MICREL SY89841UMG

SY89841U
Precision LVDS Runt Pulse
Eliminator 2:1 Multiplexer
General Description
The SY89841U is a low jitter LVDS, 2:1 input
multiplexer (MUX) optimized for redundant source
switchover applications. Unlike standard
multiplexers, the SY89841U unique 2:1 Runt Pulse
Eliminator (RPE) MUX prevents any short cycles or
“runt” pulses during switchover. In addition, a unique
Fail-safe Input protection prevents metastable
conditions when the selected input clock fails to a
DC voltage (voltage between the pins of the
differential input drops below 100mV).
The differential input includes Micrel’s unique, 3-pin
input termination architecture that allows customers
to interface to any differential signal (AC- or DCcoupled) as small as 100mV (200mVpp) without any
level shifting or termination resistor networks in the
signal path. The outputs are 350mV, LVDS with fast
rise/fall times guaranteed to be less than 150ps.
The SY89841U operates from a 2.5V ±5% supply
and is guaranteed over the full industrial
temperature range of –40°C to +85°C. The
SY89841U is part of Micrel’s high-speed, Precision
Edge® product line. All support documentation can
be found on Micrel’s web site at: www.micrel.com.
Precision Edge®
Features
• Selects between two sources, and provides a
glitch-free, stable LVDS output
• Guaranteed AC performance over temperature
and supply voltage:
– wide operating frequency: 1kHz to >1.5GHz
– <870ps In-to-Out tpd
– <150ps tr/tf
• Unique patent-pending input isolation design
minimizes crosstalk
• Fail-safe input prevents oscillations
• Ultra-low jitter design:
– <1psrms random jitter
– <1psrms cycle-to-cycle jitter
– <10pspp total jitter (clock)
– <0.7psrms MUX crosstalk induced jitter
• Unique patent-pending input termination and VT
pin accepts DC-coupled and AC-coupled inputs
(CML, PECL, LVDS)
• 350mV LVDS output swing
• 2.5V +5% power supply
• –40°C to +85°C industrial temperature range
• Available in 16-pin (3mm x 3mm) MLF™ package
Applications
• Redundant clock switchover
• Fail-safe clock protection
Markets
•
•
•
•
LAN/WAN
Enterprise servers
ATE
Test and measurement
Precision Edge is a registered trademark of Micrel, Inc.
MicroLeadFrame and MLF are trademarks of Amkor Technology, Inc.
February 2005
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SY89841U
Typical Application
Primary Clock
From System
IN0
50Ω
VT0
50Ω
/IN0
VREF-AC0
Secondary Clock
From Local Oscillator
IN1
50Ω
VT1
50Ω
/IN1
VREF-AC1
SEL
(LVTTL/CMOS)
February 2005
Primary
Clock
2:1 MUX
Secondary
Clock
0
SEL
MUX
1
Select Primary
Select Secondary
OUTPUT
S
Runt pulse eliminated
from output
Switchover
occurs
Simplified Example Illustrating Runt Pulse Eliminator (RPE)
Circuit when Primary Clock Fails
Runt Pulse
Elimination Logic
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Ordering Information(1)
Part Number
Package
Type
Operating
Range
Package Marking
Lead
Finish
SY89841UMG
MLF-16
Industrial
841U with Pb-Free bar-line Indicator
NiPdAu
Pb-Free
SY89841UMGTR(2)
MLF-16
Industrial
841U with Pb-Free bar-line Indicator
NiPdAu
Pb-Free
Notes:
1. Contact factory for die availability. Dice are guaranteed at TA = 25°C, DC Electricals Only.
2. Tape and Reel.
IN1
VT1
VREF-AC1
/IN1
Pin Configuration
16
15
14
13
VREF-AC0
2
11
CAP
VT0
3
10
SEL
IN0
4
9
GND
5
6
7
8
VCC
VCC
/Q
12
Q
1
VCC
/IN0
16-Pin MLF™ (MLF-16)
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Pin Description
Pin Number
Pin Name
Pin Function
4, 1,
16, 13
IN0, /IN0,
IN1, /IN1
Differential Inputs: These input pairs are the differential signal inputs to the
device. These inputs accept AC- or DC-coupled signals as small as 100mV.
Each pin of a pair internally terminates to a VT pin through 50. Please refer to
the “Input Interface Applications” section for more details.
VREF-AC0
VREF-AC1
Reference Voltage: This output biases to VCC –1.2V. It is used for AC-coupling
inputs IN and /IN. Connect VREF-AC directly to the corresponding VT pin. Bypass
with 0.01µF low ESR capacitor to VCC. Maximum sink/source current is ±1.5mA.
Due to the limited drive capability, the VREF-AC pin is only intended to drive its
respective VT pin. See the “Input Interface Applications” section for more details.
3, 15
VT0, VT1
Input Termination Center-Tap: Each side of the differential input pair terminates
to a VT pin. The VT0 and VT1 pins provide a center-tap to a termination network
for maximum interface flexibility. See the “Input Interface Applications” section
for more details.
5, 8, 12
VCC
Positive Power Supply: Bypass with 0.1µF//0.01µF low ESR capacitors as close
to the VCC pins as possible.
6, 7
Q, /Q
Differential Outputs: This LVDS differential output is a logic function of the IN0,
IN1, and SEL inputs. Please refer to the truth table below for details.
10
SEL
This single-ended TTL/CMOS-compatible input selects the inputs to the
multiplexer. Note that this input is internally connected to a 25k pull-up resistor
and will default to logic HIGH state if left open.
9
GND
Exposed Pad
2, 14
11
CAP
Ground: Ground and exposed pad must be connected to the same ground
plane.
Power-On Reset (POR) Initialization capacitor. When using the multiplexer with
RPE capability, this pin is tied to a capacitor to VCC. The purpose is to ensure the
internal RPE logic starts up in a known state. See “Power-On Reset (POR)
Description” section for more details regarding capacitor selection. If this pin is
tied directly to VCC, the RPE function will be disabled and the multiplexer will
function as a normal multiplexer. The CAP pin should never be left open.
Truth Table
Inputs
February 2005
Outputs
IN0
/IN0
IN1
/IN1
SEL
Q
/Q
0
1
X
X
0
0
1
1
0
X
X
0
1
0
X
X
0
1
1
0
1
X
X
1
0
1
1
0
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SY89841U
Absolute Maximum Ratings(1)
Operating Ratings(2)
Supply Voltage (VCC)............................. –0.5V to +4.0V
Input Voltage (VIN)..................................... –0.5V to VCC
Termination Current
Source or sink current on VT..................... ±100mA
Source or sink current on IN, /IN................ ±50mA
VREF-AC Source or sink current.............................. ±2mA
Lead Temperature (soldering, 20 sec.)............ +260°C
Storage Temperature (Ts) ...................–65°C to 150°C
Supply Voltage (VCC) ....................+2.375V to +2.625V
Ambient Temperature (TA) .................. –40°C to +85°C
Package Thermal Resistance(3)
MLF™ (JA)
Still-Air ........................................................ 60°C/W
MLF™ (JB)
Junction-to-Board ...................................... 33°C/W
DC Electrical Characteristics(4)
TA = –40°C to +85°C, unless otherwise stated.
Symbol
Parameter
VCC
Power Supply
ICC
Power Supply Current
RIN
Input Resistance
(IN-to-VT)
RDIFF_IN
Condition
Min
Typ
Max
Units
2.625
V
85
120
mA
45
50
55
Differential Input Resistance
(IN-to-/IN)
90
100
110
VIH
Input High Voltage
(IN, /IN)
1.2
VCC
V
VIL
Input Low Voltage
(IN, /IN)
0
VIH–0.1
V
VIN
Input Voltage Swing
(IN, /IN)
See Figure 1a. Note 5.
0.1
VCC
V
VDIFF_IN
Differential Input Voltage Swing
|IN-/IN|
See Figure 1b.
0.2
VIN_FSI
Input Voltage Threshold that
Triggers FSI
VT_IN
IN-to-VT
(IN, /IN)
VREF-AC
Output Reference Voltage
2.375
No load, max VCC
V
30
VCC–1.3
VCC–1.2
100
mV
1.28
V
VCC–1.1
V
Notes:
1. Permanent device damage may occur if absolute maximum ratings are exceeded. This is a stress rating only and functional operation is
not implied at conditions other than those detailed in the operational sections of this data sheet. Exposure to absolute maximum rating
conditions for extended periods may affect device reliability.
2. The data sheet limits are not guaranteed if the device is operated beyond the operating ratings.
3. Package Thermal Resistance assumes exposed pad is soldered (or equivalent) to the devices most negative potential on the PCB. JA and
JB values are determined for a 4-layer board in still air unless otherwise stated.
4. The circuit is designed to meet the DC specifications shown in the above table after thermal equilibrium has been established.
5. VIN(max) is specified when VT is floating.
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LVDS Outputs DC Electrical Characteristics(7)
VCC = 2.5V ±5%; RL = 100 across output pair or equivalent; TA = –40°C to + 85°C, unless otherwise stated.
Symbol
Parameter
Condition
Min
Typ
Max
Units
VOCM
Output Common Mode Voltage
1.125
1.275
V
VOCM
Change in Common Mode Voltage
–50
+50
mV
VOUT
Output Voltage Swing
See Figure 1a.
250
350
mV
VDIFF-OUT
Differential Output Voltage Swing
See Figure 1b.
500
700
mV
Min
Typ
LVTTL/CMOS DC Electrical Characteristics(7)
VCC = 2.5V ±5%; TA = –40°C to + 85°C, unless otherwise stated.
Symbol
Parameter
VIH
Input HIGH Voltage
Condition
VIL
Input LOW Voltage
IIH
Input HIGH Current
-125
IIL
Input LOW Current
-300
Max
2.0
Units
V
0.8
V
30
µA
µA
Note:
7. The circuit is designed to meet the DC specifications shown in the above table after thermal equilibrium has been established.
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SY89841U
AC Electrical Characteristics(8)
VCC = 2.5V ±5%; RL = 100 across output pair or equivalent; TA = –40°C to + 85°C, unless otherwise stated.
Symbol
Parameter
Condition
Min
Typ
fMAX
Maximum Operating Frequency
Clock
1.5
2.0
tpd
Differential Propagation Delay
In-to-Q
VIN = 100mV to 200mV(9)
470
625
870
ps
In-to-Q
VIN = 200mV to 800mV(9)
440
575
800
ps
SEL-to-Q
RPE enabled, see Timing Diagram
17
cycles
SEL-to-Q
RPE disabled (VIN = VCC/2)
900
ps
550
Max
Units
GHz
tpd
Tempco
Differential Propagation Delay
Temperature Coefficient
tSKEW
Part-to-Part Skew
Note 10
200
ps
tJitter
Random Jitter
Note 11
1
ps(rms)
Cycle-to-Cycle Jitter
Note 12
1
ps(rms)
Total Jitter (TJ)
Note 13
10
ps(pp)
Crosstalk-Induced Jitter
Note 14
0.7
ps(rms)
Output Rise/Fall Time (20% to 80%)
At full output swing.
150
ps
tr, tf
fs/oC
115
30
70
Notes:
8. High-frequency AC-parameters are guaranteed by design and characterization.
9. Propagation delay is measured with input tr, tf 300ps (20% to 80%) and VIL 800mV.
10. Part-to-part skew is defined for two parts with identical power supply voltages at the same temperature and with no skew of the edges at
the respective inputs.
11. Random Jitter is measured with a K28.7 character pattern, measured at <fMAX.
12. Cycle-to-cycle jitter definition: the variation of periods between adjacent cycles, Tn – Tn-1 where T is the time between rising edges of the
output signal.
13. Total Jitter definition: with an ideal clock input of frequency <fMAX, no more than one output edge in 1012 output edges will deviate by more
than the specified peak-to-peak jitter value.
14. Crosstalk is measured at the output while applying two similar differential clock frequencies that are asynchronous with respect to each
other at the inputs.
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SY89841U
Functional Description
RPE and FSI Functionality
The basic operation of the RPE MUX and FSI
functionality is described with the following four case
descriptions. All descriptions are related to the true
inputs and outputs. The primary (or selected) clock
is called CLK1; the secondary (or alternate) clock is
called CLK2. Due to the totally asynchronous
relation of the IN and SEL signals and an additional
internal protection against metastability, the number
of pulses required for the operations described in
cases 1-4 can vary within certain limits. Refer to
“Timing Diagrams” section for detailed information.
RPE MUX and Fail-Safe Input
The SY89841U is optimized for clock switchover
applications where switching from one clock to
another clock without runt pulses (short cycles) is
required. It features two unique circuits:
Runt-Pulse Eliminator (RPE) Circuit
The RPE MUX provides a “glitchless” switchover
between two clocks and prevents any runt pulses
from occurring during the switchover transition. The
design of both clock inputs is identical (i.e., the
switchover sequence and protection is symmetrical
for both input pair, IN0 or IN1. Thus, either input pair
may be defined as the primary input). If not required,
the RPE function can be permanently disabled to
allow the switchover between inputs to occur
immediately. If the CAP pin is tied directly to VCC,
the RPE function will be disabled and the multiplexer
will function as a normal multiplexer.
Case #1: Two Normal Clocks and RPE Enabled
In this case, the frequency difference between the
two running clocks, IN0 and IN1, must not be greater
than 1.5:1. For example, if the IN0 clock is 500MHz,
the IN1 clock must be within the range of 334MHz to
750MHz.
If the SEL input changes state to select the alternate
clock, the switchover from CLK1 to CLK2 will occur
in three stages.
Fail-Safe Input (FSI) Circuit
• Stage 1: The output will continue to follow CLK1
for a limited number of pulses.
• Stage 2: The output will remain LOW for a
limited number of pulses of CLK2.
• Stage 3: The output follows CLK2.
The FSI function provides protection against a
selected input pair that drops below the minimum
amplitude requirement. If the selected input pair
drops sufficiently below the 100mV minimum singleended input amplitude limit (VIN), or 200mV
differentially (Vdiff_IN), the output will latch to the last
valid clock state.
Stage 1
Stage 2
Stage 3
CLK1
CLK2
SEL
Select CLK2
Select CLK1
OUTPUT
Runt pulse eliminated
from output
3 to 5 falling edges
of CLK1
4 to 5 falling edges
of CLK2
Timing Diagram 1
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Case #2: Input Clock Failure: Switching from a
selected clock stuck HIGH to a valid clock (RPE
enabled).
• Stage 1: The output will remain HIGH for a
limited number of pulses of CLK2.
• Stage 2: The output will switch to LOW and then
remain LOW for a limited number of falling edges
of CLK2.
• Stage 3: The output will follow CLK2.
If CLK1 fails HIGH before the RPE MUX selects
CLK2 (using the SEL pin), the switchover will occur
in three stages.
Stage 1
Stage 2
Stage 3
CLK1
CLK2
Select CLK2
Select CLK1
SEL
OUTPUT
14 to 16 falling edges of CLK2
Runt pulse eliminated
from output
Timing Diagram 2
Note: Output show extended clock cycle during switchover. Pulse width for both high and low of this cycle will always be
greater than 50% of the CLK2 period.
Case #3: Input Clock Failure: Switching from a
selected clock stuck Low to a valid clock (RPE
enabled).
• Stage 1: The output will remain LOW for a
limited number of falling edges of CLK2.
• Stage 2: The output will follow CLK2.
If CLK1 fails LOW before the RPE MUX selects
CLK2 (using the SEL pin), the switchover will occur
in two stages.
Stage 1
Stage 2
CLK1
CLK2
SEL
Select CLK2
Select CLK1
OUTPUT
13 to 17 falling edges of CLK2
Timing Diagram 3
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If the selected input clock fails to a floating, static, or
extremely low signal swing, including 0mV, the FSI
function will eliminate any metastable condition and
guarantee a stable output signal. No ringing and no
undetermined state will occur at the output under
these conditions.
Case #4: Input Clock Failure: Switching from the
selected clock input stuck in an undetermined state
to a valid clock input (RPE enabled).
If CLK1 fails to an undetermined state (e.g.,
amplitude falls below the 100mV (VIN) minimum
single-ended input limit, or 200mV differentially)
before the RPE MUX selects CLK2 (using the SEL
pin), the switchover to the valid clock CLK2 will
occur either following Case #2 or Case #3,
depending upon the last valid state at the CLK1
Please note that the FSI function will not prevent
duty cycle distortions or runt pulses in case of a
slowly deteriorating (but still toggling) input signal.
Due to the FSI function, the propagation delay will
depend on rise and fall time of the input signal and
on its amplitude. Refer to “Typical Operating
Characteristics” for detailed information.
CLK1
CLK2
SEL
Select CLK2
Select CLK1
OUTPUT
as in case #2
as in case #3
Timing Diagram 4
Power-On Reset (POR) Description
The following formula describes this relationship:
The SY89841U includes an internal power-on reset
(POR) function to ensure the RPE logic starts-up in
a known logic state once the power-supply voltage is
stable. An external capacitor connected between VCC
and the CAP pin (pin 11) controls the delay for the
power-on reset function.
C(µF) ≥
As an example, if the time required for the system
power supply to power up past 2.3V is 12ms, then
the required capacitor value on pin 11 would be:
The required capacitor value calculation is based
upon the time the system power supply needs to
power up to a minimum of 2.3V. The time constant
for the internal power-on-reset must be greater than
the time required for the power supply to ramp up to
a minimum of 2.3V.
February 2005
t dPS (ms)
12(ms/µF)
C(µF) ≥
12ms
12(ms/µF)
C ≥ 1µF
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Typical Operating Characteristics
VCC = 2.5, GND = 0V, VIN 400mVpk, tr/tf 300ps, RL = 100 across output pair or equivalent; TA = 25°C, unless otherwise
stated.
Functional Characteristics
VCC = 2.5, GND = 0V, VIN 400mVpk, tr/tf 300ps, RL = 100 across output pair or equivalent; TA = 25°C, unless otherwise
stated.
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Singled-Ended and Differential Swings
VDIFF_IN, VDIFF_OUT
700mV (typical)
VIN,VOUT
350mV (typical)
Figure 1b. Differential Voltage Swing
Figure 1a. Single-Ended Voltage Swing
Input Stage
VCC
IN
50Ω
VT
50Ω
GND
/IN
Figure 2. Simplified Differential Input Stage
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Input Interface Applications
VCC
VCC
VCC
IN
GND
50Ω
0.01µF
50Ω
VT
GND
VCC
GND
VT
GND
NC
SY89841U
SY89841U
19Ω
VREF-AC
/IN
/IN
SY89841U
GND
CML
LVPECL
/IN
VCC
IN
IN
LVPECL
VREF-AC
NC
VT
NC
VREF-AC
0.01µF
Option: may connect VT to VCC
Figure 3a. LVPECL Interface
(DC-Coupled)
VCC
Figure 3b. LVPECL Interface
(AC-Coupled)
Figure 3c. CML Interface
(DC-Coupled)
VCC
IN
IN
CML
LVDS
/IN
/IN
SY89841U
GND VCC
VT
VREF-AC
SY89841U
GND
NC
VT
NC
VREF-AC
0.01µF
Figure 3d. CML Interface
(AC-Coupled)
February 2005
Figure 3e. LVDS Interface
(DC-Coupled)
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LVDS Output Interface Applications
vOD
49.9Ω, ±1%
100Ω
vOH, vOL
vOH, vOL
49.9Ω, ±1%
GND
vOCM,
∆vOCM
GND
Figure 4a. LVDS Differential Measurement
Figure 4b. LVDS Common Mode Measurement
Related Product and Support Documentation
Part Number
Function
Data Sheet Link
SY89840U
Precision LVPECL Runt Pulse Eliminator
2:1 Multiplexer
www.micrel.com/product-info/products/sy89840u.shtml.
SY89842U
Precision CML Runt Pulse Eliminator 2:1
Multiplexer
www.micrel.com/product-info/products/sy89842u.shtml.
MLFTM Application Note
www.amkor.com/products/notes_papers/MLFAppNote.pdf
New Products and Applications
www.micrel.com/product-info/products/solutions.shtml
HBW Solutions
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SY89841U
16 Lead MicroLeadFrameTM (MLF-16)
Packages Notes:
1. Package meets Level 2 Moisture Sensitivity Classification.
2. All parts are dry-packed before shipment.
3. Exposed pad must be soldered to a ground for proper thermal management.
MICREL, INC. 2180 FORTUNE DRIVE SAN JOSE, CA 95131 USA
TEL +1 (408) 944-0800 FAX +1 (408) 474-1000 WEB http:/www.micrel.com
The information furnished by Micrel in this data sheet is believed to be accurate and reliable. However, no responsibility is assumed by Micrel
for its use. Micrel reserves the right to change circuitry and specifications at any time without notification to the customer.
Micrel Products are not designed or authorized for use as components in life support appliances, devices or systems where malfunction of a
product can reasonably be expected to result in personal injury. Life support devices or systems are devices or systems that (a) are intended
for surgical implant into the body or (b) support or sustain life, and whose failure to perform can be reasonably expected to result in a
significant injury to the user. A Purchaser’s use or sale of Micrel Products for use in life support appliances, devices or systems is a
Purchaser’s own risk and Purchaser agrees to fully indemnify Micrel for any damages resulting from such use or sale.
© 2005 Micrel, Incorporated.
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