EClamp2357N EMI Filter and ESD Protection for Secure Digital Card Interfaces PRELIMINARY PROTECTION PRODUCTS - EMIClampTM Description Features The EClamp 2357N is a low pass filter array with integrated TVS diodes. It is designed to suppress unwanted EMI/RFI signals and provide electrostatic discharge (ESD) protection in portable electronic equipment. They have been optimized for protection of touch screen displays, secure digital (SD) card interfaces, and color LCD panels in cellular phones and other portable electronics. EMI/RFI filter with integrated ESD protection ESD protection to IEC 61000-4-2 (ESD) Level4, network for EMI/RFI filtering. A series resistor value of 100Ω and a component capacitance value of 10pF are used to achieve 20dB minimum attenuation from 1.0GHz to 3GHz. The device also includes 4 discrete TVS diodes for dedicated ESD protection. All of the TVS diodes provide effective suppression of ESD voltages in excess of ±15kV (air discharge) and ±8kV (contact discharge) per IEC 61000-4-2, level 4. Mechanical Characteristics TM The device consists of six pi filter circuits comprised of TVS diodes for ESD protection, and a resistor capacitor ±15kV (air), ±8kV (contact) Filter performance: >30dB attenuation at 1.8GHz TVS working voltage: 5V Resistor: 100Ω +/− 15% Component Capacitance: 10pF (VR = 0V) EMI & ESD protection for six lines Dedicated ESD protection for four lines Solid-state technology 16 pin QFN RoHS/WEEE Compliant Nominal Dimensions: 3.0 x 3.0 x 1.0 mm Lead Pitch: 0.5mm Lead Finish: Matte Tin Marking: Marking Code Packaging: Tape and Reel per EIA 481 Applications PIN Configuration Touch Screen Display Interfaces Secure Digital (SD) Memory Card Interfaces Multimedia Card Interfaces (MCI) Color LCD Panel Protection Cell Phone Handsets and Accessories Package Configuration 100 Ω IN OUT 10pF 10pF 16 1 GND R = 100Ω, C=10pF (max) 6X IN/OUT IN/OUT GND 16 Pin QFN (Top Side View) Maximum Dimensions (in mm) 5V TVS 2X Revision 05/16/2005 1 www.semtech.com EClamp2357N PRELIMINARY PROTECTION PRODUCTS Maximum Ratings R ating Symbol Value Units VESD +/- 20 +/- 12 kV Junction Temp erature TJ 125 o Op erating Temp erature Top -40 to +85 o Storage Temp erature TSTG -55 to +150 o ESD p er IEC 61000-4-2 (Air) ESD p er IEC 61000-4-2 (Contact) C C C Electrical Characteristics P ar am et er S y m b ol Con d i t i on s Mi n i mu m Ty p i c a l M ax i m u m Units 5 V 10 V 0.5 µA 100 115 Ohms T VS Reverse Stand-Off Voltage VRWM T VS Reverse Breakdown Voltage V BR It = 1mA T VS Reverse Leakage Current IR VRWM = 3.3V Total Series Resistance R Each Line Total Cap acitance Cin Inp ut to Gnd, Each Line VR = 0V, f = 1MHz 20 22 pF Total Cap acitance Cin Inp ut to Gnd, Each Line VR = 2.5V, f = 1MHz 12 15 pF 2005 Semtech Corp. 2 6 85 8 www.semtech.com EClamp2357N PRELIMINARY PROTECTION PRODUCTS Typical Insertion Loss S21 (Each Filter) CH1 S21 LOG Analog Crosstalk (Each Line) 6 dB / REF 0 dB CH1 S21 LOG 6 dB / REF 0 dB 1: -8.5294 dB 285.697 MHz 2: -18.060 dB 900 MHz 0 dB -6 dB 3: -31.328 dB 1.8 GHz 1 -12 dB 4: -32.019 dB 2.5 GHz -18 dB 2 -24 dB -30 dB 3 4 -36 dB -42 dB 1 MHz 10 MHz 100 MHz 3 1 GHz GHz ESD Clamping (+8kV Contact) ESD Clamping (-8kV Contact) Capacitance vs. Reverse Voltage (Normalized to 0 volts) Series Resistance vs. Temperature (Normalized to 25 Degrees Celcius) 1.2 1.2 1 1.1 0.8 Series Resistance (Ohm) Capacitance - CJ (pF) STOP 3000. 000000 MHz START . 030 MHz STOP 3000. 000000 MHz START . 030 MHz 0.6 0.4 0.2 1.0 0.9 0.8 f = 1 MHz 0 0 1 2 3 4 5 0.7 -40 Reverse Voltage - VR (V) 2005 Semtech Corp. -30 -20 -10 0 10 20 30 40 50 60 70 80 Temperature (*C) 3 www.semtech.com EClamp2357N PRELIMINARY PROTECTION PRODUCTS Applications Information Device Connection Pin Identification and Configuration (Top Side View) The EClamp2357N is comprised of six circuits each consisting of a low pass filter for EMI/RFI suppression and dual TVS diodes for ESD protection. It also includes 4 lines of TVS diodes for ESD protection of power lines or high speed I/O lines. The device is housed in a 16-pin Quad Flat No-Lead (QFN) package. Electrical connection is made via 16 pins located at the bottom of the device. A center tab serves as the ground connection. Pin connections are noted in the table to the right. The device is designed for easy PCB routing as shown in the application examples. All path lengths should be kept as short as possible to minimize the effects of parasitic inductance in the board traces. 16 15 14 13 1 2 3 4 12 11 10 9 5 6 7 8 Matte Tin Lead Finish Matte tin has become the industry standard lead-free replacement for SnPb lead finishes. A matte tin finish is composed of 100% tin solder with large grains. Since the solder volume on the leads is small compared to the solder paste volume that is placed on the land pattern of the PCB, the reflow profile will be determined by the requirements of the solder paste. Therefore, these devices are compatible with both lead-free and SnPb assembly techniques. In addition, unlike other lead-free compositions, matte tin does not have any added alloys that can cause degradation of the solder joint. Pin Identification 3, 4, 5, 7, 9, 10 Input EMI/ESD Protected Lines 1, 2, 11, 12, 14, 16 Output EMI/ESD Protected Lines 6, 8, 13, 15 Input/Output ESD Protected Lines Center Tab Ground Pin Configuration and Schematic 3 2 7 14 LOW PASS FILTER LOW PASS FILTER 4 1 13 8 LOW PASS FILTER 5 16 9 LOW PASS FILTER 6 12 LOW PASS FILTER 15 10 11 LOW PASS FILTER 2005 Semtech Corp. 4 www.semtech.com EClamp2357N PRELIMINARY PROTECTION PRODUCTS Typical Applications 2005 Semtech Corp. 5 www.semtech.com EClamp2357N PRELIMINARY PROTECTION PRODUCTS Outline Drawing - 16L QFN DIM A D A A1 A2 b D D1 E E1 e L N aaa bbb B PIN 1 INDICATOR (LASER MARK) E A2 A aaa C A1 DIMENSIONS INCHES MILLIMETERS MIN NOM MAX MIN NOM MAX C .031 .040 .002 .000 (.008) .007 .010 .012 .114 .118 .122 .051 .057 .061 .114 .118 .122 .051 .057 .061 .020 BSC .012 .016 .020 16 .003 .004 0.80 1.00 0.00 0.05 (0.20) 0.18 0.25 0.30 2.90 3.00 3.10 1.30 1.45 1.55 2.90 3.00 3.10 1.30 1.45 1.55 0.50 BSC 0.30 0.40 0.50 16 0.08 0.10 SEATING PLANE D1 e/2 LxN E/2 E1 2 1 N e bxN bbb D/2 C A B NOTES: 1. CONTROLLING DIMENSIONS ARE IN MILLIMETERS (ANGLES IN DEGREES). 2. COPLANARITY APPLIES TO THE EXPOSED PAD AS WELL AS THE TERMINALS. Land Pattern - 16L QFN H R DIM 2x G 2x Z 2x (C) 4x Y X C G H R P X Y Z DIMENSIONS INCHES MILLIMETERS (.112) .079 .063 .006 .020 .012 .033 .146 (2.85) 2.00 1.60 0.15 0.50 0.30 0.85 3.70 P NOTES: 1. 2005 Semtech Corp. THIS LAND PATTERN IS FOR REFERENCE PURPOSES ONLY. CONSULT YOUR MANUFACTURING GROUP TO ENSURE YOUR COMPANY'S MANUFACTURING GUIDELINES ARE MET. 6 www.semtech.com EClamp2357N PRELIMINARY PROTECTION PRODUCTS Marking 16 15 14 13 1 2 3 4 2357N YYWW Ordering Information Part Number Qty per Reel R eel Size EClamp 2357N .TCT 3000 7 Inch 13 14 15 16 12 11 10 9 12 11 10 9 1 2 3 4 5 6 7 8 8 7 6 5 Top View Showing Device Marking Bottom View Showing Pin 1 Identifier EClamp and EMIClamp are marks of Semtech Corporation Notes: 1) YYWW = Date Code 2) Pin 1 indicated by bevel on the ground pad Tape and Reel Specification Tape Specifications Device Orientation in Tape Contact Information Semtech Corporation Protection Products Division 200 Flynn Rd., Camarillo, CA 93012 Phone: (805)498-2111 FAX (805)498-3804 2005 Semtech Corp. 7 www.semtech.com