SN54LVC541A, SN74LVC541A OCTAL BUFFERS/DRIVERS WITH 3-STATE OUTPUTS www.ti.com SCAS298M – JANUARY 1993 – REVISED MAY 2005 • FEATURES 2 20 19 3 18 4 17 5 16 6 15 7 14 8 13 9 12 10 11 VCC OE2 Y1 Y2 Y3 Y4 Y5 Y6 Y7 Y8 A1 A2 A3 A4 A5 A6 A7 A8 20 A2 A1 OE1 VCC 1 2 19 OE2 3 18 Y1 4 17 Y2 16 Y3 15 Y4 5 6 14 Y5 13 Y6 7 8 12 Y7 9 10 A3 A4 A5 A6 A7 4 3 2 1 20 19 18 5 6 17 16 7 15 14 9 10 11 12 13 8 Y1 Y2 Y3 Y4 Y5 A8 GND Y8 Y7 Y6 1 SN54LVC541A . . . FK PACKAGE (TOP VIEW) SN74LVC541A . . . RGY PACKAGE (TOP VIEW) GND OE1 A1 A2 A3 A4 A5 A6 A7 A8 GND ABC OE2 SN54LVC541A . . . J OR W PACKAGE SN74LVC541A . . . DB, DGV, DW, NS, OR PW PACKAGE (TOP VIEW) • VCC • • Ioff Supports Partial-Power-Down Mode Operation Latch-Up Performance Exceeds 250 mA Per JESD 17 ESD Protection Exceeds JESD 22 – 2000-V Human-Body Model (A114-A) – 200-V Machine Model (A115-A) – 1000-V Charged-Device Model (C101) 11 Y8 • Operate From 1.65 V to 3.6 V Inputs Accept Voltages to 5.5 V Max tpd of 5.1 ns at 3.3 V Typical VOLP (Output Ground Bounce) < 0.8 V at VCC = 3.3 V, TA = 25°C Typical VOHV (Output VOH Undershoot) > 2 V at VCC = 3.3 V, TA = 25°C Support Mixed-Mode Signal Operation on All Ports (5-V Input/Output Voltage With 3.3-V VCC) OE1 • • • • DESCRIPTION/ORDERING INFORMATION The SN54LVC541A octal buffer/driver is designed for 2.7-V to 3.6-V VCC operation, and the SN74LVC541A octal buffer/driver is designed for 1.65-V to 3.6-V VCC operation. ORDERING INFORMATION PACKAGE (1) TA QFN – RGY Tube of 25 SN74LVC541ADW Reel of 2000 SN74LVC541ADWR SOP – NS Reel of 2000 SN74LVC541ANSR LVC541A SSOP – DB Reel of 2000 SN74LVC541ADBR LC541A Tube of 70 SN74LVC541APW Reel of 2000 SN74LVC541APWR Reel of 250 SN74LVC541APWT TVSOP – DGV Reel of 2000 SN74LVC541ADGVR LC541A CDIP – J Tube of 20 SNJ54LVC541AJ SNJ54LVC541AJ CFP – W Tube of 85 SNJ54LVC541AW SNJ54LVC541AW LCCC – FK Tube of 55 SNJ54LVC541AFK SNJ54LVC541AFK TSSOP – PW –55°C to 125°C (1) TOP-SIDE MARKING SN74LVC541ARGYR SOIC – DW –40°C to 85°C ORDERABLE PART NUMBER Reel of 1000 LC541A LVC541A LC541A Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at www.ti.com/sc/package. Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. Copyright © 1993–2005, Texas Instruments Incorporated On products compliant to MIL-PRF-38535, all parameters are tested unless otherwise noted. On all other products, production processing does not necessarily include testing of all parameters. SN54LVC541A, SN74LVC541A OCTAL BUFFERS/DRIVERS WITH 3-STATE OUTPUTS www.ti.com SCAS298M – JANUARY 1993 – REVISED MAY 2005 DESCRIPTION/ORDERING INFORMATION (CONTINUED) The 'LVC541A devices are ideal for driving bus lines or buffering memory address registers. These devices feature inputs and outputs on opposite sides of the package to facilitate printed circuit board layout. The 3-state control gate is a 2-input AND gate with active-low inputs so that, if either output enable (OE1 or OE2) input is high, all eight outputs are in the high-impedance state. Inputs can be driven from either 3.3-V or 5-V devices. This feature allows the use of these devices as translators in a mixed 3.3-V/5-V system environment. These devices are fully specified for partial-power-down applications using Ioff. The Ioff circuitry disables the outputs, preventing damaging current backflow through the devices when they are powered down. To ensure the high-impedance state during power up or power down, OE should be tied to VCC through a pullup resistor; the minimum value of the resistor is determined by the current-sinking capability of the driver. FUNCTION TABLE INPUTS A OUTPUT Y OE1 OE2 L L L L L L H H H X X Z X H X Z LOGIC DIAGRAM (POSITIVE LOGIC) OE1 OE2 A1 1 19 2 18 To Seven Other Channels 2 Y1 SN54LVC541A, SN74LVC541A OCTAL BUFFERS/DRIVERS WITH 3-STATE OUTPUTS www.ti.com SCAS298M – JANUARY 1993 – REVISED MAY 2005 Absolute Maximum Ratings (1) over operating free-air temperature range (unless otherwise noted) MIN MAX VCC Supply voltage range –0.5 6.5 V VI Input voltage range (2) –0.5 6.5 V –0.5 6.5 V –0.5 VCC + 0.5 state (2) UNIT VO Voltage range applied to any output in the high-impedance or power-off VO Voltage range applied to any output in the high or low state (2) (3) IIK Input clamp current VI < 0 –50 mA IOK Output clamp current VO < 0 –50 mA IO Continuous output current ±50 mA ±100 mA Continuous current through VCC or GND DB θJA Package thermal impedance package (4) 70 DGV package (4) 92 DW package (4) 58 NS package (4) 60 PW package (4) 83 RGY package (5) Tstg (1) (2) (3) (4) (5) Storage temperature range V °C/W 37 –65 150 °C Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. The input negative-voltage and output voltage ratings may be exceeded if the input and output current ratings are observed. The value of VCC is provided in the recommended operating conditions table. The package thermal impedance is calculated in accordance with JESD 51-7. The package thermal impedance is calculated in accordance with JESD 51-5. 3 SN54LVC541A, SN74LVC541A OCTAL BUFFERS/DRIVERS WITH 3-STATE OUTPUTS www.ti.com SCAS298M – JANUARY 1993 – REVISED MAY 2005 Recommended Operating Conditions (1) SN54LVC541A VCC Supply voltage VIH High-level input voltage Operating Data retention only MIN MAX MIN MAX 2 3.6 1.65 3.6 1.5 Low-level input voltage 1.7 2 Input voltage VO Output voltage 0.35 × VCC 0.7 0.8 High-level output current 0 5.5 0 5.5 High or low state 0 VCC 0 VCC 3-state 0 5.5 0 5.5 TA (1) 4 Low-level output current Operating free-air temperature V V –4 VCC = 2.3 V –8 VCC = 2.7 V –12 –12 VCC = 3 V –24 –24 VCC = 1.65 V IOL V 0.8 VCC = 1.65 V IOH V 2 VCC = 2.3 V to 2.7 V VCC = 2.7 V to 3.6 V VI V 0.65 × VCC VCC = 2.3 V to 2.7 V VCC = 1.65 V to 1.95 V VIL UNIT 1.5 VCC = 1.65 V to 1.95 V VCC = 2.7 V to 3.6 V SN74LVC541A mA 4 VCC = 2.3 V 8 VCC = 2.7 V 12 12 VCC = 3 V 24 24 –55 125 –40 85 All unused inputs of the device must be held at VCC or GND to ensure proper device operation. Refer to the TI application report, Implications of Slow or Floating CMOS Inputs, literature number SCBA004. mA °C SN54LVC541A, SN74LVC541A OCTAL BUFFERS/DRIVERS WITH 3-STATE OUTPUTS www.ti.com SCAS298M – JANUARY 1993 – REVISED MAY 2005 Electrical Characteristics over recommended operating free-air temperature range (unless otherwise noted) PARAMETER TEST CONDITIONS 2.7 V to 3.6 V (1) (2) VCC – 0.2 1.2 2.3 V 1.7 2.7 V 2.2 2.2 3V 2.4 2.4 3V 2.2 2.2 V 1.65 V to 3.6 V 0.2 2.7 V to 3.6 V 0.2 IOL = 4 mA 1.65 V 0.45 IOL = 8 mA 2.3 V 0.7 IOL = 12 mA 2.7 V 0.4 0.4 IOL = 24 mA 3V 0.55 0.55 ±5 ±5 µA VI = 0 to 5.5 V 3.6 V Ioff VI or VO = 5.5 V 0 IOZ VO = 0 to 5.5 V 3.6 V VI = VCC or GND 3.6 V ≤ VI ≤ 5.5 V (2) IO = 0 One input at VCC – 0.6 V, Other inputs at VCC or GND ∆ICC UNIT VCC – 0.2 IOH = –8 mA IOL = 100 µA ICC MIN TYP (1) MAX 1.65 V IOH = –24 mA II SN74LVC541A MIN TYP (1) MAX IOH = –4 mA IOH = –12 mA VOL SN54LVC541A 1.65 V to 3.6 V IOH = –100 µA VOH VCC 3.6 V 2.7 V to 3.6 V V ±10 µA ±15 ±10 µA 10 10 10 10 500 500 µA µA Ci VI = VCC or GND 3.3 V 4 4 pF Co VO = VCC or GND 3.3 V 5.5 5.5 pF All typical values are at VCC = 3.3 V, TA = 25°C. This applies in the disabled state only. Switching Characteristics over recommended operating free-air temperature range (unless otherwise noted) (see Figure 1) SN54LVC541A PARAMETER FROM (INPUT) TO (OUTPUT) MAX MIN MAX tpd A Y 5.6 1 5.1 ns ten OE Y 7.5 1 7 ns tdis OE Y 7.7 1 7 ns VCC = 2.7 V MIN VCC = 3.3 V ± 0.3 V UNIT 5 SN54LVC541A, SN74LVC541A OCTAL BUFFERS/DRIVERS WITH 3-STATE OUTPUTS www.ti.com SCAS298M – JANUARY 1993 – REVISED MAY 2005 Switching Characteristics over recommended operating free-air temperature range (unless otherwise noted) (see Figure 1) SN74LVC541A PARAMETER FROM (INPUT) TO (OUTPUT) VCC = 1.8 V ± 0.15 V VCC = 2.5 V ± 0.2 V MIN MAX MIN MAX MIN MAX MIN MAX tpd A Y 1 15.7 1 7.8 1 5.6 1.5 5.1 ns ten OE Y 1 17.5 1 10.5 1 7.5 1.5 7 ns tdis OE Y 1 16.5 1 9 1 7.7 1.5 7 ns 1 ns VCC = 2.7 V VCC = 3.3 V ± 0.3 V tsk(o) UNIT Operating Characteristics TA = 25°C TEST CONDITIONS PARAMETER Cpd 6 Power dissipation capacitance per buffer/driver Outputs enabled Outputs disabled f = 10 MHz VCC = 1.8 V VCC = 2.5 V VCC = 3.3 V TYP TYP TYP 65 58 33 2 2 2 UNIT pF SN54LVC541A, SN74LVC541A OCTAL BUFFERS/DRIVERS WITH 3-STATE OUTPUTS www.ti.com SCAS298M – JANUARY 1993 – REVISED MAY 2005 PARAMETER MEASUREMENT INFORMATION VLOAD S1 RL From Output Under Test CL (see Note A) Open GND RL TEST S1 tPLH/tPHL tPLZ/tPZL tPHZ/tPZH Open VLOAD GND LOAD CIRCUIT INPUTS VCC 1.8 V ± 0.15 V 2.5 V ± 0.2 V 2.7 V 3.3 V ± 0.3 V VI tr/tf VCC VCC 2.7 V 2.7 V ≤2 ns ≤2 ns ≤2.5 ns ≤2.5 ns VM VLOAD CL RL V∆ VCC/2 VCC/2 1.5 V 1.5 V 2 × VCC 2 × VCC 6V 6V 30 pF 30 pF 50 pF 50 pF 1 kΩ 500 Ω 500 Ω 500 Ω 0.15 V 0.15 V 0.3 V 0.3 V VI Timing Input VM 0V tw tsu VI Input VM VM th VI Data Input VM VM 0V 0V VOLTAGE WAVEFORMS PULSE DURATION VOLTAGE WAVEFORMS SETUP AND HOLD TIMES VI VM Input VM 0V tPLH VM VM VOL tPHL VM VM 0V Output Waveform 1 S1 at VLOAD (see Note B) tPLH tPLZ VLOAD/2 VM tPZH VOH Output VM tPZL tPHL VOH Output VI Output Control VM VOL VOLTAGE WAVEFORMS PROPAGATION DELAY TIMES INVERTING AND NONINVERTING OUTPUTS Output Waveform 2 S1 at GND (see Note B) VOL + V∆ VOL tPHZ VM VOH − V∆ VOH ≈0 V VOLTAGE WAVEFORMS ENABLE AND DISABLE TIMES LOW- AND HIGH-LEVEL ENABLING NOTES: A. CL includes probe and jig capacitance. B. Waveform 1 is for an output with internal conditions such that the output is low, except when disabled by the output control. Waveform 2 is for an output with internal conditions such that the output is high, except when disabled by the output control. C. All input pulses are supplied by generators having the following characteristics: PRR ≤ 10 MHz, ZO = 50 Ω. D. The outputs are measured one at a time, with one transition per measurement. E. tPLZ and tPHZ are the same as tdis. F. tPZL and tPZH are the same as ten. G. tPLH and tPHL are the same as tpd. H. All parameters and waveforms are not applicable to all devices. Figure 1. Load Circuit and Voltage Waveforms 7 PACKAGE OPTION ADDENDUM www.ti.com 18-Jul-2006 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Drawing Pins Package Eco Plan (2) Qty 5962-9759501Q2A ACTIVE LCCC FK 20 1 TBD 5962-9759501QRA ACTIVE CDIP J 20 1 TBD 1 Lead/Ball Finish MSL Peak Temp (3) POST-PLATE N / A for Pkg Type A42 SNPB N / A for Pkg Type TBD A42 N / A for Pkg Type TBD Call TI 5962-9759501QSA ACTIVE CFP W 20 SN74LVC541ADBLE OBSOLETE SSOP DB 20 SN74LVC541ADBR ACTIVE SSOP DB 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LVC541ADBRG4 ACTIVE SSOP DB 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LVC541ADGVR ACTIVE TVSOP DGV 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LVC541ADGVRE4 ACTIVE TVSOP DGV 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LVC541ADW ACTIVE SOIC DW 20 25 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LVC541ADWE4 ACTIVE SOIC DW 20 25 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LVC541ADWG4 ACTIVE SOIC DW 20 25 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LVC541ADWR ACTIVE SOIC DW 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LVC541ADWRE4 ACTIVE SOIC DW 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LVC541ADWRG4 ACTIVE SOIC DW 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LVC541ANSR ACTIVE SO NS 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LVC541ANSRE4 ACTIVE SO NS 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LVC541ANSRG4 ACTIVE SO NS 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LVC541APW ACTIVE TSSOP PW 20 70 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LVC541APWE4 ACTIVE TSSOP PW 20 70 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LVC541APWG4 ACTIVE TSSOP PW 20 70 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LVC541APWLE OBSOLETE TSSOP PW 20 SN74LVC541APWR ACTIVE TSSOP PW 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LVC541APWRE4 ACTIVE TSSOP PW 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LVC541APWRG4 ACTIVE TSSOP PW 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LVC541APWT ACTIVE TSSOP PW 20 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LVC541APWTE4 ACTIVE TSSOP PW 20 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LVC541ARGYR ACTIVE QFN RGY 20 1000 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1YEAR TBD Addendum-Page 1 Call TI Call TI Call TI PACKAGE OPTION ADDENDUM www.ti.com 18-Jul-2006 Orderable Device Status (1) Package Type Package Drawing Pins Package Eco Plan (2) Qty SN74LVC541ARGYRG4 ACTIVE QFN RGY 20 SNJ54LVC541AFK ACTIVE LCCC FK 20 1 TBD SNJ54LVC541AJ ACTIVE CDIP J 20 1 TBD A42 SNPB N / A for Pkg Type SNJ54LVC541AW ACTIVE CFP W 20 1 TBD A42 N / A for Pkg Type 1000 Green (RoHS & no Sb/Br) Lead/Ball Finish CU NIPDAU MSL Peak Temp (3) Level-2-260C-1YEAR POST-PLATE N / A for Pkg Type (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. Addendum-Page 2 MECHANICAL DATA MLCC006B – OCTOBER 1996 FK (S-CQCC-N**) LEADLESS CERAMIC CHIP CARRIER 28 TERMINAL SHOWN 18 17 16 15 14 13 NO. OF TERMINALS ** 12 19 11 20 10 A B MIN MAX MIN MAX 20 0.342 (8,69) 0.358 (9,09) 0.307 (7,80) 0.358 (9,09) 28 0.442 (11,23) 0.458 (11,63) 0.406 (10,31) 0.458 (11,63) 21 9 22 8 44 0.640 (16,26) 0.660 (16,76) 0.495 (12,58) 0.560 (14,22) 23 7 52 0.739 (18,78) 0.761 (19,32) 0.495 (12,58) 0.560 (14,22) 24 6 68 0.938 (23,83) 0.962 (24,43) 0.850 (21,6) 0.858 (21,8) 84 1.141 (28,99) 1.165 (29,59) 1.047 (26,6) 1.063 (27,0) B SQ A SQ 25 5 26 27 28 1 2 3 4 0.080 (2,03) 0.064 (1,63) 0.020 (0,51) 0.010 (0,25) 0.020 (0,51) 0.010 (0,25) 0.055 (1,40) 0.045 (1,14) 0.045 (1,14) 0.035 (0,89) 0.045 (1,14) 0.035 (0,89) 0.028 (0,71) 0.022 (0,54) 0.050 (1,27) 4040140 / D 10/96 NOTES: A. B. C. D. E. All linear dimensions are in inches (millimeters). This drawing is subject to change without notice. This package can be hermetically sealed with a metal lid. The terminals are gold plated. Falls within JEDEC MS-004 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 MECHANICAL DATA MPDS006C – FEBRUARY 1996 – REVISED AUGUST 2000 DGV (R-PDSO-G**) PLASTIC SMALL-OUTLINE 24 PINS SHOWN 0,40 0,23 0,13 24 13 0,07 M 0,16 NOM 4,50 4,30 6,60 6,20 Gage Plane 0,25 0°–8° 1 0,75 0,50 12 A Seating Plane 0,15 0,05 1,20 MAX PINS ** 0,08 14 16 20 24 38 48 56 A MAX 3,70 3,70 5,10 5,10 7,90 9,80 11,40 A MIN 3,50 3,50 4,90 4,90 7,70 9,60 11,20 DIM 4073251/E 08/00 NOTES: A. B. C. D. All linear dimensions are in millimeters. This drawing is subject to change without notice. Body dimensions do not include mold flash or protrusion, not to exceed 0,15 per side. Falls within JEDEC: 24/48 Pins – MO-153 14/16/20/56 Pins – MO-194 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 MECHANICAL DATA MSSO002E – JANUARY 1995 – REVISED DECEMBER 2001 DB (R-PDSO-G**) PLASTIC SMALL-OUTLINE 28 PINS SHOWN 0,38 0,22 0,65 28 0,15 M 15 0,25 0,09 8,20 7,40 5,60 5,00 Gage Plane 1 14 0,25 A 0°–ā8° 0,95 0,55 Seating Plane 2,00 MAX 0,10 0,05 MIN PINS ** 14 16 20 24 28 30 38 A MAX 6,50 6,50 7,50 8,50 10,50 10,50 12,90 A MIN 5,90 5,90 6,90 7,90 9,90 9,90 12,30 DIM 4040065 /E 12/01 NOTES: A. B. C. D. All linear dimensions are in millimeters. This drawing is subject to change without notice. Body dimensions do not include mold flash or protrusion not to exceed 0,15. Falls within JEDEC MO-150 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 MECHANICAL DATA MTSS001C – JANUARY 1995 – REVISED FEBRUARY 1999 PW (R-PDSO-G**) PLASTIC SMALL-OUTLINE PACKAGE 14 PINS SHOWN 0,30 0,19 0,65 14 0,10 M 8 0,15 NOM 4,50 4,30 6,60 6,20 Gage Plane 0,25 1 7 0°– 8° A 0,75 0,50 Seating Plane 0,15 0,05 1,20 MAX PINS ** 0,10 8 14 16 20 24 28 A MAX 3,10 5,10 5,10 6,60 7,90 9,80 A MIN 2,90 4,90 4,90 6,40 7,70 9,60 DIM 4040064/F 01/97 NOTES: A. B. C. D. All linear dimensions are in millimeters. This drawing is subject to change without notice. Body dimensions do not include mold flash or protrusion not to exceed 0,15. Falls within JEDEC MO-153 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements, improvements, and other changes to its products and services at any time and to discontinue any product or service without notice. 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