RY CTLSH3-2M322HL A IN Central IM EL SURFACE MOUNT ULTRA LOW VF SILICON SCHOTTKY RECTIFIER TM TINY LEADLESS MODULE PR Semiconductor Corp. DESCRIPTION: The CENTRAL SEMICONDUCTOR CTLSH3-2M322HL is a high performance HiLo™ 3.0A Schottky rectifier designed for applications where small size and operational efficiency are the prime requirements. With a maximum power dissipation of 1.45W, and a very small package footprint (smaller than the SOT-23), this leadless package design is capable of dissipating up to 4 times the power of similar devices in comparable sized surface mount packages. FEATURES: TLM322 CASE APPLICATIONS: • DC/DC Converters • Voltage Clamping • Protection Circuits MAXIMUM RATINGS: (TA=25°C) Continuous Reverse Voltage IN Power Dissipation E R P Thermal Resistance ELECTRICAL CHARACTERISTICS PER DIODE: SYMBOL VR UNITS 20 V 3.0 A PD 1.45 W* TJ, Tstg -65 to +150 °C ΘJA 86.2 °C/W * M I L Average Forward Current • Battery Powered Portable Equipment Y R A SYMBOL Operating and Storage Junction Temperature • High Thermal Efficiency • Small TLM 2x2mm case • High Current (IF=3.0A) • HiLo™ Device Characteristics (High Current/Low VF) • Ultra Low Forward Voltage Drop (VF=0.35V Typ. @ 3.0A) MARKING CODE: CBB TM IO (TA=25°C unless otherwise noted) TEST CONDITIONS MIN TYP MAX UNITS 2.0 3.0 mA IR BVR VR=10V IR=5.0mA VF IF=100mA 0.14 0.18 V VF IF=500mA 0.19 0.23 V 20 V VF IF=1.0A 0.24 0.28 V VF IF=2.0A 0.29 0.33 V VF IF=3.0A 0.35 0.40 V TBD pF CT * FR-4 Epoxy PCB with copper mounting pad area of 21mm2. R0 (6-January 2006) RY A IN CTLSH3-2M322HL Central TM Semiconductor Corp. MOUNT IM SURFACE ULTRA LOW V P L RE F SILICON SCHOTTKY RECTIFIER TM TINY LEADLESS MODULE TLM322 CASE - MECHANICAL OUTLINE Suggested mounting pad layout for maximum power dissipation (Dimensions in mm) LEAD CODE: 1) Cathode 2) Anode 3) Anode For standard mounting refer to TLM322 Package Details MARKING CODE: CBB R0 (6-January 2006)