uClamp0502T Low Profile µClampTM 2-Line ESD protection PROTECTION PRODUCTS - MicroClampTM Description Features The µClamp series of TVS arrays are designed to protect sensitive electronics from damage or latch-up due to ESD. It is designed to replace multilayer varistors (MLVs) in portable applications such as cell phones, notebook computers, and other portable electronics. It features large cross-sectional area junctions for conducting high transient currents. They offer desirable characteristics for board level protection including fast response time, low operating and clamping voltage, and no device degradation. The µClampTM0502T is in a 3-pin, RoHS/WEEE compliant, SLP1006P3T package. It measures 1.0 x 0.6 mm with a nominal height of only 0.4mm. The leads are spaced at a pitch of 0.65mm and are finished with lead-free NiPdAu. Each device will protect two lines operating at 5 volts. It gives the designer the flexibility to protect single lines in applications where arrays are not practical. They may be used to meet the ESD immunity requirements of IEC 61000-4-2, Level 4 (±15kV air, ±8kV contact discharge). The combination of small size and high ESD surge capability makes them ideal for use in portable applications such as cellular phones, digital cameras, and MP3 players. TM Transient protection for data lines to IEC 61000-4-2 (ESD) ±15kV (air), ±8kV (contact) IEC 61000-4-4 (EFT) 40A (tp = 5/50ns) Cable Discharge Event (CDE) Ultra-small package (1.0 x 0.6 x 0.4mm) Protects two data lines Low clamping voltage Working voltage: 5V Low leakage current Solid-state silicon-avalanche technology Mechanical Characteristics SLP1006P3T package RoHS/WEEE Compliant Nominal Dimensions: 1.0 x 0.6 x 0.4 mm Lead Finish: NiPdAu Molding compound flammability rating: UL 94V-0 Marking : Marking code, cathode band Packaging : Tape and Reel Applications Dimensions Cellular Handsets & Accessories Personal Digital Assistants (PDAs) Notebooks & Handhelds Portable Instrumentation Digital Cameras Peripherals MP3 Players Schematic & PIN Configuration 1.0 0.60 0.65 0.40 Nominal Dimensions (mm) Revision 07/25/2007 SLP1006P3T (Bottom View) 1 www.semtech.com uClamp0502T PROTECTION PRODUCTS Absolute Maximum Rating R ating Symbol Value Units Peak Pulse Power (tp = 8/20µs) Pp k 25 Watts Maximum Peak Pulse Current (tp = 8/20µs) Ip p 2 Amps VESD +/- 20 +/- 15 kV TJ -55 to +125 °C TSTG -55 to +150 °C ESD p er IEC 61000-4-2 (Air) ESD p er IEC 61000-4-2 (Contact) Op erating Temp erature Storage Temp erature Electrical Characteristics (T=25oC) Parameter Symbol Conditions Reverse Stand-Off Voltage VRWM Reverse Breakdown Voltage V BR It = 1mA Reverse Leakage Current IR VRWM = 5V, T=25°C Forward Voltage VF IF = 10mA Clamp ing Voltage VC Junction Cap acitance Junction Cap acitance 2007 Semtech Corp. Minimum Typical Maximum Units 5 V 6 V 0.25 µA 1.2 V IPP = 2A, tp = 8/20µs 12.5 V Cj VR = 0V, f = 1MHz 10 pF Cj VR = 3.3V, f = 1MHz 2 1 4.5 pF www.semtech.com uClamp0502T PROTECTION PRODUCTS Typical Characteristics Non-Repetitive Peak Pulse Power vs. Pulse Time Power Derating Curve 110 10 90 % of Rated Power or IPP Peak Pulse Power - PPP (kW) 100 1 0.1 80 70 60 50 40 30 20 10 0 0.01 0.1 1 10 0 100 25 50 75 100 125 150 o Ambient Temperature - TA ( C) Pulse Duration - tp (us) Forward Voltage vs. Forward Current Clamping Voltage vs. Peak Pulse Current 8 15 Forward Voltage - VF V) Clamping Voltage - VC (V) 7 10 5 Waveform Parameters: tr = 8µs td = 20µs 6 5 4 3 Waveform Parameters: tr = 8µs td = 20µs 2 1 0 0 0 0.5 1 1.5 2 2.5 0 3 1 2 3 4 5 6 7 8 9 10 11 12 13 14 Forward Current - IF (A) Peak Pulse Current - IPP (A) Junction Capacitance vs. Reverse Voltage ESD Clamping (8kV Contact per IEC 61000-4-2) 1.1 f = 1 MHz 1 0.9 CJ(VR) / CJ(VR=0) 0.8 0.7 0.6 0.5 0.4 0.3 0.2 0.1 0 0 1 2 3 Reverse Voltage - VR (V) 4 5 Note: Data is taken with a 10x attenuator 2007 Semtech Corp. 3 www.semtech.com uClamp0502T PROTECTION PRODUCTS Typical Characteristics Insertion Loss S21 CH1 S21 LOG Analog Crosstalk 6 dB / REF 0 dB CH1 S21 LOG 20 dB /REF 0 dB 1: -3.0037dB 572.149 MHz 2: -5.0581 dB 800.00 MHz 0 dB 3: -5.8299 dB 900.00 MHz 1 -6 dB 2 3 5 -12 dB 4: -23.207 1.80000 GHz -18 dB -24 dB 4 5: -13.452 2.50000 GHz -30 dB -36 dB 1 MHz START. 030 MHz 2007 Semtech Corp. 10 MHz 100 MHz 3 1 GHz GHz START. 030 MHz STOP 3000. 000000 MHz 4 STOP 3000. 000000 MHz www.semtech.com uClamp0502T PROTECTION PRODUCTS Applications Information Device Connection Options Circuit Diagram This device is designed to protect two data lines. The device is unidirectional and may be used on lines where the signal polarity is above ground. The cathode band should be placed towards the line that is to be protected. Circuit Board Layout Recommendations for Suppression of ESD. Good circuit board layout is critical for the suppression of ESD induced transients. The following guidelines are recommended: z Place the TVS near the input terminals or connectors to restrict transient coupling. z Minimize the path length between the TVS and the protected line. z Minimize all conductive loops including power and ground loops. z The ESD transient return path to ground should be kept as short as possible. z Never run critical signals near board edges. z Use ground planes whenever possible. 2007 Semtech Corp. 5 www.semtech.com uClamp0502T PROTECTION PRODUCTS Applications Information - Spice Model uClamp0502T Spice Model uClamp0502T Spice Parameters 2007 Semtech Corp. Parameter Unit D1 (T VS) IS Amp 2.05e-15 BV Volt 7.0 VJ Volt 0.80 RS Ohm 0.75 IB V Amp 1.0E-3 CJO Farad 9e-12 TT sec 2.541E-9 M -- 0.25 N -- 1.1 EG eV 1.11 6 www.semtech.com uClamp0502T PROTECTION PRODUCTS Outline Drawing - SLP1006P3T A B D DIM E A SEATING PLANE aaa C C A1 L2 b1xN bbb CL b2 A A1 b1 b2 D E e L1 L2 N aaa bbb DIMENSIONS INCHES MILLIMETERS MIN NOM MAX MIN NOM MAX .015 .016 .017 0.37 0.40 0.43 .000 .001 .002 0.00 0.03 0.05 .004 .006 .008 0.10 0.15 0.20 .018 .020 .022 0.45 0.50 0.55 .035 .039 .043 0.90 1.00 1.10 .020 .024 .028 0.50 0.60 0.70 .014 BSC 0.35 BSC .008 .010 .012 0.20 0.25 0.30 .008 .010 .012 0.20 0.25 0.30 3 3 .003 0.08 .004 0.10 C A B CL e L1 0.40 NOTES: 1. CONTROLLING DIMENSIONS ARE IN MILLIMETERS (ANGLES IN DEGREES). Land Pattern - SLP1006P3T P P/2 X1 DIMENSIONS DIM C G P X1 X2 Y Z Y (C) Z G Y INCHES (.028) .016 .014 .008 .022 .012 .039 MILLIMETERS (0.70) 0.40 0.35 0.20 0.55 0.30 1.00 X2 NOTES: 1. CONTROLLING DIMENSIONS ARE IN MILLIMETERS (ANGLES IN DEGREES). 2. THIS LAND PATTERN IS FOR REFERENCE PURPOSES ONLY. CONSULT YOUR MANUFACTURING GROUP TO ENSURE YOUR COMPANY'S MANUFACTURING GUIDELINES ARE MET. 2007 Semtech Corp. 7 www.semtech.com uClamp0502T PROTECTION PRODUCTS Marking Code Ordering Information 2T Part Number Working Voltage Qty per Reel Reel Size uClamp 0502T.TCT 5V 3,000 7 Inch Notes: 1) This is a lead-free, RoHS/WEEE compliant product MicroClamp, uClamp and µClamp are marks of Semtech Corporation Tape and Reel Specification Pin 1 Location User Direction of feed Device Orientation in Tape A0 0.69 +/-0.10 mm B0 K0 1.19 +/-0.10 mm 0.66 +/-0.10 mm Tape Width B, (Max) D D1 8 mm 4.2 mm (.165) 1.5 + 0.1 mm - 0.0 mm (0.59 +.005 - .000) 0.4 mm ±0.25 (.031) E 1.750±.10 mm (.069±.004) F P P0 P2 T W 3.5±0.05 mm (.138±.002) 4.0±0.10 mm (.157±.004) 4.0±0.1 mm (.157±.004) 2.0±0.05 mm (.079±.002) 0.254±0.02 mm (.016) 8.0 mm + 0.3 mm - 0.1 mm (.312±.012) Contact Information Semtech Corporation Protection Products Division 200 Flynn Rd., Camarillo, CA 93012 Phone: (805)498-2111 FAX (805)498-3804 2007 Semtech Corp. 8 www.semtech.com