TI SNJ54S157J

PACKAGE OPTION ADDENDUM
www.ti.com
17-Oct-2005
PACKAGING INFORMATION
Orderable Device
Status (1)
Package
Type
Package
Drawing
Pins Package Eco Plan (2)
Qty
Lead/Ball Finish
MSL Peak Temp (3)
76002012A
ACTIVE
LCCC
FK
20
1
TBD
Call TI
Level-NC-NC-NC
7600201EA
ACTIVE
CDIP
J
16
1
TBD
Call TI
Level-NC-NC-NC
7600201FA
ACTIVE
CFP
W
16
1
TBD
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Level-NC-NC-NC
76033012A
ACTIVE
LCCC
FK
20
1
TBD
Call TI
Level-NC-NC-NC
7603301EA
ACTIVE
CDIP
J
16
1
TBD
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Level-NC-NC-NC
7603301FA
ACTIVE
CFP
W
16
1
TBD
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Level-NC-NC-NC
JM38510/07903BEA
ACTIVE
CDIP
J
16
1
TBD
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Level-NC-NC-NC
JM38510/07903BFA
ACTIVE
CFP
W
16
1
TBD
Call TI
Level-NC-NC-NC
JM38510/07904BEA
OBSOLETE
CDIP
J
16
TBD
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Call TI
JM38510/07904BFA
OBSOLETE
CFP
W
16
TBD
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Call TI
JM38510/30903B2A
ACTIVE
LCCC
FK
20
1
TBD
Call TI
Level-NC-NC-NC
JM38510/30903BEA
ACTIVE
CDIP
J
16
1
TBD
Call TI
Level-NC-NC-NC
JM38510/30903BFA
ACTIVE
CFP
W
16
1
TBD
Call TI
Level-NC-NC-NC
SN54157J
ACTIVE
CDIP
J
16
1
TBD
Call TI
Level-NC-NC-NC
SN54LS157J
ACTIVE
CDIP
J
16
1
TBD
Call TI
Level-NC-NC-NC
SN54LS158J
ACTIVE
CDIP
J
16
1
TBD
Call TI
Level-NC-NC-NC
SN54S157J
ACTIVE
CDIP
J
16
1
TBD
Call TI
Level-NC-NC-NC
SN54S158J
OBSOLETE
CDIP
J
16
TBD
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Call TI
SN74157N
OBSOLETE
PDIP
N
16
TBD
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Call TI
SN74157N3
OBSOLETE
PDIP
N
16
TBD
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Call TI
SN74LS157D
ACTIVE
SOIC
D
16
40
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LS157DG4
ACTIVE
SOIC
D
16
40
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LS157DR
ACTIVE
SOIC
D
16
2500 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LS157DRG4
ACTIVE
SOIC
D
16
2500 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LS157N
ACTIVE
PDIP
N
16
Pb-Free
(RoHS)
CU NIPDAU
Level-NC-NC-NC
SN74LS157N3
OBSOLETE
PDIP
N
16
TBD
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SN74LS157NE4
ACTIVE
PDIP
N
16
Pb-Free
(RoHS)
CU NIPDAU
Level-NC-NC-NC
SN74LS157NSR
ACTIVE
SO
NS
16
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LS157NSRE4
ACTIVE
SO
NS
16
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LS158D
ACTIVE
SOIC
D
16
40
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LS158DE4
ACTIVE
SOIC
D
16
40
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LS158DR
ACTIVE
SOIC
D
16
2500 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LS158DRE4
ACTIVE
SOIC
D
16
2500 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LS158N
ACTIVE
PDIP
N
16
CU NIPDAU
Level-NC-NC-NC
25
25
25
Addendum-Page 1
Pb-Free
Call TI
PACKAGE OPTION ADDENDUM
www.ti.com
17-Oct-2005
Orderable Device
Status (1)
Package
Type
Package
Drawing
Pins Package Eco Plan (2)
Qty
SN74LS158N3
OBSOLETE
PDIP
N
16
SN74LS158NE4
ACTIVE
PDIP
N
16
SN74LS158NSR
ACTIVE
SO
NS
16
SN74LS158NSRE4
ACTIVE
SO
NS
16
SN74S157D
ACTIVE
SOIC
D
16
40
SN74S157DE4
ACTIVE
SOIC
D
16
SN74S157N
ACTIVE
PDIP
N
16
Lead/Ball Finish
MSL Peak Temp (3)
(RoHS)
TBD
Call TI
Pb-Free
(RoHS)
CU NIPDAU
Level-NC-NC-NC
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
40
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
25
Pb-Free
(RoHS)
CU NIPDAU
Level-NC-NC-NC
TBD
Call TI
25
Pb-Free
(RoHS)
CU NIPDAU
Level-NC-NC-NC
25
Call TI
SN74S157N3
OBSOLETE
PDIP
N
16
SN74S157NE4
ACTIVE
PDIP
N
16
Call TI
SN74S157NSR
ACTIVE
SO
NS
16
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74S157NSRE4
ACTIVE
SO
NS
16
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74S158D
OBSOLETE
SOIC
D
16
TBD
Call TI
Call TI
SN74S158DR
OBSOLETE
SOIC
D
16
TBD
Call TI
Call TI
SN74S158N
OBSOLETE
PDIP
N
16
TBD
Call TI
Call TI
SN74S158N3
OBSOLETE
PDIP
N
16
TBD
Call TI
Call TI
SNJ54157J
ACTIVE
CDIP
J
16
1
TBD
Call TI
Level-NC-NC-NC
SNJ54157W
ACTIVE
CFP
W
16
1
TBD
Call TI
Level-NC-NC-NC
SNJ54LS157FK
ACTIVE
LCCC
FK
20
1
TBD
Call TI
Level-NC-NC-NC
SNJ54LS157J
ACTIVE
CDIP
J
16
1
TBD
Call TI
Level-NC-NC-NC
SNJ54LS157W
ACTIVE
CFP
W
16
1
TBD
Call TI
Level-NC-NC-NC
SNJ54LS158FK
ACTIVE
LCCC
FK
20
1
TBD
Call TI
Level-NC-NC-NC
SNJ54LS158J
ACTIVE
CDIP
J
16
1
TBD
Call TI
Level-NC-NC-NC
SNJ54LS158W
ACTIVE
CFP
W
16
1
TBD
Call TI
Level-NC-NC-NC
SNJ54S157FK
ACTIVE
LCCC
FK
20
1
TBD
Call TI
Level-NC-NC-NC
SNJ54S157J
ACTIVE
CDIP
J
16
1
TBD
Call TI
Level-NC-NC-NC
SNJ54S157W
ACTIVE
CFP
W
16
1
TBD
Call TI
Level-NC-NC-NC
SNJ54S158FK
OBSOLETE
LCCC
FK
20
TBD
Call TI
Call TI
SNJ54S158J
OBSOLETE
CDIP
J
16
TBD
Call TI
Call TI
SNJ54S158W
OBSOLETE
CFP
W
16
TBD
Call TI
Call TI
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco
Plan
-
The
planned
eco-friendly
classification:
Pb-Free
(RoHS)
Addendum-Page 2
or
Green
(RoHS
&
no
Sb/Br)
-
please
check
PACKAGE OPTION ADDENDUM
www.ti.com
17-Oct-2005
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
Addendum-Page 3
MECHANICAL DATA
MLCC006B – OCTOBER 1996
FK (S-CQCC-N**)
LEADLESS CERAMIC CHIP CARRIER
28 TERMINAL SHOWN
18
17
16
15
14
13
NO. OF
TERMINALS
**
12
19
11
20
10
A
B
MIN
MAX
MIN
MAX
20
0.342
(8,69)
0.358
(9,09)
0.307
(7,80)
0.358
(9,09)
28
0.442
(11,23)
0.458
(11,63)
0.406
(10,31)
0.458
(11,63)
21
9
22
8
44
0.640
(16,26)
0.660
(16,76)
0.495
(12,58)
0.560
(14,22)
23
7
52
0.739
(18,78)
0.761
(19,32)
0.495
(12,58)
0.560
(14,22)
24
6
68
0.938
(23,83)
0.962
(24,43)
0.850
(21,6)
0.858
(21,8)
84
1.141
(28,99)
1.165
(29,59)
1.047
(26,6)
1.063
(27,0)
B SQ
A SQ
25
5
26
27
28
1
2
3
4
0.080 (2,03)
0.064 (1,63)
0.020 (0,51)
0.010 (0,25)
0.020 (0,51)
0.010 (0,25)
0.055 (1,40)
0.045 (1,14)
0.045 (1,14)
0.035 (0,89)
0.045 (1,14)
0.035 (0,89)
0.028 (0,71)
0.022 (0,54)
0.050 (1,27)
4040140 / D 10/96
NOTES: A.
B.
C.
D.
E.
All linear dimensions are in inches (millimeters).
This drawing is subject to change without notice.
This package can be hermetically sealed with a metal lid.
The terminals are gold plated.
Falls within JEDEC MS-004
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