Not Recommended for New Designs

EClamp2357N
EMI Filter and ESD Protection
for Secure Digital Card Interfaces
PRELIMINARY
PROTECTION PRODUCTS - EMIClampTM
Description
Features
TM
The EClamp 2357N is a low pass filter array with
integrated TVS diodes. It is designed to suppress
unwanted EMI/RFI signals and provide electrostatic
discharge (ESD) protection in portable electronic
equipment. They have been optimized for protection
of touch screen displays, secure digital (SD)
card interfaces, and color LCD panels in cellular
phones and other portable electronics.
EMI/RFI filter with integrated ESD protection
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ESD protection to IEC 61000-4-2 (ESD) Level4,
±15kV (air), ±8kV (contact)
Filter performance: >30dB attenuation at 1.8GHz
TVS working voltage: 5V
Resistor: 100
Component Capacitance: 10pF (VR = 0V)
EMI & ESD protection for six lines
Dedicated ESD protection for four lines
Solid-state technology
D
The device consists of six pi filter circuits comprised of
TVS diodes for ESD protection, and a resistor capacitor
network for EMI/RFI filtering. A series resistor value of
100 and a component capacitance value of 10pF
are used to achieve 20dB minimum attenuation from
1.0GHz to 3GHz. The device also includes 4 discrete
TVS diodes for dedicated ESD protection. All of the
TVS diodes provide effective suppression of ESD
voltages in excess of ±15kV (air discharge) and ±8kV
(contact discharge) per IEC 61000-4-2, level 4.
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Mechanical Characteristics
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16 pin QFN
RoHS/WEEE Compliant
Nominal Dimensions: 3.0 x 3.0 x 1.0 mm
Lead Pitch: 0.5mm
Lead Finish: Matte Tin
Marking: Marking Code
Packaging: Tape and Reel per EIA 481
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Applications
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100
IN
OUT
10pF
16
1
GND
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R
10pF
Package Configuration
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PIN Configuration
Touch Screen Display Interfaces
Secure Digital (SD) Memory Card Interfaces
Multimedia Card Interfaces (MCI)
Color LCD Panel Protection
Cell Phone Handsets and Accessories
N
R = 100 , C=10pF (max) 6X
IN/OUT
IN/OUT
GND
16 Pin QFN (Top Side View)
Maximum Dimensions (in mm)
5V TVS 2X
Revision 05/16/2005
1
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EClamp2357N
PRELIMINARY
PROTECTION PRODUCTS
Maximum Ratings
Valu e
Units
V E SD
+/- 20
+/- 12
kV
Junction Temperature
TJ
125
Op erating Temp eratu re
T op
-40 to +85
Storage Temperature
TSTG
-55 to +150
ESD p er IEC 61000-4-2 (A ir)
ESD p er IEC 61000-4-2 (Contact)
o
C
o
C
o
C
Con d i t i on s
M ax i m u m
Un its
5
V
10
V
0.5
µA
100
115
Ohms
In p ut to Gnd,
Each Line
VR = 0V, f = 1MHz
20
22
pF
In p ut to Gnd,
Each Line
V R = 2.5V, f = 1MHz
12
15
pF
V RWM
T V S Reverse B reakd ow n Voltage
VB R
It = 1mA
T V S Reverse Leakage Current
IR
V RWM = 3.3V
Total Series Resistance
R
Each Line
Total Cap acitance
Cin
Total Cap acitance
Cin
6
85
Ty p i c a l
8
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T V S Reverse Stan d-Off Vol tage
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Electrical Characteristics
P ar a m e t er
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Symbol
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2005 Semtech Corp.
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EClamp2357N
PRELIMINARY
PROTECTION PRODUCTS
Typical Insertion Loss S21 (Each Filter)
CH1 S21
LOG
Analog Crosstalk (Each Line)
6 dB / REF 0 dB
CH1 S21
LOG
6 dB / REF 0 dB
1: -8.5294 dB
285.697 MHz
-6 dB
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2: -18.060 dB
900 MHz
0 dB
3: -31.328 dB
1.8 GHz
1
-12 dB
4: -32.019 dB
2.5 GHz
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-18 dB
2
-24 dB
3
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-30 dB
4
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-36 dB
-42 dB
1
MHz
10
MHz
100
MHz
3
1
GHz GHz
STOP 3000.000000 MHz
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START. 030 MHz
STOP 3000.000000 MHz
START. 030 MHz
ESD Clamping (-8kV Contact)
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ESD Clamping (+8kV Contact)
Series Resistance vs. Temperature
(Normalized to 25 Degrees Celcius)
R
Capacitance vs. Reverse Voltage
(Normalized to 0 volts)
1.2
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1.2
1
N
1.1
0.8
1.0
0.6
0.9
0.4
0.2
0.8
f = 1 MHz
0
0
1
2
3
4
5
0.7
-40
Reverse Voltage - VR (V)
2005 Semtech Corp.
-30
-20
-10
0
10
20
30
40
50
60
70
80
Temperature (*C)
3
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EClamp2357N
PRELIMINARY
PROTECTION PRODUCTS
Applications Information
Device Connection
Pin Identification and Configuration (Top Side View)
The EClamp2357N is comprised of six circuits each
consisting of a low pass filter for EMI/RFI suppression
and dual TVS diodes for ESD protection. It also
includes 4 lines of TVS diodes for ESD protection of
power lines or high speed I/O lines. The device is
housed in a 16-pin Quad Flat No-Lead (QFN) package.
Electrical connection is made via 16 pins located at the
bottom of the device. A center tab serves as the
ground connection. Pin connections are noted in the
table to the right. The device is designed for easy PCB
routing as shown in the application examples. All path
lengths should be kept as short as possible to minimize
the effects of parasitic inductance in the board traces.
1
2
3
4
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9
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5 6 7 8
I dentificat ion
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Pin
3, 4, 5, 7, 9, 10
Input EMI/ESD Protected Lines
1, 2, 11, 12, 14, 16
Output EMI/ESD Protected Lines
6, 8, 13, 15
Input/Output ESD Protected Li nes
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Matte Tin Lead Finish
Center Tab
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Matte tin has become the industry standard lead-free
replacement for SnPb lead finishes. A matte tin finish
is composed of 100% tin solder with large grains.
Since the solder volume on the leads is small compared to the solder paste volume that is placed on the
land pattern of the PCB, the reflow profile will be
determined by the requirements of the solder paste.
Therefore, these devices are compatible with both
lead-free and SnPb assembly techniques. In addition,
unlike other lead-free compositions, matte tin does not
have any added alloys that can cause degradation of
the solder joint.
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16 15 14 13
Ground
Pin Configuration and Schematic
2
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7
14
LOW PASS FILTER
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LOW PASS FILTER
4
1
13
8
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LOW PASS FILTER
5
16
9
LOW PASS FILTER
12
N
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LOW PASS FILTER
6
15
10
11
LOW PASS FILTER
2005 Semtech Corp.
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EClamp2357N
PRELIMINARY
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PROTECTION PRODUCTS
Typical Applications
2005 Semtech Corp.
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EClamp2357N
PRELIMINARY
PROTECTION PRODUCTS
Outline Drawing - 16L QFN
A
A1
A2
b
D
D1
E
E1
e
L
N
aaa
bbb
B
PIN 1
INDICATOR
(LASER MARK)
E
A2
.031
.040
.000
.002
(.008)
.007 .010 .012
.114 .118 .122
.051 .057 .061
.114 .118 .122
.051 .057 .061
.020 BSC
.012 .016 .020
16
.003
.004
SEATING
PLANE
aaa C
A1
C
D1
LxN
E/2
E1
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e/2
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A
0.80
1.00
0.00
0.05
(0.20)
0.18 0.25 0.30
2.90 3.00 3.10
1.30 1.45 1.55
2.90 3.00 3.10
1.30 1.45 1.55
0.50 BSC
0.30 0.40 0.50
16
0.08
0.10
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A
DIMENSIONS
INCHES
MILLIMETERS
MIN NOM MAX MIN NOM MAX
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DIM
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NOTES:
C A B
CONTROLLING DIMENSIONS ARE IN MILLIMETERS (ANGLES IN DEGREES).
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1.
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D/2
H
R
DIM
2x G 2x Z
2x (C)
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Land Pattern - 16L QFN
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2. COPLANARITY APPLIES TO THE EXPOSED PAD AS WELL AS THE TERMINALS.
4x Y
X
C
G
H
R
P
X
Y
Z
DIMENSIONS
INCHES
MILLIMETERS
(.112)
.079
.063
.006
.020
.012
.033
.146
(2.85)
2.00
1.60
0.15
0.50
0.30
0.85
3.70
P
NOTES:
1. THIS LAND PATTERN IS FOR REFERENCE PURPOSES ONLY.
CONSULT YOUR MANUFACTURING GROUP TO ENSURE YOUR
COMPANY'S MANUFACTURING GUIDELINES ARE MET.
2005 Semtech Corp.
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EClamp2357N
PRELIMINARY
PROTECTION PRODUCTS
Marking
16 15 14 13
Qty p er
R ee l
R ee l Size
EClamp2357N.T CT
3000
7 Inch
12
11
10
9
1
2
3
4
EClamp and EMIClamp are marks of Semtech Corporation
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13 14 15 16
5 6 7 8
8 7 6 5
Top View Showing
Device Marking
Bottom View Showing
Pin 1 Identifier
D
2357N
YYWW
P art Numbe r
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1
2
3
4
Ordering Information
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Notes:
1) YYWW = Date Code
2) Pin 1 indicated by bevel on the ground pad
Tape Specifications
Device Orientation in Tape
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Tape and Reel Specification
Contact Information
Semtech Corporation
Protection Products Division
200 Flynn Rd., Camarillo, CA 93012
Phone: (805)498-2111 FAX (805)498-3804
2005 Semtech Corp.
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