SN74LVCZ16245A 16-BIT BUS TRANSCEIVER WITH 3-STATE OUTPUTS SCES278D – JUNE 1999 – REVISED AUGUST 2002 D D D D D D D D DGG, DGV, OR DL PACKAGE (TOP VIEW) Member of the Texas Instruments Widebus Family Operates From 2.7 V to 3.6 V Inputs Accept Voltages to 5.5 V Max tpd of 3.7 ns at 3.3 V Ioff and Power-Up 3-State Support Hot Insertion Supports Mixed-Mode Signal Operation on All Ports (5-V Input/Output Voltage With 3.3-V VCC) Latch-Up Performance Exceeds 100 mA Per JESD 78, Class II ESD Protection Exceeds JESD 22 – 2000-V Human-Body Model (A114-A) – 1000-V Charged-Device Model (C101) 1DIR 1B1 1B2 GND 1B3 1B4 VCC 1B5 1B6 GND 1B7 1B8 2B1 2B2 GND 2B3 2B4 VCC 2B5 2B6 GND 2B7 2B8 2DIR description/ordering information This 16-bit (dual-octal) noninverting bus transceiver is designed for 2.7-V to 3.6-V VCC operation. The SN74LVCZ16245A is designed for asynchronous communication between data buses. The control-function implementation minimizes external timing requirements. 1 48 2 47 3 46 4 45 5 44 6 43 7 42 8 41 9 40 10 39 11 38 12 37 13 36 14 35 15 34 16 33 17 32 18 31 19 30 20 29 21 28 22 27 23 26 24 25 1OE 1A1 1A2 GND 1A3 1A4 VCC 1A5 1A6 GND 1A7 1A8 2A1 2A2 GND 2A3 2A4 VCC 2A5 2A6 GND 2A7 2A8 2OE This device can be used as two 8-bit transceivers or one 16-bit transceiver. It allows data transmission from the A bus to the B bus or from the B bus to the A bus, depending on the logic level at the direction-control (DIR) input. The output-enable (OE) input can be used to disable the device so that the buses are effectively isolated. Inputs can be driven from either 3.3-V or 5-V devices. This feature allows the use of these devices as translators in a mixed 3.3-V/5-V system environment. When VCC is between 0 and 1.5 V, the device is in the high-impedance state during power up or power down. However, to ensure the high-impedance state above 1.5 V, OE should be tied to VCC through a pullup resistor; the minimum value of the resistor is determined by the current-sinking capability of the driver. ORDERING INFORMATION PACKAGE† TA TOP-SIDE MARKING Tube SN74LVCZ16245ADL Tape and reel SN74LVCZ16245ADLR TSSOP – DGG Tape and reel SN74LVCZ16245ADGGR TVSOP – DGV Tape and reel SN74LVCZ16245ADGVR SSOP – DL –40°C 40°C to 85°C ORDERABLE PART NUMBER LVCZ16245A LVCZ16245A CW245A † Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at www.ti.com/sc/package. Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. Widebus is a trademark of Texas Instruments. Copyright 2002, Texas Instruments Incorporated PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 1 SN74LVCZ16245A 16-BIT BUS TRANSCEIVER WITH 3-STATE OUTPUTS SCES278D – JUNE 1999 – REVISED AUGUST 2002 description/ordering information (continued) This device is fully specified for hot-insertion applications using Ioff and power-up 3-state. The Ioff circuitry disables the outputs, preventing damaging current backflow through the device when it is powered down. The power-up 3-state circuitry places the outputs in the high-impedance state during power up and power down, which prevents driver conflict. FUNCTION TABLE (each 8-bit section) INPUTS OPERATION OE DIR L L B data to A bus L H A data to B bus H X Isolation logic diagram (positive logic) 1DIR 1 2DIR 48 1A1 25 1OE 47 2A1 2 24 36 13 1B1 To Seven Other Channels 2 POST OFFICE BOX 655303 2OE To Seven Other Channels • DALLAS, TEXAS 75265 2B1 SN74LVCZ16245A 16-BIT BUS TRANSCEIVER WITH 3-STATE OUTPUTS SCES278D – JUNE 1999 – REVISED AUGUST 2002 absolute maximum ratings over operating free-air temperature range (unless otherwise noted)† Supply voltage range, VCC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –0.5 V to 6.5 V Input voltage range, VI (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –0.5 V to 6.5 V Voltage range applied to any output in the high-impedance or power-off state, VO (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –0.5 V to 6.5 V Voltage range applied to any output in the high or low state, VO (see Notes 1 and 2) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –0.5 V to VCC + 0.5 V Input clamp current, IIK (VI < 0) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –50 mA Output clamp current, IOK (VO < 0) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –50 mA Continuous output current, IO . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±50 mA Continuous current through each VCC or GND . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±100 mA Package thermal impedance, θJA (see Note 3): DGG package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 70°C/W DGV package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 58°C/W DL package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 63°C/W Storage temperature range, Tstg . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –65°C to 150°C † Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. NOTES: 1. The input negative-voltage and output voltage ratings may be exceeded if the input and output current ratings are observed. 2. The value of VCC is provided in the recommended operating conditions table. 3. The package thermal impedance is calculated in accordance with JESD 51-7. recommended operating conditions (see Note 4) MIN MAX 2.7 3.6 VCC VIH Supply voltage VIL VI Low-level input voltage VO Output voltage IOH High level output current High-level VCC = 2.7 V VCC = 3 V –12 IOL Low level output current Low-level VCC = 2.7 V VCC = 3 V 12 ∆t/∆v Input transition rise or fall rate ∆t/∆VCC TA Power-up ramp rate 150 Operating free-air temperature –40 High-level input voltage VCC = 2.7 V to 3.6 V VCC = 2.7 V to 3.6 V 2 UNIT V V 0.8 V 0 5.5 V High or low state 0 3-state 0 VCC 5.5 V Input voltage –24 24 6 mA mA ns/V µs/V 85 °C NOTE 4: All unused inputs of the device must be held at VCC or GND to ensure proper device operation. Refer to the TI application report, Implications of Slow or Floating CMOS Inputs, literature number SCBA004. POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 3 SN74LVCZ16245A 16-BIT BUS TRANSCEIVER WITH 3-STATE OUTPUTS SCES278D – JUNE 1999 – REVISED AUGUST 2002 electrical characteristics over recommended operating free-air temperature range (unless otherwise noted) PARAMETER TEST CONDITIONS VCC 2.7 V to 3.6 V IOH = –100 µA VOH 2.7 V IOH = –12 12 mA IOH = –24 mA IOL = 100 µA VOL II Ioff Control inputs MIN TYP† MAX VCC–0.2 2.2 3V 2.4 3V 2.2 UNIT V 2.7 V to 3.6 V 0.2 IOL = 12 mA IOL = 24 mA 2.7 V 0.4 3V 0.55 VI = 0 to 5.5 V VI or VO = 5.5 V 3.6 V ±5 µA 0 ±5 µA V IOZ‡ VO = 0 to 5.5 V 3.6 V ±5 µA IOZPU VO = 0.5 V to 2.5 V, OE = don’t care 0 to 1.5 V ±5 µA IOZPD VO = 0.5 V to 2.5 V, OE = don’t care 1.5 V to 0 ±5 µA ICC VI = VCC or GND 3.6 V ≤ VI ≤ 5.5 V§ IO = 0 ∆ICC Ci Control inputs Cio A or B ports 60 36V 3.6 One input at VCC – 0.6 V, Other inputs at VCC or GND 60 2.7 V to 3.6 V VI = VCC or GND VO = VCC or GND 500 µA µA 3.3 V 5 pF 3.3 V 6.5 pF † All typical values are at VCC = 3.3 V, TA = 25°C. ‡ For I/O ports, the parameter IOZ includes the input leakage current. § This applies in the disabled state only. switching characteristics over recommended operating free-air temperature range, CL = 50 pF (unless otherwise noted) (see Figure 1) FROM (INPUT) TO (OUTPUT) tpd A or B ten OE tdis OE PARAMETER VCC = 2.7 V MIN VCC = 3.3 V ± 0.3 V UNIT MAX MIN MAX B or A 4.2 1.3 4 ns A or B 6.1 1.4 5.6 ns A or B 7.1 2 6.6 ns switching characteristics over recommended operating free-air temperature range, CL = 30 pF (unless otherwise noted) (see Figure 1) FROM (INPUT) TO (OUTPUT) tpd A or B ten tdis PARAMETER 4 VCC = 2.7 V UNIT MAX MIN MAX B or A 3.9 1 3.7 ns OE A or B 5.9 1.1 5.4 ns OE A or B 6.7 1.6 6.2 ns POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 MIN VCC = 3.3 V ± 0.3 V SN74LVCZ16245A 16-BIT BUS TRANSCEIVER WITH 3-STATE OUTPUTS SCES278D – JUNE 1999 – REVISED AUGUST 2002 operating characteristics, TA = 25°C TEST CONDITIONS PARAMETER Cpd Outputs enabled Power dissipation capacitance per transceiver POST OFFICE BOX 655303 Outputs disabled • DALLAS, TEXAS 75265 VCC = 3.3 V TYP UNIT 42 f = 10 MHz 4 pF 5 SN74LVCZ16245A 16-BIT BUS TRANSCEIVER WITH 3-STATE OUTPUTS SCES278D – JUNE 1999 – REVISED AUGUST 2002 PARAMETER MEASUREMENT INFORMATION VCC = 2.7 V AND 3.3 V ± 0.3 V 2 × VCC S1 500 Ω From Output Under Test Open GND CL = 30 pF or 50 pF (see Note A) 500 Ω TEST S1 tpd tPLZ/tPZL tPHZ/tPZH Open 2 × VCC GND LOAD CIRCUIT tw VCC Timing Input VCC/2 VCC/2 VCC/2 0V VOLTAGE WAVEFORMS SETUP AND HOLD TIMES VCC/2 VCC/2 0V tPLH Output Control (low-level enabling) tPLZ VCC VCC/2 tPZH VOH VCC/2 VOL VCC/2 0V Output Waveform 1 S1 at 2 × VCC (see Note B) tPHL VCC/2 VCC VCC/2 tPZL VCC Input VOLTAGE WAVEFORMS PULSE DURATION th VCC Data Input VCC/2 0V 0V tsu Output VCC VCC/2 Input Output Waveform 2 S1 at GND (see Note B) VOL + 0.3 V VOL tPHZ VCC/2 VOH VOH – 0.3 V 0V VOLTAGE WAVEFORMS ENABLE AND DISABLE TIMES VOLTAGE WAVEFORMS PROPAGATION DELAY TIMES NOTES: A. CL includes probe and jig capacitance. B. Waveform 1 is for an output with internal conditions such that the output is low except when disabled by the output control. Waveform 2 is for an output with internal conditions such that the output is high except when disabled by the output control. C. All input pulses are supplied by generators having the following characteristics: PRR ≤ 10 MHz, ZO = 50 Ω, tr ≤ 2 ns, tf ≤ 2 ns. D. The outputs are measured one at a time with one transition per measurement. E. tPLZ and tPHZ are the same as tdis. F. tPZL and tPZH are the same as ten. G. tPLH and tPHL are the same as tpd. H. All parameters and waveforms are not applicable to all devices. Figure 1. Load Circuit and Voltage Waveforms 6 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 PACKAGE OPTION ADDENDUM www.ti.com 5-Sep-2005 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Drawing Pins Package Eco Plan (2) Qty 74LVCZ16245ADGGRE4 ACTIVE TSSOP DGG 48 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 74LVCZ16245ADGVRE4 ACTIVE TVSOP DGV 48 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LVCZ16245ADGGR ACTIVE TSSOP DGG 48 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LVCZ16245ADGVR ACTIVE TVSOP DGV 48 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LVCZ16245ADL ACTIVE SSOP DL 48 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LVCZ16245ADLR ACTIVE SSOP DL 48 1000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 25 Lead/Ball Finish MSL Peak Temp (3) (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS) or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. Addendum-Page 1 MECHANICAL DATA MPDS006C – FEBRUARY 1996 – REVISED AUGUST 2000 DGV (R-PDSO-G**) PLASTIC SMALL-OUTLINE 24 PINS SHOWN 0,40 0,23 0,13 24 13 0,07 M 0,16 NOM 4,50 4,30 6,60 6,20 Gage Plane 0,25 0°–8° 1 0,75 0,50 12 A Seating Plane 0,15 0,05 1,20 MAX PINS ** 0,08 14 16 20 24 38 48 56 A MAX 3,70 3,70 5,10 5,10 7,90 9,80 11,40 A MIN 3,50 3,50 4,90 4,90 7,70 9,60 11,20 DIM 4073251/E 08/00 NOTES: A. B. C. D. All linear dimensions are in millimeters. This drawing is subject to change without notice. Body dimensions do not include mold flash or protrusion, not to exceed 0,15 per side. Falls within JEDEC: 24/48 Pins – MO-153 14/16/20/56 Pins – MO-194 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 MECHANICAL DATA MSSO001C – JANUARY 1995 – REVISED DECEMBER 2001 DL (R-PDSO-G**) PLASTIC SMALL-OUTLINE PACKAGE 48 PINS SHOWN 0.025 (0,635) 0.0135 (0,343) 0.008 (0,203) 48 0.005 (0,13) M 25 0.010 (0,25) 0.005 (0,13) 0.299 (7,59) 0.291 (7,39) 0.420 (10,67) 0.395 (10,03) Gage Plane 0.010 (0,25) 1 0°–ā8° 24 0.040 (1,02) A 0.020 (0,51) Seating Plane 0.110 (2,79) MAX 0.004 (0,10) 0.008 (0,20) MIN PINS ** 28 48 56 A MAX 0.380 (9,65) 0.630 (16,00) 0.730 (18,54) A MIN 0.370 (9,40) 0.620 (15,75) 0.720 (18,29) DIM 4040048 / E 12/01 NOTES: A. B. C. D. All linear dimensions are in inches (millimeters). This drawing is subject to change without notice. Body dimensions do not include mold flash or protrusion not to exceed 0.006 (0,15). Falls within JEDEC MO-118 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 MECHANICAL DATA MTSS003D – JANUARY 1995 – REVISED JANUARY 1998 DGG (R-PDSO-G**) PLASTIC SMALL-OUTLINE PACKAGE 48 PINS SHOWN 0,27 0,17 0,50 48 0,08 M 25 6,20 6,00 8,30 7,90 0,15 NOM Gage Plane 1 0,25 24 0°– 8° A 0,75 0,50 Seating Plane 0,15 0,05 1,20 MAX PINS ** 0,10 48 56 64 A MAX 12,60 14,10 17,10 A MIN 12,40 13,90 16,90 DIM 4040078 / F 12/97 NOTES: A. B. C. D. All linear dimensions are in millimeters. This drawing is subject to change without notice. Body dimensions do not include mold protrusion not to exceed 0,15. Falls within JEDEC MO-153 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements, improvements, and other changes to its products and services at any time and to discontinue any product or service without notice. Customers should obtain the latest relevant information before placing orders and should verify that such information is current and complete. All products are sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment. TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TI’s standard warranty. Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty. Except where mandated by government requirements, testing of all parameters of each product is not necessarily performed. TI assumes no liability for applications assistance or customer product design. Customers are responsible for their products and applications using TI components. To minimize the risks associated with customer products and applications, customers should provide adequate design and operating safeguards. TI does not warrant or represent that any license, either express or implied, is granted under any TI patent right, copyright, mask work right, or other TI intellectual property right relating to any combination, machine, or process in which TI products or services are used. Information published by TI regarding third-party products or services does not constitute a license from TI to use such products or services or a warranty or endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the third party, or a license from TI under the patents or other intellectual property of TI. Reproduction of information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompanied by all associated warranties, conditions, limitations, and notices. Reproduction of this information with alteration is an unfair and deceptive business practice. TI is not responsible or liable for such altered documentation. Resale of TI products or services with statements different from or beyond the parameters stated by TI for that product or service voids all express and any implied warranties for the associated TI product or service and is an unfair and deceptive business practice. TI is not responsible or liable for any such statements. Following are URLs where you can obtain information on other Texas Instruments products and application solutions: Products Applications Amplifiers amplifier.ti.com Audio www.ti.com/audio Data Converters dataconverter.ti.com Automotive www.ti.com/automotive DSP dsp.ti.com Broadband www.ti.com/broadband Interface interface.ti.com Digital Control www.ti.com/digitalcontrol Logic logic.ti.com Military www.ti.com/military Power Mgmt power.ti.com Optical Networking www.ti.com/opticalnetwork Microcontrollers microcontroller.ti.com Security www.ti.com/security Telephony www.ti.com/telephony Video & Imaging www.ti.com/video Wireless www.ti.com/wireless Mailing Address: Texas Instruments Post Office Box 655303 Dallas, Texas 75265 Copyright 2005, Texas Instruments Incorporated