SDFS063A − D2932, MARCH 1987 − REVISED OCTOBER 1993 • SN54F244 . . . J PACKAGE SN74F244 . . . DB, DW, OR N PACKAGE (TOP VIEW) 3-State Outputs Drive Bus Lines or Buffer Memory Address Registers Package Options Include Plastic Small-Outline (SOIC) and Shrink Small-Outline (SSOP) Packages, Ceramic Chip Carriers, and Plastic and Ceramic DIPs 1OE 1A1 2Y4 1A2 2Y3 1A3 2Y2 1A4 2Y1 GND description These octal buffers and line drivers are designed specifically to improve both the performance and density of 3-state memory address drivers, clock drivers, and bus-oriented receivers and transmitters. Taken together with the ′F240 and ′F241, these devices provide the choice of selected combinations of inverting and noninverting outputs, symmetrical OE (active-low output-enable) inputs, and complementary OE and OE inputs. 1 20 2 19 3 18 4 17 5 16 6 15 7 14 8 13 9 12 10 11 VCC 2OE 1Y1 2A4 1Y2 2A3 1Y3 2A2 1Y4 2A1 2Y4 1A1 1OE VCC SN54F244 . . . FK PACKAGE (TOP VIEW) The ′F244 is organized as two 4-bit buffers/line drivers with separate output enable (OE) inputs. When OE is low, the device passes data from the A inputs to the Y outputs. When OE is high, the outputs are in the high-impedance state. 1A2 2Y3 1A3 2Y2 1A4 4 3 2 1 20 19 18 5 17 6 16 7 15 8 14 9 10 11 12 13 1Y1 2A4 1Y2 2A3 1Y3 2Y1 GND 2A1 1Y4 2A2 The SN74F244 is available in TI’s shrink small-outline package (DB), which provides the same I/O pin count and functionality of standard small-outline packages in less than half the printed-circuit-board area. 2OE • The SN54F244 is characterized for operation over the full military temperature range of − 55°C to 125°C. The SN74F244 is characterized for operation from 0°C to 70°C. FUNCTION TABLE (each buffer) INPUTS OE A OUTPUT Y L H H L L L H X Z Copyright 1993, Texas Instruments Incorporated !"#$ % &'!!($ #% )'*+&#$ ,#$(!,'&$% &!" $ %)(&&#$% )(! $.( $(!"% (/#% %$!'"($% %$#,#!, 0#!!#$1- !,'&$ )!&(%%2 ,(% $ (&(%%#!+1 &+',( $(%$2 #++ )#!#"($(!%- • DALLAS, TEXAS 75265 • HOUSTON, TEXAS 77251−1443 POST OFFICE BOX 655303 POST OFFICE BOX 1443 2−1 SDFS063A − D2932, MARCH 1987 − REVISED OCTOBER 1993 logic symbol† 1OE 1A1 1A2 1A3 1A4 1 logic diagram (positive logic) 1OE 1 EN 2 18 4 16 6 14 8 12 1A1 1Y1 2 18 4 16 1Y2 1Y3 1A2 6 2OE EN 14 1Y3 8 12 1A4 2A1 2A2 2A3 2A4 11 9 13 7 15 5 17 3 1Y2 1Y4 1A3 19 1Y1 1Y4 2Y1 2Y2 19 2OE 2Y3 2Y4 11 9 13 7 15 5 17 3 2Y1 2A1 † This symbol is in accordance with ANSI/IEEE Std 91-1984 and IEC Publication 617-12. 2Y2 2A2 2Y3 2A3 2A4 2Y4 absolute maximum ratings over operating free-air temperature range (unless otherwise noted)‡ Supply voltage range, VCC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.5 V to 7 V Input voltage range, VI (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −1.2 V to 7 V Input current range . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −30 mA to 5 mA Voltage range applied to any output in the disabled or power-off state . . . . . . . . . . . . . . . . . . . −0.5 V to 5.5 V Voltage range applied to any output in the high state . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.5 V to VCC Current into any output in the low state: SN54F244 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 96 mA SN74F244 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 128 mA Operating free-air temperature range: SN54F244 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −55°C to 125°C SN74F244 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 0°C to 70°C Storage temperature range . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −65°C to 150°C ‡ Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only and functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. NOTE 1: The input voltage ratings may be exceeded provided the input current ratings are observed. 2−2 • POST OFFICE BOX 655303 DALLAS, TEXAS 75265 POST OFFICE BOX 1443 HOUSTON, TEXAS 77251−1443 • SDFS063A − D2932, MARCH 1987 − REVISED OCTOBER 1993 recommended operating conditions SN54F244 SN74F244 MIN NOM MAX MIN NOM MAX 4.5 5 5.5 4.5 5 5.5 UNIT VCC VIH Supply voltage VIL IIK Low-level input voltage 0.8 0.8 V Input clamp current −18 −18 mA IOH IOL High-level output current − 12 − 15 mA 64 mA TA Operating free-air temperature 70 °C High-level input voltage 2 2 Low-level output current V 48 −55 125 V 0 electrical characteristics over recommended operating free-air temperature range (unless otherwise noted) PARAMETER VIK VCC = 4.5 V, VCC = 4.5 V VOH SN54F244 TYP† MAX TEST CONDITIONS VCC = 4.75 V, VOL VCC = 4.5 V IOZH IOZL VCC = 5.5 V, VCC = 5.5 V, II IIH VCC = 5.5 V, VCC = 5.5 V, MIN II = − 18 mA IOH = − 3 mA −1.2 IOH = − 12 mA IOH = − 15 mA 2.4 3.3 2 3.2 IOH = − 3 mA IOL = 48 mA IOS‡ Any A 0.38 IOL = 64 mA VO = 2.7 V VI = 2.7 V VI = 0.5 V VCC = 5.5 V, VO = 0 Outputs high 3.3 2 3.1 V −100 0.55 −50 −50 µA 0.1 0.1 mA µA 20 20 −1 −1 − 1.6 − 1.6 −225 −100 −225 40 60 60 90 60 90 Outputs disabled 60 90 60 † All typical values are at VCC = 5 V, TA = 25°C. ‡ Not more than one output should be shorted at a time, and the duration of the short circuit should not exceed one second. 90 Outputs low • POST OFFICE BOX 655303 DALLAS, TEXAS 75265 POST OFFICE BOX 1443 HOUSTON, TEXAS 77251−1443 • µA 50 60 VCC = 5.5 V, Outputs open V 50 40 ICC V 0.55 0.42 VO = 0.5 V VI = 7 V VCC = 5.5 V, −1.2 2.4 UNIT 2.7 OE IIL SN74F244 TYP† MAX MIN mA mA mA 2−3 SDFS063A − D2932, MARCH 1987 − REVISED OCTOBER 1993 switching characteristics (see Note 2) PARAMETER FROM (INPUT) VCC = 5 V, CL = 50 pF, RL = 500 Ω, TA = 25°C TO (OUTPUT) VCC = 4.5 V to 5.5 V, CL = 50 pF, RL = 500 Ω, TA = MIN to MAX† ′F244 tPLH tPHL A Y tPZH tPZL OE Y tPHZ tPLZ OE Y SN74F244 MIN TYP MAX MIN MAX MIN MAX 1.7 3.6 5.2 2 6.5 1.7 6.2 1.7 3.6 5.2 2 7 1.7 6.5 1.2 3.9 5.7 2 7 1.2 6.7 1.2 5 7 2 8.5 1.2 8 1.2 4.1 6 2 7 1.2 7 1.2 4.1 6 2 7.5 1.2 7 † For conditions shown as MIN or MAX, use the appropriate value specified under recommended operating conditions. NOTE 2: Load circuits and waveforms are shown in Section 1. 2−4 • POST OFFICE BOX 655303 DALLAS, TEXAS 75265 POST OFFICE BOX 1443 HOUSTON, TEXAS 77251−1443 • UNIT SN54F244 ns ns ns PACKAGE OPTION ADDENDUM www.ti.com 9-Oct-2007 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Drawing Pins Package Eco Plan (2) Qty Lead/Ball Finish MSL Peak Temp (3) 5962-9758601Q2A ACTIVE LCCC FK 20 1 TBD 5962-9758601QRA ACTIVE CDIP J 20 1 TBD A42 SNPB N / A for Pkg Type 5962-9758601QRA ACTIVE CDIP J 20 1 TBD A42 SNPB N / A for Pkg Type 5962-9758601QSA ACTIVE CFP W 20 1 TBD A42 N / A for Pkg Type 5962-9758601QSA ACTIVE CFP W 20 1 TBD A42 N / A for Pkg Type JM38510/33203B2A ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type JM38510/33203B2A ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type JM38510/33203BRA ACTIVE CDIP J 20 1 TBD A42 SNPB N / A for Pkg Type JM38510/33203BRA ACTIVE CDIP J 20 1 TBD A42 SNPB N / A for Pkg Type JM38510/33203BSA ACTIVE CFP W 20 1 TBD A42 N / A for Pkg Type JM38510/33203BSA ACTIVE CFP W 20 1 TBD A42 N / A for Pkg Type SN54F244J ACTIVE CDIP J 20 1 TBD A42 SNPB N / A for Pkg Type SN54F244J ACTIVE CDIP J 20 1 TBD A42 SNPB N / A for Pkg Type SN74F244DBLE OBSOLETE SSOP DB 20 TBD Call TI Call TI SN74F244DBLE OBSOLETE SSOP DB 20 Call TI Call TI SN74F244DBR ACTIVE SSOP DB 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74F244DBR ACTIVE SSOP DB 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74F244DBRE4 ACTIVE SSOP DB 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74F244DBRE4 ACTIVE SSOP DB 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74F244DBRG4 ACTIVE SSOP DB 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74F244DBRG4 ACTIVE SSOP DB 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74F244DW ACTIVE SOIC DW 20 25 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74F244DW ACTIVE SOIC DW 20 25 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74F244DWG4 ACTIVE SOIC DW 20 25 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74F244DWG4 ACTIVE SOIC DW 20 25 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74F244DWR ACTIVE SOIC DW 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74F244DWR ACTIVE SOIC DW 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74F244DWRG4 ACTIVE SOIC DW 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74F244DWRG4 ACTIVE SOIC DW 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74F244N ACTIVE PDIP N 20 20 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type SN74F244N ACTIVE PDIP N 20 20 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type TBD Addendum-Page 1 POST-PLATE N / A for Pkg Type PACKAGE OPTION ADDENDUM www.ti.com 9-Oct-2007 Orderable Device Status (1) Package Type Package Drawing Pins Package Eco Plan (2) Qty SN74F244N3 OBSOLETE PDIP N 20 TBD Call TI Call TI SN74F244N3 OBSOLETE PDIP N 20 TBD Call TI Call TI SN74F244NE4 ACTIVE PDIP N 20 20 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type SN74F244NE4 ACTIVE PDIP N 20 20 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type SN74F244NSLE OBSOLETE SO NS 20 TBD Call TI Call TI SN74F244NSLE OBSOLETE SO NS 20 TBD Call TI Call TI SN74F244NSR ACTIVE SO NS 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74F244NSR ACTIVE SO NS 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74F244NSRE4 ACTIVE SO NS 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74F244NSRE4 ACTIVE SO NS 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74F244NSRG4 ACTIVE SO NS 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74F244NSRG4 ACTIVE SO NS 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SNJ54F244FK ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type SNJ54F244FK ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type SNJ54F244J ACTIVE CDIP J 20 1 TBD A42 SNPB N / A for Pkg Type Lead/Ball Finish MSL Peak Temp (3) SNJ54F244J ACTIVE CDIP J 20 1 TBD A42 SNPB N / A for Pkg Type SNJ54F244W ACTIVE CFP W 20 1 TBD A42 N / A for Pkg Type SNJ54F244W ACTIVE CFP W 20 1 TBD A42 N / A for Pkg Type (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on Addendum-Page 2 PACKAGE OPTION ADDENDUM www.ti.com 9-Oct-2007 incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. Addendum-Page 3 PACKAGE MATERIALS INFORMATION www.ti.com 4-Oct-2007 TAPE AND REEL BOX INFORMATION Device Package Pins Site Reel Diameter (mm) Reel Width (mm) A0 (mm) B0 (mm) K0 (mm) P1 (mm) W Pin1 (mm) Quadrant SN74F244DWR DW 20 SITE 41 330 24 10.8 13.0 2.7 12 24 Q1 SN74F244DWR DW 20 SITE 60 330 24 10.8 13.1 2.65 12 24 Q1 Pack Materials-Page 1 PACKAGE MATERIALS INFORMATION www.ti.com 4-Oct-2007 Device Package Pins Site Length (mm) Width (mm) Height (mm) SN74F244DWR DW 20 SITE 41 346.0 346.0 41.0 SN74F244DWR DW 20 SITE 60 346.0 346.0 41.0 Pack Materials-Page 2 MECHANICAL DATA MLCC006B – OCTOBER 1996 FK (S-CQCC-N**) LEADLESS CERAMIC CHIP CARRIER 28 TERMINAL SHOWN 18 17 16 15 14 13 NO. OF TERMINALS ** 12 19 11 20 10 A B MIN MAX MIN MAX 20 0.342 (8,69) 0.358 (9,09) 0.307 (7,80) 0.358 (9,09) 28 0.442 (11,23) 0.458 (11,63) 0.406 (10,31) 0.458 (11,63) 21 9 22 8 44 0.640 (16,26) 0.660 (16,76) 0.495 (12,58) 0.560 (14,22) 23 7 52 0.739 (18,78) 0.761 (19,32) 0.495 (12,58) 0.560 (14,22) 24 6 68 0.938 (23,83) 0.962 (24,43) 0.850 (21,6) 0.858 (21,8) 84 1.141 (28,99) 1.165 (29,59) 1.047 (26,6) 1.063 (27,0) B SQ A SQ 25 5 26 27 28 1 2 3 4 0.080 (2,03) 0.064 (1,63) 0.020 (0,51) 0.010 (0,25) 0.020 (0,51) 0.010 (0,25) 0.055 (1,40) 0.045 (1,14) 0.045 (1,14) 0.035 (0,89) 0.045 (1,14) 0.035 (0,89) 0.028 (0,71) 0.022 (0,54) 0.050 (1,27) 4040140 / D 10/96 NOTES: A. B. C. D. E. All linear dimensions are in inches (millimeters). This drawing is subject to change without notice. This package can be hermetically sealed with a metal lid. The terminals are gold plated. Falls within JEDEC MS-004 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 MECHANICAL DATA MSSO002E – JANUARY 1995 – REVISED DECEMBER 2001 DB (R-PDSO-G**) PLASTIC SMALL-OUTLINE 28 PINS SHOWN 0,38 0,22 0,65 28 0,15 M 15 0,25 0,09 8,20 7,40 5,60 5,00 Gage Plane 1 14 0,25 A 0°–ā8° 0,95 0,55 Seating Plane 2,00 MAX 0,10 0,05 MIN PINS ** 14 16 20 24 28 30 38 A MAX 6,50 6,50 7,50 8,50 10,50 10,50 12,90 A MIN 5,90 5,90 6,90 7,90 9,90 9,90 12,30 DIM 4040065 /E 12/01 NOTES: A. B. C. D. All linear dimensions are in millimeters. This drawing is subject to change without notice. Body dimensions do not include mold flash or protrusion not to exceed 0,15. Falls within JEDEC MO-150 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements, improvements, and other changes to its products and services at any time and to discontinue any product or service without notice. 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