STMICROELECTRONICS TDA7269ASA

TDA7269ASA
14W+14W STEREO AMPLIFIER WITH MUTE & ST-BY
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FEATURES
Figure 1. Package
WIDE SUPPLY VOLTAGE RANGE UP TO
+20V
SPLIT SUPPLY
HIGH OUTPUT POWER 14+14W
@THD = 10%, RL= 8Ω, VS = ±16V
Clipwatt11
Table 1. Order Codes
NO POP AT TURN-ON/OFF
MUTE (POP FREE)
STAND-BY FEATURE (LOW Iq)
SHORT CIRCUIT PROTECTION TO GND
THERMAL OVERLOAD PROTECTION
CLIPWATT 11 PACKAGE
Part Number
Package
TDA7269ASA
Clipwatt11
cially designed for high quality sound application as
Hi-Fi music centers and stereo TV sets.
The TDA7269ASA is pin to pin compatible with
TDA7269, TDA7269A, TDA7269SA, TDA7265,
TDA7499, TDA7499SA.
DESCRIPTION
The TDA7269ASA is class AB Dual Audio Power amplifier assembled in the @ Clipwatt 11 package, speFigure 2. Block Diagram
+VS
15K
1000µF
1µF
MUTE/
ST-BY
IN (L)
7
1µF
15K
+5V
3
5
+
4
OUT (L)
8
IN- (L)
-
18K
GND
18K
4.7Ω
RL (L)
100nF
560Ω
9
µP
10
IN- (R)
560Ω
18K
1µF
IN (R)
11
-
2
+
1
6
-VS
OUT (R)
4.7Ω
RL (R)
100nF
1000µF
D94AU085
September 2004
Rev. 2
1/11
TDA7269ASA
Table 2. Absolute Maximum Ratings
Symbol
Parameter
VS
DC Supply Voltage
IO
Output Power Current (internally limited)
Value
Unit
±22
V
3
A
20
W
Ptot
Total Power Dissipation (Tamb = 70°C)
Tamb
Ambient Operating Temperature (1)
0 to 70
°C
Tstg, Tj
Storage and Junction Temperature
-40 to 150
°C
Value
Unit
Figure 3. Pin Connection (Top view)
11
IN+(1)
10
IN-(1)
9
GND
8
IN-(2)
7
IN+(2)
6
-VS
5
MUTE
4
OUTPUT(2)
3
+VS
2
OUTPUT(1)
1
-VS
D03AU1506
Table 3. Thermal Data
Symbol
Parameter
Rth j-case
Thermal Resistance Junction-case Max.
3.9
°C/W
Rth j-amb
Thermal Resistance Junction-ambient
48
°C/W
Figure 4. Single Supply Application
+VS
D1 5.1V
R1
10K
C1
1µF
R3
15K
C5
1000µF
MUTE
PLAY
5V
0
MUTE
R2
15K
C2
100µF
IN (L)
Q1
BSX33
3
5
7
C3 1µF
+
4
OUT (L)
8
IN- (L)
-
9
C4 1µF
IN (R)
11
C6
0.1µF
C9 470µF
R4
30K
R5
1K
+
2
IN- (R)
R8
4.7Ω
C7
0.1µF
OUT
(L)
C10 470µF
10
1
6
GND
OUT (R)
R6
30K
R7
1K
R9
4.7Ω
C8
0.1µF
D96AU444A
2/11
OUT
(R)
TDA7269ASA
Table 4. ELECTRICAL CHARACTERISTCS
(Refer to the test circuit VS = ±16V; RL = 8Ω; RS = 50Ω; GV = 30dB, f = 1KHz; Tamb = 25°C, unless otherwise
specified)
Symbol
Parameter
VS
Supply Voltage Range
Iq
Total Quiescent Current
VOS
RL = 8Ω
RL = 4Ω
Non Inverting Input Bias Current
PO
Output Power
Total Harmonic Distortion
Min.
Typ.
±5
±5
60
Input Offset Voltage
Ib
THD
Test Condition
-25
Slew Rate
GOL
Open Loop Voltage Gain
eN
Ri
SVR
Tj
Total Output Noise
100
mA
25
mV
12
8
14
10
W
W
THD = 1%;
RL = 8Ω;
VS = ±12.5V; RL = 4Ω;
9
6
11
7.5
W
W
0.03
%
RL = 8Ω; PO = 1W; f = 1KHz;
f = 1KHz;
f = 10KHz;
0.7
0.02
%
%
1
%
50
70
60
dB
dB
6.5
10
V/µs
80
dB
A Curve
f = 20Hz to 22KHz
Input Resistance
Supply Voltage Rejection
(each channel)
V
V
nA
RL = 4Ω; VS = ±10V;
PO = 0.1 to 5W;
f = 100Hz to 15KHz;
SR
±20
±15
THD = 10%;
RL = 8Ω;
VS = ±12.5V; RL = 4Ω;
RL = 4Ω; PO = 1W; f = 1KHz;
Cross Talk
Unit
500
RL = 8Ω; PO = 0.1 to 5W;
f = 100Hz to 15KHz;
CT
Max.
3
4
15
f = 100Hz; VR = 0.5V
Thermal Shut-down Junction
Temperature
8
µV
µV
20
KΩ
60
dB
145
°C
MUTE FUNCTION [ref +VS] (*)
VMUTE
Mute /Play threshold
-7
-6
AMUTE
Mute Attenuation
60
70
-3.5
-2.5
-5
V
dB
STAND-BY FUNCTIONS [ref: +VS] (only for Split Supply)
VST-BY
Stand-by Mute threshold
AST-BY
Stand-by Attenuation
IqST-BY
Quiescent Current @ Stand-by
-1.5
110
3
V
dB
6
mA
(*) In mute condition the current drawn from Pin 5 must be ≤650µA
3/11
TDA7269ASA
3
MUTE STAND-BY FUNCTION
The pin 5 (MUTE/STAND-BY) controls the amplifier status by two different thresholds, referred to +VS.
– When Vpin5 higher than = +VS -2.5V the amplifier is in Stand-by mode and the final stage generators
are off.
– When Vpin5 between = +VS -2.5V and VS -6V the final stage current generators are switched on and
the amplifier is in mute mode.
– When Vpin5 lower than = +VS -6V the amplifier is play mode.
Figure 5.
+VS
(V)
20
t
-VS
-20
VIN
(mV)
Vpin5
(V)
VS
VS-2.5
VS-6
VS-10
Iq
(mA)
0
VOUT
(V)
OFF
PLAY
STDBY
PLAY
OFF
STDBY
STDBY
MUTE
4/11
D94AU086
MUTE
MUTE
MUTE
TDA7269ASA
Figure 6. Test and Application Circuit (Stereo Configuration)
+VS
R2
C3
MUTE/
ST-BY
Q1
R1
IN (L)
SW1
ST-BY DZ
7
R3
+
4
OUT (L)
8
IN- (L)
-
GND
C5
3
5
C1
R4
C4
+VS
R5
R7
RL (L)
C8
R6
9
SW2
MUTE
10
R9
IN- (R)
R8
C2
IN (R)
11
-
2
OUT (R)
+
1
R10
6
-VS
C7
RL (R)
C9
C6
D94AU087B
4
APPLICATION SUGGESTIONS
4.1 Demo Board Schematic
The recommended values of the external components are those shown the demoboard schematic different values can be used, the following table can help the designer
Table 5. .
COMPONENT
SUGGESTION
VALUE
R1
10KΩ
Mute Circuit
Increase of Dz Biasing
Current
R2
15KΩ
Mute Circuit
Vpin #5 Shifted Downward
Vpin #5 Shifted Upward
R3
18KΩ
Mute Circuit
Vpin #5 Shifted Upward
Vpin #5 Shifted Downward
R4
15KΩ
Mute Circuit
Vpin #5 Shifted Upward
Vpin #5 Shifted Downward
R5, R8
18KΩ
Increase of Gain
R6, R9
560Ω
Closed Loop Gain
Setting (*)
R7, R10
4.7Ω
Frequency Stability
Danger of Oscillations
C1, C2
1µF
Input DC Decoupling
C3
1µF
St-By/Mute Time
Constant
C4, C6
1000µF
Supply Voltage Bypass
Danger of Oscillations
C5, C7
0.1µF
Supply Voltage Bypass
Danger of Oscillations
C8, C9
0.1µF
Frequency Stability
Dz
5.1V
Mute Circuit
PURPOSE
LARGER THAN
RECOMMENDED VALUE
SMALLER THAN
RECOMMENDED VALUE
Decrease of Gain
Danger of Oscillations
Higher Low Frequency Cutoff
Larger On/Off Time
Smaller On/Off Time
(*) Closed loop gain has to be ≥25dB
5/11
TDA7269ASA
4.2 PC Board
Figure 7. LC
Figure 8. LS
Figure 9. Component Layout
6/11
TDA7269ASA
5
HEAT SINK DIMENSIONING:
In order to avoid the thermal protection intervention, that is placed approximatively at Tj = 150°C, it is important the dimensioning of the Heat Sinker RTh (°C/W).
The parameters that influence the dimensioning are:
– Maximum dissipated power for the device (Pdmax)
– Max thermal resistance Junction to case (R Th j-c)
– Max. ambient temperature Tamb max
– Quiescent current Iq (mA)
5.1 Example:
VCC = ±16V, Rload = 8ohm, RTh j-c = 3.9 °C/W , Tamb max = 50°C
2
2V cc
Pdmax = (N° channels) · -------------------------- + I q ⋅ V c c
2
Π ⋅ R lo ad
Pdmax = 2 · ( 6.49 ) + 0.84 = 14 W
150 – T am b max
150 – 50
(Heat Sinker) R Th c-a = ----------------------------------------- – R T h j-c = ---------------------- – 3.9 = 3°C /W
14
P d max
In figure 10 is shown the Power derating curve for the device.
Figure 10. Power derating curve
25
20
Pd (W)
(a)
15
(b)
10
a)
Infinite Heatsink
b)
3.0 °C/ W
c)
5.0 °C/ W
(c)
5
0
0
40
80
120
160
Tamb (°C)
7/11
TDA7269ASA
6
CLIPWATT ASSEMBLING SUGGESTIONS
The suggested mounting method of Clipwatt on external heat sink, requires the use of a clip placed as much
as possible in the plastic body center, as indicated in the example of figure 11.
A thermal grease can be used in order to reduce the additional thermal resistance of the contact between package and heatsink.
A pressing force of 7 - 10 Kg gives a good contact and the clip must be designed in order to avoid a maximum
contact pressure of 15 Kg/mm2 between it and the plastic body case.
As example , if a 15Kg force is applied by the clip on the package , the clip must have a contact area of 1mm2
at least.
Figure 11. Example of right placement of the clip
8/11
TDA7269ASA
Figure 12. Clipwatt11 Mechanical Data & Package Dimensions
mm
inch
DIM.
MIN.
TYP.
MAX.
MIN.
TYP.
MAX.
A
3.2
0.126
B
1.05
0.041
C
0.15
0.006
D
1.5
0.059
E
0.49
F
0.77
0.8
F1
0.55
0.019
0.88
0.030
Weight: 1.80gr
0.002
0.031
0.15
0.035
0.006
G
1.57
1.7
1.83
0.062
0.067
0.072
G1
16.87
17
17.13
0.664
0.669
0.674
H1
12
0.480
H2
18.6
0.732
H3
19.85
0.781
L
17.9
0.700
L1
14.55
0.580
L2
10.7
OUTLINE AND
MECHANICAL DATA
11
11.2
0.421
0.433
L3
5.5
0.217
M
2.54
0.100
M1
2.54
0.100
0.441
Clipwatt11
0044448 G
9/11
TDA7269ASA
Table 6. Revision History
Date
Revision
May 2003
1
First Issue
Septembe 2004
2
Changed Status and the graphic aspect in compliant to the new rules
“Corporate Technical Pubblications Design Guide”
10/11
Description of Changes
TDA7269ASA
Information furnished is believed to be accurate and reliable. However, STMicroelectronics assumes no responsibility for the consequences
of use of such information nor for any infringement of patents or other rights of third parties which may result from its use. No license is granted
by implication or otherwise under any patent or patent rights of STMicroelectronics. Specifications mentioned in this publication are subject
to change without notice. This publication supersedes and replaces all information previously supplied. STMicroelectronics products are not
authorized for use as critical components in life support devices or systems without express written approval of STMicroelectronics.
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All other names are the property of their respective owners
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11/11