SN74LVCR2245A OCTAL BUS TRANSCEIVER WITH 3-STATE OUTPUTS www.ti.com SCAS581M – NOVEMBER 1996 – REVISED MARCH 2005 FEATURES • • • • • • • DB, DBQ, DGV, DW, NS, OR PW PACKAGE (TOP VIEW) 20 2 19 3 18 4 17 5 16 6 15 7 14 8 13 9 12 10 11 VCC OE B1 B2 B3 B4 B5 B6 B7 B8 A1 A2 A3 A4 A5 A6 A7 A8 VCC 1 1 20 2 19 OE 3 18 B1 4 17 B2 16 B3 5 6 15 B4 14 B5 7 13 B6 12 B7 8 9 10 11 B8 DIR A1 A2 A3 A4 A5 A6 A7 A8 GND RGY PACKAGE (TOP VIEW) DIR • • Supports Mixed-Mode Signal Operation on All Ports (5-V Input/Output Voltage With 3.3-V VCC) Ioff Supports Partial-Power-Down Mode Operation Latch-Up Performance Exceeds 250 mA Per JESD 17 ESD Protection Exceeds JESD 22 – 2000-V Human-Body Model (A114-A) – 1000-V Charged-Device Model (C101) GND • Operates From 1.65 V to 3.6 V Inputs Accept Voltages to 5.5 V Max tpd of 6.3 ns at 3.3 V All Outputs Have Equivalent 26-Ω Series Resistors, So No External Resistors Are Required Typical VOLP (Output Ground Bounce) <0.8 V at VCC = 3.3 V, TA = 25°C Typical VOHV (Output VOH Undershoot) >2 V at VCC = 3.3 V, TA = 25°C DESCRIPTION/ORDERING INFORMATION ORDERING INFORMATION PACKAGE (1) TA QFN – RGY Tube of 25 SN74LVCR2245ADW Reel of 2000 SN74LVCR2245ADWR SOP – NS Reel of 2000 SN74LVCR2245ANSR LVCR2245A SSOP – DB Reel of 2000 SN74LVCR2245ADBR LER245A SSOP (QSOP) – DBQ Reel of 2500 SN74LVCR2245ADBQR LVCR2245A Tube of 70 SN74LVCR2245APW Reel of 2000 SN74LVCR2245APWR Reel of 250 SN74LVCR2245APWT Reel of 2000 SN74LVCR2245ADGVR TSSOP – PW TVSOP – DGV VFBGA – GQN VFBGA – ZQN (Pb-free) (1) TOP-SIDE MARKING SN74LVCR2245ARGYR SOIC – DW –40°C to 85°C ORDERABLE PART NUMBER Reel of 1000 Reel of 1000 SN74LVCR2245AGQNR SN74LVCR2245AZQNR LER245A LVCR2245A LER245A LER245A LER245A Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at www.ti.com/sc/package. Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. Copyright © 1996–2005, Texas Instruments Incorporated SN74LVCR2245A OCTAL BUS TRANSCEIVER WITH 3-STATE OUTPUTS www.ti.com SCAS581M – NOVEMBER 1996 – REVISED MARCH 2005 DESCRIPTION/ORDERING INFORMATION (CONTINUED) This octal bus transceiver is designed for 1.65-V to 3.6-V VCC operation. The SN74LVCR2245A is designed for asynchronous communication between data buses. The device transmits data from the A bus to the B bus or from the B bus to the A bus, depending on the logic level at the direction-control (DIR) input. The output-enable (OE) input can be used to disable the device so the buses are effectively isolated. All outputs, which are designed to sink up to 12 mA, include equivalent 26-Ω resistors to reduce overshoot and undershoot. Inputs can be driven from either 3.3-V or 5-V devices. This feature allows the use of this device as a translator in a mixed 3.3-V/5-V system environment. This device is fully specified for partial-power-down applications using Ioff. The Ioff circuitry disables the outputs, preventing damaging current backflow through the device when it is powered down. To ensure the high-impedance state during power up or power down, OE should be tied to VCC through a pullup resistor; the minimum value of the resistor is determined by the current-sinking capability of the driver. GQN OR ZQN PACKAGE (TOP VIEW) 1 2 3 4 A B C D E TERMINAL ASSIGNMENTS 1 2 3 4 A A1 DIR VCC OE B A3 B2 A2 B1 C A5 A4 B4 B3 D A7 B6 A6 B5 E GND A8 B8 B7 FUNCTION TABLE INPUTS OE 2 DIR OPERATION L L B data to A bus L H A data to B bus H X Isolation SN74LVCR2245A OCTAL BUS TRANSCEIVER WITH 3-STATE OUTPUTS www.ti.com SCAS581M – NOVEMBER 1996 – REVISED MARCH 2005 LOGIC DIAGRAM (POSITIVE LOGIC) DIR 1 19 A1 OE 2 18 B1 To Seven Other Channels Pin numbers shown are for the DB, DBQ, DGV, DW, NS, PW, and RGY packages. Absolute Maximum Ratings (1) over operating free-air temperature range (unless otherwise noted) MIN MAX VCC Supply voltage range –0.5 6.5 V VI Input voltage range (2) –0.5 6.5 V –0.5 6.5 V –0.5 VCC + 0.5 state (2) UNIT VO Voltage range applied to any output in the high-impedance or power-off VO Voltage range applied to any output in the high or low state (2) (3) IIK Input clamp current VI < 0 –50 mA IOK Output clamp current VO < 0 –50 mA IO Continuous output current ±50 mA ±100 mA Continuous current through VCC or GND θJA Package thermal impedance DB package (4) 70 DBQ package (4) 68 DGV package (4) 92 DW package (4) 58 GQN/ZQN (1) (2) (3) (4) (5) Storage temperature range 78 NS package (4) 60 PW package (4) 83 RGY Tstg package (4) package (5) V °C/W 37 –65 150 °C Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. The input negative-voltage and output voltage ratings may be exceeded if the input and output current ratings are observed. The value of VCC is provided in the recommended operating conditions table. The package thermal impedance is calculated in accordance with JESD 51-7. The package thermal impedance is calculated in accordance with JESD 51-5. 3 SN74LVCR2245A OCTAL BUS TRANSCEIVER WITH 3-STATE OUTPUTS www.ti.com SCAS581M – NOVEMBER 1996 – REVISED MARCH 2005 Recommended Operating Conditions (1) VCC Supply voltage Operating Data retention only VCC = 1.65 V to 1.95 V VIH High-level input voltage MIN MAX 1.65 3.6 1.5 Low-level input voltage VI VCC = 2.3 V to 2.7 V 1.7 VCC = 2.7 V to 3.6 V 2 VO Output voltage IOH High-level output current 0.35 × VCC 0.7 VCC = 2.7 V to 3.6 V 0.8 0 5.5 High or low state 0 VCC 3-state 0 5.5 VCC = 1.65 V –2 VCC = 2.3 V –4 VCC = 2.7 V –8 VCC = 3 V IOL Low-level output current ∆t/∆v Input transition rise or fall rate TA Operating free-air temperature 4 V V V mA –12 VCC = 1.65 V 2 VCC = 2.3 V 4 VCC = 2.7 V 8 VCC = 3 V (1) V VCC = 2.3 V to 2.7 V Input voltage V 0.65 × VCC VCC = 1.65 V to 1.95 V VIL UNIT mA 12 –40 10 ns/V 85 °C All unused inputs of the device must be held at VCC or GND to ensure proper device operation. Refer to the TI application report, Implications of Slow or Floating CMOS Inputs, literature number SCBA004. SN74LVCR2245A OCTAL BUS TRANSCEIVER WITH 3-STATE OUTPUTS www.ti.com SCAS581M – NOVEMBER 1996 – REVISED MARCH 2005 Electrical Characteristics over recommended operating free-air temperature range (unless otherwise noted) PARAMETER TEST CONDITIONS IOH = –100 µA 1.65 V to 3.6 V IOH = –2 mA 1.2 2.3 V 1.7 2.7 V 2.2 IOH = –6 mA 3V 2.4 IOH = –8 mA 2.7 V 2 IOH = –12 mA 3V 2 IOL = 100 µA 1.65 V to 3.6 V 0.2 1.65 V 0.45 2.3 V 0.7 IOL = 2 mA IOL = 4 mA VOL II UNIT VCC – 0.2 1.65 V IOH = –4 mA VOH MIN TYP (1) MAX VCC V 2.7 V 0.4 IOL = 6 mA 3V 0.55 IOL = 8 mA 2.7 V 0.6 IOL = 12 mA 3V 0.8 3.6 V ±5 µA Control inputs VI = 0 to 5.5 V V Ioff VI or VO = 5.5 V 0 ±10 µA IOZ (2) VO = 0 to 5.5 V 3.6 V ±10 µA VI = VCC or GND ICC IO = 0 3.6 V ≤ VI ≤ 5.5 V (3) ∆ICC 10 3.6 V One input at VCC – 0.6 V, Other inputs at VCC or GND µA 10 2.7 V to 3.6 V µA 500 Ci Control inputs VI = VCC or GND 3.3 V 4 pF Cio A or B ports 3.3 V 5.5 pF (1) (2) (3) VO = VCC or GND All typical values are at VCC = 3.3 V, TA = 25°C. For I/O ports, the parameter IOZ includes the input leakage current. This applies in the disabled state only. Switching Characteristics over recommended operating free-air temperature range (unless otherwise noted) (see Figure 1) FROM (INPUT) TO (OUTPUT) tpd A or B ten OE PARAMETER tdis OE VCC = 1.8 V ± 0.15 V VCC = 2.5 V ± 0.2 V MIN MAX MIN MAX B or A (1) (1) (1) A or B (1) (1) A or B (1) (1) VCC = 2.7 V MIN VCC = 3.3 V ± 0.3 V MIN MAX (1) 7.3 1.5 6.3 ns (1) (1) 9.5 1.5 8.2 ns (1) (1) 8.5 1.7 7.8 ns 1 ns tsk(o) (1) UNIT MAX This information was not available at the time of publication. Operating Characteristics TA = 25°C TEST CONDITIONS PARAMETER Cpd (1) Power dissipation capacitance per transceiver Outputs enabled Outputs disabled f = 10 MHz VCC = 1.8 V VCC = 2.5 V VCC = 3.3 V TYP TYP TYP (1) (1) 48 (1) (1) 4 UNIT pF This information was not available at the time of publication. 5 SN74LVCR2245A OCTAL BUS TRANSCEIVER WITH 3-STATE OUTPUTS www.ti.com SCAS581M – NOVEMBER 1996 – REVISED MARCH 2005 PARAMETER MEASUREMENT INFORMATION VLOAD S1 RL From Output Under Test CL (see Note A) Open GND RL TEST S1 tPLH/tPHL tPLZ/tPZL tPHZ/tPZH Open VLOAD GND LOAD CIRCUIT INPUTS VCC 1.8 V ± 0.15 V 2.5 V ± 0.2 V 2.7 V 3.3 V ± 0.3 V VI tr/tf VCC VCC 2.7 V 2.7 V ≤2 ns ≤2 ns ≤2.5 ns ≤2.5 ns VM VLOAD CL RL V∆ VCC/2 VCC/2 1.5 V 1.5 V 2 × VCC 2 × VCC 6V 6V 30 pF 30 pF 50 pF 50 pF 1 kΩ 500 Ω 500 Ω 500 Ω 0.15 V 0.15 V 0.3 V 0.3 V VI Timing Input VM 0V tw tsu VI Input VM VM th VI Data Input VM VM 0V 0V VOLTAGE WAVEFORMS PULSE DURATION VOLTAGE WAVEFORMS SETUP AND HOLD TIMES VI VM Input VM 0V tPLH VM VM VOL tPHL VM VM 0V Output Waveform 1 S1 at VLOAD (see Note B) tPLH tPLZ VLOAD/2 VM tPZH VOH Output VM tPZL tPHL VOH Output VI Output Control VM VOL VOLTAGE WAVEFORMS PROPAGATION DELAY TIMES INVERTING AND NONINVERTING OUTPUTS Output Waveform 2 S1 at GND (see Note B) VOL + V∆ VOL tPHZ VM VOH − V∆ VOH ≈0 V VOLTAGE WAVEFORMS ENABLE AND DISABLE TIMES LOW- AND HIGH-LEVEL ENABLING NOTES: A. CL includes probe and jig capacitance. B. Waveform 1 is for an output with internal conditions such that the output is low, except when disabled by the output control. Waveform 2 is for an output with internal conditions such that the output is high, except when disabled by the output control. C. All input pulses are supplied by generators having the following characteristics: PRR ≤ 10 MHz, ZO = 50 Ω. D. The outputs are measured one at a time, with one transition per measurement. E. tPLZ and tPHZ are the same as tdis. F. tPZL and tPZH are the same as ten. G. tPLH and tPHL are the same as tpd. H. All parameters and waveforms are not applicable to all devices. Figure 1. Load Circuit and Voltage Waveforms 6 PACKAGE OPTION ADDENDUM www.ti.com 4-Jun-2007 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Drawing Pins Package Eco Plan (2) Qty 74LVCR2245ADBQRE4 ACTIVE SSOP/ QSOP DBQ 20 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR 74LVCR2245ADBQRG4 ACTIVE SSOP/ QSOP DBQ 20 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR 74LVCR2245ADGVRE4 ACTIVE TVSOP DGV 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 74LVCR2245ADGVRG4 ACTIVE TVSOP DGV 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 74LVCR2245ARGYRG4 ACTIVE QFN RGY 20 1000 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR SN74LVCR2245ADBLE OBSOLETE SSOP DB 20 ACTIVE SSOP/ QSOP DBQ 20 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR SN74LVCR2245ADBR ACTIVE SSOP DB 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LVCR2245ADBRE4 ACTIVE SSOP DB 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LVCR2245ADBRG4 ACTIVE SSOP DB 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LVCR2245ADGVR ACTIVE TVSOP DGV 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LVCR2245ADW ACTIVE SOIC DW 20 25 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LVCR2245ADWE4 ACTIVE SOIC DW 20 25 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LVCR2245ADWG4 ACTIVE SOIC DW 20 25 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LVCR2245ADWR ACTIVE SOIC DW 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LVCR2245ADWRE4 ACTIVE SOIC DW 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LVCR2245ADWRG4 ACTIVE SOIC DW 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LVCR2245AGQNR NRND GQN 20 1000 SNPB Level-1-240C-UNLIM SN74LVCR2245ANSR ACTIVE SO NS 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LVCR2245ANSRE4 ACTIVE SO NS 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LVCR2245ANSRG4 ACTIVE SO NS 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LVCR2245APW ACTIVE TSSOP PW 20 70 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LVCR2245APWE4 ACTIVE TSSOP PW 20 70 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LVCR2245APWG4 ACTIVE TSSOP PW 20 70 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LVCR2245APWLE OBSOLETE TSSOP PW 20 TBD Call TI Addendum-Page 1 TBD Call TI MSL Peak Temp (3) SN74LVCR2245ADBQR BGA MI CROSTA R JUNI OR TBD Lead/Ball Finish Call TI Call TI PACKAGE OPTION ADDENDUM www.ti.com 4-Jun-2007 Orderable Device Status (1) Package Type Package Drawing SN74LVCR2245APWR ACTIVE TSSOP PW 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LVCR2245APWRE4 ACTIVE TSSOP PW 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LVCR2245APWRG4 ACTIVE TSSOP PW 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LVCR2245APWT ACTIVE TSSOP PW 20 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LVCR2245APWTE4 ACTIVE TSSOP PW 20 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LVCR2245APWTG4 ACTIVE TSSOP PW 20 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LVCR2245ARGYR ACTIVE QFN RGY 20 1000 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR SN74LVCR2245AZQNR ACTIVE ZQN 20 1000 Green (RoHS & no Sb/Br) SNAGCU Level-1-260C-UNLIM BGA MI CROSTA R JUNI OR Pins Package Eco Plan (2) Qty Lead/Ball Finish MSL Peak Temp (3) (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. Addendum-Page 2 PACKAGE MATERIALS INFORMATION www.ti.com 19-May-2007 TAPE AND REEL INFORMATION Pack Materials-Page 1 PACKAGE MATERIALS INFORMATION www.ti.com Device 19-May-2007 Package Pins Site Reel Diameter (mm) Reel Width (mm) A0 (mm) B0 (mm) K0 (mm) P1 (mm) W Pin1 (mm) Quadrant SN74LVCR2245ADBQR DBQ 20 MLA 330 16 6.5 9.0 2.1 8 16 Q1 SN74LVCR2245ADBR DB 20 MLA 330 16 8.2 7.5 2.5 12 16 Q1 SN74LVCR2245ADGVR DGV 20 MLA 330 12 7.0 5.6 1.6 8 12 Q1 SN74LVCR2245ADWR DW 20 MLA 330 24 10.8 13.0 2.7 12 24 Q1 SN74LVCR2245AGQNR GQN 20 HIJ 330 12 3.3 4.3 1.5 8 12 Q1 SN74LVCR2245ANSR NS 20 MLA 330 24 8.2 13.0 2.5 12 24 Q1 SN74LVCR2245APWR PW 20 MLA 330 16 6.95 7.1 1.6 8 16 Q1 SN74LVCR2245ARGYR RGY 20 MLA 180 12 3.8 4.8 1.6 8 12 Q1 SN74LVCR2245AZQNR ZQN 20 HIJ 330 12 3.3 4.3 1.5 8 12 Q1 TAPE AND REEL BOX INFORMATION Device Package Pins Site Length (mm) Width (mm) Height (mm) SN74LVCR2245ADBQR DBQ 20 MLA 0.0 0.0 0.0 SN74LVCR2245ADBR DB 20 MLA 342.9 336.6 28.58 SN74LVCR2245ADGVR DGV 20 MLA 338.1 340.5 20.64 31.75 SN74LVCR2245ADWR DW 20 MLA 333.2 333.2 SN74LVCR2245AGQNR GQN 20 HIJ 346.0 346.0 29.0 SN74LVCR2245ANSR NS 20 MLA 333.2 333.2 31.75 SN74LVCR2245APWR PW 20 MLA 342.9 336.6 28.58 SN74LVCR2245ARGYR RGY 20 MLA 190.0 212.7 31.75 SN74LVCR2245AZQNR ZQN 20 HIJ 346.0 346.0 29.0 Pack Materials-Page 2 PACKAGE MATERIALS INFORMATION www.ti.com 19-May-2007 Pack Materials-Page 3 MECHANICAL DATA MPDS006C – FEBRUARY 1996 – REVISED AUGUST 2000 DGV (R-PDSO-G**) PLASTIC SMALL-OUTLINE 24 PINS SHOWN 0,40 0,23 0,13 24 13 0,07 M 0,16 NOM 4,50 4,30 6,60 6,20 Gage Plane 0,25 0°–8° 1 0,75 0,50 12 A Seating Plane 0,15 0,05 1,20 MAX PINS ** 0,08 14 16 20 24 38 48 56 A MAX 3,70 3,70 5,10 5,10 7,90 9,80 11,40 A MIN 3,50 3,50 4,90 4,90 7,70 9,60 11,20 DIM 4073251/E 08/00 NOTES: A. B. C. D. All linear dimensions are in millimeters. This drawing is subject to change without notice. Body dimensions do not include mold flash or protrusion, not to exceed 0,15 per side. Falls within JEDEC: 24/48 Pins – MO-153 14/16/20/56 Pins – MO-194 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 MECHANICAL DATA MSSO002E – JANUARY 1995 – REVISED DECEMBER 2001 DB (R-PDSO-G**) PLASTIC SMALL-OUTLINE 28 PINS SHOWN 0,38 0,22 0,65 28 0,15 M 15 0,25 0,09 8,20 7,40 5,60 5,00 Gage Plane 1 14 0,25 A 0°–ā8° 0,95 0,55 Seating Plane 2,00 MAX 0,10 0,05 MIN PINS ** 14 16 20 24 28 30 38 A MAX 6,50 6,50 7,50 8,50 10,50 10,50 12,90 A MIN 5,90 5,90 6,90 7,90 9,90 9,90 12,30 DIM 4040065 /E 12/01 NOTES: A. B. C. D. All linear dimensions are in millimeters. This drawing is subject to change without notice. Body dimensions do not include mold flash or protrusion not to exceed 0,15. Falls within JEDEC MO-150 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 MECHANICAL DATA MTSS001C – JANUARY 1995 – REVISED FEBRUARY 1999 PW (R-PDSO-G**) PLASTIC SMALL-OUTLINE PACKAGE 14 PINS SHOWN 0,30 0,19 0,65 14 0,10 M 8 0,15 NOM 4,50 4,30 6,60 6,20 Gage Plane 0,25 1 7 0°– 8° A 0,75 0,50 Seating Plane 0,15 0,05 1,20 MAX PINS ** 0,10 8 14 16 20 24 28 A MAX 3,10 5,10 5,10 6,60 7,90 9,80 A MIN 2,90 4,90 4,90 6,40 7,70 9,60 DIM 4040064/F 01/97 NOTES: A. B. C. D. All linear dimensions are in millimeters. This drawing is subject to change without notice. Body dimensions do not include mold flash or protrusion not to exceed 0,15. Falls within JEDEC MO-153 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements, improvements, and other changes to its products and services at any time and to discontinue any product or service without notice. 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