dsPIC30F2010 Data Sheet High-Performance, 16-Bit Digital Signal Controllers © 2006 Microchip Technology Inc. DS70118G Note the following details of the code protection feature on Microchip devices: • Microchip products meet the specification contained in their particular Microchip Data Sheet. • Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the intended manner and under normal conditions. • There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data Sheets. Most likely, the person doing so is engaged in theft of intellectual property. • Microchip is willing to work with the customer who is concerned about the integrity of their code. • Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not mean that we are guaranteeing the product as “unbreakable.” Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our products. Attempts to break Microchip’s code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act. Information contained in this publication regarding device applications and the like is provided only for your convenience and may be superseded by updates. It is your responsibility to ensure that your application meets with your specifications. MICROCHIP MAKES NO REPRESENTATIONS OR WARRANTIES OF ANY KIND WHETHER EXPRESS OR IMPLIED, WRITTEN OR ORAL, STATUTORY OR OTHERWISE, RELATED TO THE INFORMATION, INCLUDING BUT NOT LIMITED TO ITS CONDITION, QUALITY, PERFORMANCE, MERCHANTABILITY OR FITNESS FOR PURPOSE. Microchip disclaims all liability arising from this information and its use. Use of Microchip devices in life support and/or safety applications is entirely at the buyer’s risk, and the buyer agrees to defend, indemnify and hold harmless Microchip from any and all damages, claims, suits, or expenses resulting from such use. No licenses are conveyed, implicitly or otherwise, under any Microchip intellectual property rights. Trademarks The Microchip name and logo, the Microchip logo, Accuron, dsPIC, KEELOQ, microID, MPLAB, PIC, PIC, PICSTART, PRO MATE, PowerSmart, rfPIC and SmartShunt are registered trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. AmpLab, FilterLab, Migratable Memory, MXDEV, MXLAB, SEEVAL, SmartSensor and The Embedded Control Solutions Company are registered trademarks of Microchip Technology Incorporated in the U.S.A. Analog-for-the-Digital Age, Application Maestro, CodeGuard, dsPICDEM, dsPICDEM.net, dsPICworks, ECAN, ECONOMONITOR, FanSense, FlexROM, fuzzyLAB, In-Circuit Serial Programming, ICSP, ICEPIC, Linear Active Thermistor, Mindi, MiWi, MPASM, MPLIB, MPLINK, PICkit, PICDEM, PICDEM.net, PICLAB, PICtail, PowerCal, PowerInfo, PowerMate, PowerTool, REAL ICE, rfLAB, rfPICDEM, Select Mode, Smart Serial, SmartTel, Total Endurance, UNI/O, WiperLock and ZENA are trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. SQTP is a service mark of Microchip Technology Incorporated in the U.S.A. All other trademarks mentioned herein are property of their respective companies. © 2006, Microchip Technology Incorporated, Printed in the U.S.A., All Rights Reserved. Printed on recycled paper. Microchip received ISO/TS-16949:2002 certification for its worldwide headquarters, design and wafer fabrication facilities in Chandler and Tempe, Arizona, Gresham, Oregon and Mountain View, California. The Company’s quality system processes and procedures are for its PICmicro® 8-bit MCUs, KEELOQ® code hopping devices, Serial EEPROMs, microperipherals, nonvolatile memory and analog products. In addition, Microchip’s quality system for the design and manufacture of development systems is ISO 9001:2000 certified. DS70118G-page ii © 2006 Microchip Technology Inc. dsPIC30F2010 28-Pin dsPIC30F2010 Enhanced Flash 16-Bit Digital Signal Controller Note: This data sheet summarizes features of this group of dsPIC30F devices and is not intended to be a complete reference source. For more information on the CPU, peripherals, register descriptions and general device functionality, refer to the “dsPIC30F Family Reference Manual” (DS70046). For more information on the device instruction set and programming, refer to the “dsPIC30F/ 33F Programmer’s Reference Manual” (DS70157). High-Performance Modified RISC CPU: • Modified Harvard architecture • C compiler optimized instruction set architecture • 83 base instructions with flexible addressing modes • 24-bit wide instructions, 16-bit wide data path • 12 Kbytes on-chip Flash program space • 512 bytes on-chip data RAM • 1 Kbyte nonvolatile data EEPROM • 16 x 16-bit working register array • Up to 30 MIPs operation: - DC to 40 MHz external clock input - 4 MHz-10 MHz oscillator input with PLL active (4x, 8x, 16x) • 27 interrupt sources • Three external interrupt sources • 8 user-selectable priority levels for each interrupt • 4 processor exceptions and software traps DSP Engine Features: • Modulo and Bit-Reversed modes • Two 40-bit wide accumulators with optional saturation logic • 17-bit x 17-bit single-cycle hardware fractional/ integer multiplier • Single-cycle Multiply-Accumulate (MAC) operation • 40-stage Barrel Shifter • Dual data fetch Peripheral Features: • High current sink/source I/O pins: 25 mA/25 mA • Three 16-bit timers/counters; optionally pair up 16-bit timers into 32-bit timer modules • Four 16-bit capture input functions • Two 16-bit compare/PWM output functions - Dual Compare mode available • 3-wire SPI modules (supports 4 Frame modes) • I2CTM module supports Multi-Master/Slave mode and 7-bit/10-bit addressing • Addressable UART modules with FIFO buffers Motor Control PWM Module Features: • 6 PWM output channels - Complementary or Independent Output modes - Edge and Center-Aligned modes • 4 duty cycle generators • Dedicated time base with 4 modes • Programmable output polarity • Dead-time control for Complementary mode • Manual output control • Trigger for synchronized A/D conversions Quadrature Encoder Interface Module Features: • • • • • • • Phase A, Phase B and Index Pulse input 16-bit up/down position counter Count direction status Position Measurement (x2 and x4) mode Programmable digital noise filters on inputs Alternate 16-bit Timer/Counter mode Interrupt on position counter rollover/underflow Analog Features: • 10-bit Analog-to-Digital Converter (ADC) with: - 1 Msps (for 10-bit A/D) conversion rate - Six input channels - Conversion available during Sleep and Idle • Programmable Brown-out Reset © 2006 Microchip Technology Inc. DS70118G-page 1 dsPIC30F2010 Special Digital Signal Controller Features: • Detects clock failure and switches to on-chip lowpower RC oscillator • Programmable code protection • In-Circuit Serial Programming™ (ICSP™) programming capability • Selectable Power Management modes - Sleep, Idle and Alternate Clock modes • Enhanced Flash program memory: - 10,000 erase/write cycle (min.) for industrial temperature range, 100K (typical) • Data EEPROM memory: - 100,000 erase/write cycle (min.) for industrial temperature range, 1M (typical) • Self-reprogrammable under software control • Power-on Reset (POR), Power-up Timer (PWRT) and Oscillator Start-up Timer (OST) • Flexible Watchdog Timer (WDT) with on-chip lowpower RC oscillator for reliable operation • Fail-Safe clock monitor operation CMOS Technology: • • • • Low-power, high-speed Flash technology Wide operating voltage range (2.5V to 5.5V) Industrial and Extended temperature ranges Low power consumption dsPIC30F Motor Control and Power Conversion Family* UART SPI I2CTM CAN Program Output Motor SRAM EEPROM Timer Input A/D 10-bit Quad Mem. Bytes/ Comp/Std Control Bytes Bytes 16-bit Cap 1 Msps Enc Instructions PWM PWM dsPIC30F2010 28 12K/4K 512 1024 3 4 2 6 ch 6 ch Yes 1 1 1 – dsPIC30F3010 28 24K/8K 1024 1024 5 4 2 6 ch 6 ch Yes 1 1 1 – dsPIC30F4012 28 48K/16K 2048 1024 5 4 2 6 ch 6 ch Yes 1 1 1 1 dsPIC30F3011 40/44 24K/8K 1024 1024 5 4 4 6 ch 9 ch Yes 2 1 1 – dsPIC30F4011 40/44 48K/16K 2048 1024 5 4 4 6 ch 9 ch Yes 2 1 1 1 dsPIC30F5015 64 66K/22K 2048 1024 5 4 4 8 ch 16 ch Yes 1 2 1 1 dsPIC30F6010 80 144K/48K 8192 4096 5 8 8 8 ch 16 ch Yes 2 2 1 2 dsPIC30F6010A 80 144K/48K 8192 4096 5 8 8 8 ch 16 ch Yes 2 2 1 2 Device Pins * This table provides a summary of the dsPIC30F2010 peripheral features. Other available devices in the dsPIC30F Motor Control and Power Conversion Family are shown for feature comparison. DS70118G-page 2 © 2006 Microchip Technology Inc. dsPIC30F2010 Pin Diagrams 28-Pin SDIP and SOIC 1 2 3 4 5 6 7 8 9 10 11 12 13 14 dsPIC30F2010 MCLR EMUD3/AN0/VREF+/CN2/RB0 EMUC3/AN1/VREF-/CN3/RB1 AN2/SS1/LVDIN/CN4/RB2 AN3/INDX/CN5/RB3 AN4/QEA/IC7/CN6/RB4 AN5/QEB/IC8/CN7/RB5 VSS OSC1/CLKI OSC2/CLKO/RC15 EMUD1/SOSCI/T2CK/U1ATX/CN1//RC13 EMUC1/SOSCO/T1CK/U1ARX/CN0/RC14 VDD EMUD2/OC2/IC2/INT2/RD1 28 27 26 25 24 23 22 21 20 19 18 17 16 15 AVDD AVSS PWM1L/RE0 PWM1H/RE1 PWM2L/RE2 PWM2H/RE3 PWM3L/RE4 PWM3H/RE5 VDD VSS PGC/EMUC/U1RX/SDI1/SDA/RF2 PGD/EMUD/U1TX/SDO1/SCL/RF3 FLTA/INT0/SCK1/OCFA/RE8 EMUC2/OC1/IC1/INT1/RD0 28 27 26 25 24 23 22 EMUC3/AN1/VREF- /CN3/RB1 EMUD3/AN0/VREF+/CN2/RB0 MCLR AVDD AVSS PWM1L/RE0 PWM1H/RE1 28-Pin QFN dsPIC30F2010 8 9 10 11 12 13 14 1 2 3 4 5 6 7 21 20 19 18 17 16 15 PWM2L/RE2 PWM2H/RE3 PWM3L/RE4 PWM3H/RE5 VDD VSS PGC/EMUC/U1RX/SDI1/SDA/RF2 EMUD1/SOSCI/T2CK/U1ATX/CN1/RC13 EMUC1/SOSCO/T1CK/U1ARX/CN0/RC14 VDD EMUD2/OC2/IC2/INT2/RD1 EMUC2/OC1/IC1/INT1/RD0 FLTA/INT0/SCK1/OCFA/RE8 PGD/EMUD/U1TX/SDO1/SCL/RF3 AN2/SS1/LVDIN/CN4/RB2 AN3/INDX/CN5 RB3 AN4/QEA/IC7/CN6/RB4 AN5/QEB/IC8/CN7/RB5 VSS OSC1/CLKI OSC2/CLKO/RC15 © 2006 Microchip Technology Inc. DS70118G-page 3 dsPIC30F2010 Table of Contents 1.0 Device Overview .......................................................................................................................................................................... 5 2.0 CPU Architecture Overview.......................................................................................................................................................... 9 3.0 Memory Organization ................................................................................................................................................................. 19 4.0 Address Generator Units ............................................................................................................................................................ 31 5.0 Interrupts .................................................................................................................................................................................... 37 6.0 Flash Program Memory .............................................................................................................................................................. 43 7.0 Data EEPROM Memory ............................................................................................................................................................. 49 8.0 I/O Ports ..................................................................................................................................................................................... 53 9.0 Timer1 Module ........................................................................................................................................................................... 57 10.0 Timer2/3 Module ........................................................................................................................................................................ 61 11.0 Input Capture Module ................................................................................................................................................................. 67 12.0 Output Compare Module ............................................................................................................................................................ 71 13.0 Quadrature Encoder Interface (QEI) Module ............................................................................................................................. 75 14.0 Motor Control PWM Module ....................................................................................................................................................... 81 15.0 SPI Module ................................................................................................................................................................................. 91 16.0 I2C Module ................................................................................................................................................................................. 95 17.0 Universal Asynchronous Receiver Transmitter (UART) Module .............................................................................................. 103 18.0 10-bit High-Speed Analog-to-Digital Converter (ADC) Module ................................................................................................ 111 19.0 System Integration ................................................................................................................................................................... 123 20.0 Instruction Set Summary .......................................................................................................................................................... 137 21.0 Development Support............................................................................................................................................................... 145 22.0 Electrical Characteristics .......................................................................................................................................................... 149 23.0 Packaging Information.............................................................................................................................................................. 187 The Microchip Web Site ..................................................................................................................................................................... 199 Customer Change Notification Service .............................................................................................................................................. 199 Customer Support .............................................................................................................................................................................. 199 Reader Response .............................................................................................................................................................................. 200 Product Identification System............................................................................................................................................................. 201 TO OUR VALUED CUSTOMERS It is our intention to provide our valued customers with the best documentation possible to ensure successful use of your Microchip products. To this end, we will continue to improve our publications to better suit your needs. Our publications will be refined and enhanced as new volumes and updates are introduced. If you have any questions or comments regarding this publication, please contact the Marketing Communications Department via E-mail at [email protected] or fax the Reader Response Form in the back of this data sheet to (480) 792-4150. We welcome your feedback. Most Current Data Sheet To obtain the most up-to-date version of this data sheet, please register at our Worldwide Web site at: http://www.microchip.com You can determine the version of a data sheet by examining its literature number found on the bottom outside corner of any page. The last character of the literature number is the version number, (e.g., DS30000A is version A of document DS30000). Errata An errata sheet, describing minor operational differences from the data sheet and recommended workarounds, may exist for current devices. As device/documentation issues become known to us, we will publish an errata sheet. The errata will specify the revision of silicon and revision of document to which it applies. To determine if an errata sheet exists for a particular device, please check with one of the following: • Microchip’s Worldwide Web site; http://www.microchip.com • Your local Microchip sales office (see last page) When contacting a sales office, please specify which device, revision of silicon and data sheet (include literature number) you are using. Customer Notification System Register on our web site at www.microchip.com to receive the most current information on all of our products. DS70118G-page 4 © 2006 Microchip Technology Inc. dsPIC30F2010 1.0 DEVICE OVERVIEW Note: This data sheet summarizes features of this group of dsPIC30F devices and is not intended to be a complete reference source. For more information on the CPU, peripherals, register descriptions and general device functionality, refer to the “dsPIC30F Family Reference Manual” (DS70046). For more information on the device instruction set and programming, refer to the “dsPIC30F/ 33F Programmer’s Reference Manual” (DS70157). © 2006 Microchip Technology Inc. This document contains device specific information for the dsPIC30F2010 device. The dsPIC30F devices contain extensive Digital Signal Processor (DSP) functionality within a high-performance 16-bit microcontroller (MCU) architecture. Figure 1-1 shows a device block diagram for the dsPIC30F2010 device. DS70118G-page 5 dsPIC30F2010 FIGURE 1-1: dsPIC30F2010 BLOCK DIAGRAM Y Data Bus X Data Bus 16 Interrupt Controller PSV & Table Data Access 24 Control Block 8 16 16 Data Latch Y Data RAM (256 bytes) Address Latch 16 24 Address Latch Data EEPROM (1 Kbyte) 16 X RAGU X WAGU Y AGU PCU PCH PCL Program Counter Loop Stack Control Control Logic Logic 16 Data Latch X Data RAM (256 bytes) Address Latch 16 16 24 Program Memory (12 Kbytes) 16 EMUD3/AN0/VREF+/CN2/RB0 EMUC3/AN1/VREF-/CN3/RB1 AN2/SS1/LVDIN/CN4/RB2 AN3/INDX/CN5/RB3 AN4/QEA/IC7/CN6/RB4 AN5/QEB/IC8/CN7/RB5 PORTB Effective Address 16 Data Latch ROM Latch 16 24 IR 16 x 16 W Reg Array Decode Instruction Decode & Control Power-up Timer DSP Engine Divide Unit EMUC2/OC1/IC1/INT1/RD0 EMUD2/OC2/IC2/INT2/RD1 Oscillator Start-up Timer Timing Generation ALU<16> POR/BOR Reset Watchdog Timer MCLR SPI1 PORTC 16 16 Control Signals to Various Blocks OSC1/CLKI EMUD1/SOSCI/T2CK/U1ATX/CN1/RC13 EMUC1/SOSCO/T1CK/U1ARX/CN0/RC14 OSC2/CLKO/RC15 16 16 16 PORTD 16 10-bit ADC Input Capture Module Output Compare Module I2C™ Timers QEI Motor Control PWM UART1 PWM1L/RE0 PWM1H/RE1 PWM2L/RE2 PWM2H/RE3 PWM3L/RE4 PWM3H/RE5 FLTA/INT0/SCK1/OCFA/RE8 PORTE PGC/EMUC/U1RX/SDI1/SDA/RF2 PGD/EMUD/U1TX/SDO1/SCL/RF3 PORTF DS70118G-page 6 © 2006 Microchip Technology Inc. dsPIC30F2010 Table 1-1 provides a brief description of device I/O pinouts and the functions that may be multiplexed to a port pin. Multiple functions may exist on one port pin. When multiplexing occurs, the peripheral module’s functional requirements may force an override of the data direction of the port pin. TABLE 1-1: PINOUT I/O DESCRIPTIONS Pin Type Buffer Type AN0-AN5 I Analog Pin Name Description Analog input channels. AVDD P P Positive supply for analog module. AVSS P P Ground reference for analog module. CLKI CLKO I O CN0-CN7 I ST Input change notification inputs. Can be software programmed for internal weak pull-ups on all inputs. I/O I/O I/O I/O I/O I/O I/O I/O ST ST ST ST ST ST ST ST ICD Primary Communication Channel data input/output pin. ICD Primary Communication Channel clock input/output pin. ICD Secondary Communication Channel data input/output pin. ICD Secondary Communication Channel clock input/output pin. ICD Tertiary Communication Channel data input/output pin. ICD Tertiary Communication Channel clock input/output pin. ICD Quaternary Communication Channel data input/output pin. ICD Quaternary Communication Channel clock input/output pin. IC1, IC2, IC7, IC8 I ST Capture inputs. The dsPIC30F2010 has 4 capture inputs. The inputs are numbered for consistency with the inputs on larger device variants. INDX QEA I I ST ST QEB I ST Quadrature Encoder Index Pulse input. Quadrature Encoder Phase A input in QEI mode. Auxiliary Timer External Clock/Gate input in Timer mode. Quadrature Encoder Phase A input in QEI mode. Auxiliary Timer External Clock/Gate input in Timer mode. INT0 INT1 INT2 I I I ST ST ST External interrupt 0 External interrupt 1 External interrupt 2 FLTA PWM1L PWM1H PWM2L PWM2H PWM3L PWM3H I O O O O O O ST — — — — — — PWM Fault A input PWM 1 Low output PWM 1 High output PWM 2 Low output PWM 2 High output PWM 3 Low output PWM 3 High output MCLR I/P ST Master Clear (Reset) input or programming voltage input. This pin is an activelow Reset to the device. OCFA OC1-OC2 I O ST — Compare Fault A input (for Compare channels 1, 2, 3 and 4). Compare outputs. OSC1 I OSC2 I/O EMUD EMUC EMUD1 EMUC1 EMUD2 EMUC2 EMUD3 EMUC3 ST/CMOS External clock source input. Always associated with OSC1 pin function. — Oscillator crystal output. Connects to crystal or resonator in Crystal Oscillator mode. Optionally functions as CLKO in RC and EC modes. Always associated with OSC2 pin function. ST/CMOS Oscillator crystal input. ST buffer when configured in RC mode; CMOS otherwise. — Oscillator crystal output. Connects to crystal or resonator in Crystal Oscillator mode. Optionally functions as CLKO in RC and EC modes. Legend: CMOS = CMOS compatible input or output ST = Schmitt Trigger input with CMOS levels I = Input © 2006 Microchip Technology Inc. Analog = Analog input O = Output P = Power DS70118G-page 7 dsPIC30F2010 TABLE 1-1: PINOUT I/O DESCRIPTIONS (CONTINUED) Pin Type Buffer Type PGD PGC I/O I ST ST In-Circuit Serial Programming™ data input/output pin. In-Circuit Serial Programming clock input pin. RB0-RB5 I/O ST PORTB is a bidirectional I/O port. Pin Name Description RC13-RC14 I/O ST PORTC is a bidirectional I/O port. RD0-RD1 I/O ST PORTD is a bidirectional I/O port. RE0-RE5, RE8 I/O ST PORTE is a bidirectional I/O port. RF2, RF3 I/O ST PORTF is a bidirectional I/O port. SCK1 SDI1 SDO1 SS1 I/O I O I ST ST — ST Synchronous serial clock input/output for SPI #1. SPI #1 Data In. SPI #1 Data Out. SPI #1 Slave Synchronization. SCL SDA I/O I/O ST ST Synchronous serial clock input/output for I2C™. Synchronous serial data input/output for I2C. SOSCO SOSCI O I T1CK T2CK I I ST ST Timer1 external clock input. Timer2 external clock input. U1RX U1TX U1ARX U1ATX I O I O ST — ST — UART1 Receive. UART1 Transmit. UART1 Alternate Receive. UART1 Alternate Transmit. VDD P — Positive supply for logic and I/O pins. VSS P — Ground reference for logic and I/O pins. VREF+ I Analog Analog Voltage Reference (High) input. VREF- I Analog Analog Voltage Reference (Low) input. — 32 kHz low-power oscillator crystal output. ST/CMOS 32 kHz low-power oscillator crystal input. ST buffer when configured in RC mode; CMOS otherwise. Legend: CMOS = CMOS compatible input or output ST = Schmitt Trigger input with CMOS levels I = Input DS70118G-page 8 Analog = Analog input O = Output P = Power © 2006 Microchip Technology Inc. dsPIC30F2010 2.0 CPU ARCHITECTURE OVERVIEW Note: This data sheet summarizes features of this group of dsPIC30F devices and is not intended to be a complete reference source. For more information on the CPU, peripherals, register descriptions and general device functionality, refer to the “dsPIC30F Family Reference Manual” (DS70046). For more information on the device instruction set and programming, refer to the “dsPIC30F/ 33F Programmer’s Reference Manual” (DS70157). This document provides a summary of the dsPIC30F2010 CPU and peripheral function. For a complete description of this functionality, please refer to the “dsPIC30F Family Reference Manual” (DS70046). 2.1 Core Overview The core has a 24-bit instruction word. The Program Counter (PC) is 23 bits wide with the Least Significant bit (LSb) always clear (see Section 3.1 “Program Address Space”), and the Most Significant bit (MSb) is ignored during normal program execution, except for certain specialized instructions. Thus, the PC can address up to 4M instruction words of user program space. An instruction prefetch mechanism is used to help maintain throughput. Program loop constructs, free from loop count management overhead, are supported using the DO and REPEAT instructions, both of which are interruptible at any point. The working register array consists of 16x16-bit registers, each of which can act as data, address or offset registers. One working register (W15) operates as a software Stack Pointer for interrupts and calls. The data space is 64 Kbytes (32K words) and is split into two blocks, referred to as X and Y data memory. Each block has its own independent Address Generation Unit (AGU). Most instructions operate solely through the X memory AGU, which provides the appearance of a single unified data space. The Multiply-Accumulate (MAC) class of dual source DSP instructions operate through both the X and Y AGUs, splitting the data address space into two parts (see Section 3.2 “Data Address Space”). The X and Y data space boundary is device specific and cannot be altered by the user. Each data word consists of 2 bytes, and most instructions can address data either as words or bytes. There are two methods of accessing data stored in program memory: • The upper 32 Kbytes of data space memory can be mapped into the lower half (user space) of program space at any 16K program word boundary, defined by the 8-bit Program Space Visibility Page (PSVPAG) register. This lets any instruction access program space as if it were data space, with a limitation that the access requires an additional cycle. Moreover, only the lower 16 bits of each instruction word can be accessed using this method. © 2006 Microchip Technology Inc. • Linear indirect access of 32K word pages within program space is also possible using any working register, via table read and write instructions. Table read and write instructions can be used to access all 24 bits of an instruction word. Overhead-free circular buffers (Modulo Addressing) are supported in both X and Y address spaces. This is primarily intended to remove the loop overhead for DSP algorithms. The X AGU also supports Bit-Reversed Addressing on destination effective addresses, to greatly simplify input or output data reordering for radix-2 FFT algorithms. Refer to Section 4.0 “Address Generator Units” for details on Modulo and Bit-Reversed Addressing. The core supports Inherent (no operand), Relative, Literal, Memory Direct, Register Direct, Register Indirect, Register Offset and Literal Offset Addressing modes. Instructions are associated with predefined Addressing modes, depending upon their functional requirements. For most instructions, the core is capable of executing a data (or program data) memory read, a working register (data) read, a data memory write and a program (instruction) memory read per instruction cycle. As a result, 3-operand instructions are supported, allowing C = A + B operations to be executed in a single cycle. A DSP engine has been included to significantly enhance the core arithmetic capability and throughput. It features a high-speed 17-bit by 17-bit multiplier, a 40-bit ALU, two 40-bit saturating accumulators and a 40-bit bidirectional barrel shifter. Data in the accumulator or any working register can be shifted up to 15 bits right or 16 bits left in a single cycle. The DSP instructions operate seamlessly with all other instructions and have been designed for optimal real-time performance. The MAC class of instructions can concurrently fetch two data operands from memory, while multiplying two W registers. To enable this concurrent fetching of data operands, the data space has been split for these instructions and linear for all others. This has been achieved in a transparent and flexible manner, by dedicating certain working registers to each address space for the MAC class of instructions. The core does not support a multi-stage instruction pipeline. However, a single stage instruction prefetch mechanism is used, which accesses and partially decodes instructions a cycle ahead of execution, in order to maximize available execution time. Most instructions execute in a single cycle, with certain exceptions. The core features a vectored exception processing structure for traps and interrupts, with 62 independent vectors. The exceptions consist of up to 8 traps (of which 4 are reserved) and 54 interrupts. Each interrupt is prioritized based on a user-assigned priority between 1 and 7 (1 being the lowest priority and 7 being the highest) in conjunction with a predetermined ‘natural order’. Traps have fixed priorities, ranging from 8 to 15. DS70118G-page 9 dsPIC30F2010 2.2 Programmer’s Model The programmer’s model is shown in Figure 2-1 and consists of 16x16-bit working registers (W0 through W15), 2x40-bit accumulators (ACCA and ACCB), STATUS Register (SR), Data Table Page register (TBLPAG), Program Space Visibility Page register (PSVPAG), DO and REPEAT registers (DOSTART, DOEND, DCOUNT and RCOUNT) and Program Counter (PC). The working registers can act as data, address or offset registers. All registers are memory mapped. W0 acts as the W register for file register addressing. Some of these registers have a shadow register associated with each of them, as shown in Figure 2-1. The shadow register is used as a temporary holding register and can transfer its contents to or from its host register upon the occurrence of an event. None of the shadow registers are accessible directly. The following rules apply for transfer of registers into and out of shadows. • PUSH.S and POP.S W0, W1, W2, W3, SR (DC, N, OV, Z and C bits only) are transferred. • DO instruction DOSTART, DOEND, DCOUNT shadows are pushed on loop start, and popped on loop end. When a byte operation is performed on a working register, only the Least Significant Byte of the target register is affected. However, a benefit of memory mapped working registers is that both the Least and Most Significant Bytes can be manipulated through byte wide data memory space accesses. 2.2.1 SOFTWARE STACK POINTER/ FRAME POINTER The dsPIC® DSC devices contain a software stack. W15 is the dedicated software Stack Pointer (SP), and will be automatically modified by exception processing and subroutine calls and returns. However, W15 can be referenced by any instruction in the same manner as all other W registers. This simplifies the reading, writing and manipulation of the Stack Pointer (e.g., creating stack frames). Note: In order to protect against misaligned stack accesses, W15<0> is always clear. W15 is initialized to 0x0800 during a Reset. The user may reprogram the SP during initialization to any location within data space. W14 has been dedicated as a Stack Frame Pointer as defined by the LNK and ULNK instructions. However, W14 can be referenced by any instruction in the same manner as all other W registers. 2.2.2 STATUS REGISTER The dsPIC DSC core has a 16-bit STATUS Register (SR), the LSB of which is referred to as the SR Low Byte (SRL) and the MSB as the SR High Byte (SRH). See Figure 2-1 for SR layout. SRL contains all the MCU ALU operation status flags (including the Z bit), as well as the CPU Interrupt Priority Level status bits, IPL<2:0>, and the REPEAT active status bit, RA. During exception processing, SRL is concatenated with the MSB of the PC to form a complete word value which is then stacked. The upper byte of the STATUS register contains the DSP adder/subtracter status bits, the DO Loop Active bit (DA) and the Digit Carry (DC) status bit. 2.2.3 PROGRAM COUNTER The Program Counter is 23 bits wide. Bit 0 is always clear. Therefore, the PC can address up to 4M instruction words. DS70118G-page 10 © 2006 Microchip Technology Inc. dsPIC30F2010 FIGURE 2-1: PROGRAMMER’S MODEL D15 D0 W0/WREG PUSH.S Shadow W1 DO Shadow W2 W3 Legend W4 DSP Operand Registers W5 W6 W7 Working Registers W8 W9 DSP Address Registers W10 W11 W12/DSP Offset W13/DSP Write-Back W14/Frame Pointer W15/Stack Pointer SPLIM AD39 Stack Pointer Limit Register AD15 AD31 AD0 ACCA DSP Accumulators ACCB PC22 PC0 Program Counter 0 0 7 TABPAG TBLPAG 7 Data Table Page Address 0 PSVPAG Program Space Visibility Page Address 15 0 RCOUNT REPEAT Loop Counter 15 0 DCOUNT DO Loop Counter 22 0 DOSTART DO Loop Start Address DOEND DO Loop End Address 22 15 0 Core Configuration Register CORCON OA OB SA SB OAB SAB DA SRH © 2006 Microchip Technology Inc. DC IPL2 IPL1 IPL0 RA N OV Z C STATUS Register SRL DS70118G-page 11 dsPIC30F2010 2.3 Divide Support The dsPIC DSC devices feature a 16/16-bit signed fractional divide operation, as well as 32/16-bit and 16/ 16-bit signed and unsigned integer divide operations, in the form of single instruction iterative divides. The following instructions and data sizes are supported: 1. 2. 3. 4. 5. DIVF – 16/16 signed fractional divide DIV.sd – 32/16 signed divide DIV.ud – 32/16 unsigned divide DIV.sw – 16/16 signed divide DIV.uw – 16/16 unsigned divide The 16/16 divides are similar to the 32/16 (same number of iterations), but the dividend is either zero-extended or sign-extended during the first iteration. TABLE 2-1: The divide instructions must be executed within a REPEAT loop. Any other form of execution (e.g. a series of discrete divide instructions) will not function correctly because the instruction flow depends on RCOUNT. The divide instruction does not automatically set up the RCOUNT value, and it must, therefore, be explicitly and correctly specified in the REPEAT instruction, as shown in Table 2-1 (REPEAT will execute the target instruction {operand value + 1} times). The REPEAT loop count must be set up for 18 iterations of the DIV/ DIVF instruction. Thus, a complete divide operation requires 19 cycles. Note: The Divide flow is interruptible. However, the user needs to save the context as appropriate. DIVIDE INSTRUCTIONS Instruction Function DIVF Signed fractional divide: Wm/Wn → W0; Rem → W1 DIV.sd Signed divide: (Wm + 1:Wm)/Wn → W0; Rem → W1 DIV.ud Unsigned divide: (Wm + 1:Wm)/Wn → W0; Rem → W1 DIV.sw (or DIV.s) Signed divide: Wm/Wn → W0; Rem → W1 DIV.uw (or DIV.u) Unsigned divide: Wm/Wn → W0; Rem → W1 DS70118G-page 12 © 2006 Microchip Technology Inc. dsPIC30F2010 2.4 DSP Engine The DSP engine consists of a high-speed 17-bit x 17-bit multiplier, a barrel shifter, and a 40-bit adder/subtracter (with two target accumulators, round and saturation logic). The DSP engine also has the capability to perform inherent accumulator-to-accumulator operations, which require no additional data. These instructions are ADD, SUB and NEG. The DSP engine has various options selected through various bits in the CPU Core Configuration Register (CORCON), as listed below: 1. 2. 3. 4. 5. 6. Fractional or integer DSP multiply (IF). Signed or unsigned DSP multiply (US). Conventional or convergent rounding (RND). Automatic saturation on/off for ACCA (SATA). Automatic saturation on/off for ACCB (SATB). Automatic saturation on/off for writes to data memory (SATDW). Accumulator Saturation mode selection (ACCSAT). 7. Note: For CORCON layout, see Table 3-3. A block diagram of the DSP engine is shown in Figure 2-2. TABLE 2-2: DSP INSTRUCTION SUMMARY Instruction Algebraic Operation CLR A=0 ED A = (x – y)2 ACC WB? Yes No y)2 EDAC A = A + (x – MAC A = A + (x * y) MAC A = A + x2 No MOVSAC No change in A Yes MPY A=x*y No MPY.N A=–x*y No MSC A=A–x*y Yes © 2006 Microchip Technology Inc. No Yes DS70118G-page 13 dsPIC30F2010 FIGURE 2-2: DSP ENGINE BLOCK DIAGRAM 40 S a 40 Round t 16 u Logic r a t e 40-bit Accumulator A 40-bit Accumulator B Carry/Borrow Out Carry/Borrow In Saturate Adder Negate 40 40 40 16 X Data Bus Barrel Shifter 40 Y Data Bus Sign-Extend 32 16 Zero Backfill 32 33 17-bit Multiplier/Scaler 16 16 To/From W Array DS70118G-page 14 © 2006 Microchip Technology Inc. dsPIC30F2010 2.4.1 MULTIPLIER The 17x17-bit multiplier is capable of signed or unsigned operation and can multiplex its output using a scaler to support either 1.31 fractional (Q31) or 32-bit integer results. Unsigned operands are zero-extended into the 17th bit of the multiplier input value. Signed operands are sign-extended into the 17th bit of the multiplier input value. The output of the 17x17-bit multiplier/ scaler is a 33-bit value, which is sign-extended to 40 bits. Integer data is inherently represented as a signed two’s complement value, where the MSB is defined as a sign bit. Generally speaking, the range of an N-bit two’s complement integer is -2N-1 to 2N-1 – 1. For a 16bit integer, the data range is -32768 (0x8000) to 32767 (0x7FFF), including 0. For a 32-bit integer, the data range is -2,147,483,648 (0x8000 0000) to 2,147,483,645 (0x7FFF FFFF). When the multiplier is configured for fractional multiplication, the data is represented as a two’s complement fraction, where the MSB is defined as a sign bit and the radix point is implied to lie just after the sign bit (QX format). The range of an N-bit two’s complement fraction with this implied radix point is -1.0 to (1-21-N). For a 16-bit fraction, the Q15 data range is -1.0 (0x8000) to 0.999969482 (0x7FFF), including ‘0’ and has a precision of 3.01518x10-5. In Fractional mode, a 16x16 multiply operation generates a 1.31 product, which has a precision of 4.65661x10-10. The same multiplier is used to support the MCU multiply instructions, which include integer 16-bit signed, unsigned and mixed sign multiplies. 2.4.2.1 The adder/subtracter is a 40-bit adder with an optional zero input into one side and either true or complement data into the other input. In the case of addition, the carry/borrow input is active high and the other input is true data (not complemented), whereas in the case of subtraction, the carry/borrow input is active low and the other input is complemented. The adder/subtracter generates overflow status bits SA/SB and OA/OB, which are latched and reflected in the STATUS Register. • Overflow from bit 39: this is a catastrophic overflow in which the sign of the accumulator is destroyed. • Overflow into guard bits 32 through 39: this is a recoverable overflow. This bit is set whenever all the guard bits are not identical to each other. The adder has an additional saturation block which controls accumulator data saturation, if selected. It uses the result of the adder, the overflow status bits described above, and the SATA/B (CORCON<7:6>) and ACCSAT (CORCON<4>) mode control bits to determine when and to what value to saturate. Six STATUS register bits have been provided to support saturation and overflow; they are: 1. 2. The MUL instruction may be directed to use byte or word-sized operands. Byte operands will direct a 16-bit result, and word operands will direct a 32-bit result to the specified register(s) in the W array. 3. 2.4.2 4. DATA ACCUMULATORS AND ADDER/SUBTRACTER The data accumulator consists of a 40-bit adder/subtracter with automatic sign extension logic. It can select one of two accumulators (A or B) as its preaccumulation source and post-accumulation destination. For the ADD and LAC instructions, the data to be accumulated or loaded can be optionally scaled via the barrel shifter, prior to accumulation. Adder/Subtracter, Overflow and Saturation 5. 6. OA: ACCA overflowed into guard bits OB: ACCB overflowed into guard bits SA: ACCA saturated (bit 31 overflow and saturation) or ACCA overflowed into guard bits and saturated (bit 39 overflow and saturation) SB: ACCB saturated (bit 31 overflow and saturation) or ACCB overflowed into guard bits and saturated (bit 39 overflow and saturation) OAB: Logical OR of OA and OB SAB: Logical OR of SA and SB The OA and OB bits are modified each time data passes through the adder/subtracter. When set, they indicate that the most recent operation has overflowed into the accumulator guard bits (bits 32 through 39). The OA and OB bits can also optionally generate an arithmetic warning trap when set and the corresponding overflow trap flag enable bit (OVATE, OVBTE) in the INTCON1 register (refer to Section 5.0 “Interrupts”) is set. This allows the user to take immediate action, for example, to correct system gain. © 2006 Microchip Technology Inc. DS70118G-page 15 dsPIC30F2010 The SA and SB bits are modified each time data passes through the adder/subtracter, but can only be cleared by the user. When set, they indicate that the accumulator has overflowed its maximum range (bit 31 for 32-bit saturation, or bit 39 for 40-bit saturation) and will be saturated (if saturation is enabled). When saturation is not enabled, SA and SB default to bit 39 overflow and thus indicate that a catastrophic overflow has occurred. If the COVTE bit in the INTCON1 register is set, SA and SB bits will generate an arithmetic warning trap when saturation is disabled. The overflow and saturation status bits can optionally be viewed in the Status Register (SR) as the logical OR of OA and OB (in bit OAB), and the logical OR of SA and SB (in bit SAB). This allows programmers to check one bit in the STATUS register to determine if either accumulator has overflowed, or one bit to determine if either accumulator has saturated. This would be useful for complex number arithmetic which typically uses both the accumulators. The device supports three Saturation and Overflow modes. 1. 2. 3. Bit 39 Overflow and Saturation: When bit 39 overflow and saturation occurs, the saturation logic loads the maximally positive 9.31 (0x7FFFFFFFFF) or maximally negative 9.31 value (0x8000000000) into the target accumulator. The SA or SB bit is set and remains set until cleared by the user. This is referred to as ‘super saturation’ and provides protection against erroneous data or unexpected algorithm problems (e.g., gain calculations). Bit 31 Overflow and Saturation: When bit 31 overflow and saturation occurs, the saturation logic then loads the maximally positive 1.31 value (0x007FFFFFFF) or maximally negative 1.31 value (0x0080000000) into the target accumulator. The SA or SB bit is set and remains set until cleared by the user. When this Saturation mode is in effect, the guard bits are not used (so the OA, OB or OAB bits are never set). Bit 39 Catastrophic Overflow The bit 39 overflow status bit from the adder is used to set the SA or SB bit, which remain set until cleared by the user. No saturation operation is performed and the accumulator is allowed to overflow (destroying its sign). If the COVTE bit in the INTCON1 register is set, a catastrophic overflow can initiate a trap exception. DS70118G-page 16 2.4.2.2 Accumulator ‘Write-Back’ The MAC class of instructions (with the exception of MPY, MPY.N, ED and EDAC) can optionally write a rounded version of the high word (bits 31 through 16) of the accumulator that is not targeted by the instruction into data space memory. The write is performed across the X bus into combined X and Y address space. The following addressing modes are supported: 1. 2. W13, Register Direct: The rounded contents of the non-target accumulator are written into W13 as a 1.15 fraction. [W13]+=2, Register Indirect with Post-Increment: The rounded contents of the non-target accumulator are written into the address pointed to by W13 as a 1.15 fraction. W13 is then incremented by 2 (for a word write). 2.4.2.3 Round Logic The round logic is a combinational block, which performs a conventional (biased) or convergent (unbiased) round function during an accumulator write (store). The Round mode is determined by the state of the RND bit in the CORCON register. It generates a 16-bit, 1.15 data value which is passed to the data space write saturation logic. If rounding is not indicated by the instruction, a truncated 1.15 data value is stored and the least significant word (lsw) is simply discarded. Conventional rounding takes bit 15 of the accumulator, zero-extends it and adds it to the ACCxH word (bits 16 through 31 of the accumulator). If the ACCxL word (bits 0 through 15 of the accumulator) is between 0x8000 and 0xFFFF (0x8000 included), ACCxH is incremented. If ACCxL is between 0x0000 and 0x7FFF, ACCxH is left unchanged. A consequence of this algorithm is that over a succession of random rounding operations, the value will tend to be biased slightly positive. Convergent (or unbiased) rounding operates in the same manner as conventional rounding, except when ACCxL equals 0x8000. If this is the case, the Least Significant bit (bit 16 of the accumulator) of ACCxH is examined. If it is ‘1’, ACCxH is incremented. If it is ‘0’, ACCxH is not modified. Assuming that bit 16 is effectively random in nature, this scheme will remove any rounding bias that may accumulate. The SAC and SAC.R instructions store either a truncated (SAC) or rounded (SAC.R) version of the contents of the target accumulator to data memory, via the X bus (subject to data saturation, see Section 2.4.2.4 “Data Space Write Saturation”). Note that for the MAC class of instructions, the accumulator write-back operation will function in the same manner, addressing combined MCU (X and Y) data space though the X bus. For this class of instructions, the data is always subject to rounding. © 2006 Microchip Technology Inc. dsPIC30F2010 2.4.2.4 Data Space Write Saturation In addition to adder/subtracter saturation, writes to data space may also be saturated, but without affecting the contents of the source accumulator. The data space write saturation logic block accepts a 16-bit, 1.15 fractional value from the round logic block as its input, together with overflow status from the original source (accumulator) and the 16-bit round adder. These are combined and used to select the appropriate 1.15 fractional value as output to write to data space memory. If the SATDW bit in the CORCON register is set, data (after rounding or truncation) is tested for overflow and adjusted accordingly. For input data greater than 0x007FFF, data written to memory is forced to the maximum positive 1.15 value, 0x7FFF. For input data less than 0xFF8000, data written to memory is forced to the maximum negative 1.15 value, 0x8000. The Most Significant bit of the source (bit 39) is used to determine the sign of the operand being tested. 2.4.3 BARREL SHIFTER The barrel shifter is capable of performing up to 15-bit arithmetic or logic right shifts, or up to 16-bit left shifts in a single cycle. The source can be either of the two DSP accumulators or the X bus (to support multi-bit shifts of register or memory data). The shifter requires a signed binary value to determine both the magnitude (number of bits) and direction of the shift operation. A positive value will shift the operand right. A negative value will shift the operand left. A value of 0 will not modify the operand. The barrel shifter is 40 bits wide, thereby obtaining a 40-bit result for DSP shift operations and a 16-bit result for MCU shift operations. Data from the X bus is presented to the barrel shifter between bit positions 16 to 31 for right shifts, and bit positions 0 to 15 for left shifts. If the SATDW bit in the CORCON register is not set, the input data is always passed through unmodified under all conditions. © 2006 Microchip Technology Inc. DS70118G-page 17 dsPIC30F2010 NOTES: DS70118G-page 18 © 2006 Microchip Technology Inc. dsPIC30F2010 3.0 MEMORY ORGANIZATION FIGURE 3-1: Note: This data sheet summarizes features of this group of dsPIC30F devices and is not intended to be a complete reference source. For more information on the CPU, peripherals, register descriptions and general device functionality, refer to the “dsPIC30F Family Reference Manual” (DS70046). For more information on the device instruction set and programming, refer to the “dsPIC30F/33F Programmer’s Reference Manual” (DS70157). Reset - GOTO Instruction Reset - Target Address Reserved Ext. Osc. Fail Trap Address Error Trap Stack Error Trap Arithmetic Warn. Trap Reserved Reserved Reserved Vector 0 Vector 1 The program address space is 4M instruction words. It is addressable by a 24-bit value from either the 23-bit PC, table instruction Effective Address (EA), or data space EA, when program space is mapped into data space, as defined by Table 3-1. Note that the program space address is incremented by two between successive program words, in order to provide compatibility with data space addressing. Vector 52 Vector 53 Alternate Vector Table Vector Tables 000014 00007E 000080 0000FE 000100 User Flash Program Memory (4K instructions) Reserved (Read 0’s) User program space access is restricted to the lower 4M instruction word address range (0x000000 to 0x7FFFFE), for all accesses other than TBLRD/TBLWT, which use TBLPAG<7> to determine user or configuration space access. In Table 3-1, Read/Write instructions, bit 23 allows access to the Device ID, the User ID and the Configuration bits. Otherwise, bit 23 is always clear. Data EEPROM (1 Kbyte) 001FFE 002000 7FFBFE 7FFC00 7FFFFE 800000 The address map shown in Figure 3-1 is conceptual, and the actual memory configuration may vary across individual devices depending on available memory. Reserved Configuration Memory Space Note: 000000 000002 000004 Program Address Space User Memory Space 3.1 PROGRAM SPACE MEMORY MAP FOR dsPIC30F2010 UNITID (32 instr.) 8005BE 8005C0 8005FE 800600 Reserved Device Configuration Registers F7FFFE F80000 F8000E F80010 Reserved DEVID (2) © 2006 Microchip Technology Inc. FEFFFE FF0000 FFFFFE DS70118G-page 19 dsPIC30F2010 TABLE 3-1: PROGRAM SPACE ADDRESS CONSTRUCTION Access Space Access Type Instruction Access TBLRD/TBLWT TBLRD/TBLWT Program Space Visibility FIGURE 3-2: User User (TBLPAG<7> = 0) Configuration (TBLPAG<7> = 1) User <23> Program Space Address <22:16> <15> <14:1> <0> 0 PC<22:1> 0 TBLPAG<7:0> Data EA <15:0> TBLPAG<7:0> Data EA <15:0> 0 PSVPAG<7:0> Data EA <14:0> DATA ACCESS FROM PROGRAM SPACE ADDRESS GENERATION 23 bits Using Program Counter Program Counter 0 Select Using Program Space Visibility 0 1 0 EA PSVPAG Reg 8 bits 15 bits EA Using Table Instruction 1/0 TBLPAG Reg 8 bits User/ Configuration Space Select 16 bits 24-bit EA Byte Select Note: Program Space Visibility cannot be used to access bits <23:16> of a word in program memory. DS70118G-page 20 © 2006 Microchip Technology Inc. dsPIC30F2010 3.1.1 DATA ACCESS FROM PROGRAM MEMORY USING TABLE INSTRUCTIONS A set of Table Instructions are provided to move byte or word-sized data to and from program space. 1. This architecture fetches 24-bit wide program memory. Consequently, instructions are always aligned. However, as the architecture is modified Harvard, data can also be present in program space. There are two methods by which program space can be accessed: via special table instructions, or through the remapping of a 16K word program space page into the upper half of data space (see Section 3.1.2 “Data Access from Program Memory Using Program Space Visibility”). The TBLRDL and TBLWTL instructions offer a direct method of reading or writing the lsw of any address within program space, without going through data space. The TBLRDH and TBLWTH instructions are the only method whereby the upper 8 bits of a program space word can be accessed as data. 2. 3. The PC is incremented by two for each successive 24-bit program word. This allows program memory addresses to directly map to data space addresses. Program memory can thus be regarded as two 16-bit word wide address spaces, residing side by side, each with the same address range. TBLRDL and TBLWTL access the space which contains the least significant data word, and TBLRDH and TBLWTH access the space which contains the Most Significant data Byte. 4. Figure 3-2 shows how the EA is created for table operations and data space accesses (PSV = 1). Here, P<23:0> refers to a program space word, whereas D<15:0> refers to a data space word. FIGURE 3-3: TBLRDL: Table Read Low Word: Read the least significant word of the program address; P<15:0> maps to D<15:0>. Byte: Read one of the LSBs of the program address; P<7:0> maps to the destination byte when byte select = 0; P<15:8> maps to the destination byte when byte select = 1. TBLWTL: Table Write Low (refer to Section 6.0 “Flash Program Memory” for details on Flash Programming). TBLRDH: Table Read High Word: Read the most significant word of the program address; P<23:16> maps to D<7:0>; D<15:8> always be = 0. Byte: Read one of the MSBs of the program address; P<23:16> maps to the destination byte when byte select = 0; The destination byte will always be = 0 when byte select = 1. TBLWTH: Table Write High (refer to Section 6.0 “Flash Program Memory” for details on Flash Programming). PROGRAM DATA TABLE ACCESS (LEAST SIGNIFICANT WORD) PC Address 0x000000 0x000002 0x000004 0x000006 Program Memory ‘Phantom’ Byte (Read as ‘0’). © 2006 Microchip Technology Inc. 23 16 8 0 00000000 00000000 00000000 00000000 TBLRDL.W TBLRDL.B (Wn<0> = 0) TBLRDL.B (Wn<0> = 1) DS70118G-page 21 dsPIC30F2010 FIGURE 3-4: PROGRAM DATA TABLE ACCESS (MOST SIGNIFICANT BYTE) TBLRDH.W PC Address 0x000000 0x000002 0x000004 0x000006 23 16 8 0 00000000 00000000 00000000 00000000 TBLRDH.B (Wn<0> = 0) Program Memory ‘Phantom’ Byte (Read as ‘0’) 3.1.2 TBLRDH.B (Wn<0> = 1) DATA ACCESS FROM PROGRAM MEMORY USING PROGRAM SPACE VISIBILITY The upper 32 Kbytes of data space may optionally be mapped into any 16K word program space page. This provides transparent access of stored constant data from X data space, without the need to use special instructions (i.e., TBLRDL/H, TBLWTL/H instructions). Program space access through the data space occurs if the MSb of the data space EA is set and program space visibility is enabled, by setting the PSV bit in the Core Control register (CORCON). The functions of CORCON are discussed in Section 2.4 “DSP Engine”, DSP Engine. Data accesses to this area add an additional cycle to the instruction being executed, since two program memory fetches are required. Note that the upper half of addressable data space is always part of the X data space. Therefore, when a DSP operation uses program space mapping to access this memory region, Y data space should typically contain state (variable) data for DSP operations, whereas X data space should typically contain coefficient (constant) data. Although each data space address, 0x8000 and higher, maps directly into a corresponding program memory address (see Figure 3-5), only the lower 16-bits of the 24-bit program word are used to contain the data. The upper 8 bits should be programmed to force an illegal instruction to maintain machine robustness. Refer to the “dsPIC30F/33F Programmer’s Reference Manual” (DS70157) for details on instruction encoding. DS70118G-page 22 Note that by incrementing the PC by 2 for each program memory word, the Least Significant 15 bits of data space addresses directly map to the Least Significant 15 bits in the corresponding program space addresses. The remaining bits are provided by the Program Space Visibility Page register, PSVPAG<7:0>, as shown in Figure 3-5. Note: PSV access is temporarily disabled during table reads/writes. For instructions that use PSV which are executed outside a REPEAT loop: • The following instructions will require one instruction cycle in addition to the specified execution time: - MAC class of instructions with data operand prefetch - MOV instructions - MOV.D instructions • All other instructions will require two instruction cycles in addition to the specified execution time of the instruction. For instructions that use PSV which are executed inside a REPEAT loop: • The following instances will require two instruction cycles in addition to the specified execution time of the instruction: - Execution in the first iteration - Execution in the last iteration - Execution prior to exiting the loop due to an interrupt - Execution upon re-entering the loop after an interrupt is serviced • Any other iteration of the REPEAT loop will allow the instruction, accessing data using PSV, to execute in a single cycle. © 2006 Microchip Technology Inc. dsPIC30F2010 FIGURE 3-5: DATA SPACE WINDOW INTO PROGRAM SPACE OPERATION Data Space Program Space 0x100100 0x0000 PSVPAG(1) 0x00 8 15 EA<15> = 0 Data Space EA 16 15 EA<15> = 1 0x8000 Address 15 Concatenation 23 23 15 0 0x001200 Upper half of Data Space is mapped into Program Space 0x001FFE 0xFFFF BSET MOV MOV MOV CORCON,#2 #0x00, W0 W0, PSVPAG 0x9200, W0 ; PSV bit set ; Set PSVPAG register ; Access program memory location ; using a data space access Data Read Note: PSVPAG is an 8-bit register, containing bits <22:15> of the program space address (i.e., it defines the page in program space to which the upper half of data space is being mapped). 3.2 Data Address Space The core has two data spaces. The data spaces can be considered either separate (for some DSP instructions), or as one unified linear address range (for MCU instructions). The data spaces are accessed using two Address Generation Units (AGUs) and separate data paths. 3.2.1 DATA SPACE MEMORY MAP The data space memory is split into two blocks, X and Y data space. A key element of this architecture is that Y space is a subset of X space, and is fully contained within X space. In order to provide an apparent linear addressing space, X and Y spaces have contiguous addresses. © 2006 Microchip Technology Inc. When executing any instruction other than one of the MAC class of instructions, the X block consists of the 256 byte data address space (including all Y addresses). When executing one of the MAC class of instructions, the X block consists of the 256 bytes data address space excluding the Y address block (for data reads only). In other words, all other instructions regard the entire data memory as one composite address space. The MAC class instructions extract the Y address space from data space and address it using EAs sourced from W10 and W11. The remaining X data space is addressed using W8 and W9. Both address spaces are concurrently accessed only with the MAC class instructions. A data space memory map is shown in Figure 3-6. DS70118G-page 23 dsPIC30F2010 FIGURE 3-6: DATA SPACE MEMORY MAP MSB Address MSB SFR Space (Note) LSB Address 16 bits LSB 0x0000 0x0001 SFR Space 0x07FE 0x0800 0x07FF 0x0801 2560 bytes Near Data Space X Data RAM (X) 256 bytes 512 bytes SRAM Space 0x08FF 0x0901 0x08FE 0x0900 Y Data RAM (Y) 256 bytes 0x09FF 0x0A00 (Note) 0x8001 0x8000 X Data Unimplemented (X) Optionally Mapped into Program Memory 0xFFFF Note: 0xFFFE Unimplemented SFR or SRAM locations read as ‘0’. DS70118G-page 24 © 2006 Microchip Technology Inc. dsPIC30F2010 DATA SPACE FOR MCU AND DSP (MAC CLASS) INSTRUCTIONS SFR SPACE SFR SPACE X SPACE FIGURE 3-7: Y SPACE UNUSED X SPACE (Y SPACE) X SPACE UNUSED UNUSED Non-MAC Class Ops (Read/Write) MAC Class Ops (Write) Indirect EA using any W © 2006 Microchip Technology Inc. MAC Class Ops Read-Only Indirect EA using W8, W9 Indirect EA using W10, W11 DS70118G-page 25 dsPIC30F2010 3.2.2 DATA SPACES 3.2.3 The X data space is used by all instructions and supports all addressing modes. There are separate read and write data buses. The X read data bus is the return data path for all instructions that view data space as combined X and Y address space. It is also the X address space data path for the dual operand read instructions (MAC class). The X write data bus is the only write path to data space for all instructions. The X data space also supports Modulo Addressing for all instructions, subject to addressing mode restrictions. Bit-Reversed addressing is only supported for writes to X data space. The Y data space is used in concert with the X data space by the MAC class of instructions (CLR, ED, EDAC, MAC, MOVSAC, MPY, MPY.N and MSC) to provide two concurrent data read paths. No writes occur across the Y bus. This class of instructions dedicates two W register pointers, W10 and W11, to always address Y data space, independent of X data space, whereas W8 and W9 always address X data space. Note that during accumulator write-back, the data address space is considered a combination of X and Y data spaces, so the write occurs across the X bus. Consequently, the write can be to any address in the entire data space. The Y data space can only be used for the data prefetch operation associated with the MAC class of instructions. It also supports Modulo Addressing for automated circular buffers. Of course, all other instructions can access the Y data address space through the X data path, as part of the composite linear space. The boundary between the X and Y data spaces is defined as shown in Figure 3-6 and is not user programmable. Should an EA point to data outside its own assigned address space, or to a location outside physical memory, an all-zero word/byte will be returned. For example, although Y address space is visible by all non-MAC instructions using any Addressing mode, an attempt by a MAC instruction to fetch data from that space, using W8 or W9 (X space pointers), will return 0x0000. TABLE 3-2: EFFECT OF INVALID MEMORY ACCESSES Attempted Operation Data Returned EA = an unimplemented address 0x0000 W8 or W9 used to access Y data space in a MAC instruction 0x0000 W10 or W11 used to access X data space in a MAC instruction 0x0000 DATA SPACE WIDTH The core data width is 16 bits. All internal registers are organized as 16-bit wide words. Data space memory is organized in byte addressable, 16-bit wide blocks. 3.2.4 DATA ALIGNMENT To help maintain backward compatibility with PIC® MCU devices and improve data space memory usage efficiency, the dsPIC30F instruction set supports both word and byte operations. Data is aligned in data memory and registers as words, but all data space EAs resolve to bytes. Data byte reads will read the complete word, which contains the byte, using the LSb of any EA to determine which byte to select. The selected byte is placed onto the LSB of the X data path (no byte accesses are possible from the Y data path as the MAC class of instruction can only fetch words). That is, data memory and registers are organized as two parallel byte wide entities with shared (word) address decode, but separate write lines. Data byte writes only write to the corresponding side of the array or register which matches the byte address. As a consequence of this byte accessibility, all effective address calculations (including those generated by the DSP operations, which are restricted to word-sized data) are internally scaled to step through word-aligned memory. For example, the core would recognize that Post-Modified Register Indirect Addressing mode, [Ws ++], will result in a value of Ws + 1 for byte operations and Ws + 2 for word operations. All word accesses must be aligned to an even address. Misaligned word data fetches are not supported, so care must be taken when mixing byte and word operations, or translating from 8-bit MCU code. Should a misaligned read or write be attempted, an address error trap will be generated. If the error occurred on a read, the instruction underway is completed, whereas if it occurred on a write, the instruction will be executed but the write will not occur. In either case, a trap will then be executed, allowing the system and/or user to examine the machine state prior to execution of the address fault. FIGURE 3-8: 15 DATA ALIGNMENT MSB 87 LSB 0 0001 Byte 1 Byte 0 0000 0003 Byte 3 Byte 2 0002 0005 Byte 5 Byte 4 0004 All effective addresses are 16 bits wide and point to bytes within the data space. Therefore, the data space address range is 64 Kbytes or 32K words. DS70118G-page 26 © 2006 Microchip Technology Inc. dsPIC30F2010 All byte loads into any W register are loaded into the LSB. The MSB is not modified. A sign-extend (SE) instruction is provided to allow users to translate 8-bit signed data to 16-bit signed values. Alternatively, for 16-bit unsigned data, users can clear the MSB of any W register by executing a zero-extend (ZE) instruction on the appropriate address. Although most instructions are capable of operating on word or byte data sizes, it should be noted that some instructions, including the DSP instructions, operate only on words. 3.2.5 NEAR DATA SPACE An 8 Kbyte ‘near’ data space is reserved in X address memory space between 0x0000 and 0x1FFF, which is directly addressable via a 13-bit absolute address field within all memory direct instructions. The remaining X address space and all of the Y address space is addressable indirectly. Additionally, the whole of X data space is addressable using MOV instructions, which support memory direct addressing with a 16-bit address field. 3.2.6 SOFTWARE STACK Figure 3-9. Note that for a PC push during any CALL instruction, the MSB of the PC is zero-extended before the push, ensuring that the MSB is always clear. Note: A PC push during exception processing will concatenate the SRL register to the MSB of the PC prior to the push. There is a Stack Pointer Limit register (SPLIM) associated with the Stack Pointer. SPLIM is uninitialized at Reset. As is the case for the Stack Pointer, SPLIM<0> is forced to ‘0’, because all stack operations must be word-aligned. Whenever an EA is generated using W15 as a source or destination pointer, the address thus generated is compared with the value in SPLIM. If the contents of the Stack Pointer (W15) and the SPLIM register are equal and a push operation is performed, a stack error trap will not occur. The stack error trap will occur on a subsequent push operation. Thus, for example, if it is desirable to cause a stack error trap when the stack grows beyond address 0x2000 in RAM, initialize the SPLIM with the value, 0x1FFE. Similarly, a stack pointer underflow (stack error) trap is generated when the Stack Pointer address is found to be less than 0x0800, thus preventing the stack from interfering with the Special Function Register (SFR) space. The dsPIC DSC device contains a software stack. W15 is used as the Stack Pointer. A write to the SPLIM register should not be immediately followed by an indirect read operation using W15. The Stack Pointer always points to the first available free word, and grows from lower addresses towards higher addresses. It pre-decrements for stack pops, and post-increments for stack pushes, as shown in FIGURE 3-9: CALL STACK FRAME Stack Grows Towards Higher Address 0x0000 15 0 PC<15:0> 000000000 PC<22:16> <Free Word> W15 (before CALL) W15 (after CALL) POP: [--W15] PUSH: [W15++] © 2006 Microchip Technology Inc. DS70118G-page 27 SFR Name CORE REGISTER MAP Address (Home) Bit 15 Bit 14 Bit 13 Bit 12 Bit 11 Bit 10 Bit 9 Bit 8 Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Reset State W0 0000 W0 / WREG 0000 0000 0000 0000 W1 0002 W1 0000 0000 0000 0000 W2 0004 W2 0000 0000 0000 0000 W3 0006 W3 0000 0000 0000 0000 W4 0008 W4 0000 0000 0000 0000 W5 000A W5 0000 0000 0000 0000 W6 000C W6 0000 0000 0000 0000 W7 000E W7 0000 0000 0000 0000 © 2006 Microchip Technology Inc. W8 0010 W8 0000 0000 0000 0000 W9 0012 W9 0000 0000 0000 0000 W10 0014 W10 0000 0000 0000 0000 W11 0016 W11 0000 0000 0000 0000 W12 0018 W12 0000 0000 0000 0000 W13 001A W13 0000 0000 0000 0000 W14 001C W14 0000 0000 0000 0000 W15 001E W15 0000 1000 0000 0000 SPLIM 0020 SPLIM 0000 0000 0000 0000 ACCAL 0022 ACCAL 0000 0000 0000 0000 ACCAH 0024 ACCAH 0000 0000 0000 0000 ACCAU 0026 ACCBL 0028 ACCBL ACCBH 002A ACCBH ACCBU 002C PCL 002E PCH 0030 — — — — — — — — TBLPAG 0032 — — — — — — — — TBLPAG 0000 0000 0000 0000 PSVPAG 0034 — — — — — — — — PSVPAG 0000 0000 0000 0000 RCOUNT 0036 RCOUNT uuuu uuuu uuuu uuuu DCOUNT 0038 DCOUNT uuuu uuuu uuuu uuuu DOSTARTL 003A DOSTARTH 003C Sign Extension (ACCA<39>) ACCAU 0000 0000 0000 0000 0000 0000 0000 0000 Sign Extension (ACCB<39>) ACCBU 0000 0000 0000 0000 PCL 0000 0000 0000 0000 — PCH 0000 0000 0000 0000 DOSTARTL — — — — — — — — 0 — DOSTARTH DOENDH DOENDL 003E DOENDH 0040 — — — — — — — — — SR 0042 OA OB SA SB OAB SAB DA DC IPL2 0 IPL1 IPL0 Refer to “dsPIC30F Family Reference Manual” (DS70046) for descriptions of register bit fields. RA N uuuu uuuu uuuu uuu0 0000 0000 0uuu uuuu DOENDL Legend: u = uninitialized bit Note: 0000 0000 0000 0000 uuuu uuuu uuuu uuu0 0000 0000 0uuu uuuu OV Z C 0000 0000 0000 0000 dsPIC30F2010 DS70118G-page 28 TABLE 3-3: © 2006 Microchip Technology Inc. TABLE 3-3: SFR Name CORE REGISTER MAP (CONTINUED) Address (Home) Bit 15 Bit 14 Bit 13 Bit 12 Bit 11 Bit 10 Bit 9 Bit 8 Bit 7 Bit 6 EDT DL2 DL1 DL0 SATA SATB CORCON 0044 — — — US MODCON 0046 XMODEN YMODEN — — XMODSRT 0048 BWM<3:0> Bit 5 Bit 4 SATDW ACCSAT YWM<3:0> XS<15:1> Bit 3 Bit 2 Bit 1 Bit 0 Reset State IPL3 PSV RND IF 0000 0000 0010 0000 0 uuuu uuuu uuuu uuu0 XWM<3:0> 0000 0000 0000 0000 XMODEND 004A XE<15:1> 1 uuuu uuuu uuuu uuu1 YMODSRT 004C YS<15:1> 0 uuuu uuuu uuuu uuu0 YMODEND 004E XBREV 0050 BREN YE<15:1> DISICNT 0052 — 1 XB<14:0> — DISICNT<13:0> uuuu uuuu uuuu uuu1 uuuu uuuu uuuu uuuu 0000 0000 0000 0000 Legend: u = uninitialized bit Note: Refer to “dsPIC30F Family Reference Manual” (DS70046) for descriptions of register bit fields. dsPIC30F2010 DS70118G-page 29 dsPIC30F2010 NOTES: DS70118G-page 30 © 2006 Microchip Technology Inc. dsPIC30F2010 4.0 ADDRESS GENERATOR UNITS Note: This data sheet summarizes features of this group of dsPIC30F devices and is not intended to be a complete reference source. For more information on the CPU, peripherals, register descriptions and general device functionality, refer to the “dsPIC30F Family Reference Manual” (DS70046). For more information on the device instruction set and programming, refer to the “dsPIC30F/ 33F Programmer’s Reference Manual” (DS70157). The dsPIC DSC core contains two independent address generator units: the X AGU and Y AGU. The Y AGU supports word-sized data reads for the DSP MAC class of instructions only. The dsPIC DSC AGUs support three types of data addressing: • Linear Addressing • Modulo (Circular) Addressing • Bit-Reversed Addressing Linear and Modulo Data Addressing modes can be applied to data space or program space. Bit-Reversed Addressing is only applicable to data space addresses. TABLE 4-1: 4.1 Instruction Addressing Modes The Addressing modes in Table 4-1 form the basis of the Addressing modes optimized to support the specific features of individual instructions. The Addressing modes provided in the MAC class of instructions are somewhat different from those in the other instruction types. 4.1.1 FILE REGISTER INSTRUCTIONS Most file register instructions use a 13-bit address field (f) to directly address data present in the first 8192 bytes of data memory (near data space). Most file register instructions employ a working register W0, which is denoted as WREG in these instructions. The destination is typically either the same file register, or WREG (with the exception of the MUL instruction), which writes the result to a register or register pair. The MOV instruction allows additional flexibility and can access the entire data space. FUNDAMENTAL ADDRESSING MODES SUPPORTED Addressing Mode File Register Direct Description The address of the file register is specified explicitly. Register Direct The contents of a register are accessed directly. Register Indirect The contents of Wn forms the Effective Address (EA). Register Indirect Post-modified The contents of Wn forms the EA. Wn is post-modified (incremented or decremented) by a constant value. Register Indirect Pre-modified Wn is pre-modified (incremented or decremented) by a signed constant value to form the EA. Register Indirect with Register Offset The sum of Wn and Wb forms the EA. Register Indirect with Literal Offset © 2006 Microchip Technology Inc. The sum of Wn and a literal forms the EA. DS70118G-page 31 dsPIC30F2010 4.1.2 MCU INSTRUCTIONS The three-operand MCU instructions are of the form: Operand 3 = Operand 1 <function> Operand 2 where Operand 1 is always a working register (i.e., the Addressing mode can only be register direct), which is referred to as Wb. Operand 2 can be a W register, fetched from data memory, or 5-bit literal. The result location can be either a W register or an address location. The following Addressing modes are supported by MCU instructions: • • • • • Register Direct Register Indirect Register Indirect Post-modified Register Indirect Pre-modified 5-bit or 10-bit Literal Note: 4.1.3 Not all instructions support all the Addressing modes given above. Individual instructions may support different subsets of these Addressing modes. MOVE AND ACCUMULATOR INSTRUCTIONS Move instructions and the DSP Accumulator class of instructions provide a greater degree of addressing flexibility than other instructions. In addition to the Addressing modes supported by most MCU instructions, Move and Accumulator instructions also support Register Indirect with Register Offset Addressing mode, also referred to as Register Indexed mode. Note: For the MOV instructions, the Addressing mode specified in the instruction can differ for the source and destination EA. However, the 4-bit Wb (Register Offset) field is shared between both source and destination (but typically only used by one). 4.1.4 MAC INSTRUCTIONS The dual source operand DSP instructions (CLR, ED, EDAC, MAC, MPY, MPY.N, MOVSAC and MSC), also referred to as MAC instructions, utilize a simplified set of Addressing modes to allow the user to effectively manipulate the data pointers through register indirect tables. The two source operand prefetch registers must be a member of the set {W8, W9, W10, W11}. For data reads, W8 and W9 will always be directed to the X RAGU and W10 and W11 will always be directed to the Y AGU. The effective addresses generated (before and after modification) must, therefore, be valid addresses within X data space for W8 and W9 and Y data space for W10 and W11. Note: Register Indirect with Register Offset Addressing is only available for W9 (in X space) and W11 (in Y space). In summary, the following Addressing modes are supported by the MAC class of instructions: • • • • • Register Indirect Register Indirect Post-modified by 2 Register Indirect Post-modified by 4 Register Indirect Post-modified by 6 Register Indirect with Register Offset (Indexed) 4.1.5 OTHER INSTRUCTIONS Besides the various Addressing modes outlined above, some instructions use literal constants of various sizes. For example, BRA (branch) instructions use 16-bit signed literals to specify the branch destination directly, whereas the DISI instruction uses a 14-bit unsigned literal field. In some instructions, such as ADD Acc, the source of an operand or result is implied by the opcode itself. Certain operations, such as NOP, do not have any operands. In summary, the following Addressing modes are supported by Move and Accumulator instructions: • • • • • • • • Register Direct Register Indirect Register Indirect Post-modified Register Indirect Pre-modified Register Indirect with Register Offset (Indexed) Register Indirect with Literal Offset 8-bit Literal 16-bit Literal Note: Not all instructions support all the Addressing modes given above. Individual instructions may support different subsets of these Addressing modes. DS70118G-page 32 © 2006 Microchip Technology Inc. dsPIC30F2010 4.2 Modulo Addressing Modulo addressing is a method of providing an automated means to support circular data buffers using hardware. The objective is to remove the need for software to perform data address boundary checks when executing tightly looped code, as is typical in many DSP algorithms. Modulo addressing can operate in either data or program space (since the data pointer mechanism is essentially the same for both). One circular buffer can be supported in each of the X (which also provides the pointers into Program space) and Y data spaces. Modulo addressing can operate on any W register pointer. However, it is not advisable to use W14 or W15 for Modulo Addressing, since these two registers are used as the Stack Frame Pointer and Stack Pointer, respectively. In general, any particular circular buffer can only be configured to operate in one direction, as there are certain restrictions on the buffer start address (for incrementing buffers) or end address (for decrementing buffers) based upon the direction of the buffer. The only exception to the usage restrictions is for buffers which have a power-of-2 length. As these buffers satisfy the start and end address criteria, they may operate in a Bidirectional mode, (i.e., address boundary checks will be performed on both the lower and upper address boundaries). 4.2.1 START AND END ADDRESS The Modulo Addressing scheme requires that a starting and an end address be specified and loaded into the 16-bit modulo buffer address registers: XMODSRT, XMODEND, YMODSRT and YMODEND (see Table 3-3). Note: Y space Modulo Addressing EA calculations assume word-sized data (LSb of every EA is always clear). The length of a circular buffer is not directly specified. It is determined by the difference between the corresponding start and end addresses. The maximum possible length of the circular buffer is 32K words (64 Kbytes). 4.2.2 W ADDRESS REGISTER SELECTION The Modulo and Bit-Reversed Addressing Control register MODCON<15:0> contains enable flags as well as a W register field to specify the W address registers. The XWM and YWM fields select which registers will operate with Modulo Addressing. If XWM = 15, X RAGU and X WAGU Modulo Addressing are disabled. Similarly, if YWM = 15, Y AGU Modulo Addressing is disabled. The X Address Space Pointer W register (XWM) to which Modulo Addressing is to be applied, is stored in MODCON<3:0> (see Table 3-3). Modulo addressing is enabled for X data space when XWM is set to any value other than 15 and the XMODEN bit is set at MODCON<15>. The Y Address Space Pointer W register (YWM) to which Modulo Addressing is to be applied, is stored in MODCON<7:4>. Modulo addressing is enabled for Y data space when YWM is set to any value other than 15 and the YMODEN bit is set at MODCON<14>. © 2006 Microchip Technology Inc. DS70118G-page 33 dsPIC30F2010 FIGURE 4-1: MODULO ADDRESSING OPERATION EXAMPLE Byte Address MOV MOV MOV MOV MOV MOV MOV MOV DO MOV AGAIN: 0x1100 #0x1100,W0 W0, XMODSRT #0x1163,W0 W0,MODEND #0x8001,W0 W0,MODCON #0x0000,W0 #0x1110,W1 AGAIN,#0x31 W0, [W1++] INC W0,W0 ;set modulo start address ;set modulo end address ;enable W1, X AGU for modulo ;W0 holds buffer fill value ;point W1 to buffer ;fill the 50 buffer locations ;fill the next location ;increment the fill value 0x1163 Start Addr = 0x1100 End Addr = 0x1163 Length = 0x0032 words DS70118G-page 34 © 2006 Microchip Technology Inc. dsPIC30F2010 4.2.3 MODULO ADDRESSING APPLICABILITY Modulo addressing can be applied to the effective address calculation associated with any W register. It is important to realize that the address boundaries check for addresses less than or greater than the upper (for incrementing buffers) and lower (for decrementing buffers) boundary addresses (not just equal to). Address changes may, therefore, jump beyond boundaries and still be adjusted correctly. Note: 4.3 The modulo corrected effective address is written back to the register only when PreModify or Post-Modify Addressing mode is used to compute the effective address. When an address offset (e.g., [W7 + W2]) is used, modulo address correction is performed, but the contents of the register remains unchanged. Bit-Reversed Addressing Bit-Reversed Addressing is intended to simplify data reordering for radix-2 FFT algorithms. It is supported by the X AGU for data writes only. The modifier, which may be a constant value or register contents, is regarded as having its bit order reversed. The address source and destination are kept in normal order. Thus, the only operand requiring reversal is the modifier. 4.3.1 2. 3. XB<14:0> is the bit-reversed address modifier or ‘pivot point’ which is typically a constant. In the case of an FFT computation, its value is equal to half of the FFT data buffer size. Note: BWM (W register selection) in the MODCON register is any value other than 15 (the stack can not be accessed using Bit-Reversed Addressing) and the BREN bit is set in the XBREV register and the Addressing mode used is Register Indirect with Pre-Increment or Post-Increment. FIGURE 4-2: All Bit-Reversed EA calculations assume word-sized data (LSb of every EA is always clear). The XB value is scaled accordingly to generate compatible (byte) addresses. When enabled, Bit-Reversed Addressing will only be executed for register indirect with pre-increment or post-increment addressing and word-sized data writes. It will not function for any other addressing mode or for byte-sized data, and normal addresses will be generated instead. When Bit-Reversed Addressing is active, the W Address Pointer will always be added to the address modifier (XB) and the offset associated with the register Indirect Addressing mode will be ignored. In addition, as word-sized data is a requirement, the LSb of the EA is ignored (and always clear). Note: BIT-REVERSED ADDRESSING IMPLEMENTATION Bit-Reversed Addressing is enabled when: 1. If the length of a bit-reversed buffer is M = 2N bytes, then the last ‘N’ bits of the data buffer start address must be zeros. Modulo addressing and Bit-Reversed Addressing should not be enabled together. In the event that the user attempts to do this, bit reversed addressing will assume priority when active for the X WAGU, and X WAGU Modulo Addressing will be disabled. However, Modulo Addressing will continue to function in the X RAGU. If Bit-Reversed Addressing has already been enabled by setting the BREN (XBREV<15>) bit, then a write to the XBREV register should not be immediately followed by an indirect read operation using the W register that has been designated as the bit-reversed pointer. BIT-REVERSED ADDRESS EXAMPLE Sequential Address b15 b14 b13 b12 b11 b10 b9 b8 b7 b6 b5 b4 b3 b2 b1 0 Bit Locations Swapped Left-to-Right Around Center of Binary Value b15 b14 b13 b12 b11 b10 b9 b8 b7 b6 b5 b1 b2 b3 b4 0 Bit-Reversed Address Pivot Point XB = 0x0008 for a 16-word Bit-Reversed Buffer © 2006 Microchip Technology Inc. DS70118G-page 35 dsPIC30F2010 TABLE 4-2: BIT-REVERSED ADDRESS SEQUENCE (16-ENTRY) Normal Address A3 A2 A1 A0 Bit-Reversed Address Decimal A3 A2 A1 A0 Decimal 0 0 0 0 0 0 0 0 0 0 0 0 0 1 1 1 0 0 0 8 0 0 1 0 2 0 1 0 0 4 0 0 1 1 3 1 1 0 0 12 0 1 0 0 4 0 0 1 0 2 0 1 0 1 5 1 0 1 0 10 0 1 1 0 6 0 1 1 0 6 0 1 1 1 7 1 1 1 0 14 1 0 0 0 8 0 0 0 1 1 1 0 0 1 9 1 0 0 1 9 1 0 1 0 10 0 1 0 1 5 1 0 1 1 11 1 1 0 1 13 1 1 0 0 12 0 0 1 1 3 1 1 0 1 13 1 0 1 1 11 1 1 1 0 14 0 1 1 1 7 1 1 1 1 15 1 1 1 1 15 TABLE 4-3: Note 1: BIT-REVERSED ADDRESS MODIFIER VALUES FOR XBREV REGISTER Buffer Size (Words) XB<14:0> Bit-Reversed Address Modifier Value(1) 32768 0x4000 16384 0x2000 8192 0x1000 4096 0x0800 2048 0x0400 1024 0x0200 512 0x0100 256 0x0080 128 0x0040 64 0x0020 32 0x0010 16 0x0008 8 0x0004 4 0x0002 2 0x0001 Modifier values greater than 256 words exceed the data memory available on the dsPIC30F2010 device DS70118G-page 36 © 2006 Microchip Technology Inc. dsPIC30F2010 5.0 INTERRUPTS Note: This data sheet summarizes features of this group of dsPIC30F devices and is not intended to be a complete reference source. For more information on the CPU, peripherals, register descriptions and general device functionality, refer to the “dsPIC30F Family Reference Manual” (DS70046). For more information on the device instruction set and programming, refer to the “dsPIC30F/ 33F Programmer’s Reference Manual” (DS70157). • INTCON1<15:0>, INTCON2<15:0> Global interrupt control functions are derived from these two registers. INTCON1 contains the control and status flags for the processor exceptions. The INTCON2 register controls the external interrupt request signal behavior and the use of the alternate vector table. Note: The dsPIC30F2010 has 24 interrupt sources and 4 processor exceptions (traps), which must be arbitrated based on a priority scheme. The CPU is responsible for reading the Interrupt Vector Table (IVT) and transferring the address contained in the interrupt vector to the program counter. The interrupt vector is transferred from the program data bus into the program counter, via a 24-bit wide multiplexer on the input of the program counter. The Interrupt Vector Table (IVT) and Alternate Interrupt Vector Table (AIVT) are placed near the beginning of program memory (0x000004). The IVT and AIVT are shown in Figure 5-1. The interrupt controller is responsible for preprocessing the interrupts and processor exceptions, prior to their being presented to the processor core. The peripheral interrupts and traps are enabled, prioritized and controlled using centralized special function registers: • IFS0<15:0>, IFS1<15:0>, IFS2<15:0> All interrupt request flags are maintained in these three registers. The flags are set by their respective peripherals or external signals, and they are cleared via software. • IEC0<15:0>, IEC1<15:0>, IEC2<15:0> All interrupt enable control bits are maintained in these three registers. These control bits are used to individually enable interrupts from the peripherals or external signals. • IPC0<15:0>... IPC11<7:0> The user-assignable priority level associated with each of these interrupts is held centrally in these twelve registers. • IPL<3:0> The current CPU priority level is explicitly stored in the IPL bits. IPL<3> is present in the CORCON register, whereas IPL<2:0> are present in the STATUS Register (SR) in the processor core. © 2006 Microchip Technology Inc. Interrupt flag bits get set when an interrupt condition occurs, regardless of the state of its corresponding enable bit. User software should ensure the appropriate interrupt flag bits are clear prior to enabling an interrupt. All interrupt sources can be user-assigned to one of 7 priority levels, 1 through 7, via the IPCx registers. Each interrupt source is associated with an interrupt vector, as shown in Figure 5-1. Levels 7 and 1 represent the highest and lowest maskable priorities, respectively. Note: Assigning a priority level of 0 to an interrupt source is equivalent to disabling that interrupt. If the NSTDIS bit (INTCON1<15>) is set, nesting of interrupts is prevented. Thus, if an interrupt is currently being serviced, processing of a new interrupt is prevented, even if the new interrupt is of higher priority than the one currently being serviced. Note: The IPL bits become read-only whenever the NSTDIS bit has been set to ‘1’. Certain interrupts have specialized control bits for features like edge or level triggered interrupts, interrupt-on-change, etc. Control of these features remains within the peripheral module which generates the interrupt. The DISI instruction can be used to disable the processing of interrupts of priorities 6 and lower for a certain number of instructions, during which the DISI bit (INTCON2<14>) remains set. When an interrupt is serviced, the PC is loaded with the address stored in the vector location in Program Memory that corresponds to the interrupt. There are 63 different vectors within the IVT (refer to Figure 5-1). These vectors are contained in locations 0x000004 through 0x0000FE of program memory (refer to Figure 5-1). These locations contain 24-bit addresses, and in order to preserve robustness, an address error trap will take place should the PC attempt to fetch any of these words during normal execution. This prevents execution of random data as a result of accidentally decrementing a PC into vector space, accidentally mapping a data space address into vector space or the PC rolling over to 0x000000 after reaching the end of implemented program memory space. Execution of a GOTO instruction to this vector space will also generate an address error trap. DS70118G-page 37 dsPIC30F2010 5.1 Interrupt Priority The user-assignable Interrupt Priority (IP<2:0>) bits for each individual interrupt source are located in the Least Significant 3 bits of each nibble, within the IPCx register(s). Bit 3 of each nibble is not used and is read as a ‘0’. These bits define the priority level assigned to a particular interrupt by the user. Note: The user-selectable priority levels are from 0, as the lowest priority, to level 7, as the highest priority. Since more than one interrupt request source may be assigned to a specific user specified priority level, a means is provided to assign priority within a given level. This method is called “Natural Order Priority” and is final. Natural Order Priority is determined by the position of an interrupt in the vector table, and only affects interrupt operation when multiple interrupts with the same user-assigned priority become pending at the same time. Table 5-1 lists the interrupt numbers and interrupt sources for the dsPIC DSC devices and their associated vector numbers. Note 1: The natural order priority scheme has 0 as the highest priority and 53 as the lowest priority. 2: The natural order priority number is the same as the INT number. The ability for the user to assign every interrupt to one of seven priority levels means that the user can assign a very high overall priority level to an interrupt with a low natural order priority. For example, the PLVD (LowVoltage Detect) can be given a priority of 7. The INT0 (external interrupt 0) may be assigned to priority level 1, thus giving it a very low effective priority. DS70118G-page 38 TABLE 5-1: INT Number dsPIC30F2010 INTERRUPT VECTOR TABLE Vector Number Interrupt Source Highest Natural Order Priority 0 8 INT0 – External Interrupt 0 1 9 IC1 – Input Capture 1 2 10 OC1 – Output Compare 1 3 11 T1 – Timer 1 4 12 IC2 – Input Capture 2 5 13 OC2 – Output Compare 2 6 14 T2 – Timer 2 7 15 T3 – Timer 3 8 16 SPI1 9 17 U1RX – UART1 Receiver 10 18 U1TX – UART1 Transmitter 11 19 ADC – ADC Convert Done 12 20 NVM – NVM Write Complete 13 21 SI2C – I2C™ Slave Interrupt 14 22 MI2C – I2C Master Interrupt 15 23 Input Change Interrupt 16 24 INT1 – External Interrupt 1 17 25 IC7 – Input Capture 7 18 26 IC8 – Input Capture 8 19 27 Reserved 20 28 Reserved 21 29 Reserved 22 30 Reserved 23 31 INT2 - External Interrupt 2 24 32 Reserved 25 33 Reserved 26 34 Reserved 27 35 Reserved 28 36 Reserved 29 37 Reserved 30 38 Reserved 31 39 Reserved 32 40 Reserved 33 41 Reserved 34 42 Reserved 35 43 Reserved 36 44 INT3 – External Interrupt 3 37 45 Reserved 38 46 Reserved 39 47 PWM – PWM Period Match 40 48 QEI – QEI Interrupt 41 49 Reserved 42 50 Reserved 43 51 FLTA – PWM Fault A 44 52 Reserved 45-53 53-61 Reserved Lowest Natural Order Priority © 2006 Microchip Technology Inc. dsPIC30F2010 5.2 Reset Sequence A Reset is not a true exception, because the interrupt controller is not involved in the Reset process. The processor initializes its registers in response to a Reset, which forces the PC to zero. The processor then begins program execution at location 0x000000. A GOTO instruction is stored in the first program memory location, immediately followed by the address target for the GOTO instruction. The processor executes the GOTO to the specified address and then begins operation at the specified target (start) address. 5.2.1 5.3 Traps Traps can be considered as non-maskable interrupts indicating a software or hardware error, which adhere to a predefined priority as shown in Figure 5-1. They are intended to provide the user a means to correct erroneous operation during debug and when operating within the application. Note: RESET SOURCES In addition to External Reset and Power-on Reset (POR), there are 6 sources of error conditions which ‘trap’ to the Reset vector. • Watchdog Time-out: The watchdog has timed out, indicating that the processor is no longer executing the correct flow of code. • Uninitialized W Register Trap: An attempt to use an uninitialized W register as an Address Pointer will cause a Reset. • Illegal Instruction Trap: Attempted execution of any unused opcodes will result in an illegal instruction trap. Note that a fetch of an illegal instruction does not result in an illegal instruction trap if that instruction is flushed prior to execution due to a flow change. • Brown-out Reset (BOR): A momentary dip in the power supply to the device has been detected, which may result in malfunction. • Trap Lockout: Occurrence of multiple trap conditions simultaneously will cause a Reset. Note that many of these trap conditions can only be detected when they occur. Consequently, the questionable instruction is allowed to complete prior to trap exception processing. If the user chooses to recover from the error, the result of the erroneous action that caused the trap may have to be corrected. There are 8 fixed priority levels for traps: Level 8 through Level 15, which means that the IPL3 is always set during processing of a trap. If the user is not currently executing a trap, and he sets the IPL<3:0> bits to a value of ‘0111’ (Level 7), then all interrupts are disabled, but traps can still be processed. 5.3.1 TRAP SOURCES The following traps are provided with increasing priority. However, since all traps can be nested, priority has little effect. Math Error Trap: The math error trap executes under the following three circumstances: 1. 2. 3. 4. © 2006 Microchip Technology Inc. If the user does not intend to take corrective action in the event of a trap error condition, these vectors must be loaded with the address of a default handler that simply contains the RESET instruction. If, on the other hand, one of the vectors containing an invalid address is called, an address error trap is generated. Should an attempt be made to divide by zero, the divide operation will be aborted on a cycle boundary and the trap taken. If enabled, a math error trap will be taken when an arithmetic operation on either accumulator A or B causes an overflow from bit 31 and the accumulator guard bits are not utilized. If enabled, a math error trap will be taken when an arithmetic operation on either accumulator A or B causes a catastrophic overflow from bit 39 and all saturation is disabled. If the shift amount specified in a shift instruction is greater than the maximum allowed shift amount, a trap will occur. DS70118G-page 39 dsPIC30F2010 Address Error Trap: 5.3.2 This trap is initiated when any of the following circumstances occurs: It is possible that multiple traps can become active within the same cycle (e.g., a misaligned word stack write to an overflowed address). In such a case, the fixed priority shown in Figure 5-1 is implemented, which may require the user to check if other traps are pending, in order to completely correct the fault. 1. 2. 3. 4. A misaligned data word access is attempted. A data fetch from an unimplemented data memory location is attempted. A data access of an unimplemented program memory location is attempted. An instruction fetch from vector space is attempted. Note: 5. 6. In the MAC class of instructions, wherein the data space is split into X and Y data space, unimplemented X space includes all of Y space, and unimplemented Y space includes all of X space. Execution of a “BRA #literal” instruction or a “GOTO #literal” instruction, where literal is an unimplemented program memory address. Executing instructions after modifying the PC to point to unimplemented program memory addresses. The PC may be modified by loading a value into the stack and executing a RETURN instruction. Stack Error Trap: HARD AND SOFT TRAPS ‘Soft’ traps include exceptions of priority level 8 through level 11, inclusive. The arithmetic error trap (level 11) falls into this category of traps. ‘Hard’ traps include exceptions of priority level 12 through level 15, inclusive. The address error (level 12), stack error (level 13) and oscillator error (level 14) traps fall into this category. Each hard trap that occurs must be acknowledged before code execution of any type may continue. If a lower priority hard trap occurs while a higher priority trap is pending, acknowledged, or is being processed, a hard trap conflict will occur. The device is automatically Reset in a hard trap conflict condition. The TRAPR status bit (RCON<15>) is set when the Reset occurs, so that the condition may be detected in software. FIGURE 5-1: TRAP VECTORS 1. 2. The Stack Pointer is loaded with a value which is greater than the (user programmable) limit value written into the SPLIM register (stack overflow). The Stack Pointer is loaded with a value which is less than 0x0800 (simple stack underflow). Decreasing Priority This trap is initiated under the following conditions: IVT Oscillator Fail Trap: This trap is initiated if the external oscillator fails and operation becomes reliant on an internal RC backup. AIVT DS70118G-page 40 Reset - GOTO Instruction Reset - GOTO Address Reserved Oscillator Fail Trap Vector Address Error Trap Vector Stack Error Trap Vector Math Error Trap Vector Reserved Vector Reserved Vector Reserved Vector Interrupt 0 Vector Interrupt 1 Vector — — — Interrupt 52 Vector Interrupt 53 Vector Reserved Reserved Reserved Oscillator Fail Trap Vector Stack Error Trap Vector Address Error Trap Vector Math Error Trap Vector Reserved Vector Reserved Vector Reserved Vector Interrupt 0 Vector Interrupt 1 Vector — — — Interrupt 52 Vector Interrupt 53 Vector 0x000000 0x000002 0x000004 0x000014 0x00007E 0x000080 0x000082 0x000084 0x000094 0x0000FE © 2006 Microchip Technology Inc. dsPIC30F2010 5.4 Interrupt Sequence 5.5 All interrupt event flags are sampled in the beginning of each instruction cycle by the IFSx registers. A pending interrupt request (IRQ) is indicated by the flag bit being equal to a ‘1’ in an IFSx register. The IRQ will cause an interrupt to occur if the corresponding bit in the interrupt enable (IECx) register is set. For the remainder of the instruction cycle, the priorities of all pending interrupt requests are evaluated. If there is a pending IRQ with a priority level greater than the current processor priority level in the IPL bits, the processor will be interrupted. The processor then stacks the current program counter and the low byte of the processor STATUS register (SRL), as shown in Figure 5-2. The low byte of the status register contains the processor priority level at the time, prior to the beginning of the interrupt cycle. The processor then loads the priority level for this interrupt into the STATUS register. This action will disable all lower priority interrupts until the completion of the Interrupt Service Routine (ISR). FIGURE 5-2: INTERRUPT STACK FRAME Stack Grows Towards Higher Address 0x0000 15 0 PC<15:0> SRL IPL3 PC<22:16> W15 (before CALL) <Free Word> W15 (after CALL) POP : [--W15] PUSH : [W15++] Note 1: The user can always lower the priority level by writing a new value into SR. The Interrupt Service Routine must clear the interrupt flag bits in the IFSx register before lowering the processor interrupt priority, in order to avoid recursive interrupts. 2: The IPL3 bit (CORCON<3>) is always clear when interrupts are being processed. It is set only during execution of traps. The RETFIE (Return from Interrupt) instruction will unstack the program counter and status registers to return the processor to its state prior to the interrupt sequence. © 2006 Microchip Technology Inc. Alternate Vector Table In Program Memory, the Interrupt Vector Table (IVT) is followed by the Alternate Interrupt Vector Table (AIVT), as shown in Figure 5-1. Access to the Alternate Vector Table is provided by the ALTIVT bit in the INTCON2 register. If the ALTIVT bit is set, all interrupt and exception processes will use the alternate vectors instead of the default vectors. The alternate vectors are organized in the same manner as the default vectors. The AIVT supports emulation and debugging efforts by providing a means to switch between an application and a support environment, without requiring the interrupt vectors to be reprogrammed. This feature also enables switching between applications for evaluation of different software algorithms at run time. If the AIVT is not required, the program memory allocated to the AIVT may be used for other purposes. AIVT is not a protected section and may be freely programmed by the user. 5.6 Fast Context Saving A context saving option is available using shadow registers. Shadow registers are provided for the DC, N, OV, Z and C bits in SR, and the registers W0 through W3. The shadows are only one level deep. The shadow registers are accessible using the PUSH.S and POP.S instructions only. When the processor vectors to an interrupt, the PUSH.S instruction can be used to store the current value of the aforementioned registers into their respective shadow registers. If an ISR of a certain priority uses the PUSH.S and POP.S instructions for fast context saving, then a higher priority ISR should not include the same instructions. Users must save the key registers in software during a lower priority interrupt, if the higher priority ISR uses fast context saving. 5.7 External Interrupt Requests The interrupt controller supports five external interrupt request signals, INT0-INT4. These inputs are edge sensitive; they require a low-to-high or a high-to-low transition to generate an interrupt request. The INTCON2 register has three bits, INT0EP-INT2EP, that select the polarity of the edge detection circuitry. 5.8 Wake-up from Sleep and Idle The interrupt controller may be used to wake up the processor from either Sleep or Idle modes, if Sleep or Idle mode is active when the interrupt is generated. If an enabled interrupt request of sufficient priority is received by the interrupt controller, then the standard interrupt request is presented to the processor. At the same time, the processor will wake-up from Sleep or Idle and begin execution of the Interrupt Service Routine needed to process the interrupt request. DS70118G-page 41 SFR Name Addr. INTERRUPT CONTROLLER REGISTER MAP Bit 15 Bit 14 Bit 13 Bit 12 Bit 11 Bit 10 Bit 9 Bit 8 Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Reset State — 0000 0000 0000 0000 INTCON1 0080 NSTDIS — — — — OVATE OVBTE COVTE — — — MATHERR ADDRERR INTCON2 0082 ALTIVT DISI — — — — — — — — — — — INT2EP INT1EP IFS0 0084 CNIF MI2CIF SI2CIF NVMIF ADIF U1TXIF U1RXIF SPI1IF T3IF T2IF OC2IF IC2IF T1IF OC1IF IC1IF INT0IF 0000 0000 0000 0000 IFS1 0086 — — — — — — — — INT2IF — — — — IC8IF IC7IF INT1IF 0000 0000 0000 0000 IFS2 0088 — — — — FLTAIF — — QEIIF PWMIF — — — — — — — 0000 0000 0000 0000 IEC0 008C CNIE MI2CIE SI2CIE NVMIE ADIE SPI1IE T3IE T2IE OC2IE IC2IE T1IE OC1IE IC1IE INT0IE 0000 0000 0000 0000 IEC1 008E — — — — — — — — INT2IE — — — — IC8IE IC7IE INT1IE 0000 0000 0000 0000 IEC2 0090 — — — — FLTAIE — — QEIIE PWMIE — — — — — — — IPC0 0094 — T1IP<2:0> — IPC1 0096 — T31P<2:0> IPC2 0098 — ADIP<2:0> IPC3 009A — CNIP<2:0> IPC4 009C — IPC5 009E — IPC6 00A0 — — — IPC7 00A2 — — IPC8 00A4 — — IPC9 00A6 — IPC10 00A8 — IPC11 00AA — — — — INT2IP<2:0> U1TXIE U1RXIE OC1IP<2:0> — IC1IP<2:0> — — T2IP<2:0> — U1TXIP<2:0> — OC2IP<2:0> — U1RXIP<2:0> — MI2CIP<2:0> — — IC8IP<2:0> — INT0EP 0000 0000 0000 0000 0000 0000 0000 0000 INT0IP<2:0> 0100 0100 0100 0100 — IC2IP<2:0> 0100 0100 0100 0100 — SPI1IP<2:0> 0100 0100 0100 0100 SI2CIP<2:0> — NVMIP<2:0> 0100 0100 0100 0100 IC7IP<2:0> — INT1IP<2:0> 0100 0100 0100 0100 — — — — — — — — — — — — 0100 0000 0000 0000 — — — — — — — — — — — — — 0000 0000 0000 0000 — — — — — — — — — — — — — — 0000 0000 0000 0000 — — — — — — — — — — — — — — 0000 0000 0000 0000 PWMIP<2:0> — — — — — — — — — — — — FLTAIP<2:0> — — — — — — — — — — — — — — — — — — — — — Legend: u = uninitialized bit Note: STKERR OSCFAIL Bit 0 Refer to “dsPIC30F Family Reference Manual” (DS70046) for descriptions of register bit fields. QEIIP<2:0> — — 0000 0000 0000 0000 0100 0000 0000 0100 — 0000 0000 0000 0000 dsPIC30F2010 DS70118G-page 42 TABLE 5-2: © 2006 Microchip Technology Inc. dsPIC30F2010 6.0 FLASH PROGRAM MEMORY 6.2 Note: This data sheet summarizes features of this group of dsPIC30F devices and is not intended to be a complete reference source. For more information on the CPU, peripherals, register descriptions and general device functionality, refer to the “dsPIC30F Family Reference Manual” (DS70046). For more information on the device instruction set and programming, refer to the “dsPIC30F/ 33F Programmer’s Reference Manual” (DS70157). RTSP is accomplished using TBLRD (table read) and TBLWT (table write) instructions. With RTSP, the user may erase program memory, 32 instructions (96 bytes) at a time and can write program memory data, 32 instructions (96 bytes) at a time. The dsPIC30F family of devices contains internal program Flash memory for executing user code. There are two methods by which the user can program this memory: 1. 2. 6.1 6.3 Table Instruction Operation Summary The TBLRDL and the TBLWTL instructions are used to read or write to bits<15:0> of program memory. TBLRDL and TBLWTL can access program memory in Word or Byte mode. In-Circuit Serial Programming (ICSP) programming capability Run-Time Self-Programming (RTSP) The TBLRDH and TBLWTH instructions are used to read or write to bits<23:16> of program memory. TBLRDH and TBLWTH can access program memory in Word or Byte mode. In-Circuit Serial Programming (ICSP) A 24-bit program memory address is formed using bits<7:0> of the TBLPAG register and the EA from a W register specified in the table instruction, as shown in Figure 6-1. dsPIC30F devices can be serially programmed while in the end application circuit. This is simply done with two lines for Programming Clock and Programming Data (which are named PGC and PGD respectively), and three other lines for Power (VDD), Ground (VSS) and Master Clear (MCLR). this allows customers to manufacture boards with unprogrammed devices, and then program the digital signal controller just before shipping the product. This also allows the most recent firmware or a custom firmware to be programmed. FIGURE 6-1: Run-Time Self-Programming (RTSP) ADDRESSING FOR TABLE AND NVM REGISTERS 24 bits Using Program Counter Program Counter 0 0 NVMADR Reg EA Using NVMADR Addressing 1/0 NVMADRU Reg 8 bits 16 bits Working Reg EA Using Table Instruction User/Configuration Space Select © 2006 Microchip Technology Inc. 1/0 TBLPAG Reg 8 bits 16 bits 24-bit EA Byte Select DS70118G-page 43 dsPIC30F2010 6.4 RTSP Operation The dsPIC30F Flash program memory is organized into rows and panels. Each row consists of 32 instructions, or 96 bytes. Each panel consists of 128 rows, or 4K x 24 instructions. RTSP allows the user to erase one row (32 instructions) at a time and to program 32 instructions at one time. RTSP may be used to program multiple program memory panels, but the table pointer must be changed at each panel boundary. Each panel of program memory contains write latches that hold 32 instructions of programming data. Prior to the actual programming operation, the write data must be loaded into the panel write latches. The data to be programmed into the panel is loaded in sequential order into the write latches; instruction 0, instruction 1, etc. The instruction words loaded must always be from a 32 address boundary. The basic sequence for RTSP programming is to set up a table pointer, then do a series of TBLWT instructions to load the write latches. Programming is performed by setting the special bits in the NVMCON register. 32 TBLWTL and four TBLWTH instructions are required to load the 32 instructions. If multiple panel programming is required, the table pointer needs to be changed and the next set of multiple write latches written. All of the table write operations are single word writes (2 instruction cycles), because only the table latches are written. A programming cycle is required for programming each row. The Flash program memory is readable, writable and erasable during normal operation over the entire VDD range. 6.5 The four SFRs used to read and write the program Flash memory are: • • • • NVMCON NVMADR NVMADRU NVMKEY 6.5.1 NVMCON REGISTER The NVMCON register controls which blocks are to be erased, which memory type is to be programmed, and the start of the programming cycle. 6.5.2 NVMADR REGISTER The NVMADR register is used to hold the lower two bytes of the effective address. The NVMADR register captures the EA<15:0> of the last table instruction that has been executed and selects the row to write. 6.5.3 NVMADRU REGISTER The NVMADRU register is used to hold the upper byte of the effective address. The NVMADRU register captures the EA<23:16> of the last table instruction that has been executed. 6.5.4 NVMKEY REGISTER NVMKEY is a write-only register that is used for write protection. To start a programming or an erase sequence, the user must consecutively write 0x55 and 0xAA to the NVMKEY register. Refer to Section 6.6 “Programming Operations” for further details. Note: DS70118G-page 44 Control Registers The user can also directly write to the NVMADR and NVMADRU registers to specify a program memory address for erasing or programming. © 2006 Microchip Technology Inc. dsPIC30F2010 6.6 Programming Operations A complete programming sequence is necessary for programming or erasing the internal Flash in RTSP mode. A programming operation is nominally 2 msec in duration and the processor stalls (waits) until the operation is finished. Setting the WR bit (NVMCON<15>) starts the operation, and the WR bit is automatically cleared when the operation is finished. 6.6.1 4. 5. PROGRAMMING ALGORITHM FOR PROGRAM FLASH The user can erase and program one row of program Flash memory at a time. The general process is: 1. 2. 3. Read one row of program Flash (32 instruction words) and store into data RAM as a data “image”. Update the data image with the desired new data. Erase program Flash row. a) Setup NVMCON register for multi-word, program Flash, erase and set WREN bit. b) Write address of row to be erased into NVMADRU/NVMDR. c) Write ‘55’ to NVMKEY. d) Write ‘AA’ to NVMKEY. e) Set the WR bit. This will begin erase cycle. f) CPU will stall for the duration of the erase cycle. g) The WR bit is cleared when erase cycle ends. EXAMPLE 6-1: 6. Write 32 instruction words of data from data RAM “image” into the program Flash write latches. Program 32 instruction words into program Flash. a) Setup NVMCON register for multi-word, program Flash, program and set WREN bit. b) Write ‘55’ to NVMKEY. c) Write ‘AA’ to NVMKEY. d) Set the WR bit. This will begin program cycle. e) CPU will stall for duration of the program cycle. f) The WR bit is cleared by the hardware when program cycle ends. Repeat steps 1 through 5 as needed to program desired amount of program Flash memory. 6.6.2 ERASING A ROW OF PROGRAM MEMORY Example 6-1 shows a code sequence that can be used to erase a row (32 instructions) of program memory. ERASING A ROW OF PROGRAM MEMORY ; Setup NVMCON for erase operation, multi word ; program memory selected, and writes enabled MOV #0x4041,W0 ; ; MOV W0,NVMCON ; Init pointer to row to be ERASED MOV #tblpage(PROG_ADDR),W0 ; ; MOV W0,NVMADRU MOV #tbloffset(PROG_ADDR),W0 ; MOV W0, NVMADR ; DISI #5 ; ; MOV #0x55,W0 ; MOV W0,NVMKEY MOV #0xAA,W1 ; ; MOV W1,NVMKEY BSET NVMCON,#WR ; NOP ; NOP ; © 2006 Microchip Technology Inc. write Init NVMCON SFR Initialize PM Page Boundary SFR Intialize in-page EA[15:0] pointer Intialize NVMADR SFR Block all interrupts with priority <7 for next 5 instructions Write the 0x55 key Write the 0xAA key Start the erase sequence Insert two NOPs after the erase command is asserted DS70118G-page 45 dsPIC30F2010 6.6.3 LOADING WRITE LATCHES Example 6-2 shows a sequence of instructions that can be used to load the 96 bytes of write latches. 32 TBLWTL and 32 TBLWTH instructions are needed to load the write latches selected by the table pointer. EXAMPLE 6-2: LOADING WRITE LATCHES ; Set up a pointer to the first program memory location to be written ; program memory selected, and writes enabled MOV #0x0000,W0 ; ; Initialize PM Page Boundary SFR MOV W0,TBLPAG MOV #0x6000,W0 ; An example program memory address ; Perform the TBLWT instructions to write the latches ; 0th_program_word MOV #LOW_WORD_0,W2 ; MOV #HIGH_BYTE_0,W3 ; ; Write PM low word into program latch TBLWTL W2,[W0] ; Write PM high byte into program latch TBLWTH W3,[W0++] ; 1st_program_word MOV #LOW_WORD_1,W2 ; MOV #HIGH_BYTE_1,W3 ; ; Write PM low word into program latch TBLWTL W2,[W0] TBLWTH W3,[W0++] ; Write PM high byte into program latch ; 2nd_program_word MOV #LOW_WORD_2,W2 ; MOV #HIGH_BYTE_2,W3 ; ; Write PM low word into program latch TBLWTL W2, [W0] ; Write PM high byte into program latch TBLWTH W3, [W0++] • • • ; 31st_program_word MOV #LOW_WORD_31,W2 ; MOV #HIGH_BYTE_31,W3 ; ; Write PM low word into program latch TBLWTL W2, [W0] ; Write PM high byte into program latch TBLWTH W3, [W0++] Note: In Example 6-2, the contents of the upper byte of W3 has no effect. 6.6.4 INITIATING THE PROGRAMMING SEQUENCE For protection, the write initiate sequence for NVMKEY must be used to allow any erase or program operation to proceed. After the programming command has been executed, the user must wait for the programming time until programming is complete. The two instructions following the start of the programming sequence should be NOPs. EXAMPLE 6-3: INITIATING A PROGRAMMING SEQUENCE DISI #5 MOV MOV MOV MOV BSET NOP NOP #0x55,W0 W0,NVMKEY #0xAA,W1 W1,NVMKEY NVMCON,#WR DS70118G-page 46 ; Block all interrupts with priority <7 ; for next 5 instructions ; ; ; ; ; ; Write the 0x55 key Write the 0xAA key Start the erase sequence Insert two NOPs after the erase command is asserted © 2006 Microchip Technology Inc. © 2006 Microchip Technology Inc. TABLE 6-1: File Name NVMCON NVM REGISTER MAP Addr. Bit 15 Bit 14 Bit 13 Bit 9 Bit 8 Bit 7 0760 WR WREN WRERR Bit 12 Bit 11 Bit 10 — — — — TWRI — Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 PROGOP<6:0> NVMADR<15:0> Bit 1 Bit 0 All RESETS 0000 0000 0000 0000 NVMADR 0762 NVMADRU 0764 — — — — — — — — NVMADR<23:16> 0000 0000 uuuu uuuu NVMKEY 0766 — — — — — — — — KEY<7:0> 0000 0000 0000 0000 uuuu uuuu uuuu uuuu Legend: u = uninitialized bit Note: Refer to “dsPIC30F Family Reference ManuaI” (DS70046) for descriptions of register bit fields. dsPIC30F2010 DS70118G-page 47 dsPIC30F2010 NOTES: DS70118G-page 48 © 2006 Microchip Technology Inc. dsPIC30F2010 7.0 DATA EEPROM MEMORY Note: This data sheet summarizes features of this group of dsPIC30F devices and is not intended to be a complete reference source. For more information on the CPU, peripherals, register descriptions and general device functionality, refer to the “dsPIC30F Family Reference Manual” (DS70046). For more information on the device instruction set and programming, refer to the “dsPIC30F/ 33F Programmer’s Reference Manual” (DS70157). The Data EEPROM Memory is readable and writable during normal operation over the entire VDD range. The data EEPROM memory is directly mapped in the program memory address space. The four SFRs used to read and write the program Flash memory are used to access data EEPROM memory as well. As described in Section 4.0, these registers are: • • • • NVMCON NVMADR NVMADRU NVMKEY The EEPROM data memory allows read and write of single words and 16-word blocks. When interfacing to data memory, NVMADR, in conjunction with the NVMADRU register, is used to address the EEPROM location being accessed. TBLRDL and TBLWTL instructions are used to read and write data EEPROM. The dsPIC30F devices have up to 1 Kbyte of data EEPROM, with an address range from 0x7FFC00 to 0x7FFFFE. A word write operation should be preceded by an erase of the corresponding memory location(s). The write typically requires 2 ms to complete, but the write time will vary with voltage and temperature. © 2006 Microchip Technology Inc. A program or erase operation on the data EEPROM does not stop the instruction flow. The user is responsible for waiting for the appropriate duration of time before initiating another data EEPROM write/erase operation. Attempting to read the data EEPROM while a programming or erase operation is in progress results in unspecified data. Control bit WR initiates write operations, similar to program Flash writes. This bit cannot be cleared, only set, in software. This bit is cleared in hardware at the completion of the write operation. The inability to clear the WR bit in software prevents the accidental or premature termination of a write operation. The WREN bit, when set, will allow a write operation. On power-up, the WREN bit is clear. The WRERR bit is set when a write operation is interrupted by a MCLR Reset, or a WDT Time-out Reset, during normal operation. In these situations, following Reset, the user can check the WRERR bit and rewrite the location. The address register NVMADR remains unchanged. Note: 7.1 Interrupt flag bit NVMIF in the IFS0 register is set when write is complete. It must be cleared in software. Reading the Data EEPROM A TBLRD instruction reads a word at the current program word address. This example uses W0 as a pointer to data EEPROM. The result is placed in register W4, as shown in Example 7-1. EXAMPLE 7-1: MOV MOV MOV TBLRDL DATA EEPROM READ #LOW_ADDR_WORD,W0 ; Init Pointer #HIGH_ADDR_WORD,W1 W1,TBLPAG [ W0 ], W4 ; read data EEPROM DS70118G-page 49 dsPIC30F2010 7.2 7.2.1 Erasing Data EEPROM ERASING A BLOCK OF DATA EEPROM In order to erase a block of data EEPROM, the NVMADRU and NVMADR registers must initially point to the block of memory to be erased. Configure NVMCON for erasing a block of data EEPROM, and set the WR and WREN bits in NVMCON register. Setting the WR bit initiates the erase, as shown in Example 7-2. EXAMPLE 7-2: DATA EEPROM BLOCK ERASE ; Select data EEPROM block, ERASE, WREN bits MOV #4045,W0 MOV W0,NVMCON ; Initialize NVMCON SFR ; Start erase cycle by setting WR after writing key sequence DISI #5 ; Block all interrupts with priority <7 ; for next 5 instructions MOV #0x55,W0 ; ; Write the 0x55 key MOV W0,NVMKEY MOV #0xAA,W1 ; MOV W1,NVMKEY ; Write the 0xAA key BSET NVMCON,#WR ; Initiate erase sequence NOP NOP ; Erase cycle will complete in 2mS. CPU is not stalled for the Data Erase Cycle ; User can poll WR bit, use NVMIF or Timer IRQ to determine erasure complete 7.2.2 ERASING A WORD OF DATA EEPROM The NVMADRU and NVMADR registers must point to the block. Select erase a block of data Flash, and set the WR and WREN bits in NVMCON register. Setting the WR bit initiates the erase, as shown in Example 73. EXAMPLE 7-3: DATA EEPROM WORD ERASE ; Select data EEPROM word, ERASE, WREN bits MOV #4044,W0 MOV W0,NVMCON ; Start erase cycle by setting WR after writing key sequence DISI #5 ; Block all interrupts with priority <7 ; for next 5 instructions MOV #0x55,W0 ; ; Write the 0x55 key MOV W0,NVMKEY MOV #0xAA,W1 ; ; Write the 0xAA key MOV W1,NVMKEY BSET NVMCON,#WR ; Initiate erase sequence NOP NOP ; Erase cycle will complete in 2mS. CPU is not stalled for the Data Erase Cycle ; User can poll WR bit, use NVMIF or Timer IRQ to determine erasure complete DS70118G-page 50 © 2006 Microchip Technology Inc. dsPIC30F2010 7.3 Writing to the Data EEPROM To write an EEPROM data location, the following sequence must be followed: 1. 2. 3. Erase data EEPROM word. a) Select word, data EEPROM, erase and set WREN bit in NVMCON register. b) Write address of word to be erased into NVMADRU/NVMADR. c) Enable NVM interrupt (optional). d) Write ‘55’ to NVMKEY. e) Write ‘AA’ to NVMKEY. f) Set the WR bit. This will begin erase cycle. g) Either poll NVMIF bit or wait for NVMIF interrupt. h) The WR bit is cleared when the erase cycle ends. Write data word into data EEPROM write latches. Program 1 data word into data EEPROM. a) Select word, data EEPROM, program and set WREN bit in NVMCON register. b) Enable NVM write done interrupt (optional). c) Write ‘55’ to NVMKEY. d) Write ‘AA’ to NVMKEY. e) Set The WR bit. This will begin program cycle. f) Either poll NVMIF bit or wait for NVM interrupt. g) The WR bit is cleared when the write cycle ends. EXAMPLE 7-4: The write will not initiate if the above sequence is not exactly followed (write 0x55 to NVMKEY, write 0xAA to NVMCON, then set WR bit) for each word. It is strongly recommended that interrupts be disabled during this code segment. Additionally, the WREN bit in NVMCON must be set to enable writes. This mechanism prevents accidental writes to data EEPROM, due to unexpected code execution. The WREN bit should be kept clear at all times, except when updating the EEPROM. The WREN bit is not cleared by hardware. After a write sequence has been initiated, clearing the WREN bit will not affect the current write cycle. The WR bit will be inhibited from being set unless the WREN bit is set. The WREN bit must be set on a previous instruction. Both WR and WREN cannot be set with the same instruction. At the completion of the write cycle, the WR bit is cleared in hardware and the Nonvolatile Memory Write Complete Interrupt Flag bit (NVMIF) is set. The user may either enable this interrupt, or poll this bit. NVMIF must be cleared by software. 7.3.1 WRITING A WORD OF DATA EEPROM Once the user has erased the word to be programmed, then a table write instruction is used to write one write latch, as shown in Example 7-4. DATA EEPROM WORD WRITE ; Point to data memory MOV #LOW_ADDR_WORD,W0 MOV #HIGH_ADDR_WORD,W1 MOV W1,TBLPAG MOV #LOW(WORD),W2 TBLWTL W2,[ W0] ; The NVMADR captures last table access address ; Select data EEPROM for 1 word op MOV #0x4004,W0 MOV W0,NVMCON ; Operate key to allow write operation DISI #5 MOV MOV MOV MOV BSET NOP NOP ; Write cycle will ; User can poll WR #0x55,W0 W0,NVMKEY #0xAA,W1 W1,NVMKEY NVMCON,#WR ; Init pointer ; Get data ; Write data ; Block all interrupts with priority <7 ; for next 5 instructions ; Write the 0x55 key ; Write the 0xAA key ; Initiate program sequence complete in 2mS. CPU is not stalled for the Data Write Cycle bit, use NVMIF or Timer IRQ to determine write complete © 2006 Microchip Technology Inc. DS70118G-page 51 dsPIC30F2010 7.3.2 WRITING A BLOCK OF DATA EEPROM To write a block of data EEPROM, write to all sixteen latches first, then set the NVMCON register and program the block. EXAMPLE 7-5: 7.4 DATA EEPROM BLOCK WRITE MOV MOV MOV MOV TBLWTL MOV TBLWTL MOV TBLWTL MOV TBLWTL MOV TBLWTL MOV TBLWTL MOV TBLWTL MOV TBLWTL MOV TBLWTL MOV TBLWTL MOV TBLWTL MOV TBLWTL MOV TBLWTL MOV TBLWTL MOV TBLWTL MOV TBLWTL MOV MOV DISI #LOW_ADDR_WORD,W0 #HIGH_ADDR_WORD,W1 W1,TBLPAG #data1,W2 W2,[ W0]++ #data2,W2 W2,[ W0]++ #data3,W2 W2,[ W0]++ #data4,W2 W2,[ W0]++ #data5,W2 W2,[ W0]++ #data6,W2 W2,[ W0]++ #data7,W2 W2,[ W0]++ #data8,W2 W2,[ W0]++ #data9,W2 W2,[ W0]++ #data10,W2 W2,[ W0]++ #data11,W2 W2,[ W0]++ #data12,W2 W2,[ W0]++ #data13,W2 W2,[ W0]++ #data14,W2 W2,[ W0]++ #data15,W2 W2,[ W0]++ #data16,W2 W2,[ W0]++ #0x400A,W0 W0,NVMCON #5 MOV MOV MOV MOV BSET NOP NOP #0x55,W0 W0,NVMKEY #0xAA,W1 W1,NVMKEY NVMCON,#WR ; Init pointer ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; Get 1st data write data Get 2nd data write data Get 3rd data write data Get 4th data write data Get 5th data write data Get 6th data write data Get 7th data write data Get 8th data write data Get 9th data write data Get 10th data write data Get 11th data write data Get 12th data write data Get 13th data write data Get 14th data write data Get 15th data write data Get 16th data write data. The NVMADR captures last table access address. Select data EEPROM for multi word op Operate Key to allow program operation Block all interrupts with priority <7 for next 5 instructions ; Write the 0x55 key ; Write the 0xAA key ; Start write cycle Write Verify Depending on the application, good programming practice may dictate that the value written to the memory should be verified against the original value. This should be used in applications where excessive writes can stress bits near the specification limit. 7.5 Protection Against Spurious Write There are conditions when the device may not want to write to the data EEPROM memory. To protect against spurious EEPROM writes, various mechanisms have been built-in. On power-up, the WREN bit is cleared; also, the Power-up Timer prevents EEPROM write. The write initiate sequence and the WREN bit together help prevent an accidental write during brown-out, power glitch or software malfunction. DS70118G-page 52 © 2006 Microchip Technology Inc. dsPIC30F2010 8.0 I/O PORTS Note: This data sheet summarizes features of this group of dsPIC30F devices and is not intended to be a complete reference source. For more information on the CPU, peripherals, register descriptions and general device functionality, refer to the “dsPIC30F Family Reference Manual” (DS70046). All of the device pins (except VDD, VSS, MCLR and OSC1/CLKI) are shared between the peripherals and the parallel I/O ports. All I/O input ports feature Schmitt Trigger inputs for improved noise immunity. 8.1 Parallel I/O (PIO) Ports When a peripheral is enabled and the peripheral is actively driving an associated pin, the use of the pin as a general purpose output pin is disabled. The I/O pin may be read, but the output driver for the parallel port bit will be disabled. If a peripheral is enabled, but the peripheral is not actively driving a pin, that pin may be driven by a port. All port pins have three registers directly associated with the operation of the port pin. The data direction register (TRISx) determines whether the pin is an input or an output. If the data direction bit is a ‘1’, then the pin FIGURE 8-1: is an input. All port pins are defined as inputs after a Reset. Reads from the latch (LATx), read the latch. Writes to the latch, write the latch (LATx). Reads from the port (PORTx), read the port pins, and writes to the port pins, write the latch (LATx). Any bit and its associated data and control registers that are not valid for a particular device will be disabled. That means the corresponding LATx and TRISx registers and the port pin will read as zeros. When a pin is shared with another peripheral or function that is defined as an input only, it is nevertheless regarded as a dedicated port because there is no other competing source of outputs. An example is the INT4 pin. A parallel I/O (PIO) port that shares a pin with a peripheral is, in general, subservient to the peripheral. The peripheral’s output buffer data and control signals are provided to a pair of multiplexers. The multiplexers select whether the peripheral or the associated port has ownership of the output data and control signals of the I/O pad cell. Figure 8-1 shows how ports are shared with other peripherals, and the associated I/O cell (pad) to which they are connected. Table 8-1 shows the formats of the registers for the shared ports, PORTB through PORTF. BLOCK DIAGRAM OF A SHARED PORT STRUCTURE Output Multiplexers Peripheral Module Peripheral Input Data Peripheral Module Enable I/O Cell Peripheral Output Enable 1 Peripheral Output Data 0 PIO Module 1 Output Enable Output Data 0 Read TRIS I/O Pad Data Bus D WR TRIS CK Q TRIS Latch D WR LAT + WR Port Q CK Data Latch Read LAT Input Data Read Port © 2006 Microchip Technology Inc. DS70118G-page 53 dsPIC30F2010 8.2 Configuring Analog Port Pins The use of the ADPCFG and TRIS registers control the operation of the A/D port pins. The port pins that are desired as analog inputs must have their corresponding TRIS bit set (input). If the TRIS bit is cleared (output), the digital output level (VOH or VOL) will be converted. When reading the PORT register, all pins configured as analog input channel will read as cleared (a low level). Pins configured as digital inputs will not convert an analog input. Analog levels on any pin that is defined as a digital input (including the ANx pins), may cause the input buffer to consume current that exceeds the device specifications. 8.2.1 8.3 Input Change Notification Module The Input Change Notification module provides the dsPIC30F devices the ability to generate interrupt requests to the processor in response to a change-ofstate on selected input pins. This module is capable of detecting input change-of-states even in Sleep mode, when the clocks are disabled. There are up to 22 external signals (CN0 through CN21) that may be selected (enabled) for generating an interrupt request on a change-of-state. I/O PORT WRITE/READ TIMING One instruction cycle is required between a port direction change or port write operation and a read operation of the same port. Typically this instruction would be a NOP. EXAMPLE 8-1: PORT WRITE/READ EXAMPLE MOV 0xFF00, W0; Configure PORTB<15:8> ; as inputs MOV W0, TRISBB; and PORTB<7:0> as outputs NOP ; Delay 1 cycle btssPORTB, #13; Next Instruction DS70118G-page 54 © 2006 Microchip Technology Inc. © 2006 Microchip Technology Inc. TABLE 8-1: SFR Name dsPIC30F2010 PORT REGISTER MAP Addr. Bit 15 Bit 14 Bit 13 Bit 12 Bit 11 Bit 10 Bit 9 Bit 8 Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Reset State TRISB0 0000 0000 0011 1111 TRISB 02C6 — — — — — — — — — — TRISB5 TRISB4 TRISB3 TRISB2 TRISB1 PORTB 02C8 — — — — — — — — — — RB5 RB4 RB3 RB2 RB1 RB0 0000 0000 0000 0000 LATB 02CA — — — — — — — — — — LATB5 LATB4 LATB3 LATB2 LATB1 LATB0 0000 0000 0000 0000 TRISC 02CC TRISC15 TRISC14 TRISC13 — — — — — — — — — — — — — 1110 0000 0000 0000 PORTC 02CE RC15 RC14 RC13 — — — — — — — — — — — — — 0000 0000 0000 0000 LATC 02D0 LATC15 LATC14 LATC13 — — — — — — — — — — — — — 0000 0000 0000 0000 TRISD 02D2 — — — — — — — — — — — — — — TRISD1 TRISD0 0000 0000 0000 0111 PORTD 02D4 — — — — — — — — — — — — — — RD1 RD0 0000 0000 0000 0000 LATD 02D6 — — — — — — — — — — — — — — LATD1 LATD0 0000 0000 0000 0000 0000 0001 0011 1111 TRISE 02D8 — — — — — — — TRISE8 — — TRISE5 TRISE4 TRISE3 TRISE2 TRISE1 TRISE0 PORTE 02DA — — — — — — — RE8 — — RE5 RE4 RE3 RE2 RE1 RE0 0000 0000 0000 0000 LATE 02DC — — — — — — — LATE8 — — LATE5 LATE4 LATE3 LATE2 LATE1 LATE0 0000 0000 0000 0000 TRISF 02DE — — — — — — — — — — — — TRISF3 TRISF2 — — 0000 0000 0000 1100 PORTF 02E0 — — — — — — — — — — — — RF3 RF2 — — 0000 0000 0000 0000 LATF 02E2 — — — — — — — — — — — — LATF3 LATF2 — — 0000 0000 0000 0000 Legend: u = uninitialized bit Note: Refer to “dsPIC30F Family Reference Manual” (DS70046) for descriptions of register bit fields. TABLE 8-2: SFR Name Addr. INPUT CHANGE NOTIFICATION REGISTER MAP (BITS 15-0) Bit 15 Bit 14 Bit 13 Bit 12 Bit 11 Bit 10 Bit 9 Bit 8 Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Reset State 00C0 CN15IE CN14IE CN13IE CN12IE CN11IE CN10IE CN9IE CN8IE CN7IE CN6IE CN5IE CN4IE CN3IE CN2IE CN1IE CN0IE 0000 0000 0000 0000 CNEN2 00C2 — — — — — — — — — — CN21IE CN20IE CN19IE CN18IE CN17IE CN16IE 0000 0000 0000 0000 CNPU1 00C4 CN15PUE CN14PUE CN13PUE CN12PUE CN11PUE CN10PUE CN9PUE CN8PUE CN7PUE CN6PUE CN5PUE CN4PUE CN3PUE CN2PUE CN1PUE CN0PUE 0000 0000 0000 0000 CNPU2 00C6 — — — — — — — — — — CN21PUE CN20PUE CN19PUE CN18PUE CN17PUE CN16PUE 0000 0000 0000 0000 Legend: u = uninitialized bit Note: Refer to “dsPIC30F Family Reference Manual” (DS70046) for descriptions of register bit fields. DS70118G-page 55 dsPIC30F2010 CNEN1 dsPIC30F2010 NOTES: DS70118G-page 56 © 2006 Microchip Technology Inc. dsPIC30F2010 9.0 TIMER1 MODULE Note: This data sheet summarizes features of this group of dsPIC30F devices and is not intended to be a complete reference source. For more information on the CPU, peripherals, register descriptions and general device functionality, refer to the “dsPIC30F Family Reference Manual” (DS70046). This section describes the 16-bit general purpose Timer1 module and associated operational modes. Figure 9-1 depicts the simplified block diagram of the 16-bit Timer1 Module. Note: Timer1 is a ‘Type A’ timer. Please refer to the specifications for a Type A timer in Section 22.0 “Electrical Characteristics” of this document. The following sections provide a detailed description of the operational modes of the timers, including setup and control registers along with associated block diagrams. The Timer1 module is a 16-bit timer which can serve as the time counter for the real-time clock, or operate as a free running interval timer/counter. The 16-bit timer has the following modes: • 16-bit Timer • 16-bit Synchronous Counter • 16-bit Asynchronous Counter Further, the following operational characteristics are supported: • Timer gate operation • Selectable prescaler settings • Timer operation during CPU Idle and Sleep modes • Interrupt on 16-bit period register match or falling edge of external gate signal © 2006 Microchip Technology Inc. These operating modes are determined by setting the appropriate bit(s) in the 16-bit SFR, T1CON. Figure 9-1 presents a block diagram of the 16-bit timer module. 16-bit Timer Mode: In the 16-bit Timer mode, the timer increments on every instruction cycle up to a match value, preloaded into the period register PR1, then resets to ‘0’ and continues to count. When the CPU goes into the Idle mode, the timer will stop incrementing unless the TSIDL (T1CON<13>) bit = 0. If TSIDL = 1, the timer module logic will resume the incrementing sequence upon termination of the CPU Idle mode. 16-bit Synchronous Counter Mode: In the 16-bit Synchronous Counter mode, the timer increments on the rising edge of the applied external clock signal, which is synchronized with the internal phase clocks. The timer counts up to a match value preloaded in PR1, then resets to ‘0’ and continues. When the CPU goes into the Idle mode, the timer will stop incrementing, unless the respective TSIDL bit = 0. If TSIDL = 1, the timer module logic will resume the incrementing sequence upon termination of the CPU Idle mode. 16-bit Asynchronous Counter Mode: In the 16-bit Asynchronous Counter mode, the timer increments on every rising edge of the applied external clock signal. The timer counts up to a match value preloaded in PR1, then resets to ‘0’ and continues. When the timer is configured for the Asynchronous mode of operation and the CPU goes into the Idle mode, the timer will stop incrementing if TSIDL = 1. DS70118G-page 57 dsPIC30F2010 FIGURE 9-1: 16-BIT TIMER1 MODULE BLOCK DIAGRAM (TYPE A TIMER) PR1 Equal Comparator x 16 TSYNC 1 Reset Sync (3) TMR1 0 0 1 Q D Q CK TGATE TCS TGATE T1IF Event Flag TGATE TON SOSCO/ T1CK 1X LPOSCEN SOSCI 9.1 Timer Gate Operation The 16-bit timer can be placed in the Gated Time Accumulation mode. This mode allows the internal TCY to increment the respective timer when the gate input signal (T1CK pin) is asserted high. Control bit TGATE (T1CON<6>) must be set to enable this mode. The timer must be enabled (TON = 1) and the timer clock source set to internal (TCS = 0). When the CPU goes into the Idle mode, the timer will stop incrementing, unless TSIDL = 0. If TSIDL = 1, the timer will resume the incrementing sequence upon termination of the CPU Idle mode. 9.2 TCKPS<1:0> 2 Timer Prescaler The input clock (FOSC/4 or external clock) to the 16-bit Timer, has a prescale option of 1:1, 1:8, 1:64, and 1:256 selected by control bits TCKPS<1:0> (T1CON<5:4>). The prescaler counter is cleared when any of the following occurs: Gate Sync 01 TCY 00 9.3 Prescaler 1, 8, 64, 256 Timer Operation During Sleep Mode During CPU Sleep mode, the timer will operate if: • The timer module is enabled (TON = 1) and • The timer clock source is selected as external (TCS = 1) and • The TSYNC bit (T1CON<2>) is asserted to a logic ‘0’, which defines the external clock source as asynchronous When all three conditions are true, the timer will continue to count up to the period register and be Reset to 0x0000. When a match between the timer and the period register occurs, an interrupt can be generated, if the respective timer interrupt enable bit is asserted. • a write to the TMR1 register • clearing of the TON bit (T1CON<15>) • device Reset such as POR and BOR However, if the timer is disabled (TON = 0), then the timer prescaler cannot be reset since the prescaler clock is halted. TMR1 is not cleared when T1CON is written. It is cleared by writing to the TMR1 register. DS70118G-page 58 © 2006 Microchip Technology Inc. dsPIC30F2010 9.4 9.5.1 Timer Interrupt The 16-bit timer has the ability to generate an interrupt on period match. When the timer count matches the period register, the T1IF bit is asserted and an interrupt will be generated, if enabled. The T1IF bit must be cleared in software. The timer interrupt flag T1IF is located in the IFS0 control register in the Interrupt Controller. When the Gated Time Accumulation mode is enabled, an interrupt will also be generated on the falling edge of the gate signal (at the end of the accumulation cycle). RTC OSCILLATOR OPERATION When the TON = 1, TCS = 1 and TGATE = 0, the timer increments on the rising edge of the 32 kHz LP oscillator output signal, up to the value specified in the period register, and is then Reset to ‘0’. The TSYNC bit must be asserted to a logic ‘0’ (Asynchronous mode) for correct operation. Enabling LPOSCEN (OSCCON<1>) will disable the normal Timer and Counter modes, and enable a timer carry-out wake-up event. Enabling an interrupt is accomplished via the respective timer interrupt enable bit, T1IE. The timer interrupt enable bit is located in the IEC0 control register in the Interrupt Controller. When the CPU enters Sleep mode, the RTC will continue to operate, provided the 32 kHz external crystal oscillator is active and the control bits have not been changed. The TSIDL bit should be cleared to ‘0’ in order for RTC to continue operation in Idle mode. 9.5 9.5.2 Real-Time Clock Timer1, when operating in Real-Time Clock (RTC) mode, provides time-of-day and event time stamping capabilities. Key operational features of the RTC are: • • • • • Operation from 32 kHz LP oscillator 8-bit prescaler Low power Real-Time Clock Interrupts These Operating modes are determined by setting the appropriate bit(s) in the T1CON Control register FIGURE 9-2: RTC INTERRUPTS When an interrupt event occurs, the respective interrupt flag, T1IF, is asserted and an interrupt will be generated, if enabled. The T1IF bit must be cleared in software. The respective Timer interrupt flag, T1IF, is located in the IFS0 status register in the Interrupt Controller. Enabling an interrupt is accomplished via the respective timer interrupt enable bit, T1IE. The Timer interrupt enable bit is located in the IEC0 control register in the Interrupt Controller. RECOMMENDED COMPONENTS FOR TIMER1 LP OSCILLATOR RTC C1 SOSCI 32.768 kHz XTAL dsPIC30FXXXX SOSCO C2 R C1 = C2 = 18 pF; R = 100K © 2006 Microchip Technology Inc. DS70118G-page 59 SFR Name Addr. TMR1 0100 PR1 0102 T1CON 0104 TIMER1 REGISTER MAP Bit 15 Bit 14 Bit 13 Bit 12 Bit 11 Bit 10 Bit 9 Bit 8 Bit 7 Bit 6 Bit 5 Bit 4 Bit 2 Bit 1 Bit 0 Period Register 1 TON — TSIDL — — — — — — TGATE Reset State uuuu uuuu uuuu uuuu 1111 1111 1111 1111 TCKPS1 TCKPS0 Legend: u = uninitialized bit Note: Bit 3 Timer 1 Register Refer to “dsPIC30F Family Reference Manual” (DS70046) for descriptions of register bit fields. — TSYNC TCS — 0000 0000 0000 0000 dsPIC30F2010 DS70118G-page 60 TABLE 9-1: © 2006 Microchip Technology Inc. dsPIC30F2010 10.0 TIMER2/3 MODULE Note: This data sheet summarizes features of this group of dsPIC30F devices and is not intended to be a complete reference source. For more information on the CPU, peripherals, register descriptions and general device functionality, refer to the “dsPIC30F Family Reference Manual” (DS70046). This section describes the 32-bit general purpose Timer module (Timer2/3) and associated operational modes. Figure 10-1 depicts the simplified block diagram of the 32-bit Timer2/3 module. Figure 10-2 and Figure 10-3 show Timer2/3 configured as two independent 16-bit timers; Timer2 and Timer3, respectively. Note: Timer2 is a ‘Type B’ timer and Timer3 is a ‘Type C’ timer. Please refer to the appropriate timer type in Section 22.0 “Electrical Characteristics” of this document. The Timer2/3 module is a 32-bit timer, which can be configured as two 16-bit timers, with selectable operating modes. These timers are utilized by other peripheral modules such as: • Input Capture • Output Compare/Simple PWM The following sections provide a detailed description, including setup and control registers, along with associated block diagrams for the operational modes of the timers. For 32-bit timer/counter operation, Timer2 is the least significant word and Timer3 is the most significant word of the 32-bit timer. Note: For 32-bit timer operation, T3CON control bits are ignored. Only T2CON control bits are used for setup and control. Timer 2 clock and gate inputs are utilized for the 32-bit timer module, but an interrupt is generated with the Timer3 interrupt flag (T3IF), and the interrupt is enabled with the Timer3 interrupt enable bit (T3IE). 16-bit Mode: In the 16-bit mode, Timer2 and Timer3 can be configured as two independent 16-bit timers. Each timer can be set up in either 16-bit Timer mode or 16-bit Synchronous Counter mode. See Section 9.0 “Timer1 Module” for details on these two operating modes. The only functional difference between Timer2 and Timer3 is that Timer2 provides synchronization of the clock prescaler output. This is useful for high frequency external clock inputs. 32-bit Timer Mode: In the 32-bit Timer mode, the timer increments on every instruction cycle up to a match value, preloaded into the combined 32-bit period register PR3/PR2, then resets to ‘0’ and continues to count. The 32-bit timer has the following modes: For synchronous 32-bit reads of the Timer2/Timer3 pair, reading the least significant word (TMR2 register) will cause the most significant word (msw) to be read and latched into a 16-bit holding register, termed TMR3HLD. • Two independent 16-bit timers (Timer2 and Timer3) with all 16-bit operating modes (except Asynchronous Counter mode) • Single 32-bit Timer operation • Single 32-bit Synchronous Counter For synchronous 32-bit writes, the holding register (TMR3HLD) must first be written to. When followed by a write to the TMR2 register, the contents of TMR3HLD will be transferred and latched into the MSB of the 32-bit timer (TMR3). Further, the following operational characteristics are supported: 32-bit Synchronous Counter Mode: In the 32-bit Synchronous Counter mode, the timer increments on the rising edge of the applied external clock signal, which is synchronized with the internal phase clocks. The timer counts up to a match value preloaded in the combined 32-bit period register PR3/PR2, then resets to ‘0’ and continues. • • • • • ADC Event Trigger Timer Gate Operation Selectable Prescaler Settings Timer Operation during Idle and Sleep modes Interrupt on a 32-bit Period Register Match These operating modes are determined by setting the appropriate bit(s) in the 16-bit T2CON and T3CON SFRs. © 2006 Microchip Technology Inc. When the timer is configured for the Synchronous Counter mode of operation and the CPU goes into the Idle mode, the timer will stop incrementing, unless the TSIDL (T2CON<13>) bit = ‘0’. If TSIDL = ‘1’, the timer module logic will resume the incrementing sequence upon termination of the CPU Idle mode. DS70118G-page 61 dsPIC30F2010 FIGURE 10-1: 32-BIT TIMER2/3 BLOCK DIAGRAM Data Bus<15:0> TMR3HLD 16 16 Write TMR2 Read TMR2 16 Reset TMR3 TMR2 MSB LSB Sync ADC Event Trigger Equal Comparator x 32 PR3 PR2 0 T3IF Event Flag 1 D Q CK TGATE(T2CON<6>) TCS TGATE TGATE (T2CON<6>) Q TON T2CK Note: TCKPS<1:0> 2 1X Gate Sync 01 TCY 00 Prescaler 1, 8, 64, 256 Timer Configuration bit T32, T2CON(<3>) must be set to 1 for a 32-bit timer/counter operation. All control bits are respective to the T2CON register. DS70118G-page 62 © 2006 Microchip Technology Inc. dsPIC30F2010 FIGURE 10-2: 16-BIT TIMER2 BLOCK DIAGRAM (TYPE B TIMER) PR2 Equal Reset Comparator x 16 TMR2 Sync 0 T2IF Event Flag Q D Q CK TGATE TCS TGATE 1 TGATE TON T2CK TCKPS<1:0> 2 1X FIGURE 10-3: Gate Sync 01 TCY 00 Prescaler 1, 8, 64, 256 16-BIT TIMER3 BLOCK DIAGRAM (TYPE C TIMER) PR3 ADC Event Trigger Equal Reset TMR3 0 1 Q D Q CK TGATE Sync See NOTE TON TCKPS<1:0> 2 1 X 0 1 TCY Note: TGATE TCS TGATE T3IF Event Flag Comparator x 16 Prescaler 1, 8, 64, 256 0 0 The dsPIC30F2010 does not have an external pin input to TIMER3. The following modes should not be used: 1. TCS = 1 2. TCS = 0 and TGATE = 1 (gated time accumulation) © 2006 Microchip Technology Inc. DS70118G-page 63 dsPIC30F2010 10.1 Timer Gate Operation The 32-bit timer can be placed in the Gated Time Accumulation mode. This mode allows the internal TCY to increment the respective timer when the gate input signal (T2CK pin) is asserted high. Control bit TGATE (T2CON<6>) must be set to enable this mode. When in this mode, Timer2 is the originating clock source. The TGATE setting is ignored for Timer3. The timer must be enabled (TON = 1) and the timer clock source set to internal (TCS = 0). The falling edge of the external signal terminates the count operation, but does not reset the timer. The user must reset the timer in order to start counting from zero. 10.2 ADC Event Trigger When a match occurs between the 32-bit timer (TMR3/ TMR2) and the 32-bit combined period register (PR3/ PR2), a special ADC trigger event signal is generated by Timer3. 10.3 10.4 Timer Operation During Sleep Mode During CPU Sleep mode, the timer will not operate, because the internal clocks are disabled. 10.5 Timer Interrupt The 32-bit timer module can generate an interrupt on period match, or on the falling edge of the external gate signal. When the 32-bit timer count matches the respective 32-bit period register, or the falling edge of the external “gate” signal is detected, the T3IF bit (IFS0<7>) is asserted and an interrupt will be generated if enabled. In this mode, the T3IF interrupt flag is used as the source of the interrupt. The T3IF bit must be cleared in software. Enabling an interrupt is accomplished via the respective timer interrupt enable bit, T3IE (IEC0<7>). Timer Prescaler The input clock (FOSC/4 or external clock) to the timer has a prescale option of 1:1, 1:8, 1:64, and 1:256 selected by control bits TCKPS<1:0> (T2CON<5:4> and T3CON<5:4>). For the 32-bit timer operation, the originating clock source is Timer2. The prescaler operation for Timer3 is not applicable in this mode. The prescaler counter is cleared when any of the following occurs: • a write to the TMR2/TMR3 register • clearing either of the TON (T2CON<15> or T3CON<15>) bits to ‘0’ • device Reset such as POR and BOR However, if the timer is disabled (TON = 0), then the Timer 2 prescaler cannot be reset, since the prescaler clock is halted. TMR2/TMR3 is not cleared when T2CON/T3CON is written. DS70118G-page 64 © 2006 Microchip Technology Inc. © 2006 Microchip Technology Inc. TABLE 10-1: TIMER2/3 REGISTER MAP SFR Name Addr. Bit 15 Bit 14 Bit 13 Bit 12 Bit 11 Bit 10 Bit 9 Bit 8 Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Reset State TMR2 0106 Timer2 Register uuuu uuuu uuuu uuuu TMR3HLD 0108 Timer3 Holding Register (For 32-bit timer operations only) uuuu uuuu uuuu uuuu TMR3 010A Timer3 Register uuuu uuuu uuuu uuuu PR2 010C Period Register 2 1111 1111 1111 1111 PR3 010E Period Register 3 T2CON 0110 TON — TSIDL — — — — — — TGATE TCKPS1 TCKPS0 T32 — TCS — 0000 0000 0000 0000 T3CON 0112 TON — TSIDL — — — — — — TGATE TCKPS1 TCKPS0 — — TCS — 0000 0000 0000 0000 1111 1111 1111 1111 Legend: u = uninitialized bit Note: Refer to “dsPIC30F Family Reference Manual” (DS70046) for descriptions of register bit fields. dsPIC30F2010 DS70118G-page 65 dsPIC30F2010 NOTES: DS70118G-page 66 © 2006 Microchip Technology Inc. dsPIC30F2010 11.0 INPUT CAPTURE MODULE The key operational features of the Input Capture module are: Note: This data sheet summarizes features of this group of dsPIC30F devices and is not intended to be a complete reference source. For more information on the CPU, peripherals, register descriptions and general device functionality, refer to the “dsPIC30F Family Reference Manual” (DS70046). • Simple Capture Event mode • Timer2 and Timer3 mode selection • Interrupt on input capture event These operating modes are determined by setting the appropriate bits in the ICxCON register (where x = 1,2,...,N). The dsPIC DSC devices contain up to 8 capture channels, (i.e., the maximum value of N is 8). This section describes the Input Capture module and associated operational modes. The features provided by this module are useful in applications requiring Frequency (Period) and Pulse measurement. Figure 11-1 depicts a block diagram of the Input Capture module. Input capture is useful for such modes as: Note: • Frequency/Period/Pulse Measurements • Additional sources of External Interrupts FIGURE 11-1: The dsPIC30F2010 device has four capture inputs – IC1, IC2, IC7 and IC8. The naming of these four capture channels is intentional and preserves software compatibility with other dsPIC DSC devices. INPUT CAPTURE MODE BLOCK DIAGRAM T3_CNT From General Purpose Timer Module T2_CNT 16 ICx Pin 16 ICTMR 1 Prescaler 1, 4, 16 3 Edge Detection Logic Clock Synchronizer 0 FIFO R/W Logic ICM<2:0> Mode Select ICxBUF ICBNE, ICOV ICI<1:0> ICxCON Data Bus Note: Interrupt Logic Set Flag ICxIF Where ‘x’ is shown, reference is made to the registers or bits associated to the respective input capture channels 1 through N. © 2006 Microchip Technology Inc. DS70118G-page 67 dsPIC30F2010 11.1 Simple Capture Event Mode The simple capture events in the dsPIC30F product family are: • • • • • Capture every falling edge Capture every rising edge Capture every 4th rising edge Capture every 16th rising edge Capture every rising and falling edge These simple Input Capture modes are configured by setting the appropriate bits ICM<2:0> (ICxCON<2:0>). 11.1.1 CAPTURE PRESCALER There are four input capture prescaler settings, specified by bits ICM<2:0> (ICxCON<2:0>). Whenever the capture channel is turned off, the prescaler counter will be cleared. In addition, any Reset will clear the prescaler counter. 11.1.2 CAPTURE BUFFER OPERATION Each capture channel has an associated FIFO buffer, which is four 16-bit words deep. There are two status flags, which provide status on the FIFO buffer: 11.1.3 TIMER2 AND TIMER3 SELECTION MODE The input capture module consists of up to 8 input capture channels. Each channel can select between one of two timers for the time base, Timer2 or Timer3. Selection of the timer resource is accomplished through SFR bit ICTMR (ICxCON<7>). Timer3 is the default timer resource available for the input capture module. 11.1.4 HALL SENSOR MODE When the input capture module is set for capture on every edge, rising and falling, ICM<2:0> = 001, the following operations are performed by the input capture logic: • The input capture interrupt flag is set on every edge, rising and falling. • The interrupt on Capture mode setting bits, ICI<1:0>, is ignored, since every capture generates an interrupt. • A capture overflow condition is not generated in this mode. • ICBNE – Input Capture Buffer Not Empty • ICOV – Input Capture Overflow The ICBFNE will be set on the first input capture event and remain set until all capture events have been read from the FIFO. As each word is read from the FIFO, the remaining words are advanced by one position within the buffer. In the event that the FIFO is full with four capture events and a fifth capture event occurs prior to a read of the FIFO, an overflow condition will occur and the ICOV bit will be set to a logic ‘1’. The fifth capture event is lost and is not stored in the FIFO. No additional events will be captured until all four events have been read from the buffer. If a FIFO read is performed after the last read and no new capture event has been received, the read will yield indeterminate results. DS70118G-page 68 © 2006 Microchip Technology Inc. dsPIC30F2010 11.2 Input Capture Operation During Sleep and Idle Modes An input capture event will generate a device wake-up or interrupt, if enabled, if the device is in CPU Idle or Sleep mode. Independent of the timer being enabled, the input capture module will wake-up from the CPU Sleep or Idle mode when a capture event occurs, if ICM<2:0> = 111 and the interrupt enable bit is asserted. The same wake-up can generate an interrupt, if the conditions for processing the interrupt have been satisfied. The wake-up feature is useful as a method of adding extra external pin interrupts. 11.2.1 INPUT CAPTURE IN CPU SLEEP MODE CPU Sleep mode allows input capture module operation with reduced functionality. In the CPU Sleep mode, the ICI<1:0> bits are not applicable, and the input capture module can only function as an external interrupt source. The capture module must be configured for interrupt only on the rising edge (ICM<2:0> = 111), in order for the input capture module to be used while the device is in Sleep mode. The prescale settings of 4:1 or 16:1 are not applicable in this mode. © 2006 Microchip Technology Inc. 11.2.2 INPUT CAPTURE IN CPU IDLE MODE CPU Idle mode allows input capture module operation with full functionality. In the CPU Idle mode, the interrupt mode selected by the ICI<1:0> bits are applicable, as well as the 4:1 and 16:1 capture prescale settings, which are defined by control bits ICM<2:0>. This mode requires the selected timer to be enabled. Moreover, the ICSIDL bit must be asserted to a logic ‘0’. If the input capture module is defined as ICM<2:0> = 111 in CPU Idle mode, the input capture pin will serve only as an external interrupt pin. 11.3 Input Capture Interrupts The input capture channels have the ability to generate an interrupt, based upon the selected number of capture events. The selection number is set by control bits ICI<1:0> (ICxCON<6:5>). Each channel provides an interrupt flag (ICxIF) bit. The respective capture channel interrupt flag is located in the corresponding IFSx status register. Enabling an interrupt is accomplished via the respective capture channel interrupt enable (ICxIE) bit. The capture interrupt enable bit is located in the corresponding IEC Control register. DS70118G-page 69 SFR Name Addr. IC1BUF 0140 IC1CON 0142 IC2BUF 0144 IC2CON 0146 IC3BUF 0148 IC3CON 014A IC4BUF 014C IC4CON 014E IC5BUF 0150 IC5CON 0152 IC6BUF 0154 IC6CON 0156 IC7BUF 0158 IC7CON 015A IC8BUF 015C IC8CON 015E INPUT CAPTURE REGISTER MAP Bit 15 Bit 14 Bit 13 Bit 12 Bit 11 Bit 10 Bit 9 Bit 8 Bit 7 Bit 6 Bit 5 Bit 3 Bit 2 Bit 1 Input 1 Capture Register — — ICSIDL — — — — — — ICSIDL — — — — — ICTMR ICI<1:0> ICOV ICBNE ICM<2:0> ICI<1:0> ICOV ICBNE ICM<2:0> ICTMR — ICSIDL — — — — — — ICSIDL — — — — — ICTMR ICI<1:0> ICOV ICBNE ICM<2:0> ICI<1:0> ICOV ICBNE ICM<2:0> ICTMR — ICSIDL — — — — — — ICSIDL — — — — — ICTMR ICI<1:0> ICOV ICBNE ICM<2:0> ICI<1:0> ICOV ICBNE ICM<2:0> ICTMR — ICSIDL — — — — — ICTMR ICI<1:0> ICOV ICBNE ICM<2:0> — ICSIDL — — — — — ICTMR 0000 0000 0000 0000 0000 0000 0000 0000 uuuu uuuu uuuu uuuu Input 8 Capture Register — 0000 0000 0000 0000 uuuu uuuu uuuu uuuu Input 7 Capture Register — 0000 0000 0000 0000 uuuu uuuu uuuu uuuu Input 6 Capture Register — 0000 0000 0000 0000 uuuu uuuu uuuu uuuu Input 5 Capture Register — 0000 0000 0000 0000 uuuu uuuu uuuu uuuu Input 4 Capture Register — 0000 0000 0000 0000 uuuu uuuu uuuu uuuu Input 3 Capture Register — Reset State uuuu uuuu uuuu uuuu Input 2 Capture Register — Bit 0 uuuu uuuu uuuu uuuu ICI<1:0> Legend: u = uninitialized bit Note: Bit 4 Refer to “dsPIC30F Family Reference Manual” (DS70046) for descriptions of register bit fields. ICOV ICBNE ICM<2:0> 0000 0000 0000 0000 dsPIC30F2010 DS70118G-page 70 TABLE 11-1: © 2006 Microchip Technology Inc. dsPIC30F2010 12.0 OUTPUT COMPARE MODULE The key operational features of the Output Compare module include: Note: This data sheet summarizes features of this group of dsPIC30F devices and is not intended to be a complete reference source. For more information on the CPU, peripherals, register descriptions and general device functionality, refer to the “dsPIC30F Family Reference Manual” (DS70046). This section describes the Output Compare module and associated operational modes. The features provided by this module are useful in applications requiring operational modes such as: • Generation of Variable Width Output Pulses • Power Factor Correction Figure 12-1 depicts a block diagram of the Output Compare module. FIGURE 12-1: • • • • • • Timer2 and Timer3 Selection mode Simple Output Compare Match mode Dual Output Compare Match mode Simple PWM mode Output Compare during Sleep and Idle modes Interrupt on Output Compare/PWM Event These operating modes are determined by setting the appropriate bits in the 16-bit OCxCON SFR (where x = 1 and 2). OCxRS and OCxR in the figure represent the Dual Compare registers. In the Dual Compare mode, the OCxR register is used for the first compare and OCxRS is used for the second compare. OUTPUT COMPARE MODE BLOCK DIAGRAM Set Flag bit OCxIF OCxRS Output Logic OCxR 3 OCM<2:0> Mode Select Comparator S Q R OCx Output Enable OCFA (for x = 1 and 2) 0 From General Purpose Timer Module TMR2<15:0> Note: 1 OCTSEL TMR3<15:0> 0 T2P2_MATCH 1 T3P3_MATCH Where ‘x’ is shown, reference is made to the registers associated with the respective output compare channels 1and 2. © 2006 Microchip Technology Inc. DS70118G-page 71 dsPIC30F2010 12.1 Timer2 and Timer3 Selection Mode Each output compare channel can select between one of two 16-bit timers: Timer2 or Timer3. The selection of the timers is controlled by the OCTSEL bit (OCxCON<3>). Timer2 is the default timer resource for the Output Compare module. 12.2 Simple Output Compare Match Mode When control bits OCM<2:0> (OCxCON<2:0>) = 001, 010 or 011, the selected output compare channel is configured for one of three simple Output Compare Match modes: • Compare forces I/O pin low • Compare forces I/O pin high • Compare toggles I/O pin Dual Output Compare Match Mode When control bits OCM<2:0> (OCxCON<2:0>) = 100 or 101, the selected output compare channel is configured for one of two Dual Output Compare modes, which are: • Single Output Pulse mode • Continuous Output Pulse mode 12.3.1 For the user to configure the module for the generation of a single output pulse, the following steps are required (assuming timer is off): TCY. • Determine instruction cycle time • Calculate desired pulse width value based on TCY. • Calculate time to start pulse from timer start value of 0x0000. • Write pulse width start and stop times into OCxR and OCxRS compare registers (x denotes channel 1, 2). • Set timer period register to value equal to, or greater than, value in OCxRS compare register. • Set OCM<2:0> = 100. • Enable timer, TON (TxCON<15>) = 1. To initiate another single pulse, issue another write to set OCM<2:0> = 100. DS70118G-page 72 • Determine instruction cycle time TCY. • Calculate desired pulse value based on TCY. • Calculate timer to start pulse width from timer start value of 0x0000. • Write pulse width start and stop times into OCxR and OCxRS (x denotes channel 1, 2) compare registers, respectively. • Set timer period register to value equal to, or greater than, value in OCxRS compare register. • Set OCM<2:0> = 101. • Enable timer, TON (TxCON<15>) = 1. Simple PWM Mode When control bits OCM<2:0> (OCxCON<2:0>) = 110 or 111, the selected output compare channel is configured for the PWM mode of operation. When configured for the PWM mode of operation, OCxR is the main latch (read-only) and OCxRS is the secondary latch. This enables glitchless PWM transitions. The user must perform the following steps in order to configure the output compare module for PWM operation: 1. 2. 3. SINGLE PULSE MODE CONTINUOUS PULSE MODE For the user to configure the module for the generation of a continuous stream of output pulses, the following steps are required: 12.4 The OCxR register is used in these modes. The OCxR register is loaded with a value and is compared to the selected incrementing timer count. When a compare occurs, one of these Compare Match modes occurs. If the counter resets to zero before reaching the value in OCxR, the state of the OCx pin remains unchanged. 12.3 12.3.2 4. Set the PWM period by writing to the appropriate period register. Set the PWM duty cycle by writing to the OCxRS register. Configure the output compare module for PWM operation. Set the TMRx prescale value and enable the Timer, TON (TxCON<15>) = 1. 12.4.1 INPUT PIN FAULT PROTECTION FOR PWM When control bits OCM<2:0> (OCxCON<2:0>) = 111, the selected output compare channel is again configured for the PWM mode of operation, with the additional feature of input fault protection. While in this mode, if a logic ‘0’ is detected on the OCFA/B pin, the respective PWM output pin is placed in the high-impedance input state. The OCFLT bit (OCxCON<4>) indicates whether a Fault condition has occurred. This state will be maintained until both of the following events have occurred: • The external Fault condition has been removed. • The PWM mode has been re-enabled by writing to the appropriate control bits. © 2006 Microchip Technology Inc. dsPIC30F2010 12.4.2 PWM PERIOD 12.5 The PWM period is specified by writing to the PRx register. The PWM period can be calculated using Equation 12-1. EQUATION 12-1: PWM PERIOD PWM period = [(PRx) + 1] • 4 • TOSC • (TMRx prescale value) PWM frequency is defined as 1 / [PWM period]. When the selected TMRx is equal to its respective period register, PRx, the following four events occur on the next increment cycle: • TMRx is cleared. • The OCx pin is set. - Exception 1: If PWM duty cycle is 0x0000, the OCx pin will remain low. - Exception 2: If duty cycle is greater than PRx, the pin will remain high. • The PWM duty cycle is latched from OCxRS into OCxR. • The corresponding timer interrupt flag is set. Output Compare Operation During CPU Sleep Mode When the CPU enters the Sleep mode, all internal clocks are stopped. Therefore, when the CPU enters the Sleep state, the output compare channel will drive the pin to the active state that was observed prior to entering the CPU Sleep state. For example, if the pin was high when the CPU entered the Sleep state, the pin will remain high. Likewise, if the pin was low when the CPU entered the Sleep state, the pin will remain low. In either case, the output compare module will resume operation when the device wakes up. 12.6 Output Compare Operation During CPU Idle Mode When the CPU enters the Idle mode, the output compare module can operate with full functionality. The output compare channel will operate during the CPU Idle mode if the OCSIDL bit (OCxCON<13>) is at logic ’0’ and the selected time base (Timer2 or Timer3) is enabled and the TSIDL bit of the selected timer is set to logic ‘0’. See Figure 12-1 for key PWM period comparisons. Timer3 is referred to in the figure for clarity. FIGURE 12-1: PWM OUTPUT TIMING Period Duty Cycle TMR3 = PR3 T3IF = 1 (Interrupt Flag) OCxR = OCxRS 12.7 TMR3 = PR3 T3IF = 1 (Interrupt Flag) OCxR = OCxRS TMR3 = Duty Cycle (OCxR) TMR3 = Duty Cycle (OCxR) Output Compare Interrupts The output compare channels have the ability to generate an interrupt on a compare match, for whichever Match mode has been selected. For all modes except the PWM mode, when a compare event occurs, the respective interrupt flag (OCxIF) is asserted and an interrupt will be generated, if enabled. The OCxIF bit is located in the corresponding IFS status register, and must be cleared in software. The interrupt is enabled via the respective compare interrupt enable (OCxIE) bit, located in the corresponding IEC Control register. © 2006 Microchip Technology Inc. For the PWM mode, when an event occurs, the respective timer interrupt flag (T2IF or T3IF) is asserted and an interrupt will be generated, if enabled. The IF bit is located in the IFS0 status register, and must be cleared in software. The interrupt is enabled via the respective timer interrupt enable bit (T2IE or T3IE), located in the IEC0 Control register. The output compare interrupt flag is never set during the PWM mode of operation. DS70118G-page 73 OUTPUT COMPARE REGISTER MAP SFR Name Addr. OC1RS 0180 Output Compare 1 Master Register OC1R 0182 Output Compare 1 Slave Register OC1CON 0184 OC2RS 0186 OC2R 0188 OC2CON 018A Bit 15 — Bit 14 Bit 13 OCFRZ OCSIDL Bit 12 — Bit 11 — Bit 10 — Bit 9 — Bit 8 — Bit 7 — Bit 6 — Bit 5 Bit 4 Bit 2 Bit 1 — OCFLT1 OCTSEL1 OCM<2:0> — — — — — — — 0000 0000 0000 0000 0000 0000 0000 0000 Output Compare 2 Slave Register OCFRZ OCSIDL Reset State 0000 0000 0000 0000 Output Compare 2 Master Register — Bit 0 0000 0000 0000 0000 0000 0000 0000 0000 — OCFLT2 OCTSEL2 Legend: u = uninitialized bit Note: Bit 3 Refer to “dsPIC30F Family Reference Manual” (DS70046) for descriptions of register bit fields. OCM<2:0> 0000 0000 0000 0000 dsPIC30F2010 DS70118G-page 74 TABLE 12-1: © 2006 Microchip Technology Inc. dsPIC30F2010 13.0 QUADRATURE ENCODER INTERFACE (QEI) MODULE The Quadrature Encoder Interface (QEI) is a key feature requirement for several motor control applications, such as Switched Reluctance (SR) and AC Induction Motor (ACIM). The operational features of the QEI are, but not limited to: Note: This data sheet summarizes features of this group of dsPIC30F devices and is not intended to be a complete reference source. For more information on the CPU, peripherals, register descriptions and general device functionality, refer to the “dsPIC30F Family Reference Manual” (DS70046). • Three input channels for two phase signals and index pulse • 16-bit up/down position counter • Count direction status • Position Measurement (x2 and x4) mode • Programmable digital noise filters on inputs • Alternate 16-bit Timer/Counter mode • Quadrature Encoder Interface interrupts This section describes the Quadrature Encoder Interface (QEI) module and associated operational modes. The QEI module provides the interface to incremental encoders for obtaining motor positioning data. Incremental encoders are very useful in motor control applications. These operating modes are determined by setting the appropriate bits QEIM<2:0> (QEICON<10:8>). Figure 13-1 depicts the Quadrature Encoder Interface block diagram. FIGURE 13-1: QUADRATURE ENCODER INTERFACE BLOCK DIAGRAM TQCKPS<1:0> Sleep Input TQCS TCY Synchronize 0 Det 1 2 Prescaler 1, 8, 64, 256 1 QEIM<2:0> 0 TQGATE QEA Programmable Digital Filter UPDN_SRC 0 QEICON<11> 2 Quadrature Encoder Interface Logic QEB Programmable Digital Filter INDX Programmable Digital Filter Q CK Q QEIIF Event Flag 16-bit Up/Down Counter (POSCNT) Reset Comparator/ Zero Detect Equal 3 QEIM<2:0> Mode Select 1 D Max Count Register (MAXCNT) 3 © 2006 Microchip Technology Inc. DS70118G-page 75 dsPIC30F2010 13.1 Quadrature Encoder Interface Logic A typical incremental (a.k.a. optical) encoder has three outputs: Phase A, Phase B, and an index pulse. These signals are useful and often required in position and speed control of ACIM and SR motors. The two channels, Phase A (QEA) and Phase B (QEB), have a unique relationship. If Phase A leads Phase B, then the direction (of the motor) is deemed positive or forward. If Phase A lags Phase B, then the direction (of the motor) is deemed negative or reverse. A third channel, termed index pulse, occurs once per revolution and is used as a reference to establish an absolute position. The index pulse coincides with Phase A and Phase B, both low. 13.2 16-bit Up/Down Position Counter Mode The 16-bit Up/Down Counter counts up or down on every count pulse, which is generated by the difference of the Phase A and Phase B input signals. The counter acts as an integrator, whose count value is proportional to position. The direction of the count is determined by the UPDN signal, which is generated by the Quadrature Encoder Interface Logic. 13.2.1 POSITION COUNTER ERROR CHECKING Position count error checking in the QEI is provided for and indicated by the CNTERR bit (QEICON<15>). The error checking only applies when the position counter is configured for Reset on the Index Pulse modes (QEIM<2:0> = ‘110’ or ‘100’). In these modes, the contents of the POSCNT register is compared with the values (0xFFFF or MAXCNT + 1, depending on direction). If these values are detected, an error condition is generated by setting the CNTERR bit and a QEI count error interrupt is generated. The QEI count error interrupt can be disabled by setting the CEID bit (DFLTCON<8>). The position counter continues to count encoder edges after an error has been detected. The POSCNT register continues to count up/down until a natural rollover/underflow. No interrupt is generated for the natural rollover/underflow event. The CNTERR bit is a read/write bit and reset in software by the user. DS70118G-page 76 13.2.2 POSITION COUNTER RESET The Position Counter Reset Enable bit, POSRES (QEI<2>) controls whether the position counter is reset when the index pulse is detected. This bit is only applicable when QEIM<2:0> = ‘100’ or ‘110’. If the POSRES bit is set to ‘1’, then the position counter is reset when the index pulse is detected. If the POSRES bit is set to ‘0’, then the position counter is not reset when the index pulse is detected. The position counter will continue counting up or down, and will be reset on the rollover or underflow condition. When selecting the INDX signal to reset the position counter (POSCNT), the user has to specify the states on QEA and QEB input pins. These states have to be matched in order for a reset to occur. These states are selected by the IMV<1:0> bit in the DFLTCON <10:9> register. The IMV<1:0> (Index Match Value) bit allows the user to specify the state of the QEA and QEB input pins during an index pulse when the POSCNT register is to be reset. In 4X Quadrature Count Mode: IMV1 = Required state of phase B input signal for match on index pulse IMV0 = Required state of phase A input signal for match on index pulse In 2X Quadrature Count Mode: IMV1 = Selects phase input signal for index state match (0 = Phase A, 1 = Phase B) IMV0 = Required state of the selected phase input signal for match on index pulse The interrupt is still generated on the detection of the index pulse and not on the position counter overflow/ underflow. 13.2.3 COUNT DIRECTION STATUS As mentioned in the previous section, the QEI logic generates an UPDN signal, based upon the relationship between Phase A and Phase B. In addition to the output pin, the state of this internal UPDN signal is supplied to a SFR bit UPDN (QEICON<11>) as a readonly bit. Note: QEI pins are multiplexed with analog inputs. User must insure that all QEI associated pins are set as digital inputs in the ADPCFG register. © 2006 Microchip Technology Inc. dsPIC30F2010 13.3 Position Measurement Mode There are two Measurement modes which are supported and are termed x2 and x4. These modes are selected by the QEIM<2:0> mode select bits located in SFR QEICON<10:8>. When control bits QEIM<2:0> = 100 or 101, the x2 Measurement mode is selected and the QEI logic only looks at the Phase A input for the position counter increment rate. Every rising and falling edge of the Phase A signal causes the position counter to be incremented or decremented. The Phase B signal is still utilized for the determination of the counter direction, just as in the x4 mode. Within the x2 Measurement mode, there are two variations of how the position counter is reset: 1. 2. Position counter reset by detection of index pulse, QEIM<2:0> = 100. Position counter reset by match with MAXCNT, QEIM<2:0> = 101. When control bits QEIM<2:0> = 110 or 111, the x4 Measurement mode is selected and the QEI logic looks at both edges of the Phase A and Phase B input signals. Every edge of both signals causes the position counter to increment or decrement. Within the x4 Measurement mode, there are two variations of how the position counter is reset: 1. 2. Position counter reset by detection of index pulse, QEIM<2:0> = 110. Position counter reset by match with MAXCNT, QEIM<2:0> = 111. The x4 Measurement mode provides for finer resolution data (more position counts) for determining motor position. 13.4 13.5 When the QEI module is not configured for the QEI mode QEIM<2:0> = 001, the module can be configured as a simple 16-bit timer/counter. The setup and control of the auxiliary timer is accomplished through the QEICON SFR register. This timer functions identically to Timer1. The QEA pin is used as the timer clock input. When configured as a timer, the POSCNT register serves as the Timer Count Register and the MAXCNT register serves as the Period Register. When a timer/ period register match occur, the QEI interrupt flag will be asserted. The only exception between the general purpose timers and this timer is the added feature of external Up/ Down input select. When the UPDN pin is asserted high, the timer will increment up. When the UPDN pin is asserted low, the timer will be decremented. Note: The filter ensures that the filtered output signal is not permitted to change until a stable value has been registered for three consecutive clock cycles. For the QEA, QEB and INDX pins, the clock divide frequency for the digital filter is programmed by bits QECK<2:0> (DFLTCON<6:4>) and are derived from the base instruction cycle TCY. Changing the Operational mode (i.e., from QEI to Timer or vice versa), will not affect the Timer/Position Count Register contents. The UPDN control/status bit (QEICON<11>) can be used to select the count direction state of the Timer register. When UPDN = 1, the timer will count up. When UPDN = 0, the timer will count down. In addition, control bit UPDN_SRC (QEICON<0>) determines whether the timer count direction state is based on the logic state, written into the UPDN control/ status bit (QEICON<11>), or the QEB pin state. When UPDN_SRC = 1, the timer count direction is controlled from the QEB pin. Likewise, when UPDN_SRC = 0, the timer count direction is controlled by the UPDN bit. Note: Programmable Digital Noise Filters The digital noise filter section is responsible for rejecting noise on the incoming capture or quadrature signals. Schmitt Trigger inputs and a three-clock cycle delay filter combine to reject low level noise and large, short duration noise spikes that typically occur in noise prone applications, such as a motor system. Alternate 16-bit Timer/Counter 13.6 13.6.1 This Timer does not support the External Asynchronous Counter mode of operation. If using an external clock source, the clock will automatically be synchronized to the internal instruction cycle. QEI Module Operation During CPU Sleep Mode QEI OPERATION DURING CPU SLEEP MODE The QEI module will be halted during the CPU Sleep mode. 13.6.2 TIMER OPERATION DURING CPU SLEEP MODE During CPU Sleep mode, the timer will not operate, because the internal clocks are disabled. To enable the filter output for channels QEA, QEB and INDX, the QEOUT bit must be ‘1’. The filter network for all channels is disabled on POR and BOR. © 2006 Microchip Technology Inc. DS70118G-page 77 dsPIC30F2010 13.7 QEI Module Operation During CPU Idle Mode Since the QEI module can function as a quadrature encoder interface, or as a 16-bit timer, the following section describes operation of the module in both modes. 13.7.1 QEI OPERATION DURING CPU IDLE MODE When the CPU is placed in the Idle mode, the QEI module will operate if the QEISIDL bit (QEICON<13>) = 0. This bit defaults to a logic ‘0’ upon executing POR and BOR. For halting the QEI module during the CPU Idle mode, QEISIDL should be set to ‘1’. 13.7.2 TIMER OPERATION DURING CPU IDLE MODE When the CPU is placed in the Idle mode and the QEI module is configured in the 16-bit Timer mode, the 16-bit timer will operate if the QEISIDL bit (QEICON<13>) = 0. This bit defaults to a logic ‘0’ upon executing POR and BOR. For halting the timer module during the CPU Idle mode, QEISIDL should be set to ‘1’. 13.8 Quadrature Encoder Interface Interrupts The quadrature encoder interface has the ability to generate an interrupt on occurrence of the following events: • Interrupt on 16-bit up/down position counter rollover/underflow • Detection of qualified index pulse, or if CNTERR bit is set • Timer period match event (overflow/underflow) • Gate accumulation event The QEI interrupt flag bit, QEIIF, is asserted upon occurrence of any of the above events. The QEIIF bit must be cleared in software. QEIIF is located in the IFS2 status register. Enabling an interrupt is accomplished via the respective enable bit, QEIIE. The QEIIE bit is located in the IEC2 Control register. If the QEISIDL bit is cleared, the timer will function normally, as if the CPU Idle mode had not been entered. DS70118G-page 78 © 2006 Microchip Technology Inc. © 2006 Microchip Technology Inc. TABLE 13-1: QEI REGISTER MAP SFR Name Addr. Bit 15 Bit 14 QEICON 0122 CNTERR — DFLTCON 0124 — — POSCNT 0126 Position Counter<15:0> 0000 0000 0000 0000 MAXCNT 0128 Maximun Count<15:0> 1111 1111 1111 1111 Bit 13 Bit 12 Bit 11 Bit 10 Bit 9 Bit 8 Bit 7 QEISIDL INDX UPDN QEIM2 QEIM1 QEIM0 SWPAB — — — IMV1 IMV0 CEID QEOUT Bit 6 — QECK2 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Reset State TQGATE TQCKPS1 TQCKPS0 POSRES TQCS UPDN_SRC 0000 0000 0000 0000 QECK1 QECK0 — — — — 0000 0000 0000 0000 Legend: u = uninitialized bit Note: Refer to “dsPIC30F Family Reference Manual” (DS70046) for descriptions of register bit fields. dsPIC30F2010 DS70118G-page 79 dsPIC30F2010 NOTES: DS70118G-page 80 © 2006 Microchip Technology Inc. dsPIC30F2010 14.0 MOTOR CONTROL PWM MODULE Note: This data sheet summarizes features of this group of dsPIC30F devices and is not intended to be a complete reference source. For more information on the CPU, peripherals, register descriptions and general device functionality, refer to the “dsPIC30F Family Reference Manual” (DS70046). This module simplifies the task of generating multiple, synchronized Pulse Width Modulated (PWM) outputs. In particular, the following power and motion control applications are supported by the PWM module: • • • • Three Phase AC Induction Motor Switched Reluctance (SR) Motor Brushless DC (BLDC) Motor Uninterruptible Power Supply (UPS) • Single Pulse Generation mode • Interrupt support for asymmetrical updates in Center-Aligned mode • Output override control for Electrically Commutative Motor (ECM) operation • ‘Special Event’ comparator for scheduling other peripheral events • FLTA pins to optionally drive each of the PWM output pins to a defined state This module contains 3 duty cycle generators, numbered 1 through 3. The module has 6 PWM output pins, numbered PWM1H/PWM1L through PWM3H/PWM3L. The six I/O pins are grouped into high/low numbered pairs, denoted by the suffix H or L, respectively. For complementary loads, the low PWM pins are always the complement of the corresponding high I/O pin. The PWM module has the following features: A simplified block diagram of the Motor Control PWM modules is shown in Figure 14-1. • • • • The PWM module allows several modes of operation which are beneficial for specific power control applications. 6 PWM I/O pins with 3 duty cycle generators Up to 16-bit resolution ‘On-the-Fly’ PWM frequency changes Edge and Center-Aligned Output modes © 2006 Microchip Technology Inc. DS70118G-page 81 dsPIC30F2010 FIGURE 14-1: PWM BLOCK DIAGRAM PWMCON1 PWM Enable and Mode SFRs PWMCON2 DTCON1 Dead-Time Control SFR FLTACON FLTA Pin Control SFR OVDCON PWM Manual Control SFR PWM Generator #3 16-bit Data Bus PDC3 Buffer PDC3 Comparator PWM Generator #2 PTMR PWM3H Channel 3 Dead-Time Generator and Override Logic Channel 2 Dead-Time Generator and Override Logic PWM3L Output Driver Block PWM2H PWM2L Comparator PWM Generator #1 PTPER Channel 1 Dead-Time Generator and Override Logic PWM1H PWM1L FLTA PTPER Buffer PTCON Comparator SEVTDIR SEVTCMP Special Event Postscaler Special Event Trigger PTDIR PWM Time Base Note: Details of PWM Generator #1 and #2 not shown for clarity. DS70118G-page 82 © 2006 Microchip Technology Inc. dsPIC30F2010 14.1 PWM Time Base The PWM time base is provided by a 15-bit timer with a prescaler and postscaler. The time base is accessible via the PTMR SFR. PTMR<15> is a read-only status bit, PTDIR, that indicates the present count direction of the PWM time base. If PTDIR is cleared, PTMR is counting upwards. If PTDIR is set, PTMR is counting downwards. The PWM time base is configured via the PTCON SFR. The time base is enabled/disabled by setting/clearing the PTEN bit in the PTCON SFR. PTMR is not cleared when the PTEN bit is cleared in software. The PTPER SFR sets the counting period for PTMR. The user must write a 15-bit value to PTPER<14:0>. When the value in PTMR<14:0> matches the value in PTPER<14:0>, the time base will either Reset to ‘0’, or reverse the count direction on the next occurring clock cycle. The action taken depends on the Operating mode of the time base. Note: If the period register is set to 0x0000, the timer will stop counting, and the interrupt and the special event trigger will not be generated, even if the special event value is also 0x0000. The module will not update the period register if it is already at 0x0000; therefore, the user must disable the module in order to update the period register. The PWM time base can be configured for four different modes of operation: • • • • Free Running mode Single Shot mode Continuous Up/Down Count mode Continuous Up/Down Count mode with interrupts for double updates These four modes are selected by the PTMOD<1:0> bits in the PTCON SFR. The Up/Down Counting modes support center-aligned PWM generation. The Single Shot mode allows the PWM module to support pulse control of certain Electronically Commutative Motors (ECMs). The interrupt signals generated by the PWM time base depend on the mode selection bits (PTMOD<1:0>) and the postscaler bits (PTOPS<3:0>) in the PTCON SFR. © 2006 Microchip Technology Inc. 14.1.1 FREE RUNNING MODE In the Free Running mode, the PWM time base counts upwards until the value in the Time Base Period register (PTPER) is matched. The PTMR register is reset on the following input clock edge and the time base will continue to count upwards as long as the PTEN bit remains set. When the PWM time base is in the Free Running mode (PTMOD<1:0> = 00), an interrupt event is generated each time a match with the PTPER register occurs and the PTMR register is Reset to zero. The postscaler selection bits may be used in this mode of the timer to reduce the frequency of the interrupt events. 14.1.2 SINGLE-SHOT MODE In the Single-Shot Counting mode, the PWM time base begins counting upwards when the PTEN bit is set. When the value in the PTMR register matches the PTPER register, the PTMR register will be reset on the following input clock edge and the PTEN bit will be cleared by the hardware to halt the time base. When the PWM time base is in the Single-Shot mode (PTMOD<1:0> = 01), an interrupt event is generated when a match with the PTPER register occurs, the PTMR register is reset to zero on the following input clock edge, and the PTEN bit is cleared. The postscaler selection bits have no effect in this mode of the timer. 14.1.3 CONTINUOUS UP/DOWN COUNTING MODES In the Continuous Up/Down Counting modes, the PWM time base counts upwards until the value in the PTPER register is matched. The timer will begin counting downwards on the following input clock edge. The PTDIR bit in the PTCON SFR is read-only and indicates the counting direction The PTDIR bit is set when the timer counts downwards. In the Up/Down Counting mode (PTMOD<1:0> = 10), an interrupt event is generated each time the value of the PTMR register becomes zero and the PWM time base begins to count upwards. The postscaler selection bits may be used in this mode of the timer to reduce the frequency of the interrupt events. DS70118G-page 83 dsPIC30F2010 14.1.4 DOUBLE UPDATE MODE 14.2 PWM Period In the Double Update mode (PTMOD<1:0> = 11), an interrupt event is generated each time the PTMR register is equal to zero, as well as each time a period match occurs. The postscaler selection bits have no effect in this mode of the timer. PTPER is a 15-bit register and is used to set the counting period for the PWM time base. PTPER is a doublebuffered register. The PTPER buffer contents are loaded into the PTPER register at the following instances: The Double Update mode provides two additional functions to the user. First, the control loop bandwidth is doubled because the PWM duty cycles can be updated, twice per period. Second, asymmetrical center-aligned PWM waveforms can be generated, which are useful for minimizing output waveform distortion in certain motor control applications. • Free Running and Single Shot modes: When the PTMR register is reset to zero after a match with the PTPER register. • Up/Down Counting modes: When the PTMR register is zero. Note: 14.1.5 Programming a value of 0x0001 in the period register could generate a continuous interrupt pulse, and hence, must be avoided. PWM TIME BASE PRESCALER The input clock to PTMR (FOSC/4), has prescaler options of 1:1, 1:4, 1:16 or 1:64, selected by control bits PTCKPS<1:0> in the PTCON SFR. The prescaler counter is cleared when any of the following occurs: The value held in the PTPER buffer is automatically loaded into the PTPER register when the PWM time base is disabled (PTEN = 0). The PWM period Equation 14-1: EQUATION 14-1: TPWM = can be determined using PWM PERIOD TCY • (PTPER + 1) (PTMR Prescale Value) • a write to the PTMR register • a write to the PTCON register • any device Reset If the PWM time base is configured for one of the Up/ Down Count modes, the PWM period is found using Equation 14-2. The PTMR register is not cleared when PTCON is written. EQUATION 14-2: 14.1.6 PWM TIME BASE POSTSCALER The match output of PTMR can optionally be postscaled through a 4-bit postscaler (which gives a 1:1 to 1:16 scaling). TPWM = PWM PERIOD (UP/DOWN COUNT MODE) TCY • 2 • (PTPER + 0.75) (PTMR Prescale Value) The postscaler counter is cleared when any of the following occurs: The maximum resolution (in bits) for a given device oscillator and PWM frequency can be determined using Equation 14-3: • a write to the PTMR register • a write to the PTCON register • any device Reset EQUATION 14-3: The PTMR register is not cleared when PTCON is written. Resolution = PWM RESOLUTION log (2 • TPWM / TCY) log (2) DS70118G-page 84 © 2006 Microchip Technology Inc. dsPIC30F2010 14.3 Edge-Aligned PWM Edge-aligned PWM signals are produced by the module when the PWM time base is in the Free Running or Single Shot mode. For edge-aligned PWM outputs, the output has a period specified by the value in PTPER and a duty cycle specified by the appropriate duty cycle register (see Figure 14-2). The PWM output is driven active at the beginning of the period (PTMR = 0) and is driven inactive when the value in the duty cycle register matches PTMR. If the value in a particular duty cycle register is zero, then the output on the corresponding PWM pin will be inactive for the entire PWM period. In addition, the output on the PWM pin will be active for the entire PWM period if the value in the duty cycle register is greater than the value held in the PTPER register. FIGURE 14-2: EDGE-ALIGNED PWM New Duty Cycle Latched 14.4 Center-Aligned PWM Center-aligned PWM signals are produced by the module when the PWM time base is configured in an Up/ Down Counting mode (see Figure 14-3). The PWM compare output is driven to the active state when the value of the duty cycle register matches the value of PTMR and the PWM time base is counting downwards (PTDIR = 1). The PWM compare output is driven to the inactive state when the PWM time base is counting upwards (PTDIR = 0) and the value in the PTMR register matches the duty cycle value. If the value in a particular duty cycle register is zero, then the output on the corresponding PWM pin will be inactive for the entire PWM period. In addition, the output on the PWM pin will be active for the entire PWM period if the value in the duty cycle register is equal to the value held in the PTPER register. FIGURE 14-3: CENTER-ALIGNED PWM Period/2 PTPER PTPER PTMR Value PTMR Value Duty Cycle 0 0 Duty Cycle Period Period 14.5 PWM Duty Cycle Comparison Units There are four 16-bit Special Function Registers (PDC1, PDC2, PDC3 and PDC4) used to specify duty cycle values for the PWM module. The value in each duty cycle register determines the amount of time that the PWM output is in the active state. The duty cycle registers are 16 bits wide. The LSb of a duty cycle register determines whether the PWM edge occurs in the beginning. Thus, the PWM resolution is effectively doubled. © 2006 Microchip Technology Inc. DS70118G-page 85 dsPIC30F2010 14.5.1 DUTY CYCLE REGISTER BUFFERS The four PWM duty cycle registers are double-buffered to allow glitchless updates of the PWM outputs. For each duty cycle, there is a duty cycle register that is accessible by the user and a second duty cycle register that holds the actual compare value used in the present PWM period. For edge-aligned PWM output, a new duty cycle value will be updated whenever a match with the PTPER register occurs and PTMR is reset. The contents of the duty cycle buffers are automatically loaded into the duty cycle registers when the PWM time base is disabled (PTEN = 0) and the UDIS bit is cleared in PWMCON2. When the PWM time base is in the Up/Down Counting mode, new duty cycle values are updated when the value of the PTMR register is zero and the PWM time base begins to count upwards. The contents of the duty cycle buffers are automatically loaded into the duty cycle registers when the PWM time base is disabled (PTEN = 0). When the PWM time base is in the Up/Down Counting mode with double updates, new duty cycle values are updated when the value of the PTMR register is zero, and when the value of the PTMR register matches the value in the PTPER register. The contents of the duty cycle buffers are automatically loaded into the duty cycle registers when the PWM time base is disabled (PTEN = 0). 14.6 Complementary PWM Operation In the Complementary mode of operation, each pair of PWM outputs is obtained by a complementary PWM signal. A dead time may be optionally inserted during device switching, when both outputs are inactive for a short period (Refer to Section 14.7 “Dead-Time Generators”). In Complementary mode, the duty cycle comparison units are assigned to the PWM outputs as follows: • PDC1 register controls PWM1H/PWM1L outputs • PDC2 register controls PWM2H/PWM2L outputs • PDC3 register controls PWM3H/PWM3L outputs 14.7 Dead-Time Generators Dead-time generation may be provided when any of the PWM I/O pin pairs are operating in the Complementary Output mode. The PWM outputs use PushPull drive circuits. Due to the inability of the power output devices to switch instantaneously, some amount of time must be provided between the turn off event of one PWM output in a complementary pair and the turn on event of the other transistor. 14.7.1 DEAD-TIME GENERATORS Each complementary output pair for the PWM module has a 6-bit down counter that is used to produce the dead-time insertion. As shown in Figure 14-4, the dead-time unit has a rising and falling edge detector connected to the duty cycle comparison output. 14.7.2 DEAD-TIME RANGES The amount of dead time provided by the dead-time unit is selected by specifying the input clock prescaler value and a 6-bit unsigned value. Four input clock prescaler selections have been provided to allow a suitable range of dead times, based on the device operating frequency. The dead-time clock prescaler value is selected using the DTAPS<1:0> and DTBPS<1:0> control bits in the DTCON1 SFR. One of four clock prescaler options (TCY, 2TCY, 4TCY or 8TCY) is selected for the dead-time value. After the prescaler value is selected, the dead time is adjusted by loading a 6-bit unsigned value into the DTCON1 SFR. The dead-time unit prescaler is cleared on the following events: • On a load of the down timer due to a duty cycle comparison edge event. • On a write to the DTCON1 register. • On any device Reset. Note: The user should not modify the DTCON1 values while the PWM module is operating (PTEN = 1). Unexpected results may occur. The Complementary mode is selected for each PWM I/O pin pair by clearing the appropriate PMODx bit in the PWMCON1 SFR. The PWM I/O pins are set to Complementary mode by default upon a device Reset. DS70118G-page 86 © 2006 Microchip Technology Inc. dsPIC30F2010 FIGURE 14-4: DEAD-TIME TIMING DIAGRAM Duty Cycle Generator PWMxH PWMxL 14.8 Independent PWM Output An independent PWM Output mode is required for driving certain types of loads. A particular PWM output pair is in the Independent Output mode when the corresponding PMOD bit in the PWMCON1 register is set. No dead-time control is implemented between adjacent PWM I/O pins when the module is operating in the Independent mode and both I/O pins are allowed to be active simultaneously. In the Independent mode, each duty cycle generator is connected to both of the PWM I/O pins in an output pair. By using the associated duty cycle register and the appropriate bits in the OVDCON register, the user may select the following signal output options for each PWM I/O pin operating in the Independent mode: • I/O pin outputs PWM signal • I/O pin inactive • I/O pin active 14.9 Single Pulse PWM Operation The PWM module produces single pulse outputs when the PTCON control bits PTMOD<1:0> = 10. Only edgealigned outputs may be produced in the Single Pulse mode. In Single Pulse mode, the PWM I/O pin(s) are driven to the active state when the PTEN bit is set. When a match with a duty cycle register occurs, the PWM I/O pin is driven to the inactive state. When a match with the PTPER register occurs, the PTMR register is cleared, all active PWM I/O pins are driven to the inactive state, the PTEN bit is cleared, and an interrupt is generated. © 2006 Microchip Technology Inc. 14.10 PWM Output Override The PWM output override bits allow the user to manually drive the PWM I/O pins to specified logic states, independent of the duty cycle comparison units. All control bits associated with the PWM output override function are contained in the OVDCON register. The upper half of the OVDCON register contains six bits, POVDxH<3:1> and POVDxL<3:1>, that determine which PWM I/O pins will be overridden. The lower half of the OVDCON register contains six bits, POUTxH<3:1> and POUTxL<3:1>, that determine the state of the PWM I/O pins when a particular output is overridden via the POVD bits. 14.10.1 COMPLEMENTARY OUTPUT MODE When a PWMxL pin is driven active via the OVDCON register, the output signal is forced to be the complement of the corresponding PWMxH pin in the pair. Dead-time insertion is still performed when PWM channels are overridden manually. 14.10.2 OVERRIDE SYNCHRONIZATION If the OSYNC bit in the PWMCON2 register is set, all output overrides performed via the OVDCON register are synchronized to the PWM time base. Synchronous output overrides occur at the following times: • Edge-Aligned mode, when PTMR is zero. • Center-Aligned modes, when PTMR is zero and when the value of PTMR matches PTPER. DS70118G-page 87 dsPIC30F2010 14.11 PWM Output and Polarity Control There are three device Configuration bits associated with the PWM module that provide PWM output pin control: • HPOL Configuration bit • LPOL Configuration bit • PWMPIN Configuration bit These three bits in the FPORBOR Configuration register (see Section 21) work in conjunction with the three PWM enable bits (PWMEN<3:1>) located in the PWMCON1 SFR. The Configuration bits and PWM enable bits ensure that the PWM pins are in the correct states after a device Reset occurs. The PWMPIN configuration fuse allows the PWM module outputs to be optionally enabled on a device Reset. If PWMPIN = 0, the PWM outputs will be driven to their inactive states at Reset. If PWMPIN = 1 (default), the PWM outputs will be tri-stated. The HPOL bit specifies the polarity for the PWMxH outputs, whereas the LPOL bit specifies the polarity for the PWMxL outputs. 14.11.1 OUTPUT PIN CONTROL The PEN<3:1>H and PEN<3:1>L control bits in the PWMCON1 SFR enable each high PWM output pin and each low PWM output pin, respectively. If a particular PWM output pin not enabled, it is treated as a general purpose I/O pin. 14.12 PWM FLTA Pins cleared, the PWM I/O pin is driven to the inactive state. If the bit is set, the PWM I/O pin will be driven to the active state. The active and inactive states are referenced to the polarity defined for each PWM I/O pin (HPOL and LPOL polarity control bits). 14.12.3 FAULT INPUT MODES The FLTA input pin has two modes of operation: • Latched Mode: When the FLTA pin is driven low, the PWM outputs will go to the states defined in the FLTACON register. The PWM outputs will remain in this state until the FLTA pin is driven high and the corresponding interrupt flag has been cleared in software. When both of these actions have occurred, the PWM outputs will return to normal operation at the beginning of the next PWM cycle or half-cycle boundary. If the interrupt flag is cleared before the FLTA condition ends, the PWM module will wait until the FLTA pin is no longer asserted to restore the outputs. • Cycle-by-Cycle Mode: When the FLTA input pin is driven low, the PWM outputs remain in the defined FLTA states for as long as the FLTA pin is held low. After the FLTA pin is driven high, the PWM outputs return to normal operation at the beginning of the following PWM cycle or half-cycle boundary. The Operating mode for the FLTA input pin is selected using the FLTAM control bit in the FLTACON Special Function Register. There is one FLTA pin (FLTA) associated with the PWM module. When asserted, this pin can optionally drive each of the PWM I/O pins to a defined state. The FLTA pin can be controlled manually in software. 14.12.1 For a complex PWM application, the user may need to write up to four duty cycle registers and the time base period register, PTPER, at a given time. In some applications, it is important that all buffer registers be written before the new duty cycle and period values are loaded for use by the module. FAULT PIN ENABLE BITS The FLTACON SFR has 4 control bits that determine whether a particular pair of PWM I/O pins is to be controlled by the FLTA input pin. To enable a specific PWM I/O pin pair for FLTA overrides, the corresponding bit should be set in the FLTACON register. If all enable bits are cleared in the FLTACON register, then the FLTA input pin has no effect on the PWM module and the pin may be used as a general purpose interrupt or I/O pin. Note: 14.12.2 The FLTA pin logic can operate independent of the PWM logic. If all the enable bits in the FLTACON register are cleared, then the FLTA pin(s) could be used as general purpose interrupt pin(s). Each FLTA pin has an interrupt vector, interrupt flag bit and interrupt priority bits associated with it. 14.13 PWM Update Lockout The PWM update lockout feature is enabled by setting the UDIS control bit in the PWMCON2 SFR. The UDIS bit affects all duty cycle buffer registers and the PWM time base period buffer, PTPER. No duty cycle changes or period value changes will have effect while UDIS = 1. FAULT STATES The FLTACON special function register has 8 bits that determine the state of each PWM I/O pin when it is overridden by a FLTA input. When these bits are DS70118G-page 88 © 2006 Microchip Technology Inc. dsPIC30F2010 14.14 PWM Special Event Trigger The PWM module has a special event trigger that allows A/D conversions to be synchronized to the PWM time base. The A/D sampling and conversion time may be programmed to occur at any point within the PWM period. The special event trigger allows the user to minimize the delay between the time when A/D conversion results are acquired, and the time when the duty cycle value is updated. The PWM special event trigger has an SFR named SEVTCMP, and five control bits to control its operation. The PTMR value for which a special event trigger should occur is loaded into the SEVTCMP register. When the PWM time base is in an Up/Down Counting mode, an additional control bit is required to specify the counting phase for the special event trigger. The count phase is selected using the SEVTDIR control bit in the SEVTCMP SFR. If the SEVTDIR bit is cleared, the special event trigger will occur on the upward counting cycle of the PWM time base. If the SEVTDIR bit is set, the special event trigger will occur on the downward count cycle of the PWM time base. The SEVTDIR control bit has no effect unless the PWM time base is configured for an Up/Down Counting mode. 14.14.1 14.15 PWM Operation During CPU Sleep Mode The FLTA A and FLTA B input pins have the ability to wake the CPU from Sleep mode. The PWM module generates an interrupt if either of the FLTA pins is driven low while in Sleep. 14.16 PWM Operation During CPU Idle Mode The PTCON SFR contains a PTSIDL control bit. This bit determines if the PWM module will continue to operate or stop when the device enters Idle mode. If PTSIDL = 0, the module will continue to operate. If PTSIDL = 1, the module will stop operation as long as the CPU remains in Idle mode. SPECIAL EVENT TRIGGER POSTSCALER The PWM special event trigger has a postscaler that allows a 1:1 to 1:16 postscale ratio. The postscaler is configured by writing the SEVOPS<3:0> control bits in the PWMCON2 SFR. The special event output postscaler is cleared on the following events: • Any write to the SEVTCMP register • Any device Reset © 2006 Microchip Technology Inc. DS70118G-page 89 PWM REGISTER MAP SFR Name Addr. Bit 15 Bit 14 Bit 13 Bit 12 Bit 11 Bit 10 Bit 9 Bit 8 PTCON 01C0 PTEN — PTSIDL — — — — — Bit 7 Bit 6 Bit 5 Bit 4 PTMR 01C2 PTDIR PWM Timer Count Value 0000 0000 0000 0000 PTPER 01C4 — PWM Time Base Period Register 0011 1111 1111 1111 SEVTCMP 01C6 SEVTDIR PWMCON1 01C8 PTOPS<3:0> Bit 3 Bit 2 PTCKPS<1:0> Bit 1 Bit 0 PTMOD<1:0> PWM Special Event Compare Register — — — — — — — — — PTMOD3 PTMOD2 PTMOD1 SEVOPS<3:0> PEN3H PEN2H PEN1H — — — — 01CA DTCON1 01CC FLTACON 01D0 — — FAOV3H FAOV3L FAOV2H FAOV2L FAOV1H FAOV1L FLTAM — OVDCON 01D4 — — POVD3H POVD3L POVD2H POVD2L POVD1H POVD1L — — PDC1 01D6 DTBPS<1:0> DTB<5:0> 0000 0000 0000 0000 — PWMCON2 Reset State 0000 0000 0000 0000 DTAPS<1:0> — PEN3L PEN2L PEN1L 0000 0000 0111 0111 — — OSYNC UDIS 0000 0000 0000 0000 FAEN2 FAEN1 0000 0000 0000 0000 Dead Time A Value — — — FAEN3 0000 0000 0000 0000 POUT3H POUT3L POUT2H POUT2L POUT1H POUT1L 0011 1111 0000 0000 PWM Duty Cycle #1 Register 0000 0000 0000 0000 PDC2 01D8 PWM Duty Cycle #2 Register 0000 0000 0000 0000 PDC3 01DA PWM Duty Cycle #3 Register 0000 0000 0000 0000 Legend: u = uninitialized bit Note: Refer to “dsPIC30F Family Reference Manual” (DS70046) for descriptions of register bit fields. dsPIC30F2010 DS70118G-page 90 TABLE 14-1: © 2006 Microchip Technology Inc. dsPIC30F2010 15.0 SPI MODULE Note: This data sheet summarizes features of this group of dsPIC30F devices and is not intended to be a complete reference source. For more information on the CPU, peripherals, register descriptions and general device functionality, refer to the “dsPIC30F Family Reference Manual” (DS70046). The Serial Peripheral Interface (SPI) module is a synchronous serial interface. It is useful for communicating with other peripheral devices such as EEPROMs, shift registers, display drivers and A/D converters or other microcontrollers. It is compatible with Motorola's SPI and SIOP interfaces. 15.1 Operating Function Description Each SPI module consists of a 16-bit shift register, SPIxSR (where x = 1 or 2), used for shifting data in and out, and a buffer register, SPIxBUF. A control register, SPIxCON, configures the module. Additionally, a status register, SPIxSTAT, indicates various status conditions. The serial interface consists of 4 pins: SDIx (serial data input), SDOx (serial data output), SCKx (shift clock input or output) and SSx (active-low slave select). In Master mode operation, SCK is a clock output, but in Slave mode, it is a clock input. In Master mode, the clock is generated by prescaling the system clock. Data is transmitted as soon as a value is written to SPIxBUF. The interrupt is generated at the middle of the transfer of the last bit. In Slave mode, data is transmitted and received as external clock pulses appear on SCK. Again, the interrupt is generated when the last bit is latched. If SSx control is enabled, then transmission and reception are enabled only when SSx = low. The SDOx output will be disabled in SSx mode with SSx high. The clock provided to the module is (FOSC/4). This clock is then prescaled by the primary (PPRE<1:0>) and the secondary (SPRE<2:0>) prescale factors. The CKE bit determines whether transmit occurs on transition from active clock state to Idle clock state, or vice versa. The CKP bit selects the Idle state (high or low) for the clock. 15.1.1 WORD AND BYTE COMMUNICATION A control bit, MODE16 (SPIxCON<10>), allows the module to communicate in either 16-bit or 8-bit mode. 16-bit operation is identical to 8-bit operation, except that the number of bits transmitted is 16 instead of 8. The user software must disable the module prior to changing the MODE16 bit. The SPI module is reset when the MODE16 bit is changed by the user. A series of eight (8) or sixteen (16) clock pulses shifts out bits from the SPIxSR to SDOx pin and simultaneously shifts in data from SDIx pin. An interrupt is generated when the transfer is complete and the corresponding interrupt flag bit (SPI1IF or SPI2IF) is set. This interrupt can be disabled through an interrupt enable bit (SPI1IE or SPI2IE). A basic difference between 8-bit and 16-bit operation is that the data is transmitted out of bit 7 of the SPIxSR for 8-bit operation, and data is transmitted out of bit 15 of the SPIxSR for 16-bit operation. In both modes, data is shifted into bit 0 of the SPIxSR. The receive operation is double-buffered. When a complete byte is received, it is transferred from SPIxSR to SPIxBUF. A control bit, DISSDO, is provided to the SPIxCON register to allow the SDOx output to be disabled. This will allow the SPI module to be connected in an input only configuration. SDO can also be used for general purpose I/O. If the receive buffer is full when new data is being transferred from SPIxSR to SPIxBUF, the module will set the SPIROV bit, indicating an overflow condition. The transfer of the data from SPIxSR to SPIxBUF will not be completed and the new data will be lost. The module will not respond to SCL transitions while SPIROV is ‘1’, effectively disabling the module until SPIxBUF is read by user software. Transmit writes are also double-buffered. The user writes to SPIxBUF. When the master or slave transfer is completed, the contents of the shift register (SPIxSR) is moved to the receive buffer. If any transmit data has been written to the buffer register, the contents of the transmit buffer are moved to SPIxSR. The received data is thus placed in SPIxBUF and the transmit data in SPIxSR is ready for the next transfer. Note: 15.1.2 15.2 SDOx DISABLE Framed SPI Support The module supports a basic framed SPI protocol in Master or Slave mode. The control bit FRMEN enables framed SPI support and causes the SSx pin to perform the frame synchronization pulse (FSYNC) function. The control bit SPIFSD determines whether the SSx pin is an input or an output (i.e., whether the module receives or generates the frame synchronization pulse). The frame pulse is an active-high pulse for a single SPI clock cycle. When frame synchronization is enabled, the data transmission starts only on the subsequent transmit edge of the SPI clock. Both the transmit buffer (SPIxTXB) and the receive buffer (SPIxRXB) are mapped to the same register address, SPIxBUF. © 2006 Microchip Technology Inc. DS70118G-page 91 dsPIC30F2010 FIGURE 15-1: SPI BLOCK DIAGRAM Internal Data Bus Read Write SPIxBUF SPIxBUF Transmit Receive SPIxSR SDIx bit 0 SDOx Shift clock SS & FSYNC Clock Control Control SSx Edge Select Secondary Prescaler 1:1-1:8 SCKx Primary Prescaler 1:1, 1:4, 1:16, 1:64 FCY Enable Master Clock Note: x = 1 or 2. FIGURE 15-2: SPI MASTER/SLAVE CONNECTION SPI Master SPI Slave SDOx SDIy Serial Input Buffer (SPIxBUF) SDIx Shift Register (SPIxSR) MSb Serial Input Buffer (SPIyBUF) LSb Shift Register (SPIySR) MSb SCKx PROCESSOR 1 SDOy Serial Clock LSb SCKy PROCESSOR 2 Note: x = 1 or 2, y = 1 or 2. DS70118G-page 92 © 2006 Microchip Technology Inc. dsPIC30F2010 15.3 Slave Select Synchronization The SSx pin allows a Synchronous Slave mode. The SPI must be configured in SPI Slave mode, with SSx pin control enabled (SSEN = 1). When the SSx pin is low, transmission and reception are enabled, and the SDOx pin is driven. When SSx pin goes high, the SDOx pin is no longer driven. Also, the SPI module is resynchronized, and all counters/control circuitry are reset. Therefore, when the SSx pin is asserted low again, transmission/reception will begin at the MSb, even if SSx had been de-asserted in the middle of a transmit/receive. 15.4 SPI Operation During CPU Sleep Mode During Sleep mode, the SPI module is shut down. If the CPU enters Sleep mode while an SPI transaction is in progress, then the transmission and reception is aborted. The transmitter and receiver will stop in Sleep mode. However, register contents are not affected by entering or exiting Sleep mode. 15.5 SPI Operation During CPU Idle Mode When the device enters Idle mode, all clock sources remain functional. The SPISIDL bit (SPIxSTAT<13>) selects if the SPI module will stop or continue on Idle. If SPISIDL = 0, the module will continue to operate when the CPU enters Idle mode. If SPISIDL = 1, the module will stop when the CPU enters Idle mode. © 2006 Microchip Technology Inc. DS70118G-page 93 SFR Name SPI1 REGISTER MAP Addr. Bit 15 Bit 14 Bit 13 Bit 12 SPI1STAT 0220 SPI1CON 0222 SPIEN — SPISIDL — — FRMEN SPIFSD — SPI1BUF 0224 Bit 11 Bit 10 — — DISSDO MODE16 Bit 9 Bit 8 Bit 7 Bit 6 Bit 5 Bit 4 Bit 2 Bit 1 Bit 0 Reset State — — — SPIROV — — — — SPITBF SPIRBF 0000 0000 0000 0000 SMP CKE SSEN CKP MSTEN SPRE2 SPRE1 SPRE0 PPRE1 PPRE0 Transmit and Receive Buffer Legend: u = uninitialized bit Note: Bit 3 Refer to “dsPIC30F Family Reference Manual” (DS70046) for descriptions of register bit fields. 0000 0000 0000 0000 0000 0000 0000 0000 dsPIC30F2010 DS70118G-page 94 TABLE 15-1: © 2006 Microchip Technology Inc. dsPIC30F2010 16.0 I2C MODULE 16.1 Note: This data sheet summarizes features of this group of dsPIC30F devices and is not intended to be a complete reference source. For more information on the CPU, peripherals, register descriptions and general device functionality, refer to the “dsPIC30F Family Reference Manual” (DS70046). The Inter-Integrated Circuit (I2C) module provides complete hardware support for both Slave and MultiMaster modes of the I2C serial communication standard, with a 16-bit interface. This module offers the following key features: • I2C interface supporting both Master and Slave operation. • I2C Slave mode supports 7 and 10-bit address. • I2C Master mode supports 7 and 10-bit address. • I2C port allows bidirectional transfers between master and slaves. • Serial clock synchronization for I2C port can be used as a handshake mechanism to suspend and resume serial transfer (SCLREL control). • I2C supports Multi-Master operation; detects bus collision and will arbitrate accordingly. FIGURE 16-1: Operating Function Description The hardware fully implements all the master and slave functions of the I2C Standard and Fast mode specifications, as well as 7 and 10-bit addressing. Thus, the I2C module can operate either as a slave or a master on an I2C bus. 16.1.1 VARIOUS I2C MODES The following types of I2C operation are supported: • • • I2C Slave operation with 7-bit address I2C Slave operation with 10-bit address I2C Master operation with 7 or 10-bit address See the I2C programmer’s model in Figure 16-1. 16.1.2 PIN CONFIGURATION IN I2C MODE I2C has a 2-pin interface: pin SCL is clock and pin SDA is data. PROGRAMMER’S MODEL I2CRCV (8 bits) bit 7 bit 0 bit 7 bit 0 I2CTRN (8 bits) I2CBRG (9 bits) bit 8 bit 0 I2CCON (16 bits) bit 15 bit 0 bit 15 bit 0 I2CSTAT (16 bits) I2CADD (10 bits) bit 9 16.1.3 I2C REGISTERS I2CCON and I2CSTAT are control and status registers, respectively. The I2CCON register is readable and writable. The lower 6 bits of I2CSTAT are read-only. The remaining bits of the I2CSTAT are read/write. I2CRSR is the shift register used for shifting data, whereas I2CRCV is the buffer register to which data bytes are written, or from which data bytes are read. I2CRCV is the receive buffer, as shown in Figure 16-1. I2CTRN is the transmit register to which bytes are written during a transmit operation, as shown in Figure 16-2. © 2006 Microchip Technology Inc. bit 0 The I2CADD register holds the slave address. A status bit, ADD10, indicates 10-bit Address mode. The I2CBRG acts as the Baud Rate Generator (BRG) reload value. In receive operations, I2CRSR and I2CRCV together form a double-buffered receiver. When I2CRSR receives a complete byte, it is transferred to I2CRCV and an interrupt pulse is generated. During transmission, the I2CTRN is not double-buffered. Note: Following a Restart condition in 10-bit mode, the user only needs to match the first 7-bit address. DS70118G-page 95 dsPIC30F2010 FIGURE 16-2: I2C BLOCK DIAGRAM Internal Data Bus I2CRCV Read SCL Shift Clock I2CRSR LSB SDA Addr_Match Match Detect Write I2CADD Read Start and Stop bit Detect I2CSTAT Write Control Logic Start, Restart, Stop bit Generate Write I2CCON Collision Detect Acknowledge Generation Clock Stretching Read Read Write I2CTRN LSB Shift Clock Read Reload Control BRG Down Counter DS70118G-page 96 Write I2CBRG FCY Read © 2006 Microchip Technology Inc. dsPIC30F2010 16.2 I2C Module Addresses The I2CADD register contains the Slave mode addresses. The register is a 10-bit register. If the A10M bit (I2CCON<10>) is ‘0’, the address is interpreted by the module as a 7-bit address. When an address is received, it is compared to the 7 LSbs of the I2CADD register. If the A10M bit is ‘1’, the address is assumed to be a 10-bit address. When an address is received, it will be compared with the binary value ‘1 1 1 1 0 A9 A8’ (where A9, A8 are two Most Significant bits of I2CADD). If that value matches, the next address will be compared with the Least Significant 8 bits of I2CADD, as specified in the 10-bit addressing protocol. TABLE 16-1: 16.3.2 SLAVE RECEPTION If the R_W bit received is a ‘0’ during an address match, then Receive mode is initiated. Incoming bits are sampled on the rising edge of SCL. After 8 bits are received, if I2CRCV is not full or I2COV is not set, I2CRSR is transferred to I2CRCV. ACK is sent on the ninth clock. If the RBF flag is set, indicating that I2CRCV is still holding data from a previous operation (RBF = 1), then ACK is not sent; however, the interrupt pulse is generated. In the case of an overflow, the contents of the I2CRSR are not loaded into the I2CRCV. Note: 7-BIT I2C™ SLAVE ADDRESSES SUPPORTED BY dsPIC30F The I2CRCV will be loaded if the I2COV bit = 1 and the RBF flag = 0. In this case, a read of the I2CRCV was performed, but the user did not clear the state of the I2COV bit before the next receive occurred. The acknowledgement is not sent (ACK = 1) and the I2CRCV is updated. 0x00 General call address or Start byte 0x01-0x03 Reserved 0x04-0x07 Hs mode Master codes 16.4 0x08-0x77 Valid 7-bit addresses 0x78-0x7B Valid 10-bit addresses (lower 7 bits) In 10-bit mode, the basic receive and transmit operations are the same as in the 7-bit mode. However, the criteria for address match is more complex. 0x7C-0x7F Reserved 16.3 I2C 7-bit Slave Mode Operation Once enabled (I2CEN = 1), the slave module will wait for a Start bit to occur (i.e., the I2C module is ‘Idle’). Following the detection of a Start bit, 8 bits are shifted into I2CRSR and the address is compared against I2CADD. In 7-bit mode (A10M = 0), bits I2CADD<6:0> are compared against I2CRSR<7:1> and I2CRSR<0> is the R_W bit. All incoming bits are sampled on the rising edge of SCL. If an address match occurs, an acknowledgement will be sent, and the slave event interrupt flag (SI2CIF) is set on the falling edge of the ninth (ACK) bit. The address match does not affect the contents of the I2CRCV buffer or the RBF bit. 16.3.1 SLAVE TRANSMISSION If the R_W bit received is a ‘1’, then the serial port will go into Transmit mode. It will send ACK on the ninth bit and then hold SCL to ‘0’ until the CPU responds by writing to I2CTRN. SCL is released by setting the SCLREL bit, and 8 bits of data are shifted out. Data bits are shifted out on the falling edge of SCL, such that SDA is valid during SCL high (see timing diagram). The interrupt pulse is sent on the falling edge of the ninth clock pulse, regardless of the status of the ACK received from the master. © 2006 Microchip Technology Inc. I2C 10-bit Slave Mode Operation The I2C specification dictates that a slave must be addressed for a write operation, with two address bytes following a Start bit. The A10M bit is a control bit that signifies that the address in I2CADD is a 10-bit address rather than a 7-bit address. The address detection protocol for the first byte of a message address is identical for 7-bit and 10-bit messages, but the bits being compared are different. I2CADD holds the entire 10-bit address. Upon receiving an address following a Start bit, I2CRSR <7:3> is compared against a literal ‘11110’ (the default 10-bit address) and I2CRSR<2:1> are compared against I2CADD<9:8>. If a match occurs and if R_W = 0, the interrupt pulse is sent. The ADD10 bit will be cleared to indicate a partial address match. If a match fails or R_W = 1, the ADD10 bit is cleared and the module returns to the Idle state. The low byte of the address is then received and compared with I2CADD<7:0>. If an address match occurs, the interrupt pulse is generated and the ADD10 bit is set, indicating a complete 10-bit address match. If an address match did not occur, the ADD10 bit is cleared and the module returns to the Idle state. DS70118G-page 97 dsPIC30F2010 16.4.1 10-BIT MODE SLAVE TRANSMISSION Once a slave is addressed in this fashion, with the full 10-bit address (we will refer to this state as "PRIOR_ADDR_MATCH"), the master can begin sending data bytes for a slave reception operation. 16.4.2 10-BIT MODE SLAVE RECEPTION Once addressed, the master can generate a Repeated Start, reset the high byte of the address and set the R_W bit without generating a Stop bit, thus initiating a slave transmit operation. 16.5 Automatic Clock Stretch In the Slave modes, the module can synchronize buffer reads and write to the master device by clock stretching. 16.5.1 TRANSMIT CLOCK STRETCHING Both 10-bit and 7-bit Transmit modes implement clock stretching by asserting the SCLREL bit after the falling edge of the ninth clock if the TBF bit is cleared, indicating the buffer is empty. 16.5.3 When the STREN bit is set in Slave Receive mode, the SCL line is held low when the buffer register is full. The method for stretching the SCL output is the same for both 7 and 10-bit Addressing modes. Clock stretching takes place following the ninth clock of the receive sequence. On the falling edge of the ninth clock at the end of the ACK sequence, if the RBF bit is set, the SCLREL bit is automatically cleared, forcing the SCL output to be held low. The user’s ISR must set the SCLREL bit before reception is allowed to continue. By holding the SCL line low, the user has time to service the ISR and read the contents of the I2CRCV before the master device can initiate another receive sequence. This will prevent buffer overruns from occurring. Note 1: If the user reads the contents of the I2CRCV, clearing the RBF bit before the falling edge of the ninth clock, the SCLREL bit will not be cleared and clock stretching will not occur. 2: The SCLREL bit can be set in software, regardless of the state of the RBF bit. The user should be careful to clear the RBF bit in the ISR before the next receive sequence in order to prevent an overflow condition. In Slave Transmit modes, clock stretching is always performed, irrespective of the STREN bit. Clock synchronization takes place following the ninth clock of the transmit sequence. If the device samples an ACK on the falling edge of the ninth clock, and if the TBF bit is still clear, then the SCLREL bit is automatically cleared. The SCLREL being cleared to ‘0’ will assert the SCL line low. The user’s ISR must set the SCLREL bit before transmission is allowed to continue. By holding the SCL line low, the user has time to service the ISR and load the contents of the I2CTRN before the master device can initiate another transmit sequence. Note 1: If the user loads the contents of I2CTRN, setting the TBF bit before the falling edge of the ninth clock, the SCLREL bit will not be cleared and clock stretching will not occur. CLOCK STRETCHING DURING 7-BIT ADDRESSING (STREN = 1) 16.5.4 CLOCK STRETCHING DURING 10-BIT ADDRESSING (STREN = 1) Clock stretching takes place automatically during the addressing sequence. Because this module has a register for the entire address, it is not necessary for the protocol to wait for the address to be updated. After the address phase is complete, clock stretching will occur on each data receive or transmit sequence as was described earlier. 2: The SCLREL bit can be set in software, regardless of the state of the TBF bit. 16.5.2 RECEIVE CLOCK STRETCHING The STREN bit in the I2CCON register can be used to enable clock stretching in Slave Receive mode. When the STREN bit is set, the SCL pin will be held low at the end of each data receive sequence. DS70118G-page 98 © 2006 Microchip Technology Inc. dsPIC30F2010 16.6 Software Controlled Clock Stretching (STREN = 1) When the STREN bit is ‘1’, the SCLREL bit may be cleared by software to allow software to control the clock stretching. The logic will synchronize writes to the SCLREL bit with the SCL clock. Clearing the SCLREL bit will not assert the SCL output until the module detects a falling edge on the SCL output and SCL is sampled low. If the SCLREL bit is cleared by the user while the SCL line has been sampled low, the SCL output will be asserted (held low). The SCL output will remain low until the SCLREL bit is set, and all other devices on the I2C bus have de-asserted SCL. This ensures that a write to the SCLREL bit will not violate the minimum high time requirement for SCL. If the STREN bit is ‘0’, a software write to the SCLREL bit will be disregarded and have no effect on the SCLREL bit. 16.7 Interrupts The I2C module generates two interrupt flags, MI2CIF (I2C Master Interrupt Flag) and SI2CIF (I2C Slave Interrupt Flag). The MI2CIF interrupt flag is activated on completion of a master message event. The SI2CIF interrupt flag is activated on detection of a message directed to the slave. 16.8 Slope Control I2C The standard requires slope control on the SDA and SCL signals for Fast Mode (400 kHz). The control bit, DISSLW, enables the user to disable slew rate control, if desired. It is necessary to disable the slew rate control for 1 MHz mode. 16.9 IPMI Support The control bit IPMIEN enables the module to support Intelligent Peripheral Management Interface (IPMI). When this bit is set, the module accepts and acts upon all addresses. 16.10 General Call Address Support The general call address can address all devices. When this address is used, all devices should, in theory, respond with an acknowledgement. The general call address is one of eight addresses reserved for specific purposes by the I2C protocol. It consists of all 0s with R_W = 0. If a general call address match occurs, the I2CRSR is transferred to the I2CRCV after the eighth clock, the RBF flag is set, and on the falling edge of the ninth bit (ACK bit), the master event interrupt flag (MI2CIF) is set. When the interrupt is serviced, the source for the interrupt can be checked by reading the contents of the I2CRCV to determine if the address was device specific, or a general call address. 16.11 I2C Master Support As a Master device, six operations are supported. • Assert a Start condition on SDA and SCL. • Assert a Restart condition on SDA and SCL. • Write to the I2CTRN register initiating transmission of data/address. • Generate a Stop condition on SDA and SCL. • Configure the I2C port to receive data. • Generate an ACK condition at the end of a received byte of data. 16.12 I2C Master Operation The master device generates all of the serial clock pulses and the Start and Stop conditions. A transfer is ended with a Stop condition or with a Repeated Start condition. Since the Repeated Start condition is also the beginning of the next serial transfer, the I2C bus will not be released. In Master Transmitter mode, serial data is output through SDA, while SCL outputs the serial clock. The first byte transmitted contains the slave address of the receiving device (7 bits) and the data direction bit. In this case, the data direction bit (R_W) is logic ‘0’. Serial data is transmitted 8 bits at a time. After each byte is transmitted, an ACK bit is received. Start and Stop conditions are output to indicate the beginning and the end of a serial transfer. In Master Receive mode, the first byte transmitted contains the slave address of the transmitting device (7 bits) and the data direction bit. In this case, the data direction bit (R_W) is logic ‘1’. Thus, the first byte transmitted is a 7-bit slave address, followed by a ‘1’ to indicate receive bit. Serial data is received via SDA, while SCL outputs the serial clock. Serial data is received 8 bits at a time. After each byte is received, an ACK bit is transmitted. Start and Stop conditions indicate the beginning and end of transmission. The general call address is recognized when the General Call Enable (GCEN) bit is set (I2CCON<15> = 1). Following a Start bit detection, 8 bits are shifted into I2CRSR and the address is compared with I2CADD, and is also compared with the general call address which is fixed in hardware. © 2006 Microchip Technology Inc. DS70118G-page 99 dsPIC30F2010 16.12.1 I2C MASTER TRANSMISSION Transmission of a data byte, a 7-bit address or the second half of a 10-bit address is accomplished by simply writing a value to I2CTRN register. The user should only write to I2CTRN when the module is in a Wait state. This action will set the buffer full flag (TBF) and allow the Baud Rate Generator to begin counting and start the next transmission. Each bit of address/data will be shifted out onto the SDA pin after the falling edge of SCL is asserted. The Transmit Status Flag, TRSTAT (I2CSTAT<14>), indicates that a master transmit is in progress. 16.12.2 I2C MASTER RECEPTION Master mode reception is enabled by programming the receive enable (RCEN) bit (I2CCON<11>). The I2C module must be Idle before the RCEN bit is set, otherwise the RCEN bit will be disregarded. The Baud Rate Generator begins counting, and on each rollover, the state of the SCL pin toggles, and data is shifted in to the I2CRSR on the rising edge of each clock. 16.12.5 MULTI-MASTER COMMUNICATION, BUS COLLISION AND BUS ARBITRATION Multi-Master operation support is achieved by bus arbitration. When the master outputs address/data bits onto the SDA pin, arbitration takes place when the master outputs a ‘1’ on SDA, by letting SDA float high while another master asserts a ‘0’. When the SCL pin floats high, data should be stable. If the expected data on SDA is a ‘1’ and the data sampled on the SDA pin = 0, then a bus collision has taken place. The master will set the MI2CIF pulse and reset the master portion of the I2C port to its Idle state. If a transmit was in progress when the bus collision occurred, the transmission is halted, the TBF flag is cleared, the SDA and SCL lines are de-asserted, and a value can now be written to I2CTRN. When the user services the I2C master event Interrupt Service Routine, if the I2C bus is free (i.e., the P bit is set) the user can resume communication by asserting a Start condition. In Master mode, the reload value for the BRG is located in the I2CBRG register. When the BRG is loaded with this value, the BRG counts down to ‘0’ and stops until another reload has taken place. If clock arbitration is taking place, for instance, the BRG is reloaded when the SCL pin is sampled high. If a Start, Restart, Stop or Acknowledge condition was in progress when the bus collision occurred, the condition is aborted, the SDA and SCL lines are de-asserted, and the respective control bits in the I2CCON register are cleared to ‘0’. When the user services the bus collision Interrupt Service Routine, and if the I2C bus is free, the user can resume communication by asserting a Start condition. As per the I2C standard, FSCK may be 100 kHz or 400 kHz. However, the user can specify any baud rate up to 1 MHz. I2CBRG values of ‘0’ or ‘1’ are illegal. The Master will continue to monitor the SDA and SCL pins, and if a Stop condition occurs, the MI2CIF bit will be set. 16.12.3 BAUD RATE GENERATOR I2C EQUATION 16-1: I2CBRG VALUE Fcy Fcy I2CBRG = ⎛⎝ ----------- – ---------------------------⎞⎠ – 1 Fscl 1, 111, 111 16.12.4 CLOCK ARBITRATION Clock arbitration occurs when the master de-asserts the SCL pin (SCL allowed to float high) during any receive, transmit or Restart/Stop condition. When the SCL pin is allowed to float high, the Baud Rate Generator is suspended from counting until the SCL pin is actually sampled high. When the SCL pin is sampled high, the Baud Rate Generator is reloaded with the contents of I2CBRG and begins counting. This ensures that the SCL high time will always be at least one BRG rollover count in the event that the clock is held low by an external device. DS70118G-page 100 A write to the I2CTRN will start the transmission of data at the first data bit, regardless of where the transmitter left off when bus collision occurred. In a Multi-Master environment, the interrupt generation on the detection of Start and Stop conditions allows the determination of when the bus is free. Control of the I2C bus can be taken when the P bit is set in the I2CSTAT register, or the bus is Idle and the S and P bits are cleared. © 2006 Microchip Technology Inc. dsPIC30F2010 16.13 I2C Module Operation During CPU Sleep and Idle Modes 16.13.1 I2C OPERATION DURING CPU SLEEP MODE When the device enters Sleep mode, all clock sources to the module are shutdown and stay at logic ‘0’. If Sleep occurs in the middle of a transmission, and the state machine is partially into a transmission as the clocks stop, then the transmission is aborted. Similarly, if Sleep occurs in the middle of a reception, then the reception is aborted. 16.13.2 I2C OPERATION DURING CPU IDLE MODE For the I2C, the I2CSIDL bit selects if the module will stop on Idle or continue on Idle. If I2CSIDL = 0, the module will continue operation on assertion of the Idle mode. If I2CSIDL = 1, the module will stop on Idle. © 2006 Microchip Technology Inc. DS70118G-page 101 SFR Name Addr. I2C™ REGISTER MAP Bit 15 Bit 14 Bit 13 Bit 12 Bit 11 Bit 10 Bit 9 Bit 8 0200 — — — — — — — — I2CTRN 0202 — — — — — — — — I2CBRG 0204 — — — — — — — I2CCON 0206 I2CEN — I2CSTAT 0208 I2CADD 020A ACKSTAT — TRSTAT — I2CRCV I2CSIDL SCLREL IPMIEN — — — — — — Bit 7 Bit 6 Bit 5 Bit 3 Bit 2 Bit 1 Bit 0 Reset State 0000 0000 0000 0000 Transmit Register 0000 0000 1111 1111 Baud Rate Generator 0000 0000 0000 0000 A10M DISSLW SMEN GCEN STREN ACKDT ACKEN RCEN PEN RSEN SEN 0001 0000 0000 0000 BCL — GCSTAT ADD10 IWCOL I2COV D_A P S R_W RBF TBF 0000 0000 0000 0000 Address Register Legend: u = uninitialized bit Note: Bit 4 Receive Register Refer to “dsPIC30F Family Reference Manual” (DS70046) for descriptions of register bit fields. 0000 0000 0000 0000 dsPIC30F2010 DS70118G-page 102 TABLE 16-2: © 2006 Microchip Technology Inc. dsPIC30F2010 17.0 UNIVERSAL ASYNCHRONOUS RECEIVER TRANSMITTER (UART) MODULE 17.1 The key features of the UART module are: • • • • Note: This data sheet summarizes features of this group of dsPIC30F devices and is not intended to be a complete reference source. For more information on the CPU, peripherals, register descriptions and general device functionality, refer to the “dsPIC30F Family Reference Manual” (DS70046). • This section describes the Universal Asynchronous Receiver/Transmitter Communications module. Note: Since dsPIC30F2010 devices have only one UART, all references to Ux... imply that x = 1 only. • • • • • • FIGURE 17-1: UART Module Overview Full-duplex, 8 or 9-bit data communication Even, Odd or No Parity options (for 8-bit data) One or two Stop bits Fully integrated Baud Rate Generator with 16-bit prescaler Baud rates range from 38 bps to 1.875 Mbps at a 30 MHz instruction rate 4-word deep transmit data buffer 4-word deep receive data buffer Parity, Framing and Buffer Overrun error detection Support for Interrupt only on Address Detect (9th bit = 1) Separate Transmit and Receive Interrupts Loopback mode for diagnostic support UART TRANSMITTER BLOCK DIAGRAM Internal Data Bus Control and Status bits Write UTX8 Write UxTXREG Low Byte Transmit Control – Control TSR – Control Buffer – Generate Flags – Generate Interrupt Load TSR UxTXIF UTXBRK Data UxTX Transmit Shift Register (UxTSR) ‘0’ (Start) ‘1’ (Stop) Parity Parity Generator 16 Divider 16X Baud Clock from Baud Rate Generator Control Signals Note: x = 1 only. © 2006 Microchip Technology Inc. DS70118G-page 103 dsPIC30F2010 FIGURE 17-2: UART RECEIVER BLOCK DIAGRAM Internal Data Bus 16 Write Read Read Read UxMODE URX8 Write UxSTA UxRXREG Low Byte Receive Buffer Control – Generate Flags – Generate Interrupt – Shift Data Characters LPBACK 8-9 UxRX 0 · Start bit Detect · Parity Check · Stop bit Detect · Shift Clock Generation · Wake Logic Control Signals FERR Load RSR to Buffer Receive Shift Register (UxRSR) 1 PERR From UxTX 16 Divider 16X Baud Clock from Baud Rate Generator UxRXIF Note: x = 1 only. DS70118G-page 104 © 2006 Microchip Technology Inc. dsPIC30F2010 17.2 17.2.1 Enabling and Setting Up UART ENABLING THE UART The UART module is enabled by setting the UARTEN bit in the UxMODE register (where x = 1 only). Once enabled, the UxTX and UxRX pins are configured as an output and an input respectively, overriding the TRIS and LATCH register bit settings for the corresponding I/O port pins. The UxTX pin is at logic ‘1’ when no transmission is taking place. 17.2.2 17.3 17.3.1 1. 2. 3. Disabling the UART module resets the buffers to empty states. Any data characters in the buffers are lost, and the baud rate counter is reset. All error and status flags associated with the UART module are reset when the module is disabled. The URXDA, OERR, FERR, PERR, UTXEN, UTXBRK and UTXBF bits are cleared, whereas RIDLE and TRMT are set. Other control bits, including ADDEN, URXISEL<1:0>, UTXISEL, as well as the UxMODE and UxBRG registers, are not affected. Clearing the UARTEN bit while the UART is active will abort all pending transmissions and receptions and reset the module as defined above. Re-enabling the UART will restart the UART in the same configuration. 17.2.3 ALTERNATE I/O The alternate I/O function is enabled by setting the ALTIO bit (UxMODE<10>). If ALTIO = 1, the UxATX and UxARX pins (alternate transmit and alternate receive pins, respectively) are used by the UART module instead of the UxTX and UxRX pins. If ALTIO = 0, the UxTX and UxRX pins are used by the UART module. 17.2.4 SETTING UP DATA, PARITY AND STOP BIT SELECTIONS Control bits PDSEL<1:0> in the UxMODE register are used to select the data length and parity used in the transmission. The data length may either be 8 bits with even, odd or no parity, or 9 bits with no parity. The STSEL bit determines whether one or two Stop bits will be used during data transmission. The default (Power-on) setting of the UART is 8 bits, no parity, 1 Stop bit (typically represented as 8, N, 1). TRANSMITTING IN 8-BIT DATA MODE The following steps must be performed in order to transmit 8-bit data: DISABLING THE UART The UART module is disabled by clearing the UARTEN bit in the UxMODE register. This is the default state after any Reset. If the UART is disabled, all I/O pins operate as port pins under the control of the latch and TRIS bits of the corresponding port pins. Transmitting Data Set up the UART: First, the data length, parity and number of Stop bits must be selected. Then, the Transmit and Receive Interrupt enable and priority bits are setup in the UxMODE and UxSTA registers. Also, the appropriate baud rate value must be written to the UxBRG register. Enable the UART by setting the UARTEN bit (UxMODE<15>). Set the UTXEN bit (UxSTA<10>), thereby enabling a transmission. Note: 4. 5. The UTXEN bit must be set after the UARTEN bit is set to enable UART transmissions. Write the byte to be transmitted to the lower byte of UxTXREG. The value will be transferred to the Transmit Shift register (UxTSR) immediately and the serial bit stream will start shifting out during the next rising edge of the baud clock. Alternatively, the data byte may be written while UTXEN = 0, following which the user may set UTXEN. This will cause the serial bit stream to begin immediately because the baud clock will start from a cleared state. A Transmit interrupt will be generated depending on the value of the interrupt control bit UTXISEL (UxSTA<15>). 17.3.2 TRANSMITTING IN 9-BIT DATA MODE The sequence of steps involved in the transmission of 9-bit data is similar to 8-bit transmission, except that a 16-bit data word (of which the upper 7 bits are always clear) must be written to the UxTXREG register. 17.3.3 TRANSMIT BUFFER (UXTXB) The transmit buffer is 9 bits wide and 4 characters deep. Including the Transmit Shift Register (UxTSR), the user effectively has a 5-deep FIFO (First In First Out) buffer. The UTXBF status bit (UxSTA<9>) indicates whether the transmit buffer is full. If a user attempts to write to a full buffer, the new data will not be accepted into the FIFO, and no data shift will occur within the buffer. This enables recovery from a buffer overrun condition. The FIFO is reset during any device Reset, but is not affected when the device enters or wakes up from a Power-Saving mode. © 2006 Microchip Technology Inc. DS70118G-page 105 dsPIC30F2010 17.3.4 TRANSMIT INTERRUPT The transmit interrupt flag (U1TXIF or U2TXIF) is located in the corresponding interrupt flag register. The transmitter generates an edge to set the UxTXIF bit. The condition for generating the interrupt depends on UTXISEL control bit: a) b) If UTXISEL = 0, an interrupt is generated when a word is transferred from the Transmit buffer to the Transmit Shift register (UxTSR). This means that the transmit buffer has at least one empty word. If UTXISEL = 1, an interrupt is generated when a word is transferred from the Transmit buffer to the Transmit Shift register (UxTSR) and the Transmit buffer is empty. Switching between the two interrupt modes during operation is possible and sometimes offers more flexibility. 17.3.5 TRANSMIT BREAK 17.4.2 RECEIVE BUFFER (UXRXB) The receive buffer is 4 words deep. Including the Receive Shift register (UxRSR), the user effectively has a 5-word deep FIFO buffer. URXDA (UxSTA<0>) = 1 indicates that the receive buffer has data available. URXDA = 0 implies that the buffer is empty. If a user attempts to read an empty buffer, the old values in the buffer will be read and no data shift will occur within the FIFO. The FIFO is reset during any device Reset. It is not affected when the device enters or wakes up from a Power-Saving mode. 17.4.3 RECEIVE INTERRUPT The receive interrupt flag (U1RXIF) can be read from the corresponding interrupt flag register. The interrupt flag is set by an edge generated by the receiver. The condition for setting the receive interrupt flag depends on the settings specified by the URXISEL<1:0> (UxSTA<7:6>) control bits. Setting the UTXBRK bit (UxSTA<11>) will cause the UxTX line to be driven to logic ‘0’. The UTXBRK bit overrides all transmission activity. Therefore, the user should generally wait for the transmitter to be Idle before setting UTXBRK. a) To send a break character, the UTXBRK bit must be set by software and must remain set for a minimum of 13 baud clock cycles. The UTXBRK bit is then cleared by software to generate Stop bits. The user must wait for a duration of at least one or two baud clock cycles in order to ensure a valid Stop bit(s) before reloading the UxTXB or starting other transmitter activity. Transmission of a break character does not generate a transmit interrupt. b) 17.4 Switching between the Interrupt modes during operation is possible, though generally not advisable during normal operation. 17.4.1 Receiving Data RECEIVING IN 8-BIT OR 9-BIT DATA MODE The following steps must be performed while receiving 8-bit or 9-bit data: 1. 2. 3. 4. 5. Set up the UART (see Section 17.3.1 “Transmitting in 8-bit data mode”). Enable the UART (see Section 17.3.1 “Transmitting in 8-bit data mode”). A receive interrupt will be generated when one or more data words have been received, depending on the receive interrupt settings specified by the URXISEL bits (UxSTA<7:6>). Read the OERR bit to determine if an overrun error has occurred. The OERR bit must be reset in software. Read the received data from UxRXREG. The act of reading UxRXREG will move the next word to the top of the receive FIFO, and the PERR and FERR values will be updated. DS70118G-page 106 c) If URXISEL<1:0> = 00 or 01, an interrupt is generated every time a data word is transferred from the Receive Shift Register (UxRSR) to the Receive Buffer. There may be one or more characters in the receive buffer. If URXISEL<1:0> = 10, an interrupt is generated when a word is transferred from the Receive Shift Register (UxRSR) to the Receive Buffer, which, as a result of the transfer, contains 3 characters. If URXISEL<1:0> = 11, an interrupt is set when a word is transferred from the Receive Shift Register (UxRSR) to the Receive Buffer, which, as a result of the transfer, contains 4 characters (i.e., becomes full). 17.5 17.5.1 Reception Error Handling RECEIVE BUFFER OVERRUN ERROR (OERR BIT) The OERR bit (UxSTA<1>) is set if all of the following conditions occur: a) b) c) The receive buffer is full. The receive shift register is full, but unable to transfer the character to the receive buffer. The Stop bit of the character in the UxRSR is detected, indicating that the UxRSR needs to transfer the character to the buffer. Once OERR is set, no further data is shifted in UxRSR (until the OERR bit is cleared in software or a Reset occurs). The data held in UxRSR and UxRXREG remains valid. © 2006 Microchip Technology Inc. dsPIC30F2010 17.5.2 FRAMING ERROR (FERR) The FERR bit (UxSTA<2>) is set if a ‘0’ is detected instead of a Stop bit. If two Stop bits are selected, both Stop bits must be ‘1’, otherwise FERR will be set. The read-only FERR bit is buffered along with the received data. It is cleared on any Reset. 17.5.3 PARITY ERROR (PERR) The PERR bit (UxSTA<3>) is set if the parity of the received word is incorrect. This error bit is applicable only if a Parity mode (odd or even) is selected. The read-only PERR bit is buffered along with the received data bytes. It is cleared on any Reset. 17.5.4 IDLE STATUS When the receiver is active (i.e., between the initial detection of the Start bit and the completion of the Stop bit), the RIDLE bit (UxSTA<4>) is ‘0’. Between the completion of the Stop bit and detection of the next Start bit, the RIDLE bit is ‘1’, indicating that the UART is Idle. 17.5.5 RECEIVE BREAK The receiver will count and expect a certain number of bit times based on the values programmed in the PDSEL (UxMODE<2:1>) and STSEL (UxMODE<0>) bits. If the break is longer than 13 bit times, the reception is considered complete after the number of bit times specified by PDSEL and STSEL. The URXDA bit is set, FERR is set, zeros are loaded into the receive FIFO, interrupts are generated, if appropriate, and the RIDLE bit is set. When the module receives a long break signal and the receiver has detected the Start bit, the data bits and the invalid Stop bit (which sets the FERR), the receiver must wait for a valid Stop bit before looking for the next Start bit. It cannot assume that the break condition on the line is the next Start bit. Break is regarded as a character containing all ‘0’s, with the FERR bit set. The break character is loaded into the buffer. No further reception can occur until a Stop bit is received. Note that RIDLE goes high when the Stop bit has not been received yet. 17.6 17.7 Loopback Mode Setting the LPBACK bit enables this special mode in which the UxTX pin is internally connected to the UxRX pin. When configured for the Loopback mode, the UxRX pin is disconnected from the internal UART receive logic. However, the UxTX pin still functions as in a normal operation. To select this mode: a) b) c) Configure UART for desired mode of operation. Set LPBACK = 1 to enable Loopback mode. Enable transmission as defined in Section 17.3 “Transmitting Data”. 17.8 Baud Rate Generator The UART has a 16-bit Baud Rate Generator to allow maximum flexibility in baud rate generation. The Baud Rate Generator register (UxBRG) is readable and writable. The baud rate is computed as follows: BRG = 16-bit value held in UxBRG register (0 through 65535) FCY = Instruction Clock Rate (1/TCY) The Baud Rate is given by Equation 17-1. EQUATION 17-1: BAUD RATE Baud Rate = FCY / (16 * (BRG + 1)) Therefore, maximum baud rate possible is FCY /16 (if BRG = 0), and the minimum baud rate possible is FCY / (16 * 65536). With a full 16-bit Baud Rate Generator, at 30 MIPs operation, the minimum baud rate achievable is 28.5 bps. 17.9 Auto Baud Support To allow the system to determine baud rates of received characters, the input can be optionally linked to a selected capture input. To enable this mode, the user must program the input capture module to detect the falling and rising edges of the Start bit. Address Detect Mode Setting the ADDEN bit (UxSTA<5>) enables this special mode, in which a 9th bit (URX8) value of ‘1’ identifies the received word as an address rather than data. This mode is only applicable for 9-bit data communication. The URXISEL control bit does not have any impact on interrupt generation in this mode, since an interrupt (if enabled) will be generated every time the received word has the 9th bit set. © 2006 Microchip Technology Inc. DS70118G-page 107 dsPIC30F2010 17.10 UART Operation During CPU Sleep and Idle Modes 17.10.1 UART OPERATION DURING CPU SLEEP MODE When the device enters Sleep mode, all clock sources to the module are shutdown and stay at logic ‘0’. If entry into Sleep mode occurs while a transmission is in progress, then the transmission is aborted. The UxTX pin is driven to logic ‘1’. Similarly, if entry into Sleep mode occurs while a reception is in progress, then the reception is aborted. The UxSTA, UxMODE, transmit and receive registers and buffers, and the UxBRG register are not affected by Sleep mode. 17.10.2 UART OPERATION DURING CPU IDLE MODE For the UART, the USIDL bit selects if the module will stop operation when the device enters Idle mode, or whether the module will continue on Idle. If USIDL = 0, the module will continue operation during Idle mode. If USIDL = 1, the module will stop on Idle. If the WAKE bit (UxMODE<7>) is set before the device enters Sleep mode, then a falling edge on the UxRX pin will generate a receive interrupt. The Receive Interrupt Select mode bit (URXISEL) has no effect for this function. If the receive interrupt is enabled, then this will wake-up the device from Sleep. The UARTEN bit must be set in order to generate a wake-up interrupt. DS70118G-page 108 © 2006 Microchip Technology Inc. © 2006 Microchip Technology Inc. TABLE 17-1: UART1 REGISTER MAP SFR Name Addr. Bit 15 Bit 14 Bit 13 Bit 12 Bit 11 U1MODE 020C UARTEN — USIDL — U1STA 020E UTXISEL — — — — U1TXREG 0210 — — — — — U1RXREG 0212 — — — — — U1BRG 0214 Bit 10 ALTIO Bit 9 Bit 8 Bit 7 LPBACK Bit 5 Bit 4 ABAUD Bit 3 — PERR Bit 0 Reset State — TRMT — — UTX8 Transmit Register 0000 000u uuuu uuuu — — URX8 Receive Register 0000 0000 0000 0000 Baud Rate Generator Prescaler — Bit 1 — URXISEL1 URXISEL0 ADDEN RIDLE Bit 2 UTXBF UTXBRK UTXEN WAKE Bit 6 PDSEL1 PDSEL0 STSEL 0000 0000 0000 0000 FERR OERR URXDA 0000 0001 0001 0000 0000 0000 0000 0000 Legend: u = uninitialized bit Note: Refer to “dsPIC30F Family Reference Manual” (DS70046) for descriptions of register bit fields. dsPIC30F2010 DS70118G-page 109 dsPIC30F2010 NOTES: DS70118G-page 110 © 2006 Microchip Technology Inc. dsPIC30F2010 18.0 10-BIT HIGH-SPEED ANALOGTO-DIGITAL CONVERTER (ADC) MODULE The ADC module has six 16-bit registers: • • • • • • Note: This data sheet summarizes features of this group of dsPIC30F devices and is not intended to be a complete reference source. For more information on the CPU, peripherals, register descriptions and general device functionality, refer to the “dsPIC30F Family Reference Manual” (DS70046). The ADCON1, ADCON2 and ADCON3 registers control the operation of the ADC module. The ADCHS register selects the input channels to be converted. The ADPCFG register configures the port pins as analog inputs or as digital I/O. The ADCSSL register selects inputs for scanning. The10-bit high-speed Analog-to-Digital Converter (ADC) allows conversion of an analog input signal to a 10-bit digital number. This module is based on a Successive Approximation Register (SAR) architecture, and provides a maximum sampling rate of 500 ksps. The ADC module has up to 16 analog inputs which are multiplexed into four sample and hold amplifiers. The output of the sample and hold is the input into the converter, which generates the result. The analog reference voltages are software selectable to either the device supply voltage (AVDD/AVSS) or the voltage level on the (VREF+/VREF-) pin. The ADC has a unique feature of being able to operate while the device is in Sleep mode. FIGURE 18-1: A/D Control Register1 (ADCON1) A/D Control Register2 (ADCON2) A/D Control Register3 (ADCON3) A/D Input Select Register (ADCHS) A/D Port Configuration Register (ADPCFG) A/D Input Scan Selection Register (ADCSSL) Note: The SSRC<2:0>, ASAM, SIMSAM, SMPI<3:0>, BUFM and ALTS bits, as well as the ADCON3 and ADCSSL registers, must not be written to while ADON = 1. This would lead to indeterminate results. The block diagram of the ADC module is shown in Figure 18-1. 10-BIT HIGH-SPEED ADC FUNCTIONAL BLOCK DIAGRAM AVDD AVSS VREF+ VREF- + - AN1 AN1 AN4 AN2 AN5 CH1 ADC 10-bit Result S/H CH2 16-word, 10-bit Dual Port Buffer + - S/H CH3 CH1,CH2, CH3,CH0 Sample AN3 AN0 AN1 AN2 AN3 AN4 AN4 AN5 AN5 + AN1 - © 2006 Microchip Technology Inc. Conversion Logic + - AN2 S/H Input Switches S/H Sample/Sequence Control Bus Interface AN0 AN3 Data Format AN0 Input MUX Control CH0 DS70118G-page 111 dsPIC30F2010 18.1 A/D Result Buffer The module contains a 16-word dual port read-only buffer, called ADCBUF0...ADCBUFF, to buffer the ADC results. The RAM is 10 bits wide, but is read into different format 16-bit words. The contents of the sixteen ADC conversion result buffer registers, ADCBUF0 through ADCBUFF, cannot be written by user software. 18.2 Conversion Operation After the ADC module has been configured, the sample acquisition is started by setting the SAMP bit. Various sources, such as a programmable bit, timer time-outs and external events, will terminate acquisition and start a conversion. When the A/D conversion is complete, the result is loaded into ADCBUF0...ADCBUFF, and the A/D interrupt flag ADIF and the DONE bit are set after the number of samples specified by the SMPI bit. The following steps should be followed for doing an A/D conversion: 1. Configure the ADC module: - Configure analog pins, voltage reference and digital I/O - Select A/D input channels - Select A/D conversion clock - Select A/D conversion trigger - Turn on A/D module 2. Configure A/D interrupt (if required): - Clear ADIF bit - Select A/D interrupt priority 3. Start sampling. 4. Wait the required acquisition time. 5. Trigger acquisition end, start conversion 6. Wait for A/D conversion to complete, by either: - Waiting for the A/D interrupt - Waiting for the DONE bit to get set 7. Read A/D result buffer, clear ADIF if required. 18.3 Selecting the Conversion Sequence Several groups of control bits select the sequence in which the A/D connects inputs to the sample/hold channels, converts channels, writes the buffer memory, and generates interrupts. The sequence is controlled by the sampling clocks. The SIMSAM bit controls the acquire/convert sequence for multiple channels. If the SIMSAM bit is ‘0’, the two or four selected channels are acquired and converted sequentially, with two or four sample clocks. If the SIMSAM bit is ‘1’, two or four selected channels are acquired simultaneously, with one sample clock. The channels are then converted sequentially. Obviously, if there is only 1 channel selected, the SIMSAM bit is not applicable. DS70118G-page 112 The CHPS bits selects how many channels are sampled. This can vary from 1, 2 or 4 channels. If CHPS selects 1 channel, the CH0 channel will be sampled at the sample clock and converted. The result is stored in the buffer. If CHPS selects 2 channels, the CH0 and CH1 channels will be sampled and converted. If CHPS selects 4 channels, the CH0, CH1, CH2 and CH3 channels will be sampled and converted. The SMPI bits select the number of acquisition/conversion sequences that would be performed before an interrupt occurs. This can vary from 1 sample per interrupt to 16 samples per interrupt. The user cannot program a combination of CHPS and SMPI bits that specifies more than 16 conversions per interrupt, or 8 conversions per interrupt, depending on the BUFM bit. The BUFM bit, when set, will split the 16-word results buffer (ADCBUF0...ADCBUFF) into two 8-word groups. Writing to the 8-word buffers will be alternated on each interrupt event. Use of the BUFM bit will depend on how much time is available for moving data out of the buffers after the interrupt, as determined by the application. If the processor can quickly unload a full buffer within the time it takes to acquire and convert one channel, the BUFM bit can be ‘0’ and up to 16 conversions may be done per interrupt. The processor will have one sample and conversion time to move the sixteen conversions. If the processor cannot unload the buffer within the acquisition and conversion time, the BUFM bit should be ‘1’. For example, if SMPI<3:0> (ADCON2<5:2>) = 0111, then eight conversions will be loaded into 1/2 of the buffer, following which an interrupt occurs. The next eight conversions will be loaded into the other 1/2 of the buffer. The processor will have the entire time between interrupts to move the eight conversions. The ALTS bit can be used to alternate the inputs selected during the sampling sequence. The input multiplexer has two sets of sample inputs: MUX A and MUX B. If the ALTS bit is ‘0’, only the MUX A inputs are selected for sampling. If the ALTS bit is ‘1’ and SMPI<3:0> = 0000, on the first sample/convert sequence, the MUX A inputs are selected, and on the next acquire/convert sequence, the MUX B inputs are selected. The CSCNA bit (ADCON2<10>) will allow the CH0 channel inputs to be alternately scanned across a selected number of analog inputs for the MUX A group. The inputs are selected by the ADCSSL register. If a particular bit in the ADCSSL register is ‘1’, the corresponding input is selected. The inputs are always scanned from lower to higher numbered inputs, starting after each interrupt. If the number of inputs selected is greater than the number of samples taken per interrupt, the higher numbered inputs are unused. © 2006 Microchip Technology Inc. dsPIC30F2010 18.4 Programming the Start of Conversion Trigger The conversion trigger will terminate acquisition and start the requested conversions. The SSRC<2:0> bits select the source of the conversion trigger. The SSRC bits provide for up to 5 alternate sources of conversion trigger. When SSRC<2:0> = 000, the conversion trigger is under software control. Clearing the SAMP bit will cause the conversion trigger. When SSRC<2:0> = 111 (Auto-Start mode), the conversion trigger is under A/D clock control. The SAMC bits select the number of A/D clocks between the start of acquisition and the start of conversion. This provides the fastest conversion rates on multiple channels. SAMC must always be at least 1 clock cycle. Other trigger sources can come from timer modules, Motor Control PWM module or external interrupts. Note: To operate the A/D at the maximum specified conversion speed, the Auto Convert Trigger option should be selected (SSRC = 111) and the Auto Sample Time bits should be set to 1 TAD (SAMC = 00001). This configuration will give a total conversion period (sample + convert) of 13 TAD. The use of any other conversion trigger will result in additional TAD cycles to synchronize the external event to the A/D. 18.5 Aborting a Conversion Clearing the ADON bit during a conversion will abort the current conversion and stop the sampling sequencing. The ADCBUF will not be updated with the partially completed A/D conversion sample. That is, the ADCBUF will continue to contain the value of the last completed conversion (or the last value written to the ADCBUF register). If the clearing of the ADON bit coincides with an auto start, the clearing has a higher priority. 18.6 Selecting the A/D Conversion Clock The A/D conversion requires 12 TAD. The source of the A/D conversion clock is software selected using a six bit counter. There are 64 possible options for TAD. EQUATION 18-1: A/D CONVERSION CLOCK TAD = TCY * (0.5 * (ADCS<5:0> + 1)) TAD ADCS<5:0> = 2 –1 TCY The internal RC oscillator is selected by setting the ADRC bit. For correct A/D conversions, the A/D conversion clock (TAD) must be selected to ensure a minimum TAD time of 83.33 nsec (for VDD = 5V). Refer to the Section 22.0 "Electrical Characteristics" for minimum TAD under other operating conditions. Example 18-1 shows a sample calculation for the ADCS<5:0> bits, assuming a device operating speed of 30 MIPS. EXAMPLE 18-1: A/D CONVERSION CLOCK CALCULATION TAD = 84 nsec TCY = 33 nsec (30 MIPS) TAD –1 TCY 84 nsec =2• 33 nsec = 4.09 ADCS<5:0> = 2 –1 Therefore, Set ADCS<5:0> = 5 TCY (ADCS<5:0> + 1) 2 33 nsec = (5 + 1) 2 Actual TAD = = 99 nsec After the A/D conversion is aborted, a 2 TAD wait is required before the next sampling may be started by setting the SAMP bit. If sequential sampling is specified, the A/D will continue at the next sample pulse which corresponds with the next channel converted. If simultaneous sampling is specified, the A/D will continue with the next multichannel group conversion sequence. © 2006 Microchip Technology Inc. DS70118G-page 113 dsPIC30F2010 18.7 A/D Conversion Speeds The dsPIC30F 10-bit ADC specifications permit a maximum 1 Msps sampling rate. Table 18-1 summarizes the conversion speeds for the dsPIC30F 10-bit ADC and the required operating conditions. TABLE 18-1: 10-BIT A/D CONVERSION RATE PARAMETERS dsPIC30F 10-bit A/D Converter Conversion Rates A/D Speed Up to 1 Msps(1) TAD Sampling Minimum Time Min 83.33 ns 12 TAD RS Max VDD Temperature 500Ω 4.5V to 5.5V -40°C to +85°C A/D Channels Configuration VREF- VREF+ CH1, CH2 or CH3 ANx S/H ADC CH0 S/H Up to 750 ksps(1) 95.24 ns 2 TAD 500Ω 4.5V to 5.5V -40°C to +85°C VREF- VREF+ CHX ANx S/H Up to 600 ksps(1) 138.89 ns 12 TAD 500Ω 3.0V to 5.5V ADC -40°C to +125°C VREF- VREF+ CH1, CH2 or CH3 ANx S/H CH0 ADC S/H Up to 500 ksps 153.85 ns 1 TAD 5.0 kΩ 4.5V to 5.5V -40°C to +125°C VREF- VREF+ or or AVSS AVDD CHX ANx S/H ADC ANx or VREF- Up to 300 ksps 256.41 ns 1 TAD 5.0 kΩ 3.0V to 5.5V -40°C to +125°C VREF- VREF+ or or AVSS AVDD CHX ANx S/H ADC ANx or VREF- Note 1: External VREF- and VREF+ pins must be used for correct operation. See Figure 18-2 for recommended circuit. DS70118G-page 114 © 2006 Microchip Technology Inc. dsPIC30F2010 Figure 18-2 depicts the recommended circuit for the conversion rates above 500 ksps. The configuration guidelines give the required setup values for the conversion speeds above 500 ksps, since they require external VREF pins usage and there are some differences in the configuration procedure. Configuration details that are not critical to the conversion speed have been omitted. FIGURE 18-2: ADC VOLTAGE REFERENCE SCHEMATIC VDD R2 10 C2 0.1 μF VDD C1 0.01 μF 10 R1 VDD AVSS AVDD VREF- VREF+ C8 1 μF dsPIC30F2010 VDD VDD VSS VDD VSS VDD C5 1 μF VDD 18.7.1 1 Msps CONFIGURATION GUIDELINE The configuration for 1 Msps operation is dependent on whether a single input pin is to be sampled or whether multiple pins will be sampled. 18.7.1.1 Single Analog Input For conversions at 1 Msps for a single analog input, at least two sample and hold channels must be enabled. The analog input multiplexer must be configured so that the same input pin is connected to both sample and hold channels. The A/D converts the value held on one S/H channel, while the second S/H channel acquires a new input sample. 18.7.1.2 Multiple Analog Inputs The A/D converter can also be used to sample multiple analog inputs using multiple sample and hold channels. In this case, the total 1 Msps conversion rate is divided among the different input signals. For example, four inputs can be sampled at a rate of 250 ksps for each signal or two inputs could be sampled at a rate of 500 ksps for each signal. Sequential sampling must be used in this configuration to allow adequate sampling time on each input. 18.7.1.3 1 Msps Configuration Items • Connect external VREF+ and VREF- pins following the recommended circuit shown in Figure 18-2 • Set SSRC<2:0> = 111 in the ADCON1 register to enable the auto-convert option • Enable automatic sampling by setting the ASAM control bit in the ADCON1 register • Enable sequential sampling by clearing the SIMSAM bit in the ADCON1 register • Enable at least two sample and hold channels by writing the CHPS<1:0> control bits in the ADCON2 register • Write the SMPI<3:0> control bits in the ADCON2 register for the desired number of conversions between interrupts. At a minimum, set SMPI<3:0> = 0001 since at least two sample and hold channels should be enabled • Configure the A/D clock period to be: 1 = 83.33 ns 12 x 1,000,000 by writing to the ADCS<5:0> control bits in the ADCON3 register • Configure the sampling time to be 2 TAD by writing: SAMC<4:0> = 00010 • Select at least two channels per analog input pin by writing to the ADCHS register The following configuration items are required to achieve a 1 Msps conversion rate. • Comply with conditions provided in Table 19-2 © 2006 Microchip Technology Inc. DS70118G-page 115 dsPIC30F2010 18.7.2 750 ksps CONFIGURATION GUIDELINE The following configuration items are required to achieve a 750 ksps conversion rate. This configuration assumes that a single analog input is to be sampled. • Comply with conditions provided in Table 18-2 • Connect external VREF+ and VREF- pins following the recommended circuit shown in Figure 18-2 • Set SSRC<2:0> = 111 in the ADCON1 register to enable the auto-convert option • Enable automatic sampling by setting the ASAM control bit in the ADCON1 register • Enable one sample and hold channel by setting CHPS<1:0> = 00 in the ADCON2 register • Write the SMPI<3:0> control bits in the ADCON2 register for the desired number of conversions between interrupts • Configure the A/D clock period to be: 1 = 95.24 ns (12 + 2) X 750,000 by writing to the ADCS<5:0> control bits in the ADCON3 register • Configure the sampling time to be 2 TAD by writing: SAMC<4:0> = 00010 18.7.3 600 ksps CONFIGURATION GUIDELINE The configuration for 600 ksps operation is dependent on whether a single input pin is to be sampled or whether multiple pins will be sampled. 18.7.3.1 Single Analog Input When performing conversions at 600 ksps for a single analog input, at least two sample and hold channels must be enabled. The analog input multiplexer must be configured so that the same input pin is connected to both sample and hold channels. The A/D converts the value held on one S/H channel, while the second S/H channel acquires a new input sample. DS70118G-page 116 18.7.3.2 Multiple Analog Input The ADC can also be used to sample multiple analog inputs using multiple sample and hold channels. In this case, the total 600 ksps conversion rate is divided among the different input signals. For example, four inputs can be sampled at a rate of 150 ksps for each signal or two inputs can be sampled at a rate of 300 ksps for each signal. Sequential sampling must be used in this configuration to allow adequate sampling time on each input. 18.7.3.3 600 ksps Configuration Items The following configuration items are required to achieve a 600 ksps conversion rate. • Comply with conditions provided in Table 18-2 • Connect external VREF+ and VREF- pins following the recommended circuit shown in Figure 18-2 • Set SSRC<2:0> = 111 in the ADCON1 register to enable the auto-convert option • Enable automatic sampling by setting the ASAM control bit in the ADCON1 register • Enable sequential sampling by clearing the SIMSAM bit in the ADCON1 register • Enable at least two sample and hold channels by writing the CHPS<1:0> control bits in the ADCON2 register • Write the SMPI<3:0> control bits in the ADCON2 register for the desired number of conversions between interrupts. At a minimum, set SMPI<3:0> = 0001 since at least two sample and hold channels should be enabled • Configure the A/D clock period to be: 1 = 138.89 ns 12 x 600,000 by writing to the ADCS<5:0> control bits in the ADCON3 register • Configure the sampling time to be 2 TAD by writing: SAMC<4:0> = 00010 Select at least two channels per analog input pin by writing to the ADCHS register. © 2006 Microchip Technology Inc. dsPIC30F2010 18.8 A/D Acquisition Requirements The analog input model of the 10-bit ADC is shown in Figure 18-3. The total sampling time for the A/D is a function of the internal amplifier settling time, device VDD and the holding capacitor charge time. For the A/D converter to meet its specified accuracy, the charge holding capacitor (CHOLD) must be allowed to fully charge to the voltage level on the analog input pin. The source impedance (RS), the interconnect impedance (RIC), and the internal sampling switch (RSS) impedance combine to directly affect the time required to charge the capacitor CHOLD. The combined impedance of the analog sources must therefore be small enough to fully charge the holding capacitor within the chosen sample time. To minimize the effects of pin leakage currents on the accuracy of the A/D converter, the maximum recommended source impedance, RS, is 5 kΩ. After the analog input channel is selected (changed), this sampling function must be completed prior to starting the conversion. The internal holding capacitor will be in a discharged state prior to each sample operation. FIGURE 18-3: ADC ANALOG INPUT MODEL VDD Rs VA The user must allow at least 1 TAD period of sampling time, TSAMP, between conversions to allow each sample to be acquired. This sample time may be controlled manually in software by setting/clearing the SAMP bit, or it may be automatically controlled by the A/D converter. In an automatic configuration, the user must allow enough time between conversion triggers so that the minimum sample time can be satisfied. Refer to the Electrical Specifications for TAD and sample time requirements. ANx RIC ≤ 250Ω VT = 0.6V Sampling Switch RSS ≤ 3 kΩ RSS CPIN VT = 0.6V I leakage ± 500 nA CHOLD = DAC capacitance = 4.4 pF VSS Legend: CPIN = input capacitance = threshold voltage VT I leakage = leakage current at the pin due to various junctions = interconnect resistance RIC = sampling switch resistance RSS = sample/hold capacitance (from DAC) CHOLD Note: CPIN value depends on device package and is not tested. Effect of CPIN negligible if Rs ≤ 5 kΩ. © 2006 Microchip Technology Inc. DS70118G-page 117 dsPIC30F2010 18.9 Module Power-Down Modes If the A/D interrupt is enabled, the device will wake-up from Sleep. If the A/D interrupt is not enabled, the A/D module will then be turned off, although the ADON bit will remain set. The module has 3 internal power modes. When the ADON bit is ‘1’, the module is in Active mode; it is fully powered and functional. When ADON is ‘0’, the module is in Off mode. The digital and analog portions of the circuit are disabled for maximum current savings. In order to return to the Active mode from Off mode, the user must wait for the ADC circuitry to stabilize. 18.10.2 The ADSIDL bit selects if the module will stop on Idle or continue on Idle. If ADSIDL = 0, the module will continue operation on assertion of Idle mode. If ADSIDL = 1, the module will stop on Idle. 18.10 A/D Operation During CPU Sleep and Idle Modes 18.10.1 18.11 Effects of a Reset A/D OPERATION DURING CPU SLEEP MODE A device Reset forces all registers to their Reset state. This forces the A/D module to be turned off, and any conversion and acquisition sequence is aborted. The values that are in the ADCBUF registers are not modified. The A/D result register will contain unknown data after a Power-on Reset. When the device enters Sleep mode, all clock sources to the module are shutdown and stay at logic ‘0’. If Sleep occurs in the middle of a conversion, the conversion is aborted. The converter will not continue with a partially completed conversion on exit from Sleep mode. 18.12 Output Formats Register contents are not affected by the device entering or leaving Sleep mode. The A/D result is 10 bits wide. The data buffer RAM is also 10 bits wide. The 10-bit data can be read in one of four different formats. The FORM<1:0> bits select the format. Each of the output formats translates to a 16-bit result on the data bus. The A/D module can operate during Sleep mode if the A/D clock source is set to RC (ADRC = 1). When the RC clock source is selected, the A/D module waits one instruction cycle before starting the conversion. This allows the SLEEP instruction to be executed, which eliminates all digital switching noise from the conversion. When the conversion is complete, the DONE bit will be set and the result loaded into the ADCBUF register. FIGURE 18-4: A/D OPERATION DURING CPU IDLE MODE Write data will always be in right justified (integer) format. A/D OUTPUT DATA FORMATS RAM Contents: d09 d08 d07 d06 d05 d04 d03 d02 d01 d00 Read to Bus: Signed Fractional (1.15) d09 d08 d07 d06 d05 d04 d03 d02 d01 d00 0 0 0 0 0 0 Fractional (1.15) d09 d08 d07 d06 d05 d04 d03 d02 d01 d00 0 0 0 0 0 0 Signed Integer Integer DS70118G-page 118 d09 d09 d09 d09 d09 d09 d09 d08 d07 d06 d05 d04 d03 d02 d01 d00 0 0 0 0 0 0 d09 d08 d07 d06 d05 d04 d03 d02 d01 d00 © 2006 Microchip Technology Inc. dsPIC30F2010 18.13 Configuring Analog Port Pins 18.14 Connection Considerations The use of the ADPCFG and TRIS registers control the operation of the A/D port pins. The port pins that are desired as analog inputs must have their corresponding TRIS bit set (input). If the TRIS bit is cleared (output), the digital output level (VOH or VOL) will be converted. The analog inputs have diodes to VDD and VSS as ESD protection. This requires that the analog input be between VDD and VSS. If the input voltage exceeds this range by greater than 0.3V (either direction), one of the diodes becomes forward biased and it may damage the device if the input current specification is exceeded. The A/D operation is independent of the state of the CH0SA<3:0>/CH0SB<3:0> bits and the TRIS bits. An external RC filter is sometimes added for antialiasing of the input signal. The R component should be selected to ensure that the sampling time requirements are satisfied. Any external components connected (via high-impedance) to an analog input pin (capacitor, zener diode, etc.) should have very little leakage current at the pin. When reading the PORT register, all pins configured as analog input channels will read as cleared. Pins configured as digital inputs will not convert an analog input. Analog levels on any pin that is defined as a digital input (including the ANx pins), may cause the input buffer to consume current that exceeds the device specifications. © 2006 Microchip Technology Inc. DS70118G-page 119 SFR Name Addr. ADC REGISTER MAP Bit 15 Bit 14 Bit 13 Bit 12 Bit 11 Bit 10 ADCBUF0 0280 — — — — — — ADC Data Buffer 0 0000 00uu uuuu uuuu ADCBUF1 0282 — — — — — — ADC Data Buffer 1 0000 00uu uuuu uuuu ADCBUF2 0284 — — — — — — ADC Data Buffer 2 0000 00uu uuuu uuuu ADCBUF3 0286 — — — — — — ADC Data Buffer 3 0000 00uu uuuu uuuu ADCBUF4 0288 — — — — — — ADC Data Buffer 4 0000 00uu uuuu uuuu ADCBUF5 028A — — — — — — ADC Data Buffer 5 0000 00uu uuuu uuuu ADCBUF6 028C — — — — — — ADC Data Buffer 6 0000 00uu uuuu uuuu ADCBUF7 028E — — — — — — ADC Data Buffer 7 0000 00uu uuuu uuuu ADCBUF8 0290 — — — — — — ADC Data Buffer 8 0000 00uu uuuu uuuu ADCBUF9 0292 — — — — — — ADC Data Buffer 9 0000 00uu uuuu uuuu ADCBUFA 0294 — — — — — — ADC Data Buffer 10 0000 00uu uuuu uuuu ADCBUFB 0296 — — — — — — ADC Data Buffer 11 0000 00uu uuuu uuuu ADCBUFC 0298 — — — — — — ADC Data Buffer 12 0000 00uu uuuu uuuu ADCBUFD 029A — — — — — — ADC Data Buffer 13 0000 00uu uuuu uuuu ADCBUFE 029C — — — — — — ADC Data Buffer 14 0000 00uu uuuu uuuu ADCBUFF 029E — — — — — — ADC Data Buffer 15 ADCON1 02A0 ADON — ADSIDL — — — FORM<1:0> ADCON2 02A2 — — CSCNA CHPS<1:0> ADCON3 02A4 ADCHS 02A6 ADPCFG 02A8 — ADCSSL 02AA — VCFG<2:0> — — CH123NB<1:0> — Bit 9 Bit 8 SAMC<4:0> CH0SB<3:0> Bit 7 Bit 6 Bit 5 SSRC<2:0> BUFS — ADRC — CH123SB CH0NB CH123NA<1:0> — — — — — — — — — — — — — — — — — Bit 3 Bit 2 Bit 1 Bit 0 Reset State 0000 00uu uuuu uuuu SIMSAM ASAM SMPI<3:0> SAMP DONE 0000 0000 0000 0000 BUFM ALTS 0000 0000 0000 0000 ADCS<5:0> CH0NA — PCFG5 PCFG4 PCFG3 PCFG2 PCFG1 PCFG0 0000 0000 0000 0000 — CSSL5 CSSL4 CSSL3 CSSL2 CSSL1 CSSL0 Refer to “dsPIC30F Family Reference Manual” (DS70046) for descriptions of register bit fields. CH0SA<3:0> 0000 0000 0000 0000 CH123SA Legend: u = uninitialized bit Note: Bit 4 0000 0000 0000 0000 0000 0000 0000 0000 dsPIC30F2010 DS70118G-page 120 TABLE 18-2: © 2006 Microchip Technology Inc. dsPIC30F2010 19.0 SYSTEM INTEGRATION Note: This data sheet summarizes features of this group of dsPIC30F devices and is not intended to be a complete reference source. For more information on the CPU, peripherals, register descriptions and general device functionality, refer to the “dsPIC30F Family Reference Manual” (DS70046). For more information on the device instruction set and programming, refer to the “dsPIC30F/ 33F Programmer’s Reference Manual” (DS70157). There are several features intended to maximize system reliability, minimize cost through elimination of external components, provide Power-Saving Operating modes and offer code protection: • Oscillator Selection • Reset - Power-on Reset (POR) - Power-up Timer (PWRT) - Oscillator Start-up Timer (OST) - Programmable Brown-out Reset (BOR) • Watchdog Timer (WDT) • Power-Saving modes (Sleep and Idle) • Code Protection • Unit ID Locations • In-Circuit Serial Programming (ICSP) programming capability 19.1 Oscillator System Overview The dsPIC30F oscillator system has the following modules and features: • Various external and internal oscillator options as clock sources • An on-chip PLL to boost internal operating frequency • A clock switching mechanism between various clock sources • Programmable clock postscaler for system power savings • A Fail-Safe Clock Monitor (FSCM) that detects clock failure and takes fail-safe measures • Clock Control Register OSCCON • Configuration bits for main oscillator selection Table 19-1 provides a summary of the dsPIC30F Oscillator Operating modes. A simplified diagram of the oscillator system is shown in Figure 19-1. Configuration bits determine the clock source upon Power-on Reset (POR) and Brown-out Reset (BOR). Thereafter, the clock source can be changed between permissible clock sources. The OSCCON register controls the clock switching and reflects system clock related status bits. dsPIC30F devices have a Watchdog Timer, which is permanently enabled via the Configuration bits, or can be software controlled. It runs off its own RC oscillator for added reliability. There are two timers that offer necessary delays on power-up. One is the Oscillator Startup Timer (OST), intended to keep the chip in Reset until the crystal oscillator is stable. The other is the Powerup Timer (PWRT), which provides a delay on power-up only, designed to keep the part in Reset while the power supply stabilizes. With these two timers on-chip, most applications need no external Reset circuitry. Sleep mode is designed to offer a very low current Power-down mode. The user can wake-up from Sleep through external Reset, Watchdog Timer Wake-up or through an interrupt. Several oscillator options are also made available to allow the part to fit a wide variety of applications. In the Idle mode, the clock sources are still active, but the CPU is shut off. The RC oscillator option saves system cost, while the LP crystal option saves power. © 2006 Microchip Technology Inc. DS70118G-page 121 dsPIC30F2010 TABLE 19-1: OSCILLATOR OPERATING MODES Oscillator Mode Description XTL 200 kHz-4 MHz crystal on OSC1:OSC2. XT 4 MHz-10 MHz crystal on OSC1:OSC2. XT w/ PLL 4x 4 MHz-10 MHz crystal on OSC1:OSC2. 4x PLL enabled. XT w/ PLL 8x 4 MHz-10 MHz crystal on OSC1:OSC2. 8x PLL enabled. XT w/ PLL 16x 4 MHz-10 MHz crystal on OSC1:OSC2. 16x PLL enabled(1). LP 32 kHz crystal on SOSCO:SOSCI(2). HS 10 MHz-25 MHz crystal. EC External clock input (0-40 MHz). ECIO External clock input (0-40 MHz). OSC2 pin is I/O. EC w/ PLL 4x External clock input (0-40 MHz). OSC2 pin is I/O. 4x PLL enabled(1). EC w/ PLL 8x External clock input (0-40 MHz). OSC2 pin is I/O. 8x PLL enabled(1). EC w/ PLL 16x External clock input (0-40 MHz). OSC2 pin is I/O. 16x PLL enabled(1). ERC External RC oscillator. OSC2 pin is FOSC/4 output(3). ERCIO External RC oscillator. OSC2 pin is I/O(3). FRC 7.37 MHz internal RC Oscillator. LPRC 512 kHz internal RC Oscillator. Note 1: dsPIC30F maximum operating frequency of 120 MHz must be met. 2: LP oscillator can be conveniently shared as system clock, as well as real-time clock for Timer1. 3: Requires external R and C. Frequency operation up to 4 MHz. DS70118G-page 122 © 2006 Microchip Technology Inc. dsPIC30F2010 FIGURE 19-1: OSCILLATOR SYSTEM BLOCK DIAGRAM Oscillator Configuration bits PWRSAV Instruction Wake-up Request FPLL OSC1 OSC2 Primary Oscillator PLL x4, x8, x16 PLL Lock COSC<1:0> Primary Osc NOSC<1:0> Primary Oscillator Stability Detector POR Done OSWEN Oscillator Start-up Timer Clock Secondary Osc Switching and Control Block SOSCO SOSCI 32 kHz LP Oscillator Secondary Oscillator Stability Detector 2 POST<1:0> Internal Fast RC Oscillator (FRC) FRC Internal Low Power RC Oscillator (LPRC) LPRC FCKSM<1:0> 2 Programmable Clock Divider System Clock Fail-Safe Clock Monitor (FSCM) CF Oscillator Trap to Timer1 © 2006 Microchip Technology Inc. DS70118G-page 123 dsPIC30F2010 19.2 19.2.2 Oscillator Configurations 19.2.1 INITIAL CLOCK SOURCE SELECTION In order to ensure that a crystal oscillator (or ceramic resonator) has started and stabilized, an oscillator start-up timer is included. It is a simple 10-bit counter that counts 1024 TOSC cycles before releasing the oscillator clock to the rest of the system. The time-out period is designated as TOST. The TOST time is involved every time the oscillator has to restart (i.e., on POR, BOR and wake-up from Sleep). The oscillator start-up timer is applied to the LP Oscillator, XT, XTL, and HS modes (upon wake-up from Sleep, POR and BOR) for the primary oscillator. While coming out of Power-on Reset or Brown-out Reset, the device selects its clock source based on: a) FOS<1:0> Configuration bits that select one of four oscillator groups. AND FPR<3:0> Configuration bits that select one of 13 oscillator choices within the primary group. b) The selection is as shown in Table 19-2. TABLE 19-2: OSCILLATOR START-UP TIMER (OST) CONFIGURATION BIT VALUES FOR CLOCK SELECTION Oscillator Mode Oscillator Source FOS1 FOS0 FPR3 FPR2 FPR1 FPR0 OSC2 Function EC Primary 1 1 1 0 1 1 CLKO ECIO Primary 1 1 1 1 0 0 I/O EC w/ PLL 4x Primary 1 1 1 1 0 1 I/O EC w/ PLL 8x Primary 1 1 1 1 1 0 I/O EC w/ PLL 16x Primary 1 1 1 1 1 1 I/O ERC Primary 1 1 1 0 0 1 CLKO ERCIO Primary 1 1 1 0 0 0 I/O XT Primary 1 1 0 1 0 0 OSC2 XT w/ PLL 4x Primary 1 1 0 1 0 1 OSC2 XT w/ PLL 8x Primary 1 1 0 1 1 0 OSC2 XT w/ PLL 16x Primary 1 1 0 1 1 1 OSC2 XTL Primary 1 1 0 0 0 X OSC2 HS Primary 1 1 0 0 1 X OSC2 LP Secondary 0 0 — — — — (Notes 1, 2) FRC Internal FRC 0 1 — — — — (Notes 1, 2) LPRC Internal LPRC 1 0 — — — — (Notes 1, 2) Note 1: 2: OSC2 pin function is determined by the Primary Oscillator mode selection (FPR<3:0>). Note that OSC1 pin cannot be used as an I/O pin, even if the secondary oscillator or an internal clock source is selected at all times. DS70118G-page 124 © 2006 Microchip Technology Inc. dsPIC30F2010 19.2.3 LP OSCILLATOR CONTROL Enabling the LP oscillator is controlled with two elements: 1. 2. The current oscillator group bits COSC<1:0>. The LPOSCEN bit (OSCCON register). The LP oscillator is ON (even during Sleep mode) if LPOSCEN = 1. The LP oscillator is the device clock if: • COSC<1:0> = 00 (LP selected as main oscillator) and • LPOSCEN = 1 Keeping the LP oscillator ON at all times allows for a fast switch to the 32 kHz system clock for lower power operation. Returning to the faster main oscillator will still require a start-up time 19.2.4 PHASE LOCKED LOOP (PLL) The PLL multiplies the clock which is generated by the primary oscillator or Fast RC oscillator. The PLL is selectable to have either gains of x4, x8, and x16. Input and output frequency ranges are summarized in Table 19-3. TABLE 19-4: TUN<3:0> Bits 0111 0110 0101 0100 0011 0010 0001 0000 1111 1110 1101 1100 1011 1010 1001 1000 19.2.6 TABLE 19-3: PLL FREQUENCY RANGE FIN PLL Multiplier FOUT 4 MHz-10 MHz x4 16 MHz-40 MHz 4 MHz-10 MHz x8 32 MHz-80 MHz 4 MHz-7.5 MHz x16 64 MHz-120 MHz The PLL features a lock output which is asserted when the PLL enters a phase locked state. Should the loop fall out of lock (e.g., due to noise), the lock signal will be rescinded. The state of this signal is reflected in the read-only LOCK bit in the OSCCON register. 19.2.5 FAST RC OSCILLATOR (FRC) The FRC oscillator is a fast (7.37 MHz ±2% nominal) internal RC oscillator. This oscillator is intended to provide reasonable device operating speeds without the use of an external crystal, ceramic resonator or RC network. The dsPIC30F operates from the FRC oscillator when the current oscillator selection control bits in the OSCCON register (OSCCON<13:12>) are set to ‘01’. The four bit field specified by TUN<3:0> (OSCCON <15:14> and OSCCON<11:10>) allows the user to tune the internal fast RC oscillator (nominal 7.37MHz). The user can tune the FRC oscillator within a range of -12% (or -960 kHz) to +10.5% (or +840 kHz) in steps of 1.50% around the factory calibrated setting, see Table 19-4. © 2006 Microchip Technology Inc. FRC TUNING FRC Frequency + 10.5% + 9.0% + 7.5% + 6.0% + 4.5% + 3.0% + 1.5% Center Frequency (oscillator is running at calibrated frequency) - 1.5% - 3.0% - 4.5% - 6.0% - 7.5% - 9.0% - 10.5% - 12.0% LOW-POWER RC OSCILLATOR (LPRC) The LPRC oscillator is a component of the Watchdog Timer (WDT) and oscillates at a nominal frequency of 512 kHz. The LPRC oscillator is the clock source for the Power-up Timer (PWRT) circuit, WDT, and clock monitor circuits. It may also be used to provide a low frequency clock source option for applications where power consumption is critical and timing accuracy is not required The LPRC oscillator is always enabled at a Power-on Reset because it is the clock source for the PWRT. After the PWRT expires, the LPRC oscillator will remain on if one of the following is true: • The Fail-Safe Clock Monitor is enabled • The WDT is enabled • The LPRC oscillator is selected as the system clock via the COSC<1:0> control bits in the OSCCON register If one of the above conditions is not true, the LPRC will shut-off after the PWRT expires. Note 1: OSC2 pin function is determined by the Primary Oscillator mode selection (FPR<3:0>). 2: OSC1 pin cannot be used as an I/O pin even if the secondary oscillator or an internal clock source is selected at all times. DS70118G-page 125 dsPIC30F2010 19.2.7 FAIL-SAFE CLOCK MONITOR The Fail-Safe Clock Monitor (FSCM) allows the device to continue to operate even in the event of an oscillator failure. The FSCM function is enabled by appropriately programming the FCKSM Configuration bits (Clock Switch and Monitor Selection bits) in the FOSC device Configuration register. If the FSCM function is enabled, the LPRC Internal oscillator will run at all times (except during Sleep mode) and will not be subject to control by the SWDTEN bit. In the event of an oscillator failure, the FSCM will generate a clock failure trap event and will switch the system clock over to the FRC oscillator. The user will then have the option to either attempt to restart the oscillator or execute a controlled shutdown. The user may decide to treat the trap as a warm Reset by simply loading the Reset address into the oscillator fail trap vector. In this event, the CF (Clock Fail) status bit (OSCCON<3>) is also set whenever a clock failure is recognized. In the event of a clock failure, the WDT is unaffected and continues to run on the LPRC clock. If the oscillator has a very slow start-up time coming out of POR, BOR or Sleep, it is possible that the PWRT timer will expire before the oscillator has started. In such cases, the FSCM will be activated and the FSCM will initiate a clock failure trap, and the COSC<1:0> bits are loaded with FRC oscillator selection. This will effectively shut-off the original oscillator that was trying to start. The OSCCON register holds the control and Status bits related to clock switching. • COSC<1:0>: Read-only status bits always reflect the current oscillator group in effect. • NOSC<1:0>: Control bits which are written to indicate the new oscillator group of choice. - On POR and BOR, COSC<1:0> and NOSC<1:0> are both loaded with the Configuration bit values FOS<1:0>. • LOCK: The LOCK status bit indicates a PLL lock. • CF: Read-only status bit indicating if a clock fail detect has occurred. • OSWEN: Control bit changes from a ‘0’ to a ‘1’ when a clock transition sequence is initiated. Clearing the OSWEN control bit will abort a clock transition in progress (used for hang-up situations). If Configuration bits FCKSM<1:0> = 1x, then the clock switching and fail-safe clock monitor functions are disabled. This is the default Configuration bit setting. If clock switching is disabled, then the FOS<1:0> and FPR<3:0> bits directly control the oscillator selection and the COSC<1:0> bits do not control the clock selection. However, these bits will reflect the clock source selection. Note: The user may detect this situation and restart the oscillator in the clock fail trap ISR. Upon a clock failure detection, the FSCM module will initiate a clock switch to the FRC Oscillator as follows: 1. 2. 3. The COSC bits (OSCCON<13:12>) are loaded with the FRC Oscillator selection value. CF bit is set (OSCCON<3>). OSWEN control bit (OSCCON<0>) is cleared. For the purpose of clock switching, the clock sources are sectioned into four groups: 1. 2. 3. 4. Primary Secondary Internal FRC Internal LPRC The user can switch between these functional groups, but cannot switch between options within a group. If the primary group is selected, then the choice within the group is always determined by the FPR<3:0> Configuration bits. 19.2.8 The application should not attempt to switch to a clock of frequency lower than 100 KHz when the fail-safe clock monitor is enabled. If such clock switching is performed, the device may generate an oscillator fail trap and switch to the Fast RC oscillator. PROTECTION AGAINST ACCIDENTAL WRITES TO OSCCON A write to the OSCCON register is intentionally made difficult because it controls clock switching and clock scaling. To write to the OSCCON low byte, the following code sequence must be executed without any other instructions in between: • Byte Write “0x46” to OSCCON low • Byte Write “0x57” to OSCCON low Byte Write is allowed for one instruction cycle. Write the desired value or use bit manipulation instruction. To write to the OSCCON high byte, the following instructions must be executed without any other instructions in between: • Byte Write “0x78” to OSCCON high • Byte Write “0x9A” to OSCCON high Byte Write is allowed for one instruction cycle. Write the desired value or use bit manipulation instruction. DS70118G-page 126 © 2006 Microchip Technology Inc. dsPIC30F2010 19.3 Reset The dsPIC30F2010 differentiates between various kinds of Reset: a) b) c) d) e) f) g) h) Power-on Reset (POR) MCLR Reset during normal operation MCLR Reset during Sleep Watchdog Timer (WDT) Reset (during normal operation) Programmable Brown-out Reset (BOR) RESET Instruction Reset cause by trap lockup (TRAPR) Reset caused by illegal opcode, or by using an uninitialized W register as an Address Pointer (IOPUWR) FIGURE 19-2: Different registers are affected in different ways by various Reset conditions. Most registers are not affected by a WDT wake-up, since this is viewed as the resumption of normal operation. Status bits from the RCON register are set or cleared differently in different Reset situations, as indicated in Table 19-5. These bits are used in software to determine the nature of the Reset. A block diagram of the on-chip Reset circuit is shown in Figure 19-2. A MCLR noise filter is provided in the MCLR Reset path. The filter detects and ignores small pulses. Internally generated Resets do not drive MCLR pin low. RESET SYSTEM BLOCK DIAGRAM RESET Instruction Digital Glitch Filter MCLR Sleep or Idle WDT Module POR VDD Rise Detect S VDD Brown-out Reset BOR BOREN R Q SYSRST Trap Conflict Illegal Opcode/ Uninitialized W Register 19.3.1 POR: POWER-ON RESET A power-on event will generate an internal POR pulse when a VDD rise is detected. The Reset pulse will occur at the POR circuit threshold voltage (VPOR), which is nominally 1.85V. The device supply voltage characteristics must meet specified starting voltage and rise rate requirements. The POR pulse will Reset a POR timer and place the device in the Reset state. The POR also selects the device clock source identified by the oscillator configuration fuses. The POR circuit inserts a small delay, TPOR, which is nominally 10 μs and ensures that the device bias circuits are stable. Furthermore, a user selected powerup time-out (TPWRT) is applied. The TPWRT parameter is based on device Configuration bits and can be 0 ms (no delay), 4 ms, 16 ms or 64 ms. The total delay is at device power-up TPOR + TPWRT. When these delays have expired, SYSRST will be negated on the next leading edge of the Q1 clock, and the PC will jump to the Reset vector. The timing for the SYSRST signal is shown in Figure 19-3 through Figure 19-5. © 2006 Microchip Technology Inc. DS70118G-page 127 dsPIC30F2010 FIGURE 19-3: TIME-OUT SEQUENCE ON POWER-UP (MCLR TIED TO VDD) VDD MCLR INTERNAL POR TOST OST TIME-OUT TPWRT PWRT TIME-OUT INTERNAL Reset FIGURE 19-4: TIME-OUT SEQUENCE ON POWER-UP (MCLR NOT TIED TO VDD): CASE 1 VDD MCLR INTERNAL POR TOST OST TIME-OUT TPWRT PWRT TIME-OUT INTERNAL Reset FIGURE 19-5: TIME-OUT SEQUENCE ON POWER-UP (MCLR NOT TIED TO VDD): CASE 2 VDD MCLR INTERNAL POR TOST OST TIME-OUT TPWRT PWRT TIME-OUT INTERNAL Reset DS70118G-page 128 © 2006 Microchip Technology Inc. dsPIC30F2010 19.3.1.1 POR with Long Crystal Start-up Time (with FSCM Enabled) The oscillator start-up circuitry is not linked to the POR circuitry. Some crystal circuits (especially low frequency crystals) will have a relatively long start-up time. Therefore, one or more of the following conditions is possible after the POR timer and the PWRT have expired: A BOR will generate a Reset pulse which will reset the device. The BOR will select the clock source, based on the device Configuration bit values (FOS<1:0> and FPR<3:0>). Furthermore, if an Oscillator mode is selected, the BOR will activate the Oscillator Start-up Timer (OST). The system clock is held until OST expires. If the PLL is used, then the clock will be held until the LOCK bit (OSCCON<5>) is ‘1’. • The oscillator circuit has not begun to oscillate. • The oscillator start-up timer has NOT expired (if a crystal oscillator is used). • The PLL has not achieved a LOCK (if PLL is used). Concurrently, the POR time-out (TPOR) and the PWRT time-out (TPWRT) will be applied before the internal Reset is released. If TPWRT = 0 and a crystal oscillator is being used, then a nominal delay of TFSCM = 100 μs is applied. The total delay in this case is (TPOR + TFSCM). If the FSCM is enabled and one of the above conditions is true, then a clock failure trap will occur. The device will automatically switch to the FRC oscillator and the user can switch to the desired crystal oscillator in the trap ISR. The BOR status bit (RCON<1>) will be set to indicate that a BOR has occurred. The BOR circuit, if enabled, will continue to operate while in Sleep or Idle modes and will reset the device should VDD fall below the BOR threshold voltage. 19.3.1.2 FIGURE 19-6: Operating without FSCM and PWRT If the FSCM is disabled and the Power-up Timer (PWRT) is also disabled, then the device will exit rapidly from Reset on power-up. If the clock source is FRC, LPRC, EXTRC or EC, it will be active immediately. VDD D If the FSCM is disabled and the system clock has not started, the device will be in a frozen state at the Reset vector until the system clock starts. From the user’s perspective, the device will appear to be in Reset until a system clock is available. 19.3.2 BOR: PROGRAMMABLE BROWN-OUT RESET The BOR module is based on an internal voltage reference circuit. The main purpose of the BOR module is to generate a device Reset when a brown-out condition occurs. Brown-out conditions are generally caused by glitches on the AC mains (i.e., missing portions of the AC cycle waveform due to bad power transmission lines or voltage sags due to excessive current draw when a large inductive load is turned on). Note: The BOR voltage trip points indicated here are nominal values provided for design guidance only. © 2006 Microchip Technology Inc. R R1 C MCLR dsPIC30F Note 1: External Power-on Reset circuit is required only if the VDD power-up slope is too slow. The diode D helps discharge the capacitor quickly when VDD powers down. 2: R should be suitably chosen so as to make sure that the voltage drop across R does not violate the device’s electrical specification. 3: R1 should be suitably chosen so as to limit any current flowing into MCLR from external capacitor C, in the event of MCLR/VPP pin breakdown due to Electrostatic Discharge (ESD) or Electrical Overstress (EOS). The BOR module allows selection of one of the following voltage trip points: • 2.6V-2.71V • 4.1V-4.4V • 4.58V-4.73V EXTERNAL POWER-ON RESET CIRCUIT (FOR SLOW VDD POWER-UP) Note: Dedicated supervisory devices, such as the MCP1XX and MCP8XX, may also be used as an external Power-on Reset circuit. DS70118G-page 129 dsPIC30F2010 Table 19-5 shows the Reset conditions for the RCON Register. Since the control bits within the RCON register are R/W, the information in the table implies that all the bits are negated prior to the action specified in the condition column. TABLE 19-5: INITIALIZATION CONDITION FOR RCON REGISTER CASE 1 Condition Power-on Reset Program Counter 0x000000 TRAPR IOPUWR EXTR SWR WDTO IDLE SLEEP POR BOR 0 0 0 0 0 0 0 1 1 Brown-out Reset 0x000000 0 0 0 0 0 0 0 0 1 MCLR Reset during normal operation 0x000000 0 0 1 0 0 0 0 0 0 Software Reset during normal operation 0x000000 0 0 0 1 0 0 0 0 0 MCLR Reset during Sleep 0x000000 0 0 1 0 0 0 1 0 0 MCLR Reset during Idle 0x000000 0 0 1 0 0 1 0 0 0 WDT Time-out Reset 0x000000 0 0 0 0 1 0 0 0 0 PC + 2 0 0 0 0 1 0 1 0 0 (1) 0 0 0 0 0 0 1 0 0 Clock Failure Trap 0x000004 0 0 0 0 0 0 0 0 0 Trap Reset 0x000000 1 0 0 0 0 0 0 0 0 Illegal Operation Trap 0x000000 0 1 0 0 0 0 0 0 0 WDT Wake-up Interrupt Wake-up from Sleep PC + 2 Legend: u = unchanged, x = unknown, - = unimplemented bit, read as ‘0’ Note 1: When the wake-up is due to an enabled interrupt, the PC is loaded with the corresponding interrupt vector. Table 19-6 shows a second example of the bit conditions for the RCON Register. In this case, it is not assumed the user has set/cleared specific bits prior to action specified in the condition column. TABLE 19-6: INITIALIZATION CONDITION FOR RCON REGISTER CASE 2 Condition Program Counter TRAPR IOPUWR EXTR SWR WDTO IDLE SLEEP POR BOR Power-on Reset 0x000000 0 0 0 0 0 0 0 1 1 Brown-out Reset 0x000000 u u u u u u u 0 1 MCLR Reset during normal operation 0x000000 u u 1 0 0 0 0 u u Software Reset during normal operation 0x000000 u u 0 1 0 0 0 u u MCLR Reset during Sleep 0x000000 u u 1 u 0 0 1 u u MCLR Reset during Idle 0x000000 u u 1 u 0 1 0 u u WDT Time-out Reset 0x000000 u u 0 0 1 0 0 u u WDT Wake-up PC + 2 u u u u 1 u 1 u u Interrupt Wake-up from Sleep PC + 2(1) u u u u u u 1 u u Clock Failure Trap 0x000004 u u u u u u u u u Trap Reset 0x000000 1 u u u u u u u u Illegal Operation Reset 0x000000 u 1 u u u u u u u Legend: u = unchanged, x = unknown, - = unimplemented bit, read as ‘0’ Note 1: When the wake-up is due to an enabled interrupt, the PC is loaded with the corresponding interrupt vector. DS70118G-page 130 © 2006 Microchip Technology Inc. dsPIC30F2010 19.4 19.4.1 Watchdog Timer (WDT) WATCHDOG TIMER OPERATION The primary function of the Watchdog Timer (WDT) is to reset the processor in the event of a software malfunction. The WDT is a free running timer, which runs off an on-chip RC oscillator, requiring no external component. Therefore, the WDT timer will continue to operate even if the main processor clock (e.g., the crystal oscillator) fails. 19.4.2 ENABLING AND DISABLING THE WDT The Watchdog Timer can be “Enabled” or “Disabled” only through a Configuration bit (FWDTEN) in the Configuration register FWDT. The processor wakes up from Sleep if at least one of the following conditions has occurred: • any interrupt that is individually enabled and meets the required priority level • any Reset (POR, BOR and MCLR) • WDT time-out On waking up from Sleep mode, the processor will restart the same clock that was active prior to entry into Sleep mode. When clock switching is enabled, bits COSC<1:0> will determine the oscillator source that will be used on wake-up. If clock switch is disabled, then there is only one system clock. Note: If a POR or BOR occurred, the selection of the oscillator is based on the FOS<1:0> and FPR<3:0> Configuration bits. Setting FWDTEN = 1 enables the Watchdog Timer. The enabling is done when programming the device. By default, after chip-erase, FWDTEN bit = 1. Any device programmer capable of programming dsPIC30F devices allows programming of this and other Configuration bits. If the clock source is an oscillator, the clock to the device will be held off until OST times out (indicating a stable oscillator). If PLL is used, the system clock is held off until LOCK = 1 (indicating that the PLL is stable). In either case, TPOR, TLOCK and TPWRT delays are applied. If enabled, the WDT will increment until it overflows or “times out”. A WDT time-out will force a device Reset (except during Sleep). To prevent a WDT time-out, the user must clear the Watchdog Timer using a CLRWDT instruction. If EC, FRC, LPRC or ERC oscillators are used, then a delay of TPOR (~ 10 μs) is applied. This is the smallest delay possible on wake-up from Sleep. If a WDT times out during Sleep, the device will wakeup. The WDTO bit in the RCON register will be cleared to indicate a wake-up resulting from a WDT time-out. Setting FWDTEN = 0 allows user software to enable/ disable the Watchdog Timer via the SWDTEN (RCON<5>) control bit. 19.5 Power-Saving Modes There are two power-saving states that can be entered through the execution of a special instruction, PWRSAV. These are: Sleep and Idle. The format of the PWRSAV instruction is as follows: PWRSAV <parameter>, where ‘parameter’ defines Idle or Sleep mode. 19.5.1 SLEEP MODE In Sleep mode, the clock to the CPU and peripherals is shutdown. If an on-chip oscillator is being used, it is shutdown. The fail-safe clock monitor is not functional during Sleep, since there is no clock to monitor. However, LPRC clock remains active if WDT is operational during Sleep. Moreover, if LP oscillator was active during Sleep, and LP is the oscillator used on wake-up, then the start-up delay will be equal to TPOR. PWRT delay and OST timer delay are not applied. In order to have the smallest possible start-up delay when waking up from Sleep, one of these faster wake-up options should be selected before entering Sleep. Any interrupt that is individually enabled (using the corresponding IE bit) and meets the prevailing priority level will be able to wake-up the processor. The processor will process the interrupt and branch to the ISR. The Sleep status bit in RCON register is set upon wake-up. Note: In spite of various delays applied (TPOR, TLOCK and TPWRT), the crystal oscillator (and PLL) may not be active at the end of the time-out (e.g., for low-frequency crystals. In such cases), if FSCM is enabled, then the device will detect this as a clock failure and process the clock failure trap, the FRC oscillator will be enabled, and the user will have to re-enable the crystal oscillator. If FSCM is not enabled, then the device will simply suspend execution of code until the clock is stable, and will remain in Sleep until the oscillator clock has started. The Brown-out protection circuit and the Low Voltage Detect circuit, if enabled, will remain functional during Sleep. © 2006 Microchip Technology Inc. DS70118G-page 131 dsPIC30F2010 All Resets will wake-up the processor from Sleep mode. Any Reset, other than POR, will set the Sleep status bit. In a POR, the Sleep bit is cleared. If Watchdog Timer is enabled, then the processor will wake-up from Sleep mode upon WDT time-out. The Sleep and WDTO status bits are both set. 19.5.2 IDLE MODE In Idle mode, the clock to the CPU is shutdown while peripherals keep running. Unlike Sleep mode, the clock source remains active. Several peripherals have a control bit in each module, that allows them to operate during Idle. 3. 4. FBORPOR (0xF80004): BOR and POR Configuration Register FGS (0xF8000A): General Code Segment Configuration Register The placement of the Configuration bits is automatically handled when you select the device in your device programmer. The desired state of the Configuration bits may be specified in the source code (dependent on the language tool used), or through the programming interface. After the device has been programmed, the application software may read the Configuration bit values through the table read instructions. For additional information, please refer to the programming specifications of the device. LPRC fail-safe clock remains active if clock failure detect is enabled. Note: The processor wakes up from Idle if at least one of the following conditions is true: • on any interrupt that is individually enabled (IE bit is ‘1’) and meets the required priority level • on any Reset (POR, BOR, MCLR) • on WDT time-out Upon wake-up from Idle mode, the clock is reapplied to the CPU and instruction execution begins immediately, starting with the instruction following the PWRSAV instruction. Any interrupt that is individually enabled (using IE bit) and meets the prevailing priority level will be able to wake-up the processor. The processor will process the interrupt and branch to the ISR. The Idle status bit in RCON register is set upon wake-up. Any Reset, other than POR, will set the Idle status bit. On a POR, the Idle bit is cleared. If Watchdog Timer is enabled, then the processor will wake-up from Idle mode upon WDT time-out. The Idle and WDTO status bits are both set. Unlike wake-up from Sleep, there are no time delays involved in wake-up from Idle. 19.6 Device Configuration Registers The Configuration bits in each device Configuration register specify some of the device modes and are programmed by a device programmer, or by using the InCircuit Serial Programming (ICSP) programming capability feature of the device. Each device Configuration register is a 24-bit register, but only the lower 16 bits of each register are used to hold configuration data. There are four device Configuration registers available to the user: 1. 2. FOSC (0xF80000): Oscillator Configuration Register FWDT (0xF80002): Watchdog Timer Configuration Register DS70118G-page 132 19.7 If the code protection configuration fuse bits (FGS<GCP> and FGS<GWRP>) have been programmed, an erase of the entire code-protected device is only possible at voltages VDD ≥ 4.5V. In-Circuit Debugger When MPLAB® ICD2 is selected as a Debugger, the InCircuit Debugging functionality is enabled. This function allows simple debugging functions when used with MPLAB IDE. When the device has this feature enabled, some of the resources are not available for general use. These resources include the first 80 bytes of data RAM and two I/O pins. One of four pairs of debug I/O pins may be selected by the user using configuration options in MPLAB IDE. These pin pairs are named EMUD/EMUC, EMUD1/ EMUC1, EMUD2/EMUC2 and EMUD3/EMUC3. In each case, the selected EMUD pin is the Emulation/ Debug Data line, and the EMUC pin is the Emulation/ Debug Clock line. These pins will interface to the MPLAB ICD 2 module available from Microchip. The selected pair of Debug I/O pins is used by MPLAB ICD 2 to send commands and receive responses, as well as to send and receive data. To use the In-Circuit Debugger function of the device, the design must implement ICSP connections to MCLR, VDD, VSS, PGC, PGD and the selected EMUDx/EMUCx pin pair. This gives rise to two possibilities: 1. 2. If EMUD/EMUC is selected as the Debug I/O pin pair, then only a 5-pin interface is required, as the EMUD and EMUC pin functions are multiplexed with the PGD and PGC pin functions in all dsPIC30F devices. If EMUD1/EMUC1, EMUD2/EMUC2 or EMUD3/ EMUC3 is selected as the Debug I/O pin pair, then a 7-pin interface is required, as the EMUDx/EMUCx pin functions (x = 1, 2 or 3) are not multiplexed with the PGD and PGC pin functions. © 2006 Microchip Technology Inc. © 2006 Microchip Technology Inc. TABLE 19-7: SFR Name SYSTEM INTEGRATION REGISTER MAP Addr. Bit 15 Bit 14 Bit 13 Bit 12 RCON 0740 TRAPR IOPUWR BGST — OSCCON 0742 TUN3 TUN2 Bit 11 COSC<1:0> Bit 10 — — TUN1 TUN0 Bit 9 Bit 8 Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 — — EXTR SWR SWDTEN WDTO SLEEP IDLE BOR LOCK — CF — LPOSCEN NOSC<1:0> POST<1:0> Bit 1 Bit 0 POR Reset State Depends on type of Reset. OSWEN Depends on Configuration bits. Legend: u = uninitialized bit Note: Refer to “dsPIC30F Family Reference Manual” (DS70046) for descriptions of register bit fields. TABLE 19-8: File Name FOSC DEVICE CONFIGURATION REGISTER MAP Addr. Bits 23-16 F80000 — Bit 15 Bit 14 FCKSM<1:0> Bit 13 Bit 12 Bit 11 Bit 10 — — — — Bit 9 Bit 8 FOS<1:0> Bit 7 Bit 6 Bit 5 Bit 4 — — — — Bit 3 Bit 2 FWDT F80002 — FWDTEN — — — — — — — — — FWPSA<1:0> FBORPOR F80004 — MCLREN — — — — PWMPIN HPOL LPOL BOREN — BORV<1:0> — — FGS F8000A — — — — — — — — — — — — — — Note: — Bit 1 Bit 0 FPR<3:0> FWPSB<3:0> FPWRT<1:0> GCP GWRP Refer to “dsPIC30F Family Reference Manual” (DS70046) for descriptions of register bit fields. dsPIC30F2010 DS70118G-page 133 dsPIC30F2010 NOTES: DS70118G-page 134 © 2006 Microchip Technology Inc. dsPIC30F2010 20.0 INSTRUCTION SET SUMMARY Note: This data sheet summarizes features of this group of dsPIC30F devices and is not intended to be a complete reference source. For more information on the CPU, peripherals, register descriptions and general device functionality, refer to the “dsPIC30F Family Reference Manual” (DS70046). For more information on the device instruction set and programming, refer to the “dsPIC30F/ 33F Programmer’s Reference Manual” (DS70157). The dsPIC30F instruction set adds many enhancements to the previous PIC® MCU instruction sets, while maintaining an easy migration from PIC MCU instruction sets. Most instructions are a single program memory word (24 bits). Only three instructions require two program memory locations. Each single-word instruction is a 24-bit word divided into an 8-bit opcode which specifies the instruction type, and one or more operands which further specify the operation of the instruction. The instruction set is highly orthogonal and is grouped into five basic categories: • • • • • Word or byte-oriented operations Bit-oriented operations Literal operations DSP operations Control operations Table 20-1 shows the general symbols used in describing the instructions. The dsPIC30F instruction set summary in Table 20-2 lists all the instructions along with the status flags affected by each instruction. Most word or byte-oriented W register instructions (including barrel shift instructions) have three operands: • The first source operand, which is typically a register ‘Wb’ without any address modifier • The second source operand, which is typically a register ‘Ws’ with or without an address modifier • The destination of the result, which is typically a register ‘Wd’ with or without an address modifier However, word or byte-oriented file register instructions have two operands: • The file register specified by the value ‘f’ • The destination, which could either be the file register ‘f’ or the W0 register, which is denoted as ‘WREG’ © 2006 Microchip Technology Inc. Most bit-oriented instructions (including simple rotate/ shift instructions) have two operands: • The W register (with or without an address modifier) or file register (specified by the value of ‘Ws’ or ‘f’) • The bit in the W register or file register (specified by a literal value, or indirectly by the contents of register ‘Wb’) The literal instructions that involve data movement may use some of the following operands: • A literal value to be loaded into a W register or file register (specified by the value of ‘k’) • The W register or file register where the literal value is to be loaded (specified by ‘Wb’ or ‘f’) However, literal instructions that involve arithmetic or logical operations use some of the following operands: • The first source operand, which is a register ‘Wb’ without any address modifier • The second source operand, which is a literal value • The destination of the result (only if not the same as the first source operand), which is typically a register ‘Wd’ with or without an address modifier The MAC class of DSP instructions may use some of the following operands: • The accumulator (A or B) to be used (required operand) • The W registers to be used as the two operands • The X and Y address space prefetch operations • The X and Y address space prefetch destinations • The accumulator write-back destination The other DSP instructions do not involve any multiplication, and may include: • The accumulator to be used (required) • The source or destination operand (designated as Wso or Wdo, respectively) with or without an address modifier • The amount of shift, specified by a W register ‘Wn’ or a literal value The control instructions may use some of the following operands: • A program memory address • The mode of the table read and table write instructions All instructions are a single word, except for certain double word instructions, which were made double word instructions so that all the required information is available in these 48 bits. In the second word, the 8 MSbs are ‘0’s. If this second word is executed as an instruction (by itself), it will execute as a NOP. DS70118G-page 135 dsPIC30F2010 Most single-word instructions are executed in a single instruction cycle, unless a conditional test is true or the program counter is changed as a result of the instruction. In these cases, the execution takes two instruction cycles with the additional instruction cycle(s) executed as a NOP. Notable exceptions are the BRA (unconditional/computed branch), indirect CALL/GOTO, all table reads and writes and RETURN/RETFIE instructions, which are single-word instructions, but take two or three cycles. Certain instructions that involve skipping over the subsequent instruction, require either two or TABLE 20-1: three cycles if the skip is performed, depending on whether the instruction being skipped is a single-word or two-word instruction. Moreover, double word moves require two cycles. The double word instructions execute in two instruction cycles. Note: For more details on the instruction set, refer to the “dsPIC30F/33F Programmer’s Reference Manual” (DS70157). SYMBOLS USED IN OPCODE DESCRIPTIONS Field #text (text) [text] { } <n:m> .b .d .S .w Acc AWB bit4 C, DC, N, OV, Z Expr f lit1 lit4 lit5 lit8 lit10 lit14 lit16 lit23 None OA, OB, SA, SB PC Slit10 Slit16 Slit6 DS70118G-page 136 Description Means literal defined by “text“ Means “content of text“ Means “the location addressed by text” Optional field or operation Register bit field Byte mode selection Double word mode selection Shadow register select Word mode selection (default) One of two accumulators {A, B} Accumulator write-back destination address register ∈ {W13, [W13] + = 2} 4-bit bit selection field (used in word addressed instructions) ∈ {0...15} MCU status bits: Carry, Digit Carry, Negative, Overflow, Zero Absolute address, label or expression (resolved by the linker) File register address ∈ {0x0000...0x1FFF} 1-bit unsigned literal ∈ {0,1} 4-bit unsigned literal ∈ {0...15} 5-bit unsigned literal ∈ {0...31} 8-bit unsigned literal ∈ {0...255} 10-bit unsigned literal ∈ {0...255} for Byte mode, {0:1023} for Word mode 14-bit unsigned literal ∈ {0...16384} 16-bit unsigned literal ∈ {0...65535} 23-bit unsigned literal ∈ {0...8388608}; LSB must be 0 Field does not require an entry, may be blank DSP status bits: ACCA Overflow, ACCB Overflow, ACCA Saturate, ACCB Saturate Program Counter 10-bit signed literal ∈ {-512...511} 16-bit signed literal ∈ {-32768...32767} 6-bit signed literal ∈ {-16...16} © 2006 Microchip Technology Inc. dsPIC30F2010 TABLE 20-1: SYMBOLS USED IN OPCODE DESCRIPTIONS (CONTINUED) Field Wb Wd Wdo Wm,Wn Wm*Wm Wm*Wn Wn Wnd Wns WREG Ws Wso Wx Wxd Wy Wyd © 2006 Microchip Technology Inc. Description Base W register ∈ {W0..W15} Destination W register ∈ { Wd, [Wd], [Wd++], [Wd--], [++Wd], [--Wd] } Destination W register ∈ { Wnd, [Wnd], [Wnd++], [Wnd--], [++Wnd], [--Wnd], [Wnd+Wb] } Dividend, Divisor working register pair (direct addressing) Multiplicand and Multiplier working register pair for Square instructions ∈ {W4 * W4,W5 * W5,W6 * W6,W7 * W7} Multiplicand and Multiplier working register pair for DSP instructions ∈ {W4 * W5,W4 * W6,W4 * W7,W5 * W6,W5 * W7,W6 * W7} One of 16 working registers ∈ {W0..W15} One of 16 destination working registers ∈ {W0..W15} One of 16 source working registers ∈ {W0..W15} W0 (working register used in file register instructions) Source W register ∈ { Ws, [Ws], [Ws++], [Ws--], [++Ws], [--Ws] } Source W register ∈ { Wns, [Wns], [Wns++], [Wns--], [++Wns], [--Wns], [Wns+Wb] } X data space prefetch address register for DSP instructions ∈ {[W8] + = 6, [W8] + = 4, [W8] + = 2, [W8], [W8] - = 6, [W8] - = 4, [W8] - = 2, [W9] + = 6, [W9] + = 4, [W9] + = 2, [W9], [W9] - = 6, [W9] - = 4, [W9] - = 2, [W9 + W12],none} X data space prefetch destination register for DSP instructions ∈ {W4..W7} Y data space prefetch address register for DSP instructions ∈ {[W10] + = 6, [W10] + = 4, [W10] + = 2, [W10], [W10] - = 6, [W10] - = 4, [W10] - = 2, [W11] + = 6, [W11] + = 4, [W11] + = 2, [W11], [W11] - = 6, [W11] - = 4, [W11] - = 2, [W11 + W12], none} Y data space prefetch destination register for DSP instructions ∈ {W4..W7} DS70118G-page 137 dsPIC30F2010 TABLE 20-2: Base Instr # Assembly Mnemonic 1 ADD 2 3 4 5 6 ADDC AND ASR BCLR BRA INSTRUCTION SET OVERVIEW Assembly Syntax Description # of word s # of cycles Status Flags Affected ADD Acc Add Accumulators 1 1 OA,OB,SA,SB ADD f f = f + WREG 1 1 C,DC,N,OV,Z ADD f,WREG WREG = f + WREG 1 1 C,DC,N,OV,Z ADD #lit10,Wn Wd = lit10 + Wd 1 1 C,DC,N,OV,Z ADD Wb,Ws,Wd Wd = Wb + Ws 1 1 C,DC,N,OV,Z ADD Wb,#lit5,Wd Wd = Wb + lit5 1 1 C,DC,N,OV,Z ADD Wso,#Slit4,Acc 16-bit Signed Add to Accumulator 1 1 OA,OB,SA,SB ADDC f f = f + WREG + (C) 1 1 C,DC,N,OV,Z ADDC f,WREG WREG = f + WREG + (C) 1 1 C,DC,N,OV,Z ADDC #lit10,Wn Wd = lit10 + Wd + (C) 1 1 C,DC,N,OV,Z ADDC Wb,Ws,Wd Wd = Wb + Ws + (C) 1 1 C,DC,N,OV,Z ADDC Wb,#lit5,Wd Wd = Wb + lit5 + (C) 1 1 C,DC,N,OV,Z AND f f = f .AND. WREG 1 1 N,Z AND f,WREG WREG = f .AND. WREG 1 1 N,Z AND #lit10,Wn Wd = lit10 .AND. Wd 1 1 N,Z AND Wb,Ws,Wd Wd = Wb .AND. Ws 1 1 N,Z AND Wb,#lit5,Wd Wd = Wb .AND. lit5 1 1 N,Z ASR f f = Arithmetic Right Shift f 1 1 C,N,OV,Z ASR f,WREG WREG = Arithmetic Right Shift f 1 1 C,N,OV,Z ASR Ws,Wd Wd = Arithmetic Right Shift Ws 1 1 C,N,OV,Z ASR Wb,Wns,Wnd Wnd = Arithmetic Right Shift Wb by Wns 1 1 N,Z ASR Wb,#lit5,Wnd Wnd = Arithmetic Right Shift Wb by lit5 1 1 N,Z BCLR f,#bit4 Bit Clear f 1 1 None BCLR Ws,#bit4 Bit Clear Ws 1 1 None BRA C,Expr Branch if Carry 1 1 (2) None BRA GE,Expr Branch if greater than or equal 1 1 (2) None BRA GEU,Expr Branch if unsigned greater than or equal 1 1 (2) None BRA GT,Expr Branch if greater than 1 1 (2) None BRA GTU,Expr Branch if unsigned greater than 1 1 (2) None BRA LE,Expr Branch if less than or equal 1 1 (2) None BRA LEU,Expr Branch if unsigned less than or equal 1 1 (2) None BRA LT,Expr Branch if less than 1 1 (2) None BRA LTU,Expr Branch if unsigned less than 1 1 (2) None BRA N,Expr Branch if Negative 1 1 (2) None BRA NC,Expr Branch if Not Carry 1 1 (2) None BRA NN,Expr Branch if Not Negative 1 1 (2) None BRA NOV,Expr Branch if Not Overflow 1 1 (2) None BRA NZ,Expr Branch if Not Zero 1 1 (2) None BRA OA,Expr Branch if accumulator A overflow 1 1 (2) None BRA OB,Expr Branch if accumulator B overflow 1 1 (2) None BRA OV,Expr Branch if Overflow 1 1 (2) None BRA SA,Expr Branch if accumulator A saturated 1 1 (2) None BRA SB,Expr Branch if accumulator B saturated 1 1 (2) None BRA Expr Branch Unconditionally 1 2 None BRA Z,Expr Branch if Zero 1 1 (2) None BRA Wn Computed Branch 1 2 None 7 BSET BSET f,#bit4 Bit Set f 1 1 None BSET Ws,#bit4 Bit Set Ws 1 1 None 8 BSW BSW.C Ws,Wb Write C bit to Ws<Wb> 1 1 None BSW.Z Ws,Wb Write Z bit to Ws<Wb> 1 1 None BTG f,#bit4 Bit Toggle f 1 1 None BTG Ws,#bit4 Bit Toggle Ws 1 1 None BTSC f,#bit4 Bit Test f, Skip if Clear 1 1 (2 or 3) None BTSC Ws,#bit4 Bit Test Ws, Skip if Clear 1 1 (2 or 3) None 9 10 BTG BTSC DS70118G-page 138 © 2006 Microchip Technology Inc. dsPIC30F2010 TABLE 20-2: Base Instr # Assembly Mnemonic 11 BTSS 12 13 14 15 BTST BTSTS CALL CLR INSTRUCTION SET OVERVIEW (CONTINUED) Assembly Syntax Description # of word s # of cycles Status Flags Affected BTSS f,#bit4 Bit Test f, Skip if Set 1 1 (2 or 3) None BTSS Ws,#bit4 Bit Test Ws, Skip if Set 1 1 (2 or 3) None BTST f,#bit4 Bit Test f 1 1 Z BTST.C Ws,#bit4 Bit Test Ws to C 1 1 C BTST.Z Ws,#bit4 Bit Test Ws to Z 1 1 Z BTST.C Ws,Wb Bit Test Ws<Wb> to C 1 1 C BTST.Z Ws,Wb Bit Test Ws<Wb> to Z 1 1 Z BTSTS f,#bit4 Bit Test then Set f 1 1 Z BTSTS.C Ws,#bit4 Bit Test Ws to C, then Set 1 1 C BTSTS.Z Ws,#bit4 Bit Test Ws to Z, then Set 1 1 Z CALL lit23 Call subroutine 2 2 None CALL Wn Call indirect subroutine 1 2 None CLR f f = 0x0000 1 1 None CLR WREG WREG = 0x0000 1 1 None CLR Ws Ws = 0x0000 1 1 None CLR Acc,Wx,Wxd,Wy,Wyd,AWB Clear Accumulator 1 1 OA,OB,SA,SB Clear Watchdog Timer 1 1 WDTO,Sleep 16 CLRWDT CLRWDT 17 COM COM f f=f 1 1 N,Z COM f,WREG WREG = f 1 1 N,Z COM Ws,Wd Wd = Ws 1 1 N,Z CP f Compare f with WREG 1 1 C,DC,N,OV,Z CP Wb,#lit5 Compare Wb with lit5 1 1 C,DC,N,OV,Z CP Wb,Ws Compare Wb with Ws (Wb - Ws) 1 1 C,DC,N,OV,Z CP0 f Compare f with 0x0000 1 1 C,DC,N,OV,Z CP0 Ws Compare Ws with 0x0000 1 1 C,DC,N,OV,Z CPB f Compare f with WREG, with Borrow 1 1 C,DC,N,OV,Z CPB Wb,#lit5 Compare Wb with lit5, with Borrow 1 1 C,DC,N,OV,Z CPB Wb,Ws Compare Wb with Ws, with Borrow (Wb - Ws - C) 1 1 C,DC,N,OV,Z 18 19 20 CP CP0 CPB 21 CPSEQ CPSEQ Wb, Wn Compare Wb with Wn, skip if = 1 1 (2 or 3) None 22 CPSGT CPSGT Wb, Wn Compare Wb with Wn, skip if > 1 1 (2 or 3) None 23 CPSLT CPSLT Wb, Wn Compare Wb with Wn, skip if < 1 1 (2 or 3) None 24 CPSNE CPSNE Wb, Wn Compare Wb with Wn, skip if ≠ 1 1 (2 or 3) None 25 DAW DAW Wn Wn = decimal adjust Wn 1 1 C 26 DEC DEC f f=f-1 1 1 C,DC,N,OV,Z DEC f,WREG WREG = f -1 1 1 C,DC,N,OV,Z DEC Ws,Wd Wd = Ws - 1 1 1 C,DC,N,OV,Z DEC2 f f=f-2 1 1 C,DC,N,OV,Z DEC2 f,WREG WREG = f -2 1 1 C,DC,N,OV,Z 27 DEC2 DEC2 Ws,Wd Wd = Ws - 2 1 1 C,DC,N,OV,Z 28 DISI DISI #lit14 Disable Interrupts for k instruction cycles 1 1 None 29 DIV DIV.S Wm,Wn Signed 16/16-bit Integer Divide 1 18 N,Z,C, OV DIV.SD Wm,Wn Signed 32/16-bit Integer Divide 1 18 N,Z,C, OV DIV.U Wm,Wn Unsigned 16/16-bit Integer Divide 1 18 N,Z,C, OV N,Z,C, OV DIV.UD Wm,Wn Unsigned 32/16-bit Integer Divide 1 18 30 DIVF DIVF Wm,Wn Signed 16/16-bit Fractional Divide 1 18 N,Z,C, OV 31 DO DO #lit14,Expr Do code to PC+Expr, lit14 + 1 times 2 2 None DO Wn,Expr Do code to PC+Expr, (Wn) + 1 times 2 2 None 32 ED ED Wm*Wm,Acc,Wx,Wy,Wxd Euclidean Distance (no accumulate) 1 1 OA,OB,OAB, SA,SB,SAB 33 EDAC EDAC Wm*Wm,Acc,Wx,Wy,Wxd Euclidean Distance 1 1 OA,OB,OAB, SA,SB,SAB © 2006 Microchip Technology Inc. DS70118G-page 139 dsPIC30F2010 TABLE 20-2: Base Instr # INSTRUCTION SET OVERVIEW (CONTINUED) Assembly Mnemonic Assembly Syntax Description # of word s # of cycles Status Flags Affected 34 EXCH EXCH Wns,Wnd Swap Wns with Wnd 1 1 35 FBCL FBCL Ws,Wnd Find Bit Change from Left (MSb) Side 1 1 None C 36 FF1L FF1L Ws,Wnd Find First One from Left (MSb) Side 1 1 C C 37 FF1R FF1R Ws,Wnd Find First One from Right (LSb) Side 1 1 38 GOTO GOTO Expr Go to address 2 2 None GOTO Wn Go to indirect 1 2 None INC f f=f+1 1 1 C,DC,N,OV,Z INC f,WREG WREG = f + 1 1 1 C,DC,N,OV,Z C,DC,N,OV,Z 39 40 41 42 INC INC2 IOR LAC INC Ws,Wd Wd = Ws + 1 1 1 INC2 f f=f+2 1 1 C,DC,N,OV,Z INC2 f,WREG WREG = f + 2 1 1 C,DC,N,OV,Z C,DC,N,OV,Z INC2 Ws,Wd Wd = Ws + 2 1 1 IOR f f = f .IOR. WREG 1 1 N,Z IOR f,WREG WREG = f .IOR. WREG 1 1 N,Z IOR #lit10,Wn Wd = lit10 .IOR. Wd 1 1 N,Z IOR Wb,Ws,Wd Wd = Wb .IOR. Ws 1 1 N,Z IOR Wb,#lit5,Wd Wd = Wb .IOR. lit5 1 1 N,Z LAC Wso,#Slit4,Acc Load Accumulator 1 1 OA,OB,OAB, SA,SB,SAB 43 LNK LNK #lit14 Link frame pointer 1 1 None 44 LSR LSR f f = Logical Right Shift f 1 1 C,N,OV,Z LSR f,WREG WREG = Logical Right Shift f 1 1 C,N,OV,Z LSR Ws,Wd Wd = Logical Right Shift Ws 1 1 C,N,OV,Z LSR Wb,Wns,Wnd Wnd = Logical Right Shift Wb by Wns 1 1 N,Z LSR Wb,#lit5,Wnd Wnd = Logical Right Shift Wb by lit5 1 1 N,Z MAC Wm*Wn,Acc,Wx,Wxd,Wy,Wyd, AWB Multiply and Accumulate 1 1 OA,OB,OAB, SA,SB,SAB MAC Wm*Wm,Acc,Wx,Wxd,Wy,Wyd Square and Accumulate 1 1 OA,OB,OAB, SA,SB,SAB MOV f,Wn Move f to Wn 1 1 None MOV f Move f to f 1 1 N,Z MOV f,WREG Move f to WREG 1 1 N,Z MOV #lit16,Wn Move 16-bit literal to Wn 1 1 None MOV.b #lit8,Wn Move 8-bit literal to Wn 1 1 None MOV Wn,f Move Wn to f 1 1 None MOV Wso,Wdo Move Ws to Wd 1 1 None MOV WREG,f Move WREG to f 1 1 N,Z MOV.D Wns,Wd Move Double from W(ns):W(ns+1) to Wd 1 2 None MOV.D Ws,Wnd Move Double from Ws to W(nd+1):W(nd) 1 2 None 45 46 MAC MOV 47 MOVSAC MOVSAC Acc,Wx,Wxd,Wy,Wyd,AWB Prefetch and store accumulator 1 1 None 48 MPY MPY Wm*Wn,Acc,Wx,Wxd,Wy,Wyd Multiply Wm by Wn to Accumulator 1 1 OA,OB,OAB, SA,SB,SAB MPY Wm*Wm,Acc,Wx,Wxd,Wy,Wyd Square Wm to Accumulator 1 1 OA,OB,OAB, SA,SB,SAB 49 MPY.N MPY.N Wm*Wn,Acc,Wx,Wxd,Wy,Wyd -(Multiply Wm by Wn) to Accumulator 1 1 None 50 MSC MSC Wm*Wm,Acc,Wx,Wxd,Wy,Wyd, AWB Multiply and Subtract from Accumulator 1 1 OA,OB,OAB, SA,SB,SAB 51 MUL MUL.SS Wb,Ws,Wnd {Wnd + 1, Wnd} = signed(Wb) * signed(Ws) 1 1 None MUL.SU Wb,Ws,Wnd {Wnd + 1, Wnd} = signed(Wb) * unsigned(Ws) 1 1 None MUL.US Wb,Ws,Wnd {Wnd + 1, Wnd} = unsigned(Wb) * signed(Ws) 1 1 None MUL.UU Wb,Ws,Wnd {Wnd + 1, Wnd} = unsigned(Wb) * unsigned(Ws) 1 1 None MUL.SU Wb,#lit5,Wnd {Wnd + 1, Wnd} = signed(Wb) * unsigned(lit5) 1 1 None MUL.UU Wb,#lit5,Wnd {Wnd + 1, Wnd} = unsigned(Wb) * unsigned(lit5) 1 1 None MUL f W3:W2 = f * WREG 1 1 None DS70118G-page 140 © 2006 Microchip Technology Inc. dsPIC30F2010 TABLE 20-2: Base Instr # Assembly Mnemonic 52 NEG 53 54 NOP POP INSTRUCTION SET OVERVIEW (CONTINUED) Assembly Syntax PUSH # of word s # of cycles Status Flags Affected NEG Acc Negate Accumulator 1 1 OA,OB,OAB, SA,SB,SAB NEG f f=f+1 1 1 C,DC,N,OV,Z NEG f,WREG WREG = f + 1 1 1 C,DC,N,OV,Z NEG Ws,Wd Wd = Ws + 1 1 1 C,DC,N,OV,Z NOP No Operation 1 1 None NOPR No Operation 1 1 None None POP f Pop f from Top-of-Stack (TOS) 1 1 POP Wdo Pop from Top-of-Stack (TOS) to Wdo 1 1 None POP.D Wnd Pop from Top-of-Stack (TOS) to W(nd):W(nd + 1) 1 2 None Pop Shadow Registers 1 1 All f Push f to Top-of-Stack (TOS) 1 1 None PUSH Wso Push Wso to Top-of-Stack (TOS) 1 1 None PUSH.D Wns Push W(ns):W(ns + 1) to Top-of-Stack (TOS) 1 2 None Push Shadow Registers 1 1 None POP.S 55 Description PUSH PUSH.S 56 PWRSAV PWRSAV #lit1 Go into Sleep or Idle mode 1 1 WDTO,Sleep 57 RCALL RCALL Expr Relative Call 1 2 None RCALL Wn Computed Call 1 2 None 58 REPEAT REPEAT #lit14 Repeat Next Instruction lit14 + 1 times 1 1 None REPEAT Wn 59 RESET RESET 60 RETFIE RETFIE 61 RETLW RETLW 62 RETURN RETURN 63 RLC 64 65 66 67 RLNC RRC RRNC SAC Repeat Next Instruction (Wn) + 1 times 1 1 None Software device Reset 1 1 None Return from interrupt 1 3 (2) None #lit10,Wn Return with literal in Wn 1 3 (2) None Return from Subroutine 1 3 (2) None RLC f f = Rotate Left through Carry f 1 1 C,N,Z RLC f,WREG WREG = Rotate Left through Carry f 1 1 C,N,Z RLC Ws,Wd Wd = Rotate Left through Carry Ws 1 1 C,N,Z RLNC f f = Rotate Left (No Carry) f 1 1 N,Z RLNC f,WREG WREG = Rotate Left (No Carry) f 1 1 N,Z RLNC Ws,Wd Wd = Rotate Left (No Carry) Ws 1 1 N,Z RRC f f = Rotate Right through Carry f 1 1 C,N,Z RRC f,WREG WREG = Rotate Right through Carry f 1 1 C,N,Z RRC Ws,Wd Wd = Rotate Right through Carry Ws 1 1 C,N,Z RRNC f f = Rotate Right (No Carry) f 1 1 N,Z RRNC f,WREG WREG = Rotate Right (No Carry) f 1 1 N,Z N,Z RRNC Ws,Wd Wd = Rotate Right (No Carry) Ws 1 1 SAC Acc,#Slit4,Wdo Store Accumulator 1 1 None SAC.R Acc,#Slit4,Wdo Store Rounded Accumulator 1 1 None 68 SE SE Ws,Wnd Wnd = sign extended Ws 1 1 C,N,Z 69 SETM SETM f f = 0xFFFF 1 1 None SETM WREG WREG = 0xFFFF 1 1 None SETM Ws Ws = 0xFFFF 1 1 None SFTAC Acc,Wn Arithmetic Shift Accumulator by (Wn) 1 1 OA,OB,OAB, SA,SB,SAB SFTAC Acc,#Slit6 Arithmetic Shift Accumulator by Slit6 1 1 OA,OB,OAB, SA,SB,SAB SL f f = Left Shift f 1 1 C,N,OV,Z SL f,WREG WREG = Left Shift f 1 1 C,N,OV,Z SL Ws,Wd Wd = Left Shift Ws 1 1 C,N,OV,Z SL Wb,Wns,Wnd Wnd = Left Shift Wb by Wns 1 1 N,Z SL Wb,#lit5,Wnd Wnd = Left Shift Wb by lit5 1 1 N,Z 70 71 SFTAC SL © 2006 Microchip Technology Inc. DS70118G-page 141 dsPIC30F2010 TABLE 20-2: Base Instr # Assembly Mnemonic 72 SUB 73 74 75 76 SUBB SUBR SUBBR SWAP INSTRUCTION SET OVERVIEW (CONTINUED) Assembly Syntax Description # of word s # of cycles 1 1 Status Flags Affected SUB Acc Subtract Accumulators OA,OB,OAB, SA,SB,SAB SUB f f = f - WREG 1 1 C,DC,N,OV,Z SUB f,WREG WREG = f - WREG 1 1 C,DC,N,OV,Z SUB #lit10,Wn Wn = Wn - lit10 1 1 C,DC,N,OV,Z SUB Wb,Ws,Wd Wd = Wb - Ws 1 1 C,DC,N,OV,Z SUB Wb,#lit5,Wd Wd = Wb - lit5 1 1 C,DC,N,OV,Z SUBB f f = f - WREG - (C) 1 1 C,DC,N,OV,Z SUBB f,WREG WREG = f - WREG - (C) 1 1 C,DC,N,OV,Z SUBB #lit10,Wn Wn = Wn - lit10 - (C) 1 1 C,DC,N,OV,Z SUBB Wb,Ws,Wd Wd = Wb - Ws - (C) 1 1 C,DC,N,OV,Z SUBB Wb,#lit5,Wd Wd = Wb - lit5 - (C) 1 1 C,DC,N,OV,Z SUBR f f = WREG - f 1 1 C,DC,N,OV,Z SUBR f,WREG WREG = WREG - f 1 1 C,DC,N,OV,Z SUBR Wb,Ws,Wd Wd = Ws - Wb 1 1 C,DC,N,OV,Z SUBR Wb,#lit5,Wd Wd = lit5 - Wb 1 1 C,DC,N,OV,Z SUBBR f f = WREG - f - (C) 1 1 C,DC,N,OV,Z SUBBR f,WREG WREG = WREG - f - (C) 1 1 C,DC,N,OV,Z SUBBR Wb,Ws,Wd Wd = Ws - Wb - (C) 1 1 C,DC,N,OV,Z SUBBR Wb,#lit5,Wd Wd = lit5 - Wb - (C) 1 1 C,DC,N,OV,Z SWAP.b Wn Wn = nibble swap Wn 1 1 None SWAP Wn Wn = byte swap Wn 1 1 None 77 TBLRDH TBLRDH Ws,Wd Read Prog<23:16> to Wd<7:0> 1 2 None 78 TBLRDL TBLRDL Ws,Wd Read Prog<15:0> to Wd 1 2 None None 79 TBLWTH TBLWTH Ws,Wd Write Ws<7:0> to Prog<23:16> 1 2 80 TBLWTL TBLWTL Ws,Wd Write Ws to Prog<15:0> 1 2 None 81 ULNK ULNK Unlink frame pointer 1 1 None 82 XOR XOR f f = f .XOR. WREG 1 1 N,Z XOR f,WREG WREG = f .XOR. WREG 1 1 N,Z XOR #lit10,Wn Wd = lit10 .XOR. Wd 1 1 N,Z XOR Wb,Ws,Wd Wd = Wb .XOR. Ws 1 1 N,Z XOR Wb,#lit5,Wd Wd = Wb .XOR. lit5 1 1 N,Z ZE Ws,Wnd Wnd = Zero-Extend Ws 1 1 C,Z,N 83 ZE DS70118G-page 142 © 2006 Microchip Technology Inc. dsPIC30F2010 21.0 DEVELOPMENT SUPPORT The PIC® microcontrollers are supported with a full range of hardware and software development tools: • Integrated Development Environment - MPLAB® IDE Software • Assemblers/Compilers/Linkers - MPASMTM Assembler - MPLAB C18 and MPLAB C30 C Compilers - MPLINKTM Object Linker/ MPLIBTM Object Librarian - MPLAB ASM30 Assembler/Linker/Library • Simulators - MPLAB SIM Software Simulator • Emulators - MPLAB ICE 2000 In-Circuit Emulator - MPLAB ICE 4000 In-Circuit Emulator • In-Circuit Debugger - MPLAB ICD 2 • Device Programmers - PICSTART® Plus Development Programmer - MPLAB PM3 Device Programmer - PICkit™ 2 Development Programmer • Low-Cost Demonstration and Development Boards and Evaluation Kits 21.1 MPLAB Integrated Development Environment Software The MPLAB IDE software brings an ease of software development previously unseen in the 8/16-bit microcontroller market. The MPLAB IDE is a Windows® operating system-based application that contains: • A single graphical interface to all debugging tools - Simulator - Programmer (sold separately) - Emulator (sold separately) - In-Circuit Debugger (sold separately) • A full-featured editor with color-coded context • A multiple project manager • Customizable data windows with direct edit of contents • High-level source code debugging • Visual device initializer for easy register initialization • Mouse over variable inspection • Drag and drop variables from source to watch windows • Extensive on-line help • Integration of select third party tools, such as HI-TECH Software C Compilers and IAR C Compilers The MPLAB IDE allows you to: • Edit your source files (either assembly or C) • One touch assemble (or compile) and download to PIC MCU emulator and simulator tools (automatically updates all project information) • Debug using: - Source files (assembly or C) - Mixed assembly and C - Machine code MPLAB IDE supports multiple debugging tools in a single development paradigm, from the cost-effective simulators, through low-cost in-circuit debuggers, to full-featured emulators. This eliminates the learning curve when upgrading to tools with increased flexibility and power. © 2006 Microchip Technology Inc. DS70118G-page 143 dsPIC30F2010 21.2 MPASM Assembler The MPASM Assembler is a full-featured, universal macro assembler for all PIC MCUs. The MPASM Assembler generates relocatable object files for the MPLINK Object Linker, Intel® standard HEX files, MAP files to detail memory usage and symbol reference, absolute LST files that contain source lines and generated machine code and COFF files for debugging. The MPASM Assembler features include: • Integration into MPLAB IDE projects • User-defined macros to streamline assembly code • Conditional assembly for multi-purpose source files • Directives that allow complete control over the assembly process 21.5 MPLAB ASM30 Assembler produces relocatable machine code from symbolic assembly language for dsPIC30F devices. MPLAB C30 C Compiler uses the assembler to produce its object file. The assembler generates relocatable object files that can then be archived or linked with other relocatable object files and archives to create an executable file. Notable features of the assembler include: • • • • • • Support for the entire dsPIC30F instruction set Support for fixed-point and floating-point data Command line interface Rich directive set Flexible macro language MPLAB IDE compatibility 21.6 21.3 MPLAB C18 and MPLAB C30 C Compilers The MPLAB C18 and MPLAB C30 Code Development Systems are complete ANSI C compilers for Microchip’s PIC18 family of microcontrollers and the dsPIC30, dsPIC33 and PIC24 family of digital signal controllers. These compilers provide powerful integration capabilities, superior code optimization and ease of use not found with other compilers. For easy source level debugging, the compilers provide symbol information that is optimized to the MPLAB IDE debugger. 21.4 MPLINK Object Linker/ MPLIB Object Librarian The MPLINK Object Linker combines relocatable objects created by the MPASM Assembler and the MPLAB C18 C Compiler. It can link relocatable objects from precompiled libraries, using directives from a linker script. MPLAB ASM30 Assembler, Linker and Librarian MPLAB SIM Software Simulator The MPLAB SIM Software Simulator allows code development in a PC-hosted environment by simulating the PIC MCUs and dsPIC® DSCs on an instruction level. On any given instruction, the data areas can be examined or modified and stimuli can be applied from a comprehensive stimulus controller. Registers can be logged to files for further run-time analysis. The trace buffer and logic analyzer display extend the power of the simulator to record and track program execution, actions on I/O, most peripherals and internal registers. The MPLAB SIM Software Simulator fully supports symbolic debugging using the MPLAB C18 and MPLAB C30 C Compilers, and the MPASM and MPLAB ASM30 Assemblers. The software simulator offers the flexibility to develop and debug code outside of the hardware laboratory environment, making it an excellent, economical software development tool. The MPLIB Object Librarian manages the creation and modification of library files of precompiled code. When a routine from a library is called from a source file, only the modules that contain that routine will be linked in with the application. This allows large libraries to be used efficiently in many different applications. The object linker/library features include: • Efficient linking of single libraries instead of many smaller files • Enhanced code maintainability by grouping related modules together • Flexible creation of libraries with easy module listing, replacement, deletion and extraction DS70118G-page 144 © 2006 Microchip Technology Inc. dsPIC30F2010 21.7 MPLAB ICE 2000 High-Performance In-Circuit Emulator The MPLAB ICE 2000 In-Circuit Emulator is intended to provide the product development engineer with a complete microcontroller design tool set for PIC microcontrollers. Software control of the MPLAB ICE 2000 In-Circuit Emulator is advanced by the MPLAB Integrated Development Environment, which allows editing, building, downloading and source debugging from a single environment. The MPLAB ICE 2000 is a full-featured emulator system with enhanced trace, trigger and data monitoring features. Interchangeable processor modules allow the system to be easily reconfigured for emulation of different processors. The architecture of the MPLAB ICE 2000 In-Circuit Emulator allows expansion to support new PIC microcontrollers. The MPLAB ICE 2000 In-Circuit Emulator system has been designed as a real-time emulation system with advanced features that are typically found on more expensive development tools. The PC platform and Microsoft® Windows® 32-bit operating system were chosen to best make these features available in a simple, unified application. 21.8 MPLAB ICE 4000 High-Performance In-Circuit Emulator The MPLAB ICE 4000 In-Circuit Emulator is intended to provide the product development engineer with a complete microcontroller design tool set for high-end PIC MCUs and dsPIC DSCs. Software control of the MPLAB ICE 4000 In-Circuit Emulator is provided by the MPLAB Integrated Development Environment, which allows editing, building, downloading and source debugging from a single environment. 21.9 MPLAB ICD 2 In-Circuit Debugger Microchip’s In-Circuit Debugger, MPLAB ICD 2, is a powerful, low-cost, run-time development tool, connecting to the host PC via an RS-232 or high-speed USB interface. This tool is based on the Flash PIC MCUs and can be used to develop for these and other PIC MCUs and dsPIC DSCs. The MPLAB ICD 2 utilizes the in-circuit debugging capability built into the Flash devices. This feature, along with Microchip’s In-Circuit Serial ProgrammingTM (ICSPTM) protocol, offers costeffective, in-circuit Flash debugging from the graphical user interface of the MPLAB Integrated Development Environment. This enables a designer to develop and debug source code by setting breakpoints, single stepping and watching variables, and CPU status and peripheral registers. Running at full speed enables testing hardware and applications in real time. MPLAB ICD 2 also serves as a development programmer for selected PIC devices. 21.10 MPLAB PM3 Device Programmer The MPLAB PM3 Device Programmer is a universal, CE compliant device programmer with programmable voltage verification at VDDMIN and VDDMAX for maximum reliability. It features a large LCD display (128 x 64) for menus and error messages and a modular, detachable socket assembly to support various package types. The ICSP™ cable assembly is included as a standard item. In Stand-Alone mode, the MPLAB PM3 Device Programmer can read, verify and program PIC devices without a PC connection. It can also set code protection in this mode. The MPLAB PM3 connects to the host PC via an RS-232 or USB cable. The MPLAB PM3 has high-speed communications and optimized algorithms for quick programming of large memory devices and incorporates an SD/MMC card for file storage and secure data applications. The MPLAB ICE 4000 is a premium emulator system, providing the features of MPLAB ICE 2000, but with increased emulation memory and high-speed performance for dsPIC30F and PIC18XXXX devices. Its advanced emulator features include complex triggering and timing, and up to 2 Mb of emulation memory. The MPLAB ICE 4000 In-Circuit Emulator system has been designed as a real-time emulation system with advanced features that are typically found on more expensive development tools. The PC platform and Microsoft Windows 32-bit operating system were chosen to best make these features available in a simple, unified application. © 2006 Microchip Technology Inc. DS70118G-page 145 dsPIC30F2010 21.11 PICSTART Plus Development Programmer 21.13 Demonstration, Development and Evaluation Boards The PICSTART Plus Development Programmer is an easy-to-use, low-cost, prototype programmer. It connects to the PC via a COM (RS-232) port. MPLAB Integrated Development Environment software makes using the programmer simple and efficient. The PICSTART Plus Development Programmer supports most PIC devices in DIP packages up to 40 pins. Larger pin count devices, such as the PIC16C92X and PIC17C76X, may be supported with an adapter socket. The PICSTART Plus Development Programmer is CE compliant. A wide variety of demonstration, development and evaluation boards for various PIC MCUs and dsPIC DSCs allows quick application development on fully functional systems. Most boards include prototyping areas for adding custom circuitry and provide application firmware and source code for examination and modification. 21.12 PICkit 2 Development Programmer The PICkit™ 2 Development Programmer is a low-cost programmer with an easy-to-use interface for programming many of Microchip’s baseline, mid-range and PIC18F families of Flash memory microcontrollers. The PICkit 2 Starter Kit includes a prototyping development board, twelve sequential lessons, software and HI-TECH’s PICC™ Lite C compiler, and is designed to help get up to speed quickly using PIC® microcontrollers. The kit provides everything needed to program, evaluate and develop applications using Microchip’s powerful, mid-range Flash memory family of microcontrollers. DS70118G-page 146 The boards support a variety of features, including LEDs, temperature sensors, switches, speakers, RS-232 interfaces, LCD displays, potentiometers and additional EEPROM memory. The demonstration and development boards can be used in teaching environments, for prototyping custom circuits and for learning about various microcontroller applications. In addition to the PICDEM™ and dsPICDEM™ demonstration/development board series of circuits, Microchip has a line of evaluation kits and demonstration software for analog filter design, KEELOQ® security ICs, CAN, IrDA®, PowerSmart® battery management, SEEVAL® evaluation system, Sigma-Delta ADC, flow rate sensing, plus many more. Check the Microchip web page (www.microchip.com) and the latest “Product Selector Guide” (DS00148) for the complete list of demonstration, development and evaluation kits. © 2006 Microchip Technology Inc. dsPIC30F2010 22.0 ELECTRICAL CHARACTERISTICS This section provides an overview of dsPIC30F electrical characteristics. Additional information will be provided in future revisions of this document as it becomes available. For detailed information about the dsPIC30F architecture and core, refer to “dsPIC30F Family Reference Manual” (DS70046). Absolute maximum ratings for the dsPIC30F family are listed below. Exposure to these maximum rating conditions for extended periods may affect device reliability. Functional operation of the device at these or any other conditions above the parameters indicated in the operation listings of this specification is not implied. Absolute Maximum Ratings(†) Ambient temperature under bias.............................................................................................................-40°C to +125°C Storage temperature .............................................................................................................................. -65°C to +150°C Voltage on any pin with respect to VSS (except VDD and MCLR) ................................................... -0.3V to (VDD + 0.3V) Voltage on VDD with respect to VSS ......................................................................................................... -0.3V to +5.5V Voltage on MCLR with respect to VSS (Note 1) ......................................................................................... 0V to +13.25V Total power dissipation (Note 2) ...............................................................................................................................1.0W Maximum current out of VSS pin ...........................................................................................................................300 mA Maximum current into VDD pin ..............................................................................................................................250 mA Input clamp current, IIK (VI < 0 or VI > VDD) .......................................................................................................... ±20 mA Output clamp current, IOK (VO < 0 or VO > VDD) ...................................................................................................±20 mA Maximum output current sunk by any I/O pin..........................................................................................................25 mA Maximum output current sourced by any I/O pin ....................................................................................................25 mA Maximum current sunk by all ports .......................................................................................................................200 mA Maximum current sourced by all ports ..................................................................................................................200 mA Note 1: Voltage spikes below VSS at the MCLR/VPP pin, inducing currents greater than 80 mA, may cause latchup. Thus, a series resistor of 50-100Ω should be used when applying a “low” level to the MCLR/VPP pin, rather than pulling this pin directly to VSS. 2: Maximum allowable current is a function of device maximum power dissipation. See Table 22-4. †NOTICE: Stresses above those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress rating only and functional operation of the device at those or any other conditions above those indicated in the operation listings of this specification is not implied. Exposure to maximum rating conditions for extended periods may affect device reliability. 22.1 DC Characteristics TABLE 22-1: OPERATING MIPS VS. VOLTAGE Max MIPS VDD Range Temp Range dsPIC30F2010-30I dsPIC30F2010-20E 30 — 20 4.5-5.5V -40°C to 85°C 4.5-5.5V -40°C to 125°C — 3.0-3.6V -40°C to 85°C 20 — 3.0-3.6V -40°C to 125°C — 15 2.5-3.0V -40°C to 85°C 10 — © 2006 Microchip Technology Inc. DS70118G-page 147 dsPIC30F2010 TABLE 22-2: THERMAL OPERATING CONDITIONS Rating Symbol Min Operating Junction Temperature Range TJ Operating Ambient Temperature Range TA Operating Junction Temperature Range Operating Ambient Temperature Range Typ Max Unit -40 +125 °C -40 +85 °C TJ -40 +150 °C TA -40 +125 °C dsPIC30F2010-30I dsPIC30F2010-20E Power Dissipation: Internal chip power dissipation: P INT = V D D × ( I D D – ∑ I O H) PD PINT + PI/O W PDMAX (TJ - TA) / θJA W I/O Pin power dissipation: P I/O = ∑ ( { V D D – V O H } × I OH ) + ∑ ( V O L × I O L Maximum Allowed Power Dissipation TABLE 22-3: THERMAL PACKAGING CHARACTERISTICS Characteristic Symbol θJA θJA θJA Package Thermal Resistance, 28-pin SOIC (SO) Package Thermal Resistance, 28-pin QFN Package Thermal Resistance, 28-pin SPDIP (SP) Note 1: Max Unit Notes 48.3 °C/W 1 33.7 °C/W 1 42 °C/W 1 Junction to ambient thermal resistance, Theta-ja (θJA) numbers are achieved by package simulations. TABLE 22-4: DC TEMPERATURE AND VOLTAGE SPECIFICATIONS Standard Operating Conditions: 2.5V to 5.5V (unless otherwise stated) Operating temperature -40°C ≤ TA ≤ +85°C for Industrial -40°C ≤ TA ≤ +125°C for Extended DC CHARACTERISTICS Param No. Typ Symbol Characteristic Min Typ(1) Max Units Conditions Operating Voltage(2) DC10 VDD Supply Voltage 2.5 — 5.5 V Industrial temperature DC11 VDD Supply Voltage 3.0 — 5.5 V Extended temperature (3) DC12 VDR RAM Data Retention Voltage — 1.5 — V DC16 VPOR VDD Start Voltage to ensure internal Power-on Reset signal — VSS — V DC17 SVDD VDD Rise Rate to ensure internal Power-on Reset signal 0.05 Note 1: 2: 3: V/ms 0-5V in 0.1 sec 0-3V in 60 ms Data in “Typ” column is at 5V, 25°C unless otherwise stated. Parameters are for design guidance only and are not tested. These parameters are characterized but not tested in manufacturing. This is the limit to which VDD can be lowered without losing RAM data. DS70118G-page 148 © 2006 Microchip Technology Inc. dsPIC30F2010 TABLE 22-5: DC CHARACTERISTICS: OPERATING CURRENT (IDD) Standard Operating Conditions: 2.5V to 5.5V (unless otherwise stated) Operating temperature -40°C ≤ TA ≤ +85°C for Industrial -40°C ≤ TA ≤ +125°C for Extended DC CHARACTERISTICS Parameter No. Typical Max Units Conditions Operating Current (IDD)(1) DC31a DC31b 1.6 1.6 3 3 mA mA 25°C 85°C DC31c DC31e 1.6 3.9 3 7 mA mA 125°C 25°C DC31f DC31g 3.5 3.4 7 7 mA mA 85°C 125°C DC30a DC30b 3 3 5 5 mA mA 25°C 85°C DC30c DC30e 3 6 5 9 mA mA 125°C 25°C DC30f DC30g 6 6 9 9 mA mA 85°C 125°C DC23a DC23b 9 10 14 15 mA mA 25°C 85°C DC23c DC23e 10 16 15 24 mA mA 125°C 25°C DC23f 16 24 mA 85°C DC23g DC24a 16 21 24 32 mA mA 125°C 25°C DC24b DC24c 21 21 32 32 mA mA 85°C 125°C DC24e DC24f 35 36 53 53 mA mA 25°C 85°C DC24g DC27a 36 39 53 59 mA mA 125°C 25°C DC27b DC27d 39 66 59 99 mA mA 85°C 25°C DC27e DC27f 66 66 99 99 mA mA 85°C 125°C DC29a DC29b 95 94 150 150 mA mA 25°C 85°C Note 1: 3.3V 0.128 MIPS LPRC (512 kHz) 5V 3.3V (1.8 MIPS) FRC (7.37MHz) 5V 3.3V 4 MIPS EC mode, 4X PLL 5V 3.3V 10 MIPS EC mode, 4X PLL 5V 3.3V 20 MIPS EC mode, 8X PLL 5V 5V 30 MIPS EC mode, 16X PLL The supply current is mainly a function of the operating voltage and frequency. Other factors such as I/O pin loading and switching rate, oscillator type, internal code execution pattern and temperature also have an impact on the current consumption. The test conditions for all IDD measurements are as follows: OSC1 driven with external square wave from rail to rail. All I/O pins are configured as inputs and pulled to VDD. MCLR = VDD, WDT, FSCM, LVD and BOR are disabled. CPU, SRAM, Program Memory and Data Memory are operational. No peripheral modules are operating. © 2006 Microchip Technology Inc. DS70118G-page 149 dsPIC30F2010 TABLE 22-6: DC CHARACTERISTICS: IDLE CURRENT (IIDLE) Standard Operating Conditions: 2.5V to 5.5V (unless otherwise stated) Operating temperature -40°C ≤ TA ≤ +85°C for Industrial -40°C ≤ TA ≤ +125°C for Extended DC CHARACTERISTICS Parameter No. Typical Max Units Conditions Operating Current (IDD)(1) DC51a 1.5 3.0 mA 25°C DC51b 1.5 3.0 mA 85°C DC51c 1.5 3.0 mA 125°C DC51e 4.1 7 mA 25°C DC51f 3.6 7 mA 85°C DC51g 3.5 7 mA 125°C DC50a 3 5 mA 25°C DC50b 3 5 mA 85°C DC50c 3 5 mA 125°C DC50e 7 9 mA 25°C DC50f 6 9 mA 85°C DC50g 6 9 mA 125°C DC43a 5 9 mA 25°C DC43b 6 9 mA 85°C DC43c 6 9 mA 125°C DC43e 10 15 mA 25°C DC43f 10 15 mA 85°C DC43g 10 15 mA 125°C DC44a 11 18 mA 25°C DC44b 12 18 mA 85°C DC44c 12 18 mA 125°C DC44e 20 30 mA 25°C DC44f 20 30 mA 85°C DC44g 20 30 mA 125°C DC47a 20 30 mA 25°C DC47b 21 30 mA 85°C DC47d 35 45 mA 25°C DC47e 35 45 mA 85°C DC47f 35 45 mA 125°C DC49a 49 65 mA 25°C DC49b 50 65 mA 85°C Note 1: 2: 3.3V 0.128 MIPS LPRC (512 kHz) 5V 3.3V (1.8 MIPS) FRC (7.37MHz) 5V 3.3V 4 MIPS EC mode, 4X PLL 5V 3.3V 10 MIPS EC mode, 4X PLL 5V 3.3V 20 MIPS EC mode, 8X PLL 5V 5V 30 MIPS EC mode, 16X PLL Data in “Typical” column is at 5V, 25°C unless otherwise stated. Parameters are for design guidance only and are not tested. Base IIDLE current is measured with core off, clock on and all modules turned off. DS70118G-page 150 © 2006 Microchip Technology Inc. dsPIC30F2010 TABLE 22-7: DC CHARACTERISTICS: POWER-DOWN CURRENT (IPD) Standard Operating Conditions: 2.5V to 5.5V (unless otherwise stated) Operating temperature -40°C ≤ TA ≤ +85°C for Industrial -40°C ≤ TA ≤ +125°C for Extended DC CHARACTERISTICS Parameter No. Typical Max Units Conditions Power Down Current (IPD)(1) DC60a 0.05 — μA 25°C DC60b 3 25 μA 85°C DC60c 20 50 μA 125°C DC60e 0.1 — μA 25°C DC60f 6 35 μA 85°C DC60g 40 70 μA 125°C DC61a 30 45 μA 25°C DC61b 34 51 μA 85°C DC61c 46 69 μA 125°C DC61e 35 53 μA 25°C DC61f 39 59 μA 85°C DC61g 40 60 μA 125°C DC62a 4 10 μA 25°C DC62b 5 10 μA 85°C DC62c 4 10 μA 125°C DC62e 4 15 μA 25°C DC62f 6 15 μA 85°C DC62g 5 15 μA 125°C DC63a 4 6 μA 25°C DC63b 4 6 μA 85°C DC63c 5 7.5 μA 125°C DC63e 10 15 μA 25°C DC63f 9 15 μA 85°C DC63g 10 15 μA 125°C Note 1: 2: 3.3V Base Power Down Current(2) 5V 3.3V Watchdog Timer Current: ΔIWDT(2) 5V 3.3V Timer 1 w/32 kHz Crystal: ΔITI32(2) 5V 3.3V BOR On: ΔIBOR(2) 5V Base IPD is measured with all peripherals and clocks shut down. All I/Os are configured as inputs and pulled high. LVD, BOR, WDT, etc. are all switched off. The Δ current is the additional current consumed when the module is enabled. This current should be added to the base IPD current. © 2006 Microchip Technology Inc. DS70118G-page 151 dsPIC30F2010 TABLE 22-8: DC CHARACTERISTICS: I/O PIN INPUT SPECIFICATIONS Standard Operating Conditions: 2.5V to 5.5V (unless otherwise stated) Operating temperature -40°C ≤ TA ≤ +85°C for Industrial -40°C ≤ TA ≤ +125°C for Extended DC CHARACTERISTICS Param Symbol No. Min Typ(1) Max Units I/O pins: with Schmitt Trigger buffer VSS — 0.2 VDD V DI15 MCLR VSS — 0.2 VDD V DI16 OSC1 (in XT, HS and LP modes) VSS — 0.2 VDD V VIL DI10 Characteristic Conditions Input Low Voltage(2) mode)(3) DI17 OSC1 (in RC VSS — 0.3 VDD V DI18 SDA, SCL VSS — 0.3 VDD V SM bus disabled SDA, SCL VSS — 0.2 VDD V SM bus enabled I/O pins: with Schmitt Trigger buffer 0.8 VDD — VDD V MCLR 0.8 VDD — VDD V DI26 OSC1 (in XT, HS and LP modes) 0.7 VDD — VDD V DI27 OSC1 (in RC mode)(3) 0.9 VDD — VDD V DI28 SDA, SCL 0.7 VDD — VDD V SM bus disabled DI29 SDA, SCL 0.8 VDD — VDD V SM bus enabled 50 250 400 μA VDD = 5V, VPIN = VSS DI19 VIH DI20 DI25 ICNPU Input High Voltage(2) CNXX Pull-up Current(2) DI30 IIL Input Leakage Current(2)(4)(5) DI50 I/O ports — 0.01 ±1 μA VSS ≤ VPIN ≤ VDD, Pin at high-impedance DI51 Analog input pins — 0.50 ±1.3 μA VSS ≤ VPIN ≤ VDD, Pin at high-impedance DI55 MCLR — 0.05 ±5 μA VSS ≤ VPIN ≤ VDD DI56 OSC1 — 0.05 ±7 μA VSS ≤ VPIN ≤ VDD, XT, HS and LP Osc mode Note 1: 2: 3: 4: 5: Data in “Typ” column is at 5V, 25°C unless otherwise stated. Parameters are for design guidance only and are not tested. These parameters are characterized but not tested in manufacturing. In RC oscillator configuration, the OSC1/CLKl pin is a Schmitt Trigger input. It is not recommended that the dsPIC30F device be driven with an external clock while in RC mode. The leakage current on the MCLR pin is strongly dependent on the applied voltage level. The specified levels represent normal operating conditions. Higher leakage current may be measured at different input voltages. Negative current is defined as current sourced by the pin. DS70118G-page 152 © 2006 Microchip Technology Inc. dsPIC30F2010 TABLE 22-9: DC CHARACTERISTICS: I/O PIN OUTPUT SPECIFICATIONS Standard Operating Conditions: 2.5V to 5.5V (unless otherwise stated) Operating temperature -40°C ≤ TA ≤ +85°C for Industrial -40°C ≤ TA ≤ +125°C for Extended DC CHARACTERISTICS Param Symbol No. VOL DO10 Characteristic VOH Typ(1) Max Units Conditions Output Low Voltage(2) I/O ports DO16 Min — — 0.6 V IOL = 8.5 mA, VDD = 5V — — TBD V IOL = 2.0 mA, VDD = 3V OSC2/CLKO — — 0.6 V IOL = 1.6 mA, VDD = 5V (RC or EC Osc mode) — — TBD V IOL = 2.0 mA, VDD = 3V (2) Output High Voltage DO20 I/O ports VDD – 0.7 — — V IOH = -3.0 mA, VDD = 5V TBD — — V IOH = -2.0 mA, VDD = 3V DO26 OSC2/CLKO VDD – 0.7 — — V IOH = -1.3 mA, VDD = 5V TBD — — V IOH = -2.0 mA, VDD = 3V 15 pF In XTL, XT, HS and LP modes when external clock is used to drive OSC1. (RC or EC Osc mode) Capacitive Loading Specs on Output Pins(2) DO50 COSC2 OSC2/SOSC2 pin — — DO56 CIO All I/O pins and OSC2 — — 50 pF RC or EC Osc mode DO58 CB SCL, SDA — — 400 pF In I2C mode Note 1: 2: Data in “Typ” column is at 5V, 25°C unless otherwise stated. Parameters are for design guidance only and are not tested. These parameters are characterized but not tested in manufacturing. FIGURE 22-1: BROWN-OUT RESET CHARACTERISTICS VDD BO10 (Device in Brown-out Reset) BO15 (Device not in Brown-out Reset) Reset (due to BOR) Power Up Time-out © 2006 Microchip Technology Inc. DS70118G-page 153 dsPIC30F2010 TABLE 22-10: ELECTRICAL CHARACTERISTICS: BOR Standard Operating Conditions: 2.5V to 5.5V (unless otherwise stated) Operating temperature -40°C ≤ TA ≤ +85°C for Industrial -40°C ≤ TA ≤ +125°C for Extended DC CHARACTERISTICS Param No. BO10 Symbol VBOR Min Typ(1) Max Units BORV = 11(3) — — — V BORV = 10 2.6 — 2.71 V BORV = 01 4.1 — 4.4 V BORV = 00 4.58 — 4.73 V — 5 — mV Characteristic BOR Voltage(2) on VDD transition high to low Conditions Not in operating range BO15 VBHYS Note 1: Data in “Typ” column is at 5V, 25°C unless otherwise stated. Parameters are for design guidance only and are not tested. These parameters are characterized but not tested in manufacturing. 11 values not in usable operating range. 2: 3: TABLE 22-11: DC CHARACTERISTICS: PROGRAM AND EEPROM Standard Operating Conditions: 2.5V to 5.5V (unless otherwise stated) Operating temperature -40°C ≤ TA ≤ +85°C for Industrial -40°C ≤ TA ≤ +125°C for Extended DC CHARACTERISTICS Param Symbol No. Characteristic Min Typ(1) Max Units Conditions Data EEPROM Memory(2) -40°C ≤ TA ≤ +85°C D120 ED Byte Endurance 100K 1M — E/W D121 VDRW VDD for Read/Write VMIN — 5.5 V D122 TDEW Erase/Write Cycle Time — 2 — ms D123 TRETD Characteristic Retention 40 100 — Year Provided no other specifications are violated D124 IDEW IDD During Programming — 10 30 mA Row Erase -40°C ≤ TA ≤ +85°C Using EECON to read/write VMIN = Minimum operating voltage (2) Program Flash Memory D130 EP Cell Endurance 10K 100K — E/W D131 VPR VDD for Read VMIN — 5.5 V D132 VEB VDD for Bulk Erase 4.5 — 5.5 V D133 VPEW VDD for Erase/Write 3.0 — 5.5 V D134 TPEW Erase/Write Cycle Time — 2 — ms D135 TRETD Characteristic Retention 40 100 — Year D136 TEB ICSP Block Erase Time — 4 — ms D137 IPEW IDD During Programming — 10 30 mA Row Erase D138 IEB IDD During Programming — 10 30 mA Bulk Erase Note 1: 2: VMIN = Minimum operating voltage Provided no other specifications are violated Data in “Typ” column is at 5V, 25°C unless otherwise stated. These parameters are characterized but not tested in manufacturing. DS70118G-page 154 © 2006 Microchip Technology Inc. dsPIC30F2010 22.2 AC Characteristics and Timing Parameters The information contained in this section defines dsPIC30F AC characteristics and timing parameters. TABLE 22-12: TEMPERATURE AND VOLTAGE SPECIFICATIONS – AC Standard Operating Conditions: 2.5V to 5.5V (unless otherwise stated) Operating temperature -40°C ≤ TA ≤ +85°C for Industrial -40°C ≤ TA ≤ +125°C for Extended Operating voltage VDD range as described in Section 22.1 “DC Characteristics”. AC CHARACTERISTICS FIGURE 22-2: LOAD CONDITIONS FOR DEVICE TIMING SPECIFICATIONS Load Condition 1 - for all pins except OSC2 Load Condition 2 - for OSC2 VDD/2 CL Pin RL VSS CL Pin RL = 464 Ω CL = 50 pF for all pins except OSC2 5 pF for OSC2 output VSS FIGURE 22-3: EXTERNAL CLOCK TIMING Q4 Q1 Q2 Q3 Q4 Q1 OSC1 OS20 OS30 OS25 OS30 OS31 OS31 CLKO OS40 © 2006 Microchip Technology Inc. OS41 DS70118G-page 155 dsPIC30F2010 TABLE 22-13: EXTERNAL CLOCK TIMING REQUIREMENTS Standard Operating Conditions: 2.5V to 5.5V (unless otherwise stated) Operating temperature -40°C ≤ TA ≤ +85°C for Industrial -40°C ≤ TA ≤ +125°C for Extended AC CHARACTERISTICS Param Symbol No. OS10 FOSC Characteristic Min Typ(1) Max Units External CLKI Frequency(2) (External clocks allowed only in EC mode) DC 4 4 4 — — — — 40 10 10 7.5 MHz MHz MHz MHz EC EC with 4x PLL EC with 8x PLL EC with 16x PLL Oscillator Frequency(2) DC 0.4 4 4 4 4 10 31 — — — — — — — — — — 7.37 512 4 4 10 10 10 7.5 25 33 — — MHz MHz MHz MHz MHz MHz MHz kHz MHz kHz RC XTL XT XT with 4x PLL XT with 8x PLL XT with 16x PLL HS LP FRC internal LPRC internal Conditions OS20 TOSC TOSC = 1/FOSC — — — — See parameter OS10 for FOSC value OS25 TCY Instruction Cycle Time(2)(3) 33 — DC ns See Table 22-16 (2) OS30 TosL, TosH External Clock in (OSC1) High or Low Time .45 x TOSC — — ns EC OS31 TosR, TosF External Clock(2) in (OSC1) Rise or Fall Time — — 20 ns EC OS40 TckR CLKO Rise Time(2)(4) — 6 10 ns — 6 10 ns OS41 TckF Note 1: 2: 3: 4: CLKO Fall Time (2)(4) Data in “Typ” column is at 5V, 25°C unless otherwise stated. Parameters are for design guidance only and are not tested. These parameters are characterized but not tested in manufacturing. Instruction cycle period (TCY) equals four times the input oscillator time base period. All specified values are based on characterization data for that particular oscillator type under standard operating conditions with the device executing code. Exceeding these specified limits may result in an unstable oscillator operation and/or higher than expected current consumption. All devices are tested to operate at “Min” values with an external clock applied to the OSC1/CLKI pin. When an external clock input is used, the “Max” cycle time limit is “DC” (no clock) for all devices. Measurements are taken in EC or ERC modes. The CLKO signal is measured on the OSC2 pin. CLKO is low for the Q1-Q2 period (1/2 TCY) and high for the Q3-Q4 period (1/2 TCY). DS70118G-page 156 © 2006 Microchip Technology Inc. dsPIC30F2010 TABLE 22-14: PLL CLOCK TIMING SPECIFICATIONS (VDD = 2.5 TO 5.5 V) Standard Operating Conditions: 2.5V to 5.5V (unless otherwise stated) Operating temperature -40°C ≤ TA ≤ +85°C for Industrial -40°C ≤ TA ≤ +125°C for Extended AC CHARACTERISTICS Param No. Characteristic(1) Symbol Min Typ(2) Max Units Conditions OS50 FPLLI PLL Input Frequency Range(2) 4 4 4 4 4 4 — — — — — — 10 10 7.5(3) 10 10 7.5(3) MHz MHz MHz MHz MHz MHz EC with 4x PLL EC with 8x PLL EC with 16x PLL XT with 4x PLL XT with 8x PLL XT with 16x PLL OS51 FSYS On-Chip PLL Output(2) 16 — 120 MHz EC, XT modes with PLL OS52 TLOC PLL Start-up Time (Lock Time) — 20 50 μs Note 1: 2: 3: These parameters are characterized but not tested in manufacturing. Data in “Typ” column is at 5V, 25°C unless otherwise stated. Parameters are for design guidance only and are not tested. Limited by device operating frequency range. TABLE 22-15: PLL JITTER AC CHARACTERISTICS Param No. OS61 Characteristic x4 PLL x8 PLL x16 PLL Note 1: Standard Operating Conditions: 2.5V to 5.5V (unless otherwise stated) Operating temperature -40°C ≤ TA ≤ +85°C for Industrial -40°C ≤ TA ≤ +125°C for Extended Min Typ(1) Max Units Conditions — 0.251 0.413 % -40°C ≤ TA ≤ +85°C VDD = 3.0 to 3.6V — 0.251 0.413 % -40°C ≤ TA ≤ +125°C VDD = 3.0 to 3.6V — 0.256 0.47 % -40°C ≤ TA ≤ +85°C VDD = 4.5 to 5.5V — 0.256 0.47 % -40°C ≤ TA ≤ +125°C VDD = 4.5 to 5.5V — 0.355 0.584 % -40°C ≤ TA ≤ +85°C VDD = 3.0 to 3.6V — 0.355 0.584 % -40°C ≤ TA ≤ +125°C VDD = 3.0 to 3.6V — 0.362 0.664 % -40°C ≤ TA ≤ +85°C VDD = 4.5 to 5.5V — 0.362 0.664 % -40°C ≤ TA ≤ +125°C VDD = 4.5 to 5.5V — 0.67 0.92 % -40°C ≤ TA ≤ +85°C VDD = 3.0 to 3.6V — 0.632 0.956 % -40°C ≤ TA ≤ +85°C VDD = 4.5 to 5.5V — 0.632 0.956 % -40°C ≤ TA ≤ +125°C VDD = 4.5 to 5.5V These parameters are characterized but not tested in manufacturing. © 2006 Microchip Technology Inc. DS70118G-page 157 dsPIC30F2010 TABLE 22-16: INTERNAL CLOCK TIMING EXAMPLES Clock Oscillator Mode FOSC (MHz)(1) TCY (μsec)(2) MIPS(3) w/o PLL EC 0.200 20.0 0.05 — — — 4 1.0 1.0 4.0 8.0 16.0 — XT Note 1: 2: 3: MIPS(3) w PLL x4 MIPS(3) w PLL x8 MIPS(3) w PLL x16 10 0.4 2.5 10.0 20.0 25 0.16 6.25 — — — 4 1.0 1.0 4.0 8.0 16.0 10 0.4 2.5 10.0 20.0 — Assumption: Oscillator Postscaler is divide by 1. Instruction Execution Cycle Time: TCY = 1 / MIPS. Instruction Execution Frequency: MIPS = (FOSC * PLLx) / 4 (since there are 4 Q clocks per instruction cycle). TABLE 22-17: AC CHARACTERISTICS: INTERNAL RC ACCURACY AC CHARACTERISTICS Param No. Standard Operating Conditions: 2.5V to 5.5V (unless otherwise stated) Operating temperature -40°C ≤ TA ≤ +85°C for Industrial -40°C ≤ TA ≤ +125°C for Extended Characteristic Min Typ Max Units Conditions Internal FRC Jitter @ FRC Freq. = 7.37 MHz(1) OS62 FRC — +0.04 +0.16 % -40°C ≤ TA ≤ +85°C VDD = 3.0-3.6V — +0.07 +0.23 % -40°C ≤ TA ≤ +125°C VDD = 4.5-5.5V % -40°C ≤ TA ≤ +125°C VDD = 3.0-5.5V Internal FRC Accuracy @ FRC Freq. = 7.37 MHz(1) OS63 FRC — — +1.50 Internal FRC Drift @ FRC Freq. = 7.37 MHz(1) OS64 Note 1: 2: -0.7 — 0.5 % -40°C ≤ TA ≤ +85°C VDD = 3.0-3.6V -0.7 — 0.7 % -40°C ≤ TA ≤ +125°C VDD = 3.0-3.6V -0.7 — 0.5 % -40°C ≤ TA ≤ +85°C VDD = 4.5-5.5V -0.7 — 0.7 % -40°C ≤ TA ≤ +125°C VDD = 4.5-5.5V Frequency calibrated at 7.372 MHz ±2%, 25°C and 5V. TUN <3:0> bits can be used to compensate for temperature drift. Overall FRC variation can be calculated by adding the absolute values of jitter, accuracy and drift percentages. TABLE 22-18: INTERNAL RC ACCURACY AC CHARACTERISTICS Param No. Characteristic Standard Operating Conditions: 2.5V to 5.5V (unless otherwise stated) Operating temperature -40°C ≤ TA ≤ +85°C for Industrial -40°C ≤ TA ≤ +125°C for Extended Min Typ Max Units Conditions -35 — +35 % — LPRC @ Freq. = 512 kHz(1) OS65 Note 1: Change of LPRC frequency as VDD changes. DS70118G-page 158 © 2006 Microchip Technology Inc. dsPIC30F2010 FIGURE 22-4: CLKO AND I/O TIMING CHARACTERISTICS I/O Pin (Input) DI35 DI40 I/O Pin (Output) New Value Old Value DO31 DO32 Note: Refer to Figure 22-2 for load conditions. TABLE 22-19: CLKO AND I/O TIMING REQUIREMENTS Standard Operating Conditions: 2.5V to 5.5V (unless otherwise stated) Operating temperature -40°C ≤ TA ≤ +85°C for Industrial -40°C ≤ TA ≤ +125°C for Extended AC CHARACTERISTICS Param No. Characteristic(1)(2)(3) Symbol Min Typ(4) Max Units Conditions DO31 TIOR Port output rise time — 7 20 ns — DO32 TIOF Port output fall time — 7 20 ns — DI35 TINP INTx pin high or low time (output) DI40 TRBP CNx high or low time (input) Note 1: 2: 3: 4: 20 — — ns — 2 TCY — — — — These parameters are asynchronous events not related to any internal clock edges Measurements are taken in RC mode and EC mode where CLKO output is 4 x TOSC. These parameters are characterized but not tested in manufacturing. Data in “Typ” column is at 5V, 25°C unless otherwise stated. © 2006 Microchip Technology Inc. DS70118G-page 159 dsPIC30F2010 FIGURE 22-5: VDD RESET, WATCHDOG TIMER, OSCILLATOR START-UP TIMER AND POWER-UP TIMER TIMING CHARACTERISTICS SY12 MCLR SY10 Internal POR SY11 PWRT Time-out OSC Time-out SY30 Internal Reset Watchdog Timer Reset SY13 SY20 SY13 I/O Pins SY35 FSCM Delay Note: Refer to Figure 22-2 for load conditions. DS70118G-page 160 © 2006 Microchip Technology Inc. dsPIC30F2010 TABLE 22-20: RESET, WATCHDOG TIMER, OSCILLATOR START-UP TIMER, POWER-UP TIMER AND BROWN-OUT RESET TIMING REQUIREMENTS Standard Operating Conditions: 2.5V to 5.5V (unless otherwise stated) Operating temperature -40°C ≤ TA ≤ +85°C for Industrial -40°C ≤ TA ≤ +125°C for Extended AC CHARACTERISTICS Param Symbol No. Characteristic(1) Min Typ(2) Max Units Conditions SY10 TmcL MCLR Pulse Width (low) 2 — — μs -40°C to +85°C SY11 TPWRT Power-up Timer Period 3 12 50 4 16 64 6 22 90 ms -40°C to +85°C User programmable SY12 TPOR Power On Reset Delay 3 10 30 μs -40°C to +85°C SY13 TIOZ I/O high-impedance from MCLR Low or Watchdog Timer Reset — 0.8 1.0 μs SY20 TWDT1 Watchdog Timer Time-out Period (No Prescaler) 1.4 2.1 2.8 ms 3.3V, -40°C to +125°C 1.4 2.1 2.8 ms 5.0V, -40°C to +125°C TWDT2 Width(3) SY25 TBOR Brown-out Reset Pulse 100 — — μs VDD ≤ VBOR (D034) SY30 TOST Oscillation Start-up Timer Period — 1024 TOSC — — TOSC = OSC1 period SY35 TFSCM Fail-Safe Clock Monitor Delay — 500 900 μs -40°C to +85°C Note 1: 2: 3: These parameters are characterized but not tested in manufacturing. Data in “Typ” column is at 5V, 25°C unless otherwise stated. Refer to Figure 22-1 and Table 22-10 for BOR. © 2006 Microchip Technology Inc. DS70118G-page 161 dsPIC30F2010 FIGURE 22-6: BAND GAP START-UP TIME CHARACTERISTICS VBGAP 0V Enable Band Gap (see Note) Band Gap Stable SY40 Note: Band Gap is enabled when FBORPOR<7> is set. TABLE 22-21: BAND GAP START-UP TIME REQUIREMENTS AC CHARACTERISTICS Param No. SY40 Note 1: 2: Symbol TBGAP Standard Operating Conditions: 2.5V to 5.5V (unless otherwise stated) Operating temperature -40°C ≤ TA ≤ +85°C for Industrial -40°C ≤ TA ≤ +125°C for Extended Characteristic(1) Min Typ(2) Max Units Band Gap Start-up Time — 40 65 µs Conditions Defined as the time between the instant that the band gap is enabled and the moment that the band gap reference voltage is stable. RCON<13>Status bit These parameters are characterized but not tested in manufacturing. Data in “Typ” column is at 5V, 25°C unless otherwise stated. DS70118G-page 162 © 2006 Microchip Technology Inc. dsPIC30F2010 FIGURE 22-7: TIMER EXTERNAL CLOCK TIMING CHARACTERISTICS TxCK Tx11 Tx10 Tx15 Tx20 OS60 TMRX Note: “x” refers to Timer Type A or Timer Type B. Refer to Figure 22-2 for load conditions. TABLE 22-22: TIMER1 EXTERNAL CLOCK TIMING REQUIREMENTS Standard Operating Conditions: 2.5V to 5.5V (unless otherwise stated) Operating temperature -40°C ≤ TA ≤ +85°C for Industrial -40°C ≤ TA ≤ +125°C for Extended AC CHARACTERISTICS Param No. TA10 TA11 Symbol TTXH TTXL Characteristic TxCK High Time TxCK Low Time Min Typ Max Units Conditions Synchronous, no prescaler 0.5 TCY + 20 — — ns Must also meet parameter TA15 Synchronous, with prescaler 10 — — ns Asynchronous 10 — — ns Synchronous, no prescaler 0.5 TCY + 20 — — ns Synchronous, with prescaler 10 — — ns Asynchronous TA15 TTXP TxCK Input Period Synchronous, no prescaler Synchronous, with prescaler Asynchronous OS60 Ft1 SOSC1/T1CK oscillator input frequency range (oscillator enabled by setting bit TCS (T1CON, bit 1)) TA20 TCKEXTMRL Delay from External TxCK Clock Edge to Timer Increment © 2006 Microchip Technology Inc. 10 — — ns TCY + 10 — — ns Greater of: 20 ns or (TCY + 40)/N — — — 20 — — ns DC — 50 kHz 1.5 TCY — 0.5 TCY Must also meet parameter TA15 N = prescale value (1, 8, 64, 256) DS70118G-page 163 dsPIC30F2010 TABLE 22-23: TIMER2 EXTERNAL CLOCK TIMING REQUIREMENTS Standard Operating Conditions: 2.5V to 5.5V (unless otherwise stated) Operating temperature -40°C ≤ TA ≤ +85°C for Industrial -40°C ≤ TA ≤ +125°C for Extended AC CHARACTERISTICS Param No. TB10 TB11 TB15 Symbol TtxH TtxL TtxP Characteristic TxCK High Time TxCK Low Time Min Typ Max Units Synchronous, no prescaler 0.5 TCY + 20 — — ns Synchronous, with prescaler 10 — — ns Synchronous, no prescaler 0.5 TCY + 20 — — ns Synchronous, with prescaler 10 — — ns TCY + 10 — — ns 1.5 TCY — TxCK Input Period Synchronous, no prescaler Synchronous, with prescaler TB20 TCKEXTMRL Delay from External TxCK Clock Edge to Timer Increment Greater of: 20 ns or (TCY + 40)/N 0.5 TCY Conditions Must also meet parameter TB15 Must also meet parameter TB15 N = prescale value (1, 8, 64, 256) TABLE 22-24: TIMER3 EXTERNAL CLOCK TIMING REQUIREMENTS Standard Operating Conditions: 2.5V to 5.5V (unless otherwise stated) Operating temperature -40°C ≤ TA ≤ +85°C for Industrial -40°C ≤ TA ≤ +125°C for Extended AC CHARACTERISTICS Param No. Symbol Characteristic Min Typ Max Units Conditions TC10 TtxH TxCK High Time Synchronous 0.5 TCY + 20 — — ns Must also meet parameter TC15 TC11 TtxL TxCK Low Time Synchronous 0.5 TCY + 20 — — ns Must also meet parameter TC15 TC15 TtxP TxCK Input Period Synchronous, no prescaler TCY + 10 — — ns N = prescale value (1, 8, 64, 256) 1.5 TCY — Synchronous, with prescaler TC20 TCKEXTMRL Delay from External TxCK Clock Edge to Timer Increment DS70118G-page 164 Greater of: 20 ns or (TCY + 40)/N 0.5 TCY © 2006 Microchip Technology Inc. dsPIC30F2010 FIGURE 22-8: TIMERQ (QEI MODULE) EXTERNAL CLOCK TIMING CHARACTERISTICS QEB TQ11 TQ10 TQ15 TQ20 POSCNT TABLE 22-25: QEI MODULE EXTERNAL CLOCK TIMING REQUIREMENTS Standard Operating Conditions: 2.5V to 5.5V (unless otherwise stated) Operating temperature -40°C ≤ TA ≤ +85°C for Industrial -40°C ≤ TA ≤ +125°C for Extended AC CHARACTERISTICS Param No. Characteristic(1) Symbol Min Typ Max Units Conditions TQ10 TtQH TQCK High Time Synchronous, with prescaler TCY + 20 — ns Must also meet parameter TQ15 TQ11 TtQL TQCK Low Time Synchronous, with prescaler TCY + 20 — ns Must also meet parameter TQ15 TQ15 TtQP TQCP Input Period Synchronous, with prescaler 2 * TCY + 40 — ns — TQ20 TCKEXTMRL Delay from External TxCK Clock Edge to Timer Increment 0.5 TCY 1.5 TCY ns — Note 1: These parameters are characterized but not tested in manufacturing. © 2006 Microchip Technology Inc. DS70118G-page 165 dsPIC30F2010 FIGURE 22-9: INPUT CAPTURE (CAPx) TIMING CHARACTERISTICS ICX IC10 IC11 IC15 Note: Refer to Figure 22-2 for load conditions. TABLE 22-26: INPUT CAPTURE TIMING REQUIREMENTS Standard Operating Conditions: 2.5V to 5.5V (unless otherwise stated) Operating temperature -40°C ≤ TA ≤ +85°C for Industrial -40°C ≤ TA ≤ +125°C for Extended AC CHARACTERISTICS Param No. Characteristic(1) Symbol IC10 TccL ICx Input Low Time IC11 TccH ICx Input High Time IC15 TccP ICx Input Period No Prescaler Min Max Units 0.5 TCY + 20 — ns With Prescaler No Prescaler 10 — ns 0.5 TCY + 20 — ns 10 — ns (2 TCY + 40)/N — ns With Prescaler Note 1: Conditions N = prescale value (1, 4, 16) These parameters are characterized but not tested in manufacturing. FIGURE 22-10: OUTPUT COMPARE MODULE (OCx) TIMING CHARACTERISTICS OCx (Output Compare or PWM Mode) OC10 OC11 Note: Refer to Figure 22-2 for load conditions. TABLE 22-27: OUTPUT COMPARE MODULE TIMING REQUIREMENTS AC CHARACTERISTICS Param Symbol No. Characteristic(1) Standard Operating Conditions: 2.5V to 5.5V (unless otherwise stated) Operating temperature -40°C ≤ TA ≤ +85°C for Industrial -40°C ≤ TA ≤ +125°C for Extended Min Typ(2) Max Units Conditions OC10 TccF OCx Output Fall Time — — — ns See parameter D032 OC11 TccR OCx Output Rise Time — — — ns See parameter D031 Note 1: 2: These parameters are characterized but not tested in manufacturing. Data in “Typ” column is at 5V, 25°C unless otherwise stated. Parameters are for design guidance only and are not tested. DS70118G-page 166 © 2006 Microchip Technology Inc. dsPIC30F2010 FIGURE 22-11: OC/PWM MODULE TIMING CHARACTERISTICS OC20 OCFA/OCFB OC15 OCx TABLE 22-28: SIMPLE OC/PWM MODE TIMING REQUIREMENTS Standard Operating Conditions: 2.5V to 5.5V (unless otherwise stated) Operating temperature -40°C ≤ TA ≤ +85°C for Industrial -40°C ≤ TA ≤ +125°C for Extended AC CHARACTERISTICS Param Symbol No. Characteristic(1) Min Typ(2) Max Units Conditions OC15 TFD Fault Input to PWM I/O Change — — 50 ns — OC20 TFLT Fault Input Pulse Width 50 — — ns — Note 1: 2: These parameters are characterized but not tested in manufacturing. Data in “Typ” column is at 5V, 25°C unless otherwise stated. Parameters are for design guidance only and are not tested. © 2006 Microchip Technology Inc. DS70118G-page 167 dsPIC30F2010 FIGURE 22-12: MOTOR CONTROL PWM MODULE FAULT TIMING CHARACTERISTICS MP30 FLTA/B MP20 PWMx FIGURE 22-13: MOTOR CONTROL PWM MODULE TIMING CHARACTERISTICS MP11 MP10 PWMx Note: Refer to Figure 22-2 for load conditions. TABLE 22-29: MOTOR CONTROL PWM MODULE TIMING REQUIREMENTS AC CHARACTERISTICS Param No. MP10 MP11 MP20 MP30 Note 1: 2: Standard Operating Conditions: 2.5V to 5.5V (unless otherwise stated) Operating temperature -40°C ≤ TA ≤ +85°C for Industrial -40°C ≤ TA ≤ +125°C for Extended Characteristic(1) Min Typ(2) Max Units TFPWM PWM Output Fall Time — — — ns Symbol Conditions See parameter D032 TRPWM PWM Output Rise Time — — — ns See parameter D031 TFD Fault Input ↓ to PWM I/O Change — — 50 ns — TFH Minimum Pulse Width 50 — — ns — These parameters are characterized but not tested in manufacturing. Data in “Typ” column is at 5V, 25°C unless otherwise stated. Parameters are for design guidance only and are not tested. DS70118G-page 168 © 2006 Microchip Technology Inc. dsPIC30F2010 FIGURE 22-14: QEA/QEB INPUT CHARACTERISTICS TQ36 QEA (input) TQ30 TQ31 TQ35 QEB (input) TQ41 TQ40 TQ30 TQ31 TQ35 QEB Internal TABLE 22-30: QUADRATURE DECODER TIMING REQUIREMENTS Standard Operating Conditions: 2.5V to 5.5V (unless otherwise stated) Operating temperature -40°C ≤ TA ≤ +85°C for Industrial -40°C ≤ TA ≤ +125°C for Extended AC CHARACTERISTICS Param No. Characteristic(1) Symbol Typ(2) Max Units Conditions TQ30 TQUL Quadrature Input Low Time 6 TCY — ns — TQ31 TQUH Quadrature Input High Time 6 TCY — ns — TQ35 TQUIN Quadrature Input Period 12 TCY — ns — TQ36 TQUP Quadrature Phase Period 3 TCY — ns — TQ40 TQUFL Filter Time to Recognize Low, with Digital Filter 3 * N * TCY — ns N = 1, 2, 4, 16, 32, 64, 128 and 256 (Note 2) TQ41 TQUFH Filter Time to Recognize High, with Digital Filter 3 * N * TCY — ns N = 1, 2, 4, 16, 32, 64, 128 and 256 (Note 2) Note 1: 2: These parameters are characterized but not tested in manufacturing. N = Index Channel Digital Filter Clock Divide Select Bits. Refer to Section 16. “Quadrature Encoder Interface (QEI)” in the “dsPIC30F Family Reference Manual” (DS70046). © 2006 Microchip Technology Inc. DS70118G-page 169 dsPIC30F2010 FIGURE 22-15: QEI MODULE INDEX PULSE TIMING CHARACTERISTICS QEA (input) QEB (input) Ungated Index TQ50 TQ51 Index Internal TQ55 Position TABLE 22-31: QEI INDEX PULSE TIMING REQUIREMENTS AC CHARACTERISTICS Param No. Symbol Standard Operating Conditions: 2.5V to 5.5V (unless otherwise stated) Operating temperature -40°C ≤ TA ≤ +85°C for Industrial -40°C ≤ TA ≤ +125°C for Extended Characteristic(1) Min Max Units Conditions TQ50 TqIL Filter Time to Recognize Low, with Digital Filter 3 * N * TCY — ns N = 1, 2, 4, 16, 32, 64, 128 and 256 (Note 2) TQ51 TqiH Filter Time to Recognize High, with Digital Filter 3 * N * TCY — ns N = 1, 2, 4, 16, 32, 64, 128 and 256 (Note 2) TQ55 Tqidxr Index Pulse Recognized to Position Counter Reset (Ungated Index) 3 TCY — ns Note 1: 2: — These parameters are characterized but not tested in manufacturing. Alignment of Index Pulses to QEA and QEB is shown for Position Counter reset timing only. Shown for forward direction only (QEA leads QEB). Same timing applies for reverse direction (QEA lags QEB) but Index Pulse recognition occurs on falling edge. DS70118G-page 170 © 2006 Microchip Technology Inc. dsPIC30F2010 FIGURE 22-16: SPI MODULE MASTER MODE (CKE = 0) TIMING CHARACTERISTICS SCKx (CKP = 0) SP11 SP10 SP21 SP20 SP20 SP21 SCKx (CKP = 1) SP35 MSb SDOx BIT14 - - - - - -1 SP31 SDIx LSb SP30 MSb IN LSb IN BIT14 - - - -1 SP40 SP41 Note: Refer to Figure 22-2 for load conditions. TABLE 22-32: SPI MASTER MODE (CKE = 0) TIMING REQUIREMENTS Standard Operating Conditions: 2.5V to 5.5V (unless otherwise stated) Operating temperature -40°C ≤ TA ≤ +85°C for Industrial -40°C ≤ TA ≤ +125°C for Extended AC CHARACTERISTICS Param No. Symbol Characteristic(1) Min Typ(2) Max Units Conditions SP10 TscL SCKX Output Low Time(3) TCY / 2 — — ns — SP11 TscH SCKX Output High Time(3) TCY / 2 — — ns — — — — ns See parameter D032 Time(4 SP20 TscF SCKX Output Fall SP21 TscR SCKX Output Rise Time(4) — — — ns See parameter D031 SP30 TdoF SDOX Data Output Fall Time(4) — — — ns See parameter D032 SP31 TdoR SDOX Data Output Rise Time(4) — — — ns See parameter D031 SP35 TscH2doV, TscL2doV SDOX Data Output Valid after SCKX Edge — — 30 ns — SP40 TdiV2scH, TdiV2scL Setup Time of SDIX Data Input to SCKX Edge 20 — — ns — SP41 TscH2diL, TscL2diL Hold Time of SDIX Data Input to SCKX Edge 20 — — ns — Note 1: 2: 3: 4: These parameters are characterized but not tested in manufacturing. Data in “Typ” column is at 5V, 25°C unless otherwise stated. Parameters are for design guidance only and are not tested. The minimum clock period for SCK is 100 ns. Therefore, the clock generated in Master mode must not violate this specification. Assumes 50 pF load on all SPI pins. © 2006 Microchip Technology Inc. DS70118G-page 171 dsPIC30F2010 FIGURE 22-17: SPI MODULE MASTER MODE (CKE =1) TIMING CHARACTERISTICS SP36 SCKX (CKP = 0) SP11 SP10 SP21 SP20 SP20 SP21 SCKX (CKP = 1) SP35 BIT14 - - - - - -1 MSb SDOX SP40 SDIX LSb SP30,SP31 MSb IN BIT14 - - - -1 LSb IN SP41 Note: Refer to Figure 22-2 for load conditions. TABLE 22-33: SPI MODULE MASTER MODE (CKE = 1) TIMING REQUIREMENTS Standard Operating Conditions: 2.5V to 5.5V (unless otherwise stated) Operating temperature -40°C ≤ TA ≤ +85°C for Industrial -40°C ≤ TA ≤ +125°C for Extended AC CHARACTERISTICS Param No. SP10 Symbol TscL Characteristic(1) SCKX output low time(3) time(3) Min Typ(2) Max Units Conditions TCY / 2 — — ns — SP11 TscH SCKX output high TCY / 2 — — ns — SP20 TscF SCKX output fall time(4) — — — ns See parameter D032 SP21 TscR SCKX output rise time(4) — — — ns See parameter D031 SP30 TdoF SDOX data output fall time(4) — — — ns See parameter D032 SP31 TdoR SDOX data output rise time(4) — — — ns See parameter D031 SP35 TscH2doV, SDOX data output valid after TscL2doV SCKX edge — — 30 ns — SP36 TdoV2sc, SDOX data output setup to TdoV2scL first SCKX edge 30 — — ns — SP40 TdiV2scH, Setup time of SDIX data input TdiV2scL to SCKX edge 20 — — ns — SP41 TscH2diL, TscL2diL 20 — — ns — Note 1: 2: 3: 4: Hold time of SDIX data input to SCKX edge These parameters are characterized but not tested in manufacturing. Data in “Typ” column is at 5V, 25°C unless otherwise stated. Parameters are for design guidance only and are not tested. The minimum clock period for SCK is 100 ns. Therefore, the clock generated in Master mode must not violate this specification. Assumes 50 pF load on all SPI pins. DS70118G-page 172 © 2006 Microchip Technology Inc. dsPIC30F2010 FIGURE 22-18: SPI MODULE SLAVE MODE (CKE = 0) TIMING CHARACTERISTICS SSX SP52 SP50 SCKX (CKP = 0) SP71 SP70 SP73 SP72 SP72 SP73 SCKX (CKP = 1) SP35 MSb SDOX LSb BIT14 - - - - - -1 SP51 SP30,SP31 SDIX MSb IN BIT14 - - - -1 LSb IN SP41 SP40 Note: Refer to Figure 22-2 for load conditions. TABLE 22-34: SPI MODULE SLAVE MODE (CKE = 0) TIMING REQUIREMENTS Standard Operating Conditions: 2.5V to 5.5V (unless otherwise stated) Operating temperature -40°C ≤ TA ≤ +85°C for Industrial -40°C ≤ TA ≤ +125°C for Extended AC CHARACTERISTICS Param No. Symbol Characteristic(1) Min Typ(2) Max Units Conditions SP70 TscL SCKX Input Low Time 30 — — ns — SP71 SP72 TscH TscF SCKX Input High Time SCKX Input Fall Time(3) 30 — — 10 — 25 ns ns — — SP73 SP30 TscR TdoF SCKX Input Rise Time(3) SDOX Data Output Fall Time(3) — — 10 — 25 — ns ns SP31 TdoR SDOX Data Output Rise Time(3) — — — ns — See parameter D032 See parameter D031 SP35 TscH2doV, SDOX Data Output Valid after TscL2doV SCKX Edge — — 30 ns — SP40 TdiV2scH, Setup Time of SDIX Data Input TdiV2scL to SCKX Edge 20 — — ns — SP41 TscH2diL, TscL2diL TssL2scH, TssL2scL TssH2doZ 20 — — ns — 120 — — ns — 10 — 50 ns — 1.5 TCY +40 — — ns — SP50 SP51 Hold Time of SDIX Data Input to SCKX Edge SSX↓ to SCKX↑ or SCKX↓ Input SSX↑ to SDOX Output High-Impedance(3) SP52 TscH2ssH SSX after SCK Edge TscL2ssH Note 1: 2: These parameters are characterized but not tested in manufacturing. Data in “Typ” column is at 5V, 25°C unless otherwise stated. Parameters are for design guidance only and are not tested. Assumes 50 pF load on all SPI pins. 3: © 2006 Microchip Technology Inc. DS70118G-page 173 dsPIC30F2010 FIGURE 22-19: SPI MODULE SLAVE MODE (CKE = 1) TIMING CHARACTERISTICS SP60 SSX SP52 SP50 SCKX (CKP = 0) SP71 SP70 SP73 SP72 SP72 SP73 SCKX (CKP = 1) SP35 SP52 MSb SDOX BIT14 - - - - - -1 LSb SP30,SP31 SDIX MSb IN BIT14 - - - -1 SP51 LSb IN SP41 SP40 Note: Refer to Figure 22-2 for load conditions. DS70118G-page 174 © 2006 Microchip Technology Inc. dsPIC30F2010 TABLE 22-35: SPI MODULE SLAVE MODE (CKE = 1) TIMING REQUIREMENTS Standard Operating Conditions: 2.5V to 5.5V (unless otherwise stated) Operating temperature -40°C ≤ TA ≤ +85°C for Industrial -40°C ≤ TA ≤ +125°C for Extended AC CHARACTERISTICS Param No. Characteristic(1) Symbol Min Typ(2) Max Units Conditions TscL SCKX Input Low Time 30 — — ns — SP71 TscH SCKX Input High Time 30 — — ns — SP72 TscF SCKX Input Fall Time(3) — 10 25 ns — SP70 (3) SP73 TscR SCKX Input Rise Time — 10 25 ns — SP30 TdoF SDOX Data Output Fall Time(3) — — — ns See parameter D032 SP31 TdoR SDOX Data Output Rise Time(3) — — — ns See parameter D031 SP35 TscH2doV, SDOX Data Output Valid after TscL2doV SCKX Edge — — 30 ns — SP40 TdiV2scH, Setup Time of SDIX Data Input TdiV2scL to SCKX Edge 20 — — ns — SP41 TscH2diL, Hold Time of SDIX Data Input TscL2diL to SCKX Edge 20 — — ns — SP50 TssL2scH, SSX↓ to SCKX↓ or SCKX↑ input TssL2scL 120 — — ns — SP51 TssH2doZ SS↑ to SDOX Output High-Impedance(4) 10 — 50 ns — SP52 TscH2ssH SSX↑ after SCKX Edge TscL2ssH 1.5 TCY + 40 — — ns — SP60 TssL2doV SDOX Data Output Valid after SSX Edge — — 50 ns — Note 1: 2: 3: 4: These parameters are characterized but not tested in manufacturing. Data in “Typ” column is at 5V, 25°C unless otherwise stated. Parameters are for design guidance only and are not tested. The minimum clock period for SCK is 100 ns. Therefore, the clock generated in Master mode must not violate this specification. Assumes 50 pF load on all SPI pins. © 2006 Microchip Technology Inc. DS70118G-page 175 dsPIC30F2010 FIGURE 22-20: I2C™ BUS START/STOP BITS TIMING CHARACTERISTICS (MASTER MODE) SCL IM31 IM34 IM30 IM33 SDA Stop Condition Start Condition Note: Refer to Figure 22-2 for load conditions. FIGURE 22-21: I2C™ BUS DATA TIMING CHARACTERISTICS (MASTER MODE) IM20 IM21 IM11 IM10 SCL IM11 IM26 IM10 IM25 IM33 SDA In IM40 IM40 IM45 SDA Out Note: Refer to Figure 22-2 for load conditions. DS70118G-page 176 © 2006 Microchip Technology Inc. dsPIC30F2010 TABLE 22-36: I2C™ BUS DATA TIMING REQUIREMENTS (MASTER MODE) Standard Operating Conditions: 2.5V to 5.5V (unless otherwise stated) Operating temperature -40°C ≤ TA ≤ +85°C for Industrial -40°C ≤ TA ≤ +125°C for Extended AC CHARACTERISTICS Param Symbol No. IM10 Min(1) Max Units Conditions TLO:SCL Clock Low Time 100 kHz mode TCY / 2 (BRG + 1) — µs — 400 kHz mode TCY / 2 (BRG + 1) — µs — (2) TCY / 2 (BRG + 1) — µs — Clock High Time 100 kHz mode TCY / 2 (BRG + 1) — µs — 400 kHz mode TCY / 2 (BRG + 1) — µs — 1 MHz mode(2) TCY / 2 (BRG + 1) — µs — 100 kHz mode — 300 ns 400 kHz mode 20 + 0.1 CB 300 ns Characteristic 1 MHz mode THI:SCL IM11 TF:SCL IM20 TR:SCL IM21 SDA and SCL Fall Time SDA and SCL Rise Time TSU:DAT Data Input Setup Time IM25 THD:DAT Data Input Hold Time IM26 TSU:STA IM30 Start Condition Setup Time THD:STA Start Condition Hold Time IM31 TSU:STO Stop Condition Setup Time IM33 THD:STO Stop Condition IM34 Hold Time TAA:SCL IM40 Output Valid From Clock 1 MHz mode(2) — 100 ns 100 kHz mode — 1000 ns 400 kHz mode 20 + 0.1 CB 300 ns 1 MHz mode(2) — 300 ns 100 kHz mode 250 — ns 400 kHz mode 100 — ns 1 MHz mode(2) TBD — ns 100 kHz mode 0 — ns 400 kHz mode 0 0.9 µs 1 MHz mode(2) TBD — ns 100 kHz mode TCY / 2 (BRG + 1) — µs 400 kHz mode TCY / 2 (BRG + 1) — µs 1 MHz mode(2) TCY / 2 (BRG + 1) — µs 100 kHz mode TCY / 2 (BRG + 1) — µs 400 kHz mode TCY / 2 (BRG + 1) — µs 1 MHz mode(2) TCY / 2 (BRG + 1) — µs 100 kHz mode TCY / 2 (BRG + 1) — µs 400 kHz mode TCY / 2 (BRG + 1) — µs 1 MHz mode(2) TCY / 2 (BRG + 1) — µs 100 kHz mode TCY / 2 (BRG + 1) — ns IM50 CB Note 1: 2: CB is specified to be from 10 to 400 pF — — Only relevant for repeated Start condition After this period the first clock pulse is generated — — 400 kHz mode TCY / 2 (BRG + 1) — ns 1 MHz mode(2) TCY / 2 (BRG + 1) — ns 100 kHz mode — 3500 ns — 400 kHz mode — 1000 ns — mode(2) — — ns 100 kHz mode 4.7 — µs 1 MHz TBF:SDA Bus Free Time IM45 CB is specified to be from 10 to 400 pF 400 kHz mode 1.3 — µs 1 MHz mode(2) TBD — µs — 400 pF Bus Capacitive Loading — Time the bus must be free before a new transmission can start BRG is the value of the I2C™ Baud Rate Generator. Refer to Section 21 “Inter-Integrated Circuit™ (I2C)” in the “dsPIC30F Family Reference Manual” (DS70046). Maximum pin capacitance = 10 pF for all I2C pins (for 1 MHz mode only). © 2006 Microchip Technology Inc. DS70118G-page 177 dsPIC30F2010 FIGURE 22-22: I2C™ BUS START/STOP BITS TIMING CHARACTERISTICS (SLAVE MODE) SCL IS34 IS31 IS30 IS33 SDA Stop Condition Start Condition FIGURE 22-23: I2C™ BUS DATA TIMING CHARACTERISTICS (SLAVE MODE) IS20 IS21 IS11 IS10 SCL IS30 IS26 IS31 IS25 IS33 SDA In IS40 IS40 IS45 SDA Out DS70118G-page 178 © 2006 Microchip Technology Inc. dsPIC30F2010 TABLE 22-37: I2C™ BUS DATA TIMING REQUIREMENTS (SLAVE MODE) Standard Operating Conditions: 2.5V to 5.5V (unless otherwise stated) Operating temperature -40°C ≤ TA ≤ +85°C for Industrial -40°C ≤ TA ≤ +125°C for Extended AC CHARACTERISTICS Param No. IS10 IS11 Symbol TLO:SCL THI:SCL Characteristic Clock Low Time Clock High Time Min Max Units 100 kHz mode 4.7 — μs 400 kHz mode 1.3 — μs 1 MHz mode(1) 100 kHz mode 0.5 4.0 — — μs μs 400 kHz mode 0.6 — μs 0.5 — 20 + 0.1 CB — — 20 + 0.1 CB — 300 300 100 1000 300 μs ns ns ns ns ns Conditions Device must operate at a minimum of 1.5 MHz Device must operate at a minimum of 10 MHz. — Device must operate at a minimum of 1.5 MHz Device must operate at a minimum of 10 MHz — CB is specified to be from 10 to 400 pF IS20 TF:SCL SDA and SCL Fall Time IS21 TR:SCL SDA and SCL Rise Time 1 MHz mode(1) 100 kHz mode 400 kHz mode 1 MHz mode(1) 100 kHz mode 400 kHz mode Data Input Setup Time 1 MHz mode(1) 100 kHz mode 400 kHz mode — 250 100 300 — — ns ns ns — Data Input Hold Time 1 MHz mode(1) 100 kHz mode 400 kHz mode 100 0 0 — — 0.9 ns ns μs — Start Condition Setup Time 1 MHz mode(1) 100 kHz mode 400 kHz mode 0 4.7 0.6 0.3 — — μs μs μs 0.25 4.0 0.6 0.25 4.7 0.6 0.6 4000 600 250 0 0 — — — — — — — — — 3500 1000 μs μs μs μs μs μs μs ns ns ns ns ns 0 4.7 1.3 350 — — ns μs μs IS25 IS26 IS30 TSU:DAT THD:DAT TSU:STA IS31 THD:STA IS33 TSU:STO IS34 THD:STO IS40 TAA:SCL IS45 TBF:SDA 1 MHz mode(1) Start Condition 100 kHz mode Hold Time 400 kHz mode 1 MHz mode(1) Stop Condition 100 kHz mode Setup Time 400 kHz mode 1 MHz mode(1) Stop Condition 100 kHz mode Hold Time 400 kHz mode 1 MHz mode(1) Output Valid From 100 kHz mode Clock 400 kHz mode Bus Free Time 1 MHz mode(1) 100 kHz mode 400 kHz mode 1 MHz mode(1) IS50 Note 1: 0.5 — μs Bus Capacitive — 400 pF Loading Maximum pin capacitance = 10 pF for all I2C™ pins (for 1 MHz mode only). CB © 2006 Microchip Technology Inc. CB is specified to be from 10 to 400 pF Only relevant for repeated Start condition After this period the first clock pulse is generated — — — Time the bus must be free before a new transmission can start — DS70118G-page 179 dsPIC30F2010 TABLE 22-38: 10-BIT HIGH-SPEED A/D MODULE SPECIFICATIONS Standard Operating Conditions: 2.7V to 5.5V (unless otherwise stated) Operating temperature -40°C ≤ TA ≤ +85°C for Industrial -40°C ≤ TA ≤ +125°C for Extended AC CHARACTERISTICS Param No. Symbol Characteristic Min. Typ Max. Units Conditions Greater of VDD - 0.3 or 2.7 Lesser of VDD + 0.3 or 5.5 V — Vss - 0.3 VSS + 0.3 V — Device Supply AD01 AVDD Module VDD Supply AD02 AVSS Module VSS Supply Reference Inputs AD05 VREFH Reference Voltage High AVss+2.7 AVDD V — AD06 VREFL Reference Voltage Low AVss AVDD - 2.7 V — AD07 VREF Absolute Reference Voltage AD08 IREF Current Drain AD10 VINH-VINL Full-Scale Input Span AD11 VIN Absolute Input Voltage AVDD + 0.3 V — AD12 — Leakage Current — ±0.001 ±0.244 μA VINL = AVSS = VREFL = 0V, AVDD = VREFH = 5V Source Impedance = 5 kΩ AD13 — Leakage Current — ±0.001 ±0.244 μA VINL = AVSS = VREFL = 0V, AVDD = VREFH = 3V Source Impedance = 5 kΩ AD17 RIN Recommended Impedance Of Analog Voltage Source — 5K Ω — AD20 Nr Resolution bits — AVss - 0.3 — AVDD + 0.3 V — 300 3 μA μA A/D operating A/D off VREFH V — 200 .001 Analog Input VREFL AVSS - 0.3 DC Accuracy 10 data bits Nonlinearity(3) — ±1 ±1 LSb VINL = AVSS = VREFL = 0V, AVDD = VREFH = 5V AD21A INL Integral Nonlinearity(3) — ±1 ±1 LSb VINL = AVSS = VREFL = 0V, AVDD = VREFH = 3V AD22 DNL Differential Nonlinearity(3) — ±1 ±1 LSb VINL = AVSS = VREFL = 0V, AVDD = VREFH = 5V AD22A DNL Differential Nonlinearity(3) — ±1 ±1 LSb VINL = AVSS = VREFL = 0V, AVDD = VREFH = 3V AD23 GERR Gain Error(3) +1 ±5 ±6 LSb VINL = AVSS = VREFL = 0V, AVDD = VREFH = 5V AD23A GERR Gain Error(3) +1 ±5 ±6 LSb VINL = AVSS = VREFL = 0V, AVDD = VREFH = 3V AD21 INL Note 1: 2: 3: Integral Because the sample caps will eventually lose charge, clock rates below 10 kHz can affect linearity performance, especially at elevated temperatures. The A/D conversion result never decreases with an increase in the input voltage, and has no missing codes. Measurements were taken with external VREF+ and VREF- used as the ADC voltage references. DS70118G-page 180 © 2006 Microchip Technology Inc. dsPIC30F2010 TABLE 22-38: 10-BIT HIGH-SPEED A/D MODULE SPECIFICATIONS (CONTINUED) Standard Operating Conditions: 2.7V to 5.5V (unless otherwise stated) Operating temperature -40°C ≤ TA ≤ +85°C for Industrial -40°C ≤ TA ≤ +125°C for Extended AC CHARACTERISTICS Param No. AD24 Symbol Characteristic Min. Typ Max. Units Conditions EOFF Offset Error ±1 ±2 ±3 LSb VINL = AVSS = VREFL = 0V, AVDD = VREFH = 5V AD24A EOFF Offset Error ±1 ±2 ±3 LSb VINL = AVSS = VREFL = 0V, AVDD = VREFH = 3V AD25 — Monotonicity(2) — — — — AD30 THD Total Harmonic Distortion — -64 -67 dB — AD31 SINAD Signal to Noise and Distortion — 57 58 dB — AD32 SFDR Spurious Free Dynamic Range — 67 71 dB — AD33 FNYQ Input Signal Bandwidth — — 500 kHz — AD34 ENOB Effective Number of Bits 9.29 9.41 — bits — Guaranteed Dynamic Performance Note 1: 2: 3: Because the sample caps will eventually lose charge, clock rates below 10 kHz can affect linearity performance, especially at elevated temperatures. The A/D conversion result never decreases with an increase in the input voltage, and has no missing codes. Measurements were taken with external VREF+ and VREF- used as the ADC voltage references. © 2006 Microchip Technology Inc. DS70118G-page 181 dsPIC30F2010 FIGURE 22-24: 10-BIT HIGH-SPEED A/D CONVERSION TIMING CHARACTERISTICS (CHPS = 01, SIMSAM = 0, ASAM = 0, SSRC = 000) AD50 ADCLK Instruction Execution SET SAMP CLEAR SAMP SAMP ch0_dischrg ch0_samp ch1_dischrg ch1_samp eoc AD61 AD60 AD55 TSAMP AD55 DONE ADIF ADRES(0) ADRES(1) 1 2 3 4 5 6 7 8 5 6 7 8 1 – Software sets ADCON. SAMP to start sampling. 2 – Sampling starts after discharge period TSAMP is described in Section 18.7. 3 – Software clears ADCON. SAMP to start conversion. 4 – Sampling ends, conversion sequence starts. 5 – Convert bit 9. 6 – Convert bit 8. 7 – Convert bit 0. 8 – One TAD for end of conversion. DS70118G-page 182 © 2006 Microchip Technology Inc. dsPIC30F2010 FIGURE 22-25: 10-BIT HIGH-SPEED A/D CONVERSION TIMING CHARACTERISTICS (CHPS = 01, SIMSAM = 0, ASAM = 1, SSRC = 111, SAMC = 00001) AD50 ADCLK Instruction Execution SET ADON SAMP ch0_dischrg ch0_samp ch1_dischrg ch1_samp eoc TSAMP TSAMP AD55 TCONV AD55 DONE ADIF ADRES(0) ADRES(1) 1 2 3 4 5 6 7 3 4 5 6 8 3 1 – Software sets ADCON. ADON to start AD operation. 5 – Convert bit 0. 2 – Sampling starts after discharge period. TSAMP is described in the “dsPIC30F Family Reference Manual” (DS70046), Section 17. 6 – One TAD for end of conversion. 3 – Convert bit 9. 8 – Sample for time specified by SAMC. TSAMP is described in Section 18.7. 4 – Convert bit 8. © 2006 Microchip Technology Inc. 4 7 – Begin conversion of next channel DS70118G-page 183 dsPIC30F2010 TABLE 22-39: 10-BIT HIGH-SPEED A/D CONVERSION TIMING REQUIREMENTS Standard Operating Conditions: 2.7V to 5.5V (unless otherwise stated) Operating temperature -40°C ≤ TA ≤ +85°C for Industrial -40°C ≤ TA ≤ +125°C for Extended AC CHARACTERISTICS Param Symbol No. Characteristic Min. Typ Max. Units Conditions Clock Parameters AD50 TAD A/D Clock Period AD51 tRC A/D Internal RC Oscillator Period — 84 — ns 700 900 1100 ns See Table 18-1(1) — Conversion Rate AD55 tCONV Conversion Time — 12 TAD — — AD56 FCNV Throughput Rate — 1.0 — Msps See Table 18-1(1) — AD57 TSAMP Sample Time — 1 TAD — — See Table 18-1(1) Timing Parameters AD60 tPCS Conversion Start from Sample Trigger AD61 tPSS AD62 AD63 Note 1: — 1.0 TAD — ns — Sample Start from Setting Sample (SAMP) Bit 0.5 TAD — 1.5 TAD ns — tCSS Conversion Completion to Sample Start (ASAM = 1) — 0.5 TAD — ns — tDPU Time to Stabilize Analog Stage from A/D Off to A/D On — 20 — μs — Because the sample caps will eventually lose charge, clock rates below 10 kHz can affect linearity performance, especially at elevated temperatures. DS70118G-page 184 © 2006 Microchip Technology Inc. dsPIC30F2010 23.0 PACKAGING INFORMATION 23.1 Package Marking Information 28-Lead QFN-S Example XXXXXXXX XXXXXXXX YYWWNNN dsPIC30F2010 -30I/MM e3 060700U 28-Lead SPDIP (Skinny DIP) Example dsPIC30F2010-30I/SP 0648017 e3 XXXXXXXXXXXXXXXXX XXXXXXXXXXXXXXXXX YYWWNNN Example 28-Lead SOIC (.300”) XXXXXXXXXXXXXXXXXXXX XXXXXXXXXXXXXXXXXXXX XXXXXXXXXXXXXXXXXXXX YYWWNNN Legend: XX...X Y YY WW NNN e3 * Note: dsPIC30F2010-30I/SO 0648017 e3 Customer-specific information Year code (last digit of calendar year) Year code (last 2 digits of calendar year) Week code (week of January 1 is week ‘01’) Alphanumeric traceability code Pb-free JEDEC designator for Matte Tin (Sn) This package is Pb-free. The Pb-free JEDEC designator ( e3 ) can be found on the outer packaging for this package. In the event the full Microchip part number cannot be marked on one line, it will be carried over to the next line, thus limiting the number of available characters for customer-specific information. © 2006 Microchip Technology Inc. DS70118G-page 185 dsPIC30F2010 28-Lead Plastic Quad Flat, No Lead Package (MM) - 6x6x0.9 mm Body [QFN-S] With 0.40 mm Contact Length Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging D D2 EXPOSED PAD e E2 E b 2 2 1 1 K N N L NOTE 1 TOP VIEW BOTTOM VIEW A A3 A1 Units Dimension Limits Number of Pins N Pitch e Overall Height A Standoff A1 Contact Thickness A3 Overall Width E Exposed Pad Width E2 Overall Length D Exposed Pad Length D2 Contact Width b Contact Length § L Contact-to-Exposed Pad § K MIN 0.80 0.00 3.65 3.65 0.23 0.30 0.20 MILLIMETERS NOM 28 0.65 BSC 0.90 0.02 0.20 REF 6.00 BSC 3.70 6.00 BSC 3.70 0.38 0.40 — MAX 1.00 0.05 4.70 4.70 0.43 0.50 — Notes: 1. Pin 1 visual index feature may vary, but must be located within the hatched area. 2. § Significant Characteristic 3. Package is saw singulated 4. Dimensioning and tolerancing per ASME Y14.5M BSC: Basic Dimension. Theoretically exact value shown without tolerances. REF: Reference Dimension, usually without tolerance, for information purposes only. Microchip Technology Drawing No. C04–124, Sept. 8, 2006 DS70118G-page 186 © 2006 Microchip Technology Inc. dsPIC30F2010 28-Lead Skinny Plastic Dual In-line (SP) – 300 mil Body (PDIP) Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging E1 D 2 n 1 α E A2 A L c β B1 A1 eB Units Number of Pins Pitch p B Dimension Limits n p INCHES* MIN NOM MILLIMETERS MAX MIN 28 NOM MAX 28 .100 2.54 Top to Seating Plane A .140 .150 .160 3.56 3.81 4.06 Molded Package Thickness A2 .125 .130 .135 3.18 3.30 3.43 Base to Seating Plane A1 .015 8.26 0.38 Shoulder to Shoulder Width E .300 .310 .325 7.62 7.87 Molded Package Width E1 .275 .285 .295 6.99 7.24 7.49 Overall Length D 1.345 1.365 1.385 34.16 34.67 35.18 Tip to Seating Plane L c .125 .130 .135 3.18 3.30 3.43 .008 .012 .015 0.20 0.29 0.38 Upper Lead Width B1 .040 .053 .065 1.02 1.33 1.65 Lower Lead Width B .016 .019 .022 0.41 0.48 0.56 eB α .320 .350 .430 8.13 8.89 10.92 Lead Thickness Overall Row Spacing Mold Draft Angle Top § 5 10 15 5 10 15 β Mold Draft Angle Bottom 5 10 15 5 10 15 * Controlling Parameter § Significant Characteristic Notes: Dimension D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .010” (0.254mm) per side. JEDEC Equivalent: MO-095 Drawing No. C04-070 © 2006 Microchip Technology Inc. DS70118G-page 187 dsPIC30F2010 28-Lead Plastic Small Outline (SO) – Wide, 300 mil Body (SOIC) Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging E E1 p D B 2 1 n h α 45° c A2 A φ β L Units Dimension Limits n p A1 INCHES* NOM 28 .050 .099 .091 .008 .407 .295 .704 .020 .033 4 .011 .017 12 12 MAX MILLIMETERS NOM 28 1.27 2.36 2.50 2.24 2.31 0.10 0.20 10.01 10.34 7.32 7.49 17.65 17.87 0.25 0.50 0.41 0.84 0 4 0.23 0.28 0.36 0.42 0 12 0 12 MAX Number of Pins Pitch Overall Height A .093 .104 2.64 Molded Package Thickness A2 .088 .094 2.39 Standoff § A1 .004 .012 0.30 Overall Width E .394 .420 10.67 Molded Package Width E1 .288 .299 7.59 Overall Length D .695 .712 18.08 Chamfer Distance h .010 .029 0.74 Foot Length L .016 .050 1.27 φ Foot Angle Top 0 8 8 c Lead Thickness .009 .013 0.33 Lead Width B .014 .020 0.51 α Mold Draft Angle Top 0 15 15 β Mold Draft Angle Bottom 0 15 15 * Controlling Parameter § Significant Characteristic Notes: Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .010” (0.254mm) per side. JEDEC Equivalent: MS-013 Drawing No. C04-052 DS70118G-page 188 MIN MIN © 2006 Microchip Technology Inc. dsPIC30F2010 APPENDIX A: REVISION HISTORY Revision F (May 2006) Previous versions of this data sheet contained Advance or Preliminary Information. They were distributed with incomplete characterization data. This revision reflects these updates: • Supported I2C Slave addresses (see Table 16-1) • 10-bit A/D High-speed Conversion timing requirements (see Section 18.0 “10-bit High-Speed Analog-to-Digital Converter (ADC) Module” • Operating Current (IDD) specifications (see Table 22-5) • Idle Current (IIDLE) specifications (see Table 22-6) • Power-down Current (IPD) specifications (see Table 22-7) • I/O pin Input specifications (see Table 22-8) • BOR voltage limits (see Table 22-10) • PLL Clock Timing specifications (see Table 22-14) • PLL Jitter specifications (see Table 22-15 ) • Internal RC Accuracy specifications (see Table 22-17) • Watchdog Timer time-out limits (see Table 22-20) • Additional minor corrections throughout document. Revision G (December 2006) This revision includes updates to the packaging diagrams. © 2006 Microchip Technology Inc. DS70118G-page 189 dsPIC30F2010 NOTES: DS70118G-page 190 © 2006 Microchip Technology Inc. dsPIC30F2010 INDEX A A/D .................................................................................... 111 1 Msps Configuration Guideline................................ 115 600 ksps Configuration Guideline ............................. 116 750 ksps Configuration Guideline ............................. 116 Conversion Rate Parameters.................................... 114 Conversion Speeds................................................... 114 Selecting the Conversion Clock ................................ 113 Voltage Reference Schematic .................................. 115 AC Characteristics ............................................................ 157 Load Conditions ........................................................ 157 AC Temperature and Voltage Specifications .................... 157 Address Generator Units .................................................... 31 Alternate 16-bit Timer/Counter............................................ 77 Alternate Vector Table ........................................................ 41 Assembler MPASM Assembler................................................... 146 Automatic Clock Stretch...................................................... 98 During 10-bit Addressing (STREN = 1)....................... 98 During 7-bit Addressing (STREN = 1)......................... 98 Receive Mode ............................................................. 98 Transmit Mode ............................................................ 98 B Band Gap Start-up Time Requirements............................................................ 164 Timing Characteristics .............................................. 164 Barrel Shifter ....................................................................... 17 Bit-Reversed Addressing .................................................... 35 Example ...................................................................... 35 Implementation ........................................................... 35 Modifier Values (Table)............................................... 36 Sequence Table (16-Entry)......................................... 36 Block Diagram PWM ........................................................................... 82 Block Diagrams 10-bit High Speed ADC Functional ........................... 111 16-bit Timer1 Module .................................................. 58 DSP Engine ................................................................ 14 dsPIC30F2010 .............................................................. 6 External Power-on Reset Circuit............................... 131 I2C............................................................................... 96 Input Capture Mode .................................................... 67 Oscillator System ...................................................... 125 Output Compare Mode ............................................... 71 Quadrature Encoder Interface .................................... 75 Reset System............................................................ 129 Shared Port Structure ................................................. 53 SPI .............................................................................. 92 SPI Master/Slave Connection ..................................... 92 UART Receiver ......................................................... 104 UART Transmitter ..................................................... 103 BOR Characteristics ......................................................... 156 BOR. See Brown-out Reset Brown-out Reset Characteristics .......................................................... 155 Timing Requirements................................................ 163 Brown-out Reset (BOR) .................................................... 123 © 2006 Microchip Technology Inc. C C Compilers MPLAB C18.............................................................. 146 MPLAB C30.............................................................. 146 Center-Aligned PWM .......................................................... 85 CLKO and I/O Timing Characteristics.......................................................... 161 Requirements ........................................................... 161 Code Examples Data EEPROM Block Erase ....................................... 50 Data EEPROM Block Write ........................................ 52 Data EEPROM Read.................................................. 49 Data EEPROM Word Erase ....................................... 50 Data EEPROM Word Write ........................................ 51 Erasing a Row of Program Memory ........................... 45 Initiating a Programming Sequence ........................... 46 Loading Write Latches ................................................ 46 Code Protection ................................................................ 123 Complementary PWM Operation........................................ 86 Configuring Analog Port Pins.............................................. 54 Control Registers ................................................................ 44 NVMADR .................................................................... 44 NVMADRU ................................................................. 44 NVMCON.................................................................... 44 NVMKEY .................................................................... 44 Core Architecture Overview....................................................................... 9 Core Register Map.............................................................. 27 Customer Change Notification Service............................. 199 Customer Notification Service .......................................... 199 Customer Support............................................................. 199 D Data Access from Program Memory Using Program Space Visibility............................................. 22 Data Accumulators and Adder................................ 15, 16, 17 Data Address Space........................................................... 23 Access RAM ............................................................... 27 Alignment.................................................................... 26 Alignment (Figure) ...................................................... 26 MCU and DSP (MAC Class) Instructions ................... 25 Memory Map......................................................... 23, 24 Spaces........................................................................ 26 Width .......................................................................... 26 Data EEPROM Memory...................................................... 49 Erasing ....................................................................... 50 Erasing, Block............................................................. 50 Erasing, Word............................................................. 50 Protection Against Spurious Write.............................. 52 Reading ...................................................................... 49 Write Verify ................................................................. 52 Writing ........................................................................ 51 Writing, Block.............................................................. 52 Writing, Word.............................................................. 51 DC Characteristics............................................................ 149 BOR.......................................................................... 156 Brown-out Reset....................................................... 155 I/O Pin Input Specifications ...................................... 153 I/O Pin Output Specifications.................................... 155 Idle Current (IIDLE) .................................................... 152 Operating Current (IDD) ............................................ 151 Power-Down Current (IPD)........................................ 153 Program and EEPROM ............................................ 156 Temperature and Voltage Specifications.................. 149 DS70118G-page 191 dsPIC30F2010 Dead-Time Generators ....................................................... 86 Ranges........................................................................ 86 Development Support ....................................................... 145 Device Configuration Register Map............................................................. 135 Device Configuration Registers......................................... 134 FBORPOR ................................................................ 134 FGS........................................................................... 134 FOSC ........................................................................ 134 FWDT........................................................................ 134 Device Overview ................................................................... 5 Divide Support..................................................................... 12 DSP Engine......................................................................... 13 Multiplier...................................................................... 15 Dual Output Compare Match Mode .................................... 72 Continuous Pulse Mode .............................................. 72 Single Pulse Mode ...................................................... 72 E Edge-Aligned PWM............................................................. 85 Electrical Characteristics................................................... 149 AC ............................................................................. 157 DC ............................................................................. 149 Equations A/D Conversion Clock ............................................... 113 Baud Rate ................................................................. 107 PWM Period ................................................................ 84 PWM Period (Up/Down Count Mode) ......................... 84 PWM Resolution ......................................................... 84 Serial Clock Rate ...................................................... 100 Errata .................................................................................... 4 Exception Sequence Trap Sources .............................................................. 39 External Clock Timing Characteristics Type A and B Timer .................................................. 165 External Clock Timing Requirements................................ 158 Type A Timer ............................................................ 165 Type B Timer ............................................................ 166 Type C Timer ............................................................ 166 External Interrupt Requests ................................................ 41 F Fast Context Saving............................................................ 41 Firmware Instructions........................................................ 137 Flash Program Memory....................................................... 43 In-Circuit Serial Programming (ICSP) ......................... 43 Run-Time Self-Programming (RTSP) ......................... 43 Table Instruction Operation Summary ........................ 43 I I/O Pin Specifications Input .......................................................................... 153 Output ....................................................................... 155 I/O Ports .............................................................................. 53 Parallel I/O (PIO)......................................................... 53 I2C ....................................................................................... 95 I2C 10-bit Slave Mode Operation ........................................ 97 Reception .................................................................... 98 Transmission............................................................... 98 I2C 7-bit Slave Mode Operation .......................................... 97 Reception .................................................................... 97 Transmission............................................................... 97 DS70118G-page 192 I2C Master Mode Baud Rate Generator ............................................... 100 Clock Arbitration ....................................................... 100 Multi-Master Communication, Bus Collision and Bus Arbitration .................................................. 100 Reception ................................................................. 100 Transmission ............................................................ 100 I2C Module Addresses................................................................... 97 Bus Data Timing Characteristics Master Mode..................................................... 178 Slave Mode....................................................... 180 Bus Data Timing Requirements Master Mode..................................................... 179 Slave Mode....................................................... 181 Bus Start/Stop Bits Timing Characteristics Master Mode..................................................... 178 Slave Mode....................................................... 180 General Call Address Support .................................... 99 Interrupts .................................................................... 99 IPMI Support............................................................... 99 Master Operation ........................................................ 99 Master Support ........................................................... 99 Operating Function Description .................................. 95 Operation During CPU Sleep and Idle Modes .......... 101 Pin Configuration ........................................................ 95 Programmer’s Model .................................................. 95 Register Map ............................................................ 102 Registers .................................................................... 95 Slope Control .............................................................. 99 Software Controlled Clock Stretching (STREN = 1) ... 99 Various Modes............................................................ 95 Idle Current (IIDLE) ............................................................ 152 In-Circuit Serial Programming (ICSP)............................... 123 Independent PWM Output .................................................. 87 Initialization Condition for RCON Register Case 1 ........... 132 Initialization Condition for RCON Register Case 2 ........... 132 Initialization Condition for RCON Register, Case 1 .......... 132 Input Capture (CAPx) Timing Characteristics................... 168 Input Capture Interrupts...................................................... 69 Register Map .............................................................. 70 Input Capture Module ......................................................... 67 In CPU Sleep Mode .................................................... 69 Simple Capture Event Mode....................................... 68 Input Capture Timing Requirements................................. 168 Input Change Notification Module....................................... 54 Register Map (bits 15-0) ............................................. 55 Input Characteristics QEA/QEB ................................................................. 171 Instruction Addressing Modes ............................................ 31 File Register Instructions ............................................ 31 Fundamental Modes Supported ................................. 31 MAC Instructions ........................................................ 32 MCU Instructions ........................................................ 32 Move and Accumulator Instructions............................ 32 Other Instructions ....................................................... 32 Instruction Set................................................................... 137 Inter-Integrated Circuit. See I2C Internal Clock Timing Examples ....................................... 160 Internet Address ............................................................... 199 © 2006 Microchip Technology Inc. dsPIC30F2010 Interrupt Controller Register Map............................................................... 42 Interrupt Priority .................................................................. 38 Traps........................................................................... 39 Interrupt Sequence ............................................................. 41 Interrupt Stack Frame ................................................. 41 Interrupts ............................................................................. 37 L Load Conditions ................................................................ 157 M Memory Organization.......................................................... 19 Microchip Internet Web Site .............................................. 199 Modulo Addressing ............................................................. 33 Applicability ................................................................. 35 Operation Example ..................................................... 34 Start and End Address................................................ 33 W Address Register Selection .................................... 33 Motor Control PWM Module................................................ 81 Fault Timing Characteristics ..................................... 170 Timing Characteristics .............................................. 170 Timing Requirements................................................ 170 MPLAB ASM30 Assembler, Linker, Librarian ................... 146 MPLAB ICD 2 In-Circuit Debugger ................................... 147 MPLAB ICE 2000 High-Performance Universal In-Circuit Emulator .................................................... 147 MPLAB ICE 4000 High-Performance Universal In-Circuit Emulator .................................................... 147 MPLAB Integrated Development Environment Software .. 145 MPLAB PM3 Device Programmer .................................... 147 MPLINK Object Linker/MPLIB Object Librarian ................ 146 O OC/PWM Module Timing Characteristics.......................... 169 Operating Current (IDD)..................................................... 151 Operating MIPS vs Voltage dsPIC30F2010 .......................................................... 149 Oscillator Configurations Fast RC (FRC) .................................................. 127 Low Power RC (LPRC) ..................................... 127 Phase Locked Loop (PLL) ................................ 127 Oscillator Configurations ................................................... 126 Fail-Safe Clock Monitor............................................. 128 Initial Clock Source Selection ................................... 126 LP Oscillator Control ................................................. 127 Start-up Timer (OST) ................................................ 126 Oscillator Operating Modes Table .................................... 124 Oscillator Selection ........................................................... 123 Oscillator Start-up Timer Timing Characteristics .............................................. 162 Timing Requirements................................................ 163 Output Compare Interrupts ................................................. 73 Output Compare Mode Register Map............................................................... 74 Output Compare Module..................................................... 71 Timing Characteristics .............................................. 168 Timing Requirements................................................ 168 Output Compare Operation During CPU Idle Mode............ 73 Output Compare Sleep Mode Operation ............................ 73 © 2006 Microchip Technology Inc. P Packaging Information ...................................................... 187 Marking..................................................................... 187 PICSTART Plus Development Programmer..................... 148 Pinout Descriptions............................................................... 7 PLL Clock Timing Specifications ...................................... 159 POR. See Power-on Reset Port Register Map............................................................... 55 Port Write/Read Example ................................................... 54 PORTB Register Map .............................................................. 55 PORTC Register Map .............................................................. 55 PORTD Register Map .............................................................. 55 PORTE Register Map .............................................................. 55 PORTF Register Map .............................................................. 55 Position Measurement Mode .............................................. 77 Power-Down Current (IPD)................................................ 153 Power-on Reset (POR)..................................................... 123 Oscillator Start-up Timer (OST)................................ 123 Power-up Timer (PWRT) .......................................... 123 Power-Saving Modes........................................................ 133 Idle............................................................................ 134 Sleep ........................................................................ 133 Power-Saving Modes (Sleep and Idle) ............................. 123 Power-up Timer Timing Characteristics .............................................. 162 Timing Requirements ............................................... 163 Product Identification System ........................................... 201 Program Address Space..................................................... 19 Construction ............................................................... 20 Data Access from Program Memory Using Table Instructions ............................................... 21 Data Access From, Address Generation .................... 20 Memory Map............................................................... 19 Table Instructions TBLRDH ............................................................. 21 TBLRDL.............................................................. 21 TBLWTH............................................................. 21 TBLWTL ............................................................. 21 Program and EEPROM Characteristics............................ 156 Program Counter ................................................................ 10 Program Data Table Access............................................... 22 Program Space Visibility Window into Program Space Operation ..................... 23 Programmable .................................................................. 123 Programmable Digital Noise Filters .................................... 77 Programmer’s Model .......................................................... 10 Diagram ...................................................................... 11 Programming Operations.................................................... 45 Algorithm for Program Flash....................................... 45 Erasing a Row of Program Memory ........................... 45 Initiating the Programming Sequence ........................ 46 Loading Write Latches ................................................ 46 Programming, Device Instructions.................................... 137 Protection Against Accidental Writes to OSCCON ........... 128 DS70118G-page 193 dsPIC30F2010 PWM Register Map............................................................... 90 PWM Duty Cycle Comparison Units ................................... 85 Duty Cycle Register Buffers ........................................ 86 PWM FLTA Pins.................................................................. 88 Enable Bits .................................................................. 88 Fault States ................................................................. 88 Modes ......................................................................... 88 Cycle-by-Cycle.................................................... 88 Latched ............................................................... 88 PWM Operation During CPU Idle Mode.............................. 89 PWM Operation During CPU Sleep Mode .......................... 89 PWM Output and Polarity Control ....................................... 88 Output Pin Control ...................................................... 88 PWM Output Override......................................................... 87 Complementary Output Mode ..................................... 87 Synchronization .......................................................... 87 PWM Period ........................................................................ 84 PWM Special Event Trigger ................................................ 89 Postscaler ................................................................... 89 PWM Time Base ................................................................. 83 Continuous Up/Down Counting Modes ....................... 83 Double Update Mode .................................................. 84 Free Running Mode .................................................... 83 Postscaler ................................................................... 84 Prescaler ..................................................................... 84 Single-Shot Mode ....................................................... 83 PWM Update Lockout ......................................................... 88 Q QEA/QEB Input Characteristics ........................................ 171 QEI Module External Clock Timing Requirements........................ 167 Index Pulse Timing Characteristics........................... 172 Index Pulse Timing Requirements ............................ 172 Operation During CPU Idle Mode ............................... 78 Operation During CPU Sleep Mode ............................ 77 Register Map............................................................... 79 Timer Operation During CPU Idle Mode ..................... 78 Timer Operation During CPU Sleep Mode.................. 77 Quadrature Decoder Timing Requirements ...................... 171 Quadrature Encoder Interface (QEI) Module ...................... 75 Quadrature Encoder Interface Interrupts ............................ 78 Quadrature Encoder Interface Logic ................................... 76 R Reader Response ............................................................. 200 Reset......................................................................... 123, 129 Reset Sequence.................................................................. 39 Reset Sources ............................................................ 39 Reset Timing Characteristics ............................................ 162 Reset Timing Requirements.............................................. 163 Resets BOR, Programmable................................................. 131 POR .......................................................................... 129 Operating without FSCM and PWRT ................ 131 POR with Long Crystal Start-up Time ....................... 131 RTSP Operation.................................................................. 44 DS70118G-page 194 S Sales and Support ............................................................ 201 Serial Peripheral Interface. See SPI Simple Capture Event Mode Capture Buffer Operation............................................ 68 Capture Prescaler....................................................... 68 Hall Sensor Mode ....................................................... 68 Input Capture in CPU Idle Mode................................. 69 Timer2 and Timer3 Selection Mode............................ 68 Simple OC/PWM Mode Timing Requirements ................. 169 Simple Output Compare Match Mode ................................ 72 Simple PWM Mode ............................................................. 72 Input Pin Fault Protection ........................................... 72 Period ......................................................................... 73 Single Pulse PWM Operation ............................................. 87 Software Simulator (MPLAB SIM) .................................... 146 Software Stack Pointer, Frame Pointer .............................. 10 CALL Stack Frame ..................................................... 27 SPI ...................................................................................... 91 SPI Mode Slave Select Synchronization ..................................... 93 SPI1 Register Map...................................................... 94 SPI Module ......................................................................... 91 Framed SPI Support ................................................... 91 Operating Function Description .................................. 91 SDOx Disable ............................................................. 91 Timing Characteristics Master Mode (CKE = 0).................................... 173 Master Mode (CKE = 1).................................... 174 Slave Mode (CKE = 1).............................. 175, 176 Timing Requirements Master Mode (CKE = 0).................................... 173 Master Mode (CKE = 1).................................... 174 Slave Mode (CKE = 0)...................................... 175 Slave Mode (CKE = 1)...................................... 177 Word and Byte Communication .................................. 91 SPI Operation During CPU Idle Mode ................................ 93 SPI Operation During CPU Sleep Mode............................. 93 STATUS Register ............................................................... 10 Subtracter ........................................................................... 15 Data Space Write Saturation ...................................... 17 Overflow and Saturation ............................................. 15 Round Logic ............................................................... 16 Write Back .................................................................. 16 Symbols used in Opcode Descriptions ............................. 138 System Integration............................................................ 123 Overview................................................................... 123 Register Map ............................................................ 135 T Temperature and Voltage Specifications AC............................................................................. 157 DC ............................................................................ 149 Timer1 Module.................................................................... 57 16-bit Asynchronous Counter Mode ........................... 57 16-bit Synchronous Counter Mode ............................. 57 16-bit Timer Mode....................................................... 57 Gate Operation ........................................................... 58 Interrupt ...................................................................... 59 Operation During Sleep Mode .................................... 58 Prescaler .................................................................... 58 Real-Time Clock ......................................................... 59 RTC Interrupts .................................................... 59 RTC Oscillator Operation ................................... 59 Register Map .............................................................. 60 © 2006 Microchip Technology Inc. dsPIC30F2010 Timer2 and Timer3 Selection Mode .................................... 72 Timer2/3 Module ................................................................. 61 32-bit Synchronous Counter Mode ............................. 61 32-bit Timer Mode....................................................... 61 ADC Event Trigger...................................................... 64 Gate Operation ........................................................... 64 Interrupt....................................................................... 64 Operation During Sleep Mode .................................... 64 Register Map............................................................... 65 Timer Prescaler........................................................... 64 TimerQ (QEI Module) External Clock Timing Characteristics .......................................................... 167 Timing Characteristics A/D Conversion 10-Bit High-speed (CHPS = 01, SIMSAM = 0, ASAM = 0, SSRC = 000) .......................... 184 10-bit High-speed (CHPS = 01, SIMSAM = 0, ASAM = 1, SSRC = 111, SAMC = 00001) 185 Band Gap Start-up Time ........................................... 164 CLKO and I/O ........................................................... 161 External Clock........................................................... 157 I2C Bus Data Master Mode ..................................................... 178 Slave Mode ....................................................... 180 I2C Bus Start/Stop Bits Master Mode ..................................................... 178 Slave Mode ....................................................... 180 Input Capture (CAPx)................................................ 168 Motor Control PWM Module...................................... 170 Motor Control PWM Module Falult............................ 170 OC/PWM Module ...................................................... 169 Oscillator Start-up Timer ........................................... 162 Output Compare Module........................................... 168 Power-up Timer ........................................................ 162 QEI Module Index Pulse ........................................... 172 Reset......................................................................... 162 SPI Module Master Mode (CKE = 0) .................................... 173 Master Mode (CKE = 1) .................................... 174 Slave Mode (CKE = 0) ...................................... 175 Slave Mode (CKE = 1) ...................................... 176 TimerQ (QEI Module) External Clock ....................... 167 Type A and B Timer External Clock.......................... 165 Watchdog Timer........................................................ 162 Timing Diagrams Center-Aligned PWM .................................................. 85 Dead-Time .................................................................. 87 Edge-Aligned PWM..................................................... 85 PWM Output ............................................................... 73 Time-out Sequence on Power-up (MCLR Not Tied to VDD), Case 1 .................................. 130 Time-out Sequence on Power-up (MCLR Not Tied to VDD), Case 2 .................................. 130 Time-out Sequence on Power-up (MCLR Tied to VDD) ...................................................... 130 Timing Diagrams and Specifications DC Characteristics - Internal RC Accuracy............... 160 Timing Diagrams.See Timing Characteristics © 2006 Microchip Technology Inc. Timing Requirements A/D Conversion High-speed ....................................................... 186 Band Gap Start-up Time........................................... 164 Brown-out Reset....................................................... 163 CLKO and I/O ........................................................... 161 External Clock .......................................................... 158 I2C Bus Data (Master Mode) .................................... 179 I2C Bus Data (Slave Mode) ...................................... 181 Input Capture............................................................ 168 Motor Control PWM Module ..................................... 170 Oscillator Start-up Timer........................................... 163 Output Compare Module .......................................... 168 Power-up Timer ........................................................ 163 QEI Module External Clock .................................................. 167 Index Pulse....................................................... 172 Quadrature Decoder................................................. 171 Reset ........................................................................ 163 Simple OC/PWM Mode ............................................ 169 SPI Module Master Mode (CKE = 0).................................... 173 Master Mode (CKE = 1).................................... 174 Slave Mode (CKE = 0)...................................... 175 Slave Mode (CKE = 1)...................................... 177 Type A Timer External Clock .................................... 165 Type B Timer External Clock .................................... 166 Type C Timer External Clock.................................... 166 Watchdog Timer ....................................................... 163 Timing Specifications PLL Clock ................................................................. 159 U UART Address Detect Mode ............................................... 107 Auto Baud Support ................................................... 107 Baud Rate Generator ............................................... 107 Enabling and Setting Up UART ................................ 105 Alternate I/O ..................................................... 105 Disabling........................................................... 105 Enabling ........................................................... 105 Setting Up Data, Parity and Stop Bit Selections................................................. 105 Loopback Mode ........................................................ 107 Module Overview...................................................... 103 Operation During CPU Sleep and Idle Modes.......... 108 Receiving Data ......................................................... 106 In 8-bit or 9-bit Data Mode................................ 106 Interrupt ............................................................ 106 Receive Buffer (UxRXB)................................... 106 Reception Error Handling ......................................... 106 Framing Error (FERR) ...................................... 107 Idle Status ........................................................ 107 Parity Error (PERR) .......................................... 107 Receive Break .................................................. 107 Receive Buffer Overrun Error (OERR Bit) ........ 106 Transmitting Data ..................................................... 105 In 8-bit Data Mode ............................................ 105 In 9-bit Data Mode ............................................ 105 Interrupt ............................................................ 106 Transmit Buffer (UxTXB) .................................. 105 UART1 Register Map ............................................... 109 Unit ID Locations .............................................................. 123 Universal Asynchronous Receiver Transmitter. See UART. DS70118G-page 195 dsPIC30F2010 W Wake-up from Sleep ......................................................... 123 Wake-up from Sleep and Idle.............................................. 41 Watchdog Timer Timing Characteristics .............................................. 162 Timing Requirements ................................................ 163 Watchdog Timer (WDT) ............................................ 123, 133 Enabling and Disabling ............................................. 133 Operation .................................................................. 133 WWW Address.................................................................. 199 WWW, On-Line Support........................................................ 4 DS70118G-page 196 © 2006 Microchip Technology Inc. dsPIC30F2010 THE MICROCHIP WEB SITE CUSTOMER SUPPORT Microchip provides online support via our WWW site at www.microchip.com. This web site is used as a means to make files and information easily available to customers. Accessible by using your favorite Internet browser, the web site contains the following information: Users of Microchip products can receive assistance through several channels: • Product Support – Data sheets and errata, application notes and sample programs, design resources, user’s guides and hardware support documents, latest software releases and archived software • General Technical Support – Frequently Asked Questions (FAQ), technical support requests, online discussion groups, Microchip consultant program member listing • Business of Microchip – Product selector and ordering guides, latest Microchip press releases, listing of seminars and events, listings of Microchip sales offices, distributors and factory representatives • • • • • Distributor or Representative Local Sales Office Field Application Engineer (FAE) Technical Support Development Systems Information Line Customers should contact their distributor, representative or field application engineer (FAE) for support. Local sales offices are also available to help customers. A listing of sales offices and locations is included in the back of this document. Technical support is available through the web site at: http://support.microchip.com CUSTOMER CHANGE NOTIFICATION SERVICE Microchip’s customer notification service helps keep customers current on Microchip products. Subscribers will receive e-mail notification whenever there are changes, updates, revisions or errata related to a specified product family or development tool of interest. To register, access the Microchip web site at www.microchip.com, click on Customer Change Notification and follow the registration instructions. © 2006 Microchip Technology Inc. DS70118G-page 197 dsPIC30F2010 READER RESPONSE It is our intention to provide you with the best documentation possible to ensure successful use of your Microchip product. If you wish to provide your comments on organization, clarity, subject matter, and ways in which our documentation can better serve you, please FAX your comments to the Technical Publications Manager at (480) 792-4150. Please list the following information, and use this outline to provide us with your comments about this document. To: Technical Publications Manager RE: Reader Response Total Pages Sent ________ From: Name Company Address City / State / ZIP / Country Telephone: (_______) _________ - _________ FAX: (______) _________ - _________ Application (optional): Would you like a reply? Device: dsPIC30F2010 Y N Literature Number: DS70118G Questions: 1. What are the best features of this document? 2. How does this document meet your hardware and software development needs? 3. Do you find the organization of this document easy to follow? If not, why? 4. What additions to the document do you think would enhance the structure and subject? 5. What deletions from the document could be made without affecting the overall usefulness? 6. Is there any incorrect or misleading information (what and where)? 7. How would you improve this document? DS70118G-page 198 © 2006 Microchip Technology Inc. dsPIC30F2010 PRODUCT IDENTIFICATION SYSTEM To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office. d s P I C 3 0 F 2 0 1 0 AT - 3 0 E / S O - E S Custom ID (3 digits) or Engineering Sample (ES) Trademark Architecture Package SP = SPDIP SO = SOIC S = Die (Waffle Pack) W = Die (Wafers) Flash Memory Size in Bytes 0 = ROMless 1 = 1K to 6K 2 = 7K to 12K 3 = 13K to 24K 4 = 25K to 48K 5 = 49K to 96K 6 = 97K to 192K 7 = 193K to 384K 8 = 385K to 768K 9 = 769K and Up Temperature I = Industrial -40°C to +85°C E = Extended High Temp -40°C to +125°C Device ID Speed 20 = 20 MIPS 30 = 30 MIPS T = Tape and Reel A,B,C… = Revision Level Example: dsPIC30F2010AT-30E/SO = 30 MIPS, Extended temp., SOIC package, Rev. A © 2006 Microchip Technology Inc. DS70118G-page 199 WORLDWIDE SALES AND SERVICE AMERICAS ASIA/PACIFIC ASIA/PACIFIC EUROPE Corporate Office 2355 West Chandler Blvd. Chandler, AZ 85224-6199 Tel: 480-792-7200 Fax: 480-792-7277 Technical Support: http://support.microchip.com Web Address: www.microchip.com Asia Pacific Office Suites 3707-14, 37th Floor Tower 6, The Gateway Habour City, Kowloon Hong Kong Tel: 852-2401-1200 Fax: 852-2401-3431 India - Bangalore Tel: 91-80-4182-8400 Fax: 91-80-4182-8422 India - New Delhi Tel: 91-11-4160-8631 Fax: 91-11-4160-8632 Austria - Wels Tel: 43-7242-2244-39 Fax: 43-7242-2244-393 Denmark - Copenhagen Tel: 45-4450-2828 Fax: 45-4485-2829 India - Pune Tel: 91-20-2566-1512 Fax: 91-20-2566-1513 France - Paris Tel: 33-1-69-53-63-20 Fax: 33-1-69-30-90-79 Japan - Yokohama Tel: 81-45-471- 6166 Fax: 81-45-471-6122 Germany - Munich Tel: 49-89-627-144-0 Fax: 49-89-627-144-44 Atlanta Alpharetta, GA Tel: 770-640-0034 Fax: 770-640-0307 Boston Westborough, MA Tel: 774-760-0087 Fax: 774-760-0088 Chicago 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.......................................................................................................................................................................... 5 2.0 CPU Architecture Overview.......................................................................................................................................................... 9 3.0 Memory Organization ................................................................................................................................................................. 19 4.0 Address Generator Units............................................................................................................................................................ 31 5.0 Interrupts .................................................................................................................................................................................... 37 6.0 Flash Program Memory.............................................................................................................................................................. 43 7.0 Data EEPROM Memory ............................................................................................................................................................. 49 8.0 I/O Ports ..................................................................................................................................................................................... 53 9.0 Timer1 Module ........................................................................................................................................................................... 57 10.0 Timer2/3 Module ........................................................................................................................................................................ 61 11.0 Input Capture Module................................................................................................................................................................. 67 12.0 Output Compare Module ............................................................................................................................................................ 71 13.0 Quadrature Encoder Interface (QEI) Module ............................................................................................................................. 75 14.0 Motor Control PWM Module ....................................................................................................................................................... 81 15.0 SPI Module................................................................................................................................................................................. 91 16.0 I2C Module ................................................................................................................................................................................. 95 17.0 Universal Asynchronous Receiver Transmitter (UART) Module .............................................................................................. 103 18.0 10-bit High-Speed Analog-to-Digital Converter (ADC) Module ................................................................................................ 111 19.0 System Integration ................................................................................................................................................................... 123 20.0 Instruction Set Summary .......................................................................................................................................................... 137 21.0 Development Support............................................................................................................................................................... 145 22.0 Electrical Characteristics .......................................................................................................................................................... 149 23.0 Packaging Information.............................................................................................................................................................. 187 The Microchip Web Site ..................................................................................................................................................................... 199 Customer Change Notification Service .............................................................................................................................................. 199 Customer Support .............................................................................................................................................................................. 199 Reader Response .............................................................................................................................................................................. 200 Product Identification System ............................................................................................................................................................ 201 © 2006 Microchip Technology Inc. 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