TI SN74ABT245BNSR

 SCBS081L − JANUARY 1991 − REVISED APRIL 2005
SN54ABT245A . . . J OR W PACKAGE
SN74ABT245B . . . DB, DGV, DW, N, NS,
OR PW PACKAGE
(TOP VIEW)
19
3
18
4
17
5
16
6
15
7
14
8
13
9
12
10
11
SN54ABT245B . . . FK PACKAGE
(TOP VIEW)
VCC
OE
B1
B2
B3
B4
B5
B6
B7
B8
A1
A2
A3
A4
A5
A6
A7
A8
20
A2
A1
DIR
VCC
1
A3
A4
A5
A6
A7
19 OE
18 B1
2
3
17 B2
16 B3
4
5
15 B4
14 B5
6
7
13 B6
12 B7
8
9
10
11
4
3 2 1 20 19
18
5
17
6
16
7
15
8
14
9 10 11 12 13
B1
B2
B3
B4
B5
A8
GND
B8
B7
B6
20
2
VCC
1
B8
DIR
A1
A2
A3
A4
A5
A6
A7
A8
GND
JEDEC Standard JESD 17
ESD Protection Exceeds JESD 22
− 2000-V Human-Body Model (A114-A)
− 200-V Machine Model (A115-A)
SN74ABT245B . . . RGY PACKAGE
(TOP VIEW)
DIR
D
D
GND
D
D Latch-Up Performance Exceeds 500 mA Per
<1 V at VCC = 5 V, TA = 25°C
Ioff and Power-Up 3-State Support Hot
Insertion
High-Drive Outputs (−32-mA IOH, 64-mA IOL)
OE
D Typical VOLP (Output Ground Bounce)
description/ordering information
These octal bus transceivers are designed for asynchronous communication between data buses. The devices
transmit data from the A bus to the B bus or from the B bus to the A bus, depending on the logic level at the
direction-control (DIR) input. The output-enable (OE) input can be used to disable the device so the buses are
effectively isolated.
ORDERING INFORMATION
Tube
SN74ABT245BN
SN74ABT245BN
QFN − RGY
Tape and reel
SN74ABT245BRGYR
AB245B
Tube
SN74ABT245BDW
Tape and reel
SN74ABT245BDWR
SOP − NS
Tape and reel
SN74ABT245BNSR
ABT245B
SSOP − DB
Tape and reel
SN74ABT245BDBR
AB245B
Tube
SN74ABT245BPW
Tape and reel
SN74ABT245BPWR
Tape and reel
SN74ABT245BDGVR
TSSOP − PW
TVSOP − DGV
VFBGA − GQN
VFBGA − ZQN (Pb-free)
−55°C
−55
C to 125
125°C
C
TOP-SIDE
MARKING
PDIP − N
SOIC − DW
−40°C
85°C
−40
C to 85
C
ORDERABLE
PART NUMBER
PACKAGE†
TA
ABT245B
AB245B
AB245B
SN74ABT245BGQNR
Tape and reel
SN74ABT245BZQNR
AB245B
CDIP − J
Tube
SNJ54ABT245AJ
SNJ54ABT245AJ
CFP − W
Tube
SNJ54ABT245AW
SNJ54ABT245AW
LCCC − FK
Tube
SNJ54ABT245AFK
SNJ54ABT245AFK
† Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available
at www.ti.com/sc/package.
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
Copyright  2005, Texas Instruments Incorporated
! " #$%! " &$'(#! )!%*
)$#!" # ! "&%##!" &% !+% !%" %," "!$%!"
"!)) -!.* )$#! &#%""/ )%" ! %#%""(. #($)%
!%"!/ (( &%!%"*
&)$#!" #&(! ! 012 (( &%!%" % !%"!%)
$(%"" !+%-"% !%)* (( !+% &)$#!" &)$#!
&#%""/ )%" ! %#%""(. #($)% !%"!/ (( &%!%"*
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
1
SCBS081L − JANUARY 1991 − REVISED APRIL 2005
description/ordering information (continued)
To ensure the high-impedance state during power up or power down, OE should be tied to VCC through a pullup
resistor; the minimum value of the resistor is determined by the current-sinking capability of the driver.
This device is fully specified for hot-insertion applications using Ioff and power-up 3-state. The Ioff circuitry
disables the outputs, preventing damaging current backflow through the device when it is powered down. The
power-up 3-state circuitry places the outputs in the high-impedance state during power up and power down,
which prevents driver conflict.
SN74ABT245B . . . GQN OR ZQN PACKAGE
(TOP VIEW)
1
2
3
terminal assignments
4
1
2
3
4
A
A
A1
DIR
B
A3
B2
VCC
A2
OE
B
C
C
A5
A4
B4
B3
D
D
A7
B6
A6
B5
E
E
GND
A8
B8
B7
FUNCTION TABLE
INPUTS
OE
DIR
OPERATION
L
L
B data to A bus
L
H
A data to B bus
H
X
Isolation
logic diagram (positive logic)
DIR
1
19
A1
2
18
To Seven Other Channels
Pin numbers shown are for the DB, DGV, DW, FK, J, N, NS, PW, RGY, and W packages.
2
OE
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
B1
B1
SCBS081L − JANUARY 1991 − REVISED APRIL 2005
absolute maximum ratings over operating free-air temperature range (unless otherwise noted)†
Supply voltage range, VCC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.5 V to 7 V
Input voltage range, VI (except I/O ports) (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.5 V to 7 V
Voltage range applied to any output in the high or power-off state, VO . . . . . . . . . . . . . . . . . . . −0.5 V to 5.5 V
Current into any output in the low state, IO: SN54ABT245A . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 96 mA
SN74ABT245B . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 128 mA
Input clamp current, IIK (VI < 0) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −18 mA
Output clamp current, IOK (VO < 0) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −50 mA
Package thermal impedance, θJA (see Note 2): DB package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 70°C/W
(see Note 2): DGV package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 92°C/W
(see Note 2): DW package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 58°C/W
(see Note 2): GQN/ZQN package . . . . . . . . . . . . . . . . . . . . . . . . . . . 78°C/W
(see Note 2): N package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 69°C/W
(see Note 2): NS package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 60°C/W
(see Note 2): PW package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 83°C/W
(see Note 3): RGY package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 37°C/W
Storage temperature range, Tstg . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −65°C to 150°C
† Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
NOTES: 1. The input and output negative-voltage ratings may be exceeded if the input and output clamp-current ratings are observed.
2. The package thermal impedance is calculated in accordance with JESD 51-7.
3. The package thermal impedance is calculated in accordance with JESD 51-5.
recommended operating conditions (see Note 4)
SN54ABT245A
MAX
MIN
MAX
4.5
5.5
4.5
5.5
VCC
VIH
Supply voltage
VIL
VI
Low-level input voltage
IOH
IOL
High-level output current
VCC
−24
Low-level output current
48
∆t/∆v
Input transition rise or fall rate
∆t/∆VCC
TA
Power-up ramp rate
High-level input voltage
SN74ABT245B
MIN
2
2
0.8
Input voltage
0
5
−55
125
mA
64
mA
5
−40
V
VCC
−32
V
ns/V
µs/V
200
Operating free-air temperature
V
V
0.8
0
UNIT
85
°C
NOTE 4: All unused inputs of the device must be held at VCC or GND to ensure proper device operation. Refer to the TI application report,
Implications of Slow or Floating CMOS Inputs, literature number SCBA004.
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
3
SCBS081L − JANUARY 1991 − REVISED APRIL 2005
electrical characteristics over recommended operating free-air temperature range (unless
otherwise noted)
PARAMETER
VIK
VOH
TEST CONDITIONS
VCC = 4.5 V,
VCC = 4.5 V,
II = −18 mA
IOH = −3 mA
VCC = 5 V,
VCC = 4.5 V
VOL
VCC = 4.5 V
MIN
TA = 25°C
TYP†
MAX
MIN
−1.2
MAX
SN74ABT245B
MIN
−1.2
2.5
2.5
IOH = −3 mA
IOH = −24 mA
3
3
3
2
2
IOH = −32 mA
IOL = 48 mA
2*
A or B ports
UNIT
V
V
2
0.55
IOL = 64 mA
0.55
0.55*
0.55
100
Control inputs
VCC = 0 to 5.5 V, VI = VCC or GND
VCC = 2.1 V to 5.5 V,
VI = VCC or GND
V
mV
±1
±1
±1
±20
±100
±20
µA
IOZPU
VCC = 0 to 2.1 V,
VO = 0.5 V to 2.7 V, OE = X
±50
±50
±50
µA
IOZPD
VCC = 2.1 V to 0,
VO = 0.5 V to 2.7 V, OE = X
±50
±50
±50
µA
IOZH‡
VCC = 2.1 V to 5.5 V,
VO = 2.7 V, OE ≥ 2 V
10
10
10
µA
IOZL‡
VCC = 2.1 V to 5.5 V,
VO = 0.5 V, OE ≥ 2 V
−10
−10
−10
µA
Ioff
VCC = 0,
VCC = 5.5 V,
VO = 5.5 V
VI or VO ≤ 5.5 V
±100
µA
50
µA
VCC = 5.5 V,
VO = 2.5 V
Outputs high
−180
mA
250
µA
ICEX
IO§
ICC
A or B ports
Data inputs
∆ICC¶
Control inputs
Ci
Control inputs
Cio
A or B ports
VCC = 5.5 V,
IO = 0,
VI = VCC or GND
±100
Outputs high
Outputs low
Outputs disabled
50
−50
−140
−180
5
250
−50
−180
−50
250
22
30
30
30
mA
1
250
250
250
µA
1.5
1.5
1.5
mA
50
50
50
µA
1.5
1.5
1.5
mA
VCC = 5.5 V,
Outputs enabled
One input at 3.4 V,
Other inputs at
Outputs disabled
VCC or GND
VCC = 5.5 V, One input at 3.4 V,
Other inputs at VCC or GND
VI = 2.5 V or 0.5 V
VO = 2.5 V or 0.5 V
50
4
pF
8
pF
* On products compliant to MIL-PRF-38535, this parameter does not apply.
† All typical values are at VCC = 5 V.
‡ The parameters IOZH and IOZL include the input leakage current.
§ Not more than one output should be tested at a time, and the duration of the test should not exceed one second.
¶ This is the increase in supply current for each input that is at the specified TTL voltage level, rather than VCC or GND.
4
MAX
−1.2
2.5
Vhys
II
SN54ABT245A
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
SCBS081L − JANUARY 1991 − REVISED APRIL 2005
switching characteristics over recommended ranges of supply voltage and operating free-air
temperature, CL = 50 pF (unless otherwise noted) (see Figure 1)
FROM
(INPUT)
TO
(OUTPUT)
tPLH
tPHL
A or B
B or A
tPZH
tPZL
OE
A or B
tPHZ
tPLZ
OE
A or B
PARAMETER
tsk(o)
VCC = 5 V,
TA = 25°C
SN54ABT245A
MIN
TYP
MAX
MIN
MAX
MIN
MAX
1
2
3.2
0.8
3.8
1
3.6
1
2.6
3.5
1
4.2
1
3.9
2
3.5
4.5
1.2
6.2
2
5.6
1.9
4
5.3
1.3
6.8
1.9
6.2
2.2
4.4
5.4
2.2
6.1
2.2
5.9
1.5
3
4
1.0
4.9
1.5
4.5
0.5
POST OFFICE BOX 655303
SN74ABT245B
• DALLAS, TEXAS 75265
0.5
UNIT
ns
ns
ns
ns
5
SCBS081L − JANUARY 1991 − REVISED APRIL 2005
PARAMETER MEASUREMENT INFORMATION
7V
S1
500 Ω
From Output
Under Test
Open
GND
CL = 50 pF
(see Note A)
500 Ω
TEST
S1
tPLH/tPHL
tPLZ/tPZL
tPHZ/tPZH
Open
7V
Open
LOAD CIRCUIT
3V
Timing Input
1.5 V
0V
tw
tsu
3V
Input
1.5 V
1.5 V
th
3V
Data Input
1.5 V
1.5 V
0V
0V
VOLTAGE WAVEFORMS
PULSE DURATION
VOLTAGE WAVEFORMS
SETUP AND HOLD TIMES
3V
Input
1.5 V
1.5 V
0V
VOH
1.5 V
Output
1.5 V
VOL
Output
1.5 V
tPLZ
1.5 V
tPZH
VOH
1.5 V
VOL
VOLTAGE WAVEFORMS
PROPAGATION DELAY TIMES
INVERTING AND NONINVERTING OUTPUTS
1.5 V
0V
Output
Waveform 1
S1 at 7 V
(see Note B)
tPLH
tPHL
1.5 V
tPZL
tPHL
tPLH
3V
Output
Control
Output
Waveform 2
S1 at Open
(see Note B)
3.5 V
VOL + 0.3 V
VOL
tPHZ
1.5 V
VOH − 0.3 V
VOH
≈0 V
VOLTAGE WAVEFORMS
ENABLE AND DISABLE TIMES
LOW- AND HIGH-LEVEL ENABLING
NOTES: A. CL includes probe and jig capacitance.
B. Waveform 1 is for an output with internal conditions such that the output is low, except when disabled by the output control.
Waveform 2 is for an output with internal conditions such that the output is high, except when disabled by the output control.
C. All input pulses are supplied by generators having the following characteristics: PRR ≤ 10 MHz, ZO = 50 Ω, tr ≤ 2.5 ns, tf ≤ 2.5 ns.
D. The outputs are measured one at a time, with one transition per measurement.
E. All parameters and waveforms are not applicable to all devices.
Figure 1. Load Circuit and Voltage Waveforms
6
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
PACKAGE OPTION ADDENDUM
www.ti.com
5-Jul-2005
PACKAGING INFORMATION
Orderable Device
Status (1)
Package
Type
Package
Drawing
Pins Package Eco Plan (2)
Qty
5962-9214802Q2A
ACTIVE
LCCC
FK
20
1
TBD
Call TI
Level-NC-NC-NC
5962-9214802QRA
ACTIVE
CDIP
J
20
1
TBD
Call TI
Level-NC-NC-NC
1
TBD
Call TI
Level-NC-NC-NC
TBD
Call TI
Call TI
Pb-Free
(RoHS)
CU NIPDAU
Level-2-260C-1 YEAR/
Level-1-235C-UNLIM
Lead/Ball Finish
MSL Peak Temp (3)
5962-9214802QSA
ACTIVE
CFP
W
20
SN74ABT245BDBLE
OBSOLETE
SSOP
DB
20
SN74ABT245BDBR
ACTIVE
SSOP
DB
20
2000
SN74ABT245BDBRG4
ACTIVE
SSOP
DB
20
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-2-260C-1YEAR
SN74ABT245BDGVR
ACTIVE
TVSOP
DGV
20
2000
Pb-Free
(RoHS)
CU NIPDAU
Level-1-250C-UNLIM
SN74ABT245BDGVRE4
ACTIVE
TVSOP
DGV
20
2000
Pb-Free
(RoHS)
CU NIPDAU
Level-1-250C-UNLIM
SN74ABT245BDW
ACTIVE
SOIC
DW
20
25
Pb-Free
(RoHS)
CU NIPDAU
Level-2-250C-1 YEAR/
Level-1-235C-UNLIM
SN74ABT245BDWG4
ACTIVE
SOIC
DW
20
25
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74ABT245BDWR
ACTIVE
SOIC
DW
20
2000
Pb-Free
(RoHS)
CU NIPDAU
Level-2-250C-1 YEAR/
Level-1-235C-UNLIM
SN74ABT245BDWRG4
ACTIVE
SOIC
DW
20
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74ABT245BGQNR
ACTIVE
VFBGA
GQN
20
1000
TBD
SNPB
Level-1-240C-UNLIM
SN74ABT245BN
ACTIVE
PDIP
N
20
20
Pb-Free
(RoHS)
CU NIPDAU
Level-NC-NC-NC
SN74ABT245BNSR
ACTIVE
SO
NS
20
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74ABT245BNSRE4
ACTIVE
SO
NS
20
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74ABT245BPW
ACTIVE
TSSOP
PW
20
70
Pb-Free
(RoHS)
CU NIPDAU
Level-1-250C-UNLIM
SN74ABT245BPWE4
ACTIVE
TSSOP
PW
20
70
Pb-Free
(RoHS)
CU NIPDAU
Level-1-250C-UNLIM
SN74ABT245BPWLE
OBSOLETE
TSSOP
PW
20
TBD
Call TI
SN74ABT245BPWR
ACTIVE
TSSOP
PW
20
2000
Pb-Free
(RoHS)
CU NIPDAU
Level-1-250C-UNLIM
SN74ABT245BPWRE4
ACTIVE
TSSOP
PW
20
2000
Pb-Free
(RoHS)
CU NIPDAU
Level-1-250C-UNLIM
SN74ABT245BRGYR
ACTIVE
QFN
RGY
20
1000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-2-260C-1YEAR
SN74ABT245BZQNR
ACTIVE
VFBGA
ZQN
20
1000
Pb-Free
(RoHS)
SNAGCU
Level-1-260C-UNLIM
SNJ54ABT245AFK
ACTIVE
LCCC
FK
20
1
TBD
Call TI
Level-NC-NC-NC
SNJ54ABT245AJ
ACTIVE
CDIP
J
20
1
TBD
Call TI
Level-NC-NC-NC
SNJ54ABT245AW
ACTIVE
CFP
W
20
1
TBD
Call TI
Level-NC-NC-NC
(1)
Call TI
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
Addendum-Page 1
PACKAGE OPTION ADDENDUM
www.ti.com
5-Jul-2005
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS) or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
Addendum-Page 2
MECHANICAL DATA
MLCC006B – OCTOBER 1996
FK (S-CQCC-N**)
LEADLESS CERAMIC CHIP CARRIER
28 TERMINAL SHOWN
18
17
16
15
14
13
NO. OF
TERMINALS
**
12
19
11
20
10
A
B
MIN
MAX
MIN
MAX
20
0.342
(8,69)
0.358
(9,09)
0.307
(7,80)
0.358
(9,09)
28
0.442
(11,23)
0.458
(11,63)
0.406
(10,31)
0.458
(11,63)
21
9
22
8
44
0.640
(16,26)
0.660
(16,76)
0.495
(12,58)
0.560
(14,22)
23
7
52
0.739
(18,78)
0.761
(19,32)
0.495
(12,58)
0.560
(14,22)
24
6
68
0.938
(23,83)
0.962
(24,43)
0.850
(21,6)
0.858
(21,8)
84
1.141
(28,99)
1.165
(29,59)
1.047
(26,6)
1.063
(27,0)
B SQ
A SQ
25
5
26
27
28
1
2
3
4
0.080 (2,03)
0.064 (1,63)
0.020 (0,51)
0.010 (0,25)
0.020 (0,51)
0.010 (0,25)
0.055 (1,40)
0.045 (1,14)
0.045 (1,14)
0.035 (0,89)
0.045 (1,14)
0.035 (0,89)
0.028 (0,71)
0.022 (0,54)
0.050 (1,27)
4040140 / D 10/96
NOTES: A.
B.
C.
D.
E.
All linear dimensions are in inches (millimeters).
This drawing is subject to change without notice.
This package can be hermetically sealed with a metal lid.
The terminals are gold plated.
Falls within JEDEC MS-004
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
MECHANICAL DATA
MPDS006C – FEBRUARY 1996 – REVISED AUGUST 2000
DGV (R-PDSO-G**)
PLASTIC SMALL-OUTLINE
24 PINS SHOWN
0,40
0,23
0,13
24
13
0,07 M
0,16 NOM
4,50
4,30
6,60
6,20
Gage Plane
0,25
0°–8°
1
0,75
0,50
12
A
Seating Plane
0,15
0,05
1,20 MAX
PINS **
0,08
14
16
20
24
38
48
56
A MAX
3,70
3,70
5,10
5,10
7,90
9,80
11,40
A MIN
3,50
3,50
4,90
4,90
7,70
9,60
11,20
DIM
4073251/E 08/00
NOTES: A.
B.
C.
D.
All linear dimensions are in millimeters.
This drawing is subject to change without notice.
Body dimensions do not include mold flash or protrusion, not to exceed 0,15 per side.
Falls within JEDEC: 24/48 Pins – MO-153
14/16/20/56 Pins – MO-194
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
MECHANICAL DATA
MSSO002E – JANUARY 1995 – REVISED DECEMBER 2001
DB (R-PDSO-G**)
PLASTIC SMALL-OUTLINE
28 PINS SHOWN
0,38
0,22
0,65
28
0,15 M
15
0,25
0,09
8,20
7,40
5,60
5,00
Gage Plane
1
14
0,25
A
0°–ā8°
0,95
0,55
Seating Plane
2,00 MAX
0,10
0,05 MIN
PINS **
14
16
20
24
28
30
38
A MAX
6,50
6,50
7,50
8,50
10,50
10,50
12,90
A MIN
5,90
5,90
6,90
7,90
9,90
9,90
12,30
DIM
4040065 /E 12/01
NOTES: A.
B.
C.
D.
All linear dimensions are in millimeters.
This drawing is subject to change without notice.
Body dimensions do not include mold flash or protrusion not to exceed 0,15.
Falls within JEDEC MO-150
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
MECHANICAL DATA
MTSS001C – JANUARY 1995 – REVISED FEBRUARY 1999
PW (R-PDSO-G**)
PLASTIC SMALL-OUTLINE PACKAGE
14 PINS SHOWN
0,30
0,19
0,65
14
0,10 M
8
0,15 NOM
4,50
4,30
6,60
6,20
Gage Plane
0,25
1
7
0°– 8°
A
0,75
0,50
Seating Plane
0,15
0,05
1,20 MAX
PINS **
0,10
8
14
16
20
24
28
A MAX
3,10
5,10
5,10
6,60
7,90
9,80
A MIN
2,90
4,90
4,90
6,40
7,70
9,60
DIM
4040064/F 01/97
NOTES: A.
B.
C.
D.
All linear dimensions are in millimeters.
This drawing is subject to change without notice.
Body dimensions do not include mold flash or protrusion not to exceed 0,15.
Falls within JEDEC MO-153
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
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