SLRS008C − SEPTEMBER 1986 − REVISED NOVEMBER 2004 D Featuring Unitrode L293 and L293D D D D D D D D D D Products Now From Texas Instruments Wide Supply-Voltage Range: 4.5 V to 36 V Separate Input-Logic Supply Internal ESD Protection Thermal Shutdown High-Noise-Immunity Inputs Functionally Similar to SGS L293 and SGS L293D Output Current 1 A Per Channel (600 mA for L293D) Peak Output Current 2 A Per Channel (1.2 A for L293D) Output Clamp Diodes for Inductive Transient Suppression (L293D) L293 . . . N OR NE PACKAGE L293D . . . NE PACKAGE (TOP VIEW) 1,2EN 1A 1Y HEAT SINK AND GROUND 16 2 15 3 14 4 13 5 12 2Y 2A 6 11 7 10 VCC2 8 9 VCC1 4A 4Y HEAT SINK AND GROUND 3Y 3A 3,4EN L293 . . . DWP PACKAGE (TOP VIEW) 1,2EN 1A 1Y NC NC NC description/ordering information The L293 and L293D are quadruple high-current half-H drivers. The L293 is designed to provide bidirectional drive currents of up to 1 A at voltages from 4.5 V to 36 V. The L293D is designed to provide bidirectional drive currents of up to 600-mA at voltages from 4.5 V to 36 V. Both devices are designed to drive inductive loads such as relays, solenoids, dc and bipolar stepping motors, as well as other high-current/high-voltage loads in positive-supply applications. 1 HEAT SINK AND GROUND 1 28 2 27 3 26 4 25 5 24 6 23 7 22 8 21 9 20 NC NC 2Y 2A 10 19 11 18 12 17 13 16 VCC2 14 15 VCC1 4A 4Y NC NC NC HEAT SINK AND GROUND NC NC 3Y 3A 3,4EN All inputs are TTL compatible. Each output is a complete totem-pole drive circuit, with a Darlington transistor sink and a pseudoDarlington source. Drivers are enabled in pairs, with drivers 1 and 2 enabled by 1,2EN and drivers 3 and 4 enabled by 3,4EN. When an enable input is high, the associated drivers are enabled, and their outputs are active and in phase with their inputs. When the enable input is low, those drivers are disabled, and their outputs are off and in the high-impedance state. With the proper data inputs, each pair of drivers forms a full-H (or bridge) reversible drive suitable for solenoid or motor applications. ORDERING INFORMATION 0°C to 70°C ORDERABLE PART NUMBER PACKAGE† TA TOP-SIDE MARKING HSOP (DWP) Tube of 20 L293DWP L293DWP PDIP (N) Tube of 25 L293N L293N Tube of 25 L293NE L293NE Tube of 25 L293DNE PDIP (NE) L293DNE † Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at www.ti.com/sc/package. Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. Copyright 2004, Texas Instruments Incorporated !"# $"%&! '#( '"! ! $#!! $# )# # #* "# '' +,( '"! $!#- '# #!#&, !&"'# #- && $##( POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 1 SLRS008C − SEPTEMBER 1986 − REVISED NOVEMBER 2004 description/ordering information (continued) On the L293, external high-speed output clamp diodes should be used for inductive transient suppression. A VCC1 terminal, separate from VCC2, is provided for the logic inputs to minimize device power dissipation. The L293and L293D are characterized for operation from 0°C to 70°C. block diagram VCC1 1 0 1 0 1 16 2 15 1 M 14 4 13 5 12 6 11 3 7 10 9 8 VCC2 NOTE: Output diodes are internal in L293D. FUNCTION TABLE (each driver) INPUTS† OUTPUT A EN Y H H H L H L X L Z H = high level, L = low level, X = irrelevant, Z = high impedance (off) † In the thermal shutdown mode, the output is in the high-impedance state, regardless of the input levels. 2 POST OFFICE BOX 655303 M 4 3 2 1 0 1 0 • DALLAS, TEXAS 75265 1 0 1 0 M SLRS008C − SEPTEMBER 1986 − REVISED NOVEMBER 2004 logic diagram 1A 1,2EN 2A 3A 3,4EN 4A 2 1 7 10 9 15 ÁÁ ÁÁ ÁÁ ÁÁ ÁÁ ÁÁ ÁÁ ÁÁ ÁÁ 3 6 11 14 1Y 2Y 3Y 4Y schematics of inputs and outputs (L293) EQUIVALENT OF EACH INPUT TYPICAL OF ALL OUTPUTS VCC2 VCC1 Current Source Input Output GND GND POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 3 SLRS008C − SEPTEMBER 1986 − REVISED NOVEMBER 2004 schematics of inputs and outputs (L293D) EQUIVALENT OF EACH INPUT TYPICAL OF ALL OUTPUTS VCC2 VCC1 Current Source Output Input GND GND absolute maximum ratings over operating free-air temperature range (unless otherwise noted)† Supply voltage, VCC1 (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 36 V Output supply voltage, VCC2 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 36 V Input voltage, VI . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 V Output voltage range, VO . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −3 V to VCC2 + 3 V Peak output current, IO (nonrepetitive, t ≤ 5 ms): L293 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±2 A Peak output current, IO (nonrepetitive, t ≤ 100 µs): L293D . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ± 1.2 A Continuous output current, IO: L293 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±1 A Continuous output current, IO: L293D . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ± 600 mA Package thermal impedance, θJA (see Notes 2 and 3): DWP package . . . . . . . . . . . . . . . . . . . . . . . TBD°C/W N package . . . . . . . . . . . . . . . . . . . . . . . . . . . . 67°C/W NE package . . . . . . . . . . . . . . . . . . . . . . . . . TBD°C/W Maximum junction temperature, TJ . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 150°C Storage temperature range, Tstg . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −65°C to 150°C † Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. NOTES: 1. All voltage values are with respect to the network ground terminal. 2. Maximum power dissipation is a function of TJ(max), qJA, and TA. The maximum allowable power dissipation at any allowable ambient temperature is PD = (TJ(max) − TA)/qJA. Operating at the absolute maximum TJ of 150°C can affect reliability. 3. The package thermal impedance is calculated in accordance with JESD 51-7. 4 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 SLRS008C − SEPTEMBER 1986 − REVISED NOVEMBER 2004 recommended operating conditions MIN VCC1 VCC2 VCC1 ≤ 7 V Supply voltage VIH High-level input voltage VIL Low-level output voltage VCC1 ≥ 7 V MAX 4.5 7 VCC1 2.3 36 2.3 −0.3† UNIT V VCC1 7 V 1.5 V V TA Operating free-air temperature 0 70 °C † The algebraic convention, in which the least positive (most negative) designated minimum, is used in this data sheet for logic voltage levels. electrical characteristics, VCC1 = 5 V, VCC2 = 24 V, TA = 25°C PARAMETER TEST CONDITIONS VOH High-level output voltage L293: IOH = −1 A L293D: IOH = − 0.6 A VOL Low-level output voltage L293: IOL = 1 A L293D: IOL = 0.6 A VOKH VOKL High-level output clamp voltage L293D: IOK = − 0.6 A Low-level output clamp voltage L293D: IOK = 0.6 A IIH High-level input current IIL Low-level input current MIN TYP VCC2 − 1.8 VCC2 − 1.4 1.2 ICC1 Logic supply current IO = 0 10 −3 −10 −2 −100 All outputs at high level 13 22 All outputs at low level 35 60 8 24 All outputs at high level 14 24 All outputs at low level 2 6 All outputs at high impedance 2 4 All outputs at high impedance ICC2 Output supply current IO = 0 V 100 VI = 0 V V 0.2 A EN 1.8 0.2 VI = 7 V UNIT V VCC2 + 1.3 1.3 A EN MAX µA A µA A mA mA switching characteristics, VCC1 = 5 V, VCC2 = 24 V, TA = 25°C L293NE, L293DNE PARAMETER TEST CONDITIONS MIN TYP MAX UNIT tPLH tPHL Propagation delay time, low-to-high-level output from A input 800 ns Propagation delay time, high-to-low-level output from A input 400 ns tTLH tTHL Transition time, low-to-high-level output 300 ns 300 ns CL = 30 pF, See Figure 1 Transition time, high-to-low-level output switching characteristics, VCC1 = 5 V, VCC2 = 24 V, TA = 25°C PARAMETER TEST CONDITIONS L293DWP, L293N L293DN MIN TYP UNIT MAX tPLH tPHL Propagation delay time, low-to-high-level output from A input 750 ns Propagation delay time, high-to-low-level output from A input 200 ns tTLH tTHL Transition time, low-to-high-level output 100 ns 350 ns CL = 30 pF, See Figure 1 Transition time, high-to-low-level output POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 5 SLRS008C − SEPTEMBER 1986 − REVISED NOVEMBER 2004 PARAMETER MEASUREMENT INFORMATION tf tr Input 5 V 24 V Input 50% 50% 10% Pulse Generator (see Note B) VCC1 VCC2 10% 0 tw A tPLH tPHL Y 3V EN Output CL = 30 pF (see Note A) 90% 90% 50% 50% 10% tTHL TEST CIRCUIT NOTES: A. CL includes probe and jig capacitance. B. The pulse generator has the following characteristics: tr ≤ 10 ns, tf ≤ 10 ns, tw = 10 µs, PRR = 5 kHz, ZO = 50 Ω. Figure 1. Test Circuit and Voltage Waveforms • DALLAS, TEXAS 75265 VOL tTLH VOLTAGE WAVEFORMS POST OFFICE BOX 655303 VOH Output 10% 6 3V 90% 90% SLRS008C − SEPTEMBER 1986 − REVISED NOVEMBER 2004 APPLICATION INFORMATION 5V 24 V VCC2 VCC1 16 10 kΩ 8 1,2EN 1 Control A 1A 1Y 2 3 Motor 2A 2Y 7 6 3,4EN 9 Control B 3A 3Y 10 11 4A 4Y 15 14 Thermal Shutdown 4, 5, 12, 13 GND Figure 2. Two-Phase Motor Driver (L293) POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 7 SLRS008C − SEPTEMBER 1986 − REVISED NOVEMBER 2004 APPLICATION INFORMATION 5V 24 V VCC1 10 kΩ VCC2 8 16 1,2EN 1 Control A 1Y 1A 2 3 Motor 2A 2Y 7 6 3,4EN 9 Control B 3A 10 3Y 4A 15 4Y 11 14 Thermal Shutdown 4, 5, 12, 13 GND Figure 3. Two-Phase Motor Driver (L293D) 8 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 SLRS008C − SEPTEMBER 1986 − REVISED NOVEMBER 2004 APPLICATION INFORMATION VCC2 SES5001 M1 SES5001 M2 3A 10 4A 11 15 EN 3A H H Fast motor stop H Run H L Run L Fast motor stop X Free-running motor stop X Free-running motor stop 14 16 8 VCC1 L 1/2 L293 9 EN M1 4A M2 L = low, H = high, X = don’t care 4, 5, 12, 13 GND Figure 4. DC Motor Controls (connections to ground and to supply voltage) VCC2 2 × SES5001 M 2 × SES5001 2A 1A 7 6 3 2 16 8 1/2 L293 VCC1 1 EN EN 1A 2A H L H Turn right FUNCTION H H L Turn left H L L Fast motor stop H H H Fast motor stop L X X Fast motor stop L = low, H = high, X = don’t care 4, 5, 12, 13 GND Figure 5. Bidirectional DC Motor Control POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 9 SLRS008C − SEPTEMBER 1986 − REVISED NOVEMBER 2004 APPLICATION INFORMATION IL1/IL2 = 300 mA C1 0.22 µF 16 L293 1 2 D5 L1 VCC2 IL1 15 + D1 + D8 3 14 4 13 5 12 6 11 + D6 VCC1 D4 L2 IL2 + 7 10 8 9 D7 D3 D2 D1−D8 = SES5001 Figure 6. Bipolar Stepping-Motor Control mounting instructions The Rthj-amp of the L293 can be reduced by soldering the GND pins to a suitable copper area of the printed circuit board or to an external heat sink. Figure 9 shows the maximum package power PTOT and the θJA as a function of the side of two equal square copper areas having a thickness of 35 µm (see Figure 7). In addition, an external heat sink can be used (see Figure 8). During soldering, the pin temperature must not exceed 260°C, and the soldering time must not exceed 12 seconds. The external heatsink or printed circuit copper area must be connected to electrical ground. 10 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 SLRS008C − SEPTEMBER 1986 − REVISED NOVEMBER 2004 APPLICATION INFORMATION Copper Area 35-µm Thickness Printed Circuit Board Figure 7. Example of Printed Circuit Board Copper Area (used as heat sink) 17.0 mm 11.9 mm 38.0 mm Figure 8. External Heat Sink Mounting Example (θJA = 25°C/W) POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 11 SLRS008C − SEPTEMBER 1986 − REVISED NOVEMBER 2004 APPLICATION INFORMATION MAXIMUM POWER DISSIPATION vs AMBIENT TEMPERATURE MAXIMUM POWER AND JUNCTION vs THERMAL RESISTANCE 80 4 2 60 40 PTOT (TA = 70°C) 1 20 0 0 0 10 30 20 Side 40 50 P TOT − Power Dissipation − W θJA 3 θ JA − Thermal Resistance − °C/W P TOT − Power Dissipation − W 5 With Infinite Heat Sink 4 3 Heat Sink With θJA = 25°C/W 2 Free Air 1 0 −50 50 100 TA − Ambient Temperature − °C − mm Figure 10 Figure 9 12 0 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 150 PACKAGE OPTION ADDENDUM www.ti.com 25-Feb-2005 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Drawing Pins Package Eco Plan (2) Qty Lead/Ball Finish MSL Peak Temp (3) L293DDWP OBSOLETE SOIC DW 28 None CU SNPB Level-2-220C-1 YEAR L293DDWPTR OBSOLETE SOIC DW 28 None CU SNPB Level-2-220C-1 YEAR L293DN OBSOLETE PDIP N 16 L293DNE ACTIVE PDIP NE 16 25 None CU SNPB Level-NA-NA-NA Pb-Free (RoHS) Call TI Level-NC-NC-NC L293DSP OBSOLETE 16 None Call TI Call TI L293DSP883B OBSOLETE 16 None Call TI Call TI L293DSP883C OBSOLETE None Call TI Call TI L293DWP ACTIVE SO Power PAD DWP 28 None Call TI Level-2-220C-1 YEAR L293DWPTR OBSOLETE SO Power PAD DWP 28 None Call TI Call TI L293N ACTIVE PDIP N 16 25 None CU SNPB Level-NA-NA-NA L293NE ACTIVE PDIP NE 16 25 Pb-Free (RoHS) Call TI Level-NC-NC-NC UTR 20 (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - May not be currently available - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. None: Not yet available Lead (Pb-Free). Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Green (RoHS & no Sb/Br): TI defines "Green" to mean "Pb-Free" and in addition, uses package materials that do not contain halogens, including bromine (Br) or antimony (Sb) above 0.1% of total product weight. (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDECindustry standard classifications, and peak solder temperature. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. Addendum-Page 1 MECHANICAL DATA MPDI003 – OCTOBER 1994 NE (R-PDIP-T**) PLASTIC DUAL-IN-LINE PACKAGE 20 PIN SHOWN 0.070 (1,78) MAX 11 20 PINS ** DIM A C 1 20 0.914 (23,22) MIN MAX B 16 0.780 (19,80) 0.975 (24,77) MIN 0.930 (23,62) MAX 1.000 (25,40) 10 C MIN 0.240 (6,10) 0.260 (6,61) MAX 0.260 (6,60) 0.280 (7,11) 0.020 (0,51) MIN A 0.200 (5,08) MAX Seating Plane 0.155 (3,94) 0.125 (3,17) 0.100 (2,54) 0.021 (0,533) 0.015 (0,381) 0.010 (0,25) M 0.310 (7,87) 0.290 (7,37) 0.020 (0,51) MIN B 0.200 (5,08) MAX Seating Plane 0.155 (3,94) 0.125 (3,17) 0.100 (2,54) 0.021 (0,533) 0.015 (0,381) 0.010 (0,25) M 0°– 15° 0.010 (0,25) NOM 4040054 / B 04/95 NOTES: A. All linear dimensions are in inches (millimeters). B. This drawing is subject to change without notice. C. Falls within JEDEC MS-001 (16 pin only) POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 1 IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements, improvements, and other changes to its products and services at any time and to discontinue any product or service without notice. Customers should obtain the latest relevant information before placing orders and should verify that such information is current and complete. All products are sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment. TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TI’s standard warranty. Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty. Except where mandated by government requirements, testing of all parameters of each product is not necessarily performed. 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