TI SN74LV244APW

 SCLS383L − SEPTEMBER 1997 − REVISED APRIL 2005
19
3
18
4
17
5
16
6
15
7
14
8
13
9
12
10
11
1A1
2Y4
1A2
2Y3
1A3
2Y2
1A4
2Y1
1
20
2Y4
1A1
1OE
VCC
VCC
VCC
2OE
1Y1
2A4
1Y2
2A3
1Y3
2A2
1Y4
2A1
2
19 2OE
3
18 1Y1
4
17 2A4
16 1Y2
5
SN54LV244A . . . FK PACKAGE
(TOP VIEW)
1A2
2Y3
1A3
2Y2
1A4
15 2A3
14 1Y3
6
7
8
4
3 2 1 20 19
18
5
17
6
16
7
15
8
14
9 10 11 12 13
13 2A2
12 1Y4
9
10
11
1Y1
2A4
1Y2
2A3
1Y3
2Y1
GND
2A1
1Y4
2A2
2
20
2A1
1
Operation
Latch-Up Performance Exceeds 250 mA Per
JESD 17
ESD Protection Exceeds JESD 22
− 2000-V Human-Body Model (A114-A)
− 200-V Machine Model (A115-A)
− 1000-V Charged-Device Model (C101)
SN74LV244A . . . RGY PACKAGE
(TOP VIEW)
SN54LV244A . . . J OR W PACKAGE
SN74LV244A . . . DB, DGV, DW, NS
OR PW PACKAGE
(TOP VIEW)
1OE
1A1
2Y4
1A2
2Y3
1A3
2Y2
1A4
2Y1
GND
D
1OE
D
D
<0.8 V at VCC = 3.3 V, TA = 25°C
Typical VOHV (Output VOH Undershoot)
>2.3 V at VCC = 3.3 V, TA = 25°C
Support Mixed-Mode Voltage Operation on
All Ports
GND
D
D Ioff Supports Partial-Power-Down Mode
2OE
D 2-V to 5.5-V VCC Operation
D Max tpd of 6.5 ns at 5 V
D Typical VOLP (Output Ground Bounce)
description/ordering information
These octal buffers/line drivers are designed for 2-V to 5.5-V VCC operation.
ORDERING INFORMATION
QFN − RGY
SN74LV244ARGYR
Tube of 25
SN74LV244ADW
Reel of 2000
SN74LV244ADWR
SOP − NS
Reel of 2000
SN74LV244ANSR
74LV244A
SSOP − DB
Reel of 2000
SN74LV244ADBR
LV244A
Tube of 70
SN74LV244APW
Reel of 2000
SN74LV244APWR
Reel of 250
SN74LV244APWT
TVSOP − DGV
Reel of 2000
SN74LV244ADGVR
LV244A
CDIP − J
Tube of 20
SNJ54LV244AJ
SNJ54LV244AJ
CFP − W
Tube of 85
SNJ54LV244AW
SNJ54LV244AW
LCCC − FK
Tube of 55
SNJ54LV244AFK
TSSOP − PW
−55°C
−55
C to 125
125°C
C
TOP-SIDE
MARKING
Reel of 1000
SOIC − DW
−40°C
−40
C to 85
85°C
C
ORDERABLE
PART NUMBER
PACKAGE†
TA
LV244A
LV244A
LV244A
SNJ54LV244AFK
† Package drawings, standard packing quantities, thermal data, symbolization, and PCB design
guidelines are available at www.ti.com/sc/package.
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
Copyright  2005, Texas Instruments Incorporated
!"#$%& "!&'& &(!)$'!& "#))%& ' !( *#+,"'!& '%- )!#" "!&(!)$ !
*%"("'!& *%) % %)$ !( %.' &)#$%& '&') /'))'&0)!#"!& *)!"%&1 !% &! &%"%'),0 &",#% %&1 !( ',,
*')'$%%)POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
1
SCLS383L − SEPTEMBER 1997 − REVISED APRIL 2005
description/ordering information (continued)
The ’LV244A devices are designed specifically to improve both the performance and density of 3-state memory
address drivers, clock drivers, and bus-oriented receivers and transmitters.
These devices are organized as two 4-bit line drivers with separate output-enable (OE) inputs. When OE is low,
the device passes data from the A inputs to the Y outputs. When OE is high, the outputs are in the
high-impedance state.
To ensure the high-impedance state during power up or power down, OE should be tied to VCC through a pullup
resistor; the minimum value of the resistor is determined by the current-sinking capability of the driver.
These devices are fully specified for partial-power-down applications using Ioff. The Ioff circuitry disables the
outputs, preventing damaging current backflow through the devices when they are powered down.
FUNCTION TABLE
(each buffer)
INPUTS
OE
A
OUTPUT
Y
L
H
H
L
L
L
H
X
Z
logic diagram (positive logic)
1OE
1A1
1A2
1A3
1A4
2
1
2OE
2
18
4
16
6
14
8
12
1Y1
2A1
1Y2
2A2
1Y3
2A3
1Y4
2A4
POST OFFICE BOX 655303
19
11
9
13
7
15
5
17
3
• DALLAS, TEXAS 75265
2Y1
2Y2
2Y3
2Y4
SCLS383L − SEPTEMBER 1997 − REVISED APRIL 2005
absolute maximum ratings over operating free-air temperature range (unless otherwise noted)†
Supply voltage range, VCC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.5 V to 7 V
Input voltage range, VI (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.5 V to 7 V
Voltage range applied to any output in the high-impedance or
power-off state, VO (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.5 V to 7 V
Output voltage range applied in the high or low state, VO (see Notes 1 and 2) . . . . . . −0.5 V to VCC + 0.5 V
Input clamp current, IIK (VI < 0) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −20 mA
Output clamp current, IOK (VO < 0) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −50 mA
Continuous output current, IO (VO = 0 to VCC) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±35 mA
Continuous current through VCC or GND . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±70 mA
Package thermal impedance, θJA (see Note 3): DB package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 70°C/W
(see Note 3): DGV package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 92°C/W
(see Note 3): DW package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 58°C/W
(see Note 3): NS package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 60°C/W
(see Note 3): PW package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 83°C/W
(see Note 4): RGY package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 37°C/W
Storage temperature range, Tstg . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −65°C to 150°C
† Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
NOTES: 1. The input and output negative-voltage ratings may be exceeded if the input and output current ratings are observed.
2. This value is limited to 5.5 V maximum.
3. The package thermal impedance is calculated in accordance with JESD 51-7.
4. The package thermal impedance is calculated in accordance with JESD 51-5.
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
3
SCLS383L − SEPTEMBER 1997 − REVISED APRIL 2005
recommended operating conditions (see Note 5)
SN54LV244A
VCC
VIH
Supply voltage
High-level input voltage
VIL
Low-level input voltage
VI
Input voltage
VO
Output voltage
IOH
IOL
∆t/∆v
High-level output current
Low-level output current
Input transition rise or fall rate
VCC = 2 V
VCC = 2.3 V to 2.7 V
VCC = 3 V to 3.6 V
VCC = 4.5 V to 5.5 V
SN74LV244A
MIN
MAX
2
5.5
1.5
MIN
MAX
2
5.5
VCC × 0.7
VCC × 0.7
VCC × 0.7
VCC × 0.7
0.5
0
High or low state
0
3-state
0
VCC × 0.3
5.5
VCC
5.5
V
0.5
VCC × 0.3
VCC × 0.3
VCC = 3 V to 3.6 V
VCC = 4.5 V to 5.5 V
V
1.5
VCC × 0.7
VCC × 0.7
VCC = 2 V
VCC = 2.3 V to 2.7 V
UNIT
VCC × 0.3
VCC × 0.3
0
0
0
VCC × 0.3
5.5
V
V
VCC
5.5
V
µA
VCC = 2 V
VCC = 2.3 V to 2.7 V
−50
−50
−2
−2
VCC = 3 V to 3.6 V
VCC = 4.5 V to 5.5 V
−8
−8
−16
−16
VCC = 2 V
VCC = 2.3 V to 2.7 V
50
50
2
2
VCC = 3 V to 3.6 V
VCC = 4.5 V to 5.5 V
8
8
16
16
VCC = 2.3 V to 2.7 V
VCC = 3 V to 3.6 V
200
200
100
100
VCC = 4.5 V to 5.5 V
20
20
mA
µA
mA
ns/V
TA
Operating free-air temperature
−55
125
−40
85
°C
NOTE 5: All unused inputs of the device must be held at VCC or GND to ensure proper device operation. Refer to the TI application report,
Implications of Slow or Floating CMOS Inputs, literature number SCBA004.
&(!)$'!& "!&"%)& *)!#" & % (!)$'2% !)
%1& *'% !( %2%,!*$%&- ')'"%)" '' '& !%)
*%"("'!& ')% %1& 1!',- %.' &)#$%& )%%)2% % )1 !
"'&1% !) "!&&#% %% *)!#" /!# &!"%-
4
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
SCLS383L − SEPTEMBER 1997 − REVISED APRIL 2005
electrical characteristics over recommended operating free-air temperature range (unless
otherwise noted)
SN54LV244A
PARAMETER
VOH
VOL
TEST CONDITIONS
IOH = −50 µA
IOH = −2 mA
VCC
MIN
2 V to 5.5 V
IOL = 50 µA
IOL = 2 mA
IOL = 8 mA
IOL = 16 mA
II
IOZ
VI = 5.5 V or GND
VO = VCC or GND
ICC
Ioff
VI = VCC or GND,
VI or VO = 0 to 5.5 V
Ci
VI = VCC or GND
IO = 0
MAX
VCC−0.1
2
3V
2.48
2.48
4.5 V
3.8
tpd
A
Y
ten
OE
Y
tdis
OE
Y
tpd
V
0.1
2.3 V
0.4
0.4
3V
0.44
0.44
4.5 V
0.55
0.55
0 to 5.5 V
±1
±1
µA
5.5 V
±5
±5
µA
5.5 V
20
20
µA
5
µA
5
2.3
LOAD
CAPACITANCE
MIN
2.3
free-air
TA = 25°C
TYP
MAX
CL = 15 pF
temperature
SN54LV244A
range,
SN74LV244A
MIN
MAX
MIN
MAX
7.5*
12.5*
1*
15*
1
15
8.9*
14.6*
1*
17*
1
17
9.1*
14.1*
1*
16*
1
16
A
Y
9.5
15.3
1
18
1
18
OE
Y
10.8
17.8
1
21
1
21
tdis
OE
13.4
19.2
1
21
1
21
CL = 50 pF
tsk(o)
V
pF
ten
Y
UNIT
3.8
switching characteristics over recommended operating
VCC = 2.5 V ± 0.2 V (unless otherwise noted) (see Figure 1)
TO
(OUTPUT)
MAX
0.1
0
FROM
(INPUT)
TYP
2 V to 5.5 V
3.3 V
PARAMETER
MIN
VCC−0.1
2
2.3 V
IOH = −8 mA
IOH = −16 mA
SN74LV244A
TYP
2
UNIT
ns
ns
2
* On products compliant to MIL-PRF-38535, this parameter is not production tested.
switching characteristics over recommended operating
VCC = 3.3 V ± 0.3 V (unless otherwise noted) (see Figure 1)
PARAMETER
FROM
(INPUT)
TO
(OUTPUT)
tpd
A
Y
ten
OE
Y
tdis
tpd
OE
Y
A
Y
ten
OE
Y
tdis
OE
Y
LOAD
CAPACITANCE
MIN
free-air
TA = 25°C
TYP
MAX
CL = 15 pF
CL = 50 pF
temperature
SN54LV244A
SN74LV244A
MIN
MAX
MIN
MAX
5.4*
8.4*
1*
10*
1
10
6.3*
10.6*
1*
12.5*
1
12.5
7.6*
11.7*
1*
13*
1
13
6.8
11.9
1
13.5
1
13.5
7.8
14.1
1
16
1
16
11
16
1
18
1
18
tsk(o)
1.5
range,
UNIT
ns
ns
1.5
* On products compliant to MIL-PRF-38535, this parameter is not production tested.
&(!)$'!& "!&"%)& *)!#" & % (!)$'2% !)
%1& *'% !( %2%,!*$%&- ')'"%)" '' '& !%)
*%"("'!& ')% %1& 1!',- %.' &)#$%& )%%)2% % )1 !
"'&1% !) "!&&#% %% *)!#" /!# &!"%-
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
5
SCLS383L − SEPTEMBER 1997 − REVISED APRIL 2005
switching characteristics over recommended operating
VCC = 5 V ± 0.5 V (unless otherwise noted) (see Figure 1)
PARAMETER
FROM
(INPUT)
TO
(OUTPUT)
tpd
A
Y
ten
OE
Y
tdis
tpd
OE
Y
A
Y
ten
OE
Y
tdis
OE
Y
LOAD
CAPACITANCE
MIN
free-air
TA = 25°C
TYP
MAX
CL = 50 pF
SN54LV244A
range,
SN74LV244A
MIN
MAX
MIN
MAX
5.5*
1*
6.5*
1
6.5
4.5*
7.3*
1*
8.5*
1
8.5
6.5*
12.2*
1*
13.5*
1
13.5
4.9
7.5
1
8.5
1
8.5
5.6
9.3
1
10.5
1
10.5
8.8
14.2
1
15.5
1
15.5
3.9*
CL = 15 pF
temperature
tsk(o)
1
UNIT
ns
ns
1
* On products compliant to MIL-PRF-38535, this parameter is not production tested.
noise characteristics, VCC = 3.3 V, CL = 50 pF, TA = 25°C (see Note 6)
SN74LV244A
PARAMETER
MIN
TYP
MAX
UNIT
VOL(P)
VOL(V)
Quiet output, maximum dynamic VOL
0.55
V
Quiet output, minimum dynamic VOL
−0.5
V
VOH(V)
VIH(D)
Quiet output, minimum dynamic VOH
2.9
V
High-level dynamic input voltage
2.31
V
VIL(D)
Low-level dynamic input voltage
NOTE 6: Characteristics are for surface-mount packages only.
0.99
V
VCC
3.3 V
TYP
UNIT
5V
16
operating characteristics, TA = 25°C
PARAMETER
Cpd
Power dissipation capacitance
TEST CONDITIONS
CL = 50 pF,
&(!)$'!& "!&"%)& *)!#" & % (!)$'2% !)
%1& *'% !( %2%,!*$%&- ')'"%)" '' '& !%)
*%"("'!& ')% %1& 1!',- %.' &)#$%& )%%)2% % )1 !
"'&1% !) "!&&#% %% *)!#" /!# &!"%-
6
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
f = 10 MHz
14
pF
SCLS383L − SEPTEMBER 1997 − REVISED APRIL 2005
PARAMETER MEASUREMENT INFORMATION
From Output
Under Test
RL = 1 kΩ
From Output
Under Test
Test
Point
S1
VCC
Open
TEST
GND
CL
(see Note A)
CL
(see Note A)
S1
tPLH/tPHL
tPLZ/tPZL
tPHZ/tPZH
Open Drain
Open
VCC
GND
VCC
LOAD CIRCUIT FOR
3-STATE AND OPEN-DRAIN OUTPUTS
LOAD CIRCUIT FOR
TOTEM-POLE OUTPUTS
VCC
50% VCC
Timing Input
tw
tsu
VCC
50% VCC
Input
50% VCC
0V
th
VCC
50% VCC
Data Input
50% VCC
0V
0V
VOLTAGE WAVEFORMS
SETUP AND HOLD TIMES
VOLTAGE WAVEFORMS
PULSE DURATION
VCC
50% VCC
Input
50% VCC
tPLH
In-Phase
Output
tPHL
50% VCC
tPHL
Out-of-Phase
Output
0V
VOH
50% VCC
VOL
Output
Waveform 1
S1 at VCC
(see Note B)
VOH
50% VCC
VOL
VOLTAGE WAVEFORMS
PROPAGATION DELAY TIMES
INVERTING AND NONINVERTING OUTPUTS
50% VCC
50% VCC
0V
tPLZ
tPZL
≈VCC
50% VCC
Output
Waveform 2
S1 at GND
(see Note B)
VOL + 0.3 V
VOL
tPHZ
tPZH
tPLH
50% VCC
VCC
Output
Control
50% VCC
VOH − 0.3 V
VOH
≈0 V
VOLTAGE WAVEFORMS
ENABLE AND DISABLE TIMES
LOW- AND HIGH-LEVEL ENABLING
NOTES: A. CL includes probe and jig capacitance.
B. Waveform 1 is for an output with internal conditions such that the output is low, except when disabled by the output control.
Waveform 2 is for an output with internal conditions such that the output is high, except when disabled by the output control.
C. All input pulses are supplied by generators having the following characteristics: PRR ≤ 1 MHz, ZO = 50 Ω, tr ≤ 3 ns, tf ≤ 3 ns.
D. The outputs are measured one at a time, with one input transition per measurement.
E. tPLZ and tPHZ are the same as tdis.
F. tPZL and tPZH are the same as ten.
G. tPHL and tPLH are the same as tpd.
H. All parameters and waveforms are not applicable to all devices.
Figure 1. Load Circuit and Voltage Waveforms
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
7
PACKAGE OPTION ADDENDUM
www.ti.com
5-Jul-2005
PACKAGING INFORMATION
Orderable Device
Status (1)
Package
Type
Package
Drawing
Pins Package Eco Plan (2)
Qty
SN74LV244ADBLE
OBSOLETE
SSOP
DB
20
TBD
Call TI
SN74LV244ADBR
ACTIVE
SSOP
DB
20
2000
Pb-Free
(RoHS)
CU NIPDAU
Level-2-260C-1 YEAR/
Level-1-235C-UNLIM
SN74LV244ADBRE4
ACTIVE
SSOP
DB
20
2000
Pb-Free
(RoHS)
CU NIPDAU
Level-2-260C-1 YEAR/
Level-1-235C-UNLIM
SN74LV244ADGVR
ACTIVE
TVSOP
DGV
20
2000
Pb-Free
(RoHS)
CU NIPDAU
Level-1-250C-UNLIM
SN74LV244ADGVRE4
ACTIVE
TVSOP
DGV
20
2000
Pb-Free
(RoHS)
CU NIPDAU
Level-1-250C-UNLIM
SN74LV244ADW
ACTIVE
SOIC
DW
20
25
Pb-Free
(RoHS)
CU NIPDAU
Level-2-250C-1 YEAR/
Level-1-235C-UNLIM
SN74LV244ADWE4
ACTIVE
SOIC
DW
20
25
Pb-Free
(RoHS)
CU NIPDAU
Level-2-250C-1 YEAR/
Level-1-235C-UNLIM
SN74LV244ADWR
ACTIVE
SOIC
DW
20
2000
Pb-Free
(RoHS)
CU NIPDAU
Level-2-250C-1 YEAR/
Level-1-235C-UNLIM
SN74LV244ANSR
ACTIVE
SO
NS
20
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LV244ANSRE4
ACTIVE
SO
NS
20
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LV244ANSRG4
ACTIVE
SO
NS
20
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LV244APW
ACTIVE
TSSOP
PW
20
70
Pb-Free
(RoHS)
CU NIPDAU
Level-1-250C-UNLIM
SN74LV244APWE4
ACTIVE
TSSOP
PW
20
70
Pb-Free
(RoHS)
CU NIPDAU
Level-1-250C-UNLIM
SN74LV244APWG4
ACTIVE
TSSOP
PW
20
70
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LV244APWLE
OBSOLETE
TSSOP
PW
20
TBD
Call TI
SN74LV244APWR
ACTIVE
TSSOP
PW
20
2000
Pb-Free
(RoHS)
CU NIPDAU
Level-1-250C-UNLIM
SN74LV244APWRE4
ACTIVE
TSSOP
PW
20
2000
Pb-Free
(RoHS)
CU NIPDAU
Level-1-250C-UNLIM
SN74LV244APWRG4
ACTIVE
TSSOP
PW
20
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LV244APWT
ACTIVE
TSSOP
PW
20
250
Pb-Free
(RoHS)
CU NIPDAU
Level-1-250C-UNLIM
SN74LV244APWTE4
ACTIVE
TSSOP
PW
20
250
Pb-Free
(RoHS)
CU NIPDAU
Level-1-250C-UNLIM
SN74LV244ARGYR
ACTIVE
QFN
RGY
20
1000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-2-260C-1YEAR
Lead/Ball Finish
MSL Peak Temp (3)
Call TI
Call TI
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS) or Green (RoHS &
http://www.ti.com/productcontent for the latest availability information and additional product content details.
Addendum-Page 1
no
Sb/Br)
-
please
check
PACKAGE OPTION ADDENDUM
www.ti.com
5-Jul-2005
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
Addendum-Page 2
MECHANICAL DATA
MPDS006C – FEBRUARY 1996 – REVISED AUGUST 2000
DGV (R-PDSO-G**)
PLASTIC SMALL-OUTLINE
24 PINS SHOWN
0,40
0,23
0,13
24
13
0,07 M
0,16 NOM
4,50
4,30
6,60
6,20
Gage Plane
0,25
0°–8°
1
0,75
0,50
12
A
Seating Plane
0,15
0,05
1,20 MAX
PINS **
0,08
14
16
20
24
38
48
56
A MAX
3,70
3,70
5,10
5,10
7,90
9,80
11,40
A MIN
3,50
3,50
4,90
4,90
7,70
9,60
11,20
DIM
4073251/E 08/00
NOTES: A.
B.
C.
D.
All linear dimensions are in millimeters.
This drawing is subject to change without notice.
Body dimensions do not include mold flash or protrusion, not to exceed 0,15 per side.
Falls within JEDEC: 24/48 Pins – MO-153
14/16/20/56 Pins – MO-194
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
MECHANICAL DATA
MSSO002E – JANUARY 1995 – REVISED DECEMBER 2001
DB (R-PDSO-G**)
PLASTIC SMALL-OUTLINE
28 PINS SHOWN
0,38
0,22
0,65
28
0,15 M
15
0,25
0,09
8,20
7,40
5,60
5,00
Gage Plane
1
14
0,25
A
0°–ā8°
0,95
0,55
Seating Plane
2,00 MAX
0,10
0,05 MIN
PINS **
14
16
20
24
28
30
38
A MAX
6,50
6,50
7,50
8,50
10,50
10,50
12,90
A MIN
5,90
5,90
6,90
7,90
9,90
9,90
12,30
DIM
4040065 /E 12/01
NOTES: A.
B.
C.
D.
All linear dimensions are in millimeters.
This drawing is subject to change without notice.
Body dimensions do not include mold flash or protrusion not to exceed 0,15.
Falls within JEDEC MO-150
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
MECHANICAL DATA
MTSS001C – JANUARY 1995 – REVISED FEBRUARY 1999
PW (R-PDSO-G**)
PLASTIC SMALL-OUTLINE PACKAGE
14 PINS SHOWN
0,30
0,19
0,65
14
0,10 M
8
0,15 NOM
4,50
4,30
6,60
6,20
Gage Plane
0,25
1
7
0°– 8°
A
0,75
0,50
Seating Plane
0,15
0,05
1,20 MAX
PINS **
0,10
8
14
16
20
24
28
A MAX
3,10
5,10
5,10
6,60
7,90
9,80
A MIN
2,90
4,90
4,90
6,40
7,70
9,60
DIM
4040064/F 01/97
NOTES: A.
B.
C.
D.
All linear dimensions are in millimeters.
This drawing is subject to change without notice.
Body dimensions do not include mold flash or protrusion not to exceed 0,15.
Falls within JEDEC MO-153
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
IMPORTANT NOTICE
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications,
enhancements, improvements, and other changes to its products and services at any time and to discontinue
any product or service without notice. Customers should obtain the latest relevant information before placing
orders and should verify that such information is current and complete. All products are sold subject to TI’s terms
and conditions of sale supplied at the time of order acknowledgment.
TI warrants performance of its hardware products to the specifications applicable at the time of sale in
accordance with TI’s standard warranty. Testing and other quality control techniques are used to the extent TI
deems necessary to support this warranty. Except where mandated by government requirements, testing of all
parameters of each product is not necessarily performed.
TI assumes no liability for applications assistance or customer product design. Customers are responsible for
their products and applications using TI components. To minimize the risks associated with customer products
and applications, customers should provide adequate design and operating safeguards.
TI does not warrant or represent that any license, either express or implied, is granted under any TI patent right,
copyright, mask work right, or other TI intellectual property right relating to any combination, machine, or process
in which TI products or services are used. Information published by TI regarding third-party products or services
does not constitute a license from TI to use such products or services or a warranty or endorsement thereof.
Use of such information may require a license from a third party under the patents or other intellectual property
of the third party, or a license from TI under the patents or other intellectual property of TI.
Reproduction of information in TI data books or data sheets is permissible only if reproduction is without
alteration and is accompanied by all associated warranties, conditions, limitations, and notices. Reproduction
of this information with alteration is an unfair and deceptive business practice. TI is not responsible or liable for
such altered documentation.
Resale of TI products or services with statements different from or beyond the parameters stated by TI for that
product or service voids all express and any implied warranties for the associated TI product or service and
is an unfair and deceptive business practice. TI is not responsible or liable for any such statements.
Following are URLs where you can obtain information on other Texas Instruments products and application
solutions:
Products
Applications
Amplifiers
amplifier.ti.com
Audio
www.ti.com/audio
Data Converters
dataconverter.ti.com
Automotive
www.ti.com/automotive
DSP
dsp.ti.com
Broadband
www.ti.com/broadband
Interface
interface.ti.com
Digital Control
www.ti.com/digitalcontrol
Logic
logic.ti.com
Military
www.ti.com/military
Power Mgmt
power.ti.com
Optical Networking
www.ti.com/opticalnetwork
Microcontrollers
microcontroller.ti.com
Security
www.ti.com/security
Telephony
www.ti.com/telephony
Video & Imaging
www.ti.com/video
Wireless
www.ti.com/wireless
Mailing Address:
Texas Instruments
Post Office Box 655303 Dallas, Texas 75265
Copyright  2005, Texas Instruments Incorporated