深圳市南天星电子科技有限公司 专业代理飞思卡尔 (Freescale) 飞思卡尔主要产品 8 位微控制器 16 位微控制器 数字信号处理器与控制器 i.MX 应用处理器 基于 ARM®技术的 Kinetis MCU 32/64 位微控制器与处理器 模拟与电源管理器件 射频器件（LDMOS，收发器） 传感器（压力，加速度，磁场， 触摸，电池） 飞思卡尔产品主要应用 汽车电子 数据连接 消费电子 工业控制 医疗保健 电机控制 网络 智能能源 深圳市南天星电子科技有限公司 电话：0755－83040796 传真：0755－83040790 邮箱：[email protected] 网址：www.soustar.com.cn 地址：深圳市福田区福明路雷圳大厦 2306 室 Pressure Freescale Semiconductor + MPX2200 Rev 13, 10/2008 200 kPa On-Chip Temperature Compensated Silicon Pressure Sensors MPX2200 Series 0 to 200 kPa (0 to 29 psi) 40 mV Full Scale Span (Typical) The MPX2200 series devices are silicon piezoresistive pressure sensor providing a highly accurate and linear voltage output directly proportional to the applied pressure. The sensor is a single monolithic silicon diaphragm with the strain gauge and a thin-film resistor network integrated on-chip. The chip is laser trimmed for precise span and offset calibration and temperature compensation. They are designed for use in applications such as pump/ motor controllers, robotics, level indicators, medical diagnostics, pressure switching, barometers, altimeters, etc. Application Examples • • • • • • • Features • • • • Temperature Compensated Over 0°C to +85°C ±0.25% Linearity (MPX2200D) Easy-to-Use Chip Carrier Package Options Absolute, Differential and Gauge Options Pump/Motor Control Robotics Level Detectors Medical Diagnostics Pressure Switching Barometers Altimeters ORDERING INFORMATION Package Case Device Name Options No. Unibody Package (MPX2200 Series) MPX2200A Tray 344 MPX2200D Tray 344 MPX2200DP Tray 344C MPX2200AP Tray 344B MPX2200GP Tray 344B None # of Ports Single Dual Gauge • • Absolute Device Marking • MPX2200A • • • • • Pressure Type Differential • • MPX2200AP/GP CASE 344B-01 © Freescale Semiconductor, Inc., 2006-2008. All rights reserved. MPX2200AP MPX2200GP UNIBODY PACKAGES MPX2200A/D CASE 344-15 MPX2200D MPX2200DP MPX2200DP CASE 344C-01 Pressure Operating Characteristics Table 1. Operating Characteristics (VS = 10 VDC, TA = 25°C unless otherwise noted, P1 > P2) Characteristic Symbol Min Typ Max Units POP 0 — 200 kPa Supply Voltage(2) VS — 10 16 VDC Supply Current IO — 6.0 — mAdc Full Scale Span(3) VFSS 38.5 40 41.5 mV Offset(4) VOFF -1.0 — 1.0 mV Sensitivity ΔV/ΔΡ — 0.2 — mV/kPa — -0.25 -1.0 — — 0.25 1.0 %VFSS Pressure Hysteresis(0 to 200 kPa) — — ±0.1 — %VFSS Temperature Hysteresis(- 40°C to +125°C) — — ±0.5 — %VFSS Temperature Coefficient of Full Scale Span TCVFSS -1.0 — 1.0 %VFSS Temperature Coefficient of Offset TCVOFF -1.0 — 1.0 mV ZIN 1300 — 2500 Ω ZOUT 1400 — 3000 Ω Response Time(5) (10% to 90%) tR — 1.0 — ms Warm-Up Time(6) — — 20 — ms Offset Stability(7) — — ±0.5 — %VFSS Differential Pressure Range(1) Linearity Input Impedance Output Impedance MPX2200D Series MPX2200A Series 1. 1.0 kPa (kiloPascal) equals 0.145 psi. 2. Device is ratiometric within this specified excitation range. Operating the device above the specified excitation range may induce additional error due to device self-heating. 3. Full Scale Span (VFSS) is defined as the algebraic difference between the output voltage at full rated pressure and the output voltage at the minimum rated pressure. 4. Offset (VOFF) is defined as the output voltage at the minimum rated pressure. 5. Response Time is defined as the time for the incremental change in the output to go from 10% to 90% of its final value when subjected to a specified step change in pressure. 6. Warm-up Time is defined as the time required for the product to meet the specified output voltage after the pressure is stabilized. 7. Offset stability is the product’s output deviation when subjected to 1000 hours of Pulsed Pressure, Temperature Cycling with Bias Test. MPX2200 2 Sensors Freescale Semiconductor Pressure Maximum Ratings Table 2. Maximum Ratings(1) Rating Max Value Unit 800 kPa Storage Temperature –40 to +125 °C Operating Temperature –40 to +125 °C Maximum Pressure (P1 > P2) 1. Exposure beyond the specified limits may cause permanent damage or degradation to the device. Voltage Output versus Applied Differential The output voltage of the differential or gauge sensor increases with increasing pressure applied to the pressure side (P1) relative to the vacuum side (P2). Similarly, output voltage increases as increasing vacuum is applied to the vacuum side (P2) relative to the pressure side (P1). Figure 1 shows a block diagram of the internal circuitry on the stand-alone pressure sensor chip. VS 3 Thin Film Temperature Compensation and Calibration Circuitry Sensing Element 2 4 +VOUT –VOUT 1 GND Figure 1. Temperature Compensated and Calibrated Pressure Sensor Schematic MPX2200 Sensors Freescale Semiconductor 3 Pressure On-Chip Temperature Compensation and Calibration VS = 10 VDC TA = 25°C P1 > P2 40 35 30 TYP Span Range (TYP) Output (mVDC) 25 MAX 20 15 MIN 10 5 0 kPa PSI -5 0 25 50 7.25 75 100 125 14.5 Pressure 150 21.75 175 Offset (TYP) 200 29 Figure 2. Output vs. Pressure Differential Figure 2 shows the output characteristics of the MPX2200 series at 25°C. The output is directly proportional to the differential pressure and is essentially a straight line. Silicone Gel Die Coat Differential/Gauge Die P1 Epoxy Case Differential/Gauge Element P2 Absolute Die Silicone Gel Die Coat Stainless Steel Metal Cover Wire Bond Lead Frame The effects of temperature on full scale span and offset are very small and are shown under Operating Characteristics. Bond Die Stainless Steel Metal Cover P1 Epoxy Case Wire Bond Lead Frame Die Bond Absolute Element P2 Figure 3. Cross Sectional Diagram (not to scale) LINEARITY Linearity refers to how well a transducer's output follows the equation: VOUT = VOFF + sensitivity x P over the operating pressure range. There are two basic methods for calculating nonlinearity: (1) end point straight line fit (see Figure 4) or (2) a least squares best line fit. While a least squares fit gives the “best case” linearity error (lower numerical value), the calculations required are burdensome. Conversely, an end point fit will give the “worst case” error (often more desirable in error budget calculations) and the calculations are more straightforward for the user. Freescale’s specified pressure sensor linearities are based on the end point straight line method measured at the midrange pressure. Least Square Deviation Least Squares Fit Relative Voltage Output Figure 3 illustrates the differential/gauge die in the basic chip carrier (Case 344). A silicone gel isolates the die surface and wire bonds from the environment, while allowing the pressure signal to be transmitted to the silicon diaphragm. The MPX2200 series pressure sensor operating characteristics and internal reliability and qualification tests are based on use of dry air as the pressure media. Media other than dry air may have adverse effects on sensor performance and long term reliability. Contact the factory for information regarding media compatibility in your application. Exaggerated Performance Curve Straight Line Deviation End Point Straight Line Fit Offset 0 50 Pressure (% Full Scale) 100 Figure 4. Linearity Specification Comparison MPX2200 4 Sensors Freescale Semiconductor Pressure PRESSURE (P1)/VACUUM (P2) SIDE IDENTIFICATION TABLE Freescale designates the two sides of the pressure sensor as the Pressure (P1) side and the Vacuum (P2) side. The Pressure (P1) side is the side containing silicone gel which isolates the die from the environment. The Freescale MPX pressure sensor is designed to operate with positive differential pressure applied, P1 > P2. The Pressure (P1) side may be identified by using the following table. Table 3. Pressure (P1) Side Delineation Part Number Case Type Pressure (P1) Side Identifier MPX2200D/A 344 Stainless Steel Cap MPX2200DP 344C Side with Part Marking MPX2200GP/AP 344B Side with Port Attached MPX2200 Sensors Freescale Semiconductor 5 PACKAGE DIMENSIONS C R M 1 B 2 -A- 3 Z 4 DIM A B C D F G J L M N R Y Z N L 1 2 3 4 PIN 1 -TSEATING PLANE J F G F Y D 4 PL 0.136 (0.005) STYLE 1: PIN 1. 2. 3. 4. M T A DAMBAR TRIM ZONE: THIS IS INCLUDED WITHIN DIM. "F" 8 PL M STYLE 2: PIN 1. 2. 3. 4. GROUND + OUTPUT + SUPPLY - OUTPUT STYLE 3: PIN 1. 2. 3. 4. VCC - SUPPLY + SUPPLY GROUND NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: INCH. 3. DIMENSION -A- IS INCLUSIVE OF THE MOLD STOP RING. MOLD STOP RING NOT TO EXCEED 16.00 (0.630). INCHES MILLIMETERS MIN MAX MIN MAX 0.595 0.630 15.11 16.00 0.514 0.534 13.06 13.56 0.200 0.220 5.08 5.59 0.016 0.020 0.41 0.51 0.048 0.064 1.22 1.63 0.100 BSC 2.54 BSC 0.014 0.016 0.36 0.40 0.695 0.725 17.65 18.42 30˚ NOM 30˚ NOM 0.475 0.495 12.07 12.57 0.430 0.450 10.92 11.43 0.048 0.052 1.22 1.32 0.106 0.118 2.68 3.00 GND -VOUT VS +VOUT CASE 344-15 ISSUE AA UNIBODY PACKAGE SEATING PLANE NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. -A- -T- U L R H N PORT #1 POSITIVE PRESSURE (P1) -Q- B 1 2 3 4 PIN 1 K -P0.25 (0.010) J M T Q S S F C G D 4 PL 0.13 (0.005) M T S S Q S DIM A B C D F G H J K L N P Q R S U INCHES MILLIMETERS MIN MAX MIN MAX 1.145 1.175 29.08 29.85 0.685 0.715 17.40 18.16 0.305 0.325 7.75 8.26 0.016 0.020 0.41 0.51 0.048 0.064 1.22 1.63 0.100 BSC 2.54 BSC 0.182 0.194 4.62 4.93 0.014 0.016 0.36 0.41 0.695 0.725 17.65 18.42 0.290 0.300 7.37 7.62 0.420 0.440 10.67 11.18 0.153 0.159 3.89 4.04 0.153 0.159 3.89 4.04 0.230 0.250 5.84 6.35 0.220 0.240 5.59 6.10 0.910 BSC 23.11 BSC STYLE 1: PIN 1. GROUND 2. + OUTPUT 3. + SUPPLY 4. - OUTPUT CASE 344B-01 ISSUE B UNIBODY PACKAGE MPX2200 6 Sensors Freescale Semiconductor PACKAGE DIMENSIONS NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. -AU V PORT #1 R W L H PORT #2 PORT #1 POSITIVE PRESSURE (P1) PORT #2 VACUUM (P2) N -QB SEATING PLANE SEATING PLANE 1 2 3 4 PIN 1 K -P-T- -T- 0.25 (0.010) M T Q S S F J G D 4 PL C 0.13 (0.005) M T S S Q S DIM A B C D F G H J K L N P Q R S U V W INCHES MILLIMETERS MIN MAX MIN MAX 1.145 1.175 29.08 29.85 0.685 0.715 17.40 18.16 0.405 0.435 10.29 11.05 0.016 0.020 0.41 0.51 0.048 0.064 1.22 1.63 0.100 BSC 2.54 BSC 0.182 0.194 4.62 4.93 0.014 0.016 0.36 0.41 0.695 0.725 17.65 18.42 0.290 0.300 7.37 7.62 0.420 0.440 10.67 11.18 0.153 0.159 3.89 4.04 0.153 0.159 3.89 4.04 0.063 0.083 1.60 2.11 0.220 0.240 5.59 6.10 0.910 BSC 23.11 BSC 0.248 0.278 6.30 7.06 0.310 0.330 7.87 8.38 STYLE 1: PIN 1. 2. 3. 4. GROUND + OUTPUT + SUPPLY - OUTPUT CASE 344C-01 ISSUE B UNIBODY PACKAGE MPX2200 Sensors Freescale Semiconductor 7 How to Reach Us: Home Page: www.freescale.com Web Support: http://www.freescale.com/support USA/Europe or Locations Not Listed: Freescale Semiconductor, Inc. Technical Information Center, EL516 2100 East Elliot Road Tempe, Arizona 85284 1-800-521-6274 or +1-480-768-2130 www.freescale.com/support Europe, Middle East, and Africa: Freescale Halbleiter Deutschland GmbH Technical Information Center Schatzbogen 7 81829 Muenchen, Germany +44 1296 380 456 (English) +46 8 52200080 (English) +49 89 92103 559 (German) +33 1 69 35 48 48 (French) www.freescale.com/support Japan: Freescale Semiconductor Japan Ltd. Headquarters ARCO Tower 15F 1-8-1, Shimo-Meguro, Meguro-ku, Tokyo 153-0064 Japan 0120 191014 or +81 3 5437 9125 [email protected] Asia/Pacific: Freescale Semiconductor China Ltd. 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