± SLLS348M − JUNE 1999 − REVISED MARCH 2004
D RS-232 Bus-Pin ESD Protection Exceeds
D
D
D
D
D
D
D
D
D
D
DB OR PW PACKAGE
(TOP VIEW)
±15 kV Using Human-Body Model (HBM)
Meets or Exceeds the Requirements of
TIA/EIA-232-F and ITU v.28 Standards
Operates With 3-V to 5.5-V VCC Supply
Operates Up To 250 kbit/s
One Driver and One Receiver
Low Standby Current . . . 1 µA Typical
External Capacitors . . . 4 × 0.1 µF
Accepts 5-V Logic Input With 3.3-V Supply
Alternative High-Speed Pin-Compatible
Device (1 Mbit/s)
− SNx5C3221
Auto-Powerdown Feature Automatically
Disables Drivers for Power Savings
Applications
− Battery-Powered, Hand-Held, and
Portable Equipment
− PDAs and Palmtop PCs
− Notebooks, Subnotebooks, and Laptops
− Digital Cameras
− Mobile Phones and Wireless Devices
EN
C1+
V+
C1−
C2+
C2−
V−
RIN
1
16
2
15
3
14
4
13
5
12
6
11
7
10
8
9
FORCEOFF
VCC
GND
DOUT
FORCEON
DIN
INVALID
ROUT
description/ordering information
The MAX3221 consists of one line driver, one line receiver, and a dual charge-pump circuit with ±15-kV ESD
protection pin to pin (serial-port connection pins, including GND). The device meets the requirements of
TIA/EIA-232-F and provides the electrical interface between an asynchronous communication controller and
the serial-port connector. The charge pump and four small external capacitors allow operation from a single 3-V
to 5.5-V supply. These devices operate at data signaling rates up to 250 kbit/s and a maximum of 30-V/µs driver
output slew rate.
ORDERING INFORMATION
ORDERABLE
PART NUMBER
PACKAGE†
TA
SSOP (DB)
−0°C to 70°C
TSSOP (PW)
SSOP (DB)
−40°C to 85°C
TSSOP (PW)
Tube of 80
MAX3221CDB
Reel of 2000
MAX3221CDBR
Tube of 90
MAX3221CPW
Reel of 2000
MAX3221CPWR
Tube of 80
MAX3221IDB
Reel of 2000
MAX3221IDBR
Tube of 90
MAX3221IPW
Reel of 2000
MAX3221IPWR
TOP-SIDE
MARKING
MA3221C
MA3221C
MB3221I
MB3221I
† Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are
available at www.ti.com/sc/package.
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
Copyright 2004, Texas Instruments Incorporated
!"#$%! & '("")% $& ! *(+,'$%! -$%)
"!-('%& '!!"# %! &*)''$%!& *)" %.) %)"#& ! )/$& &%"(#)%&
&%$-$"- 0$""$%1 "!-('%! *"!')&&2 -!)& !% )')&&$",1 ',(-)
%)&%2 ! $,, *$"$#)%)"&
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1
± SLLS348M − JUNE 1999 − REVISED MARCH 2004
description/ordering information (continued)
Flexible control options for power management are available when the serial port is inactive. The
auto-powerdown feature functions when FORCEON is low and FORCEOFF is high. During this mode of
operation, if the device does not sense a valid RS-232 signal on the receiver input, the driver output is disabled.
If FORCEOFF is set low and EN is high, both the driver and receiver are shut off, and the supply current is
reduced to 1 µA. Disconnecting the serial port or turning off the peripheral drivers causes the auto-powerdown
condition to occur. Auto-powerdown can be disabled when FORCEON and FORCEOFF are high. With
auto-powerdown enabled, the device is activated automatically when a valid signal is applied to the receiver
input. The INVALID output notifies the user if an RS-232 signal is present at the receiver input. INVALID is high
(valid data) if the receiver input voltage is greater than 2.7 V or less than −2.7 V, or has been between −0.3 V
and 0.3 V for less than 30 µs. INVALID is low (invalid data) if the receiver input voltage is between −0.3 V and
0.3 V for more than 30 µs. Refer to Figure 5 for receiver input levels.
Function Tables
EACH DRIVER
INPUTS
OUTPUT
DOUT
DRIVER STATUS
X
Z
Powered off
Normal operation with
auto-powerdown disabled
DIN
FORCEON
FORCEOFF
VALID RIN
RS-232 LEVEL
X
X
L
L
H
H
X
H
H
H
H
X
L
L
L
H
Yes
H
H
L
H
Yes
L
L
L
H
No
Z
H
L
H
No
Z
Normal operation with
auto-powerdown enabled
Powered off by
auto-powerdown feature
H = high level, L = low level, X = irrelevant, Z = high impedance
EACH RECEIVER
INPUTS
RIN
EN
VALID RIN
RS-232 LEVEL
OUTPUT
ROUT
L
L
X
H
H
L
X
L
X
H
X
Z
Open
L
No
H
H = high level, L = low level, X = irrelevant,
Z = high impedance (off), Open = disconnected
input or connected driver off
2
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± SLLS348M − JUNE 1999 − REVISED MARCH 2004
logic diagram (positive logic)
DIN
FORCEOFF
FORCEON
ROUT
11
13
DOUT
16
12
10
Auto-powerdown
8
9
1
INVALID
RIN
EN
absolute maximum ratings over operating free-air temperature range (unless otherwise noted)†
Supply voltage range, VCC (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.3 V to 6 V
Positive output supply voltage range, V+ (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.3 V to 7 V
Negative output supply voltage range, V− (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 0.3 V to −7 V
Supply voltage difference, V+ − V− (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 V
Input voltage range, VI: Driver (FORCEOFF, FORCEON, EN) . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.3 V to 6 V
Receiver . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −25 V to 25 V
Output voltage range, VO: Driver . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −13.2 V to 13.2 V
Receiver (INVALID) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.3 V to VCC + 0.3 V
Package thermal impedance, θJA (see Notes 2 and 3): DB package . . . . . . . . . . . . . . . . . . . . . . . . . . . 82°C/W
PW package . . . . . . . . . . . . . . . . . . . . . . . . . 108°C/W
Operating virtual junction temperature, TJ . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 150°C
Storage temperature range, Tstg . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −65°C to 150°C
† Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
NOTES: 1. All voltages are with respect to network GND.
2. Maximum power dissipation is a function of TJ(max), θJA, and TA. The maximum allowable power dissipation at any allowable
ambient temperature is PD = (TJ(max) − TA)/θJA. Operating at the absolute maximum TJ of 150°C can affect reliability.
3. The package thermal impedance is calculated in accordance with JESD 51-7.
recommended operating conditions (see Note 4 and Figure 6)
Supply voltage
VIH
Driver and control high-level input voltage
DIN, FORCEOFF, FORCEON, EN
VIL
VI
Driver and control low-level input voltage
DIN, FORCEOFF, FORCEON, EN
Driver and control input voltage
DIN, FORCEOFF, FORCEON
VI
Receiver input voltage
Operating free-air temperature
NOM
MAX
3
3.3
3.6
4.5
5
5.5
VCC = 3.3 V
VCC = 5 V
2.4
MAX3221C
TA
MIN
VCC = 3.3 V
VCC = 5 V
MAX3221I
UNIT
V
2
V
0.8
V
0
5.5
V
−25
25
V
0
70
−40
85
°C
NOTE 4: Test conditions are C1−C4 = 0.1 µF at VCC = 3.3 V ± 0.3 V; C1 = 0.047 µF, C2−C4 = 0.33 µF at VCC = 5 V ± 0.5 V.
POST OFFICE BOX 655303
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3
± SLLS348M − JUNE 1999 − REVISED MARCH 2004
electrical characteristics over recommended ranges of supply voltage and operating free-air
temperature (unless otherwise noted) (see Note 4 and Figure 6)
PARAMETER
II
Input leakage
current
TEST CONDITIONS
FORCEOFF,
FORCEON, EN
Auto-powerdown
disabled
ICC
Supply current
MIN
VCC = 3.3 V or 5 V,
TA = 25°C
Powered off
Auto-powerdown
enabled
No load,
FORCEOFF and
FORCEON at VCC
No load, FORCEOFF at GND
No load, FORCEOFF at VCC,
FORCEON at GND,
All RIN are open or grounded
TYP†
MAX
±0.01
±1
µA
0.3
1
mA
1
10
1
10
UNIT
µA
† All typical values are at VCC = 3.3 V or VCC = 5 V, and TA = 25°C.
NOTE 4: Test conditions are C1−C4 = 0.1 µF at VCC = 3.3 V ± 0.3 V; C1 = 0.047 µF, C2−C4 = 0.33 µF at VCC = 5 V ± 0.5 V.
DRIVER SECTION
electrical characteristics over recommended ranges of supply voltage and operating free-air
temperature (unless otherwise noted) (see Note 4 and Figure 6)
PARAMETER
TEST CONDITIONS
MIN
TYP†
MAX
UNIT
VOH
High-level output voltage
DOUT at RL = 3 kΩ to
GND,
DIN = GND
5
5.4
V
VOL
Low-level output voltage
DOUT at RL = 3 kΩ to
GND,
DIN = VCC
−5
−5.4
V
IIH
IIL
High-level input current
Low-level input current
VI = VCC
VI at GND
IOS
Short-circuit output current‡
VCC = 3.6 V,
VCC = 5.5 V,
ro
Output resistance
VCC, V+, and V− = 0 V,
Ioff
Output leakage current
FORCEOFF = GND
±0.01
±1
µA
±0.01
±1
µA
±35
±60
±35
±60
VO = 0 V
VO = 0 V
VO = ±2 V
VO = ±12 V,
VCC = 3 V to 3.6 V
±25
VO = ±10 V,
VCC = 4.5 V to 5.5 V
±25
300
mA
Ω
10M
µA
† All typical values are at VCC = 3.3 V or VCC = 5 V, and TA = 25°C.
‡ Short-circuit durations should be controlled to prevent exceeding the device absolute power-dissipation ratings, and not more than one output
should be shorted at a time.
NOTE 4: Test conditions are C1−C4 = 0.1 µF at VCC = 3.3 V ± 0.3 V; C1 = 0.047 µF, C2−C4 = 0.33 µF at VCC = 5 V ± 0.5 V.
switching characteristics over recommended ranges of supply voltage and operating free-air
temperature (unless otherwise noted) (see Note 4 and Figure 6)
PARAMETER
tsk(p)
SR(tr)
TEST CONDITIONS
MIN
TYP†
150
250
CL = 1000 pF,
RL = 3 kΩ,
See Figure 1
CL = 150 pF to 2500 pF,
RL = 3 kΩ to 7 kΩ,
See Figure 2
Slew rate, transition region
(see Figure 1)
VCC = 3.3 V,
RL = 3 kΩ to 7 kΩ
CL = 150 pF to 1000 pF
6
30
CL = 150 pF to 2500 pF
4
30
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
UNIT
kbit/s
100
† All typical values are at VCC = 3.3 V or VCC = 5 V, and TA = 25°C.
§ Pulse skew is defined as |tPLH − tPHL| of each channel of the same device.
NOTE 4: Test conditions are C1−C4 = 0.1 µF at VCC = 3.3 V ± 0.3 V; C1 = 0.047 µF, C2−C4 = 0.33 µF at VCC = 5 V ± 0.5 V.
4
MAX
Maximum data rate
Pulse skew§
ns
V/µs
± SLLS348M − JUNE 1999 − REVISED MARCH 2004
ESD protection
TERMINAL
NAME
NO.
DOUT
13
TEST CONDITIONS
HBM
TYP
UNIT
±15
kV
RECEIVER SECTION
electrical characteristics over recommended ranges of supply voltage and operating free-air
temperature (unless otherwise noted) (see Note 4 and Figure 6)
PARAMETER
VOH
VOL
TEST CONDITIONS
High-level output voltage
IOH = −1 mA
IOL = 1.6 mA
Low-level output voltage
VIT+
Positive-going input threshold voltage
VCC = 3.3 V
VCC = 5 V
VIT−
Negative-going input threshold voltage
VCC = 3.3 V
VCC = 5 V
Vhys
Ioff
Input hysteresis (VIT+ − VIT−)
TYP†
MIN
VCC−0.6
MAX
VCC−0.1
V
0.4
1.6
2.4
1.9
2.4
0.6
1.1
0.8
1.4
±0.05
FORCEOFF = 0 V
ri
Input resistance
VI = ±3 V to ±25 V
3
5
† All typical values are at VCC = 3.3 V or VCC = 5 V, and TA = 25°C.
NOTE 4: Test conditions are C1−C4 = 0.1 µF at VCC = 3.3 V ± 0.3 V; C1 = 0.047 µF, C2−C4 = 0.33 µF at VCC = 5 V ± 0.5 V.
V
V
V
0.5
Output leakage current
UNIT
V
±10
µA
7
kΩ
switching characteristics over recommended ranges of supply voltage and operating free-air
temperature (unless otherwise noted) (see Note 4)
PARAMETER
TEST CONDITIONS
MIN
TYP†
MAX
UNIT
tPLH
tPHL
Propagation delay time, low- to high-level output
CL = 150 pF, See Figure 3
150
ns
Propagation delay time, high- to low-level output
CL = 150 pF, See Figure 3
150
ns
ten
tdis
Output enable time
CL = 150 pF, RL = 3 kΩ, See Figure 4
200
ns
Output disable time
CL = 150 pF, RL = 3 kΩ, See Figure 4
200
tsk(p)
Pulse skew‡
See Figure 3
50
† All typical values are at VCC = 3.3 V or VCC = 5 V, and TA = 25°C.
‡ Pulse skew is defined as |tPLH − tPHL| of each channel of the same device.
NOTE 4: Test conditions are C1−C4 = 0.1 µF at VCC = 3.3 V ± 0.3 V; C1 = 0.047 µF, C2−C4 = 0.33 µF at VCC = 5 V ± 0.5 V.
ns
ns
ESD protection
TERMINAL
NAME
RIN
TEST CONDITIONS
NO.
8
HBM
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
TYP
UNIT
±15
kV
5
± SLLS348M − JUNE 1999 − REVISED MARCH 2004
AUTO-POWERDOWN SECTION
electrical characteristics over recommended ranges of supply voltage and operating free-air
temperature (unless otherwise noted) (see Figure 5)
PARAMETER
TEST CONDITIONS
MIN
VT+(valid)
Receiver input threshold
for INVALID high-level output voltage
FORCEON = GND,
FORCEOFF = VCC
VT−(valid)
Receiver input threshold
for INVALID high-level output voltage
FORCEON = GND,
FORCEOFF = VCC
−2.7
VT(invalid)
Receiver input threshold
for INVALID low-level output voltage
FORCEON = GND,
FORCEOFF = VCC
−0.3
VOH
INVALID high-level output voltage
IOH = −1 mA, FORCEON = GND,
FORCEOFF = VCC
VOL
INVALID low-level output voltage
IOL = 1.6 mA, FORCEON = GND,
FORCEOFF = VCC
MAX
2.7
UNIT
V
V
0.3
VCC−0.6
V
V
0.4
V
switching characteristics over recommended ranges of supply voltage and operating free-air
temperature (unless otherwise noted) (see Figure 5)
PARAMETER
tvalid
tinvalid
MIN
MAX
UNIT
Propagation delay time, low- to high-level output
1
µs
Propagation delay time, high- to low-level output
30
µs
100
µs
ten
Supply enable time
† All typical values are at VCC = 3.3 V or VCC = 5 V, and TA = 25°C.
6
TYP†
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PARAMETER MEASUREMENT INFORMATION
3V
Generator
(see Note B)
Input
RS-232
Output
50 Ω
RL
tTHL
CL
(see Note A)
3V
FORCEOFF
TEST CIRCUIT
0V
tTLH
−3 V
−3 V
6V
SR(tr) +
t THL or t TLH
VOH
3V
3V
Output
VOL
VOLTAGE WAVEFORMS
NOTES: A. CL includes probe and jig capacitance.
B. The pulse generator has the following characteristics: PRR = 250 kbit/s, ZO = 50 Ω, 50% duty cycle, tr ≤ 10 ns, tf ≤ 10 ns.
Figure 1. Driver Slew Rate
3V
Generator
(see Note B)
RS-232
Output
50 Ω
RL
Input
1.5 V
1.5 V
0V
CL
(see Note A)
tPHL
tPLH
VOH
3V
FORCEOFF
50%
50%
Output
VOL
TEST CIRCUIT
VOLTAGE WAVEFORMS
NOTES: A. CL includes probe and jig capacitance.
B. The pulse generator has the following characteristics: PRR = 250 kbit/s, ZO = 50 Ω, 50% duty cycle, tr ≤ 10 ns, tf ≤ 10 ns.
Figure 2. Driver Pulse Skew
3 V or 0 V
FORCEON
3V
Input
1.5 V
1.5 V
−3 V
Output
Generator
(see Note B)
50 Ω
3V
FORCEOFF
tPHL
CL
(see Note A)
tPLH
VOH
50%
Output
50%
VOL
TEST CIRCUIT
VOLTAGE WAVEFORMS
NOTES: A. CL includes probe and jig capacitance.
B. The pulse generator has the following characteristics: ZO = 50 Ω, 50% duty cycle, tr ≤ 10 ns, tf ≤ 10 ns.
Figure 3. Receiver Propagation Delay Times
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• DALLAS, TEXAS 75265
7
± SLLS348M − JUNE 1999 − REVISED MARCH 2004
PARAMETER MEASUREMENT INFORMATION
3V
Input
3 V or 0 V
FORCEON
VCC
S1
1.5 V
GND
0V
tPZH
(S1 at GND)
tPHZ
(S1 at GND)
RL
3 V or 0 V
1.5 V
VOH
Output
50%
Output
CL
(see Note A)
EN
Generator
(see Note B)
50 Ω
0.3 V
tPZL
(S1 at VCC)
tPLZ
(S1 at VCC)
0.3 V
Output
50%
VOL
TEST CIRCUIT
NOTES: A.
B.
C.
D.
VOLTAGE WAVEFORMS
CL includes probe and jig capacitance.
The pulse generator has the following characteristics: ZO = 50 Ω, 50% duty cycle, tr ≤ 10 ns, tf ≤ 10 ns.
tPLZ and tPHZ are the same as tdis.
tPZL and tPZH are the same as ten.
Figure 4. Receiver Enable and Disable Times
8
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± SLLS348M − JUNE 1999 − REVISED MARCH 2004
PARAMETER MEASUREMENT INFORMATION
2.7 V
2.7 V
0V
Receiver
Input
0V
ROUT
Generator
(see Note B)
3V
−2.7 V
−2.7 V
50 Ω
−3 V
tvalid
tinvalid
VCC
Autopowerdown
INVALID
CL = 30 pF
(see Note A)
FORCEOFF
FORCEON
DIN
DOUT
50% VCC
INVALID
Output
50% VCC
0V
ten
≈V+
V+
0.3 V
VCC
0V
0.3 V
Supply
Voltages
≈V−
V−
TEST CIRCUIT
VOLTAGE WAVEFORMS
ÎÎÎÎÎÎÎÎÎÎÎÎ
ÎÎÎÎÎÎÎÎÎÎÎÎ
ÎÎÎÎÎÎÎÎÎÎÎÎ
ÎÎÎÎÎÎÎÎÎÎÎÎ
ÎÎÎÎÎÎÎÎÎÎÎÎ
ÎÎÎÎÎÎÎÎÎÎÎÎ
Valid RS-232 Level, INVALID High
2.7 V
Indeterminate
0.3 V
0V
If Signal Remains Within This Region
For More Than 30 µs, INVALID Is Low†
−0.3 V
Indeterminate
−2.7 V
Valid RS-232 Level, INVALID High
† Auto-powerdown disables drivers and reduces supply
current to 1 µA.
NOTES: A. CL includes probe and jig capacitance.
B. The pulse generator has the following characteristics: PRR = 5 kbit/s, ZO = 50 Ω, 50% duty cycle, tr ≤ 10 ns, tf ≤ 10 ns.
Figure 5. INVALID Propagation Delay Times and Driver Enabling Time
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• DALLAS, TEXAS 75265
9
± SLLS348M − JUNE 1999 − REVISED MARCH 2004
APPLICATION INFORMATION
EN
1
16
2
VCC
C1+
15
+
3
C1
+
+
−
−
V+
Autopowerdown
C3†
4
GND
−
14
6
C2−
7
−
RIN
12
C2
11
V−
10
C4
+
DOUT
C2+
+
−
CBYPASS = 0.1 µF
C1−
13
5
FORCEOFF
8
9
FORCEON
DIN
INVALID
ROUT
5 kΩ
† C3 can be connected to VCC or GND.
NOTES: A. Resistor values shown are nominal.
B. Nonpolarized ceramic capacitors are acceptable. If polarized tantalum or electrolytic capacitors are used, they should be
connected as shown.
VCC vs CAPACITOR VALUES
VCC
C1
C2, C3, and C4
3.3 V ± 0.3 V
5 V ± 0.5 V
3 V to 5.5 V
0.1 µF
0.047 µF
0.1 µF
0.1 µF
0.33 µF
0.47 µF
Figure 6. Typical Operating Circuit and Capacitor Values
10
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PACKAGE OPTION ADDENDUM
www.ti.com
18-Sep-2008
PACKAGING INFORMATION
Orderable Device
Status (1)
Package
Type
Package
Drawing
Pins Package Eco Plan (2)
Qty
MAX3221CDB
ACTIVE
SSOP
DB
16
80
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
MAX3221CDBE4
ACTIVE
SSOP
DB
16
80
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
MAX3221CDBG4
ACTIVE
SSOP
DB
16
80
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
MAX3221CDBR
ACTIVE
SSOP
DB
16
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
MAX3221CDBRG4
ACTIVE
SSOP
DB
16
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
MAX3221CPW
ACTIVE
TSSOP
PW
16
90
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
MAX3221CPWE4
ACTIVE
TSSOP
PW
16
90
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
MAX3221CPWG4
ACTIVE
TSSOP
PW
16
90
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
MAX3221CPWR
ACTIVE
TSSOP
PW
16
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
MAX3221CPWRE4
ACTIVE
TSSOP
PW
16
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
MAX3221CPWRG4
ACTIVE
TSSOP
PW
16
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
MAX3221IDB
ACTIVE
SSOP
DB
16
80
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
MAX3221IDBE4
ACTIVE
SSOP
DB
16
80
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
MAX3221IDBG4
ACTIVE
SSOP
DB
16
80
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
MAX3221IDBR
ACTIVE
SSOP
DB
16
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
MAX3221IDBRE4
ACTIVE
SSOP
DB
16
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
MAX3221IDBRG4
ACTIVE
SSOP
DB
16
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
MAX3221IPW
ACTIVE
TSSOP
PW
16
90
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
MAX3221IPWE4
ACTIVE
TSSOP
PW
16
90
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
MAX3221IPWG4
ACTIVE
TSSOP
PW
16
90
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
MAX3221IPWR
ACTIVE
TSSOP
PW
16
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
MAX3221IPWRE4
ACTIVE
TSSOP
PW
16
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
MAX3221IPWRG4
ACTIVE
TSSOP
PW
16
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
Addendum-Page 1
Lead/Ball Finish
MSL Peak Temp (3)
PACKAGE OPTION ADDENDUM
www.ti.com
18-Sep-2008
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
OTHER QUALIFIED VERSIONS OF MAX3221 :
• Enhanced Product: MAX3221-EP
NOTE: Qualified Version Definitions:
• Enhanced Product - Supports Defense, Aerospace and Medical Applications
Addendum-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com
30-Jul-2010
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0
Diameter Width (mm)
(mm) W1 (mm)
B0
(mm)
K0
(mm)
P1
(mm)
W
Pin1
(mm) Quadrant
12.0
16.0
Q1
MAX3221CDBR
SSOP
DB
16
2000
330.0
16.4
8.2
6.6
2.5
MAX3221CPWR
TSSOP
PW
16
2000
330.0
12.4
6.9
5.6
1.6
8.0
12.0
Q1
MAX3221IDBR
SSOP
DB
16
2000
330.0
16.4
8.2
6.6
2.5
12.0
16.0
Q1
MAX3221IPWR
TSSOP
PW
16
2000
330.0
12.4
6.9
5.6
1.6
8.0
12.0
Q1
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
30-Jul-2010
*All dimensions are nominal
Device
Package Type
Package Drawing
Pins
SPQ
Length (mm)
Width (mm)
Height (mm)
MAX3221CDBR
SSOP
DB
16
2000
346.0
346.0
33.0
MAX3221CPWR
TSSOP
PW
16
2000
346.0
346.0
29.0
MAX3221IDBR
SSOP
DB
16
2000
346.0
346.0
33.0
MAX3221IPWR
TSSOP
PW
16
2000
346.0
346.0
29.0
Pack Materials-Page 2
MECHANICAL DATA
MSSO002E – JANUARY 1995 – REVISED DECEMBER 2001
DB (R-PDSO-G**)
PLASTIC SMALL-OUTLINE
28 PINS SHOWN
0,38
0,22
0,65
28
0,15 M
15
0,25
0,09
8,20
7,40
5,60
5,00
Gage Plane
1
14
0,25
A
0°–ā8°
0,95
0,55
Seating Plane
2,00 MAX
0,10
0,05 MIN
PINS **
14
16
20
24
28
30
38
A MAX
6,50
6,50
7,50
8,50
10,50
10,50
12,90
A MIN
5,90
5,90
6,90
7,90
9,90
9,90
12,30
DIM
4040065 /E 12/01
NOTES: A.
B.
C.
D.
All linear dimensions are in millimeters.
This drawing is subject to change without notice.
Body dimensions do not include mold flash or protrusion not to exceed 0,15.
Falls within JEDEC MO-150
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
MECHANICAL DATA
MTSS001C – JANUARY 1995 – REVISED FEBRUARY 1999
PW (R-PDSO-G**)
PLASTIC SMALL-OUTLINE PACKAGE
14 PINS SHOWN
0,30
0,19
0,65
14
0,10 M
8
0,15 NOM
4,50
4,30
6,60
6,20
Gage Plane
0,25
1
7
0°– 8°
A
0,75
0,50
Seating Plane
0,15
0,05
1,20 MAX
PINS **
0,10
8
14
16
20
24
28
A MAX
3,10
5,10
5,10
6,60
7,90
9,80
A MIN
2,90
4,90
4,90
6,40
7,70
9,60
DIM
4040064/F 01/97
NOTES: A.
B.
C.
D.
All linear dimensions are in millimeters.
This drawing is subject to change without notice.
Body dimensions do not include mold flash or protrusion not to exceed 0,15.
Falls within JEDEC MO-153
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
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