EMLSI EMD28164PA-75

EMD28164PA
128M: 8M x 16 Mobile DDR SDRAM
Document Title
128M: 8M x 16 Mobile DDR SDRAM
Revision History
Revision No.
Date
History
0.0
Jun 4, 2007
Initial Draft
0.1
Nov 8, 2007
- Table 8 Operating AC Parameter updated for tCKE and tWR
- Table 2 Bonding Pad Location and Identification Table deleted
- Signal names unified to /CK, /CS, /RAS, /CAS, /WE respectively
(Ex.) CK#, CK, CKB unified to /CK
- Corrected IDD6 value in Table 16
1.0
May 26, 2008
Release
- Table 6 DC CHARACTERISTICS updated for IDD3P, IDD3N, IDD6
- Table 8 OPERATING AC PARAMETER updated for tDS, tDH, tQH, tRC
Emerging Memory & Logic Solutions Inc.
4F Korea Construction Financial Cooperation B/D, 301-1 Yeon-Dong, Jeju-Do, Korea Zip Code : 690-717
Tel : +82-64-740-1700 Fax : +82-64-740-1750 / Homepage : www.emlsi.com
The attached datasheets provided by EMLSI reserve the right to change the specifications and products.
EMLSI will answer to your questions about device. If you have any questions, please contact the EMLSI
office.
1
Rev 1.0
EMD28164PA
128M: 8M x 16 Mobile DDR SDRAM
128M : 8M x 16bit Mobile DDR SDRAM
FEATURES
· 1.8V power supply, 1.8V I/O power
· LVCMOS compatible with multiplexed address.
· Double-data-rate architecture; two data transfers per clock
cycle
· Bidirectional data strobe(DQS)
· Four banks operation.
· MRS cycle with address key programs.
· CAS latency (2, 3 & 4).
· Burst length (2, 4, 8 & 16).
· Burst type (Sequential & Interleave).
· Differential clock inputs(CK and /CK).
· EMRS cycle with address key programs.
· PASR(Partial Array Self Refresh).
· DS (Driver Strength)
· Internal auto TCSR
(Temperature Compensated Self Refresh)
· Deep power-down(DPD) mode.
· DM for write masking only.
· Auto refresh and self refresh modes.
· 64㎳ refresh period (4K cycle).
· Operating temperature range (-25℃ ~ 85℃).
GENERAL DESCRIPTION
This EMD28164PA is 134,217,728 bits synchronous double data
rate Dynamic RAM. Each 33,554,432 bits bank is organized as
4,096 rows by 512 columns by 16 bits, fabricated with EMLSI’s
high performance CMOS technology.
This device uses a double data rate architecture to achieve highspeed operation. The double data rate architecture is essentially
a 2n-prefetch architecture with an interface designed to transfer
two data words per clock cycle at the I/O balls.
Range of operating frequencies, programmable burst lengths
and programmable latencies allow the same device to be useful
for a variety of high bandwidth and high performance memory
system applications.
Table 1: ORDERING INFORMATION
Part No.
Max Freq.
EMD28164PA-60(DDR333)
166㎒(CL3), 111㎒(CL2)
EMD28164PA-75(DDR266)
133㎒(CL3), 83㎒(CL2)
EMD28164PA-90(DDR222)
111㎒(CL3), 66㎒(CL2)
Interface
Package
LVCMOS
Wafer Biz.
Remark
NOTE :
1. EMLSI is not designed or manufactured for use in a device or system that is used under circumstance in which human life is potentially at stake.
Please contact to the memory marketing team in EMLSI when considering the use of a product contained herein for any specific purpose,
such as medical, aerospace, nuclear, military, vehicular or undersea repeater use.
2
Rev 1.0
EMD28164PA
128M: 8M x 16 Mobile DDR SDRAM
Table 2: Pad Description
Symbol
Type
Descriptions
Input
Clock : CK and /CK are differential clock inputs. All address and control input signals are sampled on
the crossing of the positive edge of CK and negative edge of /CK. Input and output data is referenced to
the crossing of CK and /CK(both directions of crossing). Internal clock signals are derived from CK//CK.
CKE
Input
Clock Enable : CKE HIGH activates, and CKE LOW deactivates internal clock signals, and device input
buffers and output drivers. Taking CKE LOW provides PRECHARGE POWER-DOWN and SELF
REFRESH operation(all banks idle), or ACTIVE POWER-DOWN(row ACTIVE in any bank). CKE is
synchronous for all functions except for SELF REFRESH EXIT, which is achieved asynchronously.
Input buffers, excluding CK, /CK and CKE, are disabled during power-down and self refresh mode
which are contrived for low standby power consumption.
/CS
Input
Chip Select : /CS enables (registered LOW) and disables (registered HIGH) the command decoder. All
commands are masked when /CS is registered HIGH. /CS provides for external bank selection on systems with multiple banks. /CS is considered part of the command code.
/RAS, /CAS, /WE
Input
Command Inputs: /CAS, /RAS, and /WE(along with /CS) define the command being entered.
LDM, UDM
Input
Input Data Mask : DM is an input mask signal for write data. Input data is masked when DM is sampled
HIGH along with that input data during a WRITE access. DM is sampled on both edges of DQS.
Although DM pins are input-only, the DM loading matches the DQ and DQS loading. For x16 devices,
LDM corresponds to the data on DQ0-DQ7, UDM corresponds to the data on DQ8-DQ15.
BA0, BA1
Input
Bank Address Inputs: BA0 and BA1 define to which bank an ACTIVE, READ, WRITE or PRECHARGE
command is being applied.
A0 - A11
Input
Address Inputs: provide the row address for ACTIVE commands, and the column address and AUTO
PRECHARGE bit for READ / WRITE commands, to select one location out of the memory array in the
respective bank. The address inputs also provide the op-code during a MODE REGISTER SET command.
CK, /CK
DQ0-DQ15
I/O
Data Bus: Input / Output
LDQS, UDQS
I/O
Data Strobe: Output with read data, input with write data. Edge-aligned with read data, centered with
write data. Used to capture write data. For x16 device, LDQS corresponds to the data on DQ0-DQ7,
UDQS corresponds to the data on DQ8-DQ15.
VDD
Supply Power Supply
VSS
Supply Ground
VDDQ
Supply I/O Power Supply
VSSQ
Supply I/O Ground
3
Rev 1.0
EMD28164PA
128M: 8M x 16 Mobile DDR SDRAM
Device Operation
Simplified State Diagram
Power
On
Power
applied
Deep
Power
Down
DPDSX
Precharge
All Banks
Self
Refresh
DPDS
REFS
REFSX
Idle
All banks
precharged
MRS
MRS
EMRS
Auto
Refresh
REFA
CKEL
CKEH
Active
Power
Down
ACT
Precharge
Power
Down
Row
Active
Burst
Stop
CKEH
CKEL
READ
WRITE
BST
WRITEA
WRITE
READ
READA
WRITE
READ
WRITEA
READ
READA
READA
READ A
WRITE A
PRE
PRE
PRE
PRE
Precharge
PREALL
Automatic Sequence
Command Sequence
ACT = Active
EMRS = Ext. Mode Reg. Set
REFSX = Exit Self Refresh
BST = Burst Terminate
MRS = Mode Register Set
READ = Read w/o Auto Precharge
CKEL = Enter Power-Down
PRE = Precharge
READA = Read with Auto Precharge
CKEH =Exit Power-Down
PREALL = Precharge All Banks
WRITE = Write w/o Auto Precharge
DPDS = Enter Deep Power-Down
REFA = Auto Refresh
WRITEA = Write with Auto Precharge
DPDSX = Exit Deep Power-Down
REFS = Enter Self Refresh
4
Rev 1.0
EMD28164PA
128M: 8M x 16 Mobile DDR SDRAM
FUNCTIONAL BLOCK DIAGRAM
REFRESH
COUNTER
12
DQS
GENERATOR
BANK
2
DQS
DRIVER
2
MEMORY
ROW ADDRESS
DECODER
ARRAY
4,096
(4,096 x 256 x 32)
14
ADDRESS
REGISTER
x4
A0 - A11
BA0, BA1
32
x4
12
SENSE AMPLIFIERS
32
256
2
COLUMN ADDRESS
DECODER
I/O GATING
DM MASK LOGIC
32
32
2
2
14
○
○
/CK
/CS
/RAS
16
○
DQ0 DQ15
Din
INPUT BUF.
16
DQS
INPUT BUF.
2
○
LDQS
UDQS
○
LDM
UDM
x4
1
CK
Dout
DRIVER
16
Serial
to
Parallel
8
CKE
16
Din
2
BANK
CONTROL
LOGIC
Dout
Parallel
to
Serial
DM
INPUT BUF.
2
CONTROL
LOGIC
○
○
○
/CAS
○
/WE
○
COMMAND
DECODE
STANDARD MODE
REGISTER
EXTENDED MODE
REGISTER
5
Rev 1.0
EMD28164PA
128M: 8M x 16 Mobile DDR SDRAM
Electrical Specifications
Table 3: ABSOLUTE MAXIMUM RATINGS
Parameter
Symbol
Value
Unit
VIN,VOUT
-0.5 ~ 2.5
V
VDD, VDDQ
-0.5 ~ 2.5
V
TSTG
-55 ~ +150
℃
Power dissipation
PD
1.0
W
Short circuit current
IOS
50
㎃
Voltage on any pin relative to VSS
Voltage on VDD and VDDQ supply relative to VSS
Storage temperature
NOTE :
Permanent device damage may occur if ABSOLUTE MAXIMUM RATINGS are exceeded.
Functional operation should be restricted to recommended operating condition.
Exposure to higher than recommended voltage for extended periods of time could affect device reliability.
Table 4: DC OPERATING CONDITIONS
Recommended operating conditions (Voltage referenced to VSS = 0V, TA = -25oC~ 85oC for Extended)
Parameter
Symbol
Min
Typ
Max
Unit
Note
VDD
1.7
1.8
1.95
V
1
VDDQ
1.7
1.8
1.95
V
1
Input logic high voltage
VIH
0.8 x VDDQ
1.8
VDDQ + 0.3
V
2
Input logic low voltage
VIL
-0.3
0
0.3
V
2
Output logic high voltage
VOH
0.9 x VDDQ
-
-
V
IOH = -0.1㎃
Output logic low voltage
VOL
-
-
0.1 x VDDQ
V
IOL = 0.1㎃
Input leakage current
ILI
-2
-
2
㎂
Output leakage current
ILO
-5
-
5
㎂
Supply voltage
NOTE :
1. Under all conditions, VDDQ must be less than or equal to VDD.
2. These parameters should be tested at the pin on actual components and may be checked at either the pin or the pad in simulation.
Table 5: CAPACITANCE (VDD = 1.8V,
Pin
VDDQ = 1.8V, TA = 25℃, f=1㎒)
Symbol
Min
Max
Unit
Input capacitance
(ADD, BA0~1, /RAS, /CAS, /WE, /CS, CKE)
CIN1
1.5
3.0
㎊
Input capacitance(CK, /CK)
CIN2
1.5
3.5
㎊
Data & DQS input/output capacitance
Cout
2.0
4.5
㎊
Input capacitance(DM)
CIN3
2.0
4.5
㎊
6
Note
Rev 1.0
EMD28164PA
128M: 8M x 16 Mobile DDR SDRAM
Table 6: DC CHARACTERISTICS
Recommended operating conditions (Voltage referenced to VSS = 0V, TA = -25℃ to 85℃)
Version
Parameter
Symbol
Test Condition
Unit
-60
-75
-90
50
40
35
Operating one bank
active-precharge
current
IDD0
tRC = tRCmin; tCK = tCKmin; CKE is HIGH; /CS is HIGH
between valid commands; address inputs are SWITCHING; data bus inputs are STABLE
Precharge power-down
standby current
IDD2P
all banks idle, CKE is LOW; /CS is HIGH, tCK = tCKmin;
address and control inputs are SWITCHING; data bus
inputs are STABLE
Precharge power-down
standby current with
clock stop
IDD2PS
all banks idle, CKE is LOW; /CS is HIGH, CK = LOW,
/CK = HIGH; address and control inputs are SWITCHING; data bus inputs are STABLE
Precharge non powerdown standby current
IDD2N
all banks idle, CKE is HIGH; /CS is HIGH, tCK = tCKmin;
address and control inputs are SWITCHING; data bus
inputs are STABLE
Precharge non powerdown standby current
with clock stop
IDD2NS
all banks idle, CKE is HIGH; /CS is HIGH, CK = LOW, /
CK = HIGH; address and control inputs are SWITCHING;
data bus inputs are STABLE
Active power-down
standby current
IDD3P
one bank active, CKE is LOW; /CS is HIGH, tCK =
tCKmin; address and control inputs are SWITCHING; data
bus inputs are STABLE
Active power-down
standby current with
clock stop
IDD3PS
one bank active, CKE is LOW; /CS is HIGH, CK = LOW,
/CK = HIGH; address and control inputs are SWITCHING; data bus inputs are STABLE
Active non power-down
standby current
IDD3N
one bank active, CKE is HIGH; /CS is HIGH, tCK =
tCKmin; address and control inputs are SWITCHING; data
bus inputs are STABLE
25
20
15
mA
Active non power-down
standby current with
clock stop
IDD3NS
one bank active, CKE is HIGH; /CS is HIGH, CK = LOW,
/CK = HIGH; address and control inputs are SWITCHING; data bus inputs are STABLE
8
8
8
mA
Operating burst read
current
IDD4R
one bank active; BL=4; CL=3; tCK = tCKmin; continuous
read bursts; Iout = 0 mA; address inputs are SWITCHING; 50% data change each burst transfer
90
80
70
mA
Operating burst write
current
IDD4W
one bank active; tCK = tCKmin; continuous write bursts;
address inputs are SWITCHING; 50% data change each
burst transfer
90
80
70
mA
Auto-Refresh current
IDD5
tRC = tRFCmin; burst refresh; CKE is HIGH;
address and control inputs are SWITCHING; data bus
inputs are STABLE
90
90
80
mA
IDD6
CKE is LOW, CK = LOW, /CK
= HIGH; Extended Mode Register set to all 0s; address and
control inputs are STABLE;
data bus inputs are STABLE
mA
0.3
mA
0.3
15
12
10
mA
6
6
6
2
mA
Self Refresh Current
Deep Power-Down
Current
IDD8
TCSR Range
45*1
85
Full Array
150
200
1/2 of Full Array
120
160
1/4 of Full Array
100
140
Address and Control inputs are STABLE;
data bus inputs are STABLE
7
2
10
10
°C
10
Rev 1.0
µA
µA
EMD28164PA
128M: 8M x 16 Mobile DDR SDRAM
NOTE :
1. IDD specifications are tested after the device is properly initialized
2. Input slew rate is 1V/ns.
3. Definitions for IDD:
LOW is defined as VIN ≤ 0.1 * VDDQ ;
HIGH is defined as VIN ≥ 0.9 * VDDQ ;
STABLE is defined as inputs stable at a HIGH or LOW level ;
SWITCHING is defined as :
- address and command : inputs changing between HIGH and LOW once per two clock cycles ;
- data bus inputs : DQ changing between HIGH and LOW once per clock cycle ; DM and DQS are STABLE
Table 7: AC OPERATING TEST CONDITIONS
(VDD = 1.7V ~ 1.95V, TA = -25℃ ~85℃ for Extended)
Parameter
AC input levels(Vih/Vil)
Input timing measurement reference level
Value
Unit
0.8 × VDDQ / 0.2 × VDDQ
V
0.5 × VDDQ
V
1.0
V/㎱
0.5 × VDDQ
V
0.4 × VDDQ(Min) / 0.6 × VDDQ(Max)
V
Input rise and fall time
Output timing measurement reference level
Vix
Output load condition
Note
3
See Figure 2
NOTE :
1. Under all conditions, VDDQ must be less than or equal to VDD.
2. These parameters should be tested at the pin on actual components and may be checked at either the pin or the pad in simulation.
3. CK and /CK crossing voltage.
1.8V
Vtt=0.5 × VDDQ
13.9㏀
50Ω
VOH (DC) = 0.9 × VDDQ, IOH = -0.1㎃
Output
10.6㏀
VOL (DC) = 0.1 × VDDQ, IOL = 0.1 ㎃
20㎊
Z0=50Ω
Output
20㎊
Figure 2. AC Output Load Circuit
Figure 1. DC Output Load Circuit
8
Rev 1.0
EMD28164PA
128M: 8M x 16 Mobile DDR SDRAM
Table 8: OPERATING AC PARAMETER
(AC operating conditions unless otherwise noted)
Symbol
Parameter
-60
-75
-90
Unit
Note
7.0
ns
3
2.5
7.0
ns
0.55
0.45
0.55
tCK
0.55
0.45
0.55
tCK
Min
Max
Min
Max
Min
Max
tAC
2
5
2.5
6.0
2.5
tDQSCK
2
5
2.5
6.0
Clock high-level width
tCH
0.45
0.55
0.45
Clock low-level width
tCL
0.45
0.55
0.45
Clock half period
tHP
DQ output access time from CK//CK
DQS output access time from CK//CK
CL = 3
min
min
min
(tCL,tCH)
(tCL,tCH)
(tCL,tCH)
ns
6
100
7.5
100
9
100
ns
9
100
12
100
15
100
ns
tCK
Clock cycle time
CL = 2
DQ and DM input setup time
tDS
0.6
0.75
1.0
ns
4,5
DQ and DM input hold time
tDH
0.6
0.75
1.0
ns
4,5
tDIPW
1.8
1.8
2.0
ns
Address and control input setup time
tIS
1.1
1.3
1.5
ns
1
Address and control input hold time
tIH
1.1
1.3
1.5
ns
1
Address and control input pulse width
tIPW
2.6
2.6
3.0
ns
DQ & DQS low-impedance time from CK//CK
tLZ
1.0
1.0
1.0
ns
DQ & DQS high-impedance time from CK//CK
tHZ
5
6.0
7.0
ns
tDQSQ
0.5
0.6
0.7
ns
DQ and DM input pulse width
DQS - DQ skew
tHP-tQHS
tHP-tQHS
tHP-tQHS
Data output hold time from DQS
tQH
Data hold skew factor
tQHS
Write command to 1st DQS latching transition
tDQSS
0.75
1.25
0.75
1.25
DQS input high-level width
tDQSH
0.4
0.6
0.4
DQS input low-level width
tDQSL
0.4
0.6
0.4
DQS falling edge to CK rising - setup time
tDSS
0.2
0.2
0.2
tCK
DQS falling edge from CK rising - hold time
tDSH
0.2
0.2
0.2
tCK
MODE REGISTER SET command period
tMRD
2
2
2
tCK
tWPRES
0
0
0
ns
Write postamble
tWPST
0.4
Write preamble
tWPRE
0.25
Write preamble setup time
0.65
9
0.6
0.75
0.4
0.25
ns
1.0
ns
0.75
1.25
tCK
0.6
0.4
0.6
tCK
0.6
0.4
0.6
tCK
0.6
0.4
0.25
0.6
tCK
tCK
Rev 1.0
EMD28164PA
128M: 8M x 16 Mobile DDR SDRAM
Symbol
Parameter
CL = 2
-60
-75
-90
Unit
Min
Max
Min
Max
Min
Max
0.5
1.1
0.5
1.1
0.5
1.1
tCK
0.9
1.1
0.9
1.1
0.9
1.1
tCK
Note
tRPRE
Read preamble
CL = 3
Read postamble
tRPST
0.4
0.6
0.4
0.6
0.4
0.6
tCK
ACTIVE to PRECHARGE command period
tRAS
42
100,000
45
100,000
54
100,000
ns
ACTIVE to ACTIVE command period
tRC
60
67.5
90
ns
AUTO REFRESH to
ACTIVE / AUTO REFRESH command period
tRFC
80
80
90
ns
ACTIVE to READ or WRITE delay
tRCD
22.5
22.5
27
ns
tRP
18
22.5
27
ns
ACTIVE bank A to ACTIVE bank b delay
tRRD
12
15
15
ns
Column address to Column address delay
tCCD
1
1
1
tCK
WRITE recovery time
tWR
15
15
15
ns
Auto precharge write recovery + precharge time
tDAL
tWR+tRP
tWR+tRP
tWR+tRP
Internal write to Read command delay
tWTR
1
1
1
tCK
Self refresh exit to next valid command delay
tXSR
120
120
120
ns
Exit power down to next valid command delay
tXP
tCK+tIS
tCK+tIS
tCK+tIS
CKE min. pulse width(high and low pulse width)
tCKE
1
1
1
Refresh Period
tREF
PRECHARGE command period
64
2
tCK
64
64
ms
Note:
Table 9: Input Setup/Hold Slew Rate
Input Setup/Hold Slew Rate
∆tIS
∆tIH
(V/ns)
(ps)
(ps)
1.0
0
0
0.8
+50
+50
0.6
+100
+100
1. This derating table is used to increase tIS/tIH in the case where the input slew rate is below 1.0V/ns.
2. Minimum 5CK of tDAL (= tWR + tRP) is required because it need minimum 2CK for tWR and minimum 3CK for tRP.
3. tAC(min) value is measured at the high Vdd(1.95V) and cold temperature(-25°C).
tAC(max) value is measured at the low Vdd(1.7V) and hot temperature(85°C).
tAC is measured in the device with half driver strength and under the AC output load condition (Fig.2 in Page 8).
10
6
Rev 1.0
EMD28164PA
128M: 8M x 16 Mobile DDR SDRAM
Table 10: I/O Setup/Hold Slew Rate
I/O Setup/Hold Slew Rate
∆tDS
∆tDH
(V/ns)
(ps)
(ps)
1.0
0
0
0.8
+75
+75
0.6
+150
+150
4. This derating table is used to increase tDS/tDH in the case where the I/O slew rate is below 1.0V/ns.
Table 11: I/O Delta Rise/Fall Rate(1/slewrate)
Delta Rise/Fall Rate
∆tDS
∆tDH
(ns/V)
(ps)
(ps)
0
0
0
± 0.25
+50
+50
± 0.5
+100
+100
5. This derating table is used to increase tDS/tDH in the case where the DQ and DQS slew rates differ. The Delta Rise/Fall Rate is calculated as
1/SlewRate1-1/SlewRate2. For example, if slew rate 1 = 1.0V/ns and slew rate 2 = 0.8V/ns, then the Delta Rise/Fall Rate = -0.25ns/V.
6. Maximum burst refresh cycle : 8
11
Rev 1.0
EMD28164PA
128M: 8M x 16 Mobile DDR SDRAM
Functional Description
The 128Mb Mobile DDR SDRAM is a high-speed CMOS, dynamic random-access memory containing 134,217,728bits. It is internally configured as a quad-bank DRAM. Each of the 33,554,432-bit banks is organized as 4,096 rows by
512 columns by 16 bits.
The 128Mb Mobile DDR SDRAM uses a double data rate architecture to achieve high-speed operation. The double
data rate architecture is essentially a 2n-prefetch architecture, with an interface designed to transfer two data words
per clock cycle at the I/O balls. single read or write access for the 128Mb Mobile DDR SDRAM consists of a single 2nbit wide, one-clock-cycle data transfer at the internal DRAM core and two corresponding n-bit wide, one-half-clockcycle data transfers at the I/O balls.
Read and write accesses to the Mobile DDR SDRAM are burst oriented; accesses start at a selected location and continue for a programmed number of locations in a programmed sequence. Accesses begin with the registration of an
ACTIVE command, which is then followed by a READ or WRITE command. The address bits registered coincident
with the ACTIVE command are used to select the bank and row to be accessed (BA0, BA1 select the bank; A0-A11
select the row). The address bits registered coincident with the READ or WRITE command are used to select the starting column location for the burst access.
It should be noted that the DLL signal that is typically used on standard DDR devices is not necessary on the Mobile
DDR SDRAM. It has been omitted to save power. Prior to normal operation, the Mobile DDR SDRAM must be initialized. The following sections provide detailed information covering device initialization, register definition, command
descriptions and device operation.
Initialization
Mobile DDR SDRAMs must be powered up and initialized in a predefined manner. Operational procedures other than
those specified may result in undefined operation. If there is an interruption to the device power, the initialization routine should be followed to ensure proper functionality of the Mobile DDR SDRAM. The clock stop feature is not available until the device has been properly initialized.
To properly initialize the Mobile DDR SDRAM, this sequence must be followed:
1. To prevent device latch-up, it is recommended the core power (VDD) and I/O power (VDDQ) be from the same
power source and brought up simultaneously. If separate power sources are used, VDD must lead VDDQ.
2. Once power supply voltages are stable and the CKE has been driven HIGH, it is safe to apply the clock.
3. Once the clock is stable, a 200µs (minimum) delay is required by the Mobile DDR SDRAM prior to applying an exe
cutable command. During this time, NOP or DESELECT commands must be issued on the command bus.
4. Issue a PRECHARGE ALL command.
5. Issue NOP or DESELECT commands for at least tRP time.
6. Issue an AUTO REFRESH command followed by NOP or DESELECT commands for at least tRFC time. Issue a
second AUTO REFRESH command followed by NOP or DESELECT commands for at least tRFC time. As part of
the initialization sequence, two AUTO REFRESH commands must be issued. Typically, both of these com
mands are issued at this stage as described above. Alternately, the second AUTO-REFRESH command and NOP
or DESELECT sequence can be issued between steps 10 and 11.
7. Using the LOAD MODE REGISTER command, load the standard mode register as desired.
8. Issue NOP or DESELECT commands for at least tMRD time.
9. Using the LOAD MODE REGISTER command, load the extended mode register to the desired operating modes.
Note that the sequence in which the standard and extended mode registers are programmed is not critical.
10. Issue NOP or DESELECT commands for at least tMRD time.
11. The Mobile DDR SDRAM has been properly initialized and is ready to receive any valid command.
12
Rev 1.0
EMD28164PA
128M: 8M x 16 Mobile DDR SDRAM
Register Definition
Mode Registers
The mode registers are used to define the specific mode of operation of the Mobile DDR SDRAM. There are two mode
registers used to specify the operational characteristics of the device. The standard mode register, which exists for all
SDRAM devices, and the extended mode register, which exists on all Mobile SDRAM devices.
Standard Mode Register
The standard mode register definition includes the selection of a burst length, a burst type, a CAS latency and an operating mode, as shown in page 15. The standard mode register is programmed via the LOAD MODE REGISTER SET
command (with BA0 = 0 and BA1 = 0) and will retain the stored information until it is programmed again. Reprogramming the standard mode register will not alter the contents of the memory, provided it is performed correctly. The mode
register must be loaded (reloaded) when all banks are idle and no bursts are in progress, and the controller must wait
the specified time before initiating the subsequent operation. Violating either of these requirements will result in
unspecified operation. Mode register bits A0-A2 specify the burst length, A3 specifies the type of burst (sequential or
interleaved), A4-A6 specify the CAS latency, and A7-A11 specify the operating mode.
Note: Standard refers to meeting JEDEC-standard mode register definitions.
Burst Length
Read and write accesses to the Mobile DDR SDRAM are burst oriented, with the burst length being programmable, as
shown in page 15. The burst length determines the maximum number of column locations that can be accessed for a
given READ or WRITE command. Burst lengths of 2, 4, 8 or 16 are available for both the sequential and the interleaved burst types.
Reserved states should not be used, as unknown operation or incompatibility with future versions may result.
Burst Type
Accesses within a given burst may be programmed to be either sequential or interleaved; this is referred to as the burst
type and is selected by A3. The ordering of accesses within a burst is determined by the burst length, the burst type
and the starting column address. See Table 17~20 on page 17,18 for more information.
CAS Latency
The CAS latency is the delay, in clock cycles, between the registration of a READ command and the availability of the
first bit of output data. The latency can be set to 2, 3 or 4 clocks, as shown in page 15.
For CL = 3, if the READ command is registered at clock edge n, then the data will nominally be available at (n + 2
clocks + tAC). For CL = 2, if the READ command is registered at clock edge n, then the data will be nominally be available at (n + 1 clock + tAC).
Reserved states should not be used as unknown operation or incompatibility with future versions may result.
Operating Mode
The normal operating mode is selected by issuing a LOAD MODE REGISTER SET command with bits A7-A11 each
set to zero, and bits A0-A6 set to the desired values. All other combinations of values for A7-A11 are reserved for
future use and/or test modes. Test modes and reserved states should not be used because unknown operation or
incompatibility with future versions may result.
13
Rev 1.0
EMD28164PA
128M: 8M x 16 Mobile DDR SDRAM
Extended Mode Register
The extended mode register controls functions specific to low power operation. These additional functions include
drive strength, temperature compensated self refresh, and partial array self refresh.
This device has default values for the extended mode register (if not programmed, the device will operate with the
default values . PASR = Full Array, DS = Full Drive).
Temperature Compensated Self Refresh
On this version of the Mobile DDR SDRAM, a temperature sensor is implemented for automatic control of the self
refresh oscillator on the device. Programming of the temperature compensated self refresh (TCSR) bits will have no
effect on the device. The self refresh oscillator will continue refresh at the factory programmed optimal rate for the
device temperature.
Partial Array Self Refresh
For further power savings during SELF REFRESH, the PASR feature allows the controller to select the amount of
memory that will be refreshed during SELF REFRESH. Low Power DDR SDRAM supports 3 kinds of PASR in self
refresh mode : Full Array, 1/2 of Full Array and 1/4 of Full Array.
Partial Self
Refresh Area
BA1=0 BA1=0
BA0=0 BA0=1
BA1=0 BA1=0
BA0=0 BA0=1
BA1=0 BA1=0
BA0=0 BA0=1
BA1=1 BA1=1
BA0=0 BA0=1
BA1=1 BA1=1
BA0=0 BA0=1
BA1=1 BA1=1
BA0=0 BA0=1
- Full Array
- 1/2 Array
- 1/4 Array
Output Driver Strength
Because the Mobile DDR SDRAM is designed for use in smaller systems that are mostly point to point, an option to
control the drive strength of the output buffers is available. Drive strength should be selected based on the expected
loading of the memory bus. Bits A5 and A6 of the extended mode register can be used to select the driver strength of
the DQ outputs.
Stopping the External Clock
One method of controlling the power efficiency in applications is to throttle the clock which controls the Mobile DDR
SDRAM. There are two basic ways to control the clock:
1. Change the clock frequency, when the data transfers require a different rate of speed.
2. Stopping the clock altogether.
Both of these are specific to the application and its requirements and both allow power savings due to possible less
transitions on the clock path.
The Mobile DDR SDRAM allows the clock to change frequency during operation, only if all the timing parameters are
met with respect to that change and all refresh requirements are satisfied.
The clock can also be stopped all together, if there are no data accesses in progress, either WRITEs or READs that
would be effected by this change; i.e., if a WRITE or a READ is in progress the entire data burst must be through the
pipeline prior to stopping the clock. CKE must be held HIGH with CK = LOW and /CK = HIGH for the full duration of the
clock stop mode. One clock cycle and at least one NOP is required after the clock is restarted before a valid command
can be issued.
It is recommended that the Mobile DDR SDRAM should be in a precharged state if any changes to the clock frequency
are expected. This will eliminate timing violations that may otherwise occur during normal operational accesses.
14
Rev 1.0
EMD28164PA
128M: 8M x 16 Mobile DDR SDRAM
Table 12: MODE REGISTER FIELD TABLE TO PROGRAM MODES
Register Programmed with Normal MRS
Address
BA0 ~ BA1
Function
"0" Setting for
Normal MRS
A11 ~ A10/AP
A8
A9
A7
A6
Operating
Mode
RFU*1
A5
A4
A3
CAS Latency
A2
BT
A1
A0
Burst Length
NOTE :
1. RFU(Reserved for future use) should stay “0” during MRS cycle.
Table 13: Normal MRS Mode
Operating Mode
CAS Latency
Burst Type
Burst Length
A8
A7
Type
A6
A5
A4
Latency
A3
Type
A2
A1
A0
DDR
0
0
Mode Register Set
0
0
0
Reserved
0
Sequential
0
0
0
Reserved
0
1
Reserved
0
0
1
Reserved
1
Interleave
0
0
1
2
1
0
Reserved
0
1
0
2
0
1
0
4
1
1
Reserved
0
1
1
3
0
1
1
8
-
-
-
1
0
0
4
1
0
0
16
1
0
1
Reserved
1
1
0
Reserved
1
1
1
Reserved
-
-
-
1
0
1
Mode Select
BA1
BA0
Mode
0
Setting
for Normal
MRS
Reserved
0
-
-
-
1
1
0
Reserved
-
-
-
1
1
1
Reserved
Mode Register Set
/CK
0
1
2
3
4
5
6
7
8
CK
*1
Precharge
All Banks
Command
tCK
Any
Command
Mode
Register Set
tRP*2
2 Clock min.
NOTE :
1. MRS can be issued only at all bank precharge state.
2. Minimum tRP is required to issue MRS command.
15
Rev 1.0
EMD28164PA
128M: 8M x 16 Mobile DDR SDRAM
Table 14: Register Programmed with Extended MRS
Address
BA1
Function
BA0
A11 ~ A10/AP
A9
A8
A7
A6
RFU*1
Mode Select
A5
A4
A3
A2
RFU*1
DS
A1
A0
PASR
NOTE :
1. RFU(Reserved for future use) should stay “0” during MRS and EMRS cycle.
Table 15: EMRS for PASR(Partial Array Self Refresh) & DS(Driver Strength)
Mode Select
Driver Strength
PASR
BA1
BA0
MODE
A6
A5
Driver
Strength
A2
A1
A0
Size of Refreshed Array
0
0
Normal MRS
0
0
Full
0
0
0
Full Array
0
1
Reserved
0
1
1/2
0
0
1
1/2 of Full Array
1
0
EMRS for DDR SDRAM
1
0
1/4
0
1
0
1/4 of Full Array
1
1
Reserved
1
1
1/8
0
1
1
Reserved
1
0
0
Reserved
1
0
1
Reserved
1
1
0
Reserved
1
1
1
Reserved
Table 16: Internal Temperature Compensated Self Refresh (TCSR)
Self Refresh Current (IDD 6)
Temperature Range
Unit
Full Array
1/2 of Full Array
1/4 of Full Array
Max 85℃
200
160
140
Max 45℃
150
120
100
㎂
NOTE :
1. In order to save power consumption, Mobile DDR SDRAM includes the internal temperature sensor and control units to control the
self refresh cycle automatically according to the two temperature range : Max 85℃, Max 45℃
2. If the EMRS for external TCSR is issued by the controller, this EMRS code for TCSR is ignored.
3. It has +/- 5 ℃ tolerance.
16
Rev 1.0
EMD28164PA
128M: 8M x 16 Mobile DDR SDRAM
BURST SEQUENCE
Table 17: BURST LENGTH = 2
Initial Address
Sequential
Interleave
A0
0
0
1
0
1
1
1
0
1
0
Table 18: BURST LENGTH = 4
Initial Address
Sequential
Interleave
A1
A0
0
0
0
1
2
3
0
1
2
3
0
1
1
2
3
0
1
0
3
2
1
0
2
3
0
1
2
3
0
1
1
1
3
0
1
2
3
2
1
0
Table 19: BURST LENGTH = 8
Initial Address
Sequential
Interleave
A2
A1
A0
0
0
0
0
1
2
3
4
5
6
7
0
1
2
3
4
5
6
7
0
0
1
1
2
3
4
5
6
7
0
1
0
3
2
5
4
7
6
0
1
0
2
3
4
5
6
7
0
1
2
3
0
1
6
7
4
5
0
1
1
3
4
5
6
7
0
1
2
3
2
1
0
7
6
5
4
1
0
0
4
5
6
7
0
1
2
3
4
5
6
7
0
1
2
3
1
0
1
5
6
7
0
1
2
3
4
5
4
7
6
1
0
3
2
1
1
0
6
7
0
1
2
3
4
5
6
7
4
5
2
3
0
1
1
1
1
7
0
1
2
3
4
5
6
7
6
5
4
3
2
1
0
17
Rev 1.0
EMD28164PA
128M: 8M x 16 Mobile DDR SDRAM
Table 20: BURST LENGTH = 16
Initial Address
Sequential
Interleave
A3 A2 A1 A0
0
0
0
0
0
1
2
3
4
5
6
7
8
9
0
0
0
1
1
2
3
4
5
6
7
8
9
10 11 12 13 14 15
0
0
1
0
2
3
4
5
6
7
8
9
10 11 12 13 14 15
0
0
1
1
3
4
5
6
7
8
9
10 11 12 13 14 15
0
1
0
0
4
5
6
7
8
9
10 11 12 13 14 15
0
1
0
1
5
6
7
8
9
10 11 12 13 14 15
0
1
1
0
6
7
8
9 10 11 12 13 14 15 0
0
1
1
1
7
8
9 10 11 12 13 14 15 0
1
0
0
0
8
9 10 11 12 13 14 15 0
1
0
0
1
9
10 11 12 13 14 15
1
0
1
0
10 11 12 13 14 15
1
0
1
1
11 12 13 14 15
1
1
0
0
12 13 14 15
1
1
0
1
13 14 15
1
1
1
0
14 15
1
1
1
1
15
0
10 11 12 13 14 15
0
1
2
3
4
5
6
7
8
9
10 11 12 13 14 15
0
1
0
3
2
5
4
7
6
9
8
11 10 13 12 15 14
0
1
2
3
0
1
6
7
4
5 10 11
8
9
14 15 12 13
0
1
2
3
2
1
0
7
6
5
4
9
8
15 14 13 12
0
1
2
3
4
5
6
7
0
1
2
3 12 13 14 15 8
9
10 11
0
1
2
3
4
5
4
7
6
1
0
3
2 13 12 15 14 9
8
11 10
1
2
3
4
5
6
7
4
5
2
3
0
1 14 15 12 13 10 11
8
9
1
2
3
4
5
6
7
6
5
4
3
2
1
0 15 14 13 12 11 10 9
8
1
2
3
4
5
6
7
8
9
10 11 12 13 14 15
0
1
2
3
4
5
6
7
8
11 10 13 12 15 14
1
0
3
2
5
4
7
6
11 10
0
1
2
3
4
5
6
7
8
9
0
1
2
3
4
5
6
7
8
9
10 11
8
9
14 15 12 13
2
3
0
1
6
7
4
5
0
1
2
3
4
5
6
7
8
9
10 11 10 9
8
15 14 13 12
3
2
1
0
7
6
5
4
0
1
2
3
4
5
6
7
8
9 10 11 12 13 14 15 8
9 10 11
4
5
6
7
0
1
2
3
0
1
2
3
4
5
6
7
8
9 10 11 12 13 12 15 14 9
8
11 10
5
4
7
6
1
0
3
2
0
1
2
3
4
5
6
7
8
9 10 11 12 13 14 15 12 13 10 11
8
9
6
7
4
5
2
3
0
1
1
2
3
4
5
6
7
8
9
10 11 12 13 14 15 14 13 12 11 10
9
8
7
6
5
4
3
2
1
0
18
Rev 1.0
EMD28164PA
128M: 8M x 16 Mobile DDR SDRAM
Commands
DESELECT
The DESELECT function (/CS HIGH) prevents new commands from being executed by the Mobile DDR SDRAM. The
Mobile DDR SDRAM is effectively deselected. Operations already in progress are not affected.
NO OPERATION (NOP)
The NO OPERATION (NOP) command is used to instruct the selected DDR SDRAM to perform a NOP (/CS = LOW, /
RAS = /CAS = /WE = HIGH). This prevents unwanted commands from being registered during idle or wait states.
Operations already in progress are not affected.
LOAD MODE REGISTER
The mode register is loaded via inputs A0-A11, BA0, BA1. The LOAD MODE REGISTER and LOAD EXTENDED
MODE REGISTER commands can only be issued when all banks are idle, and a subsequent executable command
cannot be issued until tMRD is met.
The values of the mode register and extended mode register will be retained even when exiting deep power-down.
ACTIVE
The ACTIVE command is used to open (or activate) a row in a particular bank for a subsequent access. The value on
the BA0, BA1 inputs selects the bank, and the address provided on inputs A0-A11 selects the row. This row remains
active (or open) for accesses until a PRECHARGE command is issued to that bank. A PRECHARGE command must
be issued before opening a different row in the same bank.
READ
The READ command is used to initiate a burst read access to an active row. The value on the BA0, BA1 inputs selects
the bank, and the address provided on inputs A0-A8 selects the starting column location. The value on input A10
determines whether or not auto precharge is used. If auto precharge is selected, the row being accessed will be precharged at the end of the READ burst; if auto precharge is not selected, the row will remain open for subsequent
accesses.
WRITE
The WRITE command is used to initiate a burst write access to an active row. The value on the BA0, BA1 inputs
selects the bank, and the address provided on inputs A0-A8 selects the starting column location. The value on input
A10 determines whether or not auto precharge is used. If auto precharge is selected, the row being accessed will be
precharged at the end of the WRITE burst; if auto precharge is not selected, the row will remain open for subsequent
accesses. Input data appearing on the DQs is written to the memory array subject to the DM input logic level appearing
coincident with the data. If a given DM signal is registered LOW, the corresponding data will be written to memory; if
the DM signal is registered HIGH, the corresponding data inputs will be ignored, and a WRITE will not be executed to
that byte/column location.
PRECHARGE
The PRECHARGE command is used to deactivate the open row in a particular bank or the open row in all banks. The
bank(s) will be available for a subsequent row access a specified time (tRP) after the precharge command is issued.
Except in the case of concurrent auto precharge, where a READ or WRITE command to a different bank is allowed as
long as it does not interrupt the data transfer in the current bank and does not violate any other timing parameters.
Input A10 determines whether one or all banks are to be precharged, and in the case where only one bank is to be precharged, inputs BA0, BA1 select the bank. Otherwise BA0, BA1 are treated as “Don’t Care”. Once a bank has been
precharged, it is in the idle state and must be activated prior to any READ or WRITE commands being issued to that
bank. A PRECHARGE command will be treated as a NOP if there is no open row in that bank (idle state), or if the previously open row is already in the process of precharging.
19
Rev 1.0
EMD28164PA
128M: 8M x 16 Mobile DDR SDRAM
AUTO PRECHARGE
AUTO PRECHARGE is a feature which performs the same individual-bank precharge function described above, but
without requiring an explicit command. This is accomplished by using A10 to enable auto precharge in conjunction with
a specific READ or WRITE command. A precharge of the bank/row that is addressed with the READ or WRITE command is automatically performed upon completion of the READ or WRITE burst. Auto precharge is nonpersistent in
that it is either enabled or disabled for each individual READ or WRITE command. This device supports concurrent
auto precharge if the command to the other bank does not interrupt the data transfer to the current bank.
AUTO PRECHARGE ensures that the precharge is initiated at the earliest valid stage within a burst. This “earliest valid
stage” is determined as if an explicit PRECHARGE command was issued at the earliest possible time, without violating
tRAS (MIN), as described for each burst type in “Operations”. The user must not issue another command to the same
bank until the precharge time (tRP) is completed.
BURST TERMINATE
The BURST TERMINATE command is used to truncate READ bursts (with auto precharge disabled). The most
recently registered READ command prior to the BURST TERMINATE command will be truncated, as shown in “Operations”. The open page which the READ burst was terminated from remains open.
AUTO REFRESH
AUTO REFRESH is used during normal operation of the Mobile DDR SDRAM and is analogous to CAS-BEFORERAS (CBR) REFRESH in FPM/EDO DRAMs. This command is nonpersistent, so it must be issued each time a refresh
is required.
The addressing is generated by the internal refresh controller. This makes the address bits a “Don’t Care” during an
AUTO REFRESH command. The 128Mb Mobile DDR SDRAM requires AUTO REFRESH cycles at an average interval of 15.625µs (maximum).
To allow for improved efficiency in scheduling and switching between tasks, some flexibility in the absolute refresh
interval is provided. Although not a JEDEC requirement, to provide for future functionality features, CKE must be
active (HIGH) during the auto refresh period. The auto refresh period begins when the AUTO REFRESH command is
registered and ends tRFC later.
Auto Refresh
/CK
CK
Command
CKE = High
Auto
PRE
CMD
Refresh
tRFC
tRP
20
Rev 1.0
EMD28164PA
128M: 8M x 16 Mobile DDR SDRAM
SELF REFRESH
The SELF REFRESH command can be used to retain data in the Mobile DDR SDRAM, even if the rest of the system
is powered down. When in the self refresh mode, the Mobile DDR SDRAM retains data without external clocking. The
SELF REFRESH command is initiated like an AUTO REFRESH command except CKE is disabled (LOW). All command and address input signals except CKE are “Don’t Care” during SELF REFRESH.
During SELF REFRESH, the device is refreshed as identified in the external mode register (see PASR setting). For
the full array refresh, all four banks are refreshed simultaneously with the refresh frequency set by an internal self
refresh oscillator. This oscillator changes due to the temperature sensor’s input. As the case temperature of the Mobile
DDR SDRAM increases, the oscillation frequency will change to accommodate the change of temperature. This happens because the DRAM capacitors lose charge faster at higher temperatures. To ensure efficient power dissipation
during self refresh, the oscillator will change to refresh at the slowest rate possible to maintain the devices data.
The procedure for exiting SELF REFRESH requires a sequence of commands. First, CK must be stable prior to CKE
going back HIGH. Once CKE is HIGH, the Mobile DDR SDRAM must have NOP commands issued for tXSR is
required for the completion of any internal refresh in progress.
Self Refresh
/CK
CK
Command
Self
Refresh
Active
CKE = High
CMD
tXSR
tIS
DEEP POWER-DOWN
The operating mode deep power-down achieves maximum power reduction by eliminating the power of the whole
memory array of the device. Array data will not be retained once the device enters deep power-down mode.
This mode is entered by having all banks idle then /CS and /WE held LOW with /RAS and /CAS held HIGH at the rising
edge of the clock, while CKE is LOW. This mode is exited by asserting CKE HIGH.
21
Rev 1.0
EMD28164PA
128M: 8M x 16 Mobile DDR SDRAM
Operations
Bank/Row Activation
The Bank Activation command is issued by holding /CAS and /WE high with /CS and /RAS low at the rising edge of the
clock(CK). The DDR SDRAM has four independent banks, so two bank select addresses(BA0, BA1) are required. The
Bank Activation command must be applied before any READ or WRITE operation is executed. The delay from the
Bank Activation command to the first READ or WRITE command must meet or exceed the minimum of RAS to CAS
delay time(tRCD min). Once a bank has been activated, it must be precharged before another Bank Activation command can be applied to the same bank. The minimum time interval between interleaved Bank Activation commands(Bank A to Bank B and vice versa) is the Bank to Bank delay time(tRRD min).
Bank Activation Command Cycle
0
2
1
/CK
3
Tn
Bank A
Col. Addr.
Bank B
Row Addr.
Write
with Auto
Precharge
Bank B
Activate
Tn+2
Tn+1
CK
Address
Bank A
Row Address
Command
Bank A
Activate
RAS - CAS delay(tRCD)
NOP
NOP
Bank A
Row. Addr.
RAS - RAS delay time(tRRD)
Row Cycle Time(tRC)
22
NOP
Bank A
Activate
: Don't care
Rev 1.0
EMD28164PA
128M: 8M x 16 Mobile DDR SDRAM
READs
READ bursts are initiated with a READ command.
The starting column and bank addresses are provided with the READ command and auto precharge is either enabled
or disabled for that burst access. If auto precharge is enabled, the row being accessed is precharged at the completion
of the burst. For the READ commands used in the following illustrations, auto precharge is disabled.
During READ bursts, the valid data-out element from the starting column address will be available following the CAS
latency after the READ command. Each subsequent data-out element will be valid nominally at the next positive or
negative clock edge (i.e., at the next crossing of CK and /CK). DQS is driven by the Mobile DDR SDRAM along with
output data. The initial LOW state on DQS is known as the read preamble; the LOW state coincident with the last dataout element is known as the read postamble.
Upon completion of a burst, assuming no other commands have been initiated, the DQs will go High-Z.
Data from any READ burst may be concatenated with or truncated with data from a subsequent READ command. In
either case, a continuous flow of data can be maintained. The first data element from the new burst follows either the
last element of a completed burst or the last desired data element of a longer burst which is being truncated. The new
READ command should be issued x cycles after the first READ command, where x equals the number of desired data
element pairs (pairs are required by the 2n-prefetch architecture).
A READ command can be initiated on any clock cycle following a previous READ command.
Burst Read Operation < Burst Length=4, CAS Latency=2, 3) >
1
0
2
3
5
4
6
8
7
/CK
CK
Command
DQS
READ
NOP
NOP
tRPRE
NOP
NOP
NOP
NOP
NOP
NOP
tRPST
CL2
DQ’s
DQS
Dout 0 Dout 1 Dout 2 Dout 3
tRPRE
CL3
DQ’s
Dout 0 Dout 1 Dout 2 Dout 3
23
Rev 1.0
EMD28164PA
128M: 8M x 16 Mobile DDR SDRAM
Read Interrupted by a Read < Burst Length=4, CAS Latency = 2 >
0
1
READ A
READ B
2
3
5
4
6
8
7
/CK
CK
Command
NOP
NOP
NOP
NOP
NOP
NOP
NOP
DQS
CL2
DQ’s
Dout a0 Dout a1 Dout b0 Dout b1 Dout b2 Dout b3
Truncated READs
Data from any READ burst may be truncated with a BURST TERMINATE command. The BURST TERMINATE latency
is equal to the READ (CAS) latency, i.e., the BURST TERMINATE command should be issued x cycles after the READ
command, where x equals the number of desired data element pairs (pairs are required by the 2n-prefetch architecture).
Data from any READ burst must be completed or truncated before a subsequent WRITE command can be issued. If
truncation is necessary, the BURST TERMINATE command must be used.
A READ burst may be followed by, or truncated with, a PRECHARGE command to the same bank provided that auto
precharge was not activated. The PRECHARGE command should be issued x cycles after the READ command,
where x equals the number of desired data element pairs (pairs are required by the 2n-prefetch architecture). Following the PRECHARGE command, a subsequent command to the same bank cannot be issued until tRP is met.
Note: Part of the row precharge time is hidden during the access of the last data elements.
Read Interrupted by a Write & Burst Stop < Burst Length=4, CAS Latency = 2 >
1
0
2
3
5
4
6
8
7
/CK
CK
Command
Burst Stop
READ
NOP
NOP
WRITE
NOP
NOP
NOP
NOP
DQS
CL2
DQ’s
Dout 0 Dout 1
Din 1
Din 0
Din 2
Din 3
Read Interrupted by a Precharge < Burst Length=8, CAS Latency = 2 >
1
0
2
3
5
4
6
8
7
/CK
CK
1tCK
Command
READ
Precharge
NOP
NOP
NOP
NOP
NOP
NOP
NOP
DQS
CL2
DQ’s
Dout 0 Dout 1 Dout 2 Dout 3 Dout 4 Dout 5 Dout 6 Dout 7
Interrupted by precharge
24
Rev 1.0
EMD28164PA
128M: 8M x 16 Mobile DDR SDRAM
WRITEs
WRITE bursts are initiated with a WRITE command. The starting column and bank addresses are provided with the
WRITE command, and auto precharge is either enabled or disabled for that access. If auto precharge is enabled, the
row being accessed is precharged at the completion of the burst. For the WRITE commands used in the following illustrations, auto precharge is disabled. During WRITE bursts, the first valid data-in element will be registered on the first
rising edge of DQS following the WRITE command, and subsequent data elements will be registered on successive
edges of DQS. The LOW state on DQS between the WRITE command and the first rising edge is known as the write
preamble; the LOW state on DQS following the last data-in element is known as the write postamble.
The time between the WRITE command and the first corresponding rising edge of DQS (tDQSS) is specified with a relatively wide range (from 75 percent to 125 percent of one clock cycle). Upon completion of a burst, assuming no other
commands have been initiated, the DQs will remain High-Z and any additional input data will be ignored.
Data for any WRITE burst may be concatenated with or truncated with a subsequent WRITE command. In either case,
a continuous flow of input data can be maintained. The new WRITE command can be issued on any positive edge of
clock following the previous WRITE command. The first data element from the new burst is applied after either the last
element of a completed burst or the last desired data element of a longer burst which is being truncated. The new
WRITE command should be issued x cycles after the first WRITE command, where x equals the number of desired
data element pairs (pairs are required by the 2n-prefetch architecture).
Burst Write Operation < Burst Length=4 >
0
1
2
3
5
4
6
8
7
/CK
CK
Command
NOP
WRITE A
NOP
NOP
WRITE B
NOP
NOP
NOP
NOP
tDQSSmax
tDSS
DQS
tDSH tWPRES
DQ’s
Din a0 Din a1 Din a2 Din a3 Din b0 Din b1 Din b2 Din b3
25
Rev 1.0
EMD28164PA
128M: 8M x 16 Mobile DDR SDRAM
Write Interrupted by a Write < Burst Length=4 >
0
1
2
3
5
4
6
8
7
/CK
CK
1tCK
Command
WRITE A
NOP
WRITE B
NOP
NOP
NOP
NOP
NOP
NOP
DQS
DQ’s
Din a0 Din a1 Din b0 Din b1 Din b2 Din b3
Write Interrupted by a Read & DM < Burst Length=8, CAS Latency =2 >
0
1
2
3
5
4
6
8
7
/CK
CK
Command
DQS
NOP
WRITE
NOP
NOP
NOP
READ
NOP
NOP
NOP
tWTR
tDQSSmax
tDSS
tWPRES tWPRE
CL2
DQ’s
DM
DQS
Din 0
Din 1
Din 2
Din 3
tDQSSmin
Din 4
Din 5
Din 6
Din 7
Dout 0 Dout 1 Dout 2 Dout 3
tWTR
tDSS
tWPRES tWPRE
CL2
DQ’s
Din 0
Din 1
Din 2
Din 3
Din 4
Din 5
Din 6
Din 7
Dout 0 Dout 1 Dout 2 Dout 3
DM
26
Rev 1.0
EMD28164PA
128M: 8M x 16 Mobile DDR SDRAM
Write Interrupted by a Precharge & DM < Burst Length = 8 >
1
0
5
4
3
2
6
7
8
/CK
CK
Command
NOP
NOP
WRITE A
NOP
NOP
Precharge A
NOP
WRITE B
tDQSSmax
NOP
tDQSSmax
DQS
tWR
DQ’s
Din a0 Din a1 Din a2 Din a3 Din a4 Din a5 Din a6 Din a7
Din b0 Din b
DM
tDQSSmin
tDQSSmin
DQS
DQ’s
Din b0 Din b1 Din b
Din a0 Din a1 Din a2 Din a3 Din a4 Din a5 Din a6 Din a7
DM
Burst Stop < Burst Length = 4, CAS Latency = 2, 3 >
1
0
5
4
3
2
6
7
8
/CK
CK
Command
READ
Burst Stop
NOP
NOP
NOP
NOP
NOP
NOP
NOP
CL = 2
DQS
DQ’s
Dout0 Dout1
The burst ends after a delay equal to the CAS latency.
CL = 3
DQS
DQ’s
Dout0 Dout1
DM Masking < Burst Length = 8 >
1
0
5
4
3
2
6
7
8
/CK
CK
Command
WRITE
NOP
NOP
NOP
NOP
NOP
NOP
NOP
NOP
tDQSS
DQS
DQ’s
Din 0 Din 1 Din 2
DM
tDS tDH
Din 3 Din 4 Din 5 Din 6 Din 7
Masked by DM = H
27
Rev 1.0
EMD28164PA
128M: 8M x 16 Mobile DDR SDRAM
PRECHARGE
The PRECHARGE command is used to deactivate the open row in a particular bank or the open row in all banks. The
bank(s) will be available for a subsequent row access some specified time (tRP) after the PRECHARGE command is
issued. Input A10 determines whether one or all banks are to be precharged, and in the case where only one bank is
to be precharged, inputs BA0, BA1 select the bank. When all banks are to be precharged, inputs BA0, BA1 are treated
as Don’t Care. Once a bank has been precharged, it is in the idle state and must be activated prior to any READ or
WRITE commands being issued to that bank.
Read with Auto Precharge < Burst Length = 4, CAS Latency = 2, 3 >
1
0
5
4
3
2
6
7
8
9
/CK
CK
Command BANK A
ACTIVE
READ
NOP
NOP
tRAS(min.)
NOP
Auto Precharge
NOP
NOP
NOP
NOP
NOP
DQS
CL = 2
DQ’s
Dout0 Dout1 Dout2 Dout3
tRP
DQS
CL = 3
DQ’s
Dout0 Dout1 Dout2 Dout3
Begin Auto-Precharge
Write with Auto Precharge < Burst Length = 4 >
/CK
0
1
2
3
4
5
6
7
8
10
9
11
CK
Command BANK A
ACTIVE
NOP
NOP AutoWRITE
Precharge
NOP
NOP
NOP
NOP
NOP
NOP
NOP
NOP
DQS
DQ’s
Din 0 Din 1 Din 2 Din 3
Bank can be reactivated at
completion of tRP
tWR
tRP
tDAL
Internal precharge start
28
Rev 1.0
EMD28164PA
128M: 8M x 16 Mobile DDR SDRAM
POWER-DOWN
Power-down is entered when CKE is registered LOW. If power-down occurs when all banks are idle, this mode is
referred to as precharge power-down; if power-down occurs when there is a row active in any bank, this mode is
referred to as active power-down. Entering power-down deactivates the input and output buffers, including CK and /
CK. Exiting power-down requires the device to be at the same voltage as when it entered power-down and a stable
clock.
Note: The power-down duration is limited by the refresh requirements of the device.
While in power-down, CKE LOW must be maintained at the inputs of the Mobile DDR SDRAM, while all other input signals are Don’t Care. The power-down state is synchronously exited when CKE is registered HIGH (in conjunction with
a NOP or DESELECT command). NOPs or DESELECT commands must be maintained on the command bus until tXP
is satisfied.
Power down
/CK
CK
Command
Precharge
Precharge
power
down
Entry
Active
Active
power
down
Entry
Active
power
down
Exit
tIS
CKE = High
29
Read
tXP
Rev 1.0
EMD28164PA
128M: 8M x 16 Mobile DDR SDRAM
Table 21: SIMPLIFIED TRUTH TABLE
(V=Valid, X =Don't care, H=Logic High, L=Logic Low)
COMMAND
Register
Mode Register Set
CKEn-1
CKEn
/CS
/RAS
/CAS
/WE
H
X
L
L
L
L
OP CODE
L
L
L
H
X
Auto Refresh
Entry
Self
Refresh
Write &
Column
Address
A11,
A9 ~ A0
1, 2
L
L
3
H
H
H
3
H
X
H
X
X
X
3
H
X
L
L
H
H
V
H
X
L
H
L
H
V
Auto Precharge Disable
Auto Precharge Enable
H
Auto Precharge Disable
L
X
L
H
L
L
V
Auto Precharge Enable
Burst Stop
H
H
X
L
H
H
L
H
X
L
L
H
L
Bank Selection
Precharge
All Banks
Entry
Row Address
L
H
H
Note
3
L
Exit
Bank Active & Row Addr.
Read &
Column
Address
A10/AP
H
H
Refresh
BA0,1
H
X
X
X
L
H
H
H
H
X
X
X
L
H
H
H
H
X
X
X
L
H
H
H
H
X
X
X
L
H
H
H
Column
Address
(A0~A8)
Column
Address
(A0~A8)
X
V
L
X
H
4
4
4
4, 6
7
X
5
X
L
Active Power Down
Exit
Entry
L
H
H
L
Precharge
Power Down
X
Exit
L
H
Entry
H
L
L
H
H
L
Exit
L
H
H
X
X
X
Deep Power Down
X
DM
H
No Operation Command(NOP)
H
X
H
X
10
X
X
X
X
8
9
X
L
H
H
H
9
NOTE :
1. OP Code : Operand Code
A0 ~ A11 & BA0 ~ BA1 : Program keys. (@EMRS/MRS)
2. EMRS/MRS can be issued only at all banks precharge state.
A new command can be issued 2 CLK cycles after EMRS or MRS.
3. Auto refresh functions are the same as CBR refresh of DRAM.
Auto/self refresh can be issued only at all banks precharge state.
4. BA0 ~BA1 : Bank select addresses.
5. If A10/AP is “High” at row precharge, BA0 and BA1 are ignored and all banks are selected.
6. During burst write with auto precharge, new read/write command can not be issued.
Another bank read/write command can be issued after the end of burst.
New row active of the associated bank can be issued at tRP after the end of burst.
7. Burst stop command is valid at every burst length.
8. DM sampled at the rising and falling edges of the DQS and Data-in are masked at the both edges(Write DM latency is 0).
9. This combination is not defined for any function, which means “No Operation(NOP)” in DDR SDRAM.
10. The Deep Power Down Mode is exited by asserting CKE high and full initialization is required after exiting Deep Power Down Mode.
30
Rev 1.0
EMD28164PA
128M: 8M x 16 Mobile DDR SDRAM
Timing Diagrams
Basic Timing (Setup, Hold and Access Time @ BL=4, CL=2)
0
1
2
3
4
5
6
7
8
9
10
CK
/CK
tCH
tCL
tCK
HIGH
CKE
tIS
/CS
tIH
/RAS
/CAS
BA0,BA1
BAa
A10/AP
BAa
BAb
DISABLE AUTO PRECHARGE
DISABLE AUTO PRECHARGE
Ca
Cb
Ra
ADDR
(A0-A9,A11)
Ra
/WE
tDQSS
tRPRE
DQS
tRPST
Qa0 Qa1 Qa2 Qa3
DQ
tDSC
tWPRE
tDQSL
tDQSH
tDS tDHtDS tDH
Hi-Z
Hi-Z
Db0 Db1 Db2 Db3
DM
COMMAND
READ
ACTIVE
WRITE
: Don’t care
tDQSQ
DQS
DQ
tDS
tQHS
tRPST
tRPRE
DQS
Q0
Q1
Q2
DQ
Q3
tDH
tWPST
tWPRE
D0
D1
D2
D3
tDSC
READ Operation
WRITE Operation
31
Rev 1.0
EMD28164PA
128M: 8M x 16 Mobile DDR SDRAM
Multi Bank Interleaving READ (@ BL=4, CL=2)
0
1
2
3
4
5
6
7
8
9
10
CK
/CK
tCH
tCL
tCK
CKE
HIGH
/CS
/RAS
/CAS
BA0,BA1
BAa
BAb
A10/AP
Ra
Rb
BAa
DISABLE AUTO PRECHARGE
ADDR
(A0-A9,A11)
Ra
Rb
Ca
BAb
DISABLE AUTO PRECHARGE
Cb
/WE
DQS
Qa0 Qa1 Qa2 Qa3 Qb0 Qb1 Qb2 Qb3
DQ
DM
COMMAND
ACTIVE
ACTIVE
READ
32
READ
Rev 1.0
EMD28164PA
128M: 8M x 16 Mobile DDR SDRAM
Multi Bank Interleaving WRITE (@ BL=4)
0
1
2
3
4
5
6
7
8
9
10
CK
/CK
tCH
tCK
CKE
tCL
HIGH
/CS
/RAS
/CAS
BA0,BA1
BAa
BAb
A10/AP
Ra
Rb
BAa
BAb
DISABLE AUTO PRECHARGE DISABLE AUTO PRECHARGE
ADDR
(A0-A9,A11)
Ra
Rb
Ca
Cb
/WE
DQS
Da0 Da1 Da2 Da3 Db0 Db1 Db2 Db3
DQ
DM
tRCD
COMMAND
ACTIVE
ACTIVE
WRITE
33
WRITE
Rev 1.0
EMD28164PA
128M: 8M x 16 Mobile DDR SDRAM
READ with Auto Precharge (@ BL=8, CL=2)
0
1
2
3
4
5
6
7
8
9
10
CK
/CK
tCH
tCK
CKE
tCL
HIGH
/CS
/RAS
/CAS
BA0,BA1
BAa
BAa
ENABLE AUTO PRECHARGE
A10/AP
ADDR
(A0-A9,A11)
Ra
Ca
Ra
/WE
Auto Precharge start(Note 1)
tRP
DQS
Qa0 Qa1 Qa2 Qa3 Qa4 Qa5 Qa6 Qa7
DQ
DM
COMMAND
READ
ACTIVE
Note 1 The row active command of the precharged bank can be issued after tRP from this point
The new read/write command of another activated bank can be issued from this point
At burst read/write with auto precharge, CAS interrupt of the same is illegal
34
Rev 1.0
EMD28164PA
128M: 8M x 16 Mobile DDR SDRAM
WRITE with Auto Precharge (@ BL=8)
0
1
2
3
4
5
6
7
8
9
10
CK
/CK
tCH
tCL
tCK
CKE
HIGH
/CS
/RAS
/CAS
BA0,BA1
BAa
BAa
ENABLE AUTO PRECHARGE
A10/AP
ADDR
(A0-A9,A11)
Ra
Ca
Ra
/WE
Auto Precharge start(Note 1)
tWR
DQS
tRP
tDAL
Da0 Da1 Da2 Da3 Da4 Da5 Da6 Da7
DQ
DM
COMMAND
WRITE
ACTIVE
Note 1 The row active command of the precharged bank can be issued after tRP from this point
The new read/write command of another activated bank can be issued from this point
At burst read/write with auto precharge, CAS interrupt of the same bank/another bank is illegal
35
Rev 1.0
EMD28164PA
128M: 8M x 16 Mobile DDR SDRAM
WRITE followed by Precharge (@ BL=4)
0
1
2
3
4
5
6
7
8
9
10
CK
/CK
tCH
tCL
tCK
CKE
HIGH
/CS
/RAS
/CAS
BA0,BA1
BAa
BAa
A10/AP
DISABLE AUTO PRECHARGE
ADDR
(A0-A9,A11)
SINGLE BANK
Ca
/WE
tWR
DQS
Da0 Da1 Da2 Da3
DQ
DM
COMMAND
PRE
CHARGE
WRITE
36
Rev 1.0
EMD28164PA
128M: 8M x 16 Mobile DDR SDRAM
WRITE Interrupted by Precharge & DM (@ BL=8)
0
1
2
3
4
5
6
7
BAb
BAc
8
9
10
CK
/CK
tCH
tCL
tCK
HIGH
CKE
/CS
/RAS
/CAS
BA0,BA1
BAa
BAa
A10/AP
DISABLE AUTO PRECHARGE
ADDR
(A0-A9,A11)
SINGLE BANK DISABLE AUTO PRECHARGE
Ca
Cb
Cc
/WE
DQS
Da0 Da1 Da2 Da3 Da4 Da5 Da6 Da7
DQ
Db0 Db1 Dc0 Dc1 Dc2 Dc3 Dc4 Dc5
DM
tCCD
COMMAND
PRE
CHARGE
WRITE
37
WRITE
WRITE
Rev 1.0
EMD28164PA
128M: 8M x 16 Mobile DDR SDRAM
WRITE Interrupted by a READ (@ BL=8, CL=2)
0
1
2
3
4
5
6
7
8
9
10
CK
/CK
tCH
tCL
tCK
CKE
HIGH
/CS
/RAS
/CAS
BA0,BA1
BAa
BAb
DISABLE AUTO PRECHARGE
DISABLE AUTO PRECHARGE
Ca
Cb
A10/AP
ADDR
(A0-A9,A11)
/WE
DQS
Da0 Da1 Da2 Da3 Da4 Da5
DQ
Qb0 Qb1 Qb2 Qb3 Qb4 Qb5 Qb6 Qb7
DM
tWTR
COMMAND
WRITE
READ
38
Rev 1.0
EMD28164PA
128M: 8M x 16 Mobile DDR SDRAM
READ Interrupted by Precharge (@ BL=8, CL=2)
0
1
2
3
4
5
6
7
8
9
10
CK
/CK
tCH
tCL
tCK
CKE
HIGH
/CS
/RAS
/CAS
BA0,BA1
BAa
BAa
ALL BANK
A10/AP
DISABLE AUTO PRECHARGE
ADDR
(A0-A9,A11)
Ca
/WE
2 tCK valid
DQS
Qa0 Qa1 Qa2 Qa3 Qa4 Qa5
DQ
DM
COMMAND
READ
PRE
CHARGE
When a burst Read command is issued to a DDR SDRAM, a Prechcrge command may be issued to the same bank before the Read burst is
complete. The following functionality determines when a Precharge command may be given during a Read burst and when a new Bank Activate
command may be issued to the same bank.
1. For the earliest possible Precharge command without interrupting a Read burst, the Precharge command may be given on the rising clock
edge which is CL clock cycles before the end of the Read burst where CL is the CAS Latency. A new Bank Activate command may be issued
to the same bank after tRP.
2. When a Precharge command interrupts a Read burst operation, the Precharge command may be given on the rising clock edge which is CL
clock cycles before the last data from the interrupted Read burst where CL is the CAS Latency. Once the last data word has been output, the
output buffers are tristated. A new Bank Activate command may be issued to the same bank after tRP.
39
Rev 1.0
EMD28164PA
128M: 8M x 16 Mobile DDR SDRAM
READ Interrupted by a WRITE & Burst Stop (@ BL=8, CL=2)
0
1
2
3
4
5
6
7
8
9
10
CK
/CK
tCH
tCL
tCK
HIGH
CKE
/CS
/RAS
/CAS
BA0,BA1
BAa
BAb
DISABLE AUTO PRECHARGE
DISABLE AUTO PRECHARGE
Ca
Cb
A10/AP
ADDR
(A0-A9,A11)
/WE
DQS
Db0 Db1 Db2 Db3 Db4 Db5 Db6 Db7
Qa0 Qa1
DQ
DM
COMMAND
READ
Burst
stop
WRITE
40
Rev 1.0
EMD28164PA
128M: 8M x 16 Mobile DDR SDRAM
READ Interrupted by READ (@ BL=8, CL=2)
0
1
2
3
4
5
6
7
8
9
10
CK
/CK
tCH
tCK
CKE
tCL
HIGH
/CS
/RAS
/CAS
BA0,BA1
BAa
BAb
A10/AP
DISABLE AUTO PRECHARGE
ADDR
(A0-A9,A11)
Ca
Cb
/WE
DQS
Qa0 Qa1 Qb0 Qb1 Qb2 Qb3 Qb4 Qb5 Qb6 Qb7
DQ
DM
tCCD
COMMAND
READ
READ
41
Rev 1.0
EMD28164PA
128M: 8M x 16 Mobile DDR SDRAM
DM Function (@BL=8) only for write
0
1
2
3
4
5
6
7
8
9
10
CK
/CK
tCH
tCK
CKE
tCL
HIGH
/CS
/RAS
/CAS
BA0,BA1
BAa
A10/AP
DISABLE AUTO PRECHARGE
ADDR
(A0-A9,A11)
Ca
/WE
DQS
Da0 Da1 Da2 Da3 Da4 Da5 Da6 Da7
DQ
DM
COMMAND
WRITE
42
Rev 1.0
EMD28164PA
128M: 8M x 16 Mobile DDR SDRAM
Power up & Initialization Sequence
VDD
VDDQ
tCK
BA0, BA1
DQS
DQ
High-Z
High-Z
T=200us
tRP4
tRFC4
MRS
tIS tIH
CODE
tIS tIH
CODE
tIS tIH
BA0=L
BA1=L
tRFC4
tMRD4
tMRD4
EMRS
CODE
CODE
BA0=H
BA1=L
ACT
RA
RA
BA
~
~~
~~
~ ~
~ ~
~ ~
~ ~
~ ~
~ ~
~
A10
AR
~
~~
~~
~ ~
~ ~
~ ~
~ ~
~ ~
~ ~
~
A11
AR
~
~~
~~
~ ~
~ ~
~ ~
~ ~
~ ~
~ ~
~
A0-A9,
PRE
~
~~
~~
~ ~
~ ~
~ ~
~ ~
~ ~
~ ~
~
DM
NOP
~
~~
~~
~ ~
~ ~
~ ~
~ ~
~ ~
~ ~
~
NOP2
COMMAND
~
~
~~
~~
~ ~
~ ~
~ ~
~ ~
tIS tIH
~
~~
~~
~ ~
~ ~
~ ~
~ ~
~ ~
~ ~
~
LVCMOS HIGH LEVEL
CKE
~
~~
~ ~
~~
~ ~
~ ~
~ ~
~ ~
~ ~
~
CK
/CK
~
~~
~
tCH tCL
NOP3
NOP
Load
Extended
Mode
Mode
Register Register
Power-up:
VDD and CK stable
Notes: 1. PRE = PRECHARGE command, MRS = LOAD MODE REGISTER command, AR = AUTO REFRESH command
ACT = ACTIVE command, RA = Row address, BA = Bank address
2. NOP or DESELECT commands are required for at least 200us.
3. Other valid commands are possible.
4. NOPs or DESELECTs are required during this time.
43
Rev 1.0
EMD28164PA
128M: 8M x 16 Mobile DDR SDRAM
Mode Register Set
0
1
2
3
4
5
6
7
8
9
10
CK
/CK
tCH
tCK
CKE
tCL
HIGH
2 Clock min.
/CS
/RAS
/CAS
/WE
BA0, BA1
A10/AP
ADDR
(A0-A9,A11)
DM
High-Z
tRP
High-Z
DQ
High-Z
DQS
Precharge
Command
All Bank
Any Command
Mode Register Set
Command
Note 1 Power & Clock must be stable for 200us before precharge all banks
44
Rev 1.0
EMD28164PA
128M: 8M x 16 Mobile DDR SDRAM
SDRAM FUNCTION GUIDE
EM X XX XX X X X - XX X X X
1. EMLSI Memory
11. Temperature
2. Device Type
10. Power
3. Density
9. Speed
4. Organization
8. Package
5. Bank
7. Version
6. Interface ( VDD,VDDQ )
1. Memory Component
2. Device Type
8 ------------------------ Low Power SDRAM
9 ------------------------ SDRAM
D ------------------------ Mobile DDR
3. Density
32 ----------------------- 32M
64 ----------------------- 64M
28 ----------------------- 128M
56 ----------------------- 256M
12 ----------------------- 512M
1G ----------------------- 1G
4. Organization
04 ---------------------- x4 bit
08 ---------------------- x8 bit
16 ---------------------- x16 bit
32 ---------------------- x32 bit
5. Bank
2 ----------------------- 2 Bank
4 ----------------------- 4 Bank
6. Interface ( VDD,VDDQ )
V ------------------------- LVTTL ( 3.3V,3.3V )
H------------------------- LVTTL ( 3.3V,2.5V )
K ------------------------- LVTTL ( 3.0V,3.0V )
X ------------------------- LVTTL ( 3.0V,2.5V )
U ------------------------- P-LVTTL ( 3.0V,1.8V )
S ------------------------- LVCMOS ( 2.5V,2.5V )
R ------------------------- LVCMOS ( 2.5V,1.8V )
P ------------------------- LVCMOS ( 1.8V,1.8V )
7. Version
Blank ----------------- 1st generation
A ------------------------2nd generation
B ----------------------- 3rd generation
C ----------------------- 4th generation
D ----------------------- 5th generation
8. Package
Blank ----------------- KGD
U ------------------------44 TSOP2
P ----------------------- 48 FpBGA
Z ----------------------- 52 FpBGA
Y ----------------------- 54 FpBGA
V ----------------------- 90 FpBGA
9. Speed
60 ---------------------- 6.0ns (166MHz CL=3)
70 ---------------------- 7.0ns (143MHz CL=3)
75 ---------------------- 7.5ns (133MHz CL=3)
7C ---------------------- 7.5ns (133MHz CL=2)
80 ---------------------- 8.0ns (125MHz CL=3)
8C ---------------------- 8.0ns (125MHz CL=2)
90 ---------------------- 9.0ns (111MHz CL=3)
10 ---------------------- 10.0ns (100MHz CL=3)
1C ---------------------- 10.0ns (100MHz CL=2)
12 ---------------------- 12.0ns (83MHz CL=2)
1L ---------------------- 25.0ns (40MHz CL=1)
10. Power
U ---------------------- Low Low Power
L ---------------------- Low Power
S ---------------------- Standard Power
11. Temperature
C ---------------------- Commercial ( 0’C ~ 70’C )
E ---------------------- Extended (-25’C ~ 85’C )
I ---------------------- Industrial (-40’C ~ 85’C )
45
Rev 1.0