STA240 Sirius SDARS channel, service & source decoder Data Brief Features ■ 2 Satellite and 1 terrestrial signal demodulators and decoders ■ Advanced DSP processor to implement PAC audio decoder ■ Requires a single 17MHz clock reference; all high-speed clock signals are derived using on-chip PLL ■ Programmable I2S to support 32K/48K/44.1K audio sample rate (32K/48K Sample rates use internal clocks, 44.1K Sample rate uses external clock) ■ I2C master interface to control tuner and audio DAC ■ External control through uart interface using sirius standard protocol (SSP) over RS-232 LBGA288 Description STA240 is a fully integrated 3rd generation Baseband signal processor for Sirius Satellite Digital Radio Service (SDARS). It is implemented using ST Micro's advanced 0.13µm HCMOS9 technology. Analog to digital converters ■ Three internal 10 BIT A/D converters for 76.5MHZ if signals conversion It allows a highly efficient implementation of a Sirius “SDARS Satellite Digital Audio Radio Service” receiver when used with its companion STA210 tuner ASIC. Low power technology ■ 1.2V, 0.13 µm technology ■ 3.3V capable I/OS STA240 is packaged in a low profile BGA (LBGA 19x19) Table 1. June 2007 Device summary Part Number Package Packing STA240 LBGA288 Tray Rev 1 For further information contact your local STMicroelectronics sales office. 1/6 www.st.com 6 Application block diagram 1 STA240 Application block diagram Figure 1. Application block diagram FLASH 1M x 16 STA210N IF Tuner FE I2C IFAGC STA240 STA240 Baseband Baseband Processor Processor SDRAM 8Mbx8 or 16Mx8 2/6 Audio/I 2S Data AC00142 STA240 Electrical specifications 2 Electrical specifications 2.1 Absolute maximum ratings Table 2. Absolute maximum ratings Symbol 2.2 Parameter Value Unit VDD 1.2V Power supply voltage -0.5 to 2 V VDDIO 3.3V Power supply voltage -0.5 to 4 V AD_VDD 1.2V Power supply voltage -0.5 to 2 V AD_VDD3 3.3V Power supply voltage -0.5 to 4 V APLL_VDD 1.2V Power supply voltage -0.5 to 2 V Vi Voltage on input pin -0.5 to (VDDIO + 0.5) V Vo Voltage on output pin -0.5 to (VDDIO + 0.5) V Tstg Storage temperature -55 to +150 °C Top Operative ambient temperature -40 to +85 °C Tj Operative junction temperature -40 to +125 °C Thermal data Table 3. Symbol Thermal Data Parameter Value Unit Rth j-case Thermal resistance junction to case 10 °C/W Rth j-amb Thermal resistance junction to ambient (1) 31 °C/W 1. According to JEDEC specification on a 4 layers board 3/6 Package information 3 STA240 Package information In order to meet environmental requirements, ST offers these devices in ECOPACK® packages. These packages have a Lead-free second level interconnect. The category of second Level Interconnect is marked on the package and on the inner box label, in compliance with JEDEC Standard JESD97. The maximum ratings related to soldering conditions are also marked on the inner box label. ECOPACK is an ST trademark. ECOPACK specifications are available at: www.st.com. Figure 2. LBGA 288 mechanical data & package dimensions mm inch Ref. MIN. TYP. A A1 MAX. MIN. TYP. 1.700 0.270 MAX. 0.0669 0.0106 A2 1.085 0.0427 A3 0.300 0.0118 A4 0.800 0.450 D 18.800 19.000 19.200 0.7402 0.7480 0.7559 e E 0.500 0.0315 b D1 OUTLINE AND MECHANICAL DATA 0.550 0.0177 0.0197 0.0217 17.000 0.6693 1.000 0.0394 18.800 19.000 19.200 0.7402 0.7480 0.7559 E1 17.000 0.6693 F 1.000 0.0394 ddd 0.200 0.0079 eee 0.250 0.0098 fff 0.100 0.0039 LBGA288 (19x19x1.70) Low Profile Ball Grid Array Bottom view 7131786 C 4/6 STA240 4 Revision history Revision history Table 4. Document revision history Date Revision 18-Jun-2007 1 Changes Initial release. 5/6 STA240 Please Read Carefully: Information in this document is provided solely in connection with ST products. STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, modifications or improvements, to this document, and the products and services described herein at any time, without notice. All ST products are sold pursuant to ST’s terms and conditions of sale. Purchasers are solely responsible for the choice, selection and use of the ST products and services described herein, and ST assumes no liability whatsoever relating to the choice, selection or use of the ST products and services described herein. No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted under this document. 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