TI SN74LV04ARGYR

 SCLS388J − SEPTEMBER 1997 − REVISED APRIL 2005
D 2-V to 5.5-V VCC Operation
D Max tpd of 6.5 ns at 5 V
D Latch-Up Performance Exceeds 250 mA Per
13
3
12
4
11
5
10
6
9
7
8
1Y
2A
2Y
3A
3Y
14
1Y
1A
NC
VCC
6A
1
2
13 6A
3
12 6Y
4
11 5A
5
10 5Y
9 4A
6
7
8
SN54LV04A . . . FK PACKAGE
(TOP VIEW)
2A
NC
2Y
NC
3A
4
3 2 1 20 19
18
5
17
6
16
7
15
8
14
9 10 11 12 13
6Y
NC
5A
NC
5Y
3Y
GND
NC
4Y
4A
2
VCC
6A
6Y
5A
5Y
4A
4Y
VCC
14
4Y
1
All Ports
Ioff Supports Partial-Power-Down Mode
Operation
ESD Protection Exceeds JESD 22
− 2000-V Human-Body Model (A114-A)
− 200-V Machine Model (A115-A)
− 1000-V Charged-Device Model (C101)
SN74LV04A . . . RGY PACKAGE
(TOP VIEW)
SN54LV04A . . . J OR W PACKAGE
SN74LV04A . . . D, DB, DGV, NS,
OR PW PACKAGE
(TOP VIEW)
1A
1Y
2A
2Y
3A
3Y
GND
D
1A
D
D
JESD 17
Typical VOLP (Output Ground Bounce)
<0.8 V at VCC = 3.3 V, TA = 25°C
Typical VOHV (Output VOH Undershoot)
>2.3 V at VCC = 3.3 V, TA = 25°C
GND
D
D Support Mixed-Mode Voltage Operation on
NC − No internal connection
description/ordering information
These hex inverters are designed for 2-V to 5.5-V VCC operation. The ’LV04A devices contain six independent
inverters. These devices perform the Boolean function Y = A.
These devices are fully specified for partial-power-down applications using Ioff. The Ioff circuitry disables the
outputs, preventing damaging current backflow through the devices when they are powered down.
ORDERING INFORMATION
QFN − RGY
SN74LV04ARGYR
Tube of 50
SN74LV04AD
Reel of 2500
SN74LV04ADR
SOP − NS
Reel of 2000
SN74LV04ANSR
74LV04A
SSOP − DB
Reel of 2000
SN74LV04ADBR
LV04A
Tube of 90
SN74LV04APW
Reel of 2000
SN74LV04APWR
Reel of 250
SN74LV04APWT
TVSOP − DGV
Reel of 2000
SN74LV04ADGVR
LV04A
CDIP − J
Tube of 25
SNJ54LV04AJ
SNJ54LV04AJ
CFP − W
Tube of 150
SNJ54LV04AW
SNJ54LV04AW
LCCC − FK
Tube of 55
SNJ54LV04AFK
TSSOP − PW
−55°C
−55
C to 125
125°C
C
TOP-SIDE
MARKING
Reel of 1000
SOIC − D
−40°C
−40
C to 85
85°C
C
ORDERABLE
PART NUMBER
PACKAGE†
TA
LV04A
LV04A
LV04A
SNJ54LV04AFK
† Package drawings, standard packing quantities, thermal data, symbolization, and PCB design
guidelines are available at www.ti.com/sc/package.
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
Copyright  2005, Texas Instruments Incorporated
! "#
$%! %% ! $ &'(! !) "% $% &$! &% % $ *! % !!% +!%%!,)
"% &%- !%(, ( - $ !((
&!%!%)
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
1
SCLS388J − SEPTEMBER 1997 − REVISED APRIL 2005
FUNCTION TABLE
(each inverter)
INPUT
A
OUTPUT
Y
H
L
L
H
logic diagram, each inverter (positive logic)
A
Y
absolute maximum ratings over operating free-air temperature range (unless otherwise noted)†
Supply voltage range, VCC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.5 V to 7 V
Input voltage range, VI (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.5 V to 7 V
Voltage range applied to any output in the high-impedance
or power-off state, VO (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.5 V to 7 V
Output voltage range, VO (see Notes 1 and 2) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.5 V to VCC + 0.5 V
Input clamp current, IIK (VI < 0) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −20 mA
Output clamp current, IOK (VO < 0) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −50 mA
Continuous output current, IO (VO = 0 to VCC) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±25 mA
Continuous current through VCC or GND . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±50 mA
Package thermal impedance, θJA (see Note 3): D package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 86°C/W
(see Note 3): DB package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 96°C/W
(see Note 3): DGV package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 127°C/W
(see Note 3): NS package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 76°C/W
(see Note 3): PW package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 113°C/W
(see Note 4): RGY package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 47°C/W
Storage temperature range, Tstg . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −65°C to 150°C
† Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
NOTES: 1. The input and output negative-voltage ratings may be exceeded if the input and output current ratings are observed.
2. This value is limited to 5.5 V maximum.
3. The package thermal impedance is calculated in accordance with JESD 51-7.
4. The package thermal impedance is calculated in accordance with JESD 51-5.
2
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
SCLS388J − SEPTEMBER 1997 − REVISED APRIL 2005
recommended operating conditions (see Note 5)
SN54LV04A
VCC
VIH
High-level input voltage
VIL
Low-level input voltage
VI
VO
Input voltage
IOH
IOL
∆t/∆v
MIN
MAX
2
5.5
Supply voltage
VCC = 2 V
VCC = 2.3 V to 2.7 V
VCC = 3 V to 3.6 V
VCC = 4.5 V to 5.5 V
1.5
2
5.5
VCC × 0.7
VCC × 0.7
VCC × 0.7
VCC × 0.7
Output voltage
UNIT
V
V
0.5
0.5
VCC × 0.3
VCC × 0.3
VCC × 0.3
VCC × 0.3
VCC × 0.3
5.5
0
0
0
VCC
−50
VCC = 2 V
VCC = 2.3 V to 2.7 V
VCC × 0.3
5.5
0
VCC
−50
−2
VCC = 3 V to 3.6 V
VCC = 4.5 V to 5.5 V
V
V
V
µA
−2
−6
−6
−12
−12
VCC = 2 V
VCC = 2.3 V to 2.7 V
50
50
2
2
VCC = 3 V to 3.6 V
VCC = 4.5 V to 5.5 V
6
6
12
12
200
200
100
100
VCC = 2.3 V to 2.7 V
VCC = 3 V to 3.6 V
Input transition rise or fall rate
MAX
VCC × 0.7
VCC × 0.7
VCC = 3 V to 3.6 V
VCC = 4.5 V to 5.5 V
Low-level output current
MIN
1.5
VCC = 2 V
VCC = 2.3 V to 2.7 V
High-level output current
SN74LV04A
mA
µA
mA
ns/V
VCC = 4.5 V to 5.5 V
20
20
TA
Operating free-air temperature
−55
125
−40
85
°C
NOTE 5: All unused inputs of the device must be held at VCC or GND to ensure proper device operation. Refer to the TI application report,
Implications of Slow or Floating CMOS Inputs, literature number SCBA004.
electrical characteristics over recommended operating free-air temperature range (unless
otherwise noted)
SN54LV04A
PARAMETER
VOH
VOL
TEST CONDITIONS
IOH = −50 µA
IOH = −2 mA
IOL = 50 µA
IOL = 2 mA
IOL = 6 mA
IOL = 12 mA
VI = 5.5 V or GND
VI = VCC or GND,
Ioff
VI or VO = 0 to 5.5 V
Ci
VI = VCC or GND
MIN
2 V to 5.5 V
IOH = −6 mA
IOH = −12 mA
II
ICC
VCC
IO = 0
TYP
SN74LV04A
MAX
MIN
2.3 V
VCC−0.1
2
VCC−0.1
2
3V
2.48
2.48
4.5 V
3.8
TYP
MAX
UNIT
V
3.8
2 V to 5.5 V
0.1
0.1
2.3 V
0.4
0.4
3V
0.44
0.44
4.5 V
V
0.55
0.55
0 to 5.5 V
±1
±1
µA
5.5 V
20
20
µA
0
5
5
µA
3.3 V
2.3
2.3
5V
2.3
2.3
pF
"# " $%! % &% $%!. %
- &! $ .(&) #!%!% !! ! %
&$! !% - -!() *! % %%. %- !- % &% + )
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
3
SCLS388J − SEPTEMBER 1997 − REVISED APRIL 2005
switching characteristics over recommended operating
VCC = 2.5 V ± 0.2 V (unless otherwise noted) (see Figure 1)
PARAMETER
FROM
(INPUT)
TO
(OUTPUT)
tpd
A
Y
LOAD
CAPACITANCE
MIN
free-air
TA = 25°C
TYP
MAX
temperature
SN54LV04A
range,
SN74LV04A
MIN
MAX
MIN
MAX
CL = 15 pF
7.1*
11.7*
1*
14*
1
14
CL = 50 pF
10
15.5
1
18
1
18
UNIT
ns
* On products compliant to MIL-PRF-38535, this parameter is not production tested.
switching characteristics over recommended operating
VCC = 3.3 V ± 0.3 V (unless otherwise noted) (see Figure 1)
PARAMETER
FROM
(INPUT)
TO
(OUTPUT)
tpd
A
Y
free-air
LOAD
CAPACITANCE
TA = 25°C
MIN
TYP
MAX
CL = 15 pF
5.1*
CL = 50 pF
7.3
temperature
SN54LV04A
range,
SN74LV04A
MIN
MAX
MIN
MAX
7.1*
1*
8.5*
1
8.5
10.6
1
12
1
12
UNIT
ns
* On products compliant to MIL-PRF-38535, this parameter is not production tested.
switching characteristics over recommended operating
VCC = 5 V ± 0.5 V (unless otherwise noted) (see Figure 1)
PARAMETER
FROM
(INPUT)
TO
(OUTPUT)
tpd
A
Y
LOAD
CAPACITANCE
MIN
free-air
TA = 25°C
TYP
MAX
temperature
SN54LV04A
range,
SN74LV04A
MIN
MAX
MIN
MAX
CL = 15 pF
3.6*
5.5*
1*
6.5*
1
6.5
CL = 50 pF
5.1
7.5
1
8.5
1
8.5
UNIT
ns
* On products compliant to MIL-PRF-38535, this parameter is not production tested.
noise characteristics, VCC = 3.3 V, CL = 50 pF, TA = 25°C (see Note 6)
SN74LV04A
PARAMETER
MIN
TYP
MAX
UNIT
VOL(P)
VOL(V)
Quiet output, maximum dynamic VOL
0.3
0.8
V
Quiet output, minimum dynamic VOL
−0.1
−0.8
V
VOH(V)
VIH(D)
Quiet output, minimum dynamic VOH
3.1
High-level dynamic input voltage
V
2.31
V
VIL(D)
Low-level dynamic input voltage
NOTE 6: Characteristics are for surface-mount packages only.
0.99
V
VCC
3.3 V
TYP
UNIT
5V
11.4
operating characteristics, TA = 25°C
PARAMETER
Cpd
Power dissipation capacitance
TEST CONDITIONS
CL = 50 pF,
"# " $%! % &% $%!. %
- &! $ .(&) #!%!% !! ! %
&$! !% - -!() *! % %%. %- !- % &% + )
4
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
f = 10 MHz
9.6
pF
SCLS388J − SEPTEMBER 1997 − REVISED APRIL 2005
PARAMETER MEASUREMENT INFORMATION
From Output
Under Test
RL = 1 kΩ
From Output
Under Test
Test
Point
VCC
Open
S1
TEST
GND
CL
(see Note A)
CL
(see Note A)
S1
tPLH/tPHL
tPLZ/tPZL
tPHZ/tPZH
Open Drain
Open
VCC
GND
VCC
LOAD CIRCUIT FOR
3-STATE AND OPEN-DRAIN OUTPUTS
LOAD CIRCUIT FOR
TOTEM-POLE OUTPUTS
VCC
50% VCC
Timing Input
0V
tw
tsu
VCC
50% VCC
Input
50% VCC
th
VCC
50% VCC
Data Input
50% VCC
0V
0V
VOLTAGE WAVEFORMS
PULSE DURATION
VOLTAGE WAVEFORMS
SETUP AND HOLD TIMES
VCC
50% VCC
Input
50% VCC
tPLH
In-Phase
Output
50% VCC
VOH
50% VCC
VOL
VOH
50% VCC
VOL
VOLTAGE WAVEFORMS
PROPAGATION DELAY TIMES
INVERTING AND NONINVERTING OUTPUTS
50% VCC
0V
Output
Waveform 1
S1 at VCC
(see Note B)
tPLH
50% VCC
50% VCC
tPLZ
tPZL
tPHL
tPHL
Out-of-Phase
Output
0V
VCC
Output
Control
≈VCC
50% VCC
tPHZ
tPZH
Output
Waveform 2
S1 at GND
(see Note B)
VOL + 0.3 V
VOL
50% VCC
VOH − 0.3 V
VOH
≈0 V
VOLTAGE WAVEFORMS
ENABLE AND DISABLE TIMES
LOW- AND HIGH-LEVEL ENABLING
NOTES: A. CL includes probe and jig capacitance.
B. Waveform 1 is for an output with internal conditions such that the output is low, except when disabled by the output control.
Waveform 2 is for an output with internal conditions such that the output is high, except when disabled by the output control.
C. All input pulses are supplied by generators having the following characteristics: PRR ≤ 1 MHz, ZO = 50 Ω, tr ≤ 3 ns, tf ≤ 3 ns.
D. The outputs are measured one at a time, with one input transition per measurement.
E. tPLZ and tPHZ are the same as tdis.
F. tPZL and tPZH are the same as ten.
G. tPHL and tPLH are the same as tpd.
H. All parameters and waveforms are not applicable to all devices.
Figure 1. Load Circuit and Voltage Waveforms
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
5
PACKAGE OPTION ADDENDUM
www.ti.com
6-Dec-2006
PACKAGING INFORMATION
Orderable Device
Status (1)
Package
Type
Package
Drawing
Pins Package Eco Plan (2)
Qty
SN74LV04AD
ACTIVE
SOIC
D
14
SN74LV04ADBLE
OBSOLETE
SSOP
DB
14
SN74LV04ADBR
ACTIVE
SSOP
DB
14
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LV04ADBRE4
ACTIVE
SSOP
DB
14
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LV04ADE4
ACTIVE
SOIC
D
14
50
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LV04ADG4
ACTIVE
SOIC
D
14
50
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LV04ADGVR
ACTIVE
TVSOP
DGV
14
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LV04ADGVRE4
ACTIVE
TVSOP
DGV
14
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LV04ADR
ACTIVE
SOIC
D
14
2500 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LV04ADRE4
ACTIVE
SOIC
D
14
2500 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LV04ADRG4
ACTIVE
SOIC
D
14
2500 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LV04ANSR
ACTIVE
SO
NS
14
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LV04ANSRE4
ACTIVE
SO
NS
14
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LV04ANSRG4
ACTIVE
SO
NS
14
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LV04APW
ACTIVE
TSSOP
PW
14
90
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LV04APWE4
ACTIVE
TSSOP
PW
14
90
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LV04APWG4
ACTIVE
TSSOP
PW
14
90
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LV04APWLE
OBSOLETE
TSSOP
PW
14
SN74LV04APWR
ACTIVE
TSSOP
PW
14
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LV04APWRE4
ACTIVE
TSSOP
PW
14
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LV04APWRG4
ACTIVE
TSSOP
PW
14
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LV04APWT
ACTIVE
TSSOP
PW
14
250
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LV04APWTE4
ACTIVE
TSSOP
PW
14
250
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LV04ARGYR
ACTIVE
QFN
RGY
14
1000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-2-260C-1YEAR
SN74LV04ARGYRG4
ACTIVE
QFN
RGY
14
1000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-2-260C-1YEAR
50
Green (RoHS &
no Sb/Br)
TBD
TBD
Addendum-Page 1
Lead/Ball Finish
CU NIPDAU
Call TI
Call TI
MSL Peak Temp (3)
Level-1-260C-UNLIM
Call TI
Call TI
PACKAGE OPTION ADDENDUM
www.ti.com
6-Dec-2006
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
Addendum-Page 2
MECHANICAL DATA
MPDS006C – FEBRUARY 1996 – REVISED AUGUST 2000
DGV (R-PDSO-G**)
PLASTIC SMALL-OUTLINE
24 PINS SHOWN
0,40
0,23
0,13
24
13
0,07 M
0,16 NOM
4,50
4,30
6,60
6,20
Gage Plane
0,25
0°–8°
1
0,75
0,50
12
A
Seating Plane
0,15
0,05
1,20 MAX
PINS **
0,08
14
16
20
24
38
48
56
A MAX
3,70
3,70
5,10
5,10
7,90
9,80
11,40
A MIN
3,50
3,50
4,90
4,90
7,70
9,60
11,20
DIM
4073251/E 08/00
NOTES: A.
B.
C.
D.
All linear dimensions are in millimeters.
This drawing is subject to change without notice.
Body dimensions do not include mold flash or protrusion, not to exceed 0,15 per side.
Falls within JEDEC: 24/48 Pins – MO-153
14/16/20/56 Pins – MO-194
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
MECHANICAL DATA
MSSO002E – JANUARY 1995 – REVISED DECEMBER 2001
DB (R-PDSO-G**)
PLASTIC SMALL-OUTLINE
28 PINS SHOWN
0,38
0,22
0,65
28
0,15 M
15
0,25
0,09
8,20
7,40
5,60
5,00
Gage Plane
1
14
0,25
A
0°–ā8°
0,95
0,55
Seating Plane
2,00 MAX
0,10
0,05 MIN
PINS **
14
16
20
24
28
30
38
A MAX
6,50
6,50
7,50
8,50
10,50
10,50
12,90
A MIN
5,90
5,90
6,90
7,90
9,90
9,90
12,30
DIM
4040065 /E 12/01
NOTES: A.
B.
C.
D.
All linear dimensions are in millimeters.
This drawing is subject to change without notice.
Body dimensions do not include mold flash or protrusion not to exceed 0,15.
Falls within JEDEC MO-150
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
MECHANICAL DATA
MTSS001C – JANUARY 1995 – REVISED FEBRUARY 1999
PW (R-PDSO-G**)
PLASTIC SMALL-OUTLINE PACKAGE
14 PINS SHOWN
0,30
0,19
0,65
14
0,10 M
8
0,15 NOM
4,50
4,30
6,60
6,20
Gage Plane
0,25
1
7
0°– 8°
A
0,75
0,50
Seating Plane
0,15
0,05
1,20 MAX
PINS **
0,10
8
14
16
20
24
28
A MAX
3,10
5,10
5,10
6,60
7,90
9,80
A MIN
2,90
4,90
4,90
6,40
7,70
9,60
DIM
4040064/F 01/97
NOTES: A.
B.
C.
D.
All linear dimensions are in millimeters.
This drawing is subject to change without notice.
Body dimensions do not include mold flash or protrusion not to exceed 0,15.
Falls within JEDEC MO-153
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
IMPORTANT NOTICE
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications,
enhancements, improvements, and other changes to its products and services at any time and to
discontinue any product or service without notice. Customers should obtain the latest relevant information
before placing orders and should verify that such information is current and complete. All products are sold
subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment.
TI warrants performance of its hardware products to the specifications applicable at the time of sale in
accordance with TI’s standard warranty. Testing and other quality control techniques are used to the extent
TI deems necessary to support this warranty. Except where mandated by government requirements, testing
of all parameters of each product is not necessarily performed.
TI assumes no liability for applications assistance or customer product design. Customers are responsible
for their products and applications using TI components. To minimize the risks associated with customer
products and applications, customers should provide adequate design and operating safeguards.
TI does not warrant or represent that any license, either express or implied, is granted under any TI patent
right, copyright, mask work right, or other TI intellectual property right relating to any combination, machine,
or process in which TI products or services are used. Information published by TI regarding third-party
products or services does not constitute a license from TI to use such products or services or a warranty or
endorsement thereof. Use of such information may require a license from a third party under the patents or
other intellectual property of the third party, or a license from TI under the patents or other intellectual
property of TI.
Reproduction of information in TI data books or data sheets is permissible only if reproduction is without
alteration and is accompanied by all associated warranties, conditions, limitations, and notices.
Reproduction of this information with alteration is an unfair and deceptive business practice. TI is not
responsible or liable for such altered documentation.
Resale of TI products or services with statements different from or beyond the parameters stated by TI for
that product or service voids all express and any implied warranties for the associated TI product or service
and is an unfair and deceptive business practice. TI is not responsible or liable for any such statements.
Following are URLs where you can obtain information on other Texas Instruments products and application
solutions:
Products
Applications
Amplifiers
amplifier.ti.com
Audio
www.ti.com/audio
Data Converters
dataconverter.ti.com
Automotive
www.ti.com/automotive
DSP
dsp.ti.com
Broadband
www.ti.com/broadband
Interface
interface.ti.com
Digital Control
www.ti.com/digitalcontrol
Logic
logic.ti.com
Military
www.ti.com/military
Power Mgmt
power.ti.com
Optical Networking
www.ti.com/opticalnetwork
Microcontrollers
microcontroller.ti.com
Security
www.ti.com/security
Low Power Wireless
www.ti.com/lpw
Telephony
www.ti.com/telephony
Mailing Address:
Video & Imaging
www.ti.com/video
Wireless
www.ti.com/wireless
Texas Instruments
Post Office Box 655303 Dallas, Texas 75265
Copyright © 2007, Texas Instruments Incorporated