TDA7297SA - STMicroelectronics

TDA7297SA
10W+10W DUAL BRIDGE AMPLIFIER
■
■
WIDE SUPPLY VOLTAGE RANGE (6V-18V)
MINIMUM EXTERNAL COMPONENTS
– NO SWR CAPACITOR
TECHNOLOGY BI20II
– NO BOOTSTRAP
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– NO BOUCHEROT CELLS
– INTERNALLY FIXED GAIN
■
STAND-BY & MUTE FUNCTIONS
■
SHORT CIRCUIT PROTECTION
■
THERMAL OVERLOAD PROTECTION
DESCRIPTION
The TDA7297SA is a dual bridge amplifier specially
designed for TV and Portable Radio applications.
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BLOCK AND APPLICATION DIAGRAM
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CLIPWATT15
ORDERING NUMBER: TDA7297SA
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Pin to pin compatible with: TDA7297, TDA7266B,
TDA7266SA, TDA7266M, TDA7266MA, TDA7266,
& TDA7266S.
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Pr
0.22µF
IN1
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VCC
470µF
3
4
+
100nF
13
1
OUT1+
2
OUT1-
15
OUT2+
14
OUT2-
-
ST-BY
7
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b
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S-GND
0.22µF
IN2
9
Vref
12
+
+
-
MUTE
6
PW-GND
8
+
D94AU175B
September 2003
1/11
TDA7297SA
ABSOLUTE MAXIMUM RATINGS
Symbol
Parameter
Value
Unit
Vs
Supply Voltage
20
V
IO
Output Peak Current (internally limited)
2
A
Ptot
Total power dissipation (Tcase = 70°C)
Top
Operating Temperature
Tstg, Tj
Storage and Junction Temperature
30
W
0 to 70
°C
-40 to 150
°C
THERMAL DATA
Symbol
Parameter
Value
Rth j-case
Thermal Resistance Junction-case
Rth j-amb
Thermal Resistance Junction to ambient
PIN CONNECTION (Top view)
15
OUT2+
14
OUT2-
IN2
12
11
bs
10
9
O
)
8
7
uc
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Pr
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°C/W
48
°C/W
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VCC
13
t(s
Unit
Typ. = 1.8; Max. = 2.5
N.C.
N.C.
S-GND
PW-GND
ST-BY
6
MUTE
5
N.C.
4
IN1
3
VCC
2
OUT1-
1
OUT1+
D03AU1463
ELECTRICAL CHARACTERISTCS
(VCC = 13V, RL = 8Ω, f = 1KHz, Tamb = 25°C unless otherwise specified)
bs
Symbol
O
VCC
Iq
Parameter
Test Condition
Supply Range
Total Quiescent Current
Typ.
Max.
18
V
50
65
mA
120
mV
6.5
RL = ∞
VOS
Output Offset Voltage
PO
Output Power
THD 10%
Total Harmonic Distortion
PO = 1W
THD
Min.
8.3
10
0.1
PO = 0.1W to 2W
f = 100Hz to 15KHz
SVR
CT
AMUTE
Supply Voltage Rejection
0.3
%
1
%
40
56
dB
46
60
dB
Mute Attenuation
60
80
dB
150
°C
Thermal Threshold
GV
Closed Loop Voltage Gain
2/11
W
Crosstalk
Tw
∆GV
f = 100Hz, VR =0.5V
Unit
Voltage Gain Matching
31
32
33
dB
0.5
dB
TDA7297SA
ELECTRICAL CHARACTERISTCS (continued)
(VCC = 13V, RL = 8Ω, f = 1KHz, Tamb = 25°C unless otherwise specified)
Symbol
Parameter
Ri
Input Resistance
VTMUTE
Mute Threshold
VTST-BY
St-by Threshold
IST-BY
Test Condition
Vo = -30dB
Typ.
25
30
Max.
Unit
KΩ
2.3
2.9
4.1
V
0.8
1.3
1.8
V
100
µA
500
µV
µV
St-by Current V6 = GND
Total Output Voltage
eN
Min.
A Curve;
f = 20Hz to 20KHz
150
220
)
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APPLICATION SUGGESTION
STAND-BY AND MUTE FUNCTIONS
(A) Microprocessor Application
In order to avoid annoying "Pop-Noise" during Turn-On/Off transients, it is necessary to guarantee the right Stby and mute signals sequence. It is quite simple to obtain this function using a microprocessor (Fig. 1 and 2).
At first St-by signal (from µP) goes high and the voltage across the St-by terminal (Pin 7) starts to increase exponentially. The external RC network is intended to turn-on slowly the biasing circuits of the amplifier, this to
avoid "POP" and "CLICK" on the outputs.
When this voltage reaches the St-by threshold level, the amplifier is switched-on and the external capacitors in
series to the input terminals (C3, C5) start to charge.
It's necessary to mantain the mute signal low until the capacitors are fully charged, this to avoid that the device
goes in play mode causing a loud "Pop Noise" on the speakers.
A delay of 100-200ms between St-by and mute signals is suitable for a proper operation.
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Figure 1. Microprocessor Application
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IN1
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du
C1 0.22µF
VCC
3
4
+
1
C5
470µF
OUT1+
2
OUT1-
15
OUT2+
14
OUT2-
13
C6
100nF
-
ST-BY R1 10K
7
C2
10µF
S-GND
µP
9
Vref
C3 0.22µF
IN2
MUTE R2 10K
12
+
+
-
6
C4
1µF
PW-GND
8
+
D95AU258A
3/11
TDA7297SA
Figure 2. Microprocessor Driving Signals
+VS(V)
VIN
(mV)
VST-BY
pin 7
1.8
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1.3
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0.8
VMUTE
pin 6
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4.1
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2.9
2.3
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(s
Iq
(mA)
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VOUT
(V)
P
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OFF
let
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b
ST-BY
PLAY
MUTE
MUTE
ST-BY
OFF
D96AU259/mod
B) Low Cost Application
In low cost applications where the µP is not present, the suggested circuit is shown in fig.3.
O
The St-by and mute terminals are tied together and they are connected to the supply line via an external voltage
divider.
The device is switched-on/off from the supply line and the external capacitor C4 is intended to delay the St-by
and mute threshold exceeding, avoiding "Popping" problems.
4/11
TDA7297SA
Figure 3. Stand-alone low-cost Application
VCC
C3 0.22µF
IN1
R1
47K
+
-
12
6
)
(s
ct
du
15
OUT2+
14
OUT2-
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-
8
+
D95AU260A
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P
Figure 4. Distortion vs Output Power.
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OUT1-
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+
-
MUTE
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+
IN2
PW-GND
)
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9
C5 0.22µF
o
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b
C2
100nF
7
Vref
10
1
C1
470µF
OUT1+
C4
10µF
S-GND
TH D (% )
13
-
ST-BY
R2
47K
3
4
Figure 5. Distortion vs Frequency
T H D (% )
10
Vc c = 12 V
R l = 8 o hm
V c c = 16.5V
R l = 8 o hm
1
1
f = 1 5K Hz
P o ut = 1 0 0m W
f = 5K Hz
0.1
0.1
f = 1K Hz
0.0 1 0
0.1
P o ut = 5W
1
P ou t (W )
10
0.010
100
1k
10k
20k
freq uen cy (H z)
5/11
TDA7297SA
Figure 6. Frequency Response
Figure 9. Mute Attenuation vs Vpin 6
Level(d B r)
Attenuation (dB)
5.00 0 0
10
4.00 0 0
0
3.00 0 0
-10
V c c = 1 6 .5 V
Rl = 8 ohm
Pou t = 1W
2.00 0 0
-20
-30
1.00 0 0
-40
0.0
-50
-1.00 0
-60
-2.00 0
-70
-3.00 0
-80
-4.00 0
-90
-5.00 0
-100
10
10 0
1k
10 k
10 0 k
1
1.5
2
2.5
3
freq uency (Hz )
Figure 7. Output Power vs Supply Voltage
Rf=8Ω
f=1KHz
10
8
6
)
(s
d=10%
d=1%
4
t
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2
0
6
7
8
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9
10
11
O
5
t
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10
0
-10
-20
-30
-40
-50
-60
-70
-80
-90
-100
-110
-120
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Attenuation (dB)
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0
0.2
0.4
0.6
0.8
1
1.2
1.4
1.6
1.8
2
2.2
2.4
Vpin.7 (V)
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Figure 8. Ptot & Efficiency vs Ouput Power
bs
4.5
d
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r
12 Vs(V)
P
e
Ptot(W)10
(s)
4
Figure 10. Stand-By attenuation vs Vpin 7
D99AU1080
Po
(W)
3.5
Vpin.6(V)
80 µ (%)
Ptot
Figure 11. Quiescent Current vs Supply
Voltage
Iq (mA)
70
8
60
65
µ
60
6
40
Vcc = 12V
RL = 8Ω (both
channel)
f = 1KHz
4
55
50
20
2
45
40
0
0
0.5 1
2
3
4
5
6
2 x Pout (W)
7
8
9
0
10 11
35
30
6
7
8
9
10
11
12
13
Vsupply(V)
6/11
14
15
16
17
18
TDA7297SA
Figure 12. PC Board Component Layout
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Figure 13. Evaluation Board Top Layer Layout
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Figure 14. Evaluation Board Bottom Layer Layout
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7/11
TDA7297SA
HEAT SINK DIMENSIONING:
In order to avoid the thermal protection intervention, that is placed approximatively at Tj = 150°C, it is important
the dimensioning of the Heat Sinker RTh (°C/W).
The parameters that influence the dimensioning are:
– Maximum dissipated power for the device (Pdmax)
– Max thermal resistance Junction to case (RTh j-c)
– Max. ambient temperature Tamb max
– Quiescent current Iq (mA)
Example:
)
s
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VCC = 13V, Rload = 8ohm, RTh j-c = 2.5 °C/W , Tamb max = 50°C
2
Vc c
- + Iq ⋅ Vc c
Pdmax = (N° channels) · -------------------------2 R loa d
Π ⋅ -------------2
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Pdmax = 2 · ( 4.28 ) + 0.5 = 9 W
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150 – T am b max
– 50- – 2.5 = 8.6°C/W
- – R T h j-c = 150
--------------------(Heat Sinker) R Th c-a = ---------------------------------------9
P d max
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In figure 15 is shown the Power derating curve for the device.
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Figure 15. Power derating curve
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35
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30
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25
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Pd (W)
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(a)
20
(c)
15
10
(b)
(d)
5
0
0
40
80
Tamb (°C)
8/11
120
160
a)
Infinite Heatsink
b)
3.5 °C/ W
c)
5.0 °C/ W
d)
7.0 °C/ W
TDA7297SA
Clipwatt Assembling Suggestions
The suggested mounting method of Clipwatt on external heat sink, requires the use of a clip placed as much
as possible in the plastic body center, as indicated in the example of figure 16.
A thermal grease can be used in order to reduce the additional thermal resistance of the contact between package and heatsink.
A pressing force of 7 - 10 Kg gives a good contact and the clip must be designed in order to avoid a maximum
contact pressure of 15 Kg/mm2 between it and the plastic body case.
As example , if a 15Kg force is applied by the clip on the package , the clip must have a contact area of 1mm2
at least.
Figure 16. Example of right placement of the clip
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9/11
TDA7297SA
mm
inch
DIM.
MIN.
TYP.
MAX.
MIN.
TYP.
A
3.2
0.126
B
1.05
0.041
C
0.15
0.006
D
1.55
0.061
Weight: 1.92gr
E
0.49
0.55
0.019
0.022
F
0.67
0.73
0.026
0.029
G
1.14
1.27
1.4
0.045
0.050
0.055
G1
17.57
17.78
17.91
0.692
0.700
0.705
H1
12
0.480
H2
18.6
0.732
H3
19.85
)
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0.781
L
17.95
0.707
L1
14.45
0.569
L2
OUTLINE AND
MECHANICAL DATA
MAX.
10.7
11
11.2
0.421
0.433
L3
5.5
0.217
M
2.54
0.100
M1
2.54
0.100
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0.441
)
(s
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Clipwatt15
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0044538
10/11
TDA7297SA
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Information furnished is believed to be accurate and reliable. However, STMicroelectronics assumes no responsibility for the consequences
of use of such information nor for any infringement of patents or other rights of third parties which may result from its use. No license is granted
by implication or otherwise under any patent or patent rights of STMicroelectronics. Specifications mentioned in this publication are subject
to change without notice. This publication supersedes and replaces all information previously supplied. STMicroelectronics products are not
authorized for use as critical components in life support devices or systems without express written approval of STMicroelectronics.
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All other names are the property of their respective owners
© 2003 STMicroelectronics - All rights reserved
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