application INFO available UC1705 UC2705 UC3705 High Speed Power Driver FEATURES DESCRIPTION • 1.5A Source/Sink Drive • 100 nsec Delay • 40 nsec Rise and Fall into 1000pF • Inverting and Non-Inverting Inputs The UC1705 family of power drivers is made with a high speed Schottky process to interface between low-level control functions and high-power switching devices - particularly power MOSFETs. These devices are also an optimum choice for capacitive line drivers where up to 1.5 amps may be switched in either direction. With both Inverting and Non-Inverting inputs available, logic signals of either polarity may be accepted, or one input can be used to gate or strobe the other. • Low Cross-Conduction Current Spike • Low Quiescent Current • 5V to 40V Operation • Thermal Shutdown Protection • MINIDIP and Power Packages N.I H H L L The UC1705 is packaged in an 8-pin hermetically sealed CERDIP for -55°C to +125°C operation. The UC3705 is specified for a temperature range of 0°C to +70°C and is available in either a plastic minidip or a 5-pin, power TO-220 package. CONNECTION DIAGRAMS TRUTH TABLE INV H L H L Supply voltages for both VS and VC can independently range from 5V to 40V. For additional application details, see the UC1707/3707 data sheet. OUT L H L L DIL-8 MINIDIP, SOIC-8 (TOP VIEW) N or J Package, D Package OUT = INV and N.I. OUT = INV or N.I. BLOCK DIAGRAM JANUARY 1994 - REVISED AUGUST 2000 - SLUS370A 5-PIN TO-220 (TOP VIEW) T Package UC1705 UC2705 UC3705 ABSOLUTE MAXIMUM RATINGS N-Pkg J-Pkg T-Pkg Supply Voltage, VIN . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 40V . . . . . . . . . . . . . . . . . . . 40V . . . . . . . . . . . . . . . . . . . 40V Collector Supply Voltage, VC . . . . . . . . . . . . . . . . . . . . . . . . . 40V . . . . . . . . . . . . . . . . . . . 40V . . . . . . . . . . . . . . . . . . . 40V Output Current (Source or Sink) Steady-State. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±500mA. . . . . . . . . . . . . . . . ±500mA. . . . . . . . . . . . . . . . . ±1.0A Peak Transient . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±1.5A. . . . . . . . . . . . . . . . . . ±1.0A. . . . . . . . . . . . . . . . . . ±2.0A Capacitive Discharge Energy . . . . . . . . . . . . . . . . . . . . . . 20µJ . . . . . . . . . . . . . . . . . . . . 15µJ . . . . . . . . . . . . . . . . . . . . 50µJ Digital Inputs (See Note) . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5.5V. . . . . . . . . . . . . . . . . . . 5.5V. . . . . . . . . . . . . . . . . . . 5.5V Power Dissipation at TA = 25°C (See Note) . . . . . . . . . . . . . . 1W. . . . . . . . . . . . . . . . . . . . 1W. . . . . . . . . . . . . . . . . . . . 3W Power Dissipation at TA (Leads/Case) = 25°C (See Note) . . . 3W. . . . . . . . . . . . . . . . . . . . 2W . . . . . . . . . . . . . . . . . . . 25W Operating Temperature Range . . . . . . . . . . . . . . . . . . . . 0°C to +70°C . . . . . . . . . . -55°C to +125°C . . . . . . . . . . 0°C to +70°C Storage Temperature Range . . . . . . . . . . . . . . . . . . . . -65°C to +150°C . . . . . . . . . -65°C to +150°C . . . . . . . . . -65°C to +150°C Lead Temperature (Soldering, 10 seconds) . . . . . . . . . . . . . 300°C . . . . . . . . . . . . . . . . . 300°C . . . . . . . . . . . . . . . . . 300°C Note: All currents are positive into, negative out of the specified terminal. Digital Drive can exceed 5.5V if input current is limited to 10mA Consult Packaging Section of Databook for thermal limitations and considerations of package. ELECTRICAL CHARACTERISTICS: Unless otherwise stated, these specifications apply for TA = -55°C to +125°C for the UC1705, -25°C to +85°C for the UC2705, and 0°C to +70°C for the UC3705; VS = VC = 20V, TA = TJ. PARAMETERS VS Supply Current VC Supply Current (N, J Only) VC Leakage Current (N, J Only) Digital Input Low Level Digital Input High Level Input Current Input Leakage Output High Sat., VC-VO Output Low Sat., VO TEST CONDITIONS VS = 40V, (Outputs High, T Pkg) VS = 40V, (Outputs Low, T Pkg) VC = 40V, Outputs Low VS = 0, VC = 30V MIN 2.2 VI = 0 VI = 5V IO = -50mA IO = -500mA IO = 50mA IO = 500mA -0.6 0.05 Thermal Shutdown 155 TYPICAL SWITCHING CHARACTERISTICS: PARAMETERS From Inv. Input to Output: Rise Time Delay 10% to 90% Rise Fall Time Delay 90% to 10% Fall From N. I. Input to Output: Rise Time Delay 10% to 90% Rise Fall Time Delay 90% to 10% Fall VC Cross-Conduction Current Spike Duration TYP 6 8 2 0.05 MAX UNITS 8 mA 12 mA 4 mA 0.1 mA 0.8 V V -1.0 mA 0.1 mA 2.0 V 2.5 V 0.4 V 2.5 V °C VS = VC = 20V, TA = 25°C. Delays measured to 10% output change. TEST CONDITIONS OUTPUT CL = open 1.0 2.2 60 60 60 20 40 60 60 60 60 25 40 50 90 20 60 25 25 0 Ouput Rise Output Fall 2 90 40 60 40 90 60 60 50 UNIT nF ns ns ns ns ns ns ns ns ns ns UC1705 UC2705 UC3705 APPLICATIONS Power MOSFET Drive Circuit Power MOSFET Drive Circuit using Negative Bias Voltage and Level Shifting to Ground Referenced PWMs. D1, D2: UC3611 Schottky Diodes D1, D2: UC3611 Schottky Diodes Transformer Coupled MOSFET Drive Circuit D1, D2: UC3611 Schottky Diodes UNITRODE CORPORATION 7 CONTINENTAL BLVD. • MERRIMACK, NH 03054 TEL. 603-424-2410 • FAX 603-424-3460 3 Charge Pump Circuits PACKAGE OPTION ADDENDUM www.ti.com 18-Oct-2005 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Drawing Pins Package Eco Plan (2) Qty 5962-9579801M2A ACTIVE LCCC FK 20 1 TBD 5962-9579801MPA ACTIVE CDIP JG 8 1 TBD 5962-9579801VPA ACTIVE CDIP JG 8 1 UC1705J ACTIVE CDIP JG 8 1 UC1705J883B ACTIVE CDIP JG 8 1 UC1705L883B ACTIVE LCCC FK 20 1 TBD UC2705D ACTIVE SOIC D 8 75 Green (RoHS & no Sb/Br) Lead/Ball Finish MSL Peak Temp (3) POST-PLATE Level-NC-NC-NC A42 SNPB Level-NC-NC-NC TBD A42 Level-NC-NC-NC TBD A42 SNPB Level-NC-NC-NC TBD A42 SNPB Level-NC-NC-NC POST-PLATE Level-NC-NC-NC CU NIPDAU Level-2-260C-1 YEAR UC2705J ACTIVE CDIP JG 8 1 TBD A42 SNPB Level-NC-NC-NC UC2705N ACTIVE PDIP P 8 50 Green (RoHS & no Sb/Br) CU NIPDAU Level-NC-NC-NC UC3705D ACTIVE SOIC D 8 75 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR UC3705DTR ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR UC3705DTRG4 ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR UC3705J ACTIVE CDIP JG 8 1 TBD A42 SNPB Level-NC-NC-NC UC3705N ACTIVE PDIP P 8 50 Green (RoHS & no Sb/Br) CU NIPDAU Level-NC-NC-NC UC3705NG4 ACTIVE PDIP P 8 50 Green (RoHS & no Sb/Br) CU NIPDAU Level-NC-NC-NC UC3705T ACTIVE TO-220 KC 5 50 Green (RoHS & no Sb/Br) CU SN Level-NC-NC-NC UC3705TG3 ACTIVE TO-220 KC 5 50 Green (RoHS & no Sb/Br) CU SN Level-NC-NC-NC (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS) or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited Addendum-Page 1 PACKAGE OPTION ADDENDUM www.ti.com 18-Oct-2005 information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. Addendum-Page 2 MECHANICAL DATA MCER001A – JANUARY 1995 – REVISED JANUARY 1997 JG (R-GDIP-T8) CERAMIC DUAL-IN-LINE 0.400 (10,16) 0.355 (9,00) 8 5 0.280 (7,11) 0.245 (6,22) 1 0.063 (1,60) 0.015 (0,38) 4 0.065 (1,65) 0.045 (1,14) 0.310 (7,87) 0.290 (7,37) 0.020 (0,51) MIN 0.200 (5,08) MAX Seating Plane 0.130 (3,30) MIN 0.023 (0,58) 0.015 (0,38) 0°–15° 0.100 (2,54) 0.014 (0,36) 0.008 (0,20) 4040107/C 08/96 NOTES: A. B. C. D. E. All linear dimensions are in inches (millimeters). This drawing is subject to change without notice. This package can be hermetically sealed with a ceramic lid using glass frit. Index point is provided on cap for terminal identification. Falls within MIL STD 1835 GDIP1-T8 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 MECHANICAL DATA MLCC006B – OCTOBER 1996 FK (S-CQCC-N**) LEADLESS CERAMIC CHIP CARRIER 28 TERMINAL SHOWN 18 17 16 15 14 13 NO. OF TERMINALS ** 12 19 11 20 10 A B MIN MAX MIN MAX 20 0.342 (8,69) 0.358 (9,09) 0.307 (7,80) 0.358 (9,09) 28 0.442 (11,23) 0.458 (11,63) 0.406 (10,31) 0.458 (11,63) 21 9 22 8 44 0.640 (16,26) 0.660 (16,76) 0.495 (12,58) 0.560 (14,22) 23 7 52 0.739 (18,78) 0.761 (19,32) 0.495 (12,58) 0.560 (14,22) 24 6 68 0.938 (23,83) 0.962 (24,43) 0.850 (21,6) 0.858 (21,8) 84 1.141 (28,99) 1.165 (29,59) 1.047 (26,6) 1.063 (27,0) B SQ A SQ 25 5 26 27 28 1 2 3 4 0.080 (2,03) 0.064 (1,63) 0.020 (0,51) 0.010 (0,25) 0.020 (0,51) 0.010 (0,25) 0.055 (1,40) 0.045 (1,14) 0.045 (1,14) 0.035 (0,89) 0.045 (1,14) 0.035 (0,89) 0.028 (0,71) 0.022 (0,54) 0.050 (1,27) 4040140 / D 10/96 NOTES: A. B. C. D. E. All linear dimensions are in inches (millimeters). This drawing is subject to change without notice. This package can be hermetically sealed with a metal lid. The terminals are gold plated. Falls within JEDEC MS-004 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 MECHANICAL DATA MPDI001A – JANUARY 1995 – REVISED JUNE 1999 P (R-PDIP-T8) PLASTIC DUAL-IN-LINE 0.400 (10,60) 0.355 (9,02) 8 5 0.260 (6,60) 0.240 (6,10) 1 4 0.070 (1,78) MAX 0.325 (8,26) 0.300 (7,62) 0.020 (0,51) MIN 0.015 (0,38) Gage Plane 0.200 (5,08) MAX Seating Plane 0.010 (0,25) NOM 0.125 (3,18) MIN 0.100 (2,54) 0.021 (0,53) 0.015 (0,38) 0.430 (10,92) MAX 0.010 (0,25) M 4040082/D 05/98 NOTES: A. All linear dimensions are in inches (millimeters). B. This drawing is subject to change without notice. C. Falls within JEDEC MS-001 For the latest package information, go to http://www.ti.com/sc/docs/package/pkg_info.htm POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 MECHANICAL DATA MSOT008B – JANUARY 1995 – REVISED SEPTEMBER 2000 KC (R-PSFM-T5) PLASTIC FLANGE-MOUNT 0.113 (2,87) 0.103 (2,62) 0.420 (10,67) 0.380 (9,65) 0.156 (3,96) DIA 0.146 (3,71) 0.185 (4,70) 0.175 (4,46) 0.055 (1,40) 0.045 (1,14) 0.147 (3,73) 0.137 (3,48) 0.340 (8,64) 0.330 (8,38) 1.037 (26,34) 0.997 (25,32) 0.125 (3,18) (see Note C) 1 0.040 (1,02) 0.030 (0,76) 0.010 (0,25) M 5 0.067 (1,70) 0.268 (6,81) 0.122 (3,10) 0.102 (2,59) 0.025 (0,64) 0.012 (0,30) 4040208/E 09/00 NOTES: A. B. C. D. E. All linear dimensions are in inches (millimeters). This drawing is subject to change without notice. Lead dimensions are not controlled within this area. All lead dimensions apply before solder dip. The center lead is in electrical contact with the mounting tab. 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