CENTRAL CTLSH05

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Central
CTLSH05-40M621
Semiconductor Corp.
SURFACE MOUNT
LOW VF
SILICON SCHOTTKY DIODE
Top View
DESCRIPTION:
Bottom View
The CENTRAL SEMICONDUCTOR
CTLSH05-40M621 Low VF Schottky Diode packaged in a
TLM™ (Tiny Leadless Module™), is a high quality
Schottky Diode designed for applications where small size
and operational effciency are the prime requirements. With
a maximum power dissipation of 0.9W, and a very small
package footprint (comparable to the SOT-563), this
leadless package design is capable of dissipating over 3
times the power of similar devices in comparable sized
surface mount packages.
TLM621 CASE
FEATURES:
MARKING CODE: CH
• Very Small Package Size
• Current (IF=0.5A)
• Low Forward Voltage Drop
(VF=0.47V MAX @ 0.5A)
APPLICATIONS:
•
•
•
•
DC/DC Converters
Voltage Clamping
Protection Circuits
Battery Powered Portable Equipment
MAXIMUM RATINGS: (TA=25°C)
N
I
M
Peak Repetitive Reverse Voltage
VRRM
Continuous Forward Current
IF
I
L
Forward Surge Current, tp = 8ms
E
R
Power Dissipation
Operating and Storage
Junction Temperature
P
Thermal Resistance
ELECTRICAL CHARACTERISTICS:
SYMBOL
TEST CONDITIONS
IR
IR
BVR
VR= 10V
VR= 30V
IR= 500μA
VF
VF
IF= 100μA
IF= 1.0mA
VF
VF
IF= 10mA
IF= 100mA
IF= 500mA
VF
CT
• High Thermal Efficiency
• Small TLM 2x1mm case
Y
R
A
SYMBOL
Peak Repetitive Forward Current, tp ≤ 1ms
TM
IFRM
UNITS
40
V
500
mA
3.5
A
IFSM
10
A
PD
0.9
W*
TJ, Tstg
-65 to +150
°C
ΘJA
139
°C/W*
(TA=25°C unless otherwise noted)
VR=1.0V, f=1.0MHz
*FR-4 Epoxy PCB with copper mounting pad area of 33mm2
MIN
MAX
UNITS
20
μA
100
μA
V
0.13
V
0.21
V
40
0.27
V
0.35
V
0.47
V
50
pF
R1 (27-April 2006)
Central
TM
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ICTLSH05-40M621
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Semiconductor Corp.
SURFACE MOUNT
LOW VF
SILICON SCHOTTKY DIODE
TLM621 CASE - MECHANICAL OUTLINE
Suggested mounting pad layout
for maximum power dissipation
(Dimensions in mm)
For standard mounting see
TLM621 Package Details
LEAD CODE:
1)
2)
3)
4)
5)
6)
CATHODE
CATHODE
ANODE
ANODE
CATHODE
CATHODE
MARKING CODE: CH
R1 (27-April 2006)