TEMIC U6807B-FP

U6807B
Hex-Driver for High Temperature Application
Description
The hexdriver IC includes 6 non-inverted and current
limited output stages with an open collector.
Each output can sink 20 mA, parallel output operation is
possible. The digital inputs have Schmitt-trigger function
with pull-up current sources to 5 V.
Features
D Output stages:
D Six input comparators with Schmitt-trigger
characteristic
"
– Short circuit protected with diode
D Input clamping current capability to 10 mA
D Integrated protection cells (EMC, ESD, RF)
– Load-dump protected @ 1 kW
dedicated to all input stages
– No crosstalk on adjacent channels
D Low voltage reset with hysteresis
D ESD protection to human body model:
– Clamping current @ – 2 mA
"2000 V (C = 100 pF, R = 1.5 kW)
– Jump start possible
Extended Type Number
U6807B–FP
Package
SO14
Remarks
Block Diagram
VO1
VO2 VO3
VO4 VO5
VO6
1
2
5
7
3
6
4
VS
11
GND
Under
voltage
detection
VS=5 V
14
VI1
13
VI2
12
VI3
10
VI4
VS
9
VI5
8
VI6
13340
Figure 1.
TELEFUNKEN Semiconductors
Rev. A2, 28-Apr-97
1 (5)
U6807B
Pin Description
VO1 1
14 VI1
VO2 2
13 VI2
VO3 3
12 VI3
GND 4
11 VS
VO4 5
10 VI4
VO5 6
9
VI5
VO6 7
8
VI6
Pin
1
2
3
4
5
6
7
8
9
10
11
12
13
14
Symbol
VO1
VO2
VO3
GND
VO4
VO5
VO6
VI6
VI5
VI4
VS
VI3
VI2
VI1
Function
Output 1
Output 2
Output 3
Ground
Output 4
Output 5
Output 6
Input 6
Input 5
Input 4
Supply voltage, 5 V
Input 3
Input 2
Input 1
13335
Figure 2. Pinning
Basic Circuitry
The integrated circuit, U6805B, requires a stabilized supply voltage (VS = 5 V 5%) to comply with its electrical
characteristics. An external buffer capacitor of C = 100 nF
value is recommended. An integrated 14-V Z-diode
between VS and ground protects the supply pin.
"
Current Limitation of the
Output Stages
A temperature dependent current limitation between
25 mA and 100 mA protects the stages during a short.
All output stages are open collectors each capable of
sinking 20 mA. Recommended external components:
Pull–up resistor, R = 1 kW
Capacitor to GND, C = 470 pF, see figure 3
An appropriate heat sink assembly with RthJA < 100 K/W
and/or a further reduction of the maximum ambient
temperature is recommended in order to avoid thermal
overstress. Depending on the numbers of output stages
which may be in short circuit condition these maximum
ratings are (with RthJA < 120 K/W):
Tamb max 80°C @ 2 channels shorted simultaneously
Tamb max 65°C @ 3 channels shorted simultaneously
Refer to hexdriver U6805B if thermal shut down is
required.
Functional Description
Transients and Load-Dump
General
An integrated 28-V Z-diode protects each output stage
against transients and load-dump (Schaffner pulses).
With the help of external 1-kW resistor , the output
transistor is capable of the corresponding current which
flows during each of these conditions. Apart from that,
outputs are short circuit and overload protected.
All input stages are provided with an integrated 250 kW
pull-up resistor and can be directly connected to a microcontroller.
ON state: Low level at the input stage activates the
corresponding output stage.
OFF state: The internal pull-up resistor gives high level
to the input comparator and deactivates the output stage.
7 V Z-diodes between each input pin and GND are
capable of 10 mA clamping currents without crosstalk
on adjacent input stages.
"
"
A total clamping current of 30 mA should be observed
with respect to the power dissipation.
2 (5)
x
x
Low Voltage Detection
When supply voltage is switched on, a power-on reset
pulse is generated internally, which disables all output
stages until a defined supply voltage level is reached. The
low voltage detection is provided with a hysteresis of
Vhyst = 0.5 V typically.
TELEFUNKEN Semiconductors
Rev. A2, 28-Apr-97
U6807B
Absolute Maximum Ratings
Parameters
Symbol
Value
Unit
VS
7.0
V
Ambient temperature range *
Tamb
–40 to +125
Storage temperature range
Tstg
–50 to +150
Tj
+150
_C
_C
_C
Supply voltage
Maximum junction temperature
*
To be reduced if 2 or 3 output stages are shorted sumultaneously (see “remark” on page 2).
Thermal Resistance
Parameters
Junction ambient
Symbol
Value
Unit
RthJA
120
K/W
Electrical Characteristics
"
VS = 5 V 5%, Tamb = 25_C, reference point pin 4 (GND), unless otherwise specified, see figures 1 and 3.
Parameters
Max.
Unit
4.75
5.25
V
IS
IS
0.8
7
4.2
14.5
mA
mA
VTH(ON)
VTH(OFF)
3.7
3.0
4.6
3.8
V
V
Vhyst
0.55
1.05
V
Z-diode protection voltage
VI
6.7
8.5
V
Z-diode clamping current
II
Pull-up resistor
RI
Supply
Test Conditions / Pins
Supply current
Inputs open
Inputs closed to GND
Low voltage detection
threshold
ON
OFF
Low voltage hysteresis
VS
Typ.
Pins 8, 9, 10, 12, 13 and 14
Switching threshold
OFF
ON
Hysteresis
Outputs
Min.
Pin 11
Supply voltage
Inputs
Symbol
170
"10
250
305
mA
kW
VI
VI
3.3
1.8
V
V
Vhyst
1.5
V
Pins 1, 2, 3, 5, 6 and 7
Z-diode protection voltage
VO
26.5
Integrated capacitor
V
5
pF
Leakage current
ILeak
2.5
mA
Saturation voltage (I = 20 mA)
VSat
0.7
V
Current limitation
Ilimit
Propagation delay
(470 pF, 1 kW, 20 V)
TELEFUNKEN Semiconductors
Rev. A2, 28-Apr-97
td
25
mA
5
ms
3 (5)
U6807B
Application Circuit
VS=5 V
VBatt
Load
100 nF
VO1
VI2
VO2
VI3
Micro
controller
R
VI1
VI4
VI5
R
R
R
R
R
6x 1kΩ
VO3
U6807B
VO4
Hexdriver IC
VO5
VI6
VO6
C
C
C
C
C
C
6x 470 pF
13341
Figure 3. Application schematic
Package Information
Package SO14
Dimensions in mm
5.2
4.8
8.75
3.7
1.4
0.25
0.10
0.4
1.27
6.15
5.85
7.62
14
0.2
3.8
8
technical drawings
according to DIN
specifications
13035
14
4 (5)
8
TELEFUNKEN Semiconductors
Rev. A2, 28-Apr-97
U6807B
Ozone Depleting Substances Policy Statement
It is the policy of TEMIC TELEFUNKEN microelectronic GmbH to
1. Meet all present and future national and international statutory requirements.
2. Regularly and continuously improve the performance of our products, processes, distribution and operating systems
with respect to their impact on the health and safety of our employees and the public, as well as their impact on
the environment.
It is particular concern to control or eliminate releases of those substances into the atmosphere which are known as
ozone depleting substances ( ODSs).
The Montreal Protocol ( 1987) and its London Amendments ( 1990) intend to severely restrict the use of ODSs and
forbid their use within the next ten years. Various national and international initiatives are pressing for an earlier ban
on these substances.
TEMIC TELEFUNKEN microelectronic GmbH semiconductor division has been able to use its policy of
continuous improvements to eliminate the use of ODSs listed in the following documents.
1. Annex A, B and list of transitional substances of the Montreal Protocol and the London Amendments respectively
2 . Class I and II ozone depleting substances in the Clean Air Act Amendments of 1990 by the Environmental
Protection Agency ( EPA) in the USA
3. Council Decision 88/540/EEC and 91/690/EEC Annex A, B and C ( transitional substances ) respectively.
TEMIC can certify that our semiconductors are not manufactured with ozone depleting substances and do not contain
such substances.
We reserve the right to make changes to improve technical design and may do so without further notice.
Parameters can vary in different applications. All operating parameters must be validated for each customer
application by the customer. Should the buyer use TEMIC products for any unintended or unauthorized
application, the buyer shall indemnify TEMIC against all claims, costs, damages, and expenses, arising out of,
directly or indirectly, any claim of personal damage, injury or death associated with such unintended or
unauthorized use.
TEMIC TELEFUNKEN microelectronic GmbH, P.O.B. 3535, D-74025 Heilbronn, Germany
Telephone: 49 ( 0 ) 7131 67 2831, Fax number: 49 ( 0 ) 7131 67 2423
TELEFUNKEN Semiconductors
Rev. A2, 28-Apr-97
5 (5)