PACKAGE OPTION ADDENDUM www.ti.com 26-Sep-2005 PACKAGING INFORMATION Orderable Device Status (1) Package Type JM38510/07102BEA ACTIVE CDIP J 16 1 TBD Call TI Level-NC-NC-NC JM38510/07102BFA ACTIVE CFP W 16 1 TBD Call TI Level-NC-NC-NC Package Drawing Pins Package Eco Plan (2) Qty Lead/Ball Finish MSL Peak Temp (3) JM38510/30103B2A ACTIVE LCCC FK 20 1 TBD Call TI Level-NC-NC-NC JM38510/30103BEA ACTIVE CDIP J 16 1 TBD Call TI Level-NC-NC-NC JM38510/30103BFA ACTIVE CFP W 16 1 TBD Call TI Level-NC-NC-NC SN54LS112AJ ACTIVE CDIP J 16 1 TBD Call TI Level-NC-NC-NC SN54S112J ACTIVE CDIP J 16 1 TBD Call TI Level-NC-NC-NC SN74LS112AD ACTIVE SOIC D 16 40 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LS112ADE4 ACTIVE SOIC D 16 40 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LS112ADR ACTIVE SOIC D 16 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LS112ADRE4 ACTIVE SOIC D 16 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LS112AN ACTIVE PDIP N 16 Pb-Free (RoHS) CU NIPDAU Level-NC-NC-NC SN74LS112AN3 OBSOLETE PDIP N 16 TBD Call TI SN74LS112ANE4 ACTIVE PDIP N 16 Pb-Free (RoHS) CU NIPDAU Level-NC-NC-NC SN74LS112ANSR ACTIVE SO NS 16 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LS112ANSRE4 ACTIVE SO NS 16 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74S112AD OBSOLETE SOIC D 16 SN74S112ADR ACTIVE SOIC D 16 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74S112ADRE4 ACTIVE SOIC D 16 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74S112AN ACTIVE PDIP N 16 Pb-Free (RoHS) CU NIPDAU Level-NC-NC-NC SN74S112AN3 OBSOLETE PDIP N 16 TBD Call TI SN74S112ANE4 ACTIVE PDIP N 16 Pb-Free (RoHS) CU NIPDAU Level-NC-NC-NC SN74S112ANSR ACTIVE SO NS 16 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74S112ANSRE4 ACTIVE SO NS 16 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SNJ54LS112AFK ACTIVE LCCC FK 20 1 TBD Call TI Level-NC-NC-NC 25 25 TBD 25 25 Call TI Call TI Call TI Call TI SNJ54LS112AJ ACTIVE CDIP J 16 1 TBD Call TI Level-NC-NC-NC SNJ54LS112AW ACTIVE CFP W 16 1 TBD Call TI Level-NC-NC-NC SNJ54S112FK ACTIVE LCCC FK 20 1 TBD Call TI Level-NC-NC-NC SNJ54S112J ACTIVE CDIP J 16 1 TBD Call TI Level-NC-NC-NC SNJ54S112W ACTIVE CFP W 16 1 TBD Call TI Level-NC-NC-NC (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. Addendum-Page 1 PACKAGE OPTION ADDENDUM www.ti.com 26-Sep-2005 LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS) or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. Addendum-Page 2 MECHANICAL DATA MLCC006B – OCTOBER 1996 FK (S-CQCC-N**) LEADLESS CERAMIC CHIP CARRIER 28 TERMINAL SHOWN 18 17 16 15 14 13 NO. OF TERMINALS ** 12 19 11 20 10 A B MIN MAX MIN MAX 20 0.342 (8,69) 0.358 (9,09) 0.307 (7,80) 0.358 (9,09) 28 0.442 (11,23) 0.458 (11,63) 0.406 (10,31) 0.458 (11,63) 21 9 22 8 44 0.640 (16,26) 0.660 (16,76) 0.495 (12,58) 0.560 (14,22) 23 7 52 0.739 (18,78) 0.761 (19,32) 0.495 (12,58) 0.560 (14,22) 24 6 68 0.938 (23,83) 0.962 (24,43) 0.850 (21,6) 0.858 (21,8) 84 1.141 (28,99) 1.165 (29,59) 1.047 (26,6) 1.063 (27,0) B SQ A SQ 25 5 26 27 28 1 2 3 4 0.080 (2,03) 0.064 (1,63) 0.020 (0,51) 0.010 (0,25) 0.020 (0,51) 0.010 (0,25) 0.055 (1,40) 0.045 (1,14) 0.045 (1,14) 0.035 (0,89) 0.045 (1,14) 0.035 (0,89) 0.028 (0,71) 0.022 (0,54) 0.050 (1,27) 4040140 / D 10/96 NOTES: A. B. C. D. E. All linear dimensions are in inches (millimeters). This drawing is subject to change without notice. This package can be hermetically sealed with a metal lid. The terminals are gold plated. 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