TI SN74HCT32PWT

SN74LVT245B
3.3-V ABT OCTAL BUS TRANSCEIVER
WITH 3-STATE OUTPUTS
SCES004H − JANUARY 1995 − REVISED SEPTEMBER 2003
D Supports Mixed-Mode Signal Operation
D
1
20
2
19
3
18
4
17
5
16
6
15
7
14
8
13
9
12
10
11
VCC
OE
B1
B2
B3
B4
B5
B6
B7
B8
A1
A2
A3
A4
A5
A6
A7
A8
1
20
19 OE
18 B1
2
3
17 B2
16 B3
4
5
15 B4
14 B5
6
7
13 B6
12 B7
8
9
10
11
B8
DIR
A1
A2
A3
A4
A5
A6
A7
A8
GND
RGY PACKAGE
(TOP VIEW)
VCC
DB, DW, NS, OR PW PACKAGE
(TOP VIEW)
DIR
D
D
Insertion
Latch-Up Performance Exceeds 100 mA Per
JESD 78, Class II
ESD Protection Exceeds JESD 22
− 2000-V Human-Body Model (A114-A)
− 200-V Machine Model (A115-A)
− 1000-V Charged-Device Model (C101)
GND
D
D Ioff and Power-Up 3-State Support Hot
(5-V Input and Output Voltages With
3.3-V VCC)
Supports Unregulated Battery Operation
Down to 2.7 V
Typical VOLP (Output Ground Bounce)
<0.8 V at VCC = 3.3 V, TA = 25°C
description/ordering information
This octal bus transceiver is designed specifically for low-voltage (3.3-V) VCC operation, but with the capability
to provide a TTL interface to a 5-V system environment.
The SN74LVT245B is designed for asynchronous communication between data buses. The device transmits
data from the A bus to the B bus or from the B bus to the A bus, depending on the logic level at the
direction-control (DIR) input. The output-enable (OE) input can be used to disable the device so the buses are
effectively isolated.
ORDERING INFORMATION
QFN − RGY
SN74LVT245BRGYR
Tube
SN74LVT245BDW
Tape and reel
SN74LVT245BDWR
SOP − NS
Tape and reel
SN74LVT245BNSR
LVT245B
SSOP − DB
Tape and reel
SN74LVT245BDBR
LX245B
Tube
SN74LVT245BPW
Tape and reel
SN74LVT245BPWR
TSSOP − PW
VFBGA − GQN
VFBGA − ZQN (Pb-free)
†
TOP-SIDE
MARKING
Tape and reel
SOIC − DW
−40°C
40 C to 85°C
85 C
ORDERABLE
PART NUMBER
PACKAGE†
TA
LX245B
LVT245B
LX245B
SN74LVT245BGQNR
Tape and reel
SN74LVT245BZQNR
LX245B
Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are
available at www.ti.com/sc/package.
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
Copyright © 2003, Texas Instruments Incorporated
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of Texas Instruments
standard warranty. Production processing does not necessarily include
testing of all parameters.
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
1
SN74LVT245B
3.3-V ABT OCTAL BUS TRANSCEIVER
WITH 3-STATE OUTPUTS
SCES004H − JANUARY 1995 − REVISED SEPTEMBER 2003
description/ordering information (continued)
To ensure the high-impedance state during power up or power down, OE should be tied to VCC through a pullup
resistor; the minimum value of the resistor is determined by the current-sinking capability of the driver.
This device is fully specified for hot-insertion applications using Ioff and power-up 3-state. The Ioff circuitry
disables the outputs, preventing damaging current backflow through the device when it is powered down. The
power-up 3-state circuitry places the outputs in the high-impedance state during power up and power down,
which prevents driver conflict.
GQN OR ZQN PACKAGE
(TOP VIEW)
1
2
3
terminal assignments
4
1
2
3
4
A
A
A1
DIR
VCC
OE
B
B
A3
B2
A2
B1
C
C
A5
A4
B4
B3
D
D
A7
B6
A6
B5
E
E
GND
A8
B8
B7
FUNCTION TABLE
INPUTS
OE
OPERATION
DIR
L
L
B data to A bus
L
H
A data to B bus
H
X
Isolation
logic diagram (positive logic)
DIR
1
19
A1
2
18
To Seven Other Channels
Pin numbers shown are for the DB, DW, NS, PW, and RGY packages.
2
OE
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
B1
SN74LVT245B
3.3-V ABT OCTAL BUS TRANSCEIVER
WITH 3-STATE OUTPUTS
SCES004H − JANUARY 1995 − REVISED SEPTEMBER 2003
absolute maximum ratings over operating free-air temperature range (unless otherwise noted)†
Supply voltage range, VCC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.5 V to 4.6 V
Input voltage range, VI (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.5 V to 7 V
Voltage range applied to any output in the high-impedance
or power-off state, VO (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.5 V to 7 V
Voltage range applied to any output in the high state, VO (see Note 1) . . . . . . . . . . . . . −0.5 V to VCC + 0.5 V
Current into any output in the low state, IO . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 128 mA
Current into any output in the high state, IO (see Note 2) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 64 mA
Input clamp current, IIK (VI < 0) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −50 mA
Output clamp current, IOK (VO < 0) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −50 mA
Package thermal impedance, θJA (see Note 3): DB package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 70°C/W
(see Note 3): DW package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 58°C/W
(see Note 3): GQN/ZQN package . . . . . . . . . . . . . . . . . . . . . . . . . . . 78°C/W
(see Note 3): NS package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 60°C/W
(see Note 3): PW package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 83°C/W
(see Note 4): RGY package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 37°C/W
Storage temperature range, Tstg . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −65°C to 150°C
†
Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
NOTES: 1. The input and output negative-voltage ratings may be exceeded if the input and output clamp-current ratings are observed.
2. This current flows only when the output is in the high state and VO > VCC.
3. The package thermal impedance is calculated in accordance with JESD 51-7.
4. The package thermal impedance is calculated in accordance with JESD 51-5.
recommended operating conditions (see Note 5)
MIN
MAX
2.7
3.6
UNIT
VCC
Supply voltage
VIH
High-level input voltage
VIL
Low-level input voltage
VI
Input voltage
5.5
V
IOH
High-level output current
−32
mA
IOL
Low-level output current
Δt/Δv
Input transition rise or fall rate
Δt/ΔVCC
Power-up ramp rate
200
TA
Operating free-air temperature
−40
2
V
0.8
Outputs enabled
V
V
64
mA
10
ns/V
μs/V
85
°C
NOTE 5: All unused inputs of the device must be held at VCC or GND to ensure proper device operation. Refer to the TI application report,
Implications of Slow or Floating CMOS Inputs, literature number SCBA004.
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
3
SN74LVT245B
3.3-V ABT OCTAL BUS TRANSCEIVER
WITH 3-STATE OUTPUTS
SCES004H − JANUARY 1995 − REVISED SEPTEMBER 2003
electrical characteristics over recommended operating free-air temperature range (unless
otherwise noted)
PARAMETER
VIK
VOH
TEST CONDITIONS
VCC = 2.7 V,
II = −18 mA
VCC = 2.7 V to 3.6 V,
IOH = −100 μA
VCC = 2.7 V,
IOH = −8 mA
VCC = 3 V,
IOH = −32 mA
VCC = 2
2.7
7V
VOL
VCC = 3 V
Control inputs
A or B
UNIT
−1.2
V
VCC−0.2
2.4
V
2
IOL = 100 μA
0.2
IOL = 24 mA
0.5
IOL = 16 mA
0.4
IOL = 32 mA
0.5
IOL = 64 mA
0.55
VI = VCC or GND
±1
VCC = 0 or 3.6 V,
VI = 5.5 V
10
VI = 5.5 V
20
VI = VCC
1
VCC = 3.6 V
VI = 0
Ioff
VCC = 0,
VI or VO = 0 to 4.5 V
IOZH
VCC = 3.6 V,
VO = 3 V
IOZL
VCC = 3.6 V,
VO = 0.5 V
IOZPU
IOZPD
V
μA
−5
±100
μA
5
μA
−5
μA
VCC = 0 to 1.5 V, VO = 0.5 V to 3 V, OE = don’t care
±100
μA
VCC = 1.5 V to 0, VO = 0.5 V to 3 V, OE = don’t care
±100
μA
Outputs high
VCC = 3.6 V,
IO = 0,
VI = VCC or GND
ICC
MAX
VCC = 3.6 V,
II
ports‡
TYP†
MIN
0.19
Outputs low
5
Outputs disabled
mA
0.19
ΔICC§
VCC = 3 V to 3.6 V, One input at VCC − 0.6 V,
Other inputs at VCC or GND
Ci
VI = 3 V or 0
4
pF
Cio
VO = 3 V or 0
9
pF
0.2
mA
†
All typical values are at VCC = 3.3 V, TA = 25°C.
‡ Unused terminals are at V
CC or GND.
§ This is the increase in supply current for each input that is at the specified TTL-voltage level, rather than V
CC or GND.
switching characteristics over recommended operating free-air temperature range, CL = 50 pF
(unless otherwise noted) (see Figure 1)
PARAMETER
tPLH
tPHL
tPZH
tPZL
tPHZ
tPLZ
†
4
FROM
(INPUT)
TO
(OUTPUT)
A or B
B or A
OE
A or B
OE
A or B
All typical values are at VCC = 3.3 V, TA = 25°C.
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
VCC = 3.3 V
± 0.3 V
VCC = 2.7 V
UNIT
MIN
TYP†
MAX
1.2
2.3
3.5
4
1.2
2.1
3.5
4
1.3
3.2
5.5
7.1
1.7
3.4
5.5
6.5
2.2
3.5
5.9
6.5
2.2
3.4
5
5.1
MIN
MAX
ns
ns
ns
SN74LVT245B
3.3-V ABT OCTAL BUS TRANSCEIVER
WITH 3-STATE OUTPUTS
SCES004H − JANUARY 1995 − REVISED SEPTEMBER 2003
PARAMETER MEASUREMENT INFORMATION
500 Ω
From Output
Under Test
6V
Open
S1
GND
CL = 50 pF
(see Note A)
500 Ω
TEST
S1
tPLH/tPHL
tPLZ/tPZL
tPHZ/tPZH
Open
6V
GND
2.7 V
LOAD CIRCUIT
Timing Input
1.5 V
0V
tw
tsu
th
2.7 V
1.5 V
Input
2.7 V
1.5 V
Data Input
1.5 V
1.5 V
0V
0V
VOLTAGE WAVEFORMS
PULSE DURATION
VOLTAGE WAVEFORMS
SETUP AND HOLD TIMES
2.7 V
2.7 V
1.5 V
Input
Output
Control
1.5 V
0V
tPLH
Output
Waveform 1
S1 at 6 V
(see Note B)
VOH
1.5 V
VOL
tPHL
VOH
Output
1.5 V
tPLZ
3V
1.5 V
tPZH
tPLH
1.5 V
VOL
Output
Waveform 2
S1 at GND
(see Note B)
VOLTAGE WAVEFORMS
PROPAGATION DELAY TIMES
INVERTING AND NONINVERTING OUTPUTS
1.5 V
0V
tPZL
tPHL
1.5 V
Output
1.5 V
VOL + 0.3 V
VOL
tPHZ
1.5 V
VOH − 0.3 V
VOH
≈0 V
VOLTAGE WAVEFORMS
ENABLE AND DISABLE TIMES
LOW- AND HIGH-LEVEL ENABLING
NOTES: A. CL includes probe and jig capacitance.
B. Waveform 1 is for an output with internal conditions such that the output is low except when disabled by the output control.
Waveform 2 is for an output with internal conditions such that the output is high except when disabled by the output control.
C. All input pulses are supplied by generators having the following characteristics: PRR ≤ 10 MHz, ZO = 50 Ω, tr ≤ 2.5 ns, tf ≤ 2.5 ns.
D. The outputs are measured one at a time with one transition per measurement.
E. All parameters and waveforms are not applicable to all devices.
Figure 1. Load Circuit and Voltage Waveforms
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
5
PACKAGE OPTION ADDENDUM
www.ti.com
21-Dec-2009
PACKAGING INFORMATION
Orderable Device
Status (1)
Package
Type
Package
Drawing
SN74LVT245BDBLE
OBSOLETE
SSOP
DB
20
SN74LVT245BDBR
ACTIVE
SSOP
DB
20
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LVT245BDBRE4
ACTIVE
SSOP
DB
20
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LVT245BDBRG4
ACTIVE
SSOP
DB
20
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LVT245BDW
ACTIVE
SOIC
DW
20
25
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LVT245BDWE4
ACTIVE
SOIC
DW
20
25
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LVT245BDWG4
ACTIVE
SOIC
DW
20
25
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LVT245BDWR
ACTIVE
SOIC
DW
20
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LVT245BDWRE4
ACTIVE
SOIC
DW
20
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LVT245BDWRG4
ACTIVE
SOIC
DW
20
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LVT245BGQNR
NRND
GQN
20
1000
SNPB
Level-1-240C-UNLIM
SN74LVT245BNSR
ACTIVE
SO
NS
20
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LVT245BNSRE4
ACTIVE
SO
NS
20
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LVT245BNSRG4
ACTIVE
SO
NS
20
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LVT245BPW
ACTIVE
TSSOP
PW
20
70
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LVT245BPWE4
ACTIVE
TSSOP
PW
20
70
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LVT245BPWG4
ACTIVE
TSSOP
PW
20
70
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LVT245BPWLE
OBSOLETE
TSSOP
PW
20
TBD
Call TI
SN74LVT245BPWR
ACTIVE
TSSOP
PW
20
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LVT245BPWRE4
ACTIVE
TSSOP
PW
20
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LVT245BPWRG4
ACTIVE
TSSOP
PW
20
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LVT245BRGYR
ACTIVE
VQFN
RGY
20
3000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
SN74LVT245BRGYRG4
ACTIVE
VQFN
RGY
20
3000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
SN74LVT245BZQNR
ACTIVE
ZQN
20
1000 Green (RoHS &
no Sb/Br)
SNAGCU
Level-1-260C-UNLIM
BGA MI
CROSTA
R JUNI
OR
BGA MI
CROSTA
R JUNI
OR
Pins Package Eco Plan (2)
Qty
TBD
Addendum-Page 1
TBD
Lead/Ball Finish
Call TI
MSL Peak Temp (3)
Call TI
Call TI
PACKAGE OPTION ADDENDUM
www.ti.com
21-Dec-2009
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
Addendum-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com
20-Jul-2010
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
SN74LVT245BDBR
SN74LVT245BDWR
SN74LVT245BGQNR
Package Package Pins
Type Drawing
SSOP
SOIC
BGA MI
CROSTA
R JUNI
OR
SPQ
Reel
Reel
A0
Diameter Width (mm)
(mm) W1 (mm)
B0
(mm)
K0
(mm)
P1
(mm)
W
Pin1
(mm) Quadrant
DB
20
2000
330.0
16.4
8.2
7.5
2.5
12.0
16.0
Q1
DW
20
2000
330.0
24.4
10.8
13.0
2.7
12.0
24.0
Q1
GQN
20
1000
330.0
12.4
3.3
4.3
1.5
8.0
12.0
Q1
SN74LVT245BNSR
SO
NS
20
2000
330.0
24.4
8.2
13.0
2.5
12.0
24.0
Q1
SN74LVT245BPWR
TSSOP
PW
20
2000
330.0
16.4
6.95
7.1
1.6
8.0
16.0
Q1
VQFN
RGY
20
3000
330.0
12.4
3.8
4.8
1.6
8.0
12.0
Q1
ZQN
20
1000
330.0
12.4
3.3
4.3
1.5
8.0
12.0
Q1
SN74LVT245BRGYR
SN74LVT245BZQNR
BGA MI
CROSTA
R JUNI
OR
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
20-Jul-2010
*All dimensions are nominal
Device
Package Type
Package Drawing
Pins
SPQ
Length (mm)
Width (mm)
Height (mm)
SN74LVT245BDBR
SSOP
DB
20
2000
346.0
346.0
33.0
SN74LVT245BDWR
SOIC
DW
20
2000
346.0
346.0
41.0
SN74LVT245BGQNR
BGA MICROSTAR
JUNIOR
GQN
20
1000
346.0
346.0
29.0
SN74LVT245BNSR
SO
NS
20
2000
346.0
346.0
41.0
SN74LVT245BPWR
TSSOP
PW
20
2000
346.0
346.0
33.0
SN74LVT245BRGYR
VQFN
RGY
20
3000
346.0
346.0
29.0
SN74LVT245BZQNR
BGA MICROSTAR
JUNIOR
ZQN
20
1000
346.0
346.0
29.0
Pack Materials-Page 2
MECHANICAL DATA
MSSO002E – JANUARY 1995 – REVISED DECEMBER 2001
DB (R-PDSO-G**)
PLASTIC SMALL-OUTLINE
28 PINS SHOWN
0,38
0,22
0,65
28
0,15 M
15
0,25
0,09
8,20
7,40
5,60
5,00
Gage Plane
1
14
0,25
A
0°–ā8°
0,95
0,55
Seating Plane
2,00 MAX
0,10
0,05 MIN
PINS **
14
16
20
24
28
30
38
A MAX
6,50
6,50
7,50
8,50
10,50
10,50
12,90
A MIN
5,90
5,90
6,90
7,90
9,90
9,90
12,30
DIM
4040065 /E 12/01
NOTES: A.
B.
C.
D.
All linear dimensions are in millimeters.
This drawing is subject to change without notice.
Body dimensions do not include mold flash or protrusion not to exceed 0,15.
Falls within JEDEC MO-150
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
MECHANICAL DATA
MTSS001C – JANUARY 1995 – REVISED FEBRUARY 1999
PW (R-PDSO-G**)
PLASTIC SMALL-OUTLINE PACKAGE
14 PINS SHOWN
0,30
0,19
0,65
14
0,10 M
8
0,15 NOM
4,50
4,30
6,60
6,20
Gage Plane
0,25
1
7
0°– 8°
A
0,75
0,50
Seating Plane
0,15
0,05
1,20 MAX
PINS **
0,10
8
14
16
20
24
28
A MAX
3,10
5,10
5,10
6,60
7,90
9,80
A MIN
2,90
4,90
4,90
6,40
7,70
9,60
DIM
4040064/F 01/97
NOTES: A.
B.
C.
D.
All linear dimensions are in millimeters.
This drawing is subject to change without notice.
Body dimensions do not include mold flash or protrusion not to exceed 0,15.
Falls within JEDEC MO-153
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
IMPORTANT NOTICE
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements, improvements,
and other changes to its products and services at any time and to discontinue any product or service without notice. Customers should
obtain the latest relevant information before placing orders and should verify that such information is current and complete. All products are
sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment.
TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TI’s standard
warranty. Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty. Except where
mandated by government requirements, testing of all parameters of each product is not necessarily performed.
TI assumes no liability for applications assistance or customer product design. Customers are responsible for their products and
applications using TI components. To minimize the risks associated with customer products and applications, customers should provide
adequate design and operating safeguards.
TI does not warrant or represent that any license, either express or implied, is granted under any TI patent right, copyright, mask work right,
or other TI intellectual property right relating to any combination, machine, or process in which TI products or services are used. Information
published by TI regarding third-party products or services does not constitute a license from TI to use such products or services or a
warranty or endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual
property of the third party, or a license from TI under the patents or other intellectual property of TI.
Reproduction of TI information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompanied
by all associated warranties, conditions, limitations, and notices. Reproduction of this information with alteration is an unfair and deceptive
business practice. TI is not responsible or liable for such altered documentation. Information of third parties may be subject to additional
restrictions.
Resale of TI products or services with statements different from or beyond the parameters stated by TI for that product or service voids all
express and any implied warranties for the associated TI product or service and is an unfair and deceptive business practice. TI is not
responsible or liable for any such statements.
TI products are not authorized for use in safety-critical applications (such as life support) where a failure of the TI product would reasonably
be expected to cause severe personal injury or death, unless officers of the parties have executed an agreement specifically governing
such use. Buyers represent that they have all necessary expertise in the safety and regulatory ramifications of their applications, and
acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their products
and any use of TI products in such safety-critical applications, notwithstanding any applications-related information or support that may be
provided by TI. Further, Buyers must fully indemnify TI and its representatives against any damages arising out of the use of TI products in
such safety-critical applications.
TI products are neither designed nor intended for use in military/aerospace applications or environments unless the TI products are
specifically designated by TI as military-grade or "enhanced plastic." Only products designated by TI as military-grade meet military
specifications. Buyers acknowledge and agree that any such use of TI products which TI has not designated as military-grade is solely at
the Buyer's risk, and that they are solely responsible for compliance with all legal and regulatory requirements in connection with such use.
TI products are neither designed nor intended for use in automotive applications or environments unless the specific TI products are
designated by TI as compliant with ISO/TS 16949 requirements. Buyers acknowledge and agree that, if they use any non-designated
products in automotive applications, TI will not be responsible for any failure to meet such requirements.
Following are URLs where you can obtain information on other Texas Instruments products and application solutions:
Products
Applications
Amplifiers
amplifier.ti.com
Audio
www.ti.com/audio
Data Converters
dataconverter.ti.com
Automotive
www.ti.com/automotive
DLP® Products
www.dlp.com
Communications and
Telecom
www.ti.com/communications
DSP
dsp.ti.com
Computers and
Peripherals
www.ti.com/computers
Clocks and Timers
www.ti.com/clocks
Consumer Electronics
www.ti.com/consumer-apps
Interface
interface.ti.com
Energy
www.ti.com/energy
Logic
logic.ti.com
Industrial
www.ti.com/industrial
Power Mgmt
power.ti.com
Medical
www.ti.com/medical
Microcontrollers
microcontroller.ti.com
Security
www.ti.com/security
RFID
www.ti-rfid.com
Space, Avionics &
Defense
www.ti.com/space-avionics-defense
RF/IF and ZigBee® Solutions www.ti.com/lprf
Video and Imaging
www.ti.com/video
Wireless
www.ti.com/wireless-apps
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2010, Texas Instruments Incorporated