MTCH810 Haptics Controller Description: The MTCH810 provides an easy way to add Haptic feedback to any button/sliders capacitive touch interface. The device integrates a single-channel Haptic driver output with an industry standard I2C™ slave interface to create a simple Haptic feedback peripheral. Features: • Internal Library of Effects: - 14 Haptic effect commands - Firmware revision query command - Abort Playback command • I2C Control Interface: - 7-bit Addressing mode (address = 0x10) - Supports 100 kHz and 400 kHz transfer rate • Wide Operating Voltage: 2.3V-5.5V • Minimal Number of External Components • Low-Power Consumption when Idle • Operating Temperature: -40˚C to +85˚C Package Type: The device is only offered in an 8-pin 3x3 DFN package (see Figure 1). FIGURE 1: 8-PIN DFN DIAGRAM FOR MTCH810 TABLE 1: Name 8-PIN DFN PINOUT DESCRIPTION 8-Pin DFN Description VDD 1 Power supply input DR2 2 Drive output 2 DR1 3 Drive output 1 NC 4 No connection SDA 5 I2C™ Data SCL 6 I2C™ Clock NC 7 No connection VSS 8 Ground Pin Description: DR1 This is the non-inverting PWM Haptics drive output. It should be connected to the non-inverting input of a Haptic driver circuit designed for Eccentric Rotating Mass Actuators (ERMs). DR2 It should be connected to the inverting input of a Haptic driver circuit designed for ERM Actuators. SDA This pin is the serial data connection of the I2C interface. It should be connected to the I2C master SDA signal with a pull-up resistor to VDD. 3x3 DFN 1 DR2 2 DR1 3 NC 4 8 MTCH810 VDD 2012 Microchip Technology Inc. VSS 7 NC 6 SCL 5 SDA SCL This pin is the serial clock connection of the I2C interface. It should be connected to the I2C master SCL signal with a pull-up resistor to VDD. DS41672A-page 1 MTCH810 Table of Contents 1.0 Device Overview ........................................................................................................................................................................ 3 2.0 I2C™ Serial Interface ................................................................................................................................................................. 7 3.0 Electrical Characteristics.......................................................................................................................................................... 13 4.0 Packaging Information ............................................................................................................................................................. 20 Index ............................................................................................................ ........................................................................................25 The Microchip Web Site ....................................................................................................................................................................... 26 Customer Change Notification Service ................................................................................................................................................ 26 Customer Support ................................................................................................................................................................................ 26 Reader Response ................................................................................................................................................................................ 27 Product Identification System .............................................................................................................................................................. 28 TO OUR VALUED CUSTOMERS It is our intention to provide our valued customers with the best documentation possible to ensure successful use of your Microchip products. To this end, we will continue to improve our publications to better suit your needs. Our publications will be refined and enhanced as new volumes and updates are introduced. If you have any questions or comments regarding this publication, please contact the Marketing Communications Department via E-mail at [email protected] or fax the Reader Response Form in the back of this data sheet to (480) 792-4150. We welcome your feedback. Most Current Data Sheet To obtain the most up-to-date version of this data sheet, please register at our Worldwide Web site at: http://www.microchip.com You can determine the version of a data sheet by examining its literature number found on the bottom outside corner of any page. The last character of the literature number is the version number, (e.g., DS30000A is version A of document DS30000). Errata An errata sheet, describing minor operational differences from the data sheet and recommended workarounds, may exist for current devices. As device/documentation issues become known to us, we will publish an errata sheet. The errata will specify the revision of silicon and revision of document to which it applies. To determine if an errata sheet exists for a particular device, please check with one of the following: • Microchip’s Worldwide Web site; http://www.microchip.com • Your local Microchip sales office (see last page) When contacting a sales office, please specify which device, revision of silicon and data sheet (include literature number) you are using. Customer Notification System Register on our web site at www.microchip.com to receive the most current information on all of our products. DS41672A-page 2 2012 Microchip Technology Inc. MTCH810 1.0 DEVICE OVERVIEW The Microchip mTouch™ MTCH810 Haptics feedback controller provides an easy way to add tactile feedback to any application. The device implements all the digital functions for a Haptics feedback system. The Haptic effects are designed to provide feedback for a “Button and Slider” type capacitive touch interface. When combined with an analog power driver and an Eccentric Rotating Mass (ERM) style actuator, the resulting circuit comprises a complete tactile feedback Haptic system. The device is controlled through an I2C slave interface. In response to a two-byte command, the MTCH810 (in combination with the driver and ERM) generates one of 13 different Haptic vibration effects. The effects are 180-220 Hz vibrations with different amplitude envelopes and durations. The effects create a variety of different ‘feels’ to provide feedback for different capacitive touch commands, status and error conditions. Several effects are similar with different power levels in order to allow the users to compensate for the variations in the coupling of the vibrations to the user’s finger tip. Two additional commands allow the termination of an effect early and the ability to read the effects table revision. 1.1 Communications • I2C, Slave mode 1.2 Drive Outputs • DR1 is a dedicated PWM output • DR2 is a dedicated inverted PWM output 1.3 PWM Resolution • 10 bits 2012 Microchip Technology Inc. 1.4 1.4.1 Pin Description DR1 This is the enable/non-inverting digital PWM Haptics drive output. It should be connected to the non-inverting input of a Haptic power driver circuit design for ERM actuators. The PWM output should only be active when an effect is in progress. 1.4.2 DR2 This is the inverting digital PWM Haptics driver output. It should be connected to the inverting input of a Haptic power driver circuit designed for ERM actuators. The PWM output should only be active when an effect is in progress. 1.4.3 I2C – SERIAL DATA PIN (SDA) The SDA pin is the serial data pin of the I2C interface. The SDA pin is used to write or read the registers and Configuration bits. The SDA pin is an open-drain Nchannel driver. Therefore, it needs an external pull-up resistor from the VDD line to the SDA pin. Except for the Start and Stop conditions, the data on the SDA pin must be stable during the high period of the clock. The high or low state of the SDA pin can only change when the clock signal on the SCL pin is low. Refer to Section 2.1.2 “I2C Operation” for more details on the I2C serial interface communication. 1.4.4 I2C – SERIAL CLOCK PIN (SCL) The SCL pin is the serial clock pin of the I2C interface. The I2C interface only acts as a slave and the SCL pin accepts only external serial clocks. The input data from the master device is shifted into the SDA pin on the rising edges of the SCL clock, and the output from the device occurs at the falling edges of the SCL clock. The SCL pin is an open-drain N-channel driver. Therefore, it needs an external pull-up resistor from the VDD line to the SCL pin. Refer to Section Section 2.1.2 “I2C Operation” for more details on I2C serial interface communication. For more details, see Figure 1-1 and Table 1-1. DS41672A-page 3 MTCH810 1.4.4.1 1.6 Clock Stretching A feature of the SCL pin is clock stretching. This allows the I2C slave to hold communications at the end of each byte from the master. Its purpose is to allow the slave sufficient time to process the data before the next byte is sent. It accomplishes the clock hold by turning on the open-drain output, holding the clock line low. This prevents the master from starting the transmission of the next byte in the packet. For proper operation, the I2C master must be capable of recognizing a clock stretch condition, and suspending transmission until the MTCH810 releases the SCL pin. Note: 1.5 The MTCH810 includes a time-out function on the clock stretching function that will reset the I2C interface in the event that the I2C interface hangs in a clock stretch condition. Haptic Commands The commands are transmitted via the I2C serial interface as a Start condition, address plus write bit, two successive bytes and a Stop condition. For the effect table revision number, the Write command is followed by an I2C read of two bytes. Table 2-2 and Table 2-3 list all the commands supported by the MTCH810. Hardware To build a complete Haptic system, the two digital PWM outputs must be filtered to produce a DC drive signal, and amplified to produce a minimum of 300 mA of drive at 3V. This output is then used to drive an ERM actuator. Figure 1-1 below shows a typical controller, driver and actuator combination for a Haptic system. The MTCH810 is the controller in the system, accepting I2C commands and generating the appropriate PWM signals to create the Haptic effect. The outputs from the MTCH810 are then filtered and amplified by the DRV8601. The amplifier stage is essentially an audio frequency amplifier configured for differential inputs and outputs. The output of the amplifier then drives the ERM. The RC network in the feedback path provides a pole in the transfer function at 160 Hz to roll off the high frequency gain and attenuate the ripple at the PWM frequency. The connection between the DR1 output and the enable of the amplifier allows the controller to generate an output for the ERM with a drive/coast format, rather than a drive/brake control. Using a differential output eliminates the need for a large capacitor on the output to AC couple the drive signal to the ERM. Note: Any audio frequency drive circuits will work in the application, provided it can supply 300 mA at 3V and turn on in less than 1 mS. Amplifiers with built-in “click and pop” elimination have soft-start enables which have a turn on time of >10 mS and are not suitable for a Haptic driver. Table 1-1 lists the qualified ERM actuators and their manufacturers. TABLE 1-1: APPROVED ACTUATORS AND SPECIFICATIONS Dimensions (mm) Rated Voltage Haptic Transient Overdrive Voltage Impedance Nidec NRS-3388i 4.6 ± 0.2D 15.6 ± 0.9L 1.3V ± 0.2V 3.3V 10.6 ± 20% Johnson Electric 1999-1MB0037EP 6.0H x 8.0W 21.5L 4.5V 5.0V 10- typical Actuator DS41672A-page 4 2012 Microchip Technology Inc. MTCH810 FIGURE 1-1: TYPICAL SCHEMATIC VDD VDD R1 1.5K C1 C2 .1 uF R2 1.5K SDA 5 SDA DR1 2 SCL 6 SCL DR2 3 MTCH810 VSS 8 .01 uF R4 100K 1 VDD 3 R3 4 49.9K 1 2 EN REF IN2 VDD 6 IN1 VSS 7 OUT+ OUT5 8 DRV8601 R6 R7 100K 100K C3 .01 uF ERM1 VDD C5 .1 uF C6 4.7 uF C4 .01 uF R5 100K 2012 Microchip Technology Inc. DS41672A-page 5 MTCH810 NOTES: DS41672A-page 6 2012 Microchip Technology Inc. MTCH810 I2C™ SERIAL INTERFACE 2.0 This device supports the I2C serial protocol. The I2C module operates in Slave mode, so it does not generate the serial clock. 2.1 Overview 2 This I C interface is a two-wire interface. Figure 2-1 shows a typical I2C Interface connection. The I2C interface specifies different communication bit rates. These are referred to as Standard, Fast or High Speed modes. The MTCH810 device supports these three modes. The bit rates of these modes are: • Standard mode: Bit Rates up to 100 kbit/s • Fast mode: Bit Rates up to 400 kbit/s A device that sends data onto the bus is defined as a transmitter, and a device receiving data is defined as a receiver. The bus has to be controlled by a master device which generates the serial clock (SCL), controls the bus access and generates the Start and Stop conditions. The MTCH810 device works as slave. Both master and slave can operate as transmitter or receiver, but the master device determines which mode is activated. Communication is initiated by the master (microcontroller) which sends the Start bit, followed by the slave address byte. The first byte transmitted is always the slave address byte, which contains the device code, the address bits and the R/W bit. FIGURE 2-1: TYPICAL I2C™ INTERFACE Typical I2C™ Interface Connections MTCH810 Host Controller SCL SCL SDA SDA The I2C serial protocol only defines the field types, field lengths, timings, etc. of a frame. The frame content defines the behavior of the device. For details on the frame content (commands/data) refer to Section 2.3 “I2C Commands”. Refer to the NXP User Manual (UM10204_3) for more details on the I2C specifications. 2.1.1 SIGNAL DESCRIPTIONS The I2C interface uses up to two pins (signals). These are: • SDA (Serial Data) (see Section 1.4.3 “I2C – Serial Data Pin (SDA)”) • SCL (Serial Clock) (see Section 1.4.4 “I2C – Serial Clock Pin (SCL)”) 2.1.2 I2C OPERATION The MTCH810 device I2C module is compatible with the NXP I2C specification. The following lists some of the module’s features: • 7-bit Slave Addressing • Supports Three Clock Rate modes: - Standard mode, clock rates up to 100 kHz - Fast mode, clock rates up to 400 kHz • Support Multi-Master Applications The I2C 10-bit addressing mode is not supported. The NXP I2C specification only defines the field types, field lengths, timings, etc. of a frame. The frame content defines the behavior of the device. The frame content for this device is defined in Section 2.3 “I2C Commands”. 2.1.3 I2C BIT STATES AND SEQUENCE Figure 2-8 shows an I2C 8-bit transfer sequence, while Figure 2-7 shows the bit definitions. The serial clock is generated by the master. The following definitions are used for the bit states: • Start bit (S) • Data bit • Acknowledge (A) bit (driven low)/ No Acknowledge (A) bit (not driven low) • Repeated Start bit (Sr) • Stop bit (P) 2.1.4 START BIT The Start bit (see Figure 2-2) indicates the beginning of a data transfer sequence. The Start bit is defined as the SDA signal falling when the SCL signal is high. FIGURE 2-2: START BIT 1st Bit SDA 2nd Bit SCL S 2012 Microchip Technology Inc. DS41672A-page 7 MTCH810 2.1.5 DATA BIT FIGURE 2-4: The SDA signal may change state while the SCL signal is low. While the SCL signal is high, the SDA signal MUST be stable (see Figure 2-3). FIGURE 2-3: SCL DATA BIT 2nd Bit 1st Bit SDA 2.1.7 A D0 8 9 NOT A (A) RESPONSE The A bit has the SDA signal high. Table 2-1 shows the conditions where the slave device will issue a Not A (A). SCL Data Bit 2.1.6 SDA ACKNOWLEDGE WAVEFORM ACKNOWLEDGE (A) BIT The A bit (see Figure 2-4) is typically a response from the receiving device to the transmitting device. Depending on the context of the transfer sequence, the A bit may indicate different things. Typically, the slave device will supply an A response after the Start bit and eight data bits have been received. An A bit has the SDA signal low. TABLE 2-1: MTCH810 A / A RESPONSES Event General Call Slave Address valid Slave Address not valid Bus Collision DS41672A-page 8 Acknowledge Bit Response Comment A A A N/A Treated as “Don’t Care” if the collision occurs on the Start bit. Otherwise, I2C™ resets. 2012 Microchip Technology Inc. MTCH810 2.1.8 2.1.9 REPEATED START BIT The Repeated Start bit (see Figure 2-5) indicates that the current master device wishes to continue communicating with the current slave device without releasing the I2C bus. The Repeated Start condition is the same as the Start condition, except that the Repeated Start bit follows a Start bit (with the Data bits + A bit) and not a Stop bit. STOP BIT The Stop bit (see Figure 2-6) indicates the end of the I2C data transfer sequence. The Stop bit is defined as the SDA signal rising when the SCL signal is high. A Stop bit resets the I2C interface of the MTCH810 device. FIGURE 2-6: The Start bit is the beginning of a data transfer sequence and is defined as the SDA signal falling when the SCL signal is high. STOP CONDITION RECEIVE OR TRANSMIT MODE SDA A / A Note 1: A bus collision during the Repeated Start condition occurs if: SCL P • SDA is sampled low when SCL goes from low-to-high. 2.1.9.1 • SCL goes low before SDA is asserted low. This may indicate that another master is attempting to transmit a data ‘1’. FIGURE 2-5: Aborting a Transmission If any part of the I2C transmission does not meet the command format, it is aborted. This can be intentionally accomplished with a Start or Stop condition. This is done so that noisy transmissions (usually an extra Start or Stop condition) are aborted before they corrupt the device. REPEAT START CONDITION WAVEFORM 1st Bit SDA SCL Sr = Repeated Start FIGURE 2-7: TYPICAL 8-BIT I2C™ WAVEFORM FORMAT SDA SCL S FIGURE 2-8: 1st Bit 2nd Bit 3rd Bit 4th Bit 5th Bit 6th Bit 7th Bit 8th Bit A/A P I2C™ DATA STATES AND BIT SEQUENCE SDA SCL Start Condition 2012 Microchip Technology Inc. Data allowed to change Data or A valid Stop Condition DS41672A-page 9 MTCH810 2.1.9.2 2.2 Device Addressing The address byte is the first byte received following the Start condition from the master device. The full seven bits of the I2C slave address is “0010000”. Figure 2-9 shows the I2C slave address byte format, which contains the seven address bits and a Read/ Write (R/W) bit. FIGURE 2-9: SLAVE ADDRESS BITS IN THE I2C™ CONTROL BYTE Acknowledge bit Start bit Read/Write bit R/W Slave Address ACK Address Byte Slave Address (7 bits) 0 0 1 A6 A5 A4 Note 1: 0 A3 0 0 0 A0 Address A2 A1 A0 Note 1 Address Bits (A6:A0) can be reprogrammed by the customer. Device Commands This section documents the commands that the device supports. The commands can be grouped into the following categories: • Effect Commands • Revision and Control Commands TABLE 2-2: Index I2C™ Message 0 0x00 0x00 Haptic Effect Description Strong click 1 0x01 0xFF Med. strong click 60% 2 0x02 0xFE Low strong click 30% 3 0x03 0xFD Sharp click 4 0x04 0xFC Sharp click 60% 5 0x05 0xFB Sharp click 30% 6 0x06 0xFA Soft bump 7 0x07 0xF9 Med. soft bump 60% 8 0x08 0xF8 Soft bump 30% 9 0x09 0xF7 Double click 10 0x0A 0xF6 Double click 60% 11 0x0B 0xF5 Triple click 12 0x0C 0xF4 Soft buzz 13 0x0D 0xF3 Strong buzz TABLE 2-3: DS41672A-page 10 EFFECT COMMANDS REVISION AND CONTROL COMMANDS Index I2C™ Message Haptic Effect Description 14 0x0E 0xF2 Read effect library version number 15 0x0F 0xF1 Abort effect playback 2012 Microchip Technology Inc. MTCH810 I2C COMMANDS 2.3 2.3.2 2 The I C protocol does not specify how commands are formatted, so this section specifies the MTCH810 device I2C command formats and operation. REVISION AND CONTROL COMMANDS The supported commands are shown in Table 2-2 and Table 2-3. Revision and Control commands are used to either retrieve the current revision of the effects table within the controller, or to terminate early a Haptic effect. Just like the Effect commands, the command codes are two’s compliments of one another. The Terminate-early command is executed at the completion of the I2C Stop condition. When the Revision command is sent, the controller then formats the revision data and waits for an I2C read from the master. 2.3.1 2.3.3 The commands can be grouped into the following categories: • Effect Commands • Revision and Control Commands EFFECT COMMANDS Effect commands are used to initiate a specific Haptic effect. The command consists of two bytes which are the XOR of one another. The effect begins with the completion of the I2C Stop condition. ABORTING A COMMAND TRANSMISSION A Restart or Stop condition in an expected data bit position will abort the current command sequence and data will not be written to the MTCH810. Write commands are automatically aborted if the binary XOR checksum is not valid. 2.3.4 WRITE COMMAND (NORMAL AND HIGH VOLTAGE) The format of the command is shown in Figure 2-10. The MTCH810 generates the A / A bits. A Write command will only start a write cycle after a properly formatted Write command has been received and the Stop condition has occurred. FIGURE 2-10: WRITE RANDOM ADDRESS COMMAND Write bit I2C Slave Address S Command Message 0 0 1 0 0 0 0 0 A 0 0 0 0 1 0 0 1 A 1 1 1 1 0 1 1 1 A P 2012 Microchip Technology Inc. DS41672A-page 11 MTCH810 2.3.5 REVISION COMMAND 2.3.5.1 The format of the Revision command (see Figure 2-11) includes the Start condition, I2C control byte (with R/W bit set to 0), A bit, the first command byte, A bit, followed by the two’s compliment of the command byte, a Repeated Start bit, I2C control byte (with R/W bit set to 1) and the MTCH810 device transmitting the requested data bytes one at a time, until the master sends a Stop condition. Ignoring an I2C Transmission and “Falling Off” the Bus The MTCH810 device expects to receive complete, valid I2C commands and will assume that any command not defined as a valid command is due to a bus corruption and will enter a passive high condition on the SDA signal. All signals will be ignored until the next valid Start condition and control byte are received. The I2C control byte requires the R/W bit to be equal to a logic one (R/W = 1) in order to generate a read sequence. The data read will start with the Most Significant Byte (MSB) of the revision date and automatically increment to the next byte after each byte request. The sequence is ended with the master generating a Stop or Restart condition. Figure 2-11 shows the waveforms for a single read. FIGURE 2-11: READ REVISION COMMAND Write bit Repeated Start bit I2C™ Slave Address S 0 0 1 0 0 0 0 0 A Revision Command 0 0 0 0 1 1 1 0 A 1 1 1 1 0 0 1 0 A Sr Stop bit I2C™ Slave Address Read bit 0 0 Revision MSB 1 0 0 0 0 1 A D D D 7 6 5 D D D 4 3 2 Revision LSB D D 1 D D D D D D D D 1 1 0 A 7 6 5 4 3 2 1 0 N P Note 1: Master device is responsible for A / A signal. If a A signal occurs, the MTCH810 will abort this transfer and release the bus. DS41672A-page 12 2012 Microchip Technology Inc. MTCH810 3.0 ELECTRICAL SPECIFICATIONS Absolute Maximum Ratings(†) Ambient temperature under bias....................................................................................................... -40°C to +125°C Storage temperature ........................................................................................................................ -65°C to +150°C Voltage on VDD with respect to VSS .................................................................................................... -0.3V to +4.0V Voltage on all other pins with respect to VSS ........................................................................... -0.3V to (VDD + 0.3V) Total power dissipation(1) ............................................................................................................................... 800 mW Maximum current out of VSS pin, -40°C TA +85°C for industrial................................................................. 85 mA Maximum current into VDD pin, -40°C TA +85°C for industrial.................................................................... 80 mA Clamp current, IK (VPIN < 0 or VPIN > VDD)20 mA Maximum output current sunk by any DR pin ................................................................................................... 25 mA Maximum output current sourced by any DR pin .............................................................................................. 25 mA Note 1: Power dissipation is calculated as follows: PDIS = VDD x {IDD – IOH} + {(VDD – VOH) x IOH} + (VOl x IOL). † NOTICE: Stresses above those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress rating only and functional operation of the device at those or any other conditions above those indicated in the operation listings of this specification is not implied. Exposure to maximum rating conditions for extended periods may affect device reliability. 2012 Microchip Technology Inc. DS41672A-page 13 MTCH810 3.1 DC Characteristics: MTCH810 Standard Operating Conditions (unless otherwise stated) Operating temperature -40°C TA +85°C for industrial MTCH810 Param. No. Sym. Characteristic Min. Typ† Max. Units D001 VDD Supply Voltage 1.8 — 3.6 V D002 D003 VPOR* Power-on Reset Release Voltage — 1.6 — V VPORR* Power-on Reset Rearm Voltage — 0.8 — V D004* SVDD VDD Rise Rate to ensure internal Power-on Reset signal 0.05 — — V/ms Conditions Device in Sleep mode * † These parameters are characterized but not tested. Data in “Typ” column is at 3.0V, 25°C unless otherwise stated. These parameters are for design guidance only and are not tested. Note 1: This is the limit to which VDD can be lowered in Sleep mode without losing RAM data. FIGURE 3-1: POR AND POR REARM WITH SLOW RISING VDD VDD VPOR VPORR VSS NPOR(1) POR REARM VSS TVLOW(2) Note 1: 2: 3: DS41672A-page 14 TPOR(3) When NPOR is low, the device is held in Reset. TPOR 1 s typical. TVLOW 2.7 s typical. 2012 Microchip Technology Inc. MTCH810 3.2 DC Characteristics: MTCH810-I/E DC CHARACTERISTICS Param. No. Sym. VIL D030A Characteristic Input Low Voltage DR PORT: with TTL buffer Standard Operating Conditions (unless otherwise stated) Operating temperature-40°C TA +85°C for industrial Min. Typ† Max. Units — — 0.15 VD V Conditions 1.8V VDD 3.6V D D031 VIH D040A D041 IIL D060 VOL D080 VOH D090 with I2C™ levels Input High Voltage DR Ports: with TTL buffer with I2C™ levels Input Leakage Current(1) DR Ports Output Low Voltage(3) DR Ports Output High Voltage(3) DR Ports — — 0.3 VDD V 0.25 VDD + 0.8 0.7 VDD — — V — — V — ±5 ± 125 nA — ±5 ± 1000 nA — — 0.6 V IOL = 6 mA, VDD = 3.3V IOL = 1.8 mA, VDD = 1.8V VDD - 0.7 — — V IOH = 3 mA, VDD = 3.3V IOH = 1 mA, VDD = 1.8V 1.8V VDD 3.6V VSS VPIN VDD, Pin at high-impedance at 85°C 125°C Capacitive Loading Specs on Output Pins All DR pins — — 50 pF D101A* CIO * These parameters are characterized but not tested. † Data in “Typ” column is at 3.0V, 25°C unless otherwise stated. These parameters are for design guidance only and are not tested. Note 1: Negative current is defined as current sourced by the pin. 2: The leakage current on the MCLR pin is strongly dependent on the applied voltage level. The specified levels represent normal operating conditions. Higher leakage current may be measured at different input voltages. 3: Including OSC2 in CLKOUT mode. 2012 Microchip Technology Inc. DS41672A-page 15 MTCH810 FIGURE 3-2: LOAD CONDITIONS Load Condition Pin CL VSS Legend: CL = 50 pF for all pins TABLE 3-1: DR TIMING PARAMETERS Standard Operating Conditions (unless otherwise stated) Operating Temperature -40°C TA +125°C Param. No. Sym. Characteristic OS18* TioR DR output rise time OS19* TioF DR output fall time * † Min. Typ† Max. Units Conditions — — — — 90 55 60 44 140 80 80 60 ns VDD = 1.8V VDD = 3.0-3.6V VDD = 1.8V VDD = 3.0-3.6V ns These parameters are characterized but not tested. Data in “Typ” column is at 3.0V, 25C unless otherwise stated. DS41672A-page 16 2012 Microchip Technology Inc. MTCH810 FIGURE 3-3: BROWN-OUT RESET TIMING AND CHARACTERISTICS VDD VBOR and VHYST VBOR (Device in Brown-out Reset) (Device not in Brown-out Reset) 37 Reset 33 (due to BOR) TABLE 3-2: RESET, WATCHDOG TIMER, OSCILLATOR START-UP TIMER, POWER-UP TIMER AND BROWN-OUT RESET PARAMETERS Standard Operating Conditions (unless otherwise stated) Operating Temperature -40°C TA +125°C Param. No. 31 33* * † Sym. Characteristic Min. Typ† Max. Units TWDTLP Watchdog Timer Time-out Period 205 256 305 ms TPWRT 40 65 140 ms Power-up Timer Period Conditions VDD = 1.8V-3.6V, 1:1 Prescaler used These parameters are characterized but not tested. Data in “Typ” column is at 3.0V, 25°C unless otherwise stated. These parameters are for design guidance only and are not tested. 2012 Microchip Technology Inc. DS41672A-page 17 MTCH810 I2C™ BUS START/STOP BITS TIMING FIGURE 3-4: SCLx SP93 SP91 SP90 SP92 SDAx Stop Condition Start Condition Note: Refer to Figure 3-2 for load conditions. FIGURE 3-5: I2C™ BUS DATA TIMING SP103 SCLx SP100 SP90 SP102 SP101 SP106 SP107 SP91 SDAx In SP92 SP110 SP109 SP109 SDAx Out Note: Refer to Figure 3-2 for load conditions. DS41672A-page 18 2012 Microchip Technology Inc. MTCH810 TABLE 3-3: Param. No. I2C™ BUS DATA REQUIREMENTS Symbol Characteristic 400 kHz mode Min. Max. Units 0.6 — s Conditions SP100* THIGH Clock high time SP101* TLOW Clock low time 400 kHz mode 1.3 — s SP102* TR SDAx and SCLx rise time 400 kHz mode 20 + 0.1CB 300 ns CB is specified to be from 10-400 pF SP103* TF SDAx and SCLx fall time 400 kHz mode 20 + 0.1CB 250 ns CB is specified to be from 10-400 pF SP106* THD:DAT Data input hold time 400 kHz mode 0 0.9 s SP107* TSU:DAT Data input setup time 400 kHz mode 100 — ns SP109* TAA Output valid from clock 400 kHz mode — — ns SP110* TBUF Bus free time 400 kHz mode 1.3 — s SP111* CB Bus capacitive loading — 400 pF SP112* TTIMEOUT Maximum message 400 kHz mode time 29.5 36.0 ms * Time the bus must be free before a new transmission can start These parameters are characterized but not tested. 2012 Microchip Technology Inc. DS41672A-page 19 MTCH810 4.0 PACKAGING INFORMATION 4.1 Package Marking Information 8-Lead DFN (3x3x0.9 mm) XXXX YYWW NNN Example MFT0 1243 017 PIN 1 PIN 1 TABLE 4-1: Part Number Marking MTCH810-I/MF MFTO Legend: XX...X Y YY WW NNN e3 * Note: * 8-LEAD 3x3x0.9 DFN (MF) TOP MARKING Customer-specific information Year code (last digit of calendar year) Year code (last 2 digits of calendar year) Week code (week of January 1 is week ‘01’) Alphanumeric traceability code Pb-free JEDEC designator for Matte Tin (Sn) This package is Pb-free. The Pb-free JEDEC designator ( e3 ) can be found on the outer packaging for this package. In the event the full Microchip part number cannot be marked on one line, it will be carried over to the next line, thus limiting the number of available characters for customer-specific information. Standard PIC® device marking consists of Microchip part number, year code, week code, and traceability code. For PIC device marking beyond this, certain price adders apply. Please check with your Microchip Sales Office. For QTP devices, any special marking adders are included in QTP price. DS41672A-page 20 2012 Microchip Technology Inc. MTCH810 4.2 Package Details The following sections give the technical details of the packages. Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging 2012 Microchip Technology Inc. DS41672A-page 21 MTCH810 Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging DS41672A-page 22 2012 Microchip Technology Inc. MTCH810 Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging 2012 Microchip Technology Inc. DS41672A-page 23 MTCH810 APPENDIX A: DATA SHEET REVISION HISTORY Revision A (12/2012) Initial release. DS41672A-page 24 2012 Microchip Technology Inc. MTCH810 INDEX Symbols W I2C Hardware Interface ......................................................... 7 WWW Address ................................................................... 26 WWW, On-Line Support ....................................................... 2 A Absolute Maximum Ratings ................................................ 13 B Brown-out Reset (BOR) Specifications.............................................................. 17 Timing and Characteristics ......................................... 17 C Communications ................................................................... 3 Customer Change Notification Service ............................... 26 Customer Notification Service............................................. 26 Customer Support............................................................... 26 D DC Characteristics MTCH810.................................................................... 14 Description ............................................................................ 1 Device Overview ................................................................... 3 DR1 ....................................................................................... 3 DR2 ....................................................................................... 3 Drive Outputs ........................................................................ 3 E Electrical Specifications ...................................................... 13 Errata .................................................................................... 2 F Features ................................................................................ 1 I I2C™ Communications and Protocol .................................... 7 Internet Address.................................................................. 26 M Microchip Internet Web Site ................................................ 26 O Oscillator Start-up Timer (OST) Specifications.............................................................. 17 P Package Type ....................................................................... 1 Packaging DFN............................................................................. 21 Packaging Information ........................................................ 20 Pin Description .................................................................. 1, 3 Power-up Timer (PWRT) Specifications.............................................................. 17 PWM Resolution ................................................................... 3 R Reader Response ............................................................... 27 Revision History .................................................................. 24 T Timing Diagrams Brown-out Reset (BOR) .............................................. 17 I2C Bus Data ............................................................... 18 2012 Microchip Technology Inc. DS41672A-page 25 MTCH810 THE MICROCHIP WEB SITE CUSTOMER SUPPORT Microchip provides online support via our WWW site at www.microchip.com. This web site is used as a means to make files and information easily available to customers. Accessible by using your favorite Internet browser, the web site contains the following information: Users of Microchip products can receive assistance through several channels: • Product Support – Data sheets and errata, application notes and sample programs, design resources, user’s guides and hardware support documents, latest software releases and archived software • General Technical Support – Frequently Asked Questions (FAQ), technical support requests, online discussion groups, Microchip consultant program member listing • Business of Microchip – Product selector and ordering guides, latest Microchip press releases, listing of seminars and events, listings of Microchip sales offices, distributors and factory representatives • • • • • Distributor or Representative Local Sales Office Field Application Engineer (FAE) Technical Support Development Systems Information Line Customers should contact their distributor, representative or field application engineer (FAE) for support. Local sales offices are also available to help customers. A listing of sales offices and locations is included in the back of this document. Technical support is available through the web site at: http://microchip.com/support CUSTOMER CHANGE NOTIFICATION SERVICE Microchip’s customer notification service helps keep customers current on Microchip products. Subscribers will receive e-mail notification whenever there are changes, updates, revisions or errata related to a specified product family or development tool of interest. To register, access the Microchip web site at www.microchip.com. Under “Support”, click on “Customer Change Notification” and follow the registration instructions. DS41672A-page 26 2012 Microchip Technology Inc. MTCH810 READER RESPONSE It is our intention to provide you with the best documentation possible to ensure successful use of your Microchip product. If you wish to provide your comments on organization, clarity, subject matter, and ways in which our documentation can better serve you, please FAX your comments to the Technical Publications Manager at (480) 792-4150. Please list the following information, and use this outline to provide us with your comments about this document. TO: Technical Publications Manager RE: Reader Response Total Pages Sent ________ From: Name Company Address City / State / ZIP / Country Telephone: (_______) _________ - _________ FAX: (______) _________ - _________ Application (optional): Would you like a reply? Y N Device: MTCH810 Literature Number: DS41672A Questions: 1. What are the best features of this document? 2. How does this document meet your hardware and software development needs? 3. Do you find the organization of this document easy to follow? If not, why? 4. What additions to the document do you think would enhance the structure and subject? 5. What deletions from the document could be made without affecting the overall usefulness? 6. Is there any incorrect or misleading information (what and where)? 7. How would you improve this document? 2012 Microchip Technology Inc. DS41672A-page 27 MTCH810 PRODUCT IDENTIFICATION SYSTEM To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office. [X](1) PART NO. Device - X Tape and Reel Temperature Option Range /XX XXX Package Pattern Device: MTCH810 Tape and Reel Option: Blank T = Standard packaging (tube or tray) = Tape and Reel(1) Temperature Range: I = -40C to Package:(2) MF Pattern: QTP, SQTP, Code or Special Requirements (blank otherwise) = +85C Examples: a) MTCH810 - I/MF Industrial temperature, DFN package (Industrial) DFN Note 1: 2: DS41672A-page 28 Tape and Reel identifier only appears in the catalog part number description. This identifier is used for ordering purposes and is not printed on the device package. Check with your Microchip Sales Office for package availability with the Tape and Reel option. For other small form-factor package availability and marking information, please visit www.microchip.com/packaging or contact your local sales office. 2012 Microchip Technology Inc. Note the following details of the code protection feature on Microchip devices: • Microchip products meet the specification contained in their particular Microchip Data Sheet. • Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the intended manner and under normal conditions. • There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data Sheets. Most likely, the person doing so is engaged in theft of intellectual property. • Microchip is willing to work with the customer who is concerned about the integrity of their code. • Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not mean that we are guaranteeing the product as “unbreakable.” Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our products. Attempts to break Microchip’s code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act. Information contained in this publication regarding device applications and the like is provided only for your convenience and may be superseded by updates. It is your responsibility to ensure that your application meets with your specifications. MICROCHIP MAKES NO REPRESENTATIONS OR WARRANTIES OF ANY KIND WHETHER EXPRESS OR IMPLIED, WRITTEN OR ORAL, STATUTORY OR OTHERWISE, RELATED TO THE INFORMATION, INCLUDING BUT NOT LIMITED TO ITS CONDITION, QUALITY, PERFORMANCE, MERCHANTABILITY OR FITNESS FOR PURPOSE. Microchip disclaims all liability arising from this information and its use. Use of Microchip devices in life support and/or safety applications is entirely at the buyer’s risk, and the buyer agrees to defend, indemnify and hold harmless Microchip from any and all damages, claims, suits, or expenses resulting from such use. No licenses are conveyed, implicitly or otherwise, under any Microchip intellectual property rights. Trademarks The Microchip name and logo, the Microchip logo, dsPIC, FlashFlex, KEELOQ, KEELOQ logo, MPLAB, PIC, PICmicro, PICSTART, PIC32 logo, rfPIC, SST, SST Logo, SuperFlash and UNI/O are registered trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. FilterLab, Hampshire, HI-TECH C, Linear Active Thermistor, MTP, SEEVAL and The Embedded Control Solutions Company are registered trademarks of Microchip Technology Incorporated in the U.S.A. Silicon Storage Technology is a registered trademark of Microchip Technology Inc. in other countries. Analog-for-the-Digital Age, Application Maestro, BodyCom, chipKIT, chipKIT logo, CodeGuard, dsPICDEM, dsPICDEM.net, dsPICworks, dsSPEAK, ECAN, ECONOMONITOR, FanSense, HI-TIDE, In-Circuit Serial Programming, ICSP, Mindi, MiWi, MPASM, MPF, MPLAB Certified logo, MPLIB, MPLINK, mTouch, Omniscient Code Generation, PICC, PICC-18, PICDEM, PICDEM.net, PICkit, PICtail, REAL ICE, rfLAB, Select Mode, SQI, Serial Quad I/O, Total Endurance, TSHARC, UniWinDriver, WiperLock, ZENA and Z-Scale are trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. SQTP is a service mark of Microchip Technology Incorporated in the U.S.A. GestIC and ULPP are registered trademarks of Microchip Technology Germany II GmbH & Co. & KG, a subsidiary of Microchip Technology Inc., in other countries. All other trademarks mentioned herein are property of their respective companies. © 2012, Microchip Technology Incorporated, Printed in the U.S.A., All Rights Reserved. Printed on recycled paper. ISBN: 9781620768174 QUALITY MANAGEMENT SYSTEM CERTIFIED BY DNV == ISO/TS 16949 == 2012 Microchip Technology Inc. Microchip received ISO/TS-16949:2009 certification for its worldwide headquarters, design and wafer fabrication facilities in Chandler and Tempe, Arizona; Gresham, Oregon and design centers in California and India. The Company’s quality system processes and procedures are for its PIC® MCUs and dsPIC® DSCs, KEELOQ® code hopping devices, Serial EEPROMs, microperipherals, nonvolatile memory and analog products. In addition, Microchip’s quality system for the design and manufacture of development systems is ISO 9001:2000 certified. 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