SN54LVTH16952, SN74LVTH16952 3.3-V ABT 16-BIT REGISTERED TRANSCEIVERS WITH 3-STATE OUTPUTS SCBS697G – JULY 1997 – REVISED APRIL 2000 D D D D D D D D D D D D Members of the Texas Instruments Widebus Family State-of-the-Art Advanced BiCMOS Technology (ABT) Design for 3.3-V Operation and Low Static-Power Dissipation Support Mixed-Mode Signal Operation (5-V Input and Output Voltages With 3.3-V VCC) Support Unregulated Battery Operation Down to 2.7 V Typical VOLP (Output Ground Bounce) <0.8 V at VCC = 3.3 V, TA = 25°C Ioff and Power-Up 3-State Support Hot Insertion Bus Hold on Data Inputs Eliminates the Need for External Pullup/Pulldown Resistors Distributed VCC and GND Pins Minimize High-Speed Switching Noise Flow-Through Architecture Optimizes PCB Layout Latch-Up Performance Exceeds 500 mA Per JESD 17 ESD Protection Exceeds 2000 V Per MIL-STD-883, Method 3015; Exceeds 200 V Using Machine Model (C = 200 pF, R = 0) Package Options Include Plastic Shrink Small-Outline (DL) and Thin Shrink Small-Outline (DGG) Packages and 380-mil Fine-Pitch Ceramic Flat (WD) Package SN54LVTH16952 . . . WD PACKAGE SN74LVTH16952 . . . DGG OR DL PACKAGE (TOP VIEW) 1OEAB 1CLKAB 1CLKENAB GND 1A1 1A2 VCC 1A3 1A4 1A5 GND 1A6 1A7 1A8 2A1 2A2 2A3 GND 2A4 2A5 2A6 VCC 2A7 2A8 GND 2CLKENAB 2CLKAB 2OEAB 1 56 2 55 3 54 4 53 5 52 6 51 7 50 8 49 9 48 10 47 11 46 12 45 13 44 14 43 15 42 16 41 17 40 18 39 19 38 20 37 21 36 22 35 23 34 24 33 25 32 26 31 27 30 28 29 1OEBA 1CLKBA 1CLKENBA GND 1B1 1B2 VCC 1B3 1B4 1B5 GND 1B6 1B7 1B8 2B1 2B2 2B3 GND 2B4 2B5 2B6 VCC 2B7 2B8 GND 2CLKENBA 2CLKBA 2OEBA description The ’LVTH16952 devices are 16-bit registered transceivers designed for low-voltage (3.3-V) VCC operation, but with the capability to provide a TTL interface to a 5-V system environment. These devices can be used as two 8-bit transceivers or one 16-bit transceiver. Data on the A or B bus is stored in the registers on the low-to-high transition of the clock (CLKAB or CLKBA) input, provided that the clock-enable (CLKENAB or CLKENBA) input is low. Taking the output-enable (OEAB or OEBA) input low accesses the data on either port. Active bus-hold circuitry is provided to hold unused or floating data inputs at a valid logic level. When VCC is between 0 and 1.5 V, the devices are in the high-impedance state during power up or power down. However, to ensure the high-impedance state above 1.5 V, OE should be tied to VCC through a pullup resistor; the minimum value of the resistor is determined by the current-sinking capability of the driver. Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. Widebus is a trademark of Texas Instruments. Copyright 2000, Texas Instruments Incorporated PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. On products compliant to MIL-PRF-38535, all parameters are tested unless otherwise noted. On all other products, production processing does not necessarily include testing of all parameters. POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 1 SN54LVTH16952, SN74LVTH16952 3.3-V ABT 16-BIT REGISTERED TRANSCEIVERS WITH 3-STATE OUTPUTS SCBS697G – JULY 1997 – REVISED APRIL 2000 description (continued) These devices are fully specified for hot-insertion applications using Ioff and power-up 3-state. The Ioff circuitry disables the outputs, preventing damaging current backflow through the devices when they are powered down. The power-up 3-state circuitry places the outputs in the high-impedance state during power up and power down, which prevents driver conflict. The SN54LVTH16952 is characterized for operation over the full military temperature range of –55°C to 125°C. The SN74LVTH16952 is characterized for operation from –40°C to 85°C. FUNCTION TABLE† INPUTS OUTPUT B CLKENAB CLKAB OEAB A H X L X X L L X B0‡ B0‡ L ↑ L L L H L ↑ L H X X H X Z † A-to-B data flow is shown; B-to-A data flow is similar, but uses CLKENBA, CLKBA, and OEBA. ‡ Level of B before the indicated steady-state input conditions were established 2 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 SN54LVTH16952, SN74LVTH16952 3.3-V ABT 16-BIT REGISTERED TRANSCEIVERS WITH 3-STATE OUTPUTS SCBS697G – JULY 1997 – REVISED APRIL 2000 logic symbol† 1OEBA 56 54 1CLKENBA 1CLKBA 55 1 1OEAB 3 1CLKENAB 1CLKAB 2 29 2OEBA 31 2CLKENBA 2CLKBA 2OEAB 30 28 26 2CLKENAB 2CLKAB 1A1 27 5 EN3 G1 1C5 EN4 G2 2C6 EN9 G7 7C11 EN10 G8 8C12 3 6D 1A2 1A3 1A4 1A5 1A6 1A7 1A8 2A1 2A3 2A4 2A5 2A6 2A7 2A8 52 51 8 49 9 48 10 47 12 45 13 44 14 43 15 42 9 1B1 4 6 12D 2A2 5D 11D 1B2 1B3 1B4 1B5 1B6 1B7 1B8 2B1 10 16 41 17 40 19 38 20 37 21 36 23 34 24 33 2B2 2B3 2B4 2B5 2B6 2B7 2B8 † This symbol is in accordance with ANSI/IEEE Std 91-1984 and IEC Publication 617-12. POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 3 SN54LVTH16952, SN74LVTH16952 3.3-V ABT 16-BIT REGISTERED TRANSCEIVERS WITH 3-STATE OUTPUTS SCBS697G – JULY 1997 – REVISED APRIL 2000 logic diagram (positive logic) 1CLKENAB 1CLKAB 1OEBA 1A1 3 54 2 55 56 1 5 One of Eight Channels C1 CE 1D 52 1CLKENBA 1CLKBA 1OEAB 1B1 C1 CE 1D To Seven Other Channels 2CLKENAB 2CLKAB 2OEBA 26 31 27 30 29 28 One of Eight Channels 2A1 C1 CE 1D 15 C1 CE 1D To Seven Other Channels 4 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 42 2CLKENBA 2CLKBA 2OEAB 2B1 SN54LVTH16952, SN74LVTH16952 3.3-V ABT 16-BIT REGISTERED TRANSCEIVERS WITH 3-STATE OUTPUTS SCBS697G – JULY 1997 – REVISED APRIL 2000 absolute maximum ratings over operating free-air temperature range (unless otherwise noted)† Supply voltage range, VCC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –0.5 V to 4.6 V Input voltage range, VI (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –0.5 V to 7 V Voltage range applied to any output in the high-impedance or power-off state, VO (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –0.5 V to 7 V Voltage range applied to any output in the high state, VO (see Note 1) . . . . . . . . . . . . . –0.5 V to VCC + 0.5 V Current into any output in the low state, IO: SN54LVTH16952 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 96 mA SN74LVTH16952 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 128 mA Current into any output in the high state, IO (see Note 2): SN54LVTH16952 . . . . . . . . . . . . . . . . . . . . . 48 mA SN74LVTH16952 . . . . . . . . . . . . . . . . . . . . . 64 mA Input clamp current, IIK (VI < 0) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –50 mA Output clamp current, IOK (VO < 0) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –50 mA Package thermal impedance, θJA (see Note 3): DGG package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 64°C/W DL package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 56°C/W Storage temperature range, Tstg . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –65°C to 150°C † Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. NOTES: 1. The input and output negative-voltage ratings may be exceeded if the input and output clamp-current ratings are observed. 2. This current flows only when the output is in the high state and VO > VCC. 3. The package thermal impedance is calculated in accordance with JESD 51. recommended operating conditions (see Note 4) SN54LVTH16952 SN74LVTH16952 MIN MAX MIN MAX 2.7 3.6 2.7 3.6 UNIT VCC VIH Supply voltage VIL VI Low-level input voltage 0.8 0.8 V Input voltage 5.5 5.5 V IOH IOL High-level output current –24 –32 mA Low-level output current 48 64 mA ∆t/∆v Input transition rise or fall rate ∆t/∆VCC TA Power-up ramp rate 200 Operating free-air temperature –55 High-level input voltage 2 Outputs enabled 2 10 V 10 –40 ns/V µs/V 200 125 V 85 °C NOTE 4: All unused control inputs of the device must be held at VCC or GND to ensure proper device operation. Refer to the TI application report, Implications of Slow or Floating CMOS Inputs, literature number SCBA004. POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 5 SN54LVTH16952, SN74LVTH16952 3.3-V ABT 16-BIT REGISTERED TRANSCEIVERS WITH 3-STATE OUTPUTS SCBS697G – JULY 1997 – REVISED APRIL 2000 electrical characteristics over recommended operating free-air temperature range (unless otherwise noted) PARAMETER VIK VOH VCC = 2.7 V, VCC = 2.7 V to 3.6 V, II = –18 mA IOH = –100 µA VCC = 2.7 V, IOH = –8 mA IOH = –24 mA VCC = 3 V 7V VCC = 2 2.7 VOL VCC = 3 V Control inputs II A or B orts‡ ports Ioff II(hold) ( ) A or B ports SN54LVTH16952 TYP† MAX TEST CONDITIONS MIN –1.2 VCC–0.2 2.4 –1.2 VCC–0.2 2.4 0.2 IOL = 24 mA IOL = 16 mA 0.5 0.5 0.4 0.4 IOL = 32 mA IOL = 48 mA 0.5 0.5 0.55 VI = 5.5 V VI = 5.5 V 10 10 20 20 VCC = 3.6 V VI = VCC VI = 0 1 1 VCC = 0, VI or VO = 0 to 4.5 V VI = 0.8 V IOZPU IOZPD VCC = 1.5 V to 0, VO = 0.5 V to 3 V, OE = don’t care ICC VCC = 3.6 V, IO = 0, VI = VCC or GND V 0.55 IOL = 64 mA VI = VCC or GND ±1 VCC = 3 V V 2 0.2 ±1 VCC = 3.6 V, VCC = 0 or 3.6 V, UNIT V 2 IOH = –32 mA IOL = 100 µA VI = 2 V VCC = 3.6 V§, VI = 0 to 3.6 V VCC = 0 to 1.5 V, VO = 0.5 V to 3 V, OE = don’t care –5 µA –5 ±100 75 75 –75 –75 µA µA ±500 Outputs high Outputs low Outputs disabled ∆ICC¶ VCC = 3 V to 3.6 V, One input at VCC – 0.6 V, Other inputs at VCC or GND Ci VI = 3 V or 0 VO = 3 V or 0 Cio SN74LVTH16952 TYP† MAX MIN ±100 ± 100 µA ±100 ±100 µA 0.19 0.19 5 5 0.19 0.19 0.2 0.2 4 4 10 10 mA mA pF pF † All typical values are at VCC = 3.3 V, TA = 25°C. ‡ Unused pins at VCC or GND § This is the bus-hold maximum dynamic current. It is the minimum overdrive current required to switch the input from one state to another. ¶ This is the increase in supply current for each input that is at the specified TTL voltage level rather than VCC or GND. 6 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 SN54LVTH16952, SN74LVTH16952 3.3-V ABT 16-BIT REGISTERED TRANSCEIVERS WITH 3-STATE OUTPUTS SCBS697G – JULY 1997 – REVISED APRIL 2000 timing requirements over recommended operating free-air temperature range (unless otherwise noted) (see Figure 1) SN54LVTH16952 VCC = 3.3 V ± 0.3 V MIN fclock tw Clock frequency Pulse duration tsu Setup time th Hold time MAX SN74LVTH16952 VCC = 3.3 V ± 0.3 V VCC = 2.7 V MIN MAX 150 MIN 150 MAX VCC = 2.7 V MIN 150 3.3 3.3 3.3 3.3 A or B before CLK 2.6 3.3 1.7 2.5 CLKEN before CLK 2.2 2.8 2 2.8 1 1 0.8 0 1.4 1.5 0.4 0 A or B after CLK CLKEN after CLK MAX 150 CLK high or low UNIT MHz ns ns ns switching characteristics over recommended operating free-air temperature range, CL = 50 pF (unless otherwise noted) (see Figure 1) SN54LVTH16952 PARAMETER FROM (INPUT) TO (OUTPUT) VCC = 3.3 V ± 0.3 V MIN fmax tPLH tPHL tPZH tPZL tPHZ tPLZ MAX 150 CLKBA or CLKAB A or B OEBA or OEAB A or B OEBA or OEAB A or B SN74LVTH16952 VCC = 2.7 V MIN MAX 150 VCC = 3.3 V ± 0.3 V MIN TYP† VCC = 2.7 V MAX 150 MIN UNIT MAX 150 MHz 1.6 5.7 7.4 1.3 2.7 4 4.4 1.7 6 7 1.3 2.7 4 4.4 0.9 5 7.3 1 2.3 4 4.9 1.1 5.2 5.9 1 2.4 4 4.9 1.7 6.7 7.3 2.1 3.9 5.7 6.2 1.1 5.8 6 2.1 3.5 5.1 5.3 ns ns ns † All typical values are at VCC = 3.3 V, TA = 25°C. POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 7 SN54LVTH16952, SN74LVTH16952 3.3-V ABT 16-BIT REGISTERED TRANSCEIVERS WITH 3-STATE OUTPUTS SCBS697G – JULY 1997 – REVISED APRIL 2000 PARAMETER MEASUREMENT INFORMATION 6V 500 Ω From Output Under Test S1 GND CL = 50 pF (see Note A) TEST S1 tPLH/tPHL tPLZ/tPZL tPHZ/tPZH Open 6V GND Open 500 Ω 2.7 V Timing Input LOAD CIRCUIT 1.5 V 0V tw tsu 2.7 V 1.5 V Input 1.5 V th 2.7 V Data Input 1.5 V 1.5 V 0V 0V VOLTAGE WAVEFORMS PULSE DURATION VOLTAGE WAVEFORMS SETUP AND HOLD TIMES 2.7 V 1.5 V Input 1.5 V 0V tPLH tPHL VOH 1.5 V Output 1.5 V VOL tPHL Output Waveform 1 S1 at 6 V (see Note B) 1.5 V 1.5 V 1.5 V VOL VOLTAGE WAVEFORMS PROPAGATION DELAY TIMES INVERTING AND NONINVERTING OUTPUTS 1.5 V 0V tPZL tPLZ 3V 1.5 V tPZH tPLH VOH Output 2.7 V Output Control Output Waveform 2 S1 at GND (see Note B) VOL + 0.3 V VOL tPHZ 1.5 V VOH – 0.3 V VOH ≈0V VOLTAGE WAVEFORMS ENABLE AND DISABLE TIMES LOW- AND HIGH-LEVEL ENABLING NOTES: A. CL includes probe and jig capacitance. B. Waveform 1 is for an output with internal conditions such that the output is low except when disabled by the output control. Waveform 2 is for an output with internal conditions such that the output is high except when disabled by the output control. C. All input pulses are supplied by generators having the following characteristics: PRR ≤ 10 MHz, ZO = 50 Ω, tr ≤ 2.5 ns, tf ≤ 2.5 ns. D. The outputs are measured one at a time with one transition per measurement. Figure 1. Load Circuit and Voltage Waveforms 8 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 PACKAGE OPTION ADDENDUM www.ti.com 9-Oct-2007 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Drawing Pins Package Eco Plan (2) Qty Lead/Ball Finish MSL Peak Temp (3) 5962-9684901QXA ACTIVE CFP WD 56 1 TBD A42 SNPB 74LVTH16952DGGRE4 ACTIVE TSSOP DGG 56 2000 Pb-Free (RoHS) CU NIPDAU Level-1-250C-UNLIM 74LVTH16952DLRG4 ACTIVE SSOP DL 56 1000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LVTH16952DGGR ACTIVE TSSOP DGG 56 2000 Pb-Free (RoHS) CU NIPDAU Level-1-250C-UNLIM SN74LVTH16952DL ACTIVE SSOP DL 56 20 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LVTH16952DLG4 ACTIVE SSOP DL 56 20 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LVTH16952DLR ACTIVE SSOP DL 56 1000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SNJ54LVTH16952WD ACTIVE CFP WD 56 1 TBD A42 SNPB N / A for Pkg Type N / A for Pkg Type (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. Addendum-Page 1 PACKAGE MATERIALS INFORMATION www.ti.com 4-Oct-2007 TAPE AND REEL BOX INFORMATION Device Package Pins Site Reel Diameter (mm) Reel Width (mm) A0 (mm) B0 (mm) K0 (mm) P1 (mm) W Pin1 (mm) Quadrant SN74LVTH16952DGGR DGG 56 SITE 41 330 24 8.6 15.6 1.8 12 24 Q1 SN74LVTH16952DLR DL 56 SITE 41 330 32 11.35 18.67 3.1 16 32 Q1 Pack Materials-Page 1 PACKAGE MATERIALS INFORMATION www.ti.com 4-Oct-2007 Device Package Pins Site Length (mm) Width (mm) Height (mm) SN74LVTH16952DGGR DGG 56 SITE 41 346.0 346.0 41.0 SN74LVTH16952DLR DL 56 SITE 41 346.0 346.0 49.0 Pack Materials-Page 2 MECHANICAL DATA MCFP010B – JANUARY 1995 – REVISED NOVEMBER 1997 WD (R-GDFP-F**) CERAMIC DUAL FLATPACK 48 LEADS SHOWN 0.120 (3,05) 0.075 (1,91) 0.009 (0,23) 0.004 (0,10) 1.130 (28,70) 0.870 (22,10) 0.370 (9,40) 0.250 (6,35) 0.390 (9,91) 0.370 (9,40) 0.370 (9,40) 0.250 (6,35) 48 1 0.025 (0,635) A 0.014 (0,36) 0.008 (0,20) 25 24 NO. OF LEADS** 48 56 A MAX 0.640 (16,26) 0.740 (18,80) A MIN 0.610 (15,49) 0.710 (18,03) 4040176 / D 10/97 NOTES: A. B. C. D. E. All linear dimensions are in inches (millimeters). This drawing is subject to change without notice. This package can be hermetically sealed with a ceramic lid using glass frit. Index point is provided on cap for terminal identification only Falls within MIL STD 1835: GDFP1-F48 and JEDEC MO -146AA GDFP1-F56 and JEDEC MO -146AB POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 MECHANICAL DATA MSSO001C – JANUARY 1995 – REVISED DECEMBER 2001 DL (R-PDSO-G**) PLASTIC SMALL-OUTLINE PACKAGE 48 PINS SHOWN 0.025 (0,635) 0.0135 (0,343) 0.008 (0,203) 48 0.005 (0,13) M 25 0.010 (0,25) 0.005 (0,13) 0.299 (7,59) 0.291 (7,39) 0.420 (10,67) 0.395 (10,03) Gage Plane 0.010 (0,25) 1 0°–ā8° 24 0.040 (1,02) A 0.020 (0,51) Seating Plane 0.110 (2,79) MAX 0.004 (0,10) 0.008 (0,20) MIN PINS ** 28 48 56 A MAX 0.380 (9,65) 0.630 (16,00) 0.730 (18,54) A MIN 0.370 (9,40) 0.620 (15,75) 0.720 (18,29) DIM 4040048 / E 12/01 NOTES: A. B. C. D. All linear dimensions are in inches (millimeters). This drawing is subject to change without notice. Body dimensions do not include mold flash or protrusion not to exceed 0.006 (0,15). Falls within JEDEC MO-118 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 MECHANICAL DATA MTSS003D – JANUARY 1995 – REVISED JANUARY 1998 DGG (R-PDSO-G**) PLASTIC SMALL-OUTLINE PACKAGE 48 PINS SHOWN 0,27 0,17 0,50 48 0,08 M 25 6,20 6,00 8,30 7,90 0,15 NOM Gage Plane 1 0,25 24 0°– 8° A 0,75 0,50 Seating Plane 0,15 0,05 1,20 MAX PINS ** 0,10 48 56 64 A MAX 12,60 14,10 17,10 A MIN 12,40 13,90 16,90 DIM 4040078 / F 12/97 NOTES: A. B. C. D. All linear dimensions are in millimeters. This drawing is subject to change without notice. Body dimensions do not include mold protrusion not to exceed 0,15. Falls within JEDEC MO-153 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements, improvements, and other changes to its products and services at any time and to discontinue any product or service without notice. Customers should obtain the latest relevant information before placing orders and should verify that such information is current and complete. All products are sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment. TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TI’s standard warranty. Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty. Except where mandated by government requirements, testing of all parameters of each product is not necessarily performed. TI assumes no liability for applications assistance or customer product design. Customers are responsible for their products and applications using TI components. To minimize the risks associated with customer products and applications, customers should provide adequate design and operating safeguards. TI does not warrant or represent that any license, either express or implied, is granted under any TI patent right, copyright, mask work right, or other TI intellectual property right relating to any combination, machine, or process in which TI products or services are used. Information published by TI regarding third-party products or services does not constitute a license from TI to use such products or services or a warranty or endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the third party, or a license from TI under the patents or other intellectual property of TI. Reproduction of TI information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompanied by all associated warranties, conditions, limitations, and notices. Reproduction of this information with alteration is an unfair and deceptive business practice. TI is not responsible or liable for such altered documentation. Information of third parties may be subject to additional restrictions. Resale of TI products or services with statements different from or beyond the parameters stated by TI for that product or service voids all express and any implied warranties for the associated TI product or service and is an unfair and deceptive business practice. TI is not responsible or liable for any such statements. TI products are not authorized for use in safety-critical applications (such as life support) where a failure of the TI product would reasonably be expected to cause severe personal injury or death, unless officers of the parties have executed an agreement specifically governing such use. Buyers represent that they have all necessary expertise in the safety and regulatory ramifications of their applications, and acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their products and any use of TI products in such safety-critical applications, notwithstanding any applications-related information or support that may be provided by TI. Further, Buyers must fully indemnify TI and its representatives against any damages arising out of the use of TI products in such safety-critical applications. TI products are neither designed nor intended for use in military/aerospace applications or environments unless the TI products are specifically designated by TI as military-grade or "enhanced plastic." Only products designated by TI as military-grade meet military specifications. Buyers acknowledge and agree that any such use of TI products which TI has not designated as military-grade is solely at the Buyer's risk, and that they are solely responsible for compliance with all legal and regulatory requirements in connection with such use. TI products are neither designed nor intended for use in automotive applications or environments unless the specific TI products are designated by TI as compliant with ISO/TS 16949 requirements. Buyers acknowledge and agree that, if they use any non-designated products in automotive applications, TI will not be responsible for any failure to meet such requirements. Following are URLs where you can obtain information on other Texas Instruments products and application solutions: Products Applications Amplifiers amplifier.ti.com Audio www.ti.com/audio Data Converters dataconverter.ti.com Automotive www.ti.com/automotive DSP dsp.ti.com Broadband www.ti.com/broadband Interface interface.ti.com Digital Control www.ti.com/digitalcontrol Logic logic.ti.com Military www.ti.com/military Power Mgmt power.ti.com Optical Networking www.ti.com/opticalnetwork Microcontrollers microcontroller.ti.com Security www.ti.com/security RFID www.ti-rfid.com Telephony www.ti.com/telephony Low Power Wireless www.ti.com/lpw Video & Imaging www.ti.com/video Wireless www.ti.com/wireless Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265 Copyright © 2007, Texas Instruments Incorporated