SN54ABTH16245, SN74ABTH16245 16-BIT BUS TRANSCEIVERS WITH 3-STATE OUTPUTS SCBS662I – MARCH 1996 – REVISED MARCH 1999 D D D D D D D D D D SN54ABTH16245 . . . WD PACKAGE SN74ABTH16245 . . . DGG, DGV, OR DL PACKAGE (TOP VIEW) Members of the Texas Instruments Widebus Family State-of-the-Art EPIC-ΙΙB BiCMOS Design Significantly Reduces Power Dissipation 1DIR 1B1 1B2 GND 1B3 1B4 VCC 1B5 1B6 GND 1B7 1B8 2B1 2B2 GND 2B3 2B4 VCC 2B5 2B6 GND 2B7 2B8 2DIR Typical VOLP (Output Ground Bounce) < 1 V at VCC = 5 V, TA = 25°C High-Impedance State During Power Up and Power Down Distributed VCC and GND Pin Configuration Minimizes High-Speed Switching Noise Flow-Through Architecture Optimizes PCB Layout High-Drive Outputs (–32-mA IOH, 64-mA IOL) Bus Hold on Data Inputs Eliminates the Need for External Pullup/Pulldown Resistors Latch-Up Performance Exceeds 500 mA Per JESD 17 Package Options Include Plastic Shrink Small-Outline (DL), Thin Shrink Small-Outline (DGG), and Thin Very Small-Outline (DGV) Packages and 380-mil Fine-Pitch Ceramic Flat (WD) Package Using 25-mil Center-to-Center Spacings description 1 48 2 47 3 46 4 45 5 44 6 43 7 42 8 41 9 40 10 39 11 38 12 37 13 36 14 35 15 34 16 33 17 32 18 31 19 30 20 29 21 28 22 27 23 26 24 25 1OE 1A1 1A2 GND 1A3 1A4 VCC 1A5 1A6 GND 1A7 1A8 2A1 2A2 GND 2A3 2A4 VCC 2A5 2A6 GND 2A7 2A8 2OE The ’ABTH16245 devices are 16-bit noninverting 3-state transceivers that provide synchronous two-way communication between data buses. The control-function implementation minimizes external timing requirements. These devices can be used as two 8-bit transceivers or one 16-bit transceiver. They allow data transmission from the A bus to the B bus or from the B bus to the A bus, depending on the logic level at the direction-control (DIR) input. The output-enable (OE) input can be used to disable the devices so that the buses are effectively isolated. When VCC is between 0 and 2.1 V, the device is in the high-impedance state during power up or power down. However, to ensure the high-impedance state above 2.1 V, OE should be tied to VCC through a pullup resistor; the minimum value of the resistor is determined by the current-sinking capability of the driver. Active bus-hold circuitry is provided to hold unused or floating data inputs at a valid logic level. The SN54ABTH16245 is characterized for operation over the full military temperature range of –55°C to 125°C. The SN74ABTH16245 is characterized for operation from –40°C to 85°C. Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. Widebus and EPIC-ΙΙB are trademarks of Texas Instruments Incorporated. Copyright 1999, Texas Instruments Incorporated PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. On products compliant to MIL-PRF-38535, all parameters are tested unless otherwise noted. On all other products, production processing does not necessarily include testing of all parameters. POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 1 SN54ABTH16245, SN74ABTH16245 16-BIT BUS TRANSCEIVERS WITH 3-STATE OUTPUTS SCBS662I – MARCH 1996 – REVISED MARCH 1999 FUNCTION TABLE (each 8-bit section) INPUTS OPERATION OE DIR L L B data to A bus L H A data to B bus H X Isolation logic symbol† 48 1OE 1DIR 1 G3 3 EN1 [BA] 3 EN2 [AB] 25 2OE 2DIR 24 G6 6 EN4 [BA] 6 EN5 [AB] 1A1 1A2 1A3 1A4 1A5 1A6 1A7 1A8 2A1 2A2 2A3 2A4 2A5 2A6 2A7 2A8 47 2 1 2 46 44 5 43 6 41 8 40 9 38 11 37 12 36 13 4 35 5 14 33 16 32 17 30 19 29 20 27 22 26 23 † This symbol is in accordance with ANSI/IEEE Std 91-1984 and IEC Publication 617-12. 2 3 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 1B1 1B2 1B3 1B4 1B5 1B6 1B7 1B8 2B1 2B2 2B3 2B4 2B5 2B6 2B7 2B8 SN54ABTH16245, SN74ABTH16245 16-BIT BUS TRANSCEIVERS WITH 3-STATE OUTPUTS SCBS662I – MARCH 1996 – REVISED MARCH 1999 logic diagram (positive logic) 1DIR 1 2DIR 48 1A1 25 1OE 47 2A1 2 24 2OE 36 13 1B1 2B1 To Seven Other Channels To Seven Other Channels absolute maximum ratings over operating free-air temperature range (unless otherwise noted)† Supply voltage range, VCC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –0.5 V to 7 V Input voltage range, VI (except I/O ports) (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –0.5 V to 7 V Voltage range applied to any output in the high or power-off state, VO . . . . . . . . . . . . . . . . . . . –0.5 V to 5.5 V Current into any output in the low state, IO: SN54ABTH16245 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 96 mA SN74ABTH16245 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 128 mA Input clamp current, IIK (VI < 0) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –18 mA Output clamp current, IOK (VO < 0) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –50 mA Package thermal impedance, θJA (see Note 2): DGG package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 89°C/W DGV package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 93°C/W DL package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 94°C/W Storage temperature range, Tstg . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –65°C to 150°C † Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. NOTES: 1. The input and output negative-voltage ratings may be exceeded if the input and output clamp-current ratings are observed. 2. The package thermal impedance is calculated in accordance with JESD 51. recommended operating conditions (see Note 3) SN54ABTH16245 MAX MIN MAX 4.5 5.5 4.5 5.5 VCC VIH Supply voltage VIL VI Low-level input voltage IOH IOL High-level output current VCC –24 Low-level output current ∆t/∆v Input transition rise or fall rate High-level input voltage SN74ABTH16245 MIN 2 2 0.8 Input voltage 0 Outputs enabled V V 0.8 0 UNIT V VCC –32 mA V 48 64 mA 10 10 ns/V TA Operating free-air temperature –55 125 –40 85 °C NOTE 3: All unused control inputs of the device must be held at VCC or GND to ensure proper device operation. Refer to the TI application report, Implications of Slow or Floating CMOS Inputs, literature number SCBA004. POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 3 SN54ABTH16245, SN74ABTH16245 16-BIT BUS TRANSCEIVERS WITH 3-STATE OUTPUTS SCBS662I – MARCH 1996 – REVISED MARCH 1999 electrical characteristics over recommended operating free-air temperature range (unless otherwise noted) PARAMETER VIK VOH TEST CONDITIONS VCC = 4.5 V, VCC = 4.5 V, II = –18 mA IOH = –3 mA VCC = 5 V, VCC = 4 4.5 5V VOL VCC = 4 4.5 5V MIN –1.2 SN74ABTH16245 MAX MIN –1.2 IOH = –3 mA IOH = –24 mA 3 3 3 2 2 IOH = –32 mA IOL = 48 mA 2* IOL = 64 mA II(hold) I(h ld) 5V VCC = 4 4.5 VI = 0.8 V VI = 2 V IOZPU VCC = 0 to 1.9 V VCC = 0 to 2.1 V VO = 0.5 V to 2.7 V,, OE = X IOZPD VCC = 1.9 V to 0 VCC = 2.1 V to 0 VO = 0.5 V to 2.7 V,, OE = X VCC = 0, VCC = 5.5 V, VO = 5.5 V VI or VO ≤ 4.5 V VCC = 5.5 V, VO = 2.5 V Outputs high Ioff ICEX IO‡ 0.55 0.55* 0.55 A or B ports VCC = 5.5 V, IO = 0, VI = VCC or GND Control inputs ±1 ±1 ±100 ±100 ±100 100 100 –100 –100 ±50** ±50** –100 Outputs disabled µA ±50 ±100 ±100 µA 50 µA –180 mA –180 50 –50 –180 –50 2 2 2 32 32 32 2 2 2 1.5 1.5 1.5 3 Cio A or B ports VO = 2.5 V or 0.5 V 6 * On products compliant to MIL-PRF-38535, this parameter does not apply. ** On products compliant to MIL-PRF-38535, this parameter is not production tested. † All typical values are at VCC = 5 V. ‡ Not more than one output should be tested at a time, and the duration of the test should not exceed one second. § This is the increase in supply current for each input that is at the specified TTL voltage level rather than VCC or GND. POST OFFICE BOX 655303 µA ±50 50 Outputs low VI = 2.5 V or 0.5 V ±50 ±50** µ µA µA ±50** ±50 VCC = 5.5 V, One input at 3.4 V, Other inputs at VCC or GND ∆ICC§ ±1 100 Outputs high V mV –100 –50 V V 100 Control inputs UNIT 2 0.55 A or B ports 4 MAX –1.2 2.5 VI = VCC or GND Ci MIN 2.5 VCC = 5.5 V,, ICC SN54ABTH16245 2.5 Vhys II TA = 25°C TYP† MAX • DALLAS, TEXAS 75265 mA mA pF pF SN54ABTH16245, SN74ABTH16245 16-BIT BUS TRANSCEIVERS WITH 3-STATE OUTPUTS SCBS662I – MARCH 1996 – REVISED MARCH 1999 switching characteristics over recommended ranges of supply voltage and operating free-air temperature, CL = 50 pF (unless otherwise noted) (see Figure 1) SN54ABTH16245 PARAMETER FROM (INPUT) TO (OUTPUT) tPLH tPHL A or B B or A tPZH tPZL OE B or A tPHZ tPLZ OE B or A VCC = 5 V, TA = 25°C MIN MAX MIN TYP MAX 1 2.2 3.6 0.5 4.1 1 2.3 3.8 0.5 4.4 1 3.6 5.2 0.8 6.4 1 3.7 6.1 0.9 6.5 2 4.4 6.7 1.3 7.9 1.5 3.3 4.7 1.4 5.6 UNIT ns ns ns switching characteristics over recommended ranges of supply voltage and operating free-air temperature, CL = 50 pF (unless otherwise noted) (see Figure 1) SN74ABTH16245 PARAMETER FROM (INPUT) TO (OUTPUT) tPLH tPHL A or B B or A tPZH tPZL OE B or A tPHZ tPLZ OE B or A POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 VCC = 5 V, TA = 25°C MIN MAX MIN TYP MAX 1 2.2 3.4 1 3.9 1 2.3 3.7 1 4.2 1 3.6 5.2 1 6.3 1 3.7 5.4 1 6.4 2 4.4 5.8 2 6.3 1.5 3.3 4.7 1.5 5.2 UNIT ns ns ns 5 SN54ABTH16245, SN74ABTH16245 16-BIT BUS TRANSCEIVERS WITH 3-STATE OUTPUTS SCBS662I – MARCH 1996 – REVISED MARCH 1999 PARAMETER MEASUREMENT INFORMATION 500 Ω From Output Under Test S1 7V Open GND CL = 50 pF (see Note A) 500 Ω TEST S1 tPLH/tPHL tPLZ/tPZL tPHZ/tPZH Open 7V Open 3V LOAD CIRCUIT Timing Input 1.5 V 0V tw tsu th 3V Input 1.5 V 1.5 V 3V 1.5 V Data Input 1.5 V 0V 0V VOLTAGE WAVEFORMS SETUP AND HOLD TIMES VOLTAGE WAVEFORMS PULSE DURATION 3V 3V 1.5 V Input 1.5 V 0V tPHL tPLH VOH 1.5 V Output 1.5 V VOL tPLH tPHL VOH Output 1.5 V 1.5 V VOL VOLTAGE WAVEFORMS PROPAGATION DELAY TIMES INVERTING AND NONINVERTING OUTPUTS Output Control Output Waveform 1 S1 at 7 V (see Note B) Output Waveform 2 S1 at Open (see Note B) 1.5 V 1.5 V 0V tPLZ tPZL 3.5 V 1.5 V VOL + 0.3 V VOL tPHZ tPZH 1.5 V VOH – 0.3 V VOH ≈0V VOLTAGE WAVEFORMS ENABLE AND DISABLE TIMES LOW- AND HIGH-LEVEL ENABLING NOTES: A. CL includes probe and jig capacitance. B. Waveform 1 is for an output with internal conditions such that the output is low except when disabled by the output control. Waveform 2 is for an output with internal conditions such that the output is high except when disabled by the output control. C. All input pulses are supplied by generators having the following characteristics: PRR ≤ 10 MHz, ZO = 50 Ω, tr ≤ 2.5 ns, tf ≤ 2.5 ns. D. The outputs are measured one at a time with one transition per measurement. Figure 1. Load Circuit and Voltage Waveforms 6 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 PACKAGE OPTION ADDENDUM www.ti.com 9-Oct-2007 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Drawing Pins Package Eco Plan (2) Qty 1 5962-9762501QXA ACTIVE CFP WD 48 ACTIVE TSSOP DGG 48 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 74ABTH16245DGGRG4 ACTIVE TSSOP DGG 48 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 74ABTH16245DGVRE4 ACTIVE TVSOP DGV 48 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 74ABTH16245DGVRG4 ACTIVE TVSOP DGV 48 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 74ABTH16245DLRG4 ACTIVE SSOP DL 48 1000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74ABTH16245DGGR ACTIVE TSSOP DGG 48 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74ABTH16245DGVR ACTIVE TVSOP DGV 48 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74ABTH16245DL ACTIVE SSOP DL 48 25 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74ABTH16245DLG4 ACTIVE SSOP DL 48 25 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74ABTH16245DLR ACTIVE SSOP DL 48 1000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SNJ54ABTH16245WD ACTIVE CFP WD 48 TBD A42 SNPB MSL Peak Temp (3) 74ABTH16245DGGRE4 1 TBD Lead/Ball Finish A42 SNPB N / A for Pkg Type N / A for Pkg Type (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI Addendum-Page 1 PACKAGE OPTION ADDENDUM www.ti.com 9-Oct-2007 to Customer on an annual basis. Addendum-Page 2 PACKAGE MATERIALS INFORMATION www.ti.com 11-Mar-2008 TAPE AND REEL INFORMATION *All dimensions are nominal Device Package Package Pins Type Drawing SPQ Reel Reel Diameter Width (mm) W1 (mm) A0 (mm) B0 (mm) K0 (mm) P1 (mm) W Pin1 (mm) Quadrant 8.6 15.8 1.8 12.0 24.0 Q1 SN74ABTH16245DGGR TSSOP DGG 48 2000 330.0 24.4 SN74ABTH16245DGVR TVSOP DGV 48 2000 330.0 24.4 6.8 10.1 1.6 12.0 24.0 Q1 SN74ABTH16245DLR SSOP DL 48 1000 330.0 32.4 11.35 16.2 3.1 16.0 32.0 Q1 Pack Materials-Page 1 PACKAGE MATERIALS INFORMATION www.ti.com 11-Mar-2008 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) SN74ABTH16245DGGR TSSOP DGG 48 2000 346.0 346.0 41.0 SN74ABTH16245DGVR TVSOP DGV 48 2000 346.0 346.0 41.0 SN74ABTH16245DLR SSOP DL 48 1000 346.0 346.0 49.0 Pack Materials-Page 2 MECHANICAL DATA MTSS003D – JANUARY 1995 – REVISED JANUARY 1998 DGG (R-PDSO-G**) PLASTIC SMALL-OUTLINE PACKAGE 48 PINS SHOWN 0,27 0,17 0,50 48 0,08 M 25 6,20 6,00 8,30 7,90 0,15 NOM Gage Plane 1 0,25 24 0°– 8° A 0,75 0,50 Seating Plane 0,15 0,05 1,20 MAX PINS ** 0,10 48 56 64 A MAX 12,60 14,10 17,10 A MIN 12,40 13,90 16,90 DIM 4040078 / F 12/97 NOTES: A. B. C. D. All linear dimensions are in millimeters. This drawing is subject to change without notice. Body dimensions do not include mold protrusion not to exceed 0,15. Falls within JEDEC MO-153 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 MECHANICAL DATA MSSO001C – JANUARY 1995 – REVISED DECEMBER 2001 DL (R-PDSO-G**) PLASTIC SMALL-OUTLINE PACKAGE 48 PINS SHOWN 0.025 (0,635) 0.0135 (0,343) 0.008 (0,203) 48 0.005 (0,13) M 25 0.010 (0,25) 0.005 (0,13) 0.299 (7,59) 0.291 (7,39) 0.420 (10,67) 0.395 (10,03) Gage Plane 0.010 (0,25) 1 0°–ā8° 24 0.040 (1,02) A 0.020 (0,51) Seating Plane 0.110 (2,79) MAX 0.004 (0,10) 0.008 (0,20) MIN PINS ** 28 48 56 A MAX 0.380 (9,65) 0.630 (16,00) 0.730 (18,54) A MIN 0.370 (9,40) 0.620 (15,75) 0.720 (18,29) DIM 4040048 / E 12/01 NOTES: A. B. C. D. All linear dimensions are in inches (millimeters). This drawing is subject to change without notice. Body dimensions do not include mold flash or protrusion not to exceed 0.006 (0,15). Falls within JEDEC MO-118 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 MECHANICAL DATA MPDS006C – FEBRUARY 1996 – REVISED AUGUST 2000 DGV (R-PDSO-G**) PLASTIC SMALL-OUTLINE 24 PINS SHOWN 0,40 0,23 0,13 24 13 0,07 M 0,16 NOM 4,50 4,30 6,60 6,20 Gage Plane 0,25 0°–8° 1 0,75 0,50 12 A Seating Plane 0,15 0,05 1,20 MAX PINS ** 0,08 14 16 20 24 38 48 56 A MAX 3,70 3,70 5,10 5,10 7,90 9,80 11,40 A MIN 3,50 3,50 4,90 4,90 7,70 9,60 11,20 DIM 4073251/E 08/00 NOTES: A. B. C. D. All linear dimensions are in millimeters. This drawing is subject to change without notice. Body dimensions do not include mold flash or protrusion, not to exceed 0,15 per side. Falls within JEDEC: 24/48 Pins – MO-153 14/16/20/56 Pins – MO-194 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 MECHANICAL DATA MCFP010B – JANUARY 1995 – REVISED NOVEMBER 1997 WD (R-GDFP-F**) CERAMIC DUAL FLATPACK 48 LEADS SHOWN 0.120 (3,05) 0.075 (1,91) 0.009 (0,23) 0.004 (0,10) 1.130 (28,70) 0.870 (22,10) 0.370 (9,40) 0.250 (6,35) 0.390 (9,91) 0.370 (9,40) 0.370 (9,40) 0.250 (6,35) 48 1 0.025 (0,635) A 0.014 (0,36) 0.008 (0,20) 25 24 NO. OF LEADS** 48 56 A MAX 0.640 (16,26) 0.740 (18,80) A MIN 0.610 (15,49) 0.710 (18,03) 4040176 / D 10/97 NOTES: A. B. C. D. E. All linear dimensions are in inches (millimeters). This drawing is subject to change without notice. This package can be hermetically sealed with a ceramic lid using glass frit. Index point is provided on cap for terminal identification only Falls within MIL STD 1835: GDFP1-F48 and JEDEC MO -146AA GDFP1-F56 and JEDEC MO -146AB POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements, improvements, and other changes to its products and services at any time and to discontinue any product or service without notice. Customers should obtain the latest relevant information before placing orders and should verify that such information is current and complete. All products are sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment. TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TI’s standard warranty. Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty. 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