TEMIC U6101B

U6101B
IF System and I/Q Demodulator for Digital Satellite
TV Transmissions
Description
The U6101B is a monolithic integrated circuit in
TEMIC’s UHF 5 technology for Satellite Digital Video
Broadcasting (DVBS) and other digital direct satellite
service applications. The circuit operates in a wide
frequency range and in a large input level range.
isolated inputs, and an AGC-system for tuner and IF level
control. Alternatively the output level may be controlled
automatically, e.g., via the channel decoder AGC signal
output.
Implemented are two orthogonal mixer stages (precise
phase-matched by a control loop), a gain-controlled IF
amplifier of high input sensitivity with two switchable
The local oscillator operates at IF input frequency. The
oscillator signal is internally doubled and divided again
to generate the orthogonal mixer driving signals.
Features
Benefits
D Frequency range from 390 to 520 MHz
D Two unbalanced switchable inputs
D High I/Q phase accuracy, based on TEMIC’s patented
D Two switchable IF-inputs to connect a combined
0°/90° control loop circuit
D
D
D
D
D
SAW filter
D Oscillator for SAW or LC tank circuit
D Adjustable tuner AGC control
Input impedance 50 Ω, gain independent
D Low impedance output driver
High input sensitivity
AGC control range –35 dB
D Balanced prescaler output
Internal AGC detector
D Output signal level adjustable or fixed at typical or
Additionally external gain control and output level
setting possible
minimum data sheet value by pin programming
D Low power consumption, 5-V supply voltage
Ordering Information
Extended Type Number
U6101B-AFSG3
TELEFUNKEN Semiconductors
Rev. A1, 14-May-97
Package
SSO20
Remarks
Taped and reeled
1 (7)
Preliminary Information
U6101B
Block Diagram
12613
19
1
20
12
Bias
circuit
9
11
2
8
4
10
3
17
18
32
7
14
15
6
VCO
f → 2f
Divider +
90° control
16
5
13
Figure 1.
Pin Description
VCCRF
1
20 VCC
IF1
2
19 GND
DECI
3
18 PRSO
IF2
4
17 PRSO
TUD
5
16 GNDO
AGCT 6
15 FEDO
AGCS 7
14 INPO
13 ELS
GND 8
INS
9
12 VCCPA
11 OUTI
OUTQ 10
12634
Figure 2. Pinning
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Pin
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
Symbol
VCCRF
IF1
DECI
IF2
TUD
AGCT
AGCS
GND
INPS
OUTQ
OUTI
VCCPA
ELS
INPO
FEDO
GRDO
PRSO
PRSO
GND
VCC
2 (7)
Preliminary Information
Function
RF supply voltage
IF input 1
Input decoupling
IF input 2
Delayed tuner AGC current out
Tuner AGC take over
AGC storage capacitor
Ground
Input select
Baseband Q output
Baseband I output
Supply voltage power amplifier
External output level set
Oscillator input
Oscillator feedback
Oscillator ground
Prescaler output
Prescaler output
Ground
Supply voltage
TELEFUNKEN Semiconductors
Rev. A1, 14-May-97
U6101B
Absolute Maximum Ratings
All voltages are referred to GND (Pin 13)
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Parameters
Supply voltage
Pins 1, 12 and 20
Signal inputs external DC current
Signal outputs external DC voltage
Signal outputs DC current
Maximum AGC voltage
Tuner AGC current
Maximum prescaler output current
Junction temperature
Storage temperature
Pins 2 and 4
Pins 10 and 11
Pins 10 and 11
Pin 5
Pin 5
Pins 17 and 18
Symbol
VCCRF
VCCPA
VCC
IF1, IF2
OUT
OUT
TUD
TUD
PRSO
Tj
Tstg
Min.
–0.3
Typ.
–0.2
–0.3
–0.3
0
–40
–40
Max.
6.0
Unit
V
0.2
VCC
8.0
VCCRF
2.0
10
150
125
mA
V
mA
V
mA
mA
°C
°C
Operation Range
All voltages are referred to GND (Pin 13)
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Parameters
Supply voltage
Pins 1, 12 and 20
Ambient temperature
Input frequency
Pins 13 and 14
Symbol
VCCRF
VCCPA
VCC
Tamb
IFin
Min.
4.5
Typ.
0
390
Max.
5.5
Unit
V
70
520
°C
MHz
Thermal Resistance
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Parameters
Junction ambient
TELEFUNKEN Semiconductors
Rev. A1, 14-May-97
Symbol
RthJA
Min.
Typ.
Max.
Unit
K/W
3 (7)
Preliminary Information
U6101B
Electrical Characteristics
Test conditions: VSRF = +5 V, Tamb = +25°C, unless otherwise specified
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Parameters
Supply current
IF input
Impedance
Operation range
Sensitivity
Second order intercept
Third order intercept
p
Noise figure SSB
AGC range
Oscillator phase noise
Prescaler output amplitude
Test Conditions / Pins
Pins 1, 12 and 20
Pins 2 and 4
Symbol
IS
Z0
fIF
fIF
IP2
IP3
IP3
NF
fIF = 480 MHz
Note 1
Note 1
Note 2
Min.
390
50
480
57
Max.
Unit
mA
520
MHz
dBµV
dBµV
dBµV
dBµV
dB
dB
dBc/Hz
VPP
1.1
VPP
1.0
VPP
VPP
76
80
110
10
–35
10 kHz offset
Pins 17 and 18
Note 4
–80
1.0
Pins 10 and 11
0.9
Pins 10 and 11
Pin 12
1.5
0.6
Baseband outputs
Amplitude
Typ.
40
1.0
Note 5
Maximum amplitude
External level adjust
Note 3
Bandwidth
± 0.25 dB, Pins 10 and 11
fout
20
Note 4
± 1.0 dB, note 4
30
Relative phase error
Output I vs. Q, note 3
Pins 10 and 11
Relative amplitude error
Output I vs. Q, note 3
Input isolation
Input 1 vs. input 2
–30
Pins 2 and 4
Spurious oscillator at outputs (LC tank, 480 MHz, internal leveled, note 6, Pins 10 and 11)
Spurious at fosc
VCC = 4.5 to 5.5 V
<–40
Spurious at 2 fosc
<–40
Oscillator frequency drift
Dfosc
200
MHz
3
0.5
MHz
Degree
dB
dB
dBc
dBc
kHz
1)
AGC set for maximum gain
4)
Load impedance 220 Ω in series to 2,2 kΩ | | 47 pF
2)
AGC set for minimum gain
5)
3)
External AGC setting,
see application circuit figure 2
Internal AGC function activated,
see application circuit figure 1
6)
see test circuit
4 (7)
Preliminary Information
TELEFUNKEN Semiconductors
Rev. A1, 14-May-97
U6101B
Functional Description
The input signal is via two single ended constant gain
amplifiers with selectable inputs connected to a gain
controlled amplifier. The differential output signal
remains of constant amplitude to provide
behind
splitting up
optimised dynamic operation points for a
pair of identical mixers. The mixer stages are driven by
two orthogonal oscillator signals, to generate the I- and Qcomponents.
*
*
mize tilt. The output stages may drive complex loads up
to 220 Ω in series to 2.2 kΩ and 50 pF in a frequency
range up to 40 MHz.
The oscillator operates at IF-frequency. Therefore control
by an on the shelf SAW resonator is possible. Using the
internal 1/32 frequency divider circuit a VCO carrier
recovery loop can be closed via the base band decoding
system.
To avoid fast system lock in time and driving the A/D
converters with defined output levels, in one channel the
output signal will be peak-level detected and in an
internally loop level controlled. So the output signal
amplitudes are independent of frequency and
characteristic of the QPSK modulation. The output level
can be set via an external potentiometer (or at two fixed
levels by pin programming) according the actual
application. External loop control by a channel decoder
generated AGC signal is provided.
Excellent accuracy of 0°/90° phase shifting between the
demodulator switching carriers is provided by a TEMIC
patented phase correction circuit, which operates in a
wide input frequency range.
The DC-component of the AGC loop affects the IF input
level. This signal is internally compared with a adjustable
threshold and generates a tuner AGC signal.
Two matched amplifiers with second order lowpass
characteristic to suppress oscillator spurious ensure small
gain and phase errors between both channels and mini-
Small tolerances based on high DC operation point
stability and good spurious signal suppression are
performed by an internal reference voltage source.
Basic Application Circuit
4.7 W
+5 V
10 nF
10 nF
1 nF
100 pF
19
1
12608
20
12
100 pF
3
Bias
circuit
11
100 nF
A/D
2
Tuner
Channel
decoder
8
100 pF
4
10
9
17
18
10 pF
A/D
B32
22 nH
10 pF
7
14
6
15 VCO
2.2 pF
100 nF
f → 2f
Divider +
90° control
100 nF
5
13
16
SW 2
+5 V
Figure 3. Internal AGC loop, output level optional changeable 0.6 Vpp to 1 Vpp
by control voltage at Pin 13, VCO carrier recovery
TELEFUNKEN Semiconductors
Rev. A1, 14-May-97
5 (7)
Preliminary Information
U6101B
4.7 W
+5 V
10 nF
10 nF
1 nF
100 pF
100 pF
Tuner
100 pF
19
3
1
20
12609
12
Bias
circuit
11
100 nF
A/D
2
Channel
decoder
8
100pF 4
10
A/D
9
AGC
in
17
SW 1
18
10 pF
B32
7
14
+5 V
15
22 nH
AGC out
(PWM)
100 nF
+5 V
6
VCO
Divider +
90° control
f → 2f
5
16
10 pF
100 kW
100 nF
13
4.7 kW
2.2 pF
Figure 4. AGC set by channel decoder, fixed VCO frequency SAW resonator
carrier recovery, dual bandwidth IF filter, SW1 selects input
Package Information
Package: Super small outline plastic package, 20 pin – SSO20
Dimensions in mm
6.75
6.50
5.7
5.3
4.5
4.3
1.30
0.25
0.65
20
5.85
0.15
0.15
0.05
6.6
6.3
11
technical drawings
according to DIN
specifications
95 11234
1
10
6 (7)
Preliminary Information
TELEFUNKEN Semiconductors
Rev. A1, 14-May-97
U6101B
Ozone Depleting Substances Policy Statement
It is the policy of TEMIC TELEFUNKEN microelectronic GmbH to
1. Meet all present and future national and international statutory requirements.
2. Regularly and continuously improve the performance of our products, processes, distribution and operating systems
with respect to their impact on the health and safety of our employees and the public, as well as their impact on
the environment.
It is particular concern to control or eliminate releases of those substances into the atmosphere which are known as
ozone depleting substances ( ODSs).
The Montreal Protocol ( 1987) and its London Amendments ( 1990) intend to severely restrict the use of ODSs and
forbid their use within the next ten years. Various national and international initiatives are pressing for an earlier ban
on these substances.
TEMIC TELEFUNKEN microelectronic GmbH semiconductor division has been able to use its policy of
continuous improvements to eliminate the use of ODSs listed in the following documents.
1. Annex A, B and list of transitional substances of the Montreal Protocol and the London Amendments respectively
2 . Class I and II ozone depleting substances in the Clean Air Act Amendments of 1990 by the Environmental
Protection Agency ( EPA) in the USA
3. Council Decision 88/540/EEC and 91/690/EEC Annex A, B and C ( transitional substances ) respectively.
TEMIC can certify that our semiconductors are not manufactured with ozone depleting substances and do not contain
such substances.
We reserve the right to make changes to improve technical design and may do so without further notice.
Parameters can vary in different applications. All operating parameters must be validated for each customer
application by the customer. Should the buyer use TEMIC products for any unintended or unauthorized
application, the buyer shall indemnify TEMIC against all claims, costs, damages, and expenses, arising out of,
directly or indirectly, any claim of personal damage, injury or death associated with such unintended or
unauthorized use.
TEMIC TELEFUNKEN microelectronic GmbH, P.O.B. 3535, D-74025 Heilbronn, Germany
Telephone: 49 ( 0 ) 7131 67 2831, Fax number: 49 ( 0 ) 7131 67 2423
TELEFUNKEN Semiconductors
Rev. A1, 14-May-97
7 (7)
Preliminary Information