IC554 Series Dual Inline Memory Module (DIMM, 72 pins) Specifications Part Number (Details) Insulation Resistance: Dielectric Withstanding Voltage: Contact Resistance: Operating Temperature Range: Mating Cycles: Pin Count: 1,000M W min. at 500V DC 700V AC for 1 minute 30m W max. at 10mA/20mV max. –55°C to +170°C 10,000 insertions min. 72 contact pins IC-554 - 1 - MF Series No. 1 = 72 Pins MF = Flanged Unmarked = Not Flanged Materials and Finish Housing: Polyetherimide (PEI), glass-filled Contacts: Beryllium Copper (BeCu) Plating: Gold over Nickel Features í Card thickness 1.00mm Outline Socket Dimensions Recommended PC Board Layout Top View from Socket 89.00 ±0.1 89.00 ±0.2 1.27x35=44.45 ±0.1 1.27x35=44.45 ±0.2 R 1.50 Æ3.20 + 0.1 0 (1.27x17=21.59) 1.27x17=21.59 Ref 1.27x18=22.86 Ref 1.27 ±0.05 Æ3.20 0 Thru hole + 0.1 0 8.04±0.05 + 0.1 0 0.67 1.27 ±0.1 1.27x 35=44.45 ±0.2 4.84±0.05 13.00 17.00 72-Æ0.80 0.635 ±0.05 + 0.1 1.27 ±0.1 (1.27x18=22.86) 1.27±0.05 1.27x35=44.45 ±0.05 80.00 ±0.4 98.00 ±0.4 80.00 Ref 59.89 + 00.1 Matching Module Dimensions 15.48 ±0.1 11.00 Front 59.69 6.35 Front 17.78 25.35 w0.40 x t0.30 3.70 ±0.5 1.02 ±0.3 1.27 ±0.3 + 0.09 1.00 – 0.07 7.62 44.45 ±0.05 54.00 + 00.2 51.66 1.27x35=44.45 ±0.05 (1.27x17=21.59) (1.27x18=22.86) 17.78 2.00 1.80 Back (2.00) 4.00 20.00 34.10 Ref 55.90 Ref Back SPECIFICATIONS ARE SUBJECT TO ALTERATION WITHOUT PRIOR NOTICE – DIMENSIONS IN MILLIMETER Æ1.80±0.05 Test & Burn-In