uClamp0504T Low Profile μClamp® 4-Line ESD Protection PROTECTION PRODUCTS - MicroClamp® Description Features ® The μClamp series of TVS arrays are designed to protect sensitive electronics from damage or latch-up due to ESD. It is designed to replace single line devices such as multilayer varistors (MLVs) in space constrained applications such as cell phones, notebook computers, and other portable electronics. It features large cross-sectional area junctions for conducting high transient currents. TVS diodes offer desirable characteristics for board level protection including fast response time, low operating and clamping voltage, and no device degradation. Transient protection for data lines to The μClamp®0504T is in a 6-pin SLP1313P6T package. It measures 1.3 x 1.3 mm with a nominal height of only 0.4mm. The leads are spaced at a pitch of 0.4mm and are finished with lead-free NiPdAu. Each device features four TVS diodes with an operating voltage of 5 volts and a maximum loading capacitance of only 10pF. They may be used to meet the ESD immunity requirements of IEC 61000-4-2, Level 4 (±15kV air, ±8kV contact discharge). The combination of small size and high ESD surge capability makes them ideal for use in portable applications such as cellular phones, digital cameras, and notebook computers. Mechanical Characteristics IEC 61000-4-2 (ESD) ±15kV (air), ±8kV (contact) IEC 61000-4-4 (EFT) 40A (tp = 5/50ns) Cable Discharge Event (CDE) Ultra-small package Protects four data lines Low clamping voltage Working voltage: 5V Low capacitance (10pF) Solid-state silicon-avalanche technology SLP1313P6T package Pb-Free, Halogen Free, RoHS/WEEE Compliant Nominal Dimensions: 1.3 x 1.3 x 0.4 mm Lead Finish: NiPdAu Molding compound flammability rating: UL 94V-0 Marking : Marking code Packaging : Tape and Reel Applications Dimensions Cellular Handsets & Accessories Notebooks & Handhelds mp3 Players Cordless Phones Portable Instrumentation Digital Cameras Peripherals Schematic 1 1 1.30 2 3 3 4 6 1.30 6 5 4 0.40 BSC 0.40 Center Tab (GND) Nominal Dimensions (mm) (SLP1313P6T Bottom View) Revision 10/07/2009 Note: Pin 2 and 5 are N.C. 1 www.semtech.com uClamp0504T PROTECTION PRODUCTS Absolute Maximum Rating R ating Symbol Value Units Peak Pulse Power (tp = 8/20μs) Pp k 25 Watts Maximum Peak Pulse Current (tp = 8/20μs) Ip p 2 Amps VESD +/- 20 +/- 15 kV TJ -55 to +125 °C TSTG -55 to +150 °C ESD p er IEC 61000-4-2 (Air) ESD p er IEC 61000-4-2 (Contact) Op erating Temp erature Storage Temp erature Electrical Characteristics (T=25oC) Parameter Symbol Conditions Reverse Stand-Off Voltage VRWM Reverse Breakdown Voltage V BR It = 1mA Reverse Leakage Current IR VRWM = 5V, T=25°C Forward Voltage VF IF = 10mA Clamp ing Voltage VC Junction Cap acitance Junction Cap acitance © 2009 Semtech Corp. Minimum Typical Maximum Units 5 V 6 V 0.25 μA 1.2 V IPP = 2A, tp = 8/20μs 12.5 V Cj VR = 0V, f = 1MHz 10 pF Cj VR = 3.3V, f = 1MHz 2 1 4.5 pF www.semtech.com uClamp0504T PROTECTION PRODUCTS Typical Characteristics Non-Repetitive Peak Pulse Power vs. Pulse Time Power Derating Curve 110 10 90 % of Rated Power or IPP Peak Pulse Power - PPP (kW) 100 1 0.1 80 70 60 50 40 30 20 10 0 0.01 0.1 1 10 0 100 25 50 75 100 125 150 Ambient Temperature - TA (oC) Pulse Duration - tp (us) Forward Voltage vs. Forward Current Clamping Voltage vs. Peak Pulse Current 8 15 Forward Voltage - VF V) Clamping Voltage - VC (V) 7 10 5 Waveform Parameters: tr = 8μs td = 20μs 6 5 4 3 Waveform Parameters: tr = 8μs td = 20μs 2 1 0 0 0 0.5 1 1.5 2 2.5 0 3 1 2 3 4 5 6 7 8 9 10 11 12 13 14 Forward Current - IF (A) Peak Pulse Current - IPP (A) Normalized Junction Capacitance vs. Reverse Voltage ESD Clamping (8kV Contact per IEC 61000-4-2) 1.1 f = 1 MHz 1 0.9 CJ(VR) / CJ(VR=0) 0.8 0.7 0.6 0.5 0.4 0.3 0.2 0.1 0 0 1 2 3 Reverse Voltage - VR (V) 4 5 Note: Data is taken with a 10x attenuator © 2009 Semtech Corp. 3 www.semtech.com uClamp0504T PROTECTION PRODUCTS Applications Information Device Connection Options Circuit Diagram This device is designed to protect four data lines. The device is unidirectional and may be used on lines where the signal polarity is above ground. 1 3 4 6 Circuit Board Layout Recommendations for Suppression of ESD. Good circuit board layout is critical for the suppression of ESD induced transients. The following guidelines are recommended: z Place the TVS near the input terminals or connectors to restrict transient coupling. z Minimize the path length between the TVS and the protected line. z Minimize all conductive loops including power and ground loops. z The ESD transient return path to ground should be kept as short as possible. z Never run critical signals near board edges. z Use ground planes whenever possible. © 2009 Semtech Corp. Center Tab (GND) Note: Pin 2 and 5 are N.C. 4 www.semtech.com uClamp0504T PROTECTION PRODUCTS Applications Information - Spice Model uClamp0504T Spice Model uClamp0504T Spice Parameters © 2009 Semtech Corp. Parameter Unit D1 (T VS) IS Amp 2.05e-15 BV Volt 7.0 VJ Volt 0.80 RS Ohm 0.75 IB V Amp 1.0E-3 CJO Farad 9e-12 TT sec 2.541E-9 M -- 0.25 N -- 1.1 EG eV 1.11 5 www.semtech.com uClamp0504T PROTECTION PRODUCTS Outline Drawing - SLP1313P6T A B D DIM E PIN 1 INDICATOR (LASER MARK) A SEATING PLANE aaa C A2 C A1 A A1 A2 b D D1 E E1 e L N aaa bbb DIMENSIONS INCHES MILLIMETERS MIN NOM MAX MIN NOM MAX 0.37 0.40 0.43 0.00 0.03 0.05 (0.13) 0.15 0.20 0.25 1.20 1.30 1.40 0.90 1.00 1.10 1.20 1.30 1.40 0.20 0.30 0.40 0.40 BSC 0.20 0.25 0.30 6 0.08 0.10 .015 .016 .017 0.00 .001 .002 (.005) .006 .008 .010 .047 .051 .055 .035 .039 .043 .047 .051 .055 .008 .012 .016 .016 BSC .008 .010 .012 6 .003 .004 D1 1 2 LxN E/2 E1 N bxN bbb e C A B D/2 NOTES: 1. CONTROLLING DIMENSIONS ARE IN MILLIMETERS (ANGLES IN DEGREES). 2. COPLANARITY APPLIES TO THE EXPOSED PAD AS WELL AS THE TERMINALS. Land Pattern - SLP1313P6T P DIMENSIONS (C) H G DIM C G H K P X Y Z Z Y X INCHES (.050) .027 .012 .039 .016 .008 .023 .073 MILLIMETERS (1.27) 0.69 0.30 1.00 0.40 0.20 0.58 1.85 K NOTES: 1. CONTROLLING DIMENSIONS ARE IN MILLIMETERS (ANGLES IN DEGREES). 2. THIS LAND PATTERN IS FOR REFERENCE PURPOSES ONLY. CONSULT YOUR MANUFACTURING GROUP TO ENSURE YOUR COMPANY'S MANUFACTURING GUIDELINES ARE MET. 3. THERMAL VIAS IN THE LAND PATTERN OF THE EXPOSED PAD SHALL BE CONNECTED TO A SYSTEM GROUND PLANE. FAILURE TO DO SO MAY COMPROMISE THE THERMAL AND/OR FUNCTIONAL PERFORMANCE OF THE DEVICE. © 2009 Semtech Corp. 6 www.semtech.com uClamp0504T PROTECTION PRODUCTS Marking Code Ordering Information U504T YW Part Number Working Voltage Qty per Reel Reel Size uClamp 0504T.TCT 5V 3,000 7 Inch Notes: 1) This is a lead-free, RoHS/WEEE compliant product MicroClamp, uClamp and μClamp are marks of Semtech Corporation YW = Date Code Tape and Reel Specification Pin 1 Location User Direction of feed Device Orientation in Tape A0 1.51 +/-0.05 mm B0 K0 1.51 +/-0.05 mm 0.56 +/-0.05 mm Tape Width B, (Max) D D1 8 mm 4.2 mm (.165) 1.5 + 0.1 mm - 0.0 mm (0.59 +.005 - .000) 0.8 mm ±0.05 (.031) E 1.750±.10 mm (.069±.004) F K (MAX) P P0 P2 T(MAX) W 3.5±0.05 mm (.138±.002) 2.4 mm (.094) 4.0±0.1 mm (.157±.004) 4.0±0.1 mm (.157±.004) 2.0±0.05mm (.079±.002) 0.4 mm (.016) 8.0 mm + 0.3 mm - 0.1 mm (.312±.012) Contact Information Semtech Corporation Protection Products Division 200 Flynn Rd., Camarillo, CA 93012 Phone: (805)498-2111 FAX (805)498-3804 © 2009 Semtech Corp. 7 www.semtech.com