TI LVCR2245A

SN74LVCR2245A
OCTAL BUS TRANSCEIVER
WITH 3-STATE OUTPUTS
www.ti.com
SCAS581M – NOVEMBER 1996 – REVISED MARCH 2005
FEATURES
•
•
•
•
•
•
•
DB, DBQ, DGV, DW, NS, OR PW PACKAGE
(TOP VIEW)
20
2
19
3
18
4
17
5
16
6
15
7
14
8
13
9
12
10
11
VCC
OE
B1
B2
B3
B4
B5
B6
B7
B8
A1
A2
A3
A4
A5
A6
A7
A8
VCC
1
1
20
2
19 OE
3
18 B1
4
17 B2
16 B3
5
6
15 B4
14 B5
7
13 B6
12 B7
8
9
10
11
B8
DIR
A1
A2
A3
A4
A5
A6
A7
A8
GND
RGY PACKAGE
(TOP VIEW)
DIR
•
•
Supports Mixed-Mode Signal Operation on All
Ports (5-V Input/Output Voltage
With 3.3-V VCC)
Ioff Supports Partial-Power-Down Mode
Operation
Latch-Up Performance Exceeds 250 mA Per
JESD 17
ESD Protection Exceeds JESD 22
– 2000-V Human-Body Model (A114-A)
– 1000-V Charged-Device Model (C101)
GND
•
Operates From 1.65 V to 3.6 V
Inputs Accept Voltages to 5.5 V
Max tpd of 6.3 ns at 3.3 V
All Outputs Have Equivalent 26-Ω Series
Resistors, So No External Resistors Are
Required
Typical VOLP (Output Ground Bounce)
<0.8 V at VCC = 3.3 V, TA = 25°C
Typical VOHV (Output VOH Undershoot)
>2 V at VCC = 3.3 V, TA = 25°C
DESCRIPTION/ORDERING INFORMATION
ORDERING INFORMATION
PACKAGE (1)
TA
QFN – RGY
Tube of 25
SN74LVCR2245ADW
Reel of 2000
SN74LVCR2245ADWR
SOP – NS
Reel of 2000
SN74LVCR2245ANSR
LVCR2245A
SSOP – DB
Reel of 2000
SN74LVCR2245ADBR
LER245A
SSOP (QSOP) – DBQ
Reel of 2500
SN74LVCR2245ADBQR
LVCR2245A
Tube of 70
SN74LVCR2245APW
Reel of 2000
SN74LVCR2245APWR
Reel of 250
SN74LVCR2245APWT
Reel of 2000
SN74LVCR2245ADGVR
TSSOP – PW
TVSOP – DGV
VFBGA – GQN
VFBGA – ZQN (Pb-free)
(1)
TOP-SIDE MARKING
SN74LVCR2245ARGYR
SOIC – DW
–40°C to 85°C
ORDERABLE PART NUMBER
Reel of 1000
Reel of 1000
SN74LVCR2245AGQNR
SN74LVCR2245AZQNR
LER245A
LVCR2245A
LER245A
LER245A
LER245A
Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at
www.ti.com/sc/package.
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 1996–2005, Texas Instruments Incorporated
SN74LVCR2245A
OCTAL BUS TRANSCEIVER
WITH 3-STATE OUTPUTS
www.ti.com
SCAS581M – NOVEMBER 1996 – REVISED MARCH 2005
DESCRIPTION/ORDERING INFORMATION (CONTINUED)
This octal bus transceiver is designed for 1.65-V to 3.6-V VCC operation.
The SN74LVCR2245A is designed for asynchronous communication between data buses. The device transmits
data from the A bus to the B bus or from the B bus to the A bus, depending on the logic level at the
direction-control (DIR) input. The output-enable (OE) input can be used to disable the device so the buses are
effectively isolated.
All outputs, which are designed to sink up to 12 mA, include equivalent 26-Ω resistors to reduce overshoot and
undershoot.
Inputs can be driven from either 3.3-V or 5-V devices. This feature allows the use of this device as a translator in
a mixed 3.3-V/5-V system environment.
This device is fully specified for partial-power-down applications using Ioff. The Ioff circuitry disables the outputs,
preventing damaging current backflow through the device when it is powered down.
To ensure the high-impedance state during power up or power down, OE should be tied to VCC through a pullup
resistor; the minimum value of the resistor is determined by the current-sinking capability of the driver.
GQN OR ZQN PACKAGE
(TOP VIEW)
1
2
3
4
A
B
C
D
E
TERMINAL ASSIGNMENTS
1
2
3
4
A
A1
DIR
VCC
OE
B
A3
B2
A2
B1
C
A5
A4
B4
B3
D
A7
B6
A6
B5
E
GND
A8
B8
B7
FUNCTION TABLE
INPUTS
OE
2
DIR
OPERATION
L
L
B data to A bus
L
H
A data to B bus
H
X
Isolation
SN74LVCR2245A
OCTAL BUS TRANSCEIVER
WITH 3-STATE OUTPUTS
www.ti.com
SCAS581M – NOVEMBER 1996 – REVISED MARCH 2005
LOGIC DIAGRAM (POSITIVE LOGIC)
DIR
1
19
A1
OE
2
18
B1
To Seven Other Channels
Pin numbers shown are for the DB, DBQ, DGV, DW, NS, PW, and RGY packages.
Absolute Maximum Ratings (1)
over operating free-air temperature range (unless otherwise noted)
MIN
MAX
VCC
Supply voltage range
–0.5
6.5
V
VI
Input voltage range (2)
–0.5
6.5
V
–0.5
6.5
V
–0.5
VCC + 0.5
state (2)
UNIT
VO
Voltage range applied to any output in the high-impedance or power-off
VO
Voltage range applied to any output in the high or low state (2) (3)
IIK
Input clamp current
VI < 0
–50
mA
IOK
Output clamp current
VO < 0
–50
mA
IO
Continuous output current
±50
mA
±100
mA
Continuous current through VCC or GND
θJA
Package thermal impedance
DB package (4)
70
DBQ package (4)
68
DGV package (4)
92
DW package (4)
58
GQN/ZQN
(1)
(2)
(3)
(4)
(5)
Storage temperature range
78
NS package (4)
60
PW package (4)
83
RGY
Tstg
package (4)
package (5)
V
°C/W
37
–65
150
°C
Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating
conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
The input negative-voltage and output voltage ratings may be exceeded if the input and output current ratings are observed.
The value of VCC is provided in the recommended operating conditions table.
The package thermal impedance is calculated in accordance with JESD 51-7.
The package thermal impedance is calculated in accordance with JESD 51-5.
3
SN74LVCR2245A
OCTAL BUS TRANSCEIVER
WITH 3-STATE OUTPUTS
www.ti.com
SCAS581M – NOVEMBER 1996 – REVISED MARCH 2005
Recommended Operating Conditions (1)
VCC
Supply voltage
Operating
Data retention only
VCC = 1.65 V to 1.95 V
VIH
High-level input voltage
MIN
MAX
1.65
3.6
1.5
Low-level input voltage
VI
VCC = 2.3 V to 2.7 V
1.7
VCC = 2.7 V to 3.6 V
2
VO
Output voltage
IOH
High-level output current
0.35 × VCC
0.7
VCC = 2.7 V to 3.6 V
0.8
0
5.5
High or low state
0
VCC
3-state
0
5.5
VCC = 1.65 V
–2
VCC = 2.3 V
–4
VCC = 2.7 V
–8
VCC = 3 V
IOL
Low-level output current
∆t/∆v
Input transition rise or fall rate
TA
Operating free-air temperature
4
V
V
V
mA
–12
VCC = 1.65 V
2
VCC = 2.3 V
4
VCC = 2.7 V
8
VCC = 3 V
(1)
V
VCC = 2.3 V to 2.7 V
Input voltage
V
0.65 × VCC
VCC = 1.65 V to 1.95 V
VIL
UNIT
mA
12
–40
10
ns/V
85
°C
All unused inputs of the device must be held at VCC or GND to ensure proper device operation. Refer to the TI application report,
Implications of Slow or Floating CMOS Inputs, literature number SCBA004.
SN74LVCR2245A
OCTAL BUS TRANSCEIVER
WITH 3-STATE OUTPUTS
www.ti.com
SCAS581M – NOVEMBER 1996 – REVISED MARCH 2005
Electrical Characteristics
over recommended operating free-air temperature range (unless otherwise noted)
PARAMETER
TEST CONDITIONS
IOH = –100 µA
1.65 V to 3.6 V
IOH = –2 mA
1.2
2.3 V
1.7
2.7 V
2.2
IOH = –6 mA
3V
2.4
IOH = –8 mA
2.7 V
2
IOH = –12 mA
3V
2
IOL = 100 µA
1.65 V to 3.6 V
0.2
1.65 V
0.45
2.3 V
0.7
IOL = 2 mA
IOL = 4 mA
VOL
II
UNIT
VCC – 0.2
1.65 V
IOH = –4 mA
VOH
MIN TYP (1) MAX
VCC
V
2.7 V
0.4
IOL = 6 mA
3V
0.55
IOL = 8 mA
2.7 V
0.6
IOL = 12 mA
3V
0.8
3.6 V
±5
µA
Control inputs VI = 0 to 5.5 V
V
Ioff
VI or VO = 5.5 V
0
±10
µA
IOZ (2)
VO = 0 to 5.5 V
3.6 V
±10
µA
VI = VCC or GND
ICC
IO = 0
3.6 V ≤ VI ≤ 5.5 V (3)
∆ICC
10
3.6 V
One input at VCC – 0.6 V, Other inputs at VCC or GND
µA
10
2.7 V to 3.6 V
µA
500
Ci
Control inputs VI = VCC or GND
3.3 V
4
pF
Cio
A or B ports
3.3 V
5.5
pF
(1)
(2)
(3)
VO = VCC or GND
All typical values are at VCC = 3.3 V, TA = 25°C.
For I/O ports, the parameter IOZ includes the input leakage current.
This applies in the disabled state only.
Switching Characteristics
over recommended operating free-air temperature range (unless otherwise noted) (see Figure 1)
FROM
(INPUT)
TO
(OUTPUT)
tpd
A or B
ten
OE
PARAMETER
tdis
OE
VCC = 1.8 V
± 0.15 V
VCC = 2.5 V
± 0.2 V
MIN
MAX
MIN
MAX
B or A
(1)
(1)
(1)
A or B
(1)
(1)
A or B
(1)
(1)
VCC = 2.7 V
MIN
VCC = 3.3 V
± 0.3 V
MIN
MAX
(1)
7.3
1.5
6.3
ns
(1)
(1)
9.5
1.5
8.2
ns
(1)
(1)
8.5
1.7
7.8
ns
1
ns
tsk(o)
(1)
UNIT
MAX
This information was not available at the time of publication.
Operating Characteristics
TA = 25°C
TEST
CONDITIONS
PARAMETER
Cpd
(1)
Power dissipation capacitance
per transceiver
Outputs enabled
Outputs disabled
f = 10 MHz
VCC = 1.8 V
VCC = 2.5 V
VCC = 3.3 V
TYP
TYP
TYP
(1)
(1)
48
(1)
(1)
4
UNIT
pF
This information was not available at the time of publication.
5
SN74LVCR2245A
OCTAL BUS TRANSCEIVER
WITH 3-STATE OUTPUTS
www.ti.com
SCAS581M – NOVEMBER 1996 – REVISED MARCH 2005
PARAMETER MEASUREMENT INFORMATION
VLOAD
S1
RL
From Output
Under Test
CL
(see Note A)
Open
GND
RL
TEST
S1
tPLH/tPHL
tPLZ/tPZL
tPHZ/tPZH
Open
VLOAD
GND
LOAD CIRCUIT
INPUTS
VCC
1.8 V ± 0.15 V
2.5 V ± 0.2 V
2.7 V
3.3 V ± 0.3 V
VI
tr/tf
VCC
VCC
2.7 V
2.7 V
≤2 ns
≤2 ns
≤2.5 ns
≤2.5 ns
VM
VLOAD
CL
RL
V∆
VCC/2
VCC/2
1.5 V
1.5 V
2 × VCC
2 × VCC
6V
6V
30 pF
30 pF
50 pF
50 pF
1 kΩ
500 Ω
500 Ω
500 Ω
0.15 V
0.15 V
0.3 V
0.3 V
VI
Timing Input
VM
0V
tw
tsu
VI
Input
VM
VM
th
VI
Data Input
VM
VM
0V
0V
VOLTAGE WAVEFORMS
PULSE DURATION
VOLTAGE WAVEFORMS
SETUP AND HOLD TIMES
VI
VM
Input
VM
0V
tPLH
VM
VM
VOL
tPHL
VM
VM
0V
Output
Waveform 1
S1 at VLOAD
(see Note B)
tPLH
tPLZ
VLOAD/2
VM
tPZH
VOH
Output
VM
tPZL
tPHL
VOH
Output
VI
Output
Control
VM
VOL
VOLTAGE WAVEFORMS
PROPAGATION DELAY TIMES
INVERTING AND NONINVERTING OUTPUTS
Output
Waveform 2
S1 at GND
(see Note B)
VOL + V∆
VOL
tPHZ
VM
VOH − V∆
VOH
≈0 V
VOLTAGE WAVEFORMS
ENABLE AND DISABLE TIMES
LOW- AND HIGH-LEVEL ENABLING
NOTES: A. CL includes probe and jig capacitance.
B. Waveform 1 is for an output with internal conditions such that the output is low, except when disabled by the output control.
Waveform 2 is for an output with internal conditions such that the output is high, except when disabled by the output control.
C. All input pulses are supplied by generators having the following characteristics: PRR ≤ 10 MHz, ZO = 50 Ω.
D. The outputs are measured one at a time, with one transition per measurement.
E. tPLZ and tPHZ are the same as tdis.
F. tPZL and tPZH are the same as ten.
G. tPLH and tPHL are the same as tpd.
H. All parameters and waveforms are not applicable to all devices.
Figure 1. Load Circuit and Voltage Waveforms
6
PACKAGE OPTION ADDENDUM
www.ti.com
4-Jun-2007
PACKAGING INFORMATION
Orderable Device
Status (1)
Package
Type
Package
Drawing
Pins Package Eco Plan (2)
Qty
74LVCR2245ADBQRE4
ACTIVE
SSOP/
QSOP
DBQ
20
2500 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
74LVCR2245ADBQRG4
ACTIVE
SSOP/
QSOP
DBQ
20
2500 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
74LVCR2245ADGVRE4
ACTIVE
TVSOP
DGV
20
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
74LVCR2245ADGVRG4
ACTIVE
TVSOP
DGV
20
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
74LVCR2245ARGYRG4
ACTIVE
QFN
RGY
20
1000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
SN74LVCR2245ADBLE
OBSOLETE
SSOP
DB
20
ACTIVE
SSOP/
QSOP
DBQ
20
2500 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
SN74LVCR2245ADBR
ACTIVE
SSOP
DB
20
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LVCR2245ADBRE4
ACTIVE
SSOP
DB
20
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LVCR2245ADBRG4
ACTIVE
SSOP
DB
20
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LVCR2245ADGVR
ACTIVE
TVSOP
DGV
20
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LVCR2245ADW
ACTIVE
SOIC
DW
20
25
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LVCR2245ADWE4
ACTIVE
SOIC
DW
20
25
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LVCR2245ADWG4
ACTIVE
SOIC
DW
20
25
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LVCR2245ADWR
ACTIVE
SOIC
DW
20
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LVCR2245ADWRE4
ACTIVE
SOIC
DW
20
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LVCR2245ADWRG4
ACTIVE
SOIC
DW
20
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LVCR2245AGQNR
NRND
GQN
20
1000
SNPB
Level-1-240C-UNLIM
SN74LVCR2245ANSR
ACTIVE
SO
NS
20
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LVCR2245ANSRE4
ACTIVE
SO
NS
20
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LVCR2245ANSRG4
ACTIVE
SO
NS
20
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LVCR2245APW
ACTIVE
TSSOP
PW
20
70
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LVCR2245APWE4
ACTIVE
TSSOP
PW
20
70
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LVCR2245APWG4
ACTIVE
TSSOP
PW
20
70
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LVCR2245APWLE
OBSOLETE
TSSOP
PW
20
TBD
Call TI
Addendum-Page 1
TBD
Call TI
MSL Peak Temp (3)
SN74LVCR2245ADBQR
BGA MI
CROSTA
R JUNI
OR
TBD
Lead/Ball Finish
Call TI
Call TI
PACKAGE OPTION ADDENDUM
www.ti.com
4-Jun-2007
Orderable Device
Status (1)
Package
Type
Package
Drawing
SN74LVCR2245APWR
ACTIVE
TSSOP
PW
20
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LVCR2245APWRE4
ACTIVE
TSSOP
PW
20
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LVCR2245APWRG4
ACTIVE
TSSOP
PW
20
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LVCR2245APWT
ACTIVE
TSSOP
PW
20
250
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LVCR2245APWTE4
ACTIVE
TSSOP
PW
20
250
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LVCR2245APWTG4
ACTIVE
TSSOP
PW
20
250
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LVCR2245ARGYR
ACTIVE
QFN
RGY
20
1000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
SN74LVCR2245AZQNR
ACTIVE
ZQN
20
1000 Green (RoHS &
no Sb/Br)
SNAGCU
Level-1-260C-UNLIM
BGA MI
CROSTA
R JUNI
OR
Pins Package Eco Plan (2)
Qty
Lead/Ball Finish
MSL Peak Temp (3)
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
Addendum-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com
19-May-2007
TAPE AND REEL INFORMATION
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
Device
19-May-2007
Package Pins
Site
Reel
Diameter
(mm)
Reel
Width
(mm)
A0 (mm)
B0 (mm)
K0 (mm)
P1
(mm)
W
Pin1
(mm) Quadrant
SN74LVCR2245ADBQR
DBQ
20
MLA
330
16
6.5
9.0
2.1
8
16
Q1
SN74LVCR2245ADBR
DB
20
MLA
330
16
8.2
7.5
2.5
12
16
Q1
SN74LVCR2245ADGVR
DGV
20
MLA
330
12
7.0
5.6
1.6
8
12
Q1
SN74LVCR2245ADWR
DW
20
MLA
330
24
10.8
13.0
2.7
12
24
Q1
SN74LVCR2245AGQNR
GQN
20
HIJ
330
12
3.3
4.3
1.5
8
12
Q1
SN74LVCR2245ANSR
NS
20
MLA
330
24
8.2
13.0
2.5
12
24
Q1
SN74LVCR2245APWR
PW
20
MLA
330
16
6.95
7.1
1.6
8
16
Q1
SN74LVCR2245ARGYR
RGY
20
MLA
180
12
3.8
4.8
1.6
8
12
Q1
SN74LVCR2245AZQNR
ZQN
20
HIJ
330
12
3.3
4.3
1.5
8
12
Q1
TAPE AND REEL BOX INFORMATION
Device
Package
Pins
Site
Length (mm)
Width (mm)
Height (mm)
SN74LVCR2245ADBQR
DBQ
20
MLA
0.0
0.0
0.0
SN74LVCR2245ADBR
DB
20
MLA
342.9
336.6
28.58
SN74LVCR2245ADGVR
DGV
20
MLA
338.1
340.5
20.64
31.75
SN74LVCR2245ADWR
DW
20
MLA
333.2
333.2
SN74LVCR2245AGQNR
GQN
20
HIJ
346.0
346.0
29.0
SN74LVCR2245ANSR
NS
20
MLA
333.2
333.2
31.75
SN74LVCR2245APWR
PW
20
MLA
342.9
336.6
28.58
SN74LVCR2245ARGYR
RGY
20
MLA
190.0
212.7
31.75
SN74LVCR2245AZQNR
ZQN
20
HIJ
346.0
346.0
29.0
Pack Materials-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com
19-May-2007
Pack Materials-Page 3
MECHANICAL DATA
MPDS006C – FEBRUARY 1996 – REVISED AUGUST 2000
DGV (R-PDSO-G**)
PLASTIC SMALL-OUTLINE
24 PINS SHOWN
0,40
0,23
0,13
24
13
0,07 M
0,16 NOM
4,50
4,30
6,60
6,20
Gage Plane
0,25
0°–8°
1
0,75
0,50
12
A
Seating Plane
0,15
0,05
1,20 MAX
PINS **
0,08
14
16
20
24
38
48
56
A MAX
3,70
3,70
5,10
5,10
7,90
9,80
11,40
A MIN
3,50
3,50
4,90
4,90
7,70
9,60
11,20
DIM
4073251/E 08/00
NOTES: A.
B.
C.
D.
All linear dimensions are in millimeters.
This drawing is subject to change without notice.
Body dimensions do not include mold flash or protrusion, not to exceed 0,15 per side.
Falls within JEDEC: 24/48 Pins – MO-153
14/16/20/56 Pins – MO-194
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
MECHANICAL DATA
MSSO002E – JANUARY 1995 – REVISED DECEMBER 2001
DB (R-PDSO-G**)
PLASTIC SMALL-OUTLINE
28 PINS SHOWN
0,38
0,22
0,65
28
0,15 M
15
0,25
0,09
8,20
7,40
5,60
5,00
Gage Plane
1
14
0,25
A
0°–ā8°
0,95
0,55
Seating Plane
2,00 MAX
0,10
0,05 MIN
PINS **
14
16
20
24
28
30
38
A MAX
6,50
6,50
7,50
8,50
10,50
10,50
12,90
A MIN
5,90
5,90
6,90
7,90
9,90
9,90
12,30
DIM
4040065 /E 12/01
NOTES: A.
B.
C.
D.
All linear dimensions are in millimeters.
This drawing is subject to change without notice.
Body dimensions do not include mold flash or protrusion not to exceed 0,15.
Falls within JEDEC MO-150
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
MECHANICAL DATA
MTSS001C – JANUARY 1995 – REVISED FEBRUARY 1999
PW (R-PDSO-G**)
PLASTIC SMALL-OUTLINE PACKAGE
14 PINS SHOWN
0,30
0,19
0,65
14
0,10 M
8
0,15 NOM
4,50
4,30
6,60
6,20
Gage Plane
0,25
1
7
0°– 8°
A
0,75
0,50
Seating Plane
0,15
0,05
1,20 MAX
PINS **
0,10
8
14
16
20
24
28
A MAX
3,10
5,10
5,10
6,60
7,90
9,80
A MIN
2,90
4,90
4,90
6,40
7,70
9,60
DIM
4040064/F 01/97
NOTES: A.
B.
C.
D.
All linear dimensions are in millimeters.
This drawing is subject to change without notice.
Body dimensions do not include mold flash or protrusion not to exceed 0,15.
Falls within JEDEC MO-153
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
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