would you improve this document?
DS21832H-page 34
2003-2012 Microchip Technology Inc.
25AA010A/25LC010A
PRODUCT IDENTIFICATION SYSTEM
To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office.
PART NO.
X
Device
Tape & Reel
X
–
Temperature
/XX
Package
Examples:
a)
b)
Device:
25AA010A: 1 Kbit, 1.8V, 16 Byte Page, SPI Serial EEPROM
25LC010A: 1 Kbit, 2.5V, 16 Byte Page, SPI Serial EEPROM
c)
Tape & Reel:
Blank
T
=
=
Standard packaging
Tape & Reel
d)
Temperature
Range:
I
E
=
=
-40C to+85C
-40C to+125C
Package:
MS
=
P
=
SN
=
ST
=
MC
=
(1)
MNY =
OT
Note
1:
=
Plastic MSOP (Micro Small Outline), 8-lead
Plastic DIP (300 mm body), 8-lead
Plastic SOIC (3.90 mm body), 8-lead
Plastic TSSOP (4.4 mm body), 8-lead
Plastic DFN (2x3x0.9 mm body), 8-lead
Plastic TDFN (2x3x0.75 mm body), 8-lead
(Tape and Reel only)
Plastic SOT-23, 6-lead (Tape and Reel only)
e)
f)
25AA010A-I/MS = 1 Kbit, 16-byte page, 1.8V
Serial EEPROM, Industrial temp., MSOP
package
25AA010AT-I/SN = 1 Kbit, 16-byte page, 1.8V
Serial EEPROM, Industrial temp., Tape & Reel,
SOIC package
25LC010AT-I/SN = 1 Kbit, 16-byte page, 2.5V
Serial EEPROM, Industrial temp., Tape & Reel,
SOIC package
25LC010AT-I/ST = 1 Kbit, 16-byte page, 2.5V
Serial EEPROM, Industrial temp., Tape & Reel,
TSSOP package
25LC010AT-E/SN = 1 Kbit, 16-byte page, 2.5V
serial EEPROM, Extended temp., Tape & Reel,
SOIC Package
25LC010AT-I/MNY = 1 Kbit, 16-byte page, 2.5V
Serial EEPROM, Industrial temp., Tape & Reel,
TDFN package
“Y” indicates a Nickel Palladium Gold (NiPdAu) finish.
2003-2012 Microchip Technology Inc.
DS21832H-page 35
25AA010A/25LC010A
NOTES:
DS21832H-page 36
2003-2012 Microchip Technology Inc.
Note the following details of the code protection feature on Microchip devices:
•
Microchip products meet the specification contained in their particular Microchip Data Sheet.
•
Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the
intended manner and under normal conditions.
•
There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our
knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data
Sheets. Most likely, the person doing so is engaged in theft of intellectual property.
•
Microchip is willing to work with the customer who is concerned about the integrity of their code.
•
Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not
mean that we are guaranteeing the product as “unbreakable.”
Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our
products. Attempts to break Microchip’s code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts
allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act.
Information contained in this publication regarding device
applications and the like is provided only for your convenience
and may be superseded by updates. It is your responsibility to
ensure that your application meets with your specifications.
MICROCHIP MAKES NO REPRESENTATIONS OR
WARRANTIES OF ANY KIND WHETHER EXPRESS OR
IMPLIED, WRITTEN OR ORAL, STATUTORY OR
OTHERWISE, RELATED TO THE INFORMATION,
INCLUDING BUT NOT LIMITED TO ITS CONDITION,
QUALITY, PERFORMANCE, MERCHANTABILITY OR
FITNESS FOR PURPOSE. Microchip disclaims all liability
arising from this information and its use. Use of Microchip
devices in life support and/or safety applications is entirely at
the buyer’s risk, and the buyer agrees to defend, indemnify and
hold harmless Microchip from any and all damages, claims,
suits, or expenses resulting from such use. No licenses are
conveyed, implicitly or otherwise, under any Microchip
intellectual property rights.
Trademarks
The Microchip name and logo, the Microchip logo, dsPIC,
FlashFlex, KEELOQ, KEELOQ logo, MPLAB, PIC, PICmicro,
PICSTART, PIC32 logo, rfPIC, SST, SST Logo, SuperFlash
and UNI/O are registered trademarks of Microchip Technology
Incorporated in the U.S.A. and other countries.
FilterLab, Hampshire, HI-TECH C, Linear Active Thermistor,
MTP, SEEVAL and The Embedded Control Solutions
Company are registered trademarks of Microchip Technology
Incorporated in the U.S.A.
Silicon Storage Technology is a registered trademark of
Microchip Technology Inc. in other countries.
Analog-for-the-Digital Age, Application Maestro, BodyCom,
chipKIT, chipKIT logo, CodeGuard, dsPICDEM,
dsPICDEM.net, dsPICworks, dsSPEAK, ECAN,
ECONOMONITOR, FanSense, HI-TIDE, In-Circuit Serial
Programming, ICSP, Mindi, MiWi, MPASM, MPF, MPLAB
Certified logo, MPLIB, MPLINK, mTouch, Omniscient Code
Generation, PICC, PICC-18, PICDEM, PICDEM.net, PICkit,
PICtail, REAL ICE, rfLAB, Select Mode, SQI, Serial Quad I/O,
Total Endurance, TSHARC, UniWinDriver, WiperLock, ZENA
and Z-Scale are trademarks of Microchip Technology
Incorporated in the U.S.A. and other countries.
SQTP is a service mark of Microchip Technology Incorporated
in the U.S.A.
GestIC and ULPP are registered trademarks of Microchip
Technology Germany II GmbH & Co. & KG, a subsidiary of
Microchip Technology Inc., in other countries.
All other trademarks mentioned herein are property of their
respective companies.
© 2003-2012, Microchip Technology Incorporated, Printed in
the U.S.A., All Rights Reserved.
Printed on recycled paper.
ISBN: 9781620767627
QUALITY MANAGEMENT SYSTEM
CERTIFIED BY DNV
== ISO/TS 16949 ==
2003-2012 Microchip Technology Inc.
Microchip received ISO/TS-16949:2009 certification for its worldwide
headquarters, design and wafer fabrication facilities in Chandler and
Tempe, Arizona; Gresham, Oregon and design centers in California
and India. The Company’s quality system processes and procedures
are for its PIC® MCUs and dsPIC® DSCs, KEELOQ® code hopping
devices, Serial EEPROMs, microperipherals, nonvolatile memory and
analog products. In addition, Microchip’s quality system for the design
and manufacture of development systems is ISO 9001:2000 certified.
DS21832H-page 37
Worldwide Sales and Service
AMERICAS
ASIA/PACIFIC
ASIA/PACIFIC
EUROPE
Corporate Office
2355 West Chandler Blvd.
Chandler, AZ 85224-6199
Tel: 480-792-7200
Fax: 480-792-7277
Technical Support:
http://www.microchip.com/
support
Web Address:
www.microchip.com
Asia Pacific Office
Suites 3707-14, 37th Floor
Tower 6, The Gateway
Harbour City, Kowloon
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Tel: 852-2401-1200
Fax: 852-2401-3431
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Tel: 91-80-3090-4444
Fax: 91-80-3090-4123
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Tel: 91-11-4160-8631
Fax: 91-11-4160-8632
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Tel: 43-7242-2244-39
Fax: 43-7242-2244-393
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Tel: 678-957-9614
Fax: 678-957-1455
Boston
Westborough, MA
Tel: 774-760-0087
Fax: 774-760-0088
Chicago
Itasca, IL
Tel: 630-285-0071
Fax: 630-285-0075
Cleveland
Independence, OH
Tel: 216-447-0464
Fax: 216-447-0643
Dallas
Addison, TX
Tel: 972-818-7423
Fax: 972-818-2924
Detroit
Farmington Hills, MI
Tel: 248-538-2250
Fax: 248-538-2260
Indianapolis
Noblesville, IN
Tel: 317-773-8323
Fax: 317-773-5453
Los Angeles
Mission Viejo, CA
Tel: 949-462-9523
Fax: 949-462-9608
Santa Clara
Santa Clara, CA
Tel: 408-961-6444
Fax: 408-961-6445
Toronto
Mississauga, Ontario,
Canada
Tel: 905-673-0699
Fax: 905-673-6509
Australia - Sydney
Tel: 61-2-9868-6733
Fax: 61-2-9868-6755
China - Beijing
Tel: 86-10-8569-7000
Fax: 86-10-8528-2104
China - Chengdu
Tel: 86-28-8665-5511
Fax: 86-28-8665-7889
China - Chongqing
Tel: 86-23-8980-9588
Fax: 86-23-8980-9500
Netherlands - Drunen
Tel: 31-416-690399
Fax: 31-416-690340
Korea - Daegu
Tel: 82-53-744-4301
Fax: 82-53-744-4302
Spain - Madrid
Tel: 34-91-708-08-90
Fax: 34-91-708-08-91
China - Hangzhou
Tel: 86-571-2819-3187
Fax: 86-571-2819-3189
Korea - Seoul
Tel: 82-2-554-7200
Fax: 82-2-558-5932 or
82-2-558-5934
China - Hong Kong SAR
Tel: 852-2943-5100
Fax: 852-2401-3431
Malaysia - Kuala Lumpur
Tel: 60-3-6201-9857
Fax: 60-3-6201-9859
China - Nanjing
Tel: 86-25-8473-2460
Fax: 86-25-8473-2470
Malaysia - Penang
Tel: 60-4-227-8870
Fax: 60-4-227-4068
China - Qingdao
Tel: 86-532-8502-7355
Fax: 86-532-8502-7205
Philippines - Manila
Tel: 63-2-634-9065
Fax: 63-2-634-9069
China - Shanghai
Tel: 86-21-5407-5533
Fax: 86-21-5407-5066
Singapore
Tel: 65-6334-8870
Fax: 65-6334-8850
China - Shenyang
Tel: 86-24-2334-2829
Fax: 86-24-2334-2393
Taiwan - Hsin Chu
Tel: 886-3-5778-366
Fax: 886-3-5770-955
China - Shenzhen
Tel: 86-755-8864-2200
Fax: 86-755-8203-1760
Taiwan - Kaohsiung
Tel: 886-7-213-7828
Fax: 886-7-330-9305
China - Wuhan
Tel: 86-27-5980-5300
Fax: 86-27-5980-5118
Taiwan - Taipei
Tel: 886-2-2508-8600
Fax: 886-2-2508-0102
China - Xian
Tel: 86-29-8833-7252
Fax: 86-29-8833-7256
Thailand - Bangkok
Tel: 66-2-694-1351
Fax: 66-2-694-1350
UK - Wokingham
Tel: 44-118-921-5869
Fax: 44-118-921-5820
China - Xiamen
Tel: 86-592-2388138
Fax: 86-592-2388130
China - Zhuhai
Tel: 86-756-3210040
Fax: 86-756-3210049
DS21832H-page 38
Italy - Milan
Tel: 39-0331-742611
Fax: 39-0331-466781
Japan - Tokyo
Tel: 81-3-6880- 3770
Fax: 81-3-6880-3771
11/27/12
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