Freescale Semiconductor Technical Data MPX2053 Rev 6, 06/2007 50 kPa On-Chip Temperature Compensated & Calibrated Silicon Pressure Sensors MPX2053 MPXV2053G SERIES The MPX2053/MPXV2053G device is a silicon piezoresistive pressure sensor providing a highly accurate and linear voltage output - directly proportional to the applied pressure. The sensor is a single, monolithic silicon diaphragm with the strain gauge and a thin-film resistor network integrated on-chip. The chip is laser trimmed for precise span and offset calibration and temperature compensation. Features • Temperature Compensated Over 0°C to +85°C • Easy-to-Use Chip Carrier Package Options • Ratiometric to Supply Voltage • Differential and Gauge Options SMALL OUTLINE PACKAGES Application Examples • Pump/Motor Controllers • Robotics • Level Indicators • Medical Diagnostics • Pressure Switching • Non-Invasive Blood Pressure Measurement MPXV2053GP CASE 1369-01 ORDERING INFORMATION Device Case MPX Series Options Type No. Order No. SMALL OUTLINE PACKAGE (MPXV2053G SERIES) Ported Gauge, Side 1369 MPXV2053GP Elements Port, SMT Differential 1351 MPXV2053DP Dual Port, SMT UNIBODY PACKAGE (MPX2053 SERIES) Basic Differential 344 MPX2053D Element Ported Differential, 344C MPX2053DP Elements Dual Port Gauge 344B MPX2053GP Gauge, Axial PC Mount Gauge, Vacuum 344F 344D MPX2053GSX MPX2053GVP 0 TO 50 kPA (0 TO 7.25 psi) 40 mV FULL SCALE SPAN (TYPICAL) Packing Options Device Marking Trays MPXV2053G Trays MPXV2053G — MPX2053D — MPX2053DP — MPX2053GP — MPX2053D MPXV2053DP CASE 1351-01 SMALL OUTLINE PACKAGE PIN NUMBERS 1 GND(1) 5 N/C 2 +VOUT 6 N/C 3 VS 7 N/C 4 –VOUT 8 N/C 1. Pin 1 in noted by the notch in the lead. — MPX2053GVP UNIBODY PACKAGE PIN NUMBERS 1 GND(1) 3 VS 2 +VOUT 4 –VOUT 1. Pin 1 in noted by the notch in the lead. UNIBODY PACKAGES MPX2053GP CASE 344-15 MPX2053GP CASE 344B-01 MPX2053DP CASE 344C-01 © Freescale Semiconductor, Inc., 2005-2007. All rights reserved. MPX2053GVP CASE 344D-01 MPX2053GSX CASE 344F-01 VS 3 Thin Film Temperature Compensation and Calibration Circuitry Sensing Element 2 4 +VOUT –VOUT 1 GND Figure 1. Temperature Compensated and Calibrated Pressure Sensor Schematic VOLTAGE OUTPUT VERSUS APPLIED DIFFERENTIAL PRESSURE The output voltage of the differential or gauge sensor increases with increasing pressure applied to the pressure side (P1) relative to the vacuum side (P2). Similarly, output voltage increases as increasing vacuum is applied to the vacuum side (P2) relative to the pressure side (P1). Figure 1 shows a block diagram of the internal circuitry on the stand-alone pressure sensor chip. Table 1. Maximum Ratings(1) Rating Symbol Value Unit Maximum Pressure (P1 > P2) PMAX 200 kPa Storage Temperature TSTG –40 to +125 °C TA –40 to +125 °C Operating Temperature 1. Exposure beyond the specified limits may cause permanent damage or degradation to the device. MPX2053 2 Sensors Freescale Semiconductor Table 2. Operating Characteristics (VS = 10 VDC, TA = 25°C unless otherwise noted, P1 > P2) Characteristic Symbol Min Typ Max Units POP 0 — 50 kPa VS — 10 16 VDC IO — 6.0 — mAdc VFSS 38.5 40 41.5 mV Offset(4) VOFF –1.0 — 1.0 mV Sensitivity ∆V/∆Ρ — 0.8 — mV/kPa Linearity(5) — -0.6 — 0.4 %VFSS — — ±0.1 — %VFSS — — ±0.5 — %VFSS TCVFSS –2.0 — 2.0 %VFSS TCVOFF –1.0 — 1.0 mV ZIN 1000 — 2550 Ω ZOUT 1400 — 3000 Ω tR — 1.0 — ms — — 2.0 — ms — — ±0.5 — %VFSS Pressure Range(1) Supply Voltage(2) Supply Current Full Scale Pressure Span(3) Hysteresis(5) (0 to 50 kPa) Temperature Hysteresis(5) (–40°C to +125°C) Temperature Effect on Full Scale Span(5) Temperature Effect on Offset(5) Input Impedance Output Impedance Response Time(6) (10% to 90%) Warm-Up Time (7) Offset Stability 1. 1.0 kPa (kiloPascal) equals 0.145 psi. 2. Device is ratiometric within this specified excitation range. Operating the device above the specified excitation range may induce additional error due to device self-heating. 3. Full Scale Span (VFSS) is defined as the algebraic difference between the output voltage at full rated pressure and the output voltage at the minimum related pressure. 4. Offset (VOFF) is defined as the output voltage at the minimum rated pressure. 5. Accuracy (error budget) consists of the following: • Linearity: Output deviation from a straight line relationship with pressure over the specified pressure range. • Temperature Hysteresis:Output deviation at any temperature within the operating temperature range, after the temperature is cycled to and from the minimum or maximum operating temperature points, with zero differential pressure applied. • Pressure Hysteresis: Output deviation at any pressure within the specified range, when this pressure is cycled to and from the minimum or maximum rated pressure, at 25°C. • TcSpan: Output deviation over the temperature range of 0° to 85°C, relative to 25°C. • TcOffset: Output deviation with minimum rated pressure applied, over the temperature range of 0° to 85°C, relative to 25°C. • Variation from Nominal: The variation from nominal values, for Offset or Full Scale Span, as a percent of VFSS, at 25°C. 6. Response Time is defined as the time form the incremental change in the output to go from 10% to 90% of its final value when subjected to a specified step change in pressure. 7. Offset stability is the product’s output deviation when subjected to 1000 hours of Pulsed Pressure, Temperature Cycling with Bias Test. MPX2053 Sensors Freescale Semiconductor 3 Output (mVdc) ON-CHIP TEMPERATURE COMPENSATION AND CALIBRATION 40 35 30 25 20 15 10 5 0 –5 kPa PSI VS = 10 Vdc TA = 25°C MPX2053 P1 > P2 TYP Span Range (Typical) MAX MIN 0 12.5 1.8 25 3.6 37.5 5.4 Offset (Typical) 50 7.25 Figure 2. Output vs. Pressure Differential Figure 2 shows the output characteristics of the MPX2053/ MPXV2053G series at 25°C. The output is directly proportional to the differential pressure and is essentially a straight line. Silicone Die Coat The effects of temperature on full scale span and offset are very small and are shown under Operating Characteristics. Stainless Steel Metal Cover Die P1 Epoxy Case Wire Bond RTV Die Bond Lead Frame P2 Figure 3. Unibody Package: Cross Sectional Diagram (Not to Scale) LINEARITY Linearity refers to how well a transducer's output follows the equation: Vout = Voff + sensitivity x P over the operating pressure range. There are two basic methods for calculating nonlinearity: (1) end point straight line fit (see Figure 4) or (2) a least squares best line fit. While a least squares fit gives the “best case” linearity error (lower numerical value), the calculations required are burdensome. Conversely, an end point fit will give the “worst case” error (often more desirable in error budget calculations) and the calculations are more straightforward for the user. Freescale’s specified pressure sensor linearities are based on the end point straight line method measured at the midrange pressure. Least Square Deviation Least Squares Fit Relative Voltage Output Figure 3 illustrates the differential/gauge die in the basic chip carrier (Case 344). A silicone gel isolates the die surface and wire bonds from the environment, while allowing the pressure signal to be transmitted to the silicon diaphragm. The MPX2053/MPXV2053G series pressure sensor operating characteristics and internal reliability and qualification tests are based on use of dry air as the pressure media. Media other than dry air may have adverse effects on sensor performance and long term reliability. Contact the factory for information regarding media compatibility in your application. Exaggerated Performance Curve Straight Line Deviation End Point Straight Line Fit Offset 0 50 Pressure (% Full Scale) 100 Figure 4. Linearity Specification Comparison MPX2053 4 Sensors Freescale Semiconductor PRESSURE (P1)/VACUUM (P2) SIDE IDENTIFICATION TABLE Freescale designates the two sides of the pressure sensor as the Pressure (P1) side and the Vacuum (P2) side. The Pressure (P1) side is the side containing silicone gel which isolates the die from the environment. The Freescale MPX pressure sensor is designed to operate with positive differential pressure applied, P1 > P2. The Pressure (P1) side may be identified by using the following table. Table 3. Pressure (P1) Side Delineation Part Number MPX2053D Case Type 344 Pressure (P1) Side Identifier Stainless Steep Cap MPX2053DP 344C Side with Part Marking MPX2053GP 344B Side with Port Attached MPX2053GSX 344F Side with Port Attached MPXV2053GVP 344D Stainless Steep Cap MPXV2053GP 1369 Side with Port Attached MPXV2053DP 1351 Side with Part Marking MPX2053 Sensors Freescale Semiconductor 5 PACKAGE DIMENSIONS C R M 1 B 2 -A- 3 Z 4 DIM A B C D F G J L M N R Y Z N L 1 2 3 4 PIN 1 -TSEATING PLANE J F G F Y D 4 PL 0.136 (0.005) STYLE 1: PIN 1. 2. 3. 4. M T A DAMBAR TRIM ZONE: THIS IS INCLUDED WITHIN DIM. "F" 8 PL M STYLE 2: PIN 1. 2. 3. 4. GROUND + OUTPUT + SUPPLY - OUTPUT STYLE 3: PIN 1. 2. 3. 4. VCC - SUPPLY + SUPPLY GROUND NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: INCH. 3. DIMENSION -A- IS INCLUSIVE OF THE MOLD STOP RING. MOLD STOP RING NOT TO EXCEED 16.00 (0.630). INCHES MILLIMETERS MIN MAX MIN MAX 0.595 0.630 15.11 16.00 0.514 0.534 13.06 13.56 0.200 0.220 5.08 5.59 0.016 0.020 0.41 0.51 0.048 0.064 1.22 1.63 0.100 BSC 2.54 BSC 0.014 0.016 0.36 0.40 0.695 0.725 17.65 18.42 30˚ NOM 30˚ NOM 0.475 0.495 12.07 12.57 0.430 0.450 10.92 11.43 0.048 0.052 1.22 1.32 0.106 0.118 2.68 3.00 GND -VOUT VS +VOUT CASE 344-15 ISSUE AA UNIBODY PACKAGE SEATING PLANE NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. -A- -T- U L R H N PORT #1 POSITIVE PRESSURE (P1) -Q- B 1 2 3 4 PIN 1 K -P0.25 (0.010) J M T Q S S F C G D 4 PL 0.13 (0.005) M T S S Q S DIM A B C D F G H J K L N P Q R S U INCHES MILLIMETERS MIN MAX MIN MAX 1.145 1.175 29.08 29.85 0.685 0.715 17.40 18.16 0.305 0.325 7.75 8.26 0.016 0.020 0.41 0.51 0.048 0.064 1.22 1.63 0.100 BSC 2.54 BSC 0.182 0.194 4.62 4.93 0.014 0.016 0.36 0.41 0.695 0.725 17.65 18.42 0.290 0.300 7.37 7.62 0.420 0.440 10.67 11.18 0.153 0.159 3.89 4.04 0.153 0.159 3.89 4.04 0.230 0.250 5.84 6.35 0.220 0.240 5.59 6.10 0.910 BSC 23.11 BSC STYLE 1: PIN 1. GROUND 2. + OUTPUT 3. + SUPPLY 4. - OUTPUT CASE 344B-01 ISSUE B UNIBODY PACKAGE MPX2053 6 Sensors Freescale Semiconductor PACKAGE DIMENSIONS NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. -AU V PORT #1 R W L H PORT #2 N DIM A B C D F G H J K L N P Q R S U V W PORT #1 POSITIVE PRESSURE (P1) PORT #2 VACUUM (P2) -QB SEATING PLANE SEATING PLANE 1 2 3 4 PIN 1 K -P-T- -T- 0.25 (0.010) M T Q S S F J G D 4 PL C 0.13 (0.005) T S M S Q S INCHES MILLIMETERS MIN MAX MIN MAX 1.145 1.175 29.08 29.85 0.685 0.715 17.40 18.16 0.405 0.435 10.29 11.05 0.016 0.020 0.41 0.51 0.048 0.064 1.22 1.63 0.100 BSC 2.54 BSC 0.182 0.194 4.62 4.93 0.014 0.016 0.36 0.41 0.695 0.725 17.65 18.42 0.290 0.300 7.37 7.62 0.420 0.440 10.67 11.18 0.153 0.159 3.89 4.04 0.153 0.159 3.89 4.04 0.063 0.083 1.60 2.11 0.220 0.240 5.59 6.10 0.910 BSC 23.11 BSC 0.248 0.278 6.30 7.06 0.310 0.330 7.87 8.38 STYLE 1: PIN 1. 2. 3. 4. GROUND + OUTPUT + SUPPLY - OUTPUT CASE 344C-01 ISSUE B UNIBODY PACKAGE NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: INCH. -AU SEATING PLANE -T- L H PORT #2 VACUUM (P2) R DIM A B C D F G H J K L N P Q R S U POSITIVE PRESSURE (P1) N -Q- B 1 2 3 4 K PIN 1 S C F -P- J 0.25 (0.010) M T Q S G D 4 PL 0.13 (0.005) M T S S Q S STYLE 1: PIN 1. 2. 3. 4. INCHES MILLIMETERS MIN MAX MIN MAX 1.145 1.175 29.08 29.85 0.685 0.715 17.40 18.16 0.305 0.325 7.75 8.26 0.016 0.020 0.41 0.51 0.048 0.064 1.22 1.63 0.100 BSC 2.54 BSC 0.182 0.194 4.62 4.93 0.014 0.016 0.36 0.41 0.695 0.725 17.65 18.42 0.290 0.300 7.37 7.62 0.420 0.440 10.67 11.18 0.153 0.159 3.89 4.04 0.153 0.158 3.89 4.04 0.230 0.250 5.84 6.35 0.220 0.240 5.59 6.10 0.910 BSC 23.11 BSC GROUND + OUTPUT + SUPPLY - OUTPUT CASE 344D-01 ISSUE B UNIBODY PACKAGE MPX2053 Sensors Freescale Semiconductor 7 PACKAGE DIMENSIONS -TC A E -Q- U N V B R PORT #1 POSITIVE PRESSURE (P1) PIN 1 -P0.25 (0.010) M T Q M 4 3 2 1 S K J F D 4 PL 0.13 (0.005) NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. DIM A B C D E F G J K N P Q R S U V INCHES MILLIMETERS MIN MAX MIN MAX 1.080 1.120 27.43 28.45 0.740 0.760 18.80 19.30 0.630 0.650 16.00 16.51 0.016 0.020 0.41 0.51 0.160 0.180 4.06 4.57 0.048 0.064 1.22 1.63 0.100 BSC 2.54 BSC 0.014 0.016 0.36 0.41 0.220 0.240 5.59 6.10 0.070 0.080 1.78 2.03 0.150 0.160 3.81 4.06 0.150 0.160 3.81 4.06 0.440 0.460 11.18 11.68 0.695 0.725 17.65 18.42 0.840 0.860 21.34 21.84 0.182 0.194 4.62 4.92 G M T P S Q S STYLE 1: PIN 1. 2. 3. 4. GROUND V (+) OUT V SUPPLY V (-) OUT CASE 344F-01 ISSUE B UNIBODY PACKAGE MPX2053 8 Sensors Freescale Semiconductor PACKAGE DIMENSIONS PAGE 1 OF 2 CASE 1351-01 ISSUE A SMALL OUTLINE PACKAGE MPX2053 Sensors Freescale Semiconductor 9 PACKAGE DIMENSIONS PAGE 2 OF 2 CASE 1351-01 ISSUE A SMALL OUTLINE PACKAGE MPX2053 10 Sensors Freescale Semiconductor PACKAGE DIMENSIONS PAGE 1 OF 2 CASE 1369-01 ISSUE B SMALL OUTLINE PACKAGE MPX2053 Sensors Freescale Semiconductor 11 PACKAGE DIMENSIONS PAGE 2 OF 2 CASE 1369-01 ISSUE B SMALL OUTLINE PACKAGE MPX2053 12 Sensors Freescale Semiconductor How to Reach Us: Home Page: www.freescale.com Web Support: http://www.freescale.com/support USA/Europe or Locations Not Listed: Freescale Semiconductor, Inc. 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