application INFO available UC1708 UC2708 UC3708 Dual Non-Inverting Power Driver FEATURES • 3.0A Peak Current Totem Pole Output • 5 to 35V Operation • 25ns Rise and Fall Times • 25ns Propagation Delays • Thermal Shutdown and UnderVoltage Protection • • • DESCRIPTION The UC1708 family of power drivers is made with a high-speed, high-voltage, Schottky process to interface control functions and high-power switching devices – particularly power MOSFETs. Operating over a 5 to 35 volt supply range, these devices contain two independent channels. The A and B inputs are compatible with TTL and CMOS logic families, but can withstand input voltages as high as VIN. Each output can source or sink up to 3A as long as power dissipation limits are not exceeded. Although each output can be activated independently with its own inputs, they can be forced low in common through the action of either a digital high signal at the Shutdown terminal or by forcing the Enable terminal low. The High-Speed, Power MOSFET Compatible Shutdown terminal will only force the outputs low, it will not effect the behavior of the rest of the device. The Enable terminal effectively places the device Efficient High Frequency Operation in under-voltage lockout, reducing power consumption by as much as 90%. During under-voltage and disable (Enable terminal forced low) conditions, Low Cross-Conduction Current Spike the outputs are held in a self-biasing, low-voltage, state. • Enable and Shutdown Functions • Wide Input Voltage Range • ESD Protection to 2kV The UC3708 and UC2708 are available in plastic 8-pin MINI DIP and 16-pin “bat-wing” DIP packages for commercial operation over a 0oC to +70oC temperature range and industrial temperature range of -25oC to +85oC respectively. For operation over a -55oC to +125oC temperature range, the UC1708 is available in hermetically sealed 8-pin MINI CDIP, 16 pin CDIP and 20 pin CLCC packages. Surface mount devices are also available. BLOCK DIAGRAM UDG-92024-1 Note: Shutdown feature is not available in J or N packages only. SLUS171A - MARCH 1997 - REVISED AUGUST 2001 UC1708 UC2708 UC3708 ABSOLUTE MAXIMUM RATINGS (Note 1) Supply Voltage VIN . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 35V Output Current (Each Output, Source or Sink) Steady-State . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 0.5A Peak Transient . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3A Ouput Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.3 to (VIN + 0.3)V Enable and Shutdown Inputs . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.3 to 6.2V A and B Inputs . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.3 to (VIN + 0.3)V Operating Junction Temperature (Note 2) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 150°C Storage Temperature Range. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -65° to 150°C Lead Temperature (Soldering, 10 Seconds). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 300°C NOTE 1: All voltages are with respect to Logic Gnd pin. All currents are positive into, negative out of, device terminals. NOTE 2: Consult Unitrode Integrated Circuits databook for information regarding thermal specifications and limitations of packages. 3 2 1 ENABLE 4 20 19 18 VIN LOGIC GND 5 17 N/C N/C 6 16 N/C N/C 7 15 N/C SHUTDOWN 8 2 OUTPUT B PWR GND B N/C 14 10 11 12 13 N/C 9 INPUT B Note: In JE package Pin 4 is logic ground. Pins 5, 12, and 13 are N/C. OUTPUT A CLCC-20 (Top View) L Package N/C DIL-16 (Top View) JE or NE Package N/C SOIC-16 (Top View) DW Package INPUT A DIL-8 (Top View) J Or N Package PWR GND A CONNECTION DIAGRAMS VIN UC1708 UC2708 UC3708 ELECTRICAL CHARACTERISTICS: Unless otherwise stated, VIN=10V to 35V, and these specifications apply for: –55oC<TA<125oC for the UC1708, –25oC<TA<+85oC for the UC2708, and 0oC<TA<70oC for the UC3708.TA = TJ. PARAMETER VIN Supply Current TEST CONDITIONS MIN TYP MAX UNITS OutputsLow 18 26 mA Outputs High 14 18 mA Enable = 0V 1 4 mA 0.8 V A, B and Shutdown Inputs Low Level A, B and Shutdown Inputs High Level 2.0 A, B Input Current Low VA,B = 0.4V -1 A, B Input Current High VA,B = 2.4V -200 V -0.6 mA 50 µA A, B Input Leakage Current High VA,B = 35.3V 200 µA Shutdown Input Current Low VSHUTDOWN = 0.4V 20 100 µA Shutdown Input Current High VSHUTDOWN = 2.4V 170 500 µA 0.6 1.5 mA -460 200 µA 200 µA VSHUTDOWN = 6.2V Enable Input Current Low VENABLE = 0V Enable Input Current High VENABLE = 6.2V -600 Enable Threshold Rising 2.8 3.6 V 2.4 3.4 V IOUT = -50mA 2.0 V IOUT = -500mA 2.5 V IOUT = 50mA 0.5 V Enable Threshold Falling Output High Sat., VIN - VOUT Output Low Sat., VOUT 1.0 IOUT = 500mA 2.5 Thermal Shutdown V °C 155 SWITCHING CHARACTERISTICS (Figure 1), (VIN = 20V, delays measured to 10% output change.) PARAMETER TEST CONDITIONS MIN TYP MAX UNITS From A,B Input to Output: Rise Time Delay (TPLH) 10% to 90% Rise (TTLH) Fall Time Delay (TPHL) 90% to 10% Fall (TTHL) CL = 0pF 25 40 ns CL = 1000pF (Note 3) 25 40 ns CL = 2200pF 30 45 ns CL = 0pF 55 75 ns CL = 1000pF (Note 3) 25 50 ns CL = 2200pF 40 55 ns CL = 0pF 25 40 ns CL = 1000pF (Note 3) 25 45 ns CL = 2200pF 35 50 ns CL = 0pF 15 20 ns CL = 1000pF (Note 3) 25 45 ns CL = 2200pF 40 55 ns NOTE 3: These parameters, specified at 1000pF, although ensured over recommended operating conditions, are not tested in production. 3 UC1708 UC2708 UC3708 SWITCHING CHARACTERISTICS (Figure 1), (VIN = 20V, delays measured to 10% output change.) From Shutdown Input to Output Rise Time Delay (TPLH) 10% to 90% Rise (TTLH) Fall Time Delay (TPHL) 90% to 10% Fall (TTHL) Total Supply Current CL = 0pF 25 75 ns CL = 1000pF (Note 3) 30 75 ns CL = 2200pF 35 75 ns CL = 0pf 50 75 ns CL = 1000pF (Note 3) 25 50 ns CL = 2200pF 40 55 ns CL = 0pF 25 45 ns CL = 1000pF (Note 3) 30 50 ns CL = 2200pF 35 55 ns CL = 0pF 25 20 ns CL = 1000pF (Note 3) 25 45 ns CL = 2200pF 40 55 ns F = 200kHz, 50% duty cycle, both channels; CL = 0pF 23 25 mA F = 200kHz, 50% duty cycle, both channels; CL = 2200pF 38 45 mA NOTE 3: These parameters, specified at 1000pF, although ensured over recommended operating conditions, are not tested in production. Figure 1: AC Test Circuit and Switching Time Waveforms 4.3V INPUT 0V 50% 50% 20V 90% 90% OUTPUT 0V 10% 10% TPHL TPLH TTLH TTHL UDG-92026 Figure 2: Equivalent Input Circuits UDG-92025 Note: Shutdown feature available only in JE, NE or DW Packages. 4 PACKAGE OPTION ADDENDUM www.ti.com 4-Nov-2005 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Drawing Pins Package Eco Plan (2) Qty Lead/Ball Finish MSL Peak Temp (3) 5962-0051401Q2A ACTIVE LCCC FK 20 1 TBD 5962-0051401QEA ACTIVE CDIP J 16 1 TBD POST-PLATE Level-NC-NC-NC A42 SNPB Level-NC-NC-NC 5962-0051401QPA ACTIVE CDIP JG 8 1 TBD A42 SNPB Level-NC-NC-NC 5962-0051401V2A ACTIVE LCCC FK 20 1 TBD Call TI Level-NC-NC-NC 5962-0051401VEA ACTIVE CDIP J 16 1 TBD Call TI Level-NC-NC-NC 5962-0051401VPA ACTIVE CDIP JG 8 1 TBD A42 Level-NC-NC-NC UC1708J ACTIVE CDIP JG 8 1 TBD A42 SNPB Level-NC-NC-NC UC1708J883B ACTIVE CDIP JG 8 1 TBD A42 SNPB Level-NC-NC-NC UC1708JE ACTIVE CDIP J 16 1 TBD A42 SNPB Level-NC-NC-NC UC1708JE883B ACTIVE CDIP J 16 1 TBD A42 SNPB Level-NC-NC-NC UC1708L883B ACTIVE LCCC FK 20 1 TBD UTR POST-PLATE Level-NC-NC-NC UC2708D OBSOLETE TBD Call TI UC2708DW ACTIVE SOIC DW 16 40 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR UC2708DWG4 ACTIVE SOIC DW 16 40 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR UC2708DWTR ACTIVE SOIC DW 16 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR UC2708DWTRG4 ACTIVE SOIC DW 16 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR UC2708J OBSOLETE UC2708JE OBSOLETE UC2708N ACTIVE PDIP P 8 50 UC2708NE ACTIVE PDIP N 16 25 UC2708NG4 ACTIVE PDIP P 8 UTR TBD Call TI Call TI Call TI TBD Call TI Call TI Green (RoHS & no Sb/Br) CU NIPDAU Level-NC-NC-NC Green (RoHS & no Sb/Br) Call TI Level-NC-NC-NC 50 Green (RoHS & no Sb/Br) CU NIPDAU Level-NC-NC-NC UTR UC2708Q OBSOLETE TBD Call TI UC3708DW ACTIVE SOIC UTR DW 16 40 Green (RoHS & no Sb/Br) CU NIPDAU Call TI Level-2-260C-1 YEAR UC3708DWG4 ACTIVE SOIC DW 16 40 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR UC3708DWTR ACTIVE SOIC DW 16 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR UC3708DWTRG4 ACTIVE SOIC DW 16 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR UC3708J ACTIVE CDIP JG 8 1 TBD A42 SNPB Level-NC-NC-NC UC3708JE ACTIVE CDIP J 16 1 TBD A42 SNPB Level-NC-NC-NC UC3708N ACTIVE PDIP P 8 50 Green (RoHS & no Sb/Br) CU NIPDAU Level-NC-NC-NC UC3708NE ACTIVE PDIP N 16 25 Green (RoHS & no Sb/Br) Call TI Level-NC-NC-NC UC3708NEG4 ACTIVE PDIP N 16 25 Green (RoHS & no Sb/Br) Call TI Level-NC-NC-NC UC3708NG4 ACTIVE PDIP P 8 50 Green (RoHS & CU NIPDAU Level-NC-NC-NC Addendum-Page 1 PACKAGE OPTION ADDENDUM www.ti.com 4-Nov-2005 Orderable Device Status (1) UC3708Q OBSOLETE Package Type Package Drawing Pins Package Eco Plan (2) Qty Lead/Ball Finish MSL Peak Temp (3) no Sb/Br) UTR TBD Call TI Call TI (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS) or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. Addendum-Page 2 MECHANICAL DATA MCER001A – JANUARY 1995 – REVISED JANUARY 1997 JG (R-GDIP-T8) CERAMIC DUAL-IN-LINE 0.400 (10,16) 0.355 (9,00) 8 5 0.280 (7,11) 0.245 (6,22) 1 0.063 (1,60) 0.015 (0,38) 4 0.065 (1,65) 0.045 (1,14) 0.310 (7,87) 0.290 (7,37) 0.020 (0,51) MIN 0.200 (5,08) MAX Seating Plane 0.130 (3,30) MIN 0.023 (0,58) 0.015 (0,38) 0°–15° 0.100 (2,54) 0.014 (0,36) 0.008 (0,20) 4040107/C 08/96 NOTES: A. B. C. D. E. All linear dimensions are in inches (millimeters). This drawing is subject to change without notice. This package can be hermetically sealed with a ceramic lid using glass frit. Index point is provided on cap for terminal identification. Falls within MIL STD 1835 GDIP1-T8 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 MECHANICAL DATA MLCC006B – OCTOBER 1996 FK (S-CQCC-N**) LEADLESS CERAMIC CHIP CARRIER 28 TERMINAL SHOWN 18 17 16 15 14 13 NO. OF TERMINALS ** 12 19 11 20 10 A B MIN MAX MIN MAX 20 0.342 (8,69) 0.358 (9,09) 0.307 (7,80) 0.358 (9,09) 28 0.442 (11,23) 0.458 (11,63) 0.406 (10,31) 0.458 (11,63) 21 9 22 8 44 0.640 (16,26) 0.660 (16,76) 0.495 (12,58) 0.560 (14,22) 23 7 52 0.739 (18,78) 0.761 (19,32) 0.495 (12,58) 0.560 (14,22) 24 6 68 0.938 (23,83) 0.962 (24,43) 0.850 (21,6) 0.858 (21,8) 84 1.141 (28,99) 1.165 (29,59) 1.047 (26,6) 1.063 (27,0) B SQ A SQ 25 5 26 27 28 1 2 3 4 0.080 (2,03) 0.064 (1,63) 0.020 (0,51) 0.010 (0,25) 0.020 (0,51) 0.010 (0,25) 0.055 (1,40) 0.045 (1,14) 0.045 (1,14) 0.035 (0,89) 0.045 (1,14) 0.035 (0,89) 0.028 (0,71) 0.022 (0,54) 0.050 (1,27) 4040140 / D 10/96 NOTES: A. B. C. D. E. All linear dimensions are in inches (millimeters). This drawing is subject to change without notice. This package can be hermetically sealed with a metal lid. The terminals are gold plated. Falls within JEDEC MS-004 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 MECHANICAL DATA MPDI001A – JANUARY 1995 – REVISED JUNE 1999 P (R-PDIP-T8) PLASTIC DUAL-IN-LINE 0.400 (10,60) 0.355 (9,02) 8 5 0.260 (6,60) 0.240 (6,10) 1 4 0.070 (1,78) MAX 0.325 (8,26) 0.300 (7,62) 0.020 (0,51) MIN 0.015 (0,38) Gage Plane 0.200 (5,08) MAX Seating Plane 0.010 (0,25) NOM 0.125 (3,18) MIN 0.100 (2,54) 0.021 (0,53) 0.015 (0,38) 0.430 (10,92) MAX 0.010 (0,25) M 4040082/D 05/98 NOTES: A. All linear dimensions are in inches (millimeters). B. This drawing is subject to change without notice. C. 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