STMICROELECTRONICS L9339DIE1

L9339
Quad low side driver
Features
■
Wide operating supply voltage range from
4.5 V up to 32 V for transient 45 V
■
Very low stand-by quiescent current < 2 µA
■
Input to output signal transfer function
programmable
■
High signal range from -0.3 V up to 32 V for all
inputs
■
TTL and CMOS compatible inputs
■
Defined output off state for open inputs
■
Four open drain DMOS outputs, with
RDSon = 1.5 Ω for VS > 6 V at 25 °C
■
Output current limitation
■
Controlled output slope for low EMI
■
Over temperature protection for each channel
■
Integrated output clamping for fast inductive
recirculation VFB > 45 V
Description
Status monitoring for
– Over temperature
– Disconnected ground or supply voltage
The L9339 is a monolithic integrated quad low
side driver. It is intended to drive lines, lamps or
relays in automotive or industrial applications.
■
Table 1.
SO20
BARE DIE
Device summary
Order code
Package
Packing
L9339
SO20
Tube
DIE
Bare die
SO20
Tube
L9339DIE1
(1)
L9339MD
1. Obsolete order code.
June 2008
Rev 2
1/14
www.st.com
1
Contents
L9339
Contents
1
Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
2
Pins description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
3
Electrical specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
3.1
Absolute maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
3.2
Thermal data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
3.3
Electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
4
Functional description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
5
Package information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
6
Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
2/14
L9339
List of figures
List of figures
Figure 1.
Figure 2.
Figure 3.
Figure 4.
Figure 5.
Figure 6.
Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
Pins connection (top view) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
Timing characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
Application for inverting transfer polarity. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
Application for non inverting transfer polarity . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
SO20 mechanical data and package dimensions. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
3/14
List of tables
L9339
List of tables
Table 1.
Table 2.
Table 3.
Table 4.
Table 5.
Table 6.
Table 7.
4/14
Device summary . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Pins function . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
Absolute maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
Thermal data. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
Electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
Diagnostic . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
Document revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
L9339
1
Block diagram
Block diagram
Figure 1.
Block diagram
IN 4
O UT 4
C H AN N EL 4
O UT 1
IN 1
=
&
T H ER M A L
S H U TDOWN
C H AN N EL 1
4
PR G
D IA G
D IAG N O S T IC
LO GIC
EN
V int
VS
R E FE R EN C E
V logic
GND
5/14
Pins description
2
L9339
Pins description
Figure 2.
Pins connection (top view)
NC
1
20
NC
VS
2
19
DIAG
NC
3
18
NC
IN3
4
17
IN2
IN4
5
16
IN1
EN
6
15
PRG
OUT4
7
14
OUT1
OUT3
8
13
OUT2
GND
9
12
NC
11
NC
NC
10
SO20
Table 2.
6/14
Pins function
Pins #
Pin Name
Description
2
VS
9
GND
Ground
6
EN
Enable
15
PRG
Programing
19
DIAG
Diagnostic
16
IN 1
Input 1
17
IN 2
Input 2
4
IN 3
Input 3
5
IN 4
Input 4
14
OUT 1
OUTPUT 1
13
OUT 2
OUTPUT 2
8
OUT 3
OUTPUT 3
7
OUT4
OUTPUT4
1,3,10,11,12,18,20
NC
Supply Voltage
Not Connected
L9339
Electrical specifications
3
Electrical specifications
3.1
Absolute maximum ratings
Table 3.
Absolute maximum ratings
Symbol
VS
dVS/dt
VIN, VPRG
IIN
Parameter
Supply voltage
Supply voltage transient
Input, Programming
Input, Programming
DC voltage
Pulse (T < 400 ms)
Unit
-0.3 to 32
-0.3 to 45
V
-10 to +10
V/µs
-0.3 to 32
-0.3 to 45
V
-10
mA
-24 to 32
-24 to 45
V
-0.3 to 45 (1)
V
-1
internal limited
A
-0.3 to 32
-0.3 to 45
V
Negative input current
VEN
Enable voltage
Enable voltage
VOUT
Output voltage
IOUT
Negative output current
Positive output current
VDIAG
DC
Pulse (T < 400 ms)
Value
DC
Pulse (T <400ms)
Diagnostic output voltage
Diagnostic output voltage
DC
Pulse (T < 400ms)
1. In flyback phase the output voltage can reach 60 V.
ESD according to MIL 883C; tested at 2 kV; corresponds to maximum energy dissipation 0.2 mJ.
3.2
Thermal data
Table 4.
Thermal data
Symbol
Parameter
Min.
Typ.
Max.
Unit.
TJSDon
Temperature shutdown switch-on-threshold
160
200
°C
TJSDoff
Temperature shutdown switch-off-threshold
140
180
°C
97
°C/W
Rth j-amb
Thermal resistance junction to ambient
(1))
1. Mounted on SMPCB2 board
7/14
Electrical specifications
3.3
L9339
Electrical characteristics
The electrical characteristics are valid within the below defined operating conditions, unless
otherwise specified. The function is guaranteed by design until TJSDon switch-on-threshold.
VS = 4.5 to 32 V; Tj = -40 to 150 °C; Tamb = -40 to 125 °C; Ambient test temperature = -40 to
125 °C.
Table 5.
Electrical characteristics
Symbol
Parameter
Test condition
Min.
Typ.
Max.
Unit
<2
10
µA
50
µA
2
mA
Supply
-0.3 V < VEN < 0.5 V; VS = 14 V;
Ta < 125 °C
IQ
Quiescent current
-0.3 V < VEN < 0.5 V; VS = 14 V;
Ta < 150 °C
VEN > 3.2 V; VS < 14 V
1.5
Inputs, IN1 - IN4; Programming, PRG
VINlow
Input voltage low
-0.3
2.0
V
VINhigh
Input voltage high
2.8
32
V
-15
25
µA
IIN
Input current
VIN = 0 to 32V
Enable EN
VENlow
Input voltage low
-24
1
V
VENhigh
Input voltage high
3.2
VS
V
REN
Input impedance
-24 V < VIN < 2.5 V
IEN
Input current
2.5 V < VIN < 32 V
20
80
µA
VS > 6 V, IO = 0.3 A
1.7
3.8
Ω
VO =VS = 14 V; Ta < 125 °C
<1
5
µA
25
µA
60
V
1
A
1
A
VO > 4.5 V
100
pF
1.3
V
15
mA
10
kΩ
Outputs OUT1- OUT4
RDSon
Output ON-resistor
IOLeak
Leakage current
VO=VS = 14 V; Ta < 150 °C
VOClamp Output voltage during clamping
IOSC
CO
Short-circuit current
internal output capacities
time < 200 µs
10 mA < IO < 0.3 A
45
4.5V < VS < 6 V
0.3
VS > 6 V
0.4
52
0.7
Diagnostic output DIAG
VDlow
Output voltage LOW
IDL < 0.6 mA
IDmax
Maximum output current
internal current limitation
VD = 14 V
8/14
1
5
L9339
Table 5.
Symbol
IDLeak
Electrical specifications
Electrical characteristics (continued)
Parameter
Max.
Unit
< 0.1
1
µA
5
µA
2
3.5
µs
3
4.5
µs
10
µs
10
µs
16
V/µs
VD = VS = 14 V; Ta < 150 °C
On delay time
td,off
Off delay time
Sout
Typ.
(1)
td,on
td,DIAG
Min.
VD = VS = 14 V; Ta < 125 °C
Leakage current
Timing characteristics
tset
Test condition
VS = 14 V, Cext = 0 pF
10 mA < IO < 200 mA
Enable settling time
ON or OFF diagnostic delay time
Output voltage slopes
(2)
2.5
9
1. See also Figure 3 timing characteristics.
2. Output voltage slope not controlled for enable low.
All parameters are measured at Tamb = 125 °C.
Figure 3.
Timing characteristics
V
EN
V IN hig h
V IN low
active
t
V
PR G
Non-Inverting Mode
Inverting Mode
V IN hig h
V IN low
t
V
IN
V IN hig h
V IN low
t
V
OUT
V
S
5)
1/2 V
S
t
t
set
t
d,off
t
d,on
t
d,off
t
d,on
t
d,off
t
d,on
t
set
9/14
Functional description
4
L9339
Functional description
The L9339 is a quad low side driver for lines, lamps or inductive loads in automotive and
industrial applications.
The logic input levels are TTL and CMOS compatible. This allows the device to be driven
directly by a microcontroller. For the noise immunity, all input thresholds has a hysteresis of
typ. 100 mV. At each input (IN and PRG) voltages from -0.3 V to 32 V can be applied, EN
can withstand voltages from -25 V to 3 2 V. The device is activated with a 'high' signal on
ENable. ENable 'low' switches the device into the sleep mode. In this mode the quiescent
current is less than 10 µA. A high signal on PRoGramming input changes the signal transfer
polarity from non inverting into the inverting mode. This pin can be connected to VS or GND.
The forced status of the PRG and EN pin is low, if these pins are not connected. This forced
condition leads to a mode change if the PRG pin was high before the interruption.
Independent of the PRoGramming input, the OUTput switches off, if the signal INput pin is
not connected.
Each output driver has a current limitation of min 0.4 A and a independent thermal shutdown. The thermal shut-down deactivates that output, which exceeds temperature switch off
level. When the junction temperature decreases 20 K below this temperature threshold the
output will be activated again (hysteresis of the thermal shutdown function). The slew rate
of the output voltage is limited to max. 14 V/µs, to reduce the electromagnetic radiation of
the loads and its wiring. For inductive loads a output voltage clamp of typically 52 V is
implemented.
The DIAGnostic is an open drain output with an additional series diode. The logic status
depends on the PRoGramming pin. If the PRG pin is 'low' the DIAG output becomes low, if
the device works correctly. At thermal shut-down of one channel the DIAGnostic output
becomes high. If the PRG pin is 'high' this output is switched off at normal function and
switched on at over temperature.
Table 6.
Diagnostic
Pins
EN
PRG
IN
OUT
DIAG
H
L
L
L (on)
L (on)
H
L
H
H (off)
L (on)
H
H
L
H (off)
H (off)
H
H
H
L (on)
H (off)
L
X
X
H (off)
H (off)
Over temperature or
supply voltage
H
L
X
H (off)(1)
H (off)
Over temperature
H
H
X
H (off)(1)
L (on)
Correct function
1. Selective for each channel at over temperature
X = not relevant
H = high
L = low
10/14
L9339
Functional description
Figure 4.
Application for inverting transfer polarity
BOARD VOLTAGE 14 V
VCC = 5V
10µF
MICROCONTROLLER
VCC
INT
PRG
M
DIAG
A 0:8
8
Adressdecoder
VCC = 5V
EN
L9339
D0
IN 1
OUT 1
D1
IN 2
OUT 2
D2
IN 3
OUT 3
D3
IN 4
OUT 4
GND
GND
Figure 5.
VS
2W
12 mH
250 mA
240
VCC
IN
50 kHz
10µH
GND
50pF
Application for non inverting transfer polarity
BOARD VOLTAGE 14 V
10µF
PRG
VS
M
DIAG
VCC = 5V
EN
L9339
IN 1
OUT 1
IN 2
OUT 2
IN 3
OUT 3
IN 4
OUT 4
GND
2W
12 mH
250 mA
240
VCC
IN
10µH
50pF
GND
1. We recommend to use the device for driving inductive loads with flyback energy EFB < 2mJ.
11/14
Package information
5
L9339
Package information
In order to meet environmental requirements, ST (also) offers these devices in ECOPACK®
packages. ECOPACK® packages are lead-free. The category of second Level Interconnect
is marked on the package and on the inner box label, in compliance with JEDEC Standard
JESD97. The maximum ratings related to soldering conditions are also marked on the inner
box label.
ECOPACK is an ST trademark. ECOPACK specifications are available at: www.st.com.
Figure 6.
SO20 mechanical data and package dimensions
mm
inch
DIM.
MIN.
A
TYP.
2.35
MAX.
MIN.
2.65
0.093
TYP.
MAX.
0.104
A1
0.10
0.30
0.004
0.012
B
0.33
0.51
0.013
0.200
C
0.23
0.32
0.009
0.013
D (1)
12.60
13.00
0.496
0.512
E
7.40
7.60
0.291
0.299
e
1.27
0.050
H
10.0
10.65
0.394
0.419
h
0.25
0.75
0.010
0.030
L
0.40
1.27
0.016
0.050
k
ddd
OUTLINE AND
MECHANICAL DATA
0˚ (min.), 8˚ (max.)
0.10
0.004
(1) “D” dimension does not include mold flash, protusions or gate
burrs. Mold flash, protusions or gate burrs shall not exceed
0.15mm per side.
SO20
0016022 D
12/14
L9339
6
Revision history
Revision history
Table 7.
Document revision history
Date
Revision
Changes
20-Dec-1999
1
Initial release.
24-Jun-2008
2
Document reformatted.
Updated the Table 1: Device summary.
Updated the Figure 5.
13/14
L9339
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14/14