STM1066 Smart voltage supervisor Features ■ Operating voltage 2.7 V to 5.5 V ■ Supply current of 1.5 µA (typ) ■ Factory-trimmed voltage threshold from 3.2 V to 3.5 V in 50 mV increments ■ ±3% voltage threshold accuracy across temperature ■ Enable and inhibit inputs (EN, INH) ■ Power supply transient immunity ■ Current limited output of 15 mA (max) ■ Available in flip chip 6-bump package ■ Operating temperature –30°C to +85°C Flip chip (6-bump) Applications ■ Portable devices ■ Cell phones/smart phones ■ PDA ■ Palmtops ■ Organizers ■ Portable audio/video players ■ Portable terminals April 2008 Rev 4 1/20 www.st.com 1 Contents STM1066 Contents 1 Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 2 Operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 2.1 Output, OUT . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 2.2 Enable input, EN . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 2.3 Inhibit input, INH . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 3 Typical operating characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 4 Maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 5 DC and AC characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 6 Package mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 7 Part numbering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17 8 Package marking information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18 9 Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19 2/20 STM1066 List of tables List of tables Table 1. Table 2. Table 3. Table 4. Table 5. Table 6. Table 7. Table 8. Table 9. Pin descriptions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 Truth table. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 Absolute maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 Operating and AC measurement conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 DC and AC characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 Flip chip 6-bump, package mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16 Ordering information scheme . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17 Factory-trimmed thresholds with marking description. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18 Document revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19 3/20 List of figures STM1066 List of figures Figure 1. Figure 2. Figure 3. Figure 4. Figure 5. Figure 6. Figure 7. Figure 8. Figure 9. Figure 10. Figure 11. Figure 12. Figure 13. 4/20 Logic diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 6-bump flip chip connections . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 Application hookup . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 Supply current vs. supply voltage, VEN = 4 V . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 Supply current vs. temperature, VEN = 4 V. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 Supply current vs. supply voltage, VEN = 0 V . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 Supply current vs. temperature, VEN = 0 V. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 Rising voltage detector threshold vs. temperature . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 Threshold hysteresis vs. temperature. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 Waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 Flip chip 6-bump, package mechanical outline . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 Flip chip tape and reel specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16 STM1066 1 Description Description The STM1066 device monitors VCC, and connects OUT to VIN or GND, based on the VCC level (above VTH+ or below VTH- ) and the state of EN and INH inputs. The device offers several voltage thresholds, VTH+ (see Table 8) and it is available in miniature flip chip 6-bump package. Figure 1. Logic diagram VCC VIN EN STM1066 INH OUT GND ai 13963 5/20 Description Table 1. Figure 2. STM1066 Pin descriptions Pin Symbol Function 1A VIN Supply for output pin (OUT) 1B EN Enable from USB VBUS 1C GND Ground 2A OUT Output 2B INH Active high. Inhibits device 2C VCC Chip supply 6-bump flip chip connections A B C 1 VIN EN GND 2 OUT INH VCC bottom view, bumps up A B C 2 OUT INH VCC 1 VIN EN GND top view, bumps down ai 13915 6/20 STM1066 Figure 3. Description Block diagram VIN VCC Current source Band gap + - GND OUT Level shifter LOGIC Delay 2µs EN VCC INH ai13916 Figure 4. Application hookup VBUS USB charging and transceiver circuits VBAT DC-DC step-up converter OUT EN VCC C3 GND USB connector R1 R2 VBOOST ASIC VBAT C1 EN Inhibit control VCC VIN VCHARGER OUT INH C2 GND STM1066 ai13917 7/20 Operation 2 STM1066 Operation The STM1066 connects or disconnects the output OUT, from the VIN pin based on the logical combination of the enable input (EN), the inhibit input (INH), and the supply voltage level, VCC (see Table 2 or Figure 11 for more details). 2.1 Output, OUT If the enable input is in a logic high state and inhibit input is in a logic low state, the output will be connected to VIN input as VCC rises above the VTH+ voltage threshold. Otherwise, the output is connected to ground GND. The output is current limited (see Table 5). 2.2 Enable input, EN A Logic low on the enable input disconnects the output from VIN and disables the device, which enters a standby mode with very low current consumption (see Table 5). 2.3 Inhibit input, INH A logic high on the inhibit input disconnects the output from VIN. Table 2. Truth table VCC EN(1) INH OUT <VTH+ (rising edge) <VTH- (falling edge) x x connected to GND x L x connected to GND x x H connected to GND >VTH+ (rising edge) >VTH- (falling edge) H L connected to VIN 1. Once the device is disabled by EN input, the VCC must be above VTH+ to reconnect output to VIN. 8/20 STM1066 Typical operating characteristics Figure 5. Supply current vs. supply voltage, VEN = 4 V 3.0 Supply Current, ICC (µA) 2.5 2.0 1.5 TA = -30 ˚C TA = 25 ˚C TA = 0˚C TA = 85˚C 1.0 0.5 0.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 Supply Voltage, VCC (V) ai13942 Figure 6. Supply current vs. temperature, VEN = 4 V 2.5 Supply Current, ICC (µA) 3 Typical operating characteristics 2.0 1.5 1.0 VCC = 2.70 V VCC = 3.50 V VCC = 4.25 V VCC = 5.00 V VCC = 5.50 V 0.5 0.0 -30 -20 -10 0 10 20 30 40 50 60 70 80 Temperature, TA (˚C) ai13943 9/20 Typical operating characteristics Figure 7. STM1066 Supply current vs. supply voltage, VEN = 0 V 0.8 Supply Current, ICC (µA) 0.7 0.6 0.5 0.4 TA = -30 ˚C 0.3 TA = 85 ˚C 0.2 TA = 25 ˚C 0.1 TA = 0 ˚C 0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 Supply Voltage, VCC (V) ai13944 Figure 8. Supply current vs. temperature, VEN = 0 V Supply Current, ICC (µA) 0.65 0.60 0.55 VCC = 2.70 V VCC = 3.50 V 0.50 VCC = 4.25 V VCC = 5.00 V VCC = 5.50 V 0.45 -30 -20 -10 0 10 20 30 40 50 60 70 80 Temperature, TA (˚C) ai13945 10/20 STM1066 Typical operating characteristics Rising voltage detector threshold, VTH+ (V) Figure 9. Rising voltage detector threshold vs. temperature 3.50 maximum value 3.45 3.40 3.35 typical value 3.30 minimum value 3.25 3.20 -30 -20 -10 0 10 20 30 40 50 60 70 80 Temperature, TA (˚C) ai13946 Figure 10. Threshold hysteresis vs. temperature Threshold Hysteresis, VHYST (mV) 550 maximum value 500 450 400 350 minimum value 300 250 -30 -20 -10 0 10 20 30 40 50 60 70 80 Temperature, TA (˚C) ai13947 11/20 Maximum ratings 4 STM1066 Maximum ratings Stressing the device above the rating listed in the “Absolute maximum ratings” table may cause permanent damage to the device. These are stress ratings only and operation of the device at these or any other conditions above those indicated in the Operating sections of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. Refer also to the STMicroelectronics SURE Program and other relevant quality documents. Table 3. Absolute maximum ratings Symbol Parameter Min Typ Max Unit Remarks VCC Input supply voltage –0.2 +7.0 V VIN Output source voltage –0.2 +7.0 V Independent of VCC VEN VBUS input –0.2 VCC + 0.3 V Series 1M external resistor for protection VOUT Output pin –0.3 VIN + 0.3 V VINH Inhibit pin –0.3 VCC + 0.3 V Operating ambient temperature –30 +85 °C Storage temperature –45 +150 °C –100 +100 V Machine model –2000 +2000 V Human body model –500 +500 V Charged device model TA Electrostatic protection Electrostatic protection 12/20 STM1066 5 DC and AC characteristics DC and AC characteristics This section summarizes the operating measurement conditions and the DC and AC characteristics of the device. The parameters in the DC and AC characteristics tables that follow are derived from tests performed under the measurement conditions summarized in Table 4: Operating and AC measurement conditions. Designers should check that the operating conditions in their circuit match the operating conditions when relying on the quoted parameters. Table 4. Operating and AC measurement conditions Parameter Condition Unit VCC supply voltage 2.7 to 5.5 V Ambient operating temperature (TA) –30 to 85 °C ≤5 ns Input rise and fall times Figure 11. Waveforms V CC (V BAT ) V TH+ V TH~2.1V ~2.3V EN VIH EN (VBUS ) EN VIL INHIBIT V IN (5V input option) OUT Output follows Vin ai 13919 Note: VIN assumed to be from 1.6 V to 5.5 V. No VIN means no signal on OUT pin. If there is no VCC then there will be no VIN. 13/20 DC and AC characteristics Table 5. DC and AC characteristics Sym Parameter VCC Supply voltage ICC Supply current into VCC pin ICC +IIN Current into VCC + VIN pins VTH+ VHYST VTH- STM1066 Test condition(1) Min Typ 2.7 Max Unit 5.5 V VEN = 0 V 0.6 1 µA VEN = 4 V 1.5 15 µA VEN = 0 V 5 µA VEN = 4 V 15 µA +3% V 0.5 V Rising voltage detector threshold (see Table 7 on page 17 for detailed listing) –3% Threshold hysteresis VTH+ 0.3 VTH+ - VHYST V tPD-FALL(2) VCC falling to OUT delay VCC falling from (VTH- + 100 mV) to (VTH- – 100 mV) at 10 mV/µs 30 µs tPD-RISE(2) VCC rising to OUT delay VCC rising from (VTH+ – 100 mV) to (VTH+ + 100 mV) at 10m V/µs 70 µs VIN Falling voltage detector threshold Voltage on VIN pin Supply for output pin Allows 2.5 V rail, VBAT or +5 V 2.4 5.5 V VIN - 0.2 VIN V 0.3 V 15 mA Output pin, OUT(3) VOUT-OH Output high voltage, see Figure 11 ISOURCE = 5 mA VOUT-OL Output low voltage ISINK = 10 mA IOUT Output current 5 Enable input, EN VEN-IH When VBUS is valid VEN-IL When VBUS is not valid 0.4 V IEN-IN Enable input current 0.1 µA 1.2 EN glitch immunity V 1 µs Inhibit input, INH VINH-IH Inhibit logic high VINH-IL Inhibit logic low 0.4 V VINH-IN Inhibit input current 0.1 µA INH glitch immunity 1.2 V 1 1. Valid for ambient operating temperature: TA = –30°C to +85°C; VCC = 2.7 V to 5.5 V (except where noted). 2. Guaranteed by design. 3. For VCC below VTH-, the output remains low down to VCC = 1 V. Below VCC = 1 V the voltage VIN must be less than VOUT-OL (max.) to guarantee output low voltage less than 0.3 V. 14/20 µs STM1066 6 Package mechanical data Package mechanical data In order to meet environmental requirements, ST offers these devices in ECOPACK® packages. These packages have a lead-free second level interconnect. The category of second Level Interconnect is marked on the package and on the inner box label, in compliance with JEDEC Standard JESD97. The maximum ratings related to soldering conditions are also marked on the inner box label. ECOPACK is an ST trademark. ECOPACK specifications are available at: www.st.com. Figure 12. Flip chip 6-bump, package mechanical outline Flip chip (6-bump) 15/20 Package mechanical data Table 6. STM1066 Flip chip 6-bump, package mechanical data mm inches Symbol Min Typ Max Min Typ Max A 0.54 0.60 0.66 0.021 0.024 0.026 A1 0.170 0.205 0.240 0.007 0.008 0.009 A2 0.395 0.015 b 0.215 0.255 0.295 0.008 0.010 0.012 D 1.17 1.20 1.23 0.046 0.047 0.048 D1 0.80 0.031 e 0.36 0.40 0.44 0.014 0.016 0.017 E 0.77 0.80 0.83 0.030 0.031 0.033 E1 0.36 0.40 0.44 0.014 0.016 0.017 SE 0.18 0.20 0.22 0.007 0.008 0.009 f 0.20 0.008 ccc 0.05 0.002 $ 0.035 0.045 0.050 0.001 0.002 0.002 Figure 13. Flip chip tape and reel specifications Dot identifying pin A1 location All dimensions in mm TxS yww TxS yww TxS yww 4.00±0.10 User direction of unreeling 3.50±0.05 TxS yww –0.10 8.00 +0.30 5±0 1.30 ±0.05 TxS yww 0.90 ±0.05 16/20 2.00±0.05 1.5 0.200±0.015 1.75±0.10 .05 4.00±0.10 0.71±0.05 STM1066 7 Part numbering Part numbering Table 7. Ordering information scheme Example: STM1066 C35 F3 8 F Device type STM1066 Threshold voltage (3.2 V to 3.5 V in 50 mV increments) C20: 3.20 V(1) C25: 3.25 V(1) C30: 3.30 V(1) C35: 3.35 V C40: 3.40 V(1) C45: 3.45 V(1) C50: 3.50 V(1) Package F3: Flip chip, lead-free, pitch = 400 µm, bump = 250 µm Temperature 8: –30°C to 85°C Shipping method F = ECOPACK® package, tape & reel 1. Contact local ST sales office for availability. 17/20 Package marking information STM1066 8 Package marking information Table 8. Factory-trimmed thresholds with marking description Part number Rising voltage detector threshold VTH+ at ambient temperature TA from –30 to +85°C Topside marking(1) Min (–3%) Typ Max (+3%) STM1066C20F38F 3.104 3.20 3.296 TAS yww STM1066C25F38F 3.152 3.25 3.348 TBS yww STM1066C30F38F 3.201 3.30 3.399 TCS yww STM1066C35F38F 3.249 3.35 3.451 TDS yww STM1066C40F38F 3.298 3.40 3.502 TES yww STM1066C45F38F 3.346 3.45 3.554 TFS yww STM1066C50F38F 3.395 3.50 3.605 TGS yww 1. Where “y” = assembly year (0 to 9) and “ww” = assembly work week (01 to 52). 18/20 STM1066 9 Revision history Revision history Table 9. Document revision history Date Revision Changes 06-Sep-2007 1 Initial release. 03-Jan-2008 2 Updated cover page, Section 1, Figure 2, 11, 13, and Table 4; added Figure 1: Logic diagram; minor text and presentation changes. 26-Mar-2008 3 Updated Table 5, 6. 09-Apr-2008 4 Document status upgraded to full datasheet; updated Figure 12. 19/20 STM1066 Please Read Carefully: Information in this document is provided solely in connection with ST products. STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, modifications or improvements, to this document, and the products and services described herein at any time, without notice. All ST products are sold pursuant to ST’s terms and conditions of sale. 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