UC1708 UC2708 UC3708 www.ti.com SLUS171C – MARCH 1997 – REVISED SEPTEMBER 2007 DUAL NON-INVERTING POWER DRIVER • • • • • • FEATURES 1 • • • • • 3.0A Peak Current Totem Pole Output 5 to 35V Operation 25ns Rise and Fall Times 25ns Propagation Delays Thermal Shutdown and Under-Voltage Protection High-Speed, Power MOSFET Compatible Efficient High Frequency Operation Low Cross-Conduction Current Spike Enable and Shutdown Functions Wide Input Voltage Range ESD Protection to 2kV DESCRIPTION The UC1708 family of power drivers is made with a high-speed, high-voltage, Schottky process to interface control functions and high-power switching devices – particularly power MOSFETs. Operating over a 5 V to 35 V supply range, these devices contain two independent channels. The A and B inputs are compatible with TTL and CMOS logic families, but can withstand input voltages as high as VIN. Each output can source or sink up to 3 A as long as power dissipation limits are not exceeded. Although each output can be activated independently with its own inputs, they can be forced low in common through the action of either a digital high signal at the Shutdown terminal or by forcing the Enable terminal low. The Shutdown terminal will only force the outputs low, it will not effect the behavior of the rest of the device. The Enable terminal effectively places the device in under-voltage lockout, reducing power consumption by as much as 90%. During under-voltage and disable (Enable terminal forced low) conditions, the outputs are held in a self-biasing, low-voltage, state. The UC3708 and UC2708 are available in plastic 8-pin MINI DIP and 16-pin bat-wing DIP packages for commercial operation over a 0°C to 70°C temperature range and industrial temperature range of –25°C to 85°C respectively. For operation over a –55°C to 125°C temperature range, the UC1708 is available in hermetically sealed 8-pin MINI CDIP, 16 pin CDIP and 20 pin CLCC packages. Surface mount devices are also available. BLOCK DIAGRAM VIN Enable 5.6 V Reg Internal Bias Logic Gnd Thermal Shutdown Output A Pwr Gnd A Input A Input B Output B Shutdown Pwr Gnd B NOTE: Shutdown feature is not available in J or N packages only. 1 Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. Copyright © 1997–2007, Texas Instruments Incorporated UC1708 UC2708 UC3708 www.ti.com SLUS171C – MARCH 1997 – REVISED SEPTEMBER 2007 CONNECTION DIAGRAMS DIL-8 (Top View) J Or N Package SOIC-16 (Top View) DW Package Pwr Gnd A NC Input A Gnd Input B NC Output A VIN Input A Output A Enable VIN Logic Gnd NC NC NC Shutdown VIN Output B Output B Input B NC DIL-16 (Top View) JE Or NE Package Input A Output A Enable VIN ENABLE 4 2 1 PWR GND A 3 20 19 18 VIN Logic Gnd Logic Gnd LOGIC GND 5 17 NC Logic Gnd Logic Gnd NC 6 16 NC VIN NC 7 15 NC Shutdown 14 VIN Submit Documentation Feedback 13 PWR GND B Note: In JE package, Pin 4 is Logic Ground. Pins 5, 12, and 13 are no connect. 10 11 12 NC Pwr Gnd B 9 OUTPUT B 8 NC NC Output B SHUTDOWN INPUT B Input B 2 NC Pwr Gnd A INPUT A CLCC-20 (Top View) L Package NC NC Pwr Gnd B OUTPUT A Enable Copyright © 1997–2007, Texas Instruments Incorporated Product Folder Link(s): UC1708 UC2708 UC3708 UC1708 UC2708 UC3708 www.ti.com SLUS171C – MARCH 1997 – REVISED SEPTEMBER 2007 ABSOLUTE MAXIMUM RATINGS (1) VALUE UNIT Supply Voltage, VIN Output Current (Each Output, Source or Sink) V A 3 A –0.3 to (VIN + 0.3) V –0.3 to 6.2 V –0.3 to (VIN + 0.3) V Peak Transient Ouput Voltage Enable and Shutdown Inputs A and B Inputs Operating Junction Temperature 35 0.5 Steady-State 150 °C –65 to 150 °C 300 °C (2) Storage Temperature Range Lead Temperature (Soldering, 10 Seconds) (1) (2) All voltages are with respect to Logic Gnd pin. All currents are positive into, negative out of, device terminals.r Consult Unitrode Integrated Circuits databook for information regarding thermal specifications and limitations of packages. ELECTRICAL CHARACTERISTICS Unless otherwise stated, VIN=10V to 35V, and these specifications apply for: –55°C<TA<125°C for the UC1708, –25°C<TA<85°C for the UC2708, and 0°C<TA<70°C for the UC3708, TA = TJ PARAMETER VIN TEST CONDITIONS Supply current MIN TYP MAX Outputs low 18 26 Outputs high 14 18 Enable = 0 V 1 4 A, B and shutdown inputs low level 0.8 A, B and shutdown inputs high level 2.0 VA,B = 0.4V –1 A, B Input current high VA,B = 2.4V –200 A, B Input leakage current high VA,B = 35.3V Shutdown input current low VSHUTDOWN = 0.4V 20 VSHUTDOWN = 2.4V 170 A 100 A 500 A 0.6 1.5 mA –460 200 A 200 A 2.8 3.6 V 2.4 3.4 V IOUT = –50mA 2.0 V IOUT = –500mA 2.5 V IOUT = 50mA 0.5 V IOUT = 500mA 2.5 VSHUTDOWN = 6.2V VENABLE = 6.2V –600 Enable threshold rising Enable threshold falling Output Low Saturation mA 200 Enable input current high VOUT –0.6 A VENABLE = 0V Output High Saturation V 50 Enable input current low VIN – VOUT mA V A, B Input current low Shutdown input current high UNIT 1.0 Thermal Shutdown 155 Copyright © 1997–2007, Texas Instruments Incorporated Product Folder Link(s): UC1708 UC2708 UC3708 Submit Documentation Feedback V °C 3 UC1708 UC2708 UC3708 www.ti.com SLUS171C – MARCH 1997 – REVISED SEPTEMBER 2007 SWITCHING CHARACTERISTICS (see Figure 1) (VIN = 20V, delays measured to 10% output change.) PARAMETER TEST CONDITIONS MIN TYP MAX 25 40 UC1708 25 45 UC2708/UC3708 25 40 UC1708 25 50 UC2708/UC3708 25 45 UNIT FROM A,B INPUT TO OUTPUT: CL = 0pF Rise Time Delay (TPLH) CL = 1000pF CL = 2200pF CL = 0pF 10% to 90% Rise (TTLH) CL = 1000pF (1) CL = 2200pF 55 75 UC1708 25 80 UC2708/UC3708 25 50 UC1708 40 85 UC2708/UC3708 40 55 25 40 25 45 35 50 15 20 25 45 40 55 CL = 0pF Fall Time Delay (TPHL) CL = 1000pF (1) CL = 2200pF CL = 0pF 90% to 10% Fall (TTHL) CL = 1000pF (1) CL = 2200pF (1) ns ns ns ns ns ns ns ns These parameters, specified at 1000pF, although ensured over recommended operating conditions, are not tested in production. SWITCHING CHARACTERISTICS (see Figure 1) (VIN = 20V, delays measured to 10% output change.) PARAMETER TEST CONDITIONS MIN TYP MAX UNIT FROM SHUTDOWN INPUT TO OUTPUT: CL = 0pF Rise Time Delay (TPLH) CL = 1000pF (1) CL = 2200pF 25 75 UC1708 30 80 UC2708/UC3708 30 75 UC1708 35 85 UC2708/UC3708 35 75 CL = 0pF 10% to 90% Rise (TTLH) 50 75 UC1708 25 80 UC2708/UC3708 25 50 UC1708 40 85 UC2708/UC3708 40 55 CL = 0pF 25 45 CL = 1000pF (1) 30 50 CL = 2200pF 35 55 CL = 0pF 25 20 CL = 1000pF (1) 25 45 CL = 2200pF 40 55 F = 200kHz, 50% duty cycle, both channels; CL = 0pF 23 25 F = 200kHz, 50% duty cycle, both channels; CL = 2200pF 38 45 CL = 1000pF (1) CL = 2200pF Fall Time Delay (TPHL) 90% to 10% Fall (TTHL) Total Supply Current (1) 4 ns ns ns ns ns ns ns ns mA These parameters, specified at 1000pF, although ensured over recommended operating conditions, are not tested in production. Submit Documentation Feedback Copyright © 1997–2007, Texas Instruments Incorporated Product Folder Link(s): UC1708 UC2708 UC3708 UC1708 UC2708 UC3708 www.ti.com SLUS171C – MARCH 1997 – REVISED SEPTEMBER 2007 20 V 4.3 V INPUT 0V Input 47 mF 10 mF 12 V AC Input LH0063 50 W 200 kHz tr ³0.5 V/RS tf ³0.5/RS Duty Cycle - 50% 50% 20 V UC1708 MPF 6660 50% 47 W 90% 90% Output OUTPUT PWR GND 50 W CL 10% 10% 0V TPHL TPLH TTHL TTLH Logic Gnd Figure 1. AC Test Circuit and Switching Time Waveforms Enable 5.6 V VIN To A/B Output 8 kW 450 mA 2.5 pF A/B Input Shutdown 500 W 5.6 V Internal Bias 10 kW 10 kW 5.6 V 5.6 V Under Voltage Lockout To A/B Output NOTE: Shutdown feature available only in JE, NE or DW Packages. Figure 2. Equivalent Input Circuits Copyright © 1997–2007, Texas Instruments Incorporated Product Folder Link(s): UC1708 UC2708 UC3708 Submit Documentation Feedback 5 PACKAGE OPTION ADDENDUM www.ti.com 9-Aug-2008 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Drawing Pins Package Eco Plan (2) Qty 5962-0051401Q2A ACTIVE LCCC FK 20 1 TBD 5962-0051401QEA ACTIVE CDIP J 16 1 TBD 5962-0051401QPA ACTIVE CDIP JG 8 1 TBD 5962-0051401V2A ACTIVE LCCC FK 20 1 TBD 5962-0051401VEA ACTIVE CDIP J 16 1 TBD 5962-0051401VPA ACTIVE CDIP JG 8 1 UC1708J ACTIVE CDIP JG 8 1 UC1708J883B ACTIVE CDIP JG 8 Lead/Ball Finish MSL Peak Temp (3) POST-PLATE N / A for Pkg Type A42 SNPB N / A for Pkg Type A42 SNPB N / A for Pkg Type POST-PLATE N / A for Pkg Type A42 N / A for Pkg Type TBD A42 N / A for Pkg Type TBD A42 SNPB N / A for Pkg Type 1 TBD A42 SNPB N / A for Pkg Type UC1708JE ACTIVE CDIP J 16 1 TBD A42 SNPB N / A for Pkg Type UC1708JE883B ACTIVE CDIP J 16 1 TBD A42 SNPB N / A for Pkg Type UC1708L883B ACTIVE LCCC FK 20 1 TBD UTR POST-PLATE N / A for Pkg Type UC2708D OBSOLETE TBD Call TI UC2708DW ACTIVE SOIC DW 16 40 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR UC2708DWG4 ACTIVE SOIC DW 16 40 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR UC2708DWTR ACTIVE SOIC DW 16 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR UC2708DWTRG4 ACTIVE SOIC DW 16 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR UC2708J OBSOLETE UC2708JE OBSOLETE UC2708N ACTIVE PDIP P 8 50 UC2708NE ACTIVE PDIP N 16 25 UC2708NEG4 ACTIVE PDIP N 16 UC2708NG4 ACTIVE PDIP P UTR TBD Call TI Call TI Call TI TBD Call TI Call TI Green (RoHS & no Sb/Br) CU NIPDAU N / A for Pkg Type Green (RoHS & no Sb/Br) CU NIPDAU N / A for Pkg Type 25 Green (RoHS & no Sb/Br) CU NIPDAU N / A for Pkg Type 8 50 Green (RoHS & no Sb/Br) CU NIPDAU N / A for Pkg Type UTR UC2708Q OBSOLETE TBD Call TI UC3708DW ACTIVE SOIC UTR DW 16 40 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR UC3708DWG4 ACTIVE SOIC DW 16 40 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR UC3708DWTR ACTIVE SOIC DW 16 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR UC3708DWTRG4 ACTIVE SOIC DW 16 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR UC3708N ACTIVE PDIP P 8 50 Green (RoHS & no Sb/Br) CU NIPDAU N / A for Pkg Type UC3708NE ACTIVE PDIP N 16 25 Green (RoHS & no Sb/Br) CU NIPDAU N / A for Pkg Type UC3708NEG4 ACTIVE PDIP N 16 25 Green (RoHS & no Sb/Br) CU NIPDAU N / A for Pkg Type UC3708NG4 ACTIVE PDIP P 8 50 Green (RoHS & no Sb/Br) CU NIPDAU N / A for Pkg Type Addendum-Page 1 Call TI PACKAGE OPTION ADDENDUM www.ti.com 9-Aug-2008 Orderable Device Status (1) UC3708Q OBSOLETE Package Type Package Drawing Pins Package Eco Plan (2) Qty UTR TBD Lead/Ball Finish Call TI MSL Peak Temp (3) Call TI (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. Addendum-Page 2 PACKAGE MATERIALS INFORMATION www.ti.com 29-Jul-2008 TAPE AND REEL INFORMATION *All dimensions are nominal Device Package Package Pins Type Drawing SPQ Reel Reel Diameter Width (mm) W1 (mm) A0 (mm) B0 (mm) K0 (mm) P1 (mm) W Pin1 (mm) Quadrant UC2708DWTR SOIC DW 16 2000 330.0 16.4 10.85 10.8 2.7 12.0 16.0 Q1 UC3708DWTR SOIC DW 16 2000 330.0 16.4 10.85 10.8 2.7 12.0 16.0 Q1 Pack Materials-Page 1 PACKAGE MATERIALS INFORMATION www.ti.com 29-Jul-2008 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) UC2708DWTR SOIC DW 16 2000 346.0 346.0 33.0 UC3708DWTR SOIC DW 16 2000 346.0 346.0 33.0 Pack Materials-Page 2 MECHANICAL DATA MLCC006B – OCTOBER 1996 FK (S-CQCC-N**) LEADLESS CERAMIC CHIP CARRIER 28 TERMINAL SHOWN 18 17 16 15 14 13 NO. OF TERMINALS ** 12 19 11 20 10 A B MIN MAX MIN MAX 20 0.342 (8,69) 0.358 (9,09) 0.307 (7,80) 0.358 (9,09) 28 0.442 (11,23) 0.458 (11,63) 0.406 (10,31) 0.458 (11,63) 21 9 22 8 44 0.640 (16,26) 0.660 (16,76) 0.495 (12,58) 0.560 (14,22) 23 7 52 0.739 (18,78) 0.761 (19,32) 0.495 (12,58) 0.560 (14,22) 24 6 68 0.938 (23,83) 0.962 (24,43) 0.850 (21,6) 0.858 (21,8) 84 1.141 (28,99) 1.165 (29,59) 1.047 (26,6) 1.063 (27,0) B SQ A SQ 25 5 26 27 28 1 2 3 4 0.080 (2,03) 0.064 (1,63) 0.020 (0,51) 0.010 (0,25) 0.020 (0,51) 0.010 (0,25) 0.055 (1,40) 0.045 (1,14) 0.045 (1,14) 0.035 (0,89) 0.045 (1,14) 0.035 (0,89) 0.028 (0,71) 0.022 (0,54) 0.050 (1,27) 4040140 / D 10/96 NOTES: A. B. C. D. E. All linear dimensions are in inches (millimeters). This drawing is subject to change without notice. This package can be hermetically sealed with a metal lid. The terminals are gold plated. Falls within JEDEC MS-004 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 MECHANICAL DATA MPDI001A – JANUARY 1995 – REVISED JUNE 1999 P (R-PDIP-T8) PLASTIC DUAL-IN-LINE 0.400 (10,60) 0.355 (9,02) 8 5 0.260 (6,60) 0.240 (6,10) 1 4 0.070 (1,78) MAX 0.325 (8,26) 0.300 (7,62) 0.020 (0,51) MIN 0.015 (0,38) Gage Plane 0.200 (5,08) MAX Seating Plane 0.010 (0,25) NOM 0.125 (3,18) MIN 0.100 (2,54) 0.021 (0,53) 0.015 (0,38) 0.430 (10,92) MAX 0.010 (0,25) M 4040082/D 05/98 NOTES: A. All linear dimensions are in inches (millimeters). B. This drawing is subject to change without notice. C. Falls within JEDEC MS-001 For the latest package information, go to http://www.ti.com/sc/docs/package/pkg_info.htm POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 MECHANICAL DATA MCER001A – JANUARY 1995 – REVISED JANUARY 1997 JG (R-GDIP-T8) CERAMIC DUAL-IN-LINE 0.400 (10,16) 0.355 (9,00) 8 5 0.280 (7,11) 0.245 (6,22) 1 0.063 (1,60) 0.015 (0,38) 4 0.065 (1,65) 0.045 (1,14) 0.310 (7,87) 0.290 (7,37) 0.020 (0,51) MIN 0.200 (5,08) MAX Seating Plane 0.130 (3,30) MIN 0.023 (0,58) 0.015 (0,38) 0°–15° 0.100 (2,54) 0.014 (0,36) 0.008 (0,20) 4040107/C 08/96 NOTES: A. B. C. D. E. All linear dimensions are in inches (millimeters). This drawing is subject to change without notice. This package can be hermetically sealed with a ceramic lid using glass frit. Index point is provided on cap for terminal identification. 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