IC497 Series Dual Inline Memory Module (DIMM, 144 pins) Specifications Part Number (Details) Insulation Resistance: Dielectric Withstanding Voltage: Contact Resistance: Operating Temperature Range: Mating Cycles: Pin Count: 1,000M W min. at 500V DC 700V AC for 1 minute 30m W max. at 10mA/20mV max. –55°C to +170°C 10,000 insertions min. 144 contact pins IC-497 - 1 - * - MF Series No. Design No. Positioning Detail (see Section "A") Materials and Finish Housing: Polyetherimide (PEI), glass-filled Contacts: Beryllium Copper (BeCu) Plating: Gold over Nickel MF = Flanged Unmarked = Not Flanged Features í Card thickness 1.00mm í 4 different positioning indicators Outline Socket Dimensions Recommended PC Board Layout Top View from Socket 101.00 ±0.2 0.80x29=23.20 ±0.2 Æ3.20 + 00.1 101.00 ±0.1 30.50 ±0.05 30.10 ±0.05 30.10 ±0.05 0.80x41=32.80 ±0.2 0.80x29=23.20 ±0.1 0.80 ±0.05 (4.60±0.1) (0.40) 0.80x41=32.80 ±0.1 0.80 ±0.05 Æ3.20 + 0.1 0 4.60 ±0.1 (0.40) 144-Æ0.80 + 0.1 0 0.80x41=32.80 ±0.2 30.50 ±0.1 30.10 ±0.1 4.50±0.05 0.80x29=23.20 ±0.2 7.70±0.05 13.00 17.00 30.50 ±0.05 0.80 ±0.05 0.80x29=23.20 ±0.1 (0.40) 0.80x41=32.80 ±0.1 + 0.2 63.50 0 + 0.2 67.80 0 92.00 ±0.4 30.50 ±0.05 30.10 ±0.05 110.00 ±0.4 (91.50) (65.00) 17.70 ±0.1 Matching Module Dimensions R 1.70 2.00 min 2.10 0 - 0.1 R - 0.55 20.00 0.80 0.80 1.00 ±0.1 0.80x29=23.20 3.30 27.80 ±0.05 0.80x41=32.80 3.70 0.80x41=32.80 3.30 67.60 ±0.15 0.80 1.10 Front 2.55 Section "A" 1.35 4.00 ±0.1 4.00 ±0.1 Positioning Details (25.40~38.10) w0.30 x t0.30 3.50 ±0.5 3.70 27.80 ±0.05 0.80x29=23.20 IC-497-1-1-** IC-497-1-2-** 0.80 see Sec. "A" 1.50 ±0.1 2.85 Back IC-497-1-3-** B-2 Test & Burn-In 5.00 R 2.00 Section "A" 3.20 6.00 4.00 11.00 + 00.3 (36.50) R 0.50 IC-497-1-4-** SPECIFICATIONS ARE SUBJECT TO ALTERATION WITHOUT PRIOR NOTICE – DIMENSIONS IN MILLIMETER 0.80 3.80 max