PACKAGE OPTION ADDENDUM www.ti.com 17-Oct-2005 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Drawing Pins Package Eco Plan (2) Qty Lead/Ball Finish MSL Peak Temp (3) 76002012A ACTIVE LCCC FK 20 1 TBD Call TI Level-NC-NC-NC 7600201EA ACTIVE CDIP J 16 1 TBD Call TI Level-NC-NC-NC 7600201FA ACTIVE CFP W 16 1 TBD Call TI Level-NC-NC-NC 76033012A ACTIVE LCCC FK 20 1 TBD Call TI Level-NC-NC-NC 7603301EA ACTIVE CDIP J 16 1 TBD Call TI Level-NC-NC-NC 7603301FA ACTIVE CFP W 16 1 TBD Call TI Level-NC-NC-NC JM38510/07903BEA ACTIVE CDIP J 16 1 TBD Call TI Level-NC-NC-NC JM38510/07903BFA ACTIVE CFP W 16 1 TBD Call TI Level-NC-NC-NC JM38510/07904BEA OBSOLETE CDIP J 16 TBD Call TI Call TI JM38510/07904BFA OBSOLETE CFP W 16 TBD Call TI Call TI JM38510/30903B2A ACTIVE LCCC FK 20 1 TBD Call TI Level-NC-NC-NC JM38510/30903BEA ACTIVE CDIP J 16 1 TBD Call TI Level-NC-NC-NC JM38510/30903BFA ACTIVE CFP W 16 1 TBD Call TI Level-NC-NC-NC SN54157J ACTIVE CDIP J 16 1 TBD Call TI Level-NC-NC-NC SN54LS157J ACTIVE CDIP J 16 1 TBD Call TI Level-NC-NC-NC SN54LS158J ACTIVE CDIP J 16 1 TBD Call TI Level-NC-NC-NC SN54S157J ACTIVE CDIP J 16 1 TBD Call TI Level-NC-NC-NC SN54S158J OBSOLETE CDIP J 16 TBD Call TI Call TI SN74157N OBSOLETE PDIP N 16 TBD Call TI Call TI SN74157N3 OBSOLETE PDIP N 16 TBD Call TI Call TI SN74LS157D ACTIVE SOIC D 16 40 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LS157DG4 ACTIVE SOIC D 16 40 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LS157DR ACTIVE SOIC D 16 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LS157DRG4 ACTIVE SOIC D 16 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LS157N ACTIVE PDIP N 16 Pb-Free (RoHS) CU NIPDAU Level-NC-NC-NC SN74LS157N3 OBSOLETE PDIP N 16 TBD Call TI SN74LS157NE4 ACTIVE PDIP N 16 Pb-Free (RoHS) CU NIPDAU Level-NC-NC-NC SN74LS157NSR ACTIVE SO NS 16 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LS157NSRE4 ACTIVE SO NS 16 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LS158D ACTIVE SOIC D 16 40 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LS158DE4 ACTIVE SOIC D 16 40 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LS158DR ACTIVE SOIC D 16 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LS158DRE4 ACTIVE SOIC D 16 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LS158N ACTIVE PDIP N 16 CU NIPDAU Level-NC-NC-NC 25 25 25 Addendum-Page 1 Pb-Free Call TI PACKAGE OPTION ADDENDUM www.ti.com 17-Oct-2005 Orderable Device Status (1) Package Type Package Drawing Pins Package Eco Plan (2) Qty SN74LS158N3 OBSOLETE PDIP N 16 SN74LS158NE4 ACTIVE PDIP N 16 SN74LS158NSR ACTIVE SO NS 16 SN74LS158NSRE4 ACTIVE SO NS 16 SN74S157D ACTIVE SOIC D 16 40 SN74S157DE4 ACTIVE SOIC D 16 SN74S157N ACTIVE PDIP N 16 Lead/Ball Finish MSL Peak Temp (3) (RoHS) TBD Call TI Pb-Free (RoHS) CU NIPDAU Level-NC-NC-NC 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 40 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 25 Pb-Free (RoHS) CU NIPDAU Level-NC-NC-NC TBD Call TI 25 Pb-Free (RoHS) CU NIPDAU Level-NC-NC-NC 25 Call TI SN74S157N3 OBSOLETE PDIP N 16 SN74S157NE4 ACTIVE PDIP N 16 Call TI SN74S157NSR ACTIVE SO NS 16 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74S157NSRE4 ACTIVE SO NS 16 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74S158D OBSOLETE SOIC D 16 TBD Call TI Call TI SN74S158DR OBSOLETE SOIC D 16 TBD Call TI Call TI SN74S158N OBSOLETE PDIP N 16 TBD Call TI Call TI SN74S158N3 OBSOLETE PDIP N 16 TBD Call TI Call TI SNJ54157J ACTIVE CDIP J 16 1 TBD Call TI Level-NC-NC-NC SNJ54157W ACTIVE CFP W 16 1 TBD Call TI Level-NC-NC-NC SNJ54LS157FK ACTIVE LCCC FK 20 1 TBD Call TI Level-NC-NC-NC SNJ54LS157J ACTIVE CDIP J 16 1 TBD Call TI Level-NC-NC-NC SNJ54LS157W ACTIVE CFP W 16 1 TBD Call TI Level-NC-NC-NC SNJ54LS158FK ACTIVE LCCC FK 20 1 TBD Call TI Level-NC-NC-NC SNJ54LS158J ACTIVE CDIP J 16 1 TBD Call TI Level-NC-NC-NC SNJ54LS158W ACTIVE CFP W 16 1 TBD Call TI Level-NC-NC-NC SNJ54S157FK ACTIVE LCCC FK 20 1 TBD Call TI Level-NC-NC-NC SNJ54S157J ACTIVE CDIP J 16 1 TBD Call TI Level-NC-NC-NC SNJ54S157W ACTIVE CFP W 16 1 TBD Call TI Level-NC-NC-NC SNJ54S158FK OBSOLETE LCCC FK 20 TBD Call TI Call TI SNJ54S158J OBSOLETE CDIP J 16 TBD Call TI Call TI SNJ54S158W OBSOLETE CFP W 16 TBD Call TI Call TI (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS) Addendum-Page 2 or Green (RoHS & no Sb/Br) - please check PACKAGE OPTION ADDENDUM www.ti.com 17-Oct-2005 http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. Addendum-Page 3 MECHANICAL DATA MLCC006B – OCTOBER 1996 FK (S-CQCC-N**) LEADLESS CERAMIC CHIP CARRIER 28 TERMINAL SHOWN 18 17 16 15 14 13 NO. OF TERMINALS ** 12 19 11 20 10 A B MIN MAX MIN MAX 20 0.342 (8,69) 0.358 (9,09) 0.307 (7,80) 0.358 (9,09) 28 0.442 (11,23) 0.458 (11,63) 0.406 (10,31) 0.458 (11,63) 21 9 22 8 44 0.640 (16,26) 0.660 (16,76) 0.495 (12,58) 0.560 (14,22) 23 7 52 0.739 (18,78) 0.761 (19,32) 0.495 (12,58) 0.560 (14,22) 24 6 68 0.938 (23,83) 0.962 (24,43) 0.850 (21,6) 0.858 (21,8) 84 1.141 (28,99) 1.165 (29,59) 1.047 (26,6) 1.063 (27,0) B SQ A SQ 25 5 26 27 28 1 2 3 4 0.080 (2,03) 0.064 (1,63) 0.020 (0,51) 0.010 (0,25) 0.020 (0,51) 0.010 (0,25) 0.055 (1,40) 0.045 (1,14) 0.045 (1,14) 0.035 (0,89) 0.045 (1,14) 0.035 (0,89) 0.028 (0,71) 0.022 (0,54) 0.050 (1,27) 4040140 / D 10/96 NOTES: A. B. C. D. E. All linear dimensions are in inches (millimeters). This drawing is subject to change without notice. This package can be hermetically sealed with a metal lid. The terminals are gold plated. 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