www.ti.com SN75185 MULTIPLE RS-232 DRIVERS AND RECEIVERS SLLS181D – DECEMBER 1994 – REVISED JANUARY 2006 FEATURES • • • • • N PACKAGE (TOP VIEW) Single Chip With Easy Interface Between UART and Serial-Port Connector of IBM™ PC/AT™ and Compatibles Meets or Exceeds the Requirements of TIA/EIA-232-F and ITU v.28 Standards Supports Data Rates up to 120 kbit/s ESD Protection Meets or Exceeds 10 kV on RS-232 Pins and 3.5 kV on All Other Pins (Human-Body Model) Pin-to-Pin Compatible With the SN75C185 VDD RA1 RA2 RA3 DY1 DY2 RA4 DY3 RA5 VSS DESCRIPTION/ORDERING INFORMATION The SN75185 combines three drivers and five receivers from the TI SN75188 and SN75189 bipolar quadruple drivers and receivers, respectively. The pinout matches the flow-through design of the SN75C185 to decrease the part count, reduce the board space required, and allow easy interconnection of the UART and serial-port connector of IBM™ PC/AT™ and compatibles. The bipolar circuits and processing of the SN75185 provide a rugged low-cost solution for this function at the expense of quiescent power and external passive components relative to the SN75C185. The SN75185 complies with the requirements of the TIA/EIA-232-F and ITU v.28 standards. These standards are for data interchange between a host computer and peripheral at signaling rates up to 20 kbit/s. The switching speeds of the SN75185 are fast enough to support rates up to 120 kbit/s with lower capacitive loads (shorter cables). Interoperability at the higher signaling rates cannot be assured unless the designer has design control of the cable and the interface circuits at both ends. For interoperability at signaling rates to 120 kbit/s, use of TIA/EIA-423-B (ITU v.10) and TIA/EIA-422-B (ITU v.11) standards is recommended. 1 20 2 19 3 18 4 17 5 16 6 15 7 14 8 13 9 12 10 11 VCC RY1 RY2 RY3 DA1 DA2 RY4 DA3 RY5 GND DB, DW, OR PW PACKAGE (TOP VIEW) VDD RA1 RA2 RA3 DY1 DY2 RA4 DY3 RA5 VSS 1 2 3 4 5 6 7 8 9 10 20 19 18 17 16 15 14 13 12 11 VCC RY1 RY2 RY3 DA1 DA2 RY4 DA3 RY5 GND XXXXX The SN75185 is characterized for operation over the temperature range of 0°C to 70°C. Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. IBM, PC/AT are trademarks of IBM Corporation. PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. Copyright © 1994–2006, Texas Instruments Incorporated SN75185 MULTIPLE RS-232 DRIVERS AND RECEIVERS www.ti.com SLLS181D – DECEMBER 1994 – REVISED JANUARY 2006 ORDERING INFORMATION PACKAGE (1) TA PDIP – N SOIC – DW 0°C to 70°C SSOP – DB TSSOP – PW (1) ORDERABLE PART NUMBER Tube of 20 SN75185N Tube of 25 SN75185DW Reel of 2000 SN75185DWR Tube of 70 SN75185DB Reel of 2000 SN75185DBR SN75185N Tube of 70 SN75185PW Reel of 2000 SN75185PWR SN75185 A185 A185 Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at www.ti.com/sc/package. LOGIC DIAGRAM (POSITIVE LOGIC) RA1 RA2 RA3 DY1 DY2 RA4 DY3 RA5 2 TOP-SIDE MARKING 2 19 3 18 4 17 5 16 6 15 7 14 8 13 9 12 RY1 RY2 RY3 DA1 DA2 RY4 DA3 RY5 SN75185 MULTIPLE RS-232 DRIVERS AND RECEIVERS www.ti.com SLLS181D – DECEMBER 1994 – REVISED JANUARY 2006 SCHEMATIC OF DRIVERS To Other Drivers VDD ESD 11.6 kΩ DAx Input 9.4 kΩ ESD 75.8 Ω 320 Ω ESD 4.2 kΩ DYx Output GND To Other Drivers VSS 10.4 kΩ 3.3 kΩ 68.5 Ω ESD To Other Drivers Resistor values shown are nominal. SCHEMATIC (EACH RECEIVER) To Other Receivers 9 kΩ 5 kΩ ESD VCC ESD RYx Output 1.66 kΩ 2 kΩ RAx Input ESD 3.8 kΩ 10 kΩ GND To Other Receivers Resistor values shown are nominal. 3 SN75185 MULTIPLE RS-232 DRIVERS AND RECEIVERS www.ti.com SLLS181D – DECEMBER 1994 – REVISED JANUARY 2006 Absolute Maximum Ratings (1) over operating free-air temperature range (unless otherwise noted) MIN (2) VCC Supply voltage VDD Supply voltage (2) VSS voltage (2) Supply Input voltage range TJ Operating virtual junction temperature 30 –15 15 V 20 mA DB package 70 DW package 58 N package 69 (4) (5) (6) (7) 4 V °C/W 83 150 Machine Model (2) (3) V –30 Electrostatic discharge (1) –15 Receiver Human-Body Model Storage temperature range V 7 PW package Tstg V 15 –15 Receiver low-level output current Package thermal impedance (3) (4) UNIT 10 Driver Driver output voltage range θJA MAX RS-232 pins, class 3, A (5) 10 All pins, class 3, A (6) 3.5 RS-232 pins, class 3, B (7) 600 All pins, class 3, B (5) 250 –65 150 °C kV V °C Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. All voltages are with respect to the network ground terminal. Maximum power dissipation is a function of TJ(max), θJA, and TA. The maximum allowable power dissipation at any allowable ambient temperature is PD = (TJ(max) – TA)/θJA. Operating at the absolute maximum TJ of 150°C can affect reliability. The package thermal impedance is calculated in accordance with JESD 51-7. RS-232 pins are tested with respect to ground and to each other. Per MIL-PRF-38535 RS-232 pins are tested with respect to ground. SN75185 MULTIPLE RS-232 DRIVERS AND RECEIVERS www.ti.com SLLS181D – DECEMBER 1994 – REVISED JANUARY 2006 Recommended Operating Conditions MIN NOM MAX VCC Supply voltage 4.5 5 5.5 V VDD Supply voltage 7.5 9 15 V VSS Supply voltage –7.5 –9 –15 V VIH High-level input voltage (drivers only) VIL Low-level input voltage (drivers only) 1.9 V 0.8 Drivers IOH High-level output current IOL Low-level output current TA Operating free-air temperature UNIT –6 Receivers –0.5 Drivers 6 Receivers 16 0 70 V mA mA °C Supply Currents PARAMETER ICC IDD Supply current from VCC TEST CONDITIONS MAX No load, VCC = 5 V VDD = 9 V, VSS = –9 V 15 All inputs at 1.9 V, No load VDD = 12 V, VSS = –12 V 19 VDD = 15 V, VSS = –15 V 25 VDD = 9 V, VSS = –9 V 4.5 VDD = 12 V, VSS = –12 V 5.5 VDD = 15 V, VSS = –15 V VDD = 9 V, VSS = –9 V –15 VDD = 12 V, VSS = –12 V –19 VDD = 15 V, VSS = –15 V –25 VDD = 9 V, VSS = –9 V –3.2 VDD = 12 V, VSS = –12 V –3.2 VDD = 15 V, VSS = –15 V –3.2 Supply current from VDD All inputs at 0.8 V, All inputs at 1.9 V, ISS MIN All inputs at 5 V, No load No load Supply current from VSS All inputs at 0.8 V, No load 30 UNIT mA mA 9 mA 5 SN75185 MULTIPLE RS-232 DRIVERS AND RECEIVERS www.ti.com SLLS181D – DECEMBER 1994 – REVISED JANUARY 2006 DRIVER SECTION abc Electrical Characteristics over recommended operating free-air temperature range, VDD = 9 V, VSS = –9 V, VCC = 5 V (unless otherwise noted) PARAMETER TEST CONDITIONS MIN VOH High-level output voltage VIL = 0.8 V, RL = 3 kΩ, See Figure 1 VOL Low-level output voltage (1) VIH = 1.9 V, RL = 3 kΩ, See Figure 1 IIH High-level input current VI = 5 V, See Figure 2 IIL Low-level input current VI = 0, See Figure 2 IOS(H) High-level short-circuit output current (2) VIL = 0.8 V, VO = 0, See Figure 1 IOS(L) Low-level short-circuit output current VIH = 2 V, VO = 0, ro (1) (2) (3) Output resistance (3) VCC = VDD = VSS = 0, 6 TYP MAX 7.5 –7.5 UNIT V –6 V 10 μA –1.6 mA –4.5 –12 –19.5 mA See Figure 1 4.5 12 19.5 mA VO = –2 V to 2 V 300 Ω The algebraic convention, in which the more positive (less negative) limit is designated as maximum, is used in this data sheet for logic levels only (e.g., if –10 V is maximum, the typical value is a more negative voltage). Output short-circuit conditions must maintain the total power dissipation below absolute maximum ratings. Test conditions are those specified by TIA/EIA-232-F and as listed above. Switching Characteristics VCC = 5 V, VDD = 12 V, VSS = –12 V, TA = 25°C (see Figure 3) PARAMETER TEST CONDITIONS MIN TYP MAX UNIT tPLH Propagation delay time, low- to high-level output RL = 3 kΩ to 7 kΩ, CL = 15 pF 315 500 ns tPHL Propagation delay time, high- to low-level output RL = 3 kΩ to 7 kΩ, CL = 15 pF 75 175 ns CL = 15 pF 60 100 ns μs tTLH tTHL (1) (2) 6 Transition time, low- to high-level output Transition time, high- to low-level output RL = 3 kΩ to 7 kΩ RL = 3 kΩ to 7 kΩ CL = 2500 pF (1) 1.7 2.5 CL = 15 pF 40 75 ns CL = 2500 pF (2) 1.5 2.5 μs Measured between –3-V and 3-V points of the output waveform (TIA/EIA-232-F conditions); all unused inputs are tied either high or low. Measured between 3-V and –3-V points of the output waveform (TIA/EIA-232-F conditions); all unused inputs are tied either high or low. SN75185 MULTIPLE RS-232 DRIVERS AND RECEIVERS www.ti.com SLLS181D – DECEMBER 1994 – REVISED JANUARY 2006 RECEIVER SECTION abc Electrical Characteristics over recommended operating conditions (unless otherwise noted) PARAMETER VT+ Positive-going threshold voltage VT– Negative-going threshold voltage Vhys Input hysteresis (VT+ – VT–) MIN TYP (1) MAX TA = 25°C 1.75 1.9 2.3 TA = 0°C to 70°C 1.55 TEST CONDITIONS See Figure 5 0.75 0.97 1.25 4 5 0.2 0.45 0.5 VIH = 0.75 V 2.6 Inputs open 2.6 VOH High-level output voltage IOH = –0.5 mA VOL Low-level input voltage IOL = 10 mA, VI = 3 V IIH High-level input current VI = 25 V, See Figure 5 3.6 VI = 3 V, See Figure 5 0.43 IIL Low-level output current VI = –25 V, See Figure 5 –3.6 VI = –3 V, See Figure 5 –0.43 IOS Short-circuit output current (1) 2.3 See Figure 4 UNIT V V V 8.3 –8.3 –3.4 –12 V V mA mA mA All typical values are at TA = 25°C, VCC = 5 V, VDD = 9 V, and VSS = –9 V. Switching Characteristics VCC = 5 V, VDD = 12 V, VSS = -12 V, TA = 25°C (see Figure 6) PARAMETER TEST CONDITIONS MIN TYP MAX 107 500 UNIT tPLH Propagation delay time, low- to high-level output CL = 50 pF, RL = 5 kΩ ns tPHL Propagation delay time, high- to low-level output CL = 50 pF, RL = 5 kΩ 42 150 ns tTLH Transition time, low- to high-level output CL = 50 pF, RL = 5 kΩ 175 525 ns tTHL Transition time, high- to low-level output CL = 50 pF, RL = 5 kΩ 16 60 ns 7 SN75185 MULTIPLE RS-232 DRIVERS AND RECEIVERS www.ti.com SLLS181D – DECEMBER 1994 – REVISED JANUARY 2006 PARAMETER MEASUREMENT INFORMATION IOS(L) VDD or GND VI −IOS(H) RL = 3 kΩ VSS or GND VO Figure 1. Driver Test Circuit for VOH, VOL, IOS(H), and IOS(L) IIH VI −IIL VI Figure 2. Driver Test Circuit for IIH and IIL 3V Input 1.5 V 1.5 V Input Pulse Generator (see Note B) 0V tPHL Output CL (see Note A) RL 90% Output tPLH 50% 10% 50% 10% tTHL TEST CIRCUIT VOLTAGE WAVEFORMS A. CL includes probe and jig capacitance. B. The pulse generator has the following characteristics: tw = 25 μs, PRR = 20 kHz, ZO = 50 Ω, tr = tf < 50 ns. Figure 3. Driver Test Circuit and Voltage Waveforms VI Figure 4. Receiver Test Circuit for IOS VT, VI VOH VOL −IOH IOL Figure 5. Receiver Test Circuit for VT, VOH, and VOL 8 90% tTLH VOH VOL SN75185 MULTIPLE RS-232 DRIVERS AND RECEIVERS www.ti.com SLLS181D – DECEMBER 1994 – REVISED JANUARY 2006 PARAMETER MEASUREMENT INFORMATION (continued) 4V Input 50% 50% 0V Input Pulse Generator (see Note B) tPHL Output CL (see Note A) RL 90% Output 50% 10% tPLH 50% 10% tTHL TEST CIRCUIT 90% tTLH VOH VOL VOLTAGE WAVEFORMS A. CL includes probe and jig capacitance. B. The pulse generator has the following characteristics: tw = 25 μs, PRR = 20 kHz, ZO = 50 Ω, tr = tf < 50 ns. Figure 6. Receiver Propagation and Transition Times 9 SN75185 MULTIPLE RS-232 DRIVERS AND RECEIVERS www.ti.com SLLS181D – DECEMBER 1994 – REVISED JANUARY 2006 TYPICAL CHARACTERISTICS ABC DRIVER SECTION VDD = 12 V, VSS = −12 V 20 VDD = 9 V, VSS = −9 V 6 16 VDD = 6 V, VSS = −6 V 12 3 I O − Output Current − mA VO − Output Voltage − V 9 0 −3 −6 −9 −12 OUTPUT CURRENT vs OUTPUT VOLTAGE VOLTAGE TRANSFER CHARACTERISTICS 12 RL = 3 kΩ TA = 25°C 0 0.2 0.4 VDD = 9 V VSS = −9 V TA = 25°C VOL (VI = 1.9 V) 8 4 0 −4 −8 3-kΩ Load Line −12 0.6 0.8 1 1.2 1.4 1.6 1.8 VOH (VI = 0.8 V) −16 2 −20 −16 VI − Input Voltage − V −12 −8 −4 0 4 8 12 16 VO − Output Voltage − V Figure 8. SHORT-CIRCUIT OUTPUT CURRENT vs FREE-AIR TEMPERATURE SLEW RATE vs LOAD CAPACITANCE 9 6 3 VDD = 9 V VSS = −9 V VO = 0 0 −3 100 10 −6 IOS(H) (VI = 0.8 V) −9 −12 0 10 20 30 40 50 TA − Free-Air Temperature − °C Figure 9. 10 1000 IOS(L) (VI = 1.9 V) SR − Slew Rate − V/ μ s IOS − Short-Circuit Output Current − mA 12 Figure 7. 60 70 1 10 VDD = 9 V VSS = −9 V RL = 3 kΩ TA = 25°C 100 1000 CL − Load Capacitance − pF Figure 10. 10000 SN75185 MULTIPLE RS-232 DRIVERS AND RECEIVERS www.ti.com SLLS181D – DECEMBER 1994 – REVISED JANUARY 2006 TYPICAL CHARACTERISTICS ABC RECEIVER SECTION INPUT THRESHOLD VOLTAGE vs FREE-AIR TEMPERATURE 2.4 2 VT+ 1.8 2 VT+ Input Threshold Voltage − V Input Threshold Voltage − V 2.2 1.8 1.6 1.4 1.2 1 VT− 0.8 1.6 1.4 1.2 1 VT− 0.8 0.6 0.4 0.6 0.4 INPUT THRESHOLD VOLTAGE vs SUPPLY VOLTAGE 0.2 0 10 20 30 40 50 60 0 70 2 3 TA − Free-Air Temperature − °C 4 5 Figure 11. VCC = 5 V TA = 25°C See Note A 5 9 10 60 70 14 CC = 500 pF 3 CC = 12 pF 2 CC = 100 pF 1 VCC − Supply Voltage − V 4 Amplitude − V 8 MAXIMUM SUPPLY VOLTAGE vs FREE-AIR TEMPERATURE 16 CC = 300 pF 0 7 Figure 12. NOISE REJECTION 6 6 VCC − Supply Voltage − V 12 10 8 6 4 10 40 100 400 1000 4000 10000 tw − Pulse Duration − ns NOTE A: This figure shows the maximum amplitude of a positive-going pulse that, starting from 0 V, will not cause a change in the output level. Figure 13. 2 0 RL ≥ 3 kΩ (from each output to GND) 0 10 20 30 40 50 TA − Free-Air Temperature − °C Figure 14. 11 SN75185 MULTIPLE RS-232 DRIVERS AND RECEIVERS www.ti.com SLLS181D – DECEMBER 1994 – REVISED JANUARY 2006 APPLICATION INFORMATION Diodes placed in series with the VDD and VSS leads protect the SN75185 in the fault condition. In the fault condition, the device outputs are shorted to ±15 V, and the power supplies are at low and provide low-impedance paths to ground (see Figure 15). VDD ±15 V VDD Output SN75185 SN75185 VSS VSS Figure 15. Power-Supply Protection to Meet Power-Off Fault Conditions of TIA/EIA-232-F −12 V TL16C450 ACE RI DTR CTS SO RTS SI DSR DCD 11 43 12 37 13 40 14 13 15 36 16 11 17 41 18 42 19 5V (1) 20 GND VSS RY5 RA5 DA3 DY3 RY4 RA4 DA2 DY2 SN75185 DA1 DY1 RY3 RA3 RY2 RA2 RY1 RA1 VCC VDD 10 5 9 9 R1 8 DTR 7 CTS 6 TX 5 RTS 4 RX 3 DSR 2 DCD 1 C3(1) C2(1) C1(1) 6 1 12 V See Figure 10 to select the correct values for the loading capacitors (C1, C2, and C3), which are required to meet the RS-232 maximum slew-rate requirement of 30 V/μs. The value of the loading capacitors required depends on the line length and desired slew rate, but typically is 330 pF. Figure 16. Typical Connection 12 TIA/EIA-232-F DB9S Connector PACKAGE OPTION ADDENDUM www.ti.com 6-Dec-2006 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Drawing Pins Package Eco Plan (2) Qty SN75185DB ACTIVE SSOP DB 20 70 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN75185DBE4 ACTIVE SSOP DB 20 70 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN75185DBR ACTIVE SSOP DB 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN75185DBRG4 ACTIVE SSOP DB 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN75185DW ACTIVE SOIC DW 20 25 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN75185DWE4 ACTIVE SOIC DW 20 25 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN75185DWG4 ACTIVE SOIC DW 20 25 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN75185DWR ACTIVE SOIC DW 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN75185DWRE4 ACTIVE SOIC DW 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN75185DWRG4 ACTIVE SOIC DW 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN75185N ACTIVE PDIP N 20 20 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type SN75185NE4 ACTIVE PDIP N 20 20 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type SN75185PW ACTIVE TSSOP PW 20 70 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN75185PWR ACTIVE TSSOP PW 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM Lead/Ball Finish MSL Peak Temp (3) (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is Addendum-Page 1 PACKAGE OPTION ADDENDUM www.ti.com 6-Dec-2006 provided. 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Addendum-Page 2 MECHANICAL DATA MSSO002E – JANUARY 1995 – REVISED DECEMBER 2001 DB (R-PDSO-G**) PLASTIC SMALL-OUTLINE 28 PINS SHOWN 0,38 0,22 0,65 28 0,15 M 15 0,25 0,09 8,20 7,40 5,60 5,00 Gage Plane 1 14 0,25 A 0°–ā8° 0,95 0,55 Seating Plane 2,00 MAX 0,10 0,05 MIN PINS ** 14 16 20 24 28 30 38 A MAX 6,50 6,50 7,50 8,50 10,50 10,50 12,90 A MIN 5,90 5,90 6,90 7,90 9,90 9,90 12,30 DIM 4040065 /E 12/01 NOTES: A. B. C. D. All linear dimensions are in millimeters. This drawing is subject to change without notice. Body dimensions do not include mold flash or protrusion not to exceed 0,15. Falls within JEDEC MO-150 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 MECHANICAL DATA MTSS001C – JANUARY 1995 – REVISED FEBRUARY 1999 PW (R-PDSO-G**) PLASTIC SMALL-OUTLINE PACKAGE 14 PINS SHOWN 0,30 0,19 0,65 14 0,10 M 8 0,15 NOM 4,50 4,30 6,60 6,20 Gage Plane 0,25 1 7 0°– 8° A 0,75 0,50 Seating Plane 0,15 0,05 1,20 MAX PINS ** 0,10 8 14 16 20 24 28 A MAX 3,10 5,10 5,10 6,60 7,90 9,80 A MIN 2,90 4,90 4,90 6,40 7,70 9,60 DIM 4040064/F 01/97 NOTES: A. B. C. D. All linear dimensions are in millimeters. This drawing is subject to change without notice. Body dimensions do not include mold flash or protrusion not to exceed 0,15. Falls within JEDEC MO-153 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements, improvements, and other changes to its products and services at any time and to discontinue any product or service without notice. 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