MODEL BB1110RC Resistor capacitor network Thick film resistors Ceramic chip capacitors DISCRIPTION Model BB1110RC is designed for terminating high-speed memory buses. Ideally suited for local decoupling of data line drivers. These specialty networks employ solder balls for surface mount flip chip attachment. Their unique construction yields extremely low capacitance and inductance parasitics critical for these high-speed applications. FEATURES • Integrated resistor and capacitor network • High density packaging • High temperature solder balls • Industry standard ball diameter and pitch • Excellent high frequency performance SCHEMATIC C1-9 = 0.1uF R1-9 = 50 Ω ELECTRICAL1 Resistance Tolerance ± 1% Capacitance Tolerance ± 10% Capacitor Type X5R Capacitor Maximum Voltage 10 volts TCR 200 ppm/°C Operating Temperature Range -55°C to +85°C Maximum Resistor Power 0.05 watts at 70°C Package Power Rating 1 1.0 watt @ 70°C Specifications subject to change without notice. BI Technologies Corporation 4200 Bonita Place, Fullerton, CA 92835 USA Phone: 714 447 2345 August 30, 2005 Website: www.bitechnologies.com page 1 of 2 BI technologies MODEL BB1110RC MECHANICAL Solder Ball Finish SnPb 10/90 Solder Ball Co-planarity 0.15 mm Substrate Material Al2O3 Resistor Material Cermet ORDERING INFORMATION2 BB 1 1 10 RC 7 Model Series Tape Reel packing Channels: 9 Resistor Capacitor Network Solder ball Pitch: 1.0 mm Nominal: 50 ohms / 0.1uf PACKING INFORMATION Tape reel suffix (also reel size in inches) 7 13 Part count/reel 750 3000 OUTLINE DRAWING Units: mm 2 Contact our customer service for custom designs and features. BI Technologies Corporation 4200 Bonita Place, Fullerton, CA 92835 USA Phone: 714 447 2345 October 7, 2004 Website: www.bitechnologies.com page 2 of 2 BI technologies