DBLECTRO WH2002A-Y-JCS

DB LECTRO Inc.
SPECIFICATION
CUSTOMER
Ver:0
:
MODULE NO.:
WP2002A-Y-JCS
APPROVED BY:
( FOR CUSTOMER USE ONLY )
SALES BY
APPROVED BY
CHECKED BY
PREPARED BY
ISSUED DATE:
第 1 頁,共 18 頁
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Version modify record
NO. Version
Date
Modify contents
第 2 頁,共 18 頁
Page
Remarks
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Contents
1.Module Classification Information
2.Precautions in use of LCD Modules
3.General Specification
4.Absolute Maximum Ratings
5.Electrical Characteristics
6.Optical Characteristics
7.Interface Pin Function
8.Contour Drawing & Block Diagram
9.Function Description
10.Character Generator ROM Pattern
11.Instruction Table
12.Timing Characteristics
13.Initializing of LCM
14.Quality Assurance
15.Reliability
第 3 頁,共 18 頁
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1.Module Classification Information
WP
2002 A-Y-
cd
c
d
e
f
g
6
○
e
f
JCS
g
6
○
Brand:DB LECTRO Inc.
Display Type:H→Character Type, G→Graphic Type , P→PLED
Display Font:Character 16 words, 2Lines.
Model serials no.
Backlight Type: Y→Yellow Green
Special Code
JCS: English and Japanese standard font
2.Precautions in use of PLED Modules
(1)Avoid applying excessive shocks to the module or making any alterations or modifications to
it.
(2)Don’t make extra holes on the printed circuit board, modify its shape or change the
components of PLED module.
(3)Don’t disassemble the PLEDM.
(4)Don’t operate it above the absolute maximum rating.
(5)Don’t drop, bend or twist PLEDM.
(6)Soldering: only to the I/O terminals.
(7)Storage: please storage in anti-static electricity container and clean environment.
3.General Specification
Item
Dimension
Unit
20 characters x 2 Lines
-
116.0 x 37.0 x 9.5(MAX)
mm
View area
75.0 x 16.0
mm
Active area
71.37 x 11.87
mm
Dot size
0.57 x 0.67
mm
Dot pitch
0.6 x 0.7
mm
Character size
2.97 x 5.57
mm
Character pitch
3.60 x 6.30
mm
Number of Characters
Module dimension
LCD type
PLED , Green
Duty
1/16
第 4 頁,共 18 頁
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4.Absolute Maximum Ratings
Item
Symbol
Min
Typ
Max
Unit
Operating Temperature
TOP
-20
25
+50
℃
Storage Temperature
TST
-30
-
+70
℃
Input Voltage
VI
-0.3
-
VDD
V
Supply Voltage For Logic
VDD-VSS
-0.3
-
7
V
Supply Voltage For LCD
VBT- VSS
-0.3
-
5.0
V
5.Electrical Characteristics
Item
Symbol
Condition
Min
Typ
Max
Unit
Supply Voltage For Logic
VDD-VSS
-
4.5
5.0
5.5
V
Supply Voltage For LCD
VBT
Ta=25℃
2.0
2.5
5.0
V
Input High Volt.
VIH
-
0.7 VDD
-
VDD
V
Input Low Volt.
VIL
-
-0.3
-
0.55
V
Output High Volt.
VOH
-
2.4
-
-
V
Output Low Volt.
VOL
-
-
-
0.4
V
Supply Current
IDD
VDD=5V
-
0.35
0.6
mA
Min
Typ
Max
Unit
6.Optical Characteristics
Item
Symbol
Condition
(V)θ
80
deg
(H)φ
80
deg
View Angle
Contrast Ratio
-
T rise
-
10
us
T fall
-
10
us
With polarizer
40
nits
第 5 頁,共 18 頁
100
-
100 lux
Response Time
Brightness
-
CR
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7.Interface Pin Function
Pin No. Symbol
Level
Description
1
VSS
0V
Ground
2
VDD
5.0V
3
※VBT
4
RS
H/L
H: DATA, L: Instruction code
5
R/W
H/L
H: Read(MPU→Module) L: Write(MPU→Module)
6
E
H,H→L
7
DB0
H/L
Data bit 0
8
DB1
H/L
Data bit 1
9
DB2
H/L
Data bit 2
10
DB3
H/L
Data bit 3
11
DB4
H/L
Data bit 4
12
DB5
H/L
Data bit 5
13
DB6
H/L
Data bit 6
14
DB7
H/L
Data bit 7
15
NC
-
16
NC
-
Supply Voltage for logic
(Variable) Operating voltage for PLED Brightness adjhstment
Chip enable signal
※Brightness Control
VBT Brightness(nits) Power consumption(measured with random texts)
2.5V 20(typical)
50mW
3.0V 45(typical)
63mW
Note:1.When random texts pattern is running,averagely,at any instance,about 1/4 of pixels will be
on.
2.If VBT is not operated within 2V and 3V,non-uniformity display may occur.
3.You have to use the saving mode by VBT 2.5V in order to make long life.
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8.Contour Drawing &Block Diagram
116
93
75.0(VA)
71.37(AA)
6.5 4
9.5 MAX
4.9
15
2
1
18.5
16
4
29
37.0 0.5
31.2
16(VA)
11.87(AA)
4
2.9
4 8.5
59.0
4.0
4- 3.5 PTH
4- 5.5 PAD
108
2.97
2.5
1
PIN DETAIL
80 series
or
68 series
RS
R/W
E
DB0~DB7
Vdd
Vbt
Vss
DOT SIZE
SCALE 5/1
Com1~16
Controller/Com Driver
20X2 LCD
Bias and
Power Circuit
MPU
Vss
Vdd
Vo
RS
R/W
E
DB0
DB1
DB2
DB3
DB4
DB5
DB6
DB7
NC
NC
5.57
0.7
0.67
2
0.73
(P2.54*7)
17.78
8.34
15
0.63
0.6
0.57
2.54
16
1.6
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
D
Seg Driver
M
CL1
CL2
Vdd,Vss,V1~V5
Character located 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16
DDRAM address 00 01 02 03 04 05 06 07 08 09 0A 0B 0C 0D 0E 0F
DDRAM address 40 41 42 43 44 45 46 47 48 49 4A 4B 4C 4D 4E 4F
第 7 頁,共 18 頁
~
20
13
53
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9.Function Description
The LCD display Module is built in a LSI controller, the controller has two 8-bit registers, an
instruction register (IR) and a data register (DR).
The IR stores instruction codes, such as display clear and cursor shift, and address information
for display data RAM (DDRAM) and character generator (CGRAM). The IR can only be written
from the MPU. The DR temporarily stores data to be written or read from DDRAM or
CGRAM. When address information is written into the IR, then data is stored into the DR from
DDRAM or CGRAM. By the register selector (RS) signal, these two registers can be selected.
RS
R/W
Operation
0
0
IR write as an internal operation (display clear, etc.)
0
1
Read busy flag (DB7) and address counter (DB0 to DB7)
1
0
Write data to DDRAM or CGRAM (DR to DDRAM or CGRAM)
1
1
Read data from DDRAM or CGRAM (DDRAM or CGRAM to DR)
Busy Flag (BF)
When the busy flag is 1, the controller LSI is in the internal operation mode, and the next
instruction will not be accepted. When RS=0 and R/W=1, the busy flag is output to DB7.
next instruction must be written after ensuring that the busy flag is 0.
The
Address Counter (AC)
The address counter (AC) assigns addresses to both DDRAM and CGRAM
Display Data RAM (DDRAM)
This DDRAM is used to store the display data represented in 8-bit character codes. Its extended
capacity is 80×8 bits or 80 characters. Below figure is the relationships between DDRAM
addresses and positions on the liquid crystal display.
High bits
Low bits
Example: DDRAM addresses 4E
AC
(hexadecimal)
AC6 AC5 AC4 AC3 AC2 AC1 AC0
第 8 頁,共 18 頁
1
0
0
1
1
1
0
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Display position DDRAM address
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
00 01 02 03 04 05 06 07 08 09 0A 0B 0C 0D 0E 0F
40 41 42 43 44 45 46 47 48 49 4A 4B 4C 4D 4E 4F
2-Line by 16-Character Display
Character Generator ROM (CGROM)
The CGROM generate 5×8 dot or 5×10 dot character patterns from 8-bit character codes. See
Table 2.
Character Generator RAM (CGRAM)
In CGRAM, the user can rewrite character by program. For 5×8 dots, eight character patterns
can be written, and for 5×10 dots, four character patterns can be written.
Write into DDRAM the character code at the addresses shown as the left column of table 1. To
show the character patterns stored in CGRAM.
第 9 頁,共 18 頁
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Relationship between CGRAM Addresses, Character Codes (DDRAM) and Character
patterns
Table 1.
F o r 5 * 8 d o t c h a ra c te r p a tte rn s
C h a ra c te r C o d e s
( D D R A M d a ta )
7
6
5
4
3
H ig h
0
0
0
0
0
0
0
0
0
2
1
0
Low
0
0
0
* 0
* 0
*
1
0
0
1
C h a ra c te r P a tte rn s
( C G R A M d a ta )
C G R A M A d d re ss
5
4
3
2
1
0
7
Low
0 0
0 0
0 1
0 1
0 0 0 1 0
1 0
1 1
1 1
0 0
0 0
0 1
0 1
0 0 1
1 0
1 0
1 1
1 1
0 0
0 0
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
*
*
*
*
*
*
*
*
*
*
*
*
*
*
*
*
*
H ig h
0
1
1
1
1
1
1
1
1
1
0
0
1
1
0
1
0
1
*
6
5
H ig h
* *
* *
* *
* *
* *
* *
* *
* *
* *
* *
* *
* *
* *
* *
* *
* *
* *
*
4
3
2
1
0
Low
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
C h a ra c te r
p a tte rn ( 1 )
0
0
0
0
C u rs o r p a tte rn
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
C h a ra c te r
p a tte rn ( 2 )
C u rs o r p a tte rn
*
F o r 5 * 1 0 d o t c h a ra c te r p a tte rn s
C h a ra c te r C o d e s
( D D R A M d a ta )
7
6
5
4
H ig h
0
0
0
3
2
1
0
Low
0
* 0
0
C h a ra c te r P a tte rn s
( C G R A M d a ta )
C G R A M A d d re ss
5
4
3
H ig h
0
0
2
1
0
7
Low
0
6
5
4
3
1
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
H ig h
2
Low
0
0
0
0
0
0
0
0
1
1
1
0
0
0
0
1
1
1
1
0
0
0
0
0
1
1
0
0
1
1
0
0
1
0
1
0
1
0
1
0
1
0
1
0
*
*
*
*
*
*
*
*
*
*
*
*
*
*
*
*
*
*
*
*
*
*
* 0
* 0
*
*
*
*
*
*
*
*
* 0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
1
1
1
1
*
*
*
*
*
*
*
*
C h a ra c te r
p a tte rn
C u rs o r p a tte rn
: " H ig h "
第 10 頁,共 18 頁
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10.Character Generator ROM Pattern
Table.2
Upper
4 bit
Lower
4 bit
LLLL LLLH LLHL LLHH LHLL LHLH LHHL LHHH HLLL HLLH HLHL HLHH HHLL HHLH HHHL HHHH
LLLL
CG
RAM
(1)
LLLH
(2)
LLHL
(3)
LLHH
(4)
LHLL
(5)
LHLH
(6)
LHHL
(7)
LHHH
(8)
HLLL
(1)
HLLH
(2)
HLHL
(3)
HLHH
(4)
HHLL
(5)
HHLH
(6)
HHHL
(7)
HHHH
(8)
第 11 頁,共 18 頁
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11.Instruction Table
Instruction Code
Instruction
Execution time
Description
(fosc=270Khz)
RS R/W DB7 DB6 DB5 DB4 DB3 DB2 DB1 DB0
Clear Display
0
0
0
0
0
0
0
0
0
1
Write “00H” to DDRAM and set
1.52ms
DDRAM address to “00H” from AC
Set DDRAM address to “00H” from AC
Return Home
0
0
0
0
0
0
0
0
1
-
and return cursor to its original position
if shifted. The contents of DDRAM are
1.52ms
not changed.
Assign cursor moving direction and
Entry Mode
Set
0
0
0
0
0
0
0
1
I/D
SH
enable the shift of entire display.
I/D=1:Increment;0: Decrement
37μs
SH=1:Display shift on
Set display (D), cursor (C), and blinking
Display
ON/OFF
Control
of cursor (B) on/off control bit.
0
0
0
0
0
0
1
D
C
B
37μs
D=1:Display on
C=1:Cursor display on
B=1:Cursor blink on
Set cursor moving and display shift
Cursor or
Display Shift
control bit, and the direction, without
0
0
0
0
0
1
S/C R/L
-
- changing of DDRAM data.
37μs
S/C=1:Shift display;0:Move cursor
R/L=1:Shift right;0:Shift leftf
Set interface data length (DL)
DL=1:8-bit;0:4-bit
Function Set
0
0
0
0
1
DL
N
F
-
-
Set numbers of display lines(N)
N=1:Dual line;0:Single line
37μs
Set display font type (F)
F=1:5x10 dots;0:5x8dots
Set CGRAM
Address
Set DDRAM
Address
0
0
0
0
0
1
AC5 AC4 AC3 AC2 AC1 AC0 Set CGRAM address in address counter.
37μs
AC6 AC5 AC4 AC3 AC2 AC1 AC0 Set DDRAM address in address counter.
37μs
1
Whether during internal operation or not
Read Busy
Flag and
Address
can be known by reading BF. The
0
1
BF AC6 AC5 AC4 AC3 AC2 AC1 AC0
contents of address counter can also be
read.
0μs
BF=1:Internal operation
BF=0:Ready for instruction
Write Data to
RAM
1
0
D7
D6
D5
D4
D3
D2
D1
D0
Read Data
from RAM
1
1
D7
D6
D5
D4
D3
D2
D1
D0
Write data into internal RAM
(DDRAM/CGRAM).
Read data from internal RAM
(DDRAM/CGRAM).
37μs
37μs
* ”-”:don’t care
第 12 頁,共 18 頁
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12.Timing Characteristics
VIH1
RS
VIH1
VIL1
VIL1
tAS
R/W
tAH
VIL1
VIL1
PWEH
VIH1
E
tAH
tEf
VIH1
VIL1
VIL1
tEr
VIL1
tDSW
tH
VIH1
DB0 to DB7
VIH1
Valid data
VIL1
VIL1
tcycE
12.1
Write Operation
Ta=25℃, VDD=5.0± 0.5V
Item
Symbol
Min
Typ
Max
Unit
tcycE
500
-
-
ns
Enable pulse width (high level)
PWEH
230
-
-
ns
Enable rise/fall time
tEr,tEf
-
-
20
ns
Address set-up time (RS, R/W to E)
tAS
40
-
-
ns
Address hold time
tAH
10
-
-
ns
Data set-up time
tDSW
80
-
-
ns
tH
10
-
-
ns
Enable cycle time
Data hold time
第 13 頁,共 18 頁
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12.2
Read Operation
VIH1
RS
VIH1
VIL1
VIL1
tAS
tAH
VIH1
R/W
VIH1
PWEH
VIH1
E
VIH1
VIL1
tEr
tAH
tEf
VIL1
t
VOH1
DB0 to DB7
VIL1
tDHR
DDR
VOL1*
VOH1
Valid data
*VOL1
tcycE
NOTE: *VOL1 is assumed to be 0.8V at 2 MHZ operation.
Ta=25℃, VDD=5.0± 0.5V
Item
Symbol
Min
Typ
Max
Unit
tcycE
500
-
-
ns
Enable pulse width (high level)
PWEH
230
-
-
ns
Enable rise/fall time
tEr,tEf
-
-
20
ns
Address set-up time (RS, R/W to E)
tAS
40
-
-
ns
Address hold time
tAH
10
-
-
ns
Data delay time
tDDR
-
-
160
ns
Data hold time
tDHR
5
-
-
ns
Enable cycle time
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13.Initializing of LCM
Power on
Wait for more than 15 ms after VCC rises to 4.5 V
BF can not be checked before this instruction.
RS R/W DB7 DB6 DB5 DB4 DB3 DB2 DB1 DB0 Function set ( Interface is 8 bits long. )
0
0
0
0
1
1
*
*
*
*
Wait for more than 4.1 ms
BF can not be checked before this instruction.
RS R/W DB7 DB6 DB5 DB4 DB3 DB2 DB1 DB0 Function set ( Interface is 8 bits long. )
0
0
1
0
0
1
*
*
*
*
Wait for more than 100 µs
BF can not be checked before this instruction.
RS R/W DB7 DB6 DB5 DB4 DB3 DB2 DB1 DB0 Function set ( Interface is 8 bits long. )
0
0
1
*
*
*
*
0
0
1
BF can be checked after the following instructions.
When BF is not checked , the waiting time between
instructions is longer than execution instruction time.
RS R/W DB7
0
0
0
0
0
0
0
0
0
0
0
0
DB6
0
0
0
0
DB5
1
0
0
0
DB4 DB3 DB2
N F
1
0
1
0
0
0
0
0
0
1
DB1 DB0
*
*
0
0
0
1
I/D S
Function set ( Interface is 8 bits long. Specify
the number of display lines and font. )
The number of display lines and character font
can not be changed after this point.
Display off
Display clear
Entry mode set
Initialization ends
第 15 頁,共 18 頁
8-Bit Ineterface
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Power on
Wait for more than 15 ms after VCC rises to 4.5 V
BF can not be checked before this instruction.
RS R/W DB7 DB6 DB5 DB4
0
0
0
0
1
1
Function set ( Interface is 8 bits long. )
Wait for more than 4.1 ms
BF can not be checked before this instruction.
RS R/W DB7 DB6 DB5 DB4
0
0
0
0
1
1
Function set ( Interface is 8 bits long. )
Wait for more than 100 µs
BF can not be checked before this instruction.
RS R/W DB7 DB6 DB5 DB4
0
0
0
0
1
1
Function set ( Interface is 8 bits long. )
RS R/W DB7 DB6 DB5 DB4
0
0
1
0
0
0
0
0
0
0
1
0
0
0
N F
*
*
0
0
0
0
0
0
0
0
1
0
0
0
0
0
0
0
0
0
0
0
0
0
0
1
0
0
0
0
0
0
1 I/D S
0
0
0
BF can be checked after the following instructions.
When BF is not checked , the waiting time between
instructions is longer than execution instruction time.
Function set ( Set interface to be 4 bits long. )
Interface is 8 bits in length.
Function set ( Interface is 4 bits long. Specify
the number of display lines and character font. )
The number of display lines and character font
can not be changed after this point.
Display off
Display clear
Entry mode set
Initialization ends
4-Bit Ineterface
第 16 頁,共 18 頁
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14.Quality Assurance
Screen Cosmetic Criteria
Item
Defect
1
Spots
2
Bubbles in Polarize
3
Scratch
4
Allowable Density
5
Coloration
Judgment Criterion
A)Clear
Size: d mm
Acceptable Qty in active area
d ≦0.1
Disregard
0.1<d≦0.2
6
0.2<d≦0.3
2
0.3<d
0
Note: Including pin holes and defective dots which must
be within one pixel size.
B)Unclear
Size: d mm
Acceptable Qty in active area
d ≦0.2
Disregard
0.2<d≦0.5
6
0.5<d≦0.7
2
0.7<d
0
Size: d mm
Acceptable Qty in active area
d≦0.3
Disregard
0.3<d≦1.0
3
1.0<d≦1.5
1
1.5<d
0
In accordance with spots cosmetic criteria. When the light
reflects on the panel surface, the scratches are not to be
remarkable.
Above defects should be separated more than 30mm each
other.
Not to be noticeable coloration in the viewing area of the
LCD panels.
Back-light type should be judged with back-light on state
only.
第 17 頁,共 18 頁
Partition
Minor
Minor
Minor
Minor
Minor
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15.Reliability
Content of Reliability Test
Environmental Test
Test Item
High
Temperature
storage
Low
Temperature
storage
High
Temperature
Operation
Low
Temperature
Operation
High
Temperature/
Humidity
Storage
High
Temperature/
Humidity
Operation
Temperature
Cycle
Content of Test
Test Condition
Applicable
Standard
Endurance test applying the high storage
temperature for a long time.
70℃
200hrs
——
Endurance test applying the high storage
temperature for a long time.
-30℃
200hrs
——
Endurance test applying the electric stress
(Voltage & Current) and the thermal stress
to the element for a long time.
50℃
200hrs
——
Endurance test applying the electric stress
under low temperature for a long time.
-20℃
200hrs
——
Endurance test applying the high
70℃,90%RH
temperature and high humidity storage for a
96hrs
long time.
Endurance test applying the electric stress
(Voltage & Current) and temperature /
humidity stress to the element for a long
time.
Endurance test applying the low and high
temperature cycle.
-20℃
25℃
50℃
30min
5min
1 cycle
——
50℃,90%RH
96hrs
——
-20℃/50℃
10 cycles
——
30min
Mechanical Test
Vibration test
Endurance test applying the vibration
during transportation and using.
Shock test
Constructional and mechanical endurance
test applying the shock during
transportation.
Atmospheric
pressure test
Endurance test applying the atmospheric
pressure during transportation by air.
10~22Hz→1.5mmp-p
22~500Hz→1.5G
Total 0.5hrs
50G Half sign
wave 11 msedc
3 times of each
direction
115mbar
40hrs
——
——
——
Others
VS=800V,RS=1.5kΩ
Static electricity Endurance test applying the electric stress to
CS=100pF
test
the terminal.
1 time
——
***Supply voltage for logic system=5V. Supply voltage for LCD system =Operating voltage at 25℃
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